Light emitting device package and display device using the same

Abstract

The present invention can be applied to the technical field related to display devices, and relates to a light emitting device package using, for example, a light emitting diode (LED), and a display device. This invention may comprise: a first layer provided with a light emitting part including a light emitting device constituting a unit sub-pixel; a second layer on a first surface of the first layer, the second layer including a terminal portion and a plurality of connection electrodes connecting a gap between the terminal portion and the light emitting device; and a third layer located on a second surface of the first layer and transmitting light emitted from the light emitting portion, the connection electrode may have a height corresponding to the interval and have a pillar structure having an inclination angle with respect to the first surface.

Description

Technical Field

[0001] This invention is applicable to the field of display device technology, for example, it relates to a light-emitting device package and display device utilizing LED (Light Emitting Diode). Background Technology

[0002] In recent years, the field of display technology has seen the development of display devices with superior characteristics such as thinness and flexibility. Currently, the main commercially available displays are represented by LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diodes).

[0003] On the other hand, light-emitting diodes (LEDs), as semiconductor light-emitting devices known for converting electric current into light, have been used as light sources for displaying images in electronic devices, including information and communication equipment, since the commercialization of red LEDs using GaAsP compound semiconductors in 1962, along with green LEDs of the GaP:N series.

[0004] In recent years, these light-emitting diodes (LEDs) have been gradually miniaturized and manufactured into micron-sized LEDs for use as pixels in display devices.

[0005] Compared to other conventional devices / panels, LED technology, as described above, exhibits characteristics such as low power consumption, high brightness, and high reliability, and is also applicable to flexible devices. Therefore, it has been actively researched by research institutions and companies in recent years.

[0006] The diverse market for LED displays is expanding into applications that leverage the high brightness and high reliability of LEDs. Signage displays, in particular, hold the dominant position in the market due to these characteristics.

[0007] In the display described above, LEDs can be manufactured in a package form that can be used as a unit pixel. When using miniature LEDs with a size in the micrometer unit, such an LED package may include a support layer comprising a common sapphire substrate. Typically, this support layer may be significantly thicker than the light-emitting layer containing the LED. As mentioned above, if the support layer is thick, more light is emitted from the sides of the LED package. From the display device's perspective, this side-emitted light may be perceived as a loss.

[0008] In displays such as PM (passive matrix) signage, mini LEDs, which can achieve high brightness using driving methods such as PWM (pulse width modulation), have been implemented and applied. In recent years, with the goal of improving efficiency and reducing costs, light-emitting device packages (RGB packaged chips) that can utilize miniature LEDs as individual pixels are being developed.

[0009] Using this type of light-emitting device package can reduce the cost of chip-on-wafer (C-on-Wafer) provided in a wafer-on-wafer state, the cost of wiring board mounting, and the cost of simplifying the back panel process through LED mounting.

[0010] However, when miniature LEDs are used instead of miniature LEDs for the light-emitting part, it may be difficult to use miniature LEDs smaller than a certain size due to the phenomenon of efficiency reduction (droop effect) caused by the current density injected into the LED.

[0011] Moreover, as the size of micro LEDs decreases, it becomes difficult to inspect the chips beforehand, and it may be difficult to apply the pick-up and place process currently used in mass production technology, which involves mounting individual chips onto a substrate.

[0012] In addition, solutions are needed to address the problems that may arise as chip size decreases. Summary of the Invention

[0013] The problem that the invention aims to solve

[0014] The technical problem to be solved by the present invention is to provide a light-emitting device package that can stably connect the layers constituting the light-emitting device package and a display device using the same.

[0015] In addition, a light-emitting device package and a display device utilizing the same are provided, which can expand the contact area by using such a connection electrode structure to ensure a stable electrical connection.

[0016] A light-emitting device package with excellent properties is provided, which can improve the thickness of the package by utilizing the structure of the connecting electrodes as described above, thereby improving the durability of the package, and a display device using the same.

[0017] Therefore, a light-emitting device package and a display device utilizing the same are provided, which can improve the reliability of the light-emitting device package to the external environment.

[0018] Furthermore, according to another embodiment of the present invention, those skilled in the art can also understand additional technical issues not mentioned herein through the full spirit of the specification and drawings.

[0019] Technical solutions to the problem

[0020] As a first aspect for achieving the above-mentioned objective, the present invention may include: a first layer having a light-emitting portion comprising a light-emitting device constituting a unit sub-pixel; a second layer located on a first surface of the first layer, comprising a terminal portion and a plurality of connecting electrodes connecting the terminal portion and the light-emitting device to a space; and a third layer located on a second surface of the first layer, through which light emitted from the light-emitting portion passes; the connecting electrodes may have a height corresponding to the space and have a column structure having an angle of inclination relative to the first surface.

[0021] As an exemplary embodiment, the connection electrode may be located on the outer surface of a column shape disposed within the second layer.

[0022] As an exemplary embodiment, the connecting electrode may have an angle of inclination relative to the cylindrical shape.

[0023] As an exemplary embodiment, an inclined portion having the aforementioned inclination angle may be provided on the outer side of the column shape.

[0024] As an exemplary embodiment, the connecting electrode may include: a first connecting portion connected to the terminal portion; and a second connecting portion connected to the light-emitting device.

[0025] As an exemplary embodiment, a third connecting portion may also be included, which is connected between the first connecting portion and the second connecting portion.

[0026] As an exemplary embodiment, the third connecting portion may have the tilt angle.

[0027] As an exemplary embodiment, the terminal portion may have a column structure corresponding to the connecting electrode.

