Semiconductor water-cooled cavity structure and semiconductor processing equipment

Abstract

The application relates to the technical field of semiconductor processing, and discloses a semiconductor water-cooled cavity structure and a semiconductor processing device, which comprise a wafer supporting table assembly, the wafer supporting table assembly is provided with a water-cooling mechanism, and the wafer supporting table assembly is further provided with a gas blowing mechanism; the water-cooling mechanism comprises an annular water-cooled cavity, the annular water-cooled cavity is arranged in the wafer supporting table assembly, a central cavity is further arranged in a central region of the wafer supporting table assembly, the bottom of the central cavity is provided with uniformly distributed heat exchange ribs, the gas blowing mechanism comprises the central cavity, when a top shaft is not jacked up, a middle through hole is aligned with the annular cavity, and airflow passing through a shunt cavity performs heat dissipation on water liquid in the central cavity; after the top shaft is jacked up, a bottom through hole is aligned with the annular cavity, and the airflow is blown out along the circumferential tangent direction of a wafer from the gas blowing groove, thereby forming a rotating uniform air cushion layer and providing flexible air floating support for the wafer; the device can reduce the temperature of cooling liquid in the central region of the wafer supporting table seat, so that the cooling effect of the central region of the wafer is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically to a semiconductor water-cooled cavity structure and semiconductor processing equipment. Background Technology

[0002] During semiconductor processing, wafers generate heat during processes such as exposure, inspection, and etching. In order to cool the wafers quickly on the wafer stage, a water-cooled cavity structure is usually set in the wafer stage. The heat is continuously exchanged through the circulating coolant inside the cavity, thereby cooling the wafers quickly. First, the existing water-cooling cavity structure generally adopts an annular cavity. The coolant enters from the outside of the wafer stage and flows into the central area of ​​the wafer stage through the annular cavity. When the coolant first enters the outer ring of the wafer stage, the temperature is the lowest and the heat exchange is the strongest. It continuously absorbs heat with each turn, and the water temperature is higher closer to the center, thus forming a radial temperature gradient of undercooled wafer edges and high temperature in the center. However, the center of the wafer is a large area of ​​concentrated heat source. Therefore, the existing water-cooling cavity structure does not have a good cooling effect on the wafer. Secondly, the existing wafer carrier stage is also equipped with a wafer swivel mechanism, which is used to remove the wafer from the carrier stage surface for easy removal by the robotic arm. After the wafer is cooled by the water-cooled cavity on the carrier stage, the swivel mechanism lifts the wafer. In order to continuously cool the wafer, the existing technology generally uses an air blowing device to accelerate the airflow speed at the bottom of the wafer. However, the existing air blowing device generally blows air along the radial direction of the wafer. When the airflow diffuses from the center to the outside, it is easy to cause the wafer to warp and shake. Therefore, in order to solve the above problems, it is necessary to provide a semiconductor water-cooled cavity structure and semiconductor processing equipment. Summary of the Invention

[0003] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor water-cooled cavity structure and semiconductor processing equipment to solve the problems existing in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor water-cooled cavity structure and semiconductor processing equipment, including a wafer stage assembly, wherein a water-cooling mechanism is provided on the wafer stage assembly, and an air blowing mechanism is also provided in the wafer stage assembly; The water cooling mechanism includes an annular water cooling cavity, which is formed in the plate support assembly. The central area of ​​the plate support assembly also has an inner cavity, and the bottom of the inner cavity has uniformly distributed heat exchange fins. The air blowing mechanism includes a central cavity, which is located at the center of the plate support assembly. Uniformly distributed diversion cavities are provided on the outer side of the central cavity. The ends of the diversion cavities are interconnected with annular cavities. The diversion cavities correspond to the heat exchange ribs and are all located in the heat exchange ribs. The support platform assembly is movably sleeved with a top shaft, which has a shaft cavity, a bottom through hole at the bottom of the shaft cavity, a middle through hole in the middle of the shaft cavity, and an air blowing groove at the top of the shaft cavity. A slope block is fixedly installed on the top of the top shaft. When the top shaft is not lifted, the central through hole is aligned with the annular cavity. When the airflow passes through the split cavity, it dissipates heat from the liquid in the inner cavity. After the top shaft is lifted, the bottom through hole is aligned with the annular cavity. The airflow is blown out from the air blowing groove along the circumferential tangent of the wafer to form a uniformly rotating air cushion layer, which provides flexible air-floating support for the wafer.

