Chip stripping system and chip pushing device

Abstract

The invention provides a chip stripping system and a chip pushing device. The chip pushing device can be used for pushing a first chip or a second chip of a wafer. The chip pushing device comprises a carrying table, an ejector pin base structure and a shell. The ejector pin seat structure comprises a first pushing mechanism, a second pushing mechanism, an inner ejector pin seat, a plurality of first ejector pins, an outer ejector pin seat and a plurality of second ejector pins. The shell is provided with a plurality of ejector pin holes corresponding to the plurality of first ejector pins and the plurality of second ejector pins. When the first pushing mechanism moves and pushes the inner ejector pin base in the preset direction, the multiple first ejector pins penetrate out of the ejector pin holes to push the first chip. When the second pushing mechanism moves along the preset direction, the inner ejector pin seat and the outer ejector pin seat are pushed up at the same time, and the plurality of first ejector pins and the plurality of second ejector pins penetrate out of the ejector pin holes to push the second chip. Therefore, the to-be-processed object can eject the first chip or the second chip through the chip ejection device without being transferred, so that the first chip or the second chip is prevented from being damaged in the transferring process, for example, the characteristic change of an adhesive film is avoided.

Description

Technical Field

[0001] This application relates to a chip pushing device, and more particularly to a chip stripping system and a chip pushing device for pushing two chips of different sizes. Background Technology

[0002] When producing two different sizes of chips on a single wafer, existing chip pusher devices can only push chips of a single size. Therefore, the wafer is usually transferred to different chip pusher devices according to the size of the chip to be pushed, so as to push out the two different sizes of chips separately. However, the process of transferring the wafer to different chip pusher devices can easily cause structural damage to the wafer.

[0003] Therefore, the applicant believes that the above-mentioned defects can be improved. So, the applicant has devoted himself to research and applied scientific principles, and finally proposed a design that is reasonable and effectively improves the above-mentioned defects. Summary of the Invention

[0004] The technical problem to be solved by this application is to provide a chip stripping system and a chip pushing device, which can effectively improve the defects that may occur in existing chip pushing devices.

[0005] One embodiment of this application discloses a chip stripping system, comprising: a workpiece, including an adhesive film and a wafer adhered to the adhesive film; wherein the wafer includes a plurality of first chips and a plurality of second chips spaced apart from the plurality of first chips, and the size of each second chip is larger than the size of any one of the first chips; a worktable for fixing the adhesive film; and a chip pushing device disposed within the worktable for pushing each of the first chips or each of the second chips on the wafer, the chip pushing device comprising: a platform; a pusher pin structure disposed on one side of the platform, the pusher pin structure comprising: a first pushing mechanism capable of selectively moving along a preset direction; a second pushing mechanism disposed outside the first pushing mechanism; wherein the second pushing mechanism is capable of selectively moving along the preset direction; an inner pusher pin seat and a plurality of first pushers, the inner pusher pin seat being connected to the first pusher pin seat. The mechanism includes a second pushing mechanism, wherein a plurality of first ejector pins are fixed to the inner ejector pin seat; an outer ejector pin seat and a plurality of second ejector pins, the outer ejector pin seat being disposed outside the inner ejector pin seat and connected to the second pushing mechanism, and the plurality of second ejector pins being fixed to the outer ejector pin seat; and a housing connected to the platform, the housing covering the ejector pin seat structure, the housing having a plurality of ejector pin holes, the positions of the housing corresponding to the plurality of first ejector pins and the plurality of second ejector pins respectively; wherein, when the first pushing mechanism moves along the preset direction and the second pushing mechanism does not move, the first pushing mechanism pushes up the inner ejector pin seat so that the plurality of first ejector pins pass through the corresponding ejector pin holes to push the first chip; wherein, when the second pushing mechanism moves along the preset direction, the inner ejector pin seat and the outer ejector pin seat are simultaneously pushed up so that the plurality of first ejector pins and the plurality of second ejector pins pass through the corresponding ejector pin holes to push the second chip.

[0006] Optionally, the chip stripping system further includes a chip capturing device located on one side of the chip pushing device, and the chip capturing device can be used to capture the first chip or the second chip pushed out by the chip pushing device, so as to separate the first chip or the second chip from the adhesive film.