[0028] As an exemplary embodiment, a driving device located on one side of the light-emitting device may also be included.

[0029] As an exemplary embodiment, a fourth layer containing microparticles may also be included between the third layer and the first layer.

[0030] As an exemplary embodiment, the second layer can function as a reflective layer.

[0031] As a second aspect for achieving the above-mentioned objectives, the present invention may include: a light-emitting layer having a light-emitting portion comprising a light-emitting device constituting a unit sub-pixel; a connecting layer located on a first surface of the light-emitting layer, including a terminal portion and a plurality of connecting electrodes connecting the terminal portion and the light-emitting device; and a support layer located on a second surface of the light-emitting layer through which light emitted from the light-emitting portion passes; the connecting electrodes may have a metal pattern shape located on a columnar shape including an inclined portion disposed in the connecting layer.

[0032] As an exemplary embodiment, the metal pattern may be located on the outer surface of a column shape disposed within the connecting layer.

[0033] As an exemplary embodiment, a scattering layer containing microparticles may also be included between the light-emitting layer and the support layer.

[0034] As a third aspect for achieving the above-mentioned objectives, in the display device of the present invention including a light-emitting device package defining a single pixel, the light-emitting device package may include: a light-emitting layer having a light-emitting portion including a light-emitting device constituting a unit sub-pixel; a connecting layer located on a first surface of the light-emitting layer, including a terminal portion and a plurality of connecting electrodes connected between the terminal portion and the light-emitting device; and a support layer located on a second surface of the light-emitting layer, through which light emitted from the light-emitting portion passes; the connecting electrodes may have a metal pattern shape located on a columnar shape including an inclined portion disposed in the connecting layer.

[0035] Invention Effects

[0036] According to one embodiment of the present invention, the following effects are achieved.

[0037] First, according to an embodiment of the present invention, by using a connection electrode having a more gently inclined structure than a via hole structure, it is possible to stably connect the various layers constituting the light-emitting device package.

[0038] In addition, this electrode structure can be used to increase the contact area, thereby ensuring a stable electrical connection.

[0039] The thickness of a light-emitting device package with excellent properties can be improved by utilizing the structure of the connecting electrodes as described above, thereby improving durability.

[0040] This improves the reliability of the light-emitting device package to the external environment.

[0041] Furthermore, according to yet another embodiment of the present invention, additional technical effects not mentioned herein are also present. Those skilled in the art will understand this from the full spirit of the specification and drawings. Attached Figure Description

[0042] Figure 1 This is a cross-sectional view showing a light-emitting device package according to a first embodiment of the present invention.

[0043] Figure 2 This is a top view showing a light-emitting device package according to a first embodiment of the present invention.

[0044] Figure 3 This is an enlarged view showing the column shape and inclined portion of the light-emitting device package according to the first embodiment of the present invention.

[0045] Figure 4 This is a cross-sectional schematic diagram showing an example of a connecting electrode of a light-emitting device package according to an upsloping structural shape, according to a first embodiment of the present invention.

[0046] Figure 5 This is a cross-sectional view showing a light-emitting device package according to a second embodiment of the present invention.

[0047] Figure 6 This is a cross-sectional view showing a light-emitting device package according to a third embodiment of the present invention.

[0048] Figure 7 This is a cross-sectional view showing a light-emitting device package according to a fourth embodiment of the present invention.

[0049] Figure 8 This is a cross-sectional view showing a light-emitting device package according to a fifth embodiment of the present invention.

[0050] Figures 9 to 11 This is a cross-sectional view showing a light-emitting device package according to a sixth embodiment of the present invention and its variations.

[0051] Figure 12 This is a schematic diagram illustrating an example of a connecting electrode used as an alignment mark in an embodiment of the present invention.

[0052] Figure 13 This is a schematic diagram illustrating an example of a terminal portion used as an alignment mark in an embodiment of the present invention.

[0053] Figure 14 This is a cross-sectional schematic diagram showing a display device utilizing a light-emitting device package according to a first embodiment of the present invention.

[0054] Figures 15 to 24 This is a cross-sectional view showing the process of manufacturing the light-emitting device package of the first embodiment. Detailed Implementation

[0055] The embodiments disclosed in this specification will now be described in detail with reference to the accompanying drawings. Unless otherwise specified by the drawing numbers, identical or similar components are given the same reference numerals and their descriptions are omitted. The suffixes "module" and "part" used for the components in this description are assigned or used interchangeably for ease of writing and do not inherently distinguish one another. Furthermore, in describing the embodiments disclosed in this specification, detailed descriptions of related well-known technologies are omitted where it is determined that such detailed descriptions might obscure the main idea of ​​the embodiments disclosed in this specification. It should also be noted that the drawings are only for the purpose of facilitating the understanding of the embodiments disclosed in this specification and should not be construed as limiting the technical concepts disclosed in this specification.

[0056] Furthermore, for ease of explanation, each figure has been described, but other embodiments implemented by those skilled in the art in conjunction with two or more figures are also within the scope of the present invention.

[0057] In addition, when it is mentioned that elements such as layers, regions or substrates exist "on" another constituent element, it should be understood that they can exist directly on the other element, or that there can be other intermediate elements between them.

[0058] The semiconductor light-emitting devices mentioned in this instruction manual include concepts such as LEDs and micro LEDs, and they can be used in combination.

[0059] Figure 1 This is a cross-sectional view showing a light-emitting device package according to a first embodiment of the present invention. Figure 2 This is a top view showing a light-emitting device package according to a first embodiment of the present invention.

