Wafer transfer cassette fixing mechanism for wafer loader
By using components such as a second cylinder, fixing pin, through slot, pressure block, and positioning hole in the wafer loader, combined with the design of rubber bumps and magnetic rings, the problem of wobbling and falling off the wafer transfer box when it is opened is solved, and more stable wafer transfer is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FICO SEMICONDUCTOR (ZHANGJIAGANG) CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-21
AI Technical Summary
Existing wafer transfer box fixing mechanisms pose a risk of the wafer box being pulled or falling off when opened, resulting in wafer damage.
The system employs components such as a second cylinder, fixing pins, through slots, pressure blocks, wafer transfer boxes, positioning holes, fixing slots, connecting plates, and rubber bumps. Positioning and fixing are achieved through positioning holes and fixing pins. The second cylinder and pressure blocks apply reverse compression, and the rubber bumps increase friction. A magnetic ring attracts the fixing pins to improve connection stability.
This effectively prevents the wafer transfer box from shaking and falling out when opened, enhances connection stability, avoids wafer damage, and improves the safety of the transfer process.
Smart Images

Figure CN224538705U_ABST