Wafer feeding device and feeding method thereof

Abstract

The invention discloses a wafer feeding device and a feeding method thereof.The wafer feeding device comprises a wafer platform, two feeding mechanisms and a transferring mechanism, the two feeding mechanisms are symmetrically arranged on the two opposite sides of the wafer platform, each feeding mechanism is internally provided with a plurality of feeding pieces, and the feeding pieces are used for bearing wafers; the transfer mechanism is arranged between the two feeding mechanisms, the transfer mechanism comprises two clamping assemblies, the two clamping assemblies and the two feeding mechanisms are arranged in a one-to-one correspondence mode, and when one clamping assembly transfers a feeding piece in the corresponding feeding mechanism to the wafer platform, the two clamping assemblies are arranged in a one-to-one correspondence mode; and the other clamping assembly is used for transferring the material supply piece on the wafer platform to the corresponding material supply mechanism. According to the wafer feeding device, the feeding operation of the wafer and the discharging operation of the empty feeding piece can be synchronously carried out, the overall feeding efficiency of the wafer feeding device is improved, and the technical requirement of a wafer processing production line for efficient and continuous feeding is met.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and in particular to a wafer feeding device and its feeding method. Background Technology

[0002] In the field of wafer fabrication technology, the processing requires a feeding mechanism to transport wafers to designated processing positions for subsequent operations. Existing feeding mechanisms consist of only a single loading component, which must simultaneously perform two tasks: removing empty wafer disks (after wafer removal) from the wafer stage and placing full wafer disks (filled with wafers) onto the wafer stage. This single loading component's workflow results in sequential loading and unloading, leaving the wafer stage idle while waiting for empty disks to be removed and new disks to be placed. This limits the overall feeding rhythm, leading to low overall feeding efficiency and failing to meet the high-efficiency, continuous feeding requirements of wafer fabrication production lines. Summary of the Invention

[0003] This application aims to at least solve one of the aforementioned technical problems existing in the prior art. Therefore, the purpose of this application is to provide a wafer feeding device that enables the wafer loading operation and the unloading operation of empty feeders to be performed simultaneously, thereby improving the overall feeding efficiency of the wafer feeding device and meeting the technical requirements of wafer processing production lines for efficient and continuous feeding.

[0004] This application also proposes a feeding method based on the above-mentioned wafer feeding device.

[0005] A wafer feeding apparatus according to a first aspect embodiment of this application includes: Wafer platform; Two feeding mechanisms are symmetrically arranged on opposite sides of the wafer platform. Each feeding mechanism is provided with multiple feeding components, which are used to carry wafers. A transfer mechanism is disposed between the two feeding mechanisms. The transfer mechanism includes two clamping components, which are configured one-to-one with the two feeding mechanisms. When one of the clamping components transfers the feed component in the corresponding feeding mechanism to the wafer platform, the other clamping component transfers the feed component on the wafer platform to the corresponding feeding mechanism.

[0006] The wafer feeding device according to the embodiments of this application has at least the following beneficial effects: two feeding mechanisms are symmetrically arranged on opposite sides of the wafer platform. Each feeding mechanism is provided with multiple feeding components for carrying wafers. At the same time, two clamping components are arranged one-to-one with the two feeding mechanisms. When one clamping component transfers the feeding component in the corresponding feeding mechanism to the wafer platform, the other clamping component simultaneously transfers the feeding component on the wafer platform to the corresponding feeding mechanism. This allows the wafer loading operation and the unloading operation of empty feeding components to be carried out simultaneously, improving the overall feeding efficiency of the wafer feeding device and meeting the technical requirements of wafer processing production lines for efficient and continuous feeding.

[0007] According to some embodiments of this application, the clamping assembly includes a first clamping member, a second clamping member, and a driving member. The first clamping member and the second clamping member are disposed opposite to each other along a first direction. The first clamping member is connected to the driving end of the driving member. The first clamping member can rotate relative to the second clamping member to clamp the feeder.