[0007] Optionally, when neither the first pushing mechanism nor the second pushing mechanism pushes up the inner ejector seat and the outer ejector seat, the inner ejector seat and the outer ejector seat are both located in a first position, and the top surface of the inner ejector seat and the top surface of the outer ejector seat are coplanar; when the second pushing mechanism moves along the preset direction, the second pushing mechanism simultaneously drives the first pushing mechanism, thereby simultaneously pushing up the inner ejector seat and the outer ejector seat, so that the inner ejector seat and the outer ejector seat are located in a second position, and the top surface of the inner ejector seat and the top surface of the outer ejector seat are coplanar.

[0008] Optionally, the chip pushing device defines a central cross-section formed along the preset direction, and the stage, the ejector pin structure, and the housing are mirror-symmetrical to the central cross-section, and the plurality of first ejector pins and the plurality of second ejector pins are arranged in pairs facing each other relative to the central cross-section.

[0009] Optionally, the plurality of first ejector pins have a first distribution density, and the plurality of second ejector pins have a second distribution density that is less than the first distribution density.

[0010] Optionally, the first pushing mechanism can move a predetermined distance along the preset direction to make the inner ejector pin seat adjacent to the housing; the second pushing mechanism can move the predetermined distance along the preset direction to make the inner ejector pin seat and the outer ejector pin seat adjacent to the housing.

[0011] Optionally, the stage further has a plurality of protrusions, the housing has a plurality of fixing portions corresponding to the plurality of protrusions, and the plurality of protrusions are used to fix the plurality of fixing portions.

[0012] Optionally, the first pushing mechanism is columnar, and the second pushing mechanism is annularly surrounding the first pushing mechanism.

[0013] One embodiment of this application discloses a chip pushing device, which can be used to push a first chip or a second chip larger than the first chip on a wafer. The chip pushing device includes: a stage; a push pin holder structure disposed on one side of the stage, the push pin holder structure including: a first pushing mechanism capable of selectively moving along a preset direction; a second pushing mechanism disposed outside the first pushing mechanism; wherein the second pushing mechanism is capable of selectively moving along the preset direction; an inner push pin holder and a plurality of first push pins, the inner push pin holder being connected to the first pushing mechanism and the second pushing mechanism, the plurality of first push pins being fixed to the inner push pin holder; and an outer push pin holder and a plurality of second push pins, the outer push pin holder being disposed outside the inner push pin holder. The system comprises: a first push mechanism connected to the second push mechanism; a plurality of second ejector pins fixed to the outer ejector pin seat; and a housing connected to the platform, the housing covering the ejector pin seat structure, the housing having a plurality of ejector pin holes, the positions of the housing corresponding to a plurality of first ejector pins and a plurality of second ejector pins; wherein, when the first push mechanism moves along the preset direction and the second push mechanism does not move, the first push mechanism pushes up the inner ejector pin seat, so that a plurality of first ejector pins pass through the corresponding ejector pin holes to push up the first chip; wherein, when the second push mechanism moves along the preset direction, the inner ejector pin seat and the outer ejector pin seat are simultaneously pushed up, so that a plurality of first ejector pins and a plurality of second ejector pins pass through the corresponding ejector pin holes to push up the second chip.

[0014] One embodiment of this application discloses a chip stripping system, comprising: a workpiece, including an adhesive film and a wafer adhered to the adhesive film; wherein the wafer includes a plurality of first chips and a plurality of second chips spaced apart from the plurality of first chips, and the size of each second chip is larger than the size of any one of the first chips; a worktable for fixing the adhesive film; and a chip pushing device disposed within the worktable for pushing each of the first chips or each of the second chips on the wafer, the chip pushing device comprising: a platform; a pusher seat structure disposed on one side of the platform, the pusher seat structure comprising: a first pushing mechanism capable of selectively moving along a preset direction; a second pushing mechanism disposed outside the first pushing mechanism; wherein the second pushing mechanism is capable of selectively moving along the preset direction; an inner pusher seat and a plurality of first pushers, the inner pusher seat being connected to the first chip. A pushing mechanism is provided, wherein a plurality of first ejector pins are fixed to an inner ejector pin seat; an outer ejector pin seat and a plurality of second ejector pins are provided, the outer ejector pin seat is disposed outside the inner ejector pin seat and connected to the second pushing mechanism, and the plurality of second ejector pins are fixed to the outer ejector pin seat; and a housing is connected to the platform and the housing covers the ejector pin seat structure, the housing having a plurality of ejector pin holes, the positions of the housing corresponding to the plurality of first ejector pins and the plurality of second ejector pins respectively; wherein, when the first pushing mechanism moves along the preset direction and the second pushing mechanism does not move, the first pushing mechanism pushes up the inner ejector pin seat so that the plurality of first ejector pins pass through the corresponding ejector pin holes to push the first chip; wherein, when the second pushing mechanism moves along the preset direction and the first pushing mechanism does not move, the second pushing mechanism pushes up the outer ejector pin seat so that the plurality of second ejector pins pass through the corresponding ejector pin holes to push the second chip.