[0005] The technical effects and advantages of this invention are as follows: When the top spindle is not lifted, the wafer is in contact with the wafer support. Coolant enters the inner cavity through the annular water-cooling cavity. At this time, after the coolant passes through the outer ring for heat exchange, the coolant temperature in the inner cavity rises. The air pump starts and blows air into the central cavity through the air injection pipe. The airflow is divided through the evenly distributed distribution cavity. The coolant in the inner cavity uses the heat exchange ribs and the heat dissipation grooves opened on them, together with the rapidly flowing airflow in the distribution cavity, to dissipate heat, thereby reducing the coolant temperature in the central area of ​​the wafer support, thus improving the cooling effect in the central area of ​​the wafer. After heat exchange, the airflow enters the annular cavity and enters the spindle cavity through the central through hole. Since the air blowing groove is closed at this time, the airflow is discharged outward through the bottom through hole. After the top shaft is lifted, the wafer separates from the substrate. The bottom through-hole connects to the annular cavity, and the middle through-hole is sealed in the lifting hole. Airflow is blown out from the air blowing grooves along the circumferential tangent of the wafer, forming a uniformly rotating air cushion layer. The air blowing grooves are evenly distributed at the bottom of the wafer, and the air blowing direction is along the circumferential tangent of the wafer and evenly distributed. This forms a circumferentially uniform static pressure air film between the wafer and the substrate, providing flexible air buoyancy support for the wafer. This effectively suppresses wafer swaying, tilting, and vibration, making the wafer's posture more stable and its positioning more accurate. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic cross-sectional view of the rotating mechanism of the present invention; Figure 3 This is a schematic diagram of the rotating mechanism of the present invention; Figure 4 This is a schematic cross-sectional view of the support platform assembly of the present invention; Figure 5 This is a schematic cross-sectional view of the water-cooling mechanism of the present invention; Figure 6 This is a schematic diagram of the internal cavity structure of the present invention; Figure 7 This is a schematic diagram of the cross-sectional structure of the annular cavity of the present invention; Figure 8 This is a schematic cross-sectional view of the air injection chamber of the present invention; Figure 9 This is a schematic diagram of the top shaft structure of the present invention; Figure 10 This is a schematic diagram of the structure when the central through hole and the annular cavity are aligned; Figure 11 This is a schematic diagram of the structure of the air blowing groove of the present invention when leakage occurs; Figure 12 This is a cross-sectional structural diagram of the top shaft and the bearing plate base of the present invention.

[0007] The attached figures are labeled as follows: 1. Plate support assembly; 101. Plate support base; 102. Lifting hole; 103. Suction groove; 104. Suction hole; 105. Support hole; 2. Rotating mechanism; 201. Base; 202. Seat plate; 203. Pressure sleeve; 204. Outer sleeve; 205. Plate; 206. Inner seat; 207. Rotating sleeve; 208. High and low groove; 209. Connecting ring; 210. Coupling shaft; 211. Top plate; 212. Compression spring; 213. Moving pin; 214. Top shaft; 215. Swing pin; 216. Support pin; 217. Swing rod; 218. Tension spring. ; 219. Cylinder; 220. Pusher wheel; 3. Air valve; 4. Water cooling mechanism; 401. Annular water cooling chamber; 402. Inner cavity; 403. Liquid injection pipe; 404. Heat exchange fin; 405. Liquid discharge chamber; 406. Liquid discharge pipe; 407. Chiller; 5. Air blowing mechanism; 501. Central cavity; 502. Diverter cavity; 503. Annular cavity; 504. Air injection chamber; 505. Air injection pipe; 506. Air induced draft machine; 507. Bottom through hole; 508. Middle through hole; 509. Air blowing groove; 510. Slope block; 511. Air dissipation hole; 512. Elastic sealing ring. Detailed Implementation