[0008] According to some embodiments of this application, the clamping assembly further includes a mounting base, the second clamping member is connected to the mounting base, the first clamping member is rotatably connected to the mounting base via a rotating shaft, the first clamping member is hinged to the driving end of the driving member, and the driving member can drive the first clamping member to rotate around the rotating shaft to adjust the angle between the first clamping member and the second clamping member.

[0009] According to some embodiments of this application, the transfer mechanism further includes a moving module, and the mounting base is connected to the moving end of the moving module to drive the clamping assembly to move along a second direction, wherein the second direction is perpendicular to the first direction.

[0010] According to some embodiments of this application, the feeding mechanism includes a feeding box, and the feeding box is provided with a plurality of first mounting parts and a plurality of second mounting parts on its two inner sidewalls along a third direction. The plurality of first mounting parts and the plurality of second mounting parts are all spaced apart along a first direction. The first mounting parts and the corresponding second mounting parts form a mounting position. The feeding component is disposed in the mounting position, wherein the third direction is perpendicular to the first direction.

[0011] According to some embodiments of this application, the feeding mechanism further includes a lifting assembly, and the feeding box is connected to the lifting end of the lifting assembly to drive the feeding box to move along the first direction.

[0012] According to some embodiments of this application, the wafer platform includes two limiting rings, which are spaced apart along a first direction to form a feeding position, and the transfer mechanism can transfer the feeding component to the feeding position.

[0013] According to some embodiments of this application, both of the limiting rings are provided with clearance openings, which are used to avoid the clamping components.

[0014] According to the second aspect embodiment of this application, the feeding method using the wafer feeding apparatus of the first aspect embodiment of this application includes the following steps: The moving module of the transfer mechanism drives one of the clamping components to move to the loading position corresponding to the feeding mechanism. The clamping component clamps the feeding component that carries the wafer in the feeding mechanism, and the other clamping component clamps the feeding component that completes the feeding on the wafer platform. The moving module drives the clamping assembly to transfer the feeder carrying the wafer to the feed position of the wafer platform, and another clamping assembly transfers the feeder that has completed feeding to the unloading position of the corresponding feed mechanism. The two clamping components alternately transfer the feeder carrying the wafer in the corresponding feeding mechanism to the feeding position of the wafer platform, and alternately transfer the feeder that has completed feeding on the wafer platform to the corresponding feeding mechanism, until the feeding of the feeder in the feeding mechanism is completed.

[0015] The feeding method according to the embodiments of this application has at least the following beneficial effects: by moving the module, the two clamping components are driven to perform clamping and feeding of the feeder to be fed and clamping and unloading of the feeder to be fed, respectively, so as to realize the synchronous and parallel operation of feeding and unloading, improve the overall feeding efficiency, and meet the technical requirements of wafer processing production lines for efficient and continuous feeding.

[0016] According to some embodiments of this application, the moving module of the transfer mechanism drives one of the clamping components to move to the loading position corresponding to the feeding mechanism. The clamping component clamps the feeding element carrying the wafer within the feeding mechanism, including: The lifting component of the feeding mechanism drives its feeding box to move along the first direction to a preset position, so that the clamping component can clamp the feeding components in the feeding box in sequence.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the wafer feeding device according to an embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the transfer mechanism of the wafer feeding device shown. Figure 3 for Figure 2 The diagram shows the structure of the clamping assembly of the transfer mechanism. Figure 4 for Figure 1 The diagram shows the structure of the feeding mechanism of the wafer feeding device. Figure 5 for Figure 1 One of the schematic diagrams of the wafer platform of the wafer feeding device shown; Figure 6 for Figure 1 The second schematic diagram of the wafer platform of the wafer feeding device shown; Figure 7 for Figure 6 The diagram shows the structure of the wafer platform limiting ring.