[0015] In summary, the chip stripping system and chip pushing device disclosed in this application can selectively push the inner ejector seat and multiple first ejector pins, and / or push the outer ejector seat and multiple second ejector pins through the first pushing mechanism and the second pushing mechanism, correspondingly pushing each of the first chips or each of the second chips (that is, the objects to be processed) adhered to the adhesive film, so that the objects to be processed can be pushed out of the first chips or second chips by the chip pushing device without transfer, thereby avoiding damage during the transfer process (e.g., changes in the characteristics of the adhesive film).

[0016] The other effects and embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional schematic diagram of the chip stripping system according to Embodiment 1 of this application;

[0019] Figure 2 This is a three-dimensional schematic diagram of the chip pushing device according to Embodiment 1 of this application;

[0020] Figure 3 for Figure 2 A schematic diagram of the decomposition process;

[0021] Figure 4 for Figure 2 A cross-sectional view along section line IV-IV;

[0022] Figure 5 for Figure 4 A cross-sectional view of the inner ejector pin seat of the chip pusher device in the second position;

[0023] Figure 6 for Figure 5 A cross-sectional view of the inner and outer ejector pin seats of the chip pushing device in the second position;

[0024] Figure 7 This is a top view of the inner ejector pin holder, multiple first ejector pins, outer ejector pin holder, and multiple second ejector pins of the chip pushing device according to Embodiment 1 of this application.

[0025] Figure 8 for Figure 1 A cross-sectional view along section line VIII-VIII;

[0026] Figure 9 for Figure 8 A cross-sectional schematic diagram of the chip pushing device pushing the first chip;

[0027] Figure 10 for Figure 9 A cross-sectional schematic diagram of the chip pushing device pushing the second chip;

[0028] Figure 11 This is a three-dimensional schematic diagram of the first pushing mechanism of Embodiment 2 of this application independently corresponding to the inner ejector pin seat;

[0029] Figure 12 This is a three-dimensional schematic diagram of the second pushing mechanism of Embodiment 2 of this application independently corresponding to the pushing of the outer ejector pin seat. Detailed Implementation

[0030] The following specific embodiments illustrate the implementation of the "chip stripping system and chip pushing device" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0031] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0032] [Example 1]

[0033] Please see Figures 1 to 10 As shown, this is an embodiment of this application. Figure 1 As shown, this embodiment discloses a chip stripping system 100, which includes: a target object 1, a workbench 2 carrying the target object 1, and a chip pushing device 3 located on one side of the workbench 2.

[0034] It should be noted that although the aforementioned object to be processed 1, workbench 2, and chip pushing device 3 are collectively defined as the chip stripping system 100 in this embodiment, this application is not limited thereto. For example, in other embodiments not shown in this application, the chip pushing device 3 may also be used alone (e.g., in implementation, manufacturing, or sales) or in combination with other components.

[0035] Please refer to the following first. Figure 1 and Figure 8As shown, the object to be processed 1 includes an adhesive film 11 and a wafer 12 bonded to the adhesive film 11. Each wafer 12 includes a plurality of first chips 121 disposed separately from each other, and a plurality of second chips 122 spaced apart from the plurality of first chips 121. Further, the size of the first chips 121 differs from the size of the second chips 122, and this embodiment is described with the size of each second chip 122 being larger than the size of any one of the first chips 121. However, the sizes of the first chips 121 and the second chips 122 can be adjusted and varied according to design requirements, and this application is not limited thereto. It should be further noted that the size of the first chip 121 in this embodiment can refer to any side length of the first chip 121, and the size of the second chip 122 can refer to any side length of the second chip 122, but is not limited thereto.

[0036] Furthermore, the adhesive film 11 can be fixed by the worktable 2, and the worktable 2 can stretch the adhesive film 11 so that the spacing between each of the first chips 121 and each of the second chips 122 adhered to the adhesive film 11 can be increased and they can be maintained on the adhesive film 11.

[0037] Furthermore, the chip pushing device 3 is movable relative to the worktable 2, and in this embodiment, the worktable 2 is movable relative to the chip pushing device 3 so that each of the first chips 121 or each of the second chips 122 can be moved to the position corresponding to the chip pushing device 3. However, this application is not limited to this. For example, in other embodiments not shown in this application, the chip stripping system 100 may also be moved by the chip pushing device 3 relative to the worktable 2 so that the chip pushing device 3 can be moved to the position corresponding to each of the first chips 121 or each of the second chips 122.