[0060] Here, Figure 1 The light-emitting device package of the first embodiment is shown schematically. Therefore, Figure 1 and Figure 2 The structures may not be entirely consistent. As an example, in... Figure 1 For ease of explanation, the structure of the light-emitting part 250 can be shown schematically.

[0061] Reference Figure 1 and Figure 2 The light-emitting device package 200 of the first embodiment of the present invention may include a light-emitting layer (or a first layer) 210, and the light-emitting part 250 of the light-emitting devices 251, 252, and 253 is located in the light-emitting layer 210.

[0062] The light-emitting part 250 may include a first light-emitting device 251, a second light-emitting device 252, and a third light-emitting device 253. As an example, the first light-emitting device may be a red light-emitting device (R), the second light-emitting device may be a green light-emitting device (G), and the third light-emitting device may be a blue light-emitting device (B). Depending on the situation, at least one of these first light-emitting devices (R), second light-emitting devices (G), and third light-emitting devices (B) may include more than two light-emitting devices.

[0063] When the light-emitting device package 200 is used in a display device, the first light-emitting device 251, the second light-emitting device 252, and the third light-emitting device 253 can each correspond to a single subpixel. The first light-emitting device 251, the second light-emitting device 252, and the third light-emitting device 253 can constitute a unit pixel in the display device.

[0064] The light-emitting devices 251, 252, and 253 constituting the light-emitting part 250 can be mini LEDs with a size of millimeters or micro LEDs with a size of micrometers.

[0065] A connection layer (or second layer) 220 may be provided on the first surface 211 of the light-emitting layer 210, including a terminal portion 280 and a plurality of connection electrodes 270 connecting the terminal portion 280 and the light-emitting devices 251, 252, 253.

[0066] A support layer (or third layer) 230 may be provided on the second surface 212 of the light-emitting layer 210 to allow light emitted from the light-emitting part 250 to pass through. That is, light generated by the light-emitting part 250 can be emitted through the support layer 230. As described above, Figure 1 The light-emitting device package shown can be light-oriented. Figure 1 The structure shown is a bottom-emitting (bottom-emitting) type light-emitting device package.

[0067] At this time, the connecting electrode 270 may have metal pattern shapes 271, 272, 273 located on an insulating pillar shape 221 including an inclined portion 222 disposed in the connecting layer 220.

[0068] As an example, the inclined portion 222 may have an inclined angle relative to the main plane of the connecting layer 220. Figure 1 The image shows an example where the inclined portion 222 has an inclination angle θ relative to an imaginary line perpendicular to the main plane of the connecting layer 220.

[0069] As described above, as an exemplary embodiment, the connection electrode 270 may be located on the outer surface of the cylindrical shape 221 disposed within the connection layer (or second layer) 220. Thus, the connection electrode 270 may have an angle of inclination relative to the cylindrical shape 221.

[0070] Reference Figure 1 As an exemplary embodiment, an inclined portion 222 with an inclination angle θ may be provided on the outer side of the column shape 221.

[0071] As an example, an inclined insulating support shape can be formed by a column shape 221 and an inclined portion 222, and a connecting electrode 270 with a metal pattern shape 271, 272, 273 can be provided along the outer side of this support shape.

[0072] The connecting electrode 270 having the metal pattern shapes 271, 272, and 273 as described above can have a structure with a via electrode shape deformed along the via hole. Hereinafter, for ease of explanation, the shape corresponding to the via hole as described above can be referred to as an up-hill structure. Furthermore, the structure of the connecting electrode 270 formed on this up-hill structure can be referred to as an up-hill electrode.

[0073] As an exemplary embodiment, the connecting electrode 270 may include a first connecting portion 271 connected to the terminal portion 280 and a second connecting portion 272 connected to the light-emitting devices 251, 252, and 253.

[0074] Reference Figure 1 and Figure 2 The first connecting portion 271 of the connecting electrode 270 can be electrically connected to the terminal portion 280. Figure 2 In the diagram, the second connection portion 272 is schematically shown. As an example, the second connection portion 272, as described above, can be a common electrode connected to the first light-emitting device 251, the second light-emitting device 252, and the third light-emitting device 253. The second connection portion 272 can be connected to one of the four terminal portions 280. On the other hand, as an example, lighting signals can be transmitted to the first light-emitting device 251, the second light-emitting device 252, and the third light-emitting device 253 respectively through the first connection portion 271, which is connected to the other three of the four terminal portions 280. As another example, a driving device 260 for driving the light-emitting portion 250 (see reference 200) can be additionally provided in the light-emitting device package 200. Figure 5 Therefore, the first light-emitting device 251, the second light-emitting device 252, and the third light-emitting device 253 can be driven individually by this driving device 260.

[0075] As an example, a third connecting portion 273 can be provided between the first connecting portion 271 and the second connecting portion 272. In this case, the third connecting portion 273 can have the same tilt angle as the tilting portion 222. This third connecting portion 273 can essentially set the height of the connecting electrode 270. As an example, the third connecting portion 273 can have a height corresponding to the height between the terminal portion 280 and the light-emitting portion 250. This height can correspond to the height of the column shape 221.

[0076] The connecting electrode 270 with the upsloping structure described above can have an increased effective area compared to through-hole electrodes or cylindrical electrodes formed in the same region. The effects of this connecting electrode 270 structure will be described in detail later.

[0077] As an exemplary embodiment, a fourth layer (or scattering layer) 240 containing microparticles 241 may be provided between the support layer (or third layer) 230 and the light-emitting layer (or first layer) 210.

[0078] These microparticles 241 can have a size of micrometers or nanometers. These microparticles can be light-scattering particles. The refractive index of these microparticles can be greater than 1.3.