[0019] Reference numerals: 100, wafer platform; 110, limiting ring; 111, clearance opening; 200. Feeding mechanism; 210. Feeding component; 220. Feeding box; 221. First mounting section; 222. Second mounting section; 230. Lifting assembly; 300. Transfer mechanism; 310. Clamping assembly; 311. First clamping member; 312. Second clamping member; 313. Drive component; 314. Mounting base; 315. Linkage rod; 316. Rotating shaft; 317. Limiting step; 320. Moving module; 400. Wafer. Detailed Implementation

[0020] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0021] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0024] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] Reference Figures 1 to 4 The first aspect of this application provides a wafer feeding device, including a wafer platform 100, two feeding mechanisms 200 and a transfer mechanism 300. The two feeding mechanisms 200 are symmetrically arranged on opposite sides of the wafer platform 100. Each feeding mechanism 200 is provided with a plurality of feeding elements 210, which are used to carry wafers 400. The transfer mechanism 300 is disposed between the two feeding mechanisms 200. The transfer mechanism 300 includes two clamping components 310, which are arranged one-to-one with the two feeding mechanisms 200. When one clamping component 310 transfers the feeding element 210 in the corresponding feeding mechanism 200 to the wafer platform 100, the other clamping component 310 transfers the feeding element 210 on the wafer platform 100 to the corresponding feeding mechanism 200.

[0026] Specifically, two feeding mechanisms 200 are symmetrically arranged on both sides of the wafer platform 100. Each feeding mechanism 200 is provided with multiple feeding components 210 for carrying wafers 400. At the same time, two clamping components 310 are arranged one-to-one with the two feeding mechanisms 200. When one clamping component 310 transfers the feeding component 210 in the corresponding feeding mechanism 200 to the wafer platform 100, the other clamping component 310 simultaneously transfers the feeding component 210 on the wafer platform 100 to the corresponding feeding mechanism 200. This allows the wafer 400 loading operation to be carried out simultaneously with the unloading operation of the empty feeding component 210, thereby improving the overall feeding efficiency of the wafer feeding device and meeting the technical requirements of the wafer 400 processing production line for efficient and continuous feeding.

[0027] Reference Figures 1 to 3 In some embodiments, the clamping assembly 310 includes a first clamping member 311, a second clamping member 312, and a driving member 313. The first clamping member 311 and the second clamping member 312 are disposed opposite to each other along a first direction. The first clamping member 311 is connected to the driving end of the driving member 313, and the first clamping member 311 can rotate relative to the second clamping member 312 to clamp the feed member 210. Specifically, the driving member 313 drives the first clamping member 311 to rotate, adjusting the angle between the first clamping member 311 and the second clamping member 312, thereby facilitating the clamping of the feed member 210. By using the driving member 313 to drive the first clamping member 311 to rotate, the angle between the first clamping member 311 and the second clamping member 312 is adjusted, thereby adjusting the clamping angle of the two clamping members. This reduces the overall volume of the clamping assembly 310, lowers the space occupancy, and allows the clamping assembly 310 to adapt to the installation layout requirements of the transfer mechanism 300. Meanwhile, by using the drive component 313 to rotate the first clamping component 311, the included angle between the first clamping component 311 and the second clamping component 312 can be adjusted, so that the first clamping component 311 and the second clamping component 312 can be adapted to the feeder component 210 with different shapes and sizes, thereby improving the versatility of the clamping assembly.

[0028] Reference Figure 1 , Figure 2 It should be noted that the first direction is set to the Z-axis direction.