[0038] To facilitate understanding of this embodiment, the structure of each component in the chip pushing device 3 and their connection relationship will be described first, and then the connection relationship between the chip pushing device 3 and the first chip 121 and the second chip 122 will be explained when the chip pushing device 3 moves to the position corresponding to each of the first chip 121 or the position of the second chip 122.

[0039] like Figures 2 to 4As shown, the chip pushing device 3 includes a platform 31, a pin holder structure 32 disposed on one side of the platform 31, and a housing 33 connected to the platform 31. Further, the chip pushing device 3 defines a central cross-section S formed along a predetermined direction D, and the platform 31, the housing 33, and the pin holder structure 32 are mirror-symmetrical about the central cross-section S.

[0040] The platform 31 has multiple protrusions 311, and the housing 33 has multiple fixing portions 332 corresponding to the multiple protrusions 311. In this embodiment, the multiple protrusions 311 are used to fix (e.g., lock) the multiple fixing portions 332, but this application is not limited thereto. For example, in other embodiments not shown in this application, the multiple protrusions 311 may also be detachably fixed (e.g., snap-fitted) to the multiple fixing portions 332. Furthermore, the housing 33 also has multiple ejector pin holes 331.

[0041] Furthermore, the ejector pin structure 32 is located between the housing 33 and the platform 31, and the housing 33 can cover the ejector pin structure 32 and fix it to the platform 31. In this embodiment, the height of the ejector pin structure 32 and the height of the housing 33 relative to the platform 31 can be adjusted and varied according to design requirements, and this application does not impose any limitations on them.

[0042] like Figures 3 to 6 As shown, the ejector seat structure 32 includes a first pushing mechanism 321, a second pushing mechanism 322 disposed outside the first pushing mechanism 321, an inner ejector seat 323 connected to the first pushing mechanism 321 and the second pushing mechanism 322, an outer ejector seat 324 connected to the second pushing mechanism 322, a plurality of first ejector pins 325 fixed to the inner ejector seat 323, and a plurality of second ejector pins 326 fixed to the outer ejector seat 324.

[0043] like Figure 3 As shown, the first pushing mechanism 321 is columnar, and the second pushing mechanism 322 is ring-shaped around the outside of the first pushing mechanism 321. However, these can be adjusted and varied according to design requirements, and this application is not limited thereto. Furthermore, both the first pushing mechanism 321 and the second pushing mechanism 322 can selectively move along the preset direction D.

[0044] Furthermore, the outer ejector pin holder 324 is disposed outside the inner ejector pin holder 323, and the size of the inner ejector pin holder 323 corresponds to the size of the first chip 121, and the size of the outer ejector pin holder 324 corresponds to the size of the second chip 122. It should be noted that the sizes of the inner ejector pin holder 323 and the outer ejector pin holder 324 can be adjusted and varied according to the sizes of the first chip 121 and the second chip 122, respectively, and this application does not impose any limitations on these adjustments.

[0045] Based on the above configuration, as follows Figures 4 to 6 As shown, the first pushing mechanism 321 can push the inner ejector seat 323 along the preset direction D (e.g., Figure 5 As shown), and the second pushing mechanism 322 can move along the preset direction D, so that the inner ejector seat 323 and the outer ejector seat 324 are simultaneously pushed up (as shown). Figure 6 (As shown). Specifically, when the second pushing mechanism 322 moves along the preset direction D, the second pushing mechanism 322 can simultaneously drive the first pushing mechanism 321 to move along the preset direction D, thereby simultaneously pushing up the inner ejector seat 323 and the outer ejector seat 324. However, this application is not limited to this. For example, in other embodiments not shown in this application, the second pushing mechanism 322 can also independently and simultaneously push up the inner ejector seat 323 and the outer ejector seat 324.

[0046] More specifically, the first pushing mechanism 321 can move a predetermined distance H along the preset direction D to push the inner ejector seat 323 to be adjacent to the housing 33, and the second pushing mechanism 322 can also move the predetermined distance H along the preset direction D, thereby synchronously driving the first pushing mechanism 321 to move the predetermined distance H, so as to simultaneously push the inner ejector seat 323 and the outer ejector seat 324 to be adjacent to the housing 33.