[0008] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. The semiconductor water-cooled cavity structure and semiconductor processing equipment involved in the present invention are not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0009] Reference Figure 1This invention provides a semiconductor water-cooled cavity structure and semiconductor processing equipment, including a wafer stage assembly 1. The wafer stage assembly 1 includes a wafer stage base 101, a lifting hole 102 on the wafer stage base 101, the lifting hole 102 being movably sleeved with a top shaft 214, a suction groove 103 on the wafer stage base 101, a suction hole 104 in the wafer stage base 101, a support hole 105 communicating between the suction hole 104 and the suction groove 103, and a mounting plate installed at the outer end of the suction hole 104. The bottom of the platen support assembly 1 is equipped with a rotating mechanism 2, which includes a base 201, a seat plate 202 fixedly mounted on the base 201, a pressure sleeve 203 fixedly mounted on the seat plate 202, an outer sleeve 204 fixedly mounted on the outer ring of the pressure sleeve 203, and a plate 205 fixedly mounted on the upper end of the outer sleeve 204. The platen support assembly 1 is mounted on the plate 205, and the air valve 3 is installed on the platen support assembly 1. The platen support assembly 1 is also equipped with a water cooling mechanism 4. Mechanism 4 includes an annular water-cooled cavity 401, which is formed within the plate support 101. An inner cavity 402 is also formed in the central region of the plate support 101. A liquid injection pipe 403 is fixedly connected to the inlet end of the annular water-cooled cavity 401, and the outlet end of the annular water-cooled cavity 401 communicates with the inner cavity 402. The bottom of the inner cavity 402 is provided with uniformly distributed heat exchange ribs 404. The plate support assembly 1 also includes an air-blowing mechanism 5, which includes a central cavity 501. The central cavity 501 is located at the center of the support plate 101. The outer side of the central cavity 501 is provided with evenly distributed branch cavities 502. The ends of the branch cavities 502 are connected to annular cavities 503. The branch cavities 502 correspond to the heat exchange ribs 404. The branch cavities 502 are all located in the heat exchange ribs 404. The bottom of the central cavity 501 is also connected to an injection cavity 504. An injection pipe 505 is fixedly connected to the outer end of the injection cavity 504. An air induced draft fan 506 is connected to the outside of the injection pipe 505. In use, the wafer stage assembly 1 holds the wafers, and the swivel mechanism 2 lifts the wafers from the wafer stage assembly 1 for the robotic arm to pick them up. The bottom of the swivel mechanism 2 is equipped with a three-axis drive mechanism, a conventional technique used by those skilled in the art. This mechanism drives the wafer stage assembly 1 to move in the X, Y, and Z axes, thereby precisely controlling the wafer picking position. When the air valve 3 is activated, the wafer stage assembly 1 can adsorb the wafers placed on it. The water cooling mechanism 4 is used to cool the wafers through heat exchange. The air blowing mechanism 5 works in conjunction with the water cooling mechanism 4 to enhance heat dissipation in the central area of ​​the wafer stage assembly 1 and provides flexible air support during wafer lifting, effectively suppressing wafer swaying, tilting, and vibration. This structure... Figure 1 As shown in the figure, since it is a conventional technical method, its specific structure will not be described in detail.