[0029] Reference Figures 1 to 3In some embodiments, the clamping assembly 310 further includes a mounting base 314, a second clamping member 312 connected to the mounting base 314, a first clamping member 311 rotatably connected to the mounting base 314 via a pivot 316, and the first clamping member 311 is hinged to the driving end of the driving member 313. The driving member 313 can drive the first clamping member 311 to rotate around the pivot 316 to adjust the angle between the first clamping member 311 and the second clamping member 312. Specifically, the driving component 313 is configured as a cylinder, and the driving end of the cylinder is hinged to the first clamping component 311 via a connecting rod 315. When the driving end of the driving component 313 pushes the first clamping component 311, the first clamping component 311 rotates around the rotating shaft 316, thereby converting the linear movement of the driving component 313 into the rotation of the first clamping component 311. This simplifies the transmission structure of the clamping assembly 310, reduces the overall size and manufacturing cost of the clamping assembly 310, and allows for adjustment of the included angle of the first clamping component 311 by rotating around the rotating shaft 316. This enables the first clamping component 311 and the second clamping component 312 to adapt to feeders 210 of different shapes and sizes, improving the adaptability and versatility of the clamping assembly 310 to the feeders 210. Of course, in actual design, the structure of the driving component 313 can be designed according to actual needs.

[0030] Reference Figures 1 to 3 In some embodiments, a limiting step 317 is formed between the second clamping member and the mounting base. When the clamping assembly 310 clamps the feeder 210, the limiting step 317 contacts the edge of the feeder 210, thereby limiting the feeder 210. Combined with the clamping force of the first clamping member 311 and the second clamping member 312, the position and posture of the feeder 210 during the clamping process are further limited, preventing the feeder 210 from shifting due to the clamping force or shaking during the transfer process, and improving the positional stability of the feeder 210 in the clamping state.

[0031] Reference Figures 1 to 3In some embodiments, the transfer mechanism 300 further includes a moving module 320, and the mounting base 314 is connected to the moving end of the moving module 320 to drive the clamping assembly 310 to move along a second direction, wherein the second direction is perpendicular to the first direction. Specifically, the moving module 320 drives the mounting base 314 to move along the second direction, which can drive the clamping component 310 to the loading position and unloading position of the feeding mechanism 200 and the feeding position of the wafer platform 100. This facilitates the clamping component 310 to transfer the feeding component 210 carrying the wafer 400 to the wafer platform 100 or to transfer the feeding component 210 that has completed feeding to the feeding mechanism 200. This realizes the transfer of the feeding component 210 between the feeding mechanism 200 and the wafer platform 100. With the synchronous reverse operation mode of the two clamping components 310, the idle waiting time of the wafer platform 100 is reduced, ensuring the continuity of the overall feeding process and improving the transfer efficiency of the transfer mechanism 300 and the feeding rhythm of the overall feeding device.

[0032] In some embodiments, the moving module 320 is configured as a U-shaped linear motor, which is driven in a closed loop by a magnetic scale. Compared with traditional synchronous belt or lead screw transmission structures, this solves the problem of missed steps and ensures positioning accuracy during the transfer process. Furthermore, the drive section of the U-shaped linear motor has a cross-sectional dimension of 40mm*36mm, which is small in size, saving installation space for the moving module 320 and optimizing its overall structural layout. In addition, due to processing and assembly errors, the central axis of the feed box 220 is at a certain angle to the first direction. The U-shaped linear motor can drive the clamping component 310 to move and clamp the feed component by setting the force control mode. Compared with the traditional synchronous belt or screw drive structure, which cannot guarantee that each feed component 210 is in contact with the clamping component 310 and is prone to compression deformation due to excessive movement, the force control mode can adjust the moving force and position of the clamping component 310 in real time to ensure that the clamping component 310 is in contact with each feed component 210. At the same time, it can avoid compression deformation of the feed component 210 due to excessive movement, ensure the clamping accuracy of the clamping component 310, reduce damage to the feed component 210 and the supporting wafer, and improve the reliability of the feed component 210 transfer process and the wafer transfer yield.

[0033] Reference Figure 1 , Figure 2 It should be noted that the second direction is set as the X-axis direction.