[0047] To put it another way, such as Figure 4 As shown, when neither the first pushing mechanism 321 nor the second pushing mechanism 322 moves along the preset direction D (that is, neither pushes up the inner ejector seat 323 and the outer ejector seat 324), the inner ejector seat 323 and the outer ejector seat 324 are both located at a first position P1, and the top surface of the inner ejector seat 323 and the top surface of the outer ejector seat 324 are coplanar.

[0048] Furthermore, such as Figure 5As shown, when the first pushing mechanism 321 moves along the preset direction D and the second pushing mechanism 322 does not move, the first pushing mechanism 321 pushes up the inner ejector seat 323 so that the inner ejector seat 323 is located in a second position P2 adjacent to the housing 33. At this time, the outer ejector seat 324 is still located in the first position P1, and the top surface of the inner ejector seat 323 and the top surface of the outer ejector seat 324 are separated by the predetermined distance H in the preset direction D.

[0049] And, such as Figure 6 As shown, when the second pushing mechanism 322 moves along the preset direction D, the second pushing mechanism 322 simultaneously drives the first pushing mechanism 321 to simultaneously push up the inner ejector seat 323 and the outer ejector seat 324, so that the inner ejector seat 323 and the outer ejector seat 324 are both located at the second position P2 and adjacent to the housing 33, and the top surface of the inner ejector seat 323 and the top surface of the outer ejector seat 324 are coplanar.

[0050] Based on the above, the reference... Figure 3 , Figure 4 and Figure 7 As shown, a plurality of first ejector pins 325 and a plurality of second ejector pins 326 can be fixed in the inner ejector pin seat 323 and the outer ejector pin seat 324 respectively along the preset direction D.

[0051] In this embodiment, the plurality of first ejector pins 325 and the plurality of second ejector pins 326 are all round ejector pins, but this application is not limited thereto. For example, in other embodiments not shown in this application, the plurality of first ejector pins 325 and the plurality of second ejector pins 326 may be selected from at least one of pyramid-shaped ejector pins, conical ejector pins, T-shaped ejector pins, fence-shaped ejector pins, round ejector pins, and flat ejector pins.

[0052] Furthermore, in this embodiment, the plurality of first ejector pins 325 have a first distribution density, and the plurality of second ejector pins 326 have a second distribution density, wherein the second distribution density is not greater than the first distribution density. It should be further noted that the first distribution density is based on the number of first ejector pins 325 provided on the inner ejector pin seat 323 per unit area (e.g., per square millimeter), and the second distribution density is based on the number of second ejector pins 326 provided on the outer ejector pin seat 324 per unit area (e.g., per square millimeter), but is not limited thereto.

[0053] Specifically, such as Figures 4 to 6As shown, the positions of the plurality of ejector pin holes 331 of the housing 33 can respectively correspond to the plurality of first ejector pins 325 and the plurality of second ejector pins 326 along the preset direction D. More specifically, when neither the first pushing mechanism 321 nor the second pushing mechanism 322 pushes the inner ejector pin seat 323 and the outer ejector pin seat 324, the plurality of first ejector pins 325 and the plurality of second ejector pins 326 may be (partially) accommodated in the plurality of ejector pin holes 331, but not protruding from the plurality of ejector pin holes 331.

[0054] Furthermore, such as Figure 5 As shown, when the first pushing mechanism 321 pushes the inner ejector seat 323 to be adjacent to the housing 33 (that is, the inner ejector seat 323 is located in the second position P2), a plurality of first ejector pins 325 can pass through the corresponding ejector pin holes 331.

[0055] And, such as Figure 6 As shown, when the second pushing mechanism 322 and the first pushing mechanism 321 simultaneously push the inner ejector seat 323 and the outer ejector seat 324 to be adjacent to the housing 33 (that is, the inner ejector seat 323 and the outer ejector seat 324 are located in the second position P2), a plurality of first ejector pins 325 and a plurality of second ejector pins 326 can respectively pass through the corresponding ejector pin holes 331.

[0056] According to the above configuration, with the inner ejector pin holder 323 and the outer ejector pin holder 324 respectively designed to correspond to the dimensions of the first chip 121 and the second chip 122, when the plurality of first ejector pins 325 fixed to the inner ejector pin holder 323 protrude through the corresponding plurality of ejector pin holes 331, the plurality of first ejector pins 325 can be used to push the first chip 121. Furthermore, when the plurality of first ejector pins 325 fixed to the inner ejector pin holder 323 and the plurality of second ejector pins 326 fixed to the outer ejector pin holder 324 protrude through the corresponding plurality of ejector pin holes 331, the plurality of first ejector pins 325 and the plurality of second ejector pins 326 can be used to push the second chip 122.