[0010] Reference Figure 2 and Figure 3An inner seat 206 is fixedly installed inside the base 201. A lifting sleeve 207 is movably sleeved on the inner seat 206. A high-low groove 208 is opened on the outer wall of the lifting sleeve 207. A connecting ring 209 is fixedly installed at the bottom of the plate 205. A connecting shaft 210 is fixedly connected to the bottom of the connecting ring 209. A top plate 211 is movably sleeved on the shaft of the connecting shaft 210 between the top plate 211 and the connecting ring 209. A compression spring 212 is sleeved on the shaft of the connecting shaft 210. A moving pin 213 corresponding to the high-low groove 208 is fixedly installed on the outer side of the top plate 211. The moving pin 213 is movably sleeved in the high-low groove 208. A top shaft 214 is fixedly installed on the top plate 211. The top shaft 214 passes through the support plate assembly 1 and is movably sleeved with it. A swing pin 215 is fixedly installed at the bottom of the outer ring of the lifting sleeve 207. A support pin 216 is installed on the bottom mounting groove of the seat plate 202. A swing rod 217 is movably sleeved on the support pin 216. The inner end of the swing rod 217 contacts and cooperates with the swing pin 215. A tension spring 218 is also connected between the swing rod 217 and the outer end of the seat plate 202. A cylinder 219 is installed on the seat plate 202. A push wheel 220 is movably sleeved at the end of the drive shaft of the cylinder 219. The outer end of the swing rod 217 contacts and cooperates with the push wheel 220. When the device is in use, the wafer is on the wafer stage assembly 1. When it is necessary to lift the wafer, the cylinder 219 drives the push wheel 220 to push the swing arm 217 to swing. The swing arm 217 pushes the swing pin 215 to move, thereby driving the lifting sleeve 207 to rotate. The rotation of the lifting sleeve 207 causes the moving pin 213 to move from the low position to the high position of the high and low groove 208, thereby driving the top plate 211 to move upward, thereby driving the top shaft 214 to lift upward in the wafer stage assembly 1, thereby separating the wafer from the wafer stage assembly 1.

[0011] Reference Figure 4 When the device is in use, the air valve 3 is connected to the air pump (not shown in the figure). When the wafer is placed on the wafer support 101, the air valve 3 is opened and the air pump exhausts air outward, so that the suction groove 103 generates negative pressure, thereby allowing the wafer to be adsorbed on the wafer support 101.

[0012] Reference Figure 5 and Figure 6 The support plate 101 also has a drain chamber 405, which is located above the annular water cooling chamber 401. The inlet of the drain chamber 405 is connected to the inner cavity 402, and the outlet of the drain chamber 405 is fixedly connected to the drain pipe 406. The water cooling mechanism 4 also includes a chiller 407. The outlet of the chiller 407 is connected to the injection pipe 403, and the inlet of the chiller 407 is connected to the drain pipe 406. When the device is in use, the chiller 407 cools the water and then injects it into the annular water-cooling cavity 401 through the injection pipe 403. During the flow process in the annular water-cooling cavity 401, the water exchanges heat with the wafer support 101, thereby cooling the wafer placed on the wafer support 101. After the water enters the inner cavity 402, it gradually fills the inner cavity 402 and is discharged from the upper drainage cavity 405. It then flows back to the chiller 407 through the drainage pipe 406 for recooling. The chiller 407 is mainly composed of a compression refrigeration component and a circulation pump (not shown in the figure). Since this structure is a common technical means used by those skilled in the art, the specific structure of the chiller 407 will not be described in detail.