[0079] Microparticles may include at least one of metal oxides, resin particles, and inorganic oxides. As an example, microparticles may include at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, silicon dioxide, and PMMA.

[0080] As an example, microparticles can be used to improve viewing angles to prevent color temperature deviations caused by the light emission angle of the light-emitting part 250 in the third layer 230.

[0081] As an exemplary embodiment, the light-emitting layer 210 can function as a reflective layer. For example, this light-emitting layer 210 can also contain microparticles to function as a reflective layer. In this case, the content of microparticles contained in the light-emitting layer 210 can be greater than the content of microparticles contained in the fourth layer (or scattering layer) 240.

[0082] As an example, the inclined portion 222 constituting the uphill structure can have the same physical properties as the light-emitting layer 210. That is, the inclined portion 222 can function as a reflective layer in the same way as the light-emitting layer 210.

[0083] In the case of displays such as signage using the PM (passive matrix) method, mini LEDs, which can achieve high brightness based on driving methods such as PWM (pulse width modulation), are implemented and applied. In recent years, with the goal of improving efficiency and reducing costs, light-emitting device packages (RGB packaged chips) that utilize mini LEDs and can be used as individual pixels are being developed.

[0084] Using this type of light-emitting device package can reduce the cost of chip-on-wafer (C-on-Wafer) provided in a wafer-on-wafer state, the cost of wiring board mounting, and the cost of simplifying the back panel process through LED mounting.

[0085] However, when using micro-LEDs instead of mini-LEDs in the light-emitting section 250, it may be difficult to use micro-LEDs smaller than a certain size due to the phenomenon of efficiency reduction (droop) caused by the current density injected into the LED.

[0086] Moreover, as the size of micro LEDs decreases, it becomes difficult to inspect the chips beforehand, and it may be difficult to apply the pick-up and place process currently used in mass production technology, which involves mounting individual chips onto a substrate.

[0087] Thus, as in embodiments of the present invention, after transferring micro-LEDs onto a process substrate such as a temporary substrate or support substrate, an inspectable package structure can be manufactured and applied by adding wiring processes.

[0088] When the area of ​​the light-emitting device (LED) package is large enough, it is possible to have a structure where the micro-LEDs and terminal post structures do not overlap. Therefore, in order to apply as many LED packages as possible to the process substrate, it may be necessary to reduce the size of the LED package. In addition, for the smaller LED package, the size needs to be ensured according to the electrode spacing of the wiring substrate.

[0089] As a driving device, if the sign driver uses the AM (active matrix) method or AM / PM composite method of micro IC, its size can be further reduced compared to PM-driven micro LEDs in terms of not requiring time-division lighting.

[0090] However, it is necessary to ensure the transfer space of the micro IC, and the circuit complexity increases with the connection between the micro LED and the driver device. In order to ensure the pillar structure connected to the terminal, the size of the light-emitting device package may be increased.

[0091] In the case of micro ICs, it may also be necessary to reduce the package size in order to reduce process costs and increase productivity.

[0092] In the case of light-emitting device packages with a size of 200μm or less, there may be areas where the terminal portion overlaps with the microLED and, in some cases, the driving device, including the area opposite the connection layer of the metal pattern connected to the microLED.

[0093] The gentler the side slope θ of the connecting electrode 270, the greater the reliability against external environments such as solder heat treatment, thermal shock, and high temperature and humidity during the subsequent mounting of the light-emitting device package onto the wiring substrate. For example, this effect can be amplified when the terminal portion is manufactured using a thin-film deposition process such as sputtering instead of a plating process.

[0094] Therefore, according to embodiments of the present invention, such as Figure 1 and Figure 2 As shown, an uphill structure can be applied to the connecting layer 220 between the connecting terminal portion 280 and the light-emitting portion 250.

[0095] As described above, by utilizing the connection electrode 270, which has a gently sloping structure compared to a via hole structure, it is possible to stably connect the various layers constituting the light-emitting device package 200.

[0096] In addition, by utilizing the structure of this connecting electrode 270, the contact area can be increased, thereby ensuring a stable electrical connection.

[0097] By utilizing the structure of the connecting electrode 270 as described above, the thickness of the light-emitting device package 200 with excellent characteristics can be improved, thereby enhancing durability.

[0098] Figure 3 This is an enlarged view showing the column shape and inclined portion of the light-emitting device package according to the first embodiment of the present invention. Figure 4 This is a cross-sectional schematic diagram showing an example of a connecting electrode of a light-emitting device package according to an upsloping structural shape, according to a first embodiment of the present invention.

[0099] As described above, in order to achieve an electrical connection between the terminal portion 280 and the light-emitting portion 250 or between the third connecting portion 273 connecting the terminal portion 280 and the light-emitting portion 250, a so-called uphill structure with metal pattern shapes 271, 272, and 273 can be used on the column shape and the inclined portion.

[0100] Reference Figure 3 The insulating pillar structure having a pillar shape 221 and an inclined portion 222 as described above can be provided on the light-emitting layer 210.

[0101] As an exemplary embodiment, after forming a protruding column shape 221 on the light-emitting layer 210, a liquid is applied to the outside of this column shape 221 to form an inclined portion 222. At this time, the side shape of the inclined portion 222 can be adjusted by utilizing the viscosity of the coating liquid, solvent evaporation, gravity, surface tension, etc., to form a smooth shape.

[0102] As an example, the pillar shape 221 can be made of a photoresist (PR) material such as a photoactive compound resin. In this case, the pillar shape 221 can also be non-perpendicularly tilted relative to the light-emitting layer 210. This tilt can be imparted according to the method of forming the pillar shape 221.