[0057] It is worth mentioning that a plurality of first ejector pins 325 and a plurality of second ejector pins 326 are respectively arranged in pairs facing each other on the inner ejector pin seat 323 and the outer ejector pin seat 324 relative to the central sectional surface S, so that when the first chip 121 or the second chip 122 is pushed, it is pushed out evenly by force.

[0058] As described above, the chip pushing device 3 can selectively move along the preset direction D via the first pushing mechanism 321 and the second pushing mechanism 322 to push up the inner ejector seat 323 and the plurality of first ejector pins 325, or further simultaneously push up the outer ejector seat 324 and the plurality of second ejector pins 326. Therefore, the chip pushing device 3 provided in this embodiment can push up two different sizes of chips (i.e., the first chip 121 and the second chip 122).

[0059] The above has explained the various components of the chip pushing device 3 and the connections between them. Please refer to [link / reference]. Figures 8 to 10 As shown below, the chip pushing device 3 will cooperate with other components in the chip stripping system 100 provided in this embodiment to push out each of the first chips 121 or each of the second chips 122 on the adhesive film 11.

[0060] Specifically, such as Figure 8 and Figure 9 As shown, when the worktable 2 moves relative to the chip pushing device 3, so that one of the first chips 121 on the adhesive film 11 moves to the position corresponding to the chip pushing device 3, the first pushing mechanism 321 can push the inner ejector seat 323 along the preset direction D, so that the inner ejector seat 323 is located in the second position P2, and the plurality of first ejectors 325 can pass through the corresponding ejector hole 331 to push their corresponding first chip 121.

[0061] Furthermore, such as Figure 8 and Figure 10 As shown, when the worktable 2 moves relative to the chip pushing device 3, so that one of the second chips 122 on the adhesive film 11 moves to the position corresponding to the chip pushing device 3, the second pushing mechanism 322 and the first pushing mechanism 321 can simultaneously push the inner ejector seat 323 and the outer ejector seat 324 along the preset direction D, so that the inner ejector seat 323 and the outer ejector seat 324 are both located in the second position P2, and a plurality of first ejector pins 325 and a plurality of second ejector pins 326 can pass through the corresponding ejector pin holes 331 to push their corresponding second chips 122.

[0062] According to the above configuration, the chip stripping system 100 provided in this application embodiment can directly push and push multiple first chips 121 or multiple second chips 122 (that is, the object to be processed 1) that are bonded to the adhesive film 11 through the chip pushing device 3. In other words, the chip pushing device 3 in this application embodiment can push and push each of the first chips 121 or each of the second chips 122 included in a wafer 12.

[0063] Therefore, the chip stripping system 100 provided in this application embodiment can push out the first chip 121 and the second chip 122 without transferring the object to be processed 1 to other devices through the chip pushing device 3 included therein, thereby avoiding damage to the object to be processed 1 during the transfer process (e.g., changes in the characteristics of the adhesive film 11 on which the first chip 121 and the second chip 122 are bonded).

[0064] It should be further noted that the chip stripping system 100 may also be further configured with a chip capturing device 4 (e.g., a suction nozzle) to capture the first chip 121 or the second chip 122 ejected by the chip pushing device 3. However, it may be selectively added according to design requirements, and this application is not limited thereto. Furthermore, the chip capturing device 4 is located on one side of the worktable 2.

[0065] In this embodiment, the chip capturing device 4 can be used to acquire the first chip 121 or the second chip 122 pushed out by the chip pushing device 3, so that the first chip 121 or the second chip 122 is separated from the adhesive film 11, and then the first chip 121 and the second chip 122 are moved to any position.

[0066] [Example 2]

[0067] Please see Figure 11 and Figure 12 As shown, this is Embodiment Two of this application. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The main differences between this embodiment and Embodiment One described above are explained as follows:

[0068] In this embodiment, the second pushing mechanism 322 is disposed outside the first pushing mechanism 321, the inner ejector seat 323 is connected to the first pushing mechanism 321, and the outer ejector seat 324 is disposed outside the inner ejector seat 323 and connected to the second pushing mechanism 322. That is, the first pushing mechanism 321 is independently connected to the inner ejector seat 323, and the second pushing mechanism 322 is independently pushed and connected to the outer ejector seat 324.