[0013] Reference Figures 7-12 The annular cavity 503 passes through the lifting hole 102. The top shaft 214 has a shaft cavity. The bottom of the shaft cavity has a bottom through hole 507, the middle of the shaft cavity has a middle through hole 508, and the top of the shaft cavity has an air blowing groove 509. The top of the top shaft 214 is fixedly installed with a slope block 510. When the top shaft 214 is not lifted, the central through hole 508 is aligned with the annular cavity 503, the annular cavity 503 is unobstructed, the bottom of the support plate 101 is provided with a bottom groove, the bottom through hole 507 protrudes from the bottom groove of the support plate 101, and the air blowing groove 509 is stored in the lifting hole 102. After the top shaft 214 is lifted, the bottom through hole 507 is aligned with the annular cavity 503, the annular cavity 503 is unobstructed, the central through hole 508 is stored in the lifting hole 102, the air blowing groove 509 protrudes from the upper end of the lifting hole 102, the opening direction of the air blowing groove 509 is along the circumferential tangent direction of the support plate 101, the upper slope angle of the ramp 510 tends to be horizontal, the ramp 510 makes the airflow blow out in the horizontal direction, the top shaft 214 is evenly distributed and the air blowing direction of the air blowing groove 509 is evenly distributed. The bottom side of the support plate 101 is also provided with a vent hole 511, through which the gas blown out from the bottom through hole 507 is dispersed. The heat exchange rib 404 has evenly distributed heat dissipation grooves on its outer side. An elastic sealing ring 512 is also provided at the bottom through hole 507 and the middle through hole 508, which can prevent air leakage when the bottom through hole 507 and the middle through hole 508 are aligned with the annular cavity 503, thus ensuring the smooth flow of air.

[0014] When the device is in use, with the top shaft 214 not lifted, the wafer is in contact with the wafer support 101. Coolant enters the inner cavity 402 through the annular water-cooling cavity 401. At this time, after the coolant undergoes heat exchange in the outer ring, the coolant temperature in the inner cavity 402 rises. The air pump 506 starts and blows air into the central cavity 501 through the air injection pipe 505. The airflow is split through the evenly distributed distribution cavity 502. The coolant in the inner cavity 402 dissipates heat using the heat exchange ribs 404 and the heat dissipation grooves on them, in conjunction with the rapidly flowing airflow in the distribution cavity 502, thereby reducing the coolant temperature in the central area of ​​the wafer support 101 and improving the cooling effect in the central area of ​​the wafer. After heat exchange, the airflow enters the annular cavity 503 and enters through the central through-hole 508. In the shaft cavity of the top shaft 214, since the air blowing groove 509 is closed at this time, the airflow is discharged outward through the bottom through hole 507. After the top shaft 214 is lifted, the wafer is separated from the substrate 101. The bottom through hole 507 is connected to the annular cavity 503, and the middle through hole 508 is closed in the lifting hole 102. The airflow is blown out from the air blowing groove 509 along the circumferential tangential direction of the wafer to form a rotating uniform air cushion layer. The air blowing groove 509 is evenly distributed at the bottom of the wafer, and its gas blowing direction is along the circumferential tangential direction of the wafer and evenly distributed. Thus, a circumferentially uniform static pressure air film is formed between the wafer and the substrate 101, which forms a flexible air buoyancy support for the wafer, effectively suppressing wafer swaying, tilting and vibration, making the wafer posture more stable and the positioning more accurate.