[0103] Subsequently, when forming the inclined portion 222, the reflow characteristics of the liquid coating can be applied according to the material after the patterning of the column shape 221. Thus, inclined portions 222 with various angles α, β, γ can be formed.

[0104] like Figure 4 As shown, the tilt angles of the connecting electrodes 270, 274, and 275 formed above the tilted structures 221, 223, and 224 can be adjusted according to their shapes.

[0105] As described above, the thickness of the connecting electrodes 270, 274, and 275 can vary depending on the plane and side angles, and can have various characteristics in terms of connection stability at the inflection point.

[0106] As an example, such as Figure 4 As shown in (A), when the column shape 221 is not inclined, a connecting electrode 274 in the form of a through-hole electrode can be provided along the outer surface of the column shape 221 with a vertical cross section.

[0107] On the other hand, refer to Figure 4 (B) As in the embodiment of the present invention, when an inclined portion 222 is provided on the outside of the column shape 221, a connecting electrode 270 with a side inclination can be provided on the outside of the column shape 221 and the inclined portion 222.

[0108] As an exemplary embodiment, refer to Figure 4 (C), the inclined portion 224 can be formed to have a ratio of Figure 4 As shown in (B), the slope is gentle. On the other hand, as an example, the column shape 221 and the inclined portion 222 can be formed as one piece. In addition, a connection electrode 275 with a gentle slope as described above can be formed on this integrally formed inclined portion 224.

[0109] Figure 5This is a cross-sectional view showing a light-emitting device package according to a second embodiment of the present invention.

[0110] Reference Figure 5 The light-emitting device package 200 of the second embodiment of the present invention may include a light-emitting layer (or a first layer) 210, and the light-emitting portions 250 of the light-emitting devices 251, 252, and 253 are located in the light-emitting layer (or the first layer) 210. In this case, a driving device 260 may be provided on one side of the light-emitting portion 250 in the light-emitting layer 210.

[0111] This driver chip 260 can be implemented as an integrated circuit (IC). This driver chip 260 can drive the light-emitting unit 250. This driver chip 260 can be connected to the light-emitting unit 250 to control the light emission color / intensity of the light-emitting device package 200. Furthermore, the driver chip 260 can implement AM (Active Matrix) driving when the light-emitting device package 200 is configured as a pixel of a display.

[0112] As described above, when the driving device 260 is provided, the connecting electrode 270 may further include a fourth connecting portion 276 connected to the driving device 260. One side of this fourth connecting portion 276 may be connected to the connecting electrode 270, and the other side of the fourth connecting portion 276 may be connected to the light-emitting portion 250.

[0113] As described above, a connection layer (or second layer) 220 may be provided on the light-emitting layer 210 where the light-emitting part 250 is located, including a terminal part 280 and a plurality of connection electrodes 270 connecting the terminal part 280 and the light-emitting devices 251, 252, 253.

[0114] Furthermore, a support layer (or third layer) 230 may be provided on the bottom surface of the light-emitting layer 210 to allow light emitted from the light-emitting part 250 to pass through. That is, light generated in the light-emitting part 250 can be emitted through the support layer 230. As described above, Figure 5 The light-emitting device package shown can be light-oriented. Figure 5 The aforementioned structure is a bottom-emission type light-emitting device package.

[0115] Except for the parts not described, the descriptions can be the same as those described above for the first embodiment. Therefore, repeated descriptions are omitted.

[0116] Figure 6 This is a cross-sectional view showing a light-emitting device package according to a third embodiment of the present invention.

[0117] Reference Figure 6The light-emitting device package 200 of the third embodiment of the present invention may include a light-emitting layer (or a first layer) 210, and the light-emitting part 250 of the light-emitting devices 251, 252, and 253 is located in the light-emitting layer (or the first layer) 210.

[0118] A connection layer (or second layer) 220 may be provided on the light-emitting layer 210 where the light-emitting part 250 is located, including a terminal part 280 and a plurality of connection electrodes 270 connecting the terminal part 280 and the light-emitting devices 251, 252, 253.

[0119] Furthermore, a support layer (or third layer) 230 may be provided on the bottom surface of the light-emitting layer 210 to allow light emitted from the light-emitting part 250 to pass through. That is, light generated in the light-emitting part 250 can be emitted through the support layer 230. As described above, Figure 6 The light-emitting device package shown can be light-oriented. Figure 6 The structure shown is a bottom-emission type light-emitting device package.

[0120] The connecting electrode 270 may have metal pattern shapes 271, 272, 273 located on an insulating pillar shape 221 including an inclined portion 222 disposed in the connecting layer 220.

[0121] The connecting electrode 270 with metal pattern shapes 271, 272, 273 as described above can have a structure (uphill structure) formed by deforming the shape of the via electrode along the via hole.

[0122] As an exemplary embodiment, the connecting electrode 270 may include a first connecting portion 271 connected to the terminal portion 280 and a second connecting portion 272 connected to the light-emitting devices 251, 252, and 253.

[0123] A third connecting portion 273 may be provided between the first connecting portion 271 and the second connecting portion 272. In this case, the third connecting portion 273 may have the same tilt angle as the tilting portion 222. This third connecting portion 273 can essentially set the height of the connecting electrode 270. For example, the third connecting portion 273 may have a height corresponding to the height between the terminal portion 280 and the light-emitting portion 250. This height may correspond to the height of the columnar shape 221.

[0124] The connection electrode 270 with the upsloping structure described above can have an increased effective area compared to through-hole electrodes or cylindrical electrodes formed in the same region.