[0034] Reference Figure 1 , Figure 4In some embodiments, the feeding mechanism 200 includes a feeding box 220. The feeding box 220 has a plurality of first mounting portions 221 and a plurality of second mounting portions 222 respectively provided on its two inner sidewalls along a third direction. The plurality of first mounting portions 221 and the plurality of second mounting portions 222 are all spaced apart along a first direction. The first mounting portion 221 and the corresponding second mounting portion 222 form a mounting position. The feeding component 210 is disposed in the mounting position. The third direction is perpendicular to the first direction. Specifically, the first mounting part 221 and the corresponding second mounting part 222 can support the feeders 210, thereby allowing multiple feeders 210 to be spaced apart. This provides clamping and placement positions for the clamping assembly 310, facilitating the clamping assembly 310 to grip the feeders 210 carrying the wafer 400 and transfer them to the wafer platform 100. It also facilitates the clamping assembly 310 to transfer the feeders 210 that have completed feeding to the corresponding mounting positions, improving the docking efficiency between the clamping assembly 310 and the feeding mechanism 200, and ensuring the smooth transfer of the feeders 210 between the feeding mechanism 200 and the wafer platform 100. At the same time, the feed box 220 can hold multiple feeders 210 carrying the wafer 400, reducing the frequency of changing the feed box 220 and improving feeding efficiency.

[0035] Reference Figure 1 , Figure 4 It should be noted that the third direction is set to the Y-axis direction.

[0036] In some embodiments, the mounting position of the feeding box 220 can hold the feeding component 210 that carries different types of wafers 400, and the feeding operation of different types of wafers 400 can be completed through the same feeding mechanism 200, reducing the equipment investment and space occupied by the feeding device, and simplifying the equipment layout design of the wafer 400 processing production line.

[0037] Reference Figure 1 , Figure 4In some embodiments, the feeding mechanism 200 further includes a lifting assembly 230. The feeding box 220 is connected to the lifting end of the lifting assembly 230 to drive the feeding box 220 to move along a first direction, thereby adjusting the position of the feeding box 220 in the first direction. Combined with multiple mounting positions spaced apart along the first direction inside the feeding box 220, mounting positions of different heights can be driven to align sequentially with the working position of the clamping assembly 310, achieving feeding of the contents of the feeding box 220 without additional adjustment of the position of the clamping assembly 310. The sequential operation of multiple feeders 210 facilitates the clamping assembly 310 in sequentially gripping the feeders 210 carrying the wafer 400 and transferring them to the wafer platform 100. It also facilitates the clamping assembly 310 in transferring the fed feeders 210 to their corresponding mounting positions, improving the docking accuracy and operational efficiency between the clamping assembly 310 and the feeding mechanism 200. Simultaneously, the lifting adjustment method allows multiple feeders 210 within the feed box 220 to participate in the feeding process in an orderly manner, ensuring the continuity and orderliness of the feeding process. Furthermore, the lifting assembly 230 can be configured as a linear module; however, in actual design, the structure of the lifting assembly 230 can be designed according to specific needs.

[0038] Reference Figure 1 , Figures 5 to 7 In some embodiments, the wafer platform 100 includes two limiting rings 110, which are spaced apart along a first direction to form a feeding position, and the transfer mechanism 300 can transfer the feeding component 210 to the feeding position. Specifically, the clamping assembly 310 transfers the feeder 210 to the feed position. At this time, the limiting ring 110 limits the edge of the feeder 210 to prevent the feeder 210 from shifting or shaking on the wafer platform 100, ensuring the positional stability of the feeder 210 and the supporting wafer 400. At the same time, the wafer 400 on the feeder 210 is exposed in the middle of the limiting ring 110, providing working space for subsequent processes, improving the flow efficiency of the wafer 400 from the feeding stage to the subsequent processing stage, ensuring the continuous operation rhythm of the wafer 400 processing line, and the exposed wafer 400 has a clear position, which is convenient for the execution mechanism of the subsequent process to position and grasp, reducing the risk of the wafer 400 shifting, falling off or being damaged during the transfer or transport process, and improving the reliability of the wafer 400 processing process.

[0039] Reference Figures 5 to 7 In some embodiments, both limiting rings 110 are provided with clearance openings 111, which are used to avoid the clamping assembly 310, so that the transfer module can drive the clamping assembly 310 to move, thereby transferring the feeder 210 to the feed position of the wafer platform 100.