[0015] The working principle of this invention: After the chiller 407 cools the water, it is injected into the annular water-cooling cavity 401 through the injection pipe 403. During the flow process in the annular water-cooling cavity 401, heat is exchanged with the wafer support 101, thereby cooling the wafer placed on the wafer support 101. After the water enters the inner cavity 402, it gradually fills the inner cavity 402 and is discharged from the upper drainage cavity 405. It then flows back to the chiller 407 through the drainage pipe 406 for re-cooling. When not lifted, the wafer is in contact with the substrate 101. Coolant enters the inner cavity 402 through the annular water-cooling cavity 401. After heat exchange in the outer ring, the coolant temperature in the inner cavity 402 rises. The induced draft fan 506 starts, blowing air into the central cavity 501 through the injection pipe 505. The airflow is split through the evenly distributed distribution cavity 502. The coolant in the inner cavity 402 utilizes the heat exchange ribs 404 and the heat dissipation grooves on them, combined with the rapid flow in the distribution cavity 502. Airflow dissipates heat, thereby reducing the temperature of the coolant in the central area of ​​the wafer stage 101, thus improving the cooling effect in the wafer's central area. After heat exchange, the airflow enters the annular cavity 503 and then passes through the central through-hole 508 into the shaft cavity of the top shaft 214. Since the air blowing groove 509 is closed at this time, the airflow is discharged outward through the bottom through-hole 507. When the top shaft 214 is lifted, the wafer separates from the wafer stage 101, the bottom through-hole 507 connects with the annular cavity 503, and the central through-hole 508... 8 is enclosed in the lifting hole 102. The airflow is blown out from the air blowing groove 509 along the circumferential tangent of the wafer to form a rotating uniform air cushion layer. The air blowing groove 509 is evenly distributed at the bottom of the wafer, and the air blowing direction is along the circumferential tangent of the wafer and evenly distributed. This forms a circumferentially uniform static pressure air film between the wafer and the wafer support 101, which forms a flexible air buoyancy support for the wafer, effectively suppressing wafer swaying, tilting and vibration, making the wafer posture more stable and the positioning more accurate.

[0016] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change. Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other. In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor water-cooled cavity structure and semiconductor processing equipment, comprising a wafer stage assembly (1), characterized in that: The plate-bearing stage assembly (1) is provided with a water-cooling mechanism (4), and the plate-bearing stage assembly (1) is also provided with an air-blowing mechanism (5). The water cooling mechanism (4) includes an annular water cooling cavity (401), which is located in the plate support assembly (1). The central area of ​​the plate support assembly (1) also has an inner cavity (402). The bottom of the inner cavity (402) is provided with uniformly distributed heat exchange ribs (404). The air blowing mechanism (5) includes a central cavity (501), which is located at the center of the plate support assembly (1). The outer side of the central cavity (501) is provided with uniformly distributed diversion cavities (502). The ends of the diversion cavities (502) are connected to an annular cavity (503). The diversion cavities (502) correspond to the heat exchange ribs (404), and the diversion cavities (502) are all located in the heat exchange ribs (404). The wafer support assembly (1) is movably fitted with a top shaft (214). The top shaft (214) has a shaft cavity, a bottom through hole (507) at the bottom of the shaft cavity, a middle through hole (508) in the middle of the shaft cavity, and an air blowing groove (509) at the top of the shaft cavity. A ramp (510) is fixedly installed on the top of the top shaft (214). When the top shaft (214) is not lifted, the middle through hole (508) is aligned with the annular cavity (503). When the airflow passes through the diversion cavity (502), it dissipates heat from the water in the inner cavity (402). After the top shaft (214) is lifted, the bottom through hole (507) is aligned with the annular cavity (503). The airflow is blown out from the air blowing groove (509) along the circumferential tangent of the wafer to form a rotating uniform air cushion layer, which forms a flexible air floating support for the wafer.

2. The semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 1, characterized in that: The bottom of the plate support assembly (1) is provided with a rotating mechanism (2), and an air valve (3) is installed on the plate support assembly (1).

3. The semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 2, characterized in that: The rotating mechanism (2) includes a base (201), a seat plate (202) is fixedly installed on the base (201), a pressure sleeve (203) is fixedly installed on the seat plate (202), an outer sleeve (204) is fixedly installed on the outer ring of the pressure sleeve (203), a plate (205) is fixedly installed on the upper end of the outer sleeve (204), and the plate support assembly (1) is installed on the plate (205).

4. The semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 3, characterized in that: An inner seat (206) is fixedly installed inside the base (201). A lifting sleeve (207) is movably sleeved on the inner seat (206). A high and low groove (208) is provided on the outer wall of the lifting sleeve (207). A connecting ring (209) is fixedly installed at the bottom of the plate (205). A connecting shaft (210) is fixedly connected to the bottom of the connecting ring (209). A top plate (211) is movably sleeved on the shaft of the connecting shaft (210). A compression spring (212) is sleeved on the shaft of the connecting shaft (210) between the top plate (211) and the connecting ring (209). A movable pin (213) corresponding to the high and low groove (208) is fixedly installed on the outer side of the top plate (211). The movable pin (213) is movably sleeved in the high and low groove (208). A top shaft (214) is fixedly installed on the top plate (211). The top shaft (214) passes through the support plate assembly (1) and is movably sleeved with it.