[0125] As an exemplary embodiment, the terminal portion 280 may have a pillar structure corresponding to the connecting electrode 270. As an example, the terminal portion 280 may include a fifth connecting portion 281 connected to the first connecting portion 271 of the connecting electrode 270, a terminal layer 282 that serves as a terminal for connecting to an external electrode pad, and a sixth connecting portion 283 that connects the fifth connecting portion 281 and the terminal layer 282 to each other.

[0126] Similar to the third connection portion 273 of the connecting electrode 270, as an example, the sixth connection portion 283 of the terminal portion 280 may have a non-right-angle tilt angle relative to the terminal layer 282. This third connection portion 273 can substantially set the height of the terminal portion 280.

[0127] Apart from this, the description of any undescribed parts can be the same as the description of the first embodiment above. Therefore, repeated descriptions are omitted.

[0128] Figure 7 This is a cross-sectional view showing a light-emitting device package according to a fourth embodiment of the present invention.

[0129] Reference Figure 7 The fourth embodiment of the light-emitting device package 200 of the present invention shows an embodiment in which the connecting electrode 270 has a terminal portion 280.

[0130] As an exemplary embodiment, the terminal portion 280 may be omitted, and the seventh connection portion 277 connecting the electrode 270 may perform the function of the terminal portion 280.

[0131] As an example, the connecting electrode 270 may include a seventh connecting portion 277 that performs the function of the terminal portion, a second connecting portion 272 that is connected to the light-emitting devices 251, 252, and 253, and a third connecting portion 273 that is connected between the seventh connecting portion 277 and the second connecting portion 272. In this case, the third connecting portion 273 may have the tilt angle of the tilt portion 222.

[0132] and Figure 1 Compared to the first embodiment shown, the area of ​​the seventh connecting portion 277 is larger than that of the first connecting portion 271 in the first embodiment. As described above, the seventh connecting portion 277 with the enlarged area can function as a terminal portion 280 connected to an external electrode pad.

[0133] Therefore, the diameter of column shape 225 can be increased. That is, refer to... Figure 7 The column shape 225 can have a wider cross-sectional area to function as a terminal portion. The area of ​​the seventh connecting portion 277 located at the end side of this column shape 225 can also have a wider area.

[0134] Apart from this, the description of any undescribed parts can be the same as the description of the first embodiment above. Therefore, repeated descriptions are omitted.

[0135] Figure 8 This is a cross-sectional view showing a light-emitting device package according to a fifth embodiment of the present invention.

[0136] Reference Figure 8 The light-emitting device package 200 of the fifth embodiment of the present invention may include a light-emitting layer (or a first layer) 210, and the light-emitting portions 250 of the light-emitting devices 251, 252, and 253 are located in the light-emitting layer (or the first layer) 210. At this time, a driving device 260 may be provided on one side of the light-emitting portion 250 in the light-emitting layer 210.

[0137] As described above, when the driving device 260 is provided, the connecting electrode 270 may further include a fourth connecting portion 276 connected to the driving device 260. One side of this fourth connecting portion 276 may be connected to the connecting electrode 270, and the other side of the fourth connecting portion 276 may be connected to the light-emitting portion 250.

[0138] As an example, the connecting electrode 270 may include a seventh connecting portion 277 that performs the function of the terminal portion, a second connecting portion 272 that is connected to the light-emitting devices 251, 252, and 253, and a third connecting portion 273 that is connected between the seventh connecting portion 277 and the second connecting portion 272. In this case, the third connecting portion 273 may have the tilt angle of the tilt portion 222.

[0139] The area of ​​the seventh connecting portion 277 can be larger than that of the first connecting portion 271 in the first embodiment. As described above, the seventh connecting portion 277 with the enlarged area can function as a terminal portion 280 connected to an external electrode pad.

[0140] Except for the parts not described, the descriptions can be the same as those described above for the first and fourth embodiments. Therefore, repeated descriptions are omitted.

[0141] Figures 9 to 11 This is a cross-sectional view showing a light-emitting device package according to a sixth embodiment of the present invention and its variations.

[0142] Reference Figures 9 to 11 The light-emitting device package 200 of the sixth embodiment of the present invention may include a light-emitting layer (or a first layer) 210, and the light-emitting part 250 of the light-emitting devices 251, 252, and 253 is located in the light-emitting layer (or the first layer) 210.

[0143] A connection layer (or second layer) 220 may be provided on the light-emitting layer 210 where the light-emitting part 250 is located, including a terminal part 280 and a plurality of connection electrodes 278 connecting the terminal part 280 and the light-emitting devices 251, 252, 253.

[0144] A support layer (or third layer) 230 may be provided on the bottom surface of the light-emitting layer 210 to allow light emitted from the light-emitting part 250 to pass through. That is, the light generated in the light-emitting part 250 can be emitted through the support layer 230. As described above, Figure 5 The light-emitting device package shown can be light-oriented. Figure 5 The structure shown is a bottom-emission type light-emitting device package.

[0145] A driving device 260 may be provided in this connecting layer 220. At this time, the driving device 260 may be located on the light-emitting part 250, and the driving device 260 and the light-emitting part 250 may overlap each other at least partially in the vertical direction.

[0146] As an example, the driving device 260 and the light-emitting part 250 can be arranged in the same direction relative to the stacking direction of the light-emitting layer 210, the connecting layer 220 and the support layer 230.

[0147] Reference Figure 9 Regarding the inclined portion 226, the connecting electrode 270 may have a shape reversed from that in the first embodiment. For example, in the first embodiment, the connecting electrode 270 may have an upwardly protruding shape, but referring to... Figure 9 The connecting electrode 278 may have a shape that protrudes downward.