[0040] In some embodiments, the feeder 210 is configured as a steel ring structure. The steel ring can be set at the feed position. A blue film is provided in the hollow area of ​​the steel ring as a support for the wafer 400. The outer periphery of the blue film is fixed on the steel ring, and the wafer 400 is adhered and fixedly placed on the blue film.

[0041] A second aspect of this application provides a feeding method, which uses the wafer feeding apparatus of the first aspect of this application and includes the following steps: S100, the moving module 320 of the transfer mechanism 300 drives one of the clamping components 310 to move to the loading position of the corresponding feeding mechanism 200. The clamping component 310 clamps the feeding component 210 carrying the wafer 400 in the corresponding feeding mechanism 200, and the other clamping component 310 clamps the feeding component 210 that has completed feeding on the wafer platform 100.

[0042] In step S100, the two clamping components 310 are divided into a first clamping component and a second clamping component, and the two feeding mechanisms 200 are divided into a first feeding mechanism and a second feeding mechanism. The moving module 320 of the transfer mechanism 300 drives the first clamping component to move to the loading position of the first feeding mechanism. The first clamping component clamps the feeding component 210 carrying the wafer 400 in the first feeding mechanism, and the second clamping component clamps the feeding component 210 that has completed feeding on the wafer platform 100; or, the moving module 320 drives the second clamping component to move to the loading position of the second feeding mechanism. The second clamping component clamps the feeding component 210 carrying the wafer 400 in the second feeding mechanism, and the first clamping component clamps the feeding component 210 that has completed feeding on the wafer platform 100.

[0043] S200, the moving module 320 drives the clamping component 310 to transfer the feeder 210 carrying the wafer 400 to the feed position of the wafer platform 100, and another clamping component 310 transfers the feeder 210 that has completed feeding to the unloading position of the corresponding feeding mechanism.

[0044] In step S200, the moving module 320 drives the first clamping component to transfer the feeder 210 carrying the wafer 400 to the feed position of the wafer platform 100, and the second clamping component transfers the feeder 210 that has completed feeding to the unloading position of the second feeding mechanism; or, the moving module 320 drives the second clamping component to transfer the feeder 210 carrying the wafer 400 to the feed position of the wafer platform 100, and the first clamping component transfers the feeder 210 that has completed feeding to the unloading position of the first feeding mechanism.

[0045] In step S200, the lifting component 230 of the feeding mechanism 200 drives its feeding box 220 to move along the first direction to a preset position, so that the clamping component 310 can clamp the feeding parts 210 in the feeding box 220 in sequence, and also facilitate the clamping component 310 to transfer the feeding parts 210 that have completed feeding to the corresponding installation position, thereby improving the docking accuracy and operation efficiency between the clamping component 310 and the feeding mechanism 200.

[0046] S300, the two clamping components 310 alternately transfer the feeder 210 carrying the wafer 400 in the corresponding feeder mechanism 200 to the feeder position of the wafer platform 100, and alternately transfer the feeder 210 that has completed feeding on the wafer platform 100 to the corresponding feeder mechanism 200, until the feeder 210 in the feeder mechanism 200 is fully fed.

[0047] In step S300, the first clamping assembly clamps the feeder 210 carrying the wafer 400 in the first feeding mechanism to the feeding position of the wafer platform 100. Simultaneously, the second clamping assembly transfers the feeder 210, which has completed feeding, to the unloading position of the second feeding mechanism. Subsequently, the second clamping assembly transfers the feeder 210 carrying the wafer 400 to the feeding position of the wafer platform 100, and the first clamping assembly transfers the feeder 210, which has completed feeding, to the unloading position of the first feeding mechanism.

[0048] The feeding method of this application embodiment uses a moving module 320 to drive two clamping components 310 to perform clamping and feeding of the feeder 210 to be fed and clamping and unloading of the feeder 210 to be completed, thereby realizing the synchronous and parallel execution of feeding and unloading actions, improving the overall feeding efficiency, and meeting the technical requirements of the wafer 400 processing production line for efficient and continuous feeding.