5. The semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 4, characterized in that: A swing pin (215) is fixedly installed at the bottom of the outer ring of the lifting sleeve (207). A support pin (216) is installed on the bottom mounting groove of the seat plate (202). A swing rod (217) is movably sleeved on the support pin (216). The inner end of the swing rod (217) is in contact with the swing pin (215). A tension spring (218) is also connected between the swing rod (217) and the outer end of the seat plate (202). A cylinder (219) is installed on the seat plate (202). A push wheel (220) is movably sleeved at the end of the drive shaft of the cylinder (219). The outer end of the swing rod (217) is in contact with the push wheel (220).

6. The semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 5, characterized in that: The plate support assembly (1) includes a plate support base (101), a lifting hole (102) is provided on the plate support base (101), the lifting hole (102) is movably connected to the top shaft (214), a suction groove (103) is provided on the plate support base (101), a suction hole (104) is provided in the plate support base (101), a support hole (105) is connected between the suction hole (104) and the suction groove (103), and an air valve (3) is installed at the outer end of the suction hole (104).

7. The semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 6, characterized in that: The inlet end of the annular water-cooled cavity (401) is fixedly connected to a liquid injection pipe (403), and the outlet end of the annular water-cooled cavity (401) is connected to the inner cavity (402). The support plate base (101) is also provided with a drain chamber (405), which is located above the annular water-cooling chamber (401). The inlet of the drain chamber (405) is connected to the inner cavity (402), and the outlet of the drain chamber (405) is fixedly connected to a drain pipe (406). The water-cooling mechanism (4) also includes a chiller (407), the outlet of the chiller (407) is connected to the injection pipe (403), and the inlet of the chiller (407) is connected to the drain pipe (406).

8. The semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 7, characterized in that: The bottom of the central cavity (501) is also connected to an air injection cavity (504), and an air injection pipe (505) is fixedly connected to the outer end of the air injection cavity (504). An air induced draft machine (506) is connected to the outside of the air injection pipe (505).

9. A semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 8, characterized in that: The annular cavity (503) passes through the lifting hole (102). When the top shaft (214) is not lifted, the central through hole (508) is aligned with the annular cavity (503), and the annular cavity (503) has unobstructed loop. The bottom of the support plate base (101) is provided with a bottom groove, and the bottom through hole (507) protrudes from the bottom groove of the support plate base (101). The air blowing groove (509) is housed in the lifting hole (102). After the top shaft (214) is lifted, the bottom through hole (507) is aligned with the annular cavity (503). The annular cavity (503) is unobstructed, the central through hole (508) is housed in the lifting hole (102), the air blowing groove (509) leaks out from the upper end of the lifting hole (102), the opening direction of the air blowing groove (509) is along the circumferential tangent direction of the support plate base (101), the upper slope angle of the slope block (510) tends to be horizontal, the slope block (510) causes the airflow to blow out in the horizontal direction, the top shaft (214) is evenly distributed and makes the air blowing direction of the air blowing groove (509) evenly distributed.

10. A semiconductor water-cooled cavity structure and semiconductor processing equipment according to claim 9, characterized in that: The bottom side of the support plate base (101) is also provided with a vent hole (511). The gas blown out from the bottom through hole (507) is dispersed through the vent hole (511). The heat exchange rib (404) is provided with a uniformly distributed heat dissipation groove on the outer side. The bottom through hole (507) and the middle through hole (508) are also provided with an elastic sealing ring (512).

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