[0148] As an example, the inclined portion 226 may have a shape in which the cross-sectional area narrows in the downward direction. Therefore, the connecting electrode 278 may include a first connecting portion 271 connected to the terminal portion 280, a second connecting portion 272 connected to the light-emitting devices 251, 252, and 253, and a third connecting portion 273 connected to the second connecting portion 272. In this case, the first connecting portion 271 and the third connecting portion 273 may have the same inclination angle as the inclined portion 226. Furthermore, the second connecting portion 272 may be connected to the end sides of the first connecting portion 271 and the third connecting portion 273.

[0149] As described above, when the driving device 260 is provided, the connecting electrode 270 may also include a fourth connecting portion 276 connected to the driving device 260.

[0150] Reference Figure 9One side of the terminal portion 280 may have a flat plate shape, and the other side of the terminal portion 280 may have a column structure corresponding to the connecting electrode 270. As an example, the terminal portion 280 may include a fifth connecting portion 281 connected to the first connecting portion 271 of the connecting electrode 270, a terminal layer 282 that serves as a terminal for connecting to an external electrode pad, and a sixth connecting portion 283 that connects the fifth connecting portion 281 and the terminal layer 282 to each other.

[0151] On the other hand, refer to Figure 10 ,and Figure 9 In different cases, the connecting electrode 270 can be arranged in the same direction as in the first embodiment.

[0152] Reference Figure 11 The terminal portion 280 may have a flat plate shape. An additional connecting portion 284 may be provided between this terminal portion 280 and the connecting electrode 270.

[0153] This connecting portion 284 can have a shape similar to that of the connecting electrode 270. That is, the connecting portion 284 between the connecting terminal portion 280 and the connecting electrode 270 can have an eighth connecting portion 285 connected to the terminal portion 280, a ninth connecting portion 286 connected to the connecting electrode 270, and a tenth connecting portion 287 connecting the eighth connecting portion 285 and the ninth connecting portion 286 to each other. In this case, the tenth connecting portion 287 can have a non-right-angle tilt angle relative to the terminal portion 280.

[0154] As described above, in the stacked structure of the driver 260 and the light-emitting part 250, due to the thickness of the driver 260, a fairly deep opening may be required for electrical connection with the lower light-emitting part 250. For a stable electrical connection, a thicker wiring connection with ordinary plating can be selected.

[0155] At this time, if the proposed upslope structure is used to form a gently sloping surface for the connection electrode 270 and / or terminal portion 280, the drive device 260 can be electrically connected at a height similar to that of the terminal portion 280, thereby enabling a stable connection using thin-film wiring.

[0156] Furthermore, if a double-sloping structure is formed by connecting the electrode 270 and / or the terminal portion 280, the area of ​​the terminal portion 280 can be improved, and the thickness of the light-emitting device package 200 can be made thicker.

[0157] Figure 12 This is a schematic diagram illustrating an example of a connecting electrode used as an alignment mark in an embodiment of the present invention. Figure 13 This is a schematic diagram illustrating an example of a terminal portion used as an alignment mark in an embodiment of the present invention.

[0158] Reference Figure 12The example shown is an example of a portion of the connection electrode 270 as described above being used as an alignment key.

[0159] As an example, by making the shapes of the first connecting portions 271a and 271b of the connecting electrode 270 different, they can be used as alignment marks. As an example, the first connecting portion 271b of the connecting electrode 270, which serves as a common electrode, can be formed in a different shape from the other first connecting portions 271b or used to distinguish them.

[0160] As described above, if the connection status between each connecting electrode 270 and the internal light-emitting part 250 and driving device 260 can be visually confirmed from the outside, then during the actual assembly of the light-emitting device package 200, it can be easily matched with the terminals of the wiring substrate.

[0161] Reference Figure 13 The terminal portion 288 connected to the common electrode can be represented as having a different shape from the other terminal portions 280 or can be distinguished from them.

[0162] As an example, a slanted line shape 289 may be added to the terminal portion 288 connected to the common electrode to distinguish it from the other terminal portions 280.

[0163] Figure 14 This is a cross-sectional schematic diagram showing a display device utilizing a light-emitting device package according to a first embodiment of the present invention.

[0164] Figure 14 References are shown Figure 1 and Figure 2 The light-emitting device package 200 described in the first embodiment is used as an example of a display device per unit pixel.

[0165] Reference Figure 14 The light-emitting device package 200 is mounted on a wiring substrate 100 including a substrate 110 on which wiring electrodes 120 are formed, relative to... Figure 1 The display device 10 is configured in a reversed state. At this time, the wiring electrodes 120 can be distinguished from each other through the gap 121.

[0166] The light-emitting device package 200 can be connected to the wiring electrode 120 using an electrical connection portion 122 such as solder 122.

[0167] A molding layer 130 may be provided on the substrate 110 to bury the light-emitting device package 200. An optical layer 140 may be provided on the molding layer 130.

[0168] Depending on the situation, a black matrix 150 may be provided on the side of each light-emitting device package 200.

[0169] Figures 15 to 24 This is a cross-sectional view showing the process of manufacturing the light-emitting device package of the first embodiment.

[0170] The following is for reference Figures 15 to 24 The manufacturing process of the light-emitting device package 200 according to the first embodiment is explained.

[0171] Reference Figure 15 First, a support layer 230 can be formed on the process substrate 300. As an example, this support layer 230 can be formed by coating on the process substrate 300.

[0172] Reference Figure 16 A scattering layer 240 can be formed on the support layer 230. As an example, this scattering layer 240 can also be formed by coating the support layer 230. As described above, the scattering layer 240 can contain microparticles 241.

[0173] Reference Figure 17 The light-emitting devices 251, 252, and 253 constituting the light-emitting part 250 can be transferred on the scattering layer 240.

[0174] Then, refer to Figure 18 A columnar shape 221 can be formed between each light-emitting part 250. As an example, the columnar shape 221 can be formed at four positions around each light-emitting part 250. The position of this columnar shape 221 on the plane can be... Figure 2 The position of the first connecting part 271 shown corresponds to that of the first connecting part.

[0175] Reference Figure 19 An inclined portion 222 may be formed on the outer side of the column shape 221. As an example, this inclined portion 222 may be continuously formed with the portion of the light-emitting portion 250 being molded. As an example, the inclined portion 222 may be in contact with the side of the light-emitting portion 250.

[0176] Reference Figure 20 The connecting electrode 270 can be formed by patterning along the outer surface of the column shape 221 and the inclined portion 222. This connecting electrode 270 can be electrically connected to the light-emitting portion 250.

[0177] Reference Figure 21 A connection layer 220 covering the connection electrode 270 can be formed. As an example, after forming the layer covering the entire connection electrode 270, a portion can be removed to expose the first connection portion 271 of the connection electrode 270, thereby forming the connection layer 220.

[0178] Reference Figure 22 Terminal portion 280, which is electrically connected to this connecting electrode 270, can be formed by patterning.

[0179] Reference Figure 23 A trench T can be formed that can distinguish individual light-emitting device packages 200. This trench T allows the individual light-emitting device packages 200 to be separated by removing portions between them.

[0180] Then, refer to Figure 24 The process substrate 300 can be separated from the support layer 230. As described above, if the process substrate 300 is separated, it is possible to manufacture... Figure 1 and Figure 2 The first embodiment of the light-emitting device package 200 is shown.

[0181] The above description is merely an exemplary illustration of the technical concept of the present invention. Anyone skilled in the art can make various modifications and variations without departing from the essential characteristics of the present invention.

[0182] Therefore, the embodiments disclosed in this invention are intended to illustrate rather than limit the technical concept of the invention, and the scope of the technical concept of the invention is not limited by these embodiments.

[0183] The scope of protection of this invention shall be interpreted by the appended claims, and all technical ideas within the equivalent scope shall be interpreted as being included within the scope of the claims of this invention.

[0184] Industrial availability

[0185] According to the present invention, a light-emitting device package utilizing a light-emitting device and a display device utilizing the light-emitting device package can be provided.

Claims

1. A light-emitting device package, characterized in that, include: The first layer is provided with a light-emitting part including light-emitting devices that constitute a unit sub-pixel; The second layer, located on the first surface of the first layer, includes a terminal portion and a plurality of connecting electrodes that connect the terminal portion and the light-emitting device at intervals. The third layer is located on the second surface of the first layer, through which light emitted from the light-emitting part passes; The connecting electrode has a height corresponding to the interval and has a column structure with an angle of inclination relative to the first surface.

2. The light-emitting device package according to claim 1, characterized in that, The connecting electrode is located on the outer surface of a column shape disposed within the second layer.

3. The light-emitting device package according to claim 1, characterized in that, The connecting electrode has an angle of inclination relative to the column shape.

4. The light-emitting device package according to claim 1, characterized in that, An inclined portion with the aforementioned inclination angle is provided on the outer side of the column shape.

5. The light-emitting device package according to claim 1, characterized in that, The connecting electrode includes: A first connecting portion is connected to the terminal portion; and The second connecting part is connected to the light-emitting device.

6. The light-emitting device package according to claim 5, characterized in that, It also includes a third connecting portion that connects the first connecting portion and the second connecting portion.

7. The light-emitting device package according to claim 6, characterized in that, The third connecting portion has the tilt angle.

8. The light-emitting device package according to claim 1, characterized in that, The terminal portion has a column structure corresponding to the connecting electrode.

9. The light-emitting device package according to claim 1, characterized in that, It also includes a driver located on one side of the light-emitting device.

10. The light-emitting device package according to claim 1, characterized in that, Between the third layer and the first layer, there is also a fourth layer containing scattering particles.

11. The light-emitting device package according to claim 1, characterized in that, The second layer functions as a reflective layer.

12. A light-emitting device package, characterized in that, include: The light-emitting layer is provided with a light-emitting part including light-emitting devices constituting a unit sub-pixel; A connection layer, located on the first surface of the light-emitting layer, includes a terminal portion and a plurality of connection electrodes connected between the terminal portion and the light-emitting device; A support layer is located on the second surface of the light-emitting layer, through which light emitted from the light-emitting part passes; The connecting electrode has a metal pattern shape located on a column shape including an inclined portion disposed in the connecting layer.

13. The light-emitting device package according to claim 12, characterized in that, The metal pattern is located on the outer surface of the column shape disposed within the connecting layer.

14. The light-emitting device package according to claim 12, characterized in that, The connecting electrode includes: A first connecting portion is connected to the terminal portion; and The second connecting part is connected to the light-emitting device.

15. The light-emitting device package according to claim 14, characterized in that, It also includes a third connecting portion that connects the first connecting portion and the second connecting portion.

16. The light-emitting device package according to claim 15, characterized in that, The third connecting portion has the inclination of the inclined portion.

17. The light-emitting device package according to claim 12, characterized in that, It also includes a driver located on one side of the light-emitting device.

18. The light-emitting device package according to claim 12, characterized in that, A scattering layer containing scattering particles is also included between the light-emitting layer and the support layer.

19. The light-emitting device package according