[0049] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A wafer feeding device, characterized in that, include: Wafer platform; Two feeding mechanisms are symmetrically arranged on opposite sides of the wafer platform. Each feeding mechanism is provided with multiple feeding components, which are used to carry wafers. A transfer mechanism is disposed between the two feeding mechanisms. The transfer mechanism includes two clamping components, which are configured one-to-one with the two feeding mechanisms. When one of the clamping components transfers the feed component in the corresponding feeding mechanism to the wafer platform, the other clamping component transfers the feed component on the wafer platform to the corresponding feeding mechanism.

2. The wafer feeding device according to claim 1, characterized in that, The clamping assembly includes a first clamping member, a second clamping member, and a driving member. The first clamping member and the second clamping member are disposed opposite to each other along a first direction. The first clamping member is connected to the driving end of the driving member. The first clamping member can rotate relative to the second clamping member to clamp the feeder.

3. The wafer feeding device according to claim 2, characterized in that, The clamping assembly further includes a mounting base, the second clamping member is connected to the mounting base, the first clamping member is rotatably connected to the mounting base via a rotating shaft, the first clamping member is hinged to the driving end of the driving member, and the driving member can drive the first clamping member to rotate around the rotating shaft to adjust the angle between the first clamping member and the second clamping member.

4. The wafer feeding device according to claim 3, characterized in that, The transfer mechanism further includes a moving module, and the mounting base is connected to the moving end of the moving module to drive the clamping assembly to move along a second direction, wherein the second direction is perpendicular to the first direction.

5. The wafer feeding device according to claim 1, characterized in that, The feeding mechanism includes a feeding box, and the feeding box is provided with a plurality of first mounting parts and a plurality of second mounting parts on its two inner sidewalls along a third direction. The plurality of first mounting parts and the plurality of second mounting parts are all spaced apart along a first direction. The first mounting parts and the corresponding second mounting parts form mounting positions. The feeding component is disposed in the mounting positions, wherein the third direction is perpendicular to the first direction.

6. The wafer feeding device according to claim 5, characterized in that, The feeding mechanism further includes a lifting assembly, and the feeding box is connected to the lifting end of the lifting assembly to drive the feeding box to move along the first direction.

7. The wafer feeding device according to claim 1, characterized in that, The wafer platform includes two limiting rings, which are spaced apart along a first direction to form a feeding position. The transfer mechanism can transfer the feeding component to the feeding position.

8. The wafer feeding device according to claim 7, characterized in that, Both of the limiting rings are provided with clearance openings, which are used to avoid the clamping components.

9. A feeding method based on the wafer feeding apparatus according to any one of claims 1 to 8, characterized in that, Includes the following steps: The moving module of the transfer mechanism drives one of the clamping components to move to the loading position corresponding to the feeding mechanism. The clamping component clamps the feeding component that carries the wafer in the feeding mechanism, and the other clamping component clamps the feeding component that completes the feeding on the wafer platform. The moving module drives the clamping assembly to transfer the feeder carrying the wafer to the feed position of the wafer platform, and another clamping assembly transfers the feeder that has completed feeding to the unloading position of the corresponding feed mechanism. The two clamping components alternately transfer the feeder carrying the wafer in the corresponding feeding mechanism to the feeding position of the wafer platform, and alternately transfer the feeder that has completed feeding on the wafer platform to the corresponding feeding mechanism, until the feeding of the feeder in the feeding mechanism is completed.

10. The feeding method according to claim 9, characterized in that, The moving module of the transfer mechanism drives one of the clamping components to move to the loading position corresponding to the feeding mechanism. This clamping component clamps the feeding element carrying the wafer within the feeding mechanism, including: The lifting component of the feeding mechanism drives its feeding box to move along the first direction to a preset position, so that the clamping component can clamp the feeding components in the feeding box in sequence.

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