[0069] Based on the above configuration, as follows Figure 11 As shown, when the first pushing mechanism 321 moves along the preset direction D and the second pushing mechanism 322 does not move, the first pushing mechanism 321 can push up the inner pin seat 323 so that the plurality of first pins 325 pass through the corresponding pin holes 331, and can then be used to push the first chip 121.

[0070] Furthermore, such as Figure 12 As shown, when the second pushing mechanism 322 moves along the preset direction D and the first pushing mechanism 321 does not move, the second pushing mechanism 322 can push up the outer ejector pin seat 324 so that a plurality of second ejector pins 326 pass through the corresponding ejector pin holes 331, and can then be used to push the second chip 122 accordingly.

[0071] In summary, the difference between the second embodiment of this application and the first embodiment is that the first pushing mechanism 321 will only independently push up the inner ejector seat 323 and the plurality of first ejector pins 325, and the second pushing mechanism 322 will only independently push up the outer ejector seat 324 and the plurality of second ejector pins 326, thereby providing more operating modes to meet different needs.

[0072] [Technical Effects of the Embodiments in this Application]

[0073] In summary, the chip stripping system and chip pushing device disclosed in this application can selectively push the inner ejector seat and multiple first ejector pins, and / or push the outer ejector seat and multiple second ejector pins through the first pushing mechanism and the second pushing mechanism, correspondingly pushing each of the first chips or each of the second chips (i.e., the object to be processed) adhered to the adhesive film. This allows the object to be processed to be ejected from the first chips or second chips by the chip pushing device without transfer, thereby avoiding damage during the transfer process (e.g., changes in the characteristics of the adhesive film).

[0074] The embodiments and / or implementation methods described above are merely preferred embodiments and / or implementation methods for implementing the technology of this application, and are not intended to limit the implementation methods of the technology of this application in any way. Any person skilled in the art may make some modifications or alterations to other equivalent embodiments without departing from the scope of the technical means disclosed in this application, but these should still be regarded as the technology or embodiments that are substantially the same as those of this application.

Claims

1. A chip stripping system, characterized in that, The chip stripping system includes: An object to be processed includes an adhesive film and a wafer adhered to the adhesive film; wherein the wafer includes a plurality of first chips and a plurality of second chips spaced apart from the plurality of first chips, and the size of each second chip is larger than the size of any one of the first chips; A worktable for fixing the adhesive film; and A chip pushing device is disposed within the worktable for pushing each of the first chips or each of the second chips on the wafer. The chip pushing device includes: One platform; A pin holder structure is disposed on one side of the stage, the pin holder structure comprising: A first pushing mechanism is capable of selectively moving along a preset direction; A second pushing mechanism is disposed outside the first pushing mechanism; wherein the second pushing mechanism is selectively movable along the preset direction; An inner ejector seat and a plurality of first ejector pins, the inner ejector seat being connected to the first pushing mechanism and the second pushing mechanism, and the plurality of first ejector pins being fixed to the inner ejector seat; and An outer ejector seat and a plurality of second ejector pins, the outer ejector seat being disposed outside the inner ejector seat and connected to the second pushing mechanism, the plurality of second ejector pins being fixed to the outer ejector seat; and A housing is connected to the stage and covers the ejector pin seat structure. The housing has multiple ejector pin holes, and the positions of the housing correspond to multiple first ejector pins and multiple second ejector pins, respectively. When the first pushing mechanism moves along the preset direction and the second pushing mechanism does not move, the first pushing mechanism pushes up the inner pin seat so that the plurality of first pins pass through the corresponding pin holes to push the first chip. When the second pushing mechanism moves along the preset direction, the inner ejector pin seat and the outer ejector pin seat are simultaneously pushed up, so that a plurality of first ejector pins and a plurality of second ejector pins pass through the corresponding ejector pin holes to push the second chip.

2. The chip stripping system according to claim 1, characterized in that, The chip stripping system further includes a chip capturing device located on one side of the chip pushing device, and the chip capturing device can be used to capture the first chip or the second chip pushed out by the chip pushing device, so as to separate the first chip or the second chip from the adhesive film.

3. The chip stripping system according to claim 1, characterized in that, When neither the first pushing mechanism nor the second pushing mechanism pushes up the inner ejector seat and the outer ejector seat, the inner ejector seat and the outer ejector seat are both located in a first position, and the top surfaces of the inner ejector seat and the outer ejector seat are coplanar. When the second pushing mechanism moves along the preset direction, the second pushing mechanism simultaneously drives the first pushing mechanism, thereby simultaneously pushing up the inner ejector seat and the outer ejector seat, so that the inner ejector seat and the outer ejector seat are located in a second position, and the top surfaces of the inner ejector seat and the outer ejector seat are coplanar.

4. The chip stripping system according to claim 1, characterized in that, The chip pushing device is defined with a central cross-section formed along the preset direction, and the stage, the ejector pin structure, and the housing are mirror-symmetrical to the central cross-section, and a plurality of first ejector pins and a plurality of second ejector pins are arranged in pairs facing each other relative to the central cross-section.

5. The chip stripping system according to claim 4, characterized in that, The plurality of first ejector pins have a first distribution density, and the plurality of second ejector pins have a second distribution density that is less than the first distribution density.

6. The chip stripping system according to claim 1, characterized in that, The first pushing mechanism can move a predetermined distance along the preset direction so that the inner ejector seat is adjacent to the housing; the second pushing mechanism can move the predetermined distance along the preset direction so that the inner ejector seat and the outer ejector seat are adjacent to the housing.

7. The chip stripping system according to claim 1, characterized in that, The platform further has multiple protrusions, and the housing has multiple fixing parts corresponding to the multiple protrusions, and the multiple protrusions are used to fix the multiple fixing parts.

8. The chip stripping system according to claim 1, characterized in that, The first pushing mechanism is columnar, and the second pushing mechanism is ring-shaped and surrounds the first pushing mechanism.

9. A chip pushing device, characterized in that, The chip pushing device can be used to push a first chip or a second chip larger than the first chip onto a wafer. The chip pushing device includes: One platform; A pin holder structure is disposed on one side of the stage, the pin holder structure comprising: A first pushing mechanism is capable of selectively moving along a preset direction; A second pushing mechanism is disposed outside the first pushing mechanism; wherein the second pushing mechanism is selectively movable along the preset direction; An inner ejector seat and a plurality of first ejector pins, the inner ejector seat being connected to the first pushing mechanism and the second pushing mechanism, and the plurality of first ejector pins being fixed to the inner ejector seat; and An outer ejector seat and a plurality of second ejector pins, the outer ejector seat being disposed outside the inner ejector seat and connected to the second pushing mechanism, the plurality of second ejector pins being fixed to the outer ejector seat; and A housing is connected to the stage and covers the ejector pin seat structure. The housing has multiple ejector pin holes, and the positions of the housing correspond to multiple first ejector pins and multiple second ejector pins, respectively. When the first pushing mechanism moves along the preset direction and the second pushing mechanism does not move, the first pushing mechanism pushes up the inner pin seat so that the plurality of first pins pass through the corresponding pin holes to push the first chip. When the second pushing mechanism moves along the preset direction, the inner ejector pin seat and the outer ejector pin seat are simultaneously pushed up, so that a plurality of first ejector pins and a plurality of second ejector pins pass through the corresponding ejector pin holes to push the second chip.

10. A chip stripping system, characterized in that, The chip stripping system includes: An object to be processed includes an adhesive film and a wafer adhered to the adhesive film; wherein the wafer includes a plurality of first chips and a plurality of second chips spaced apart from the plurality of first chips, and the size of each second chip is larger than the size of any one of the first chips; A worktable for fixing the adhesive film; and A chip pushing device is disposed within the worktable for pushing each of the first chips or each of the second chips on the wafer. The chip pushing device includes: One platform; A pin holder structure is disposed on one side of the stage, the pin holder structure comprising: A first pushing mechanism is capable of selectively moving along a preset direction; A second pushing mechanism is disposed outside the first pushing mechanism; wherein the second pushing mechanism is selectively movable along the preset direction; An inner ejector seat and a plurality of first ejector pins, wherein the inner ejector seat is connected to the first pushing mechanism. A plurality of the first ejector pins are fixed to the inner ejector pin seat; and An outer ejector seat and a plurality of second ejector pins, the outer ejector seat being disposed outside the inner ejector seat and connected to the second pushing mechanism, the plurality of second ejector pins being fixed to the outer ejector seat; and A housing is connected to the stage and covers the ejector pin seat structure. The housing has multiple ejector pin holes, and the positions of the housing correspond to multiple first ejector pins and multiple second ejector pins, respectively. When the first pushing mechanism moves along the preset direction and the second pushing mechanism does not move, the first pushing mechanism pushes up the inner pin seat so that the plurality of first pins pass through the corresponding pin holes to push the first chip. When the second pushing mechanism moves along the preset direction and the first pushing mechanism does not move, the second pushing mechanism pushes up the outer pin seat so that multiple second pins pass through the corresponding pin holes to push the second chip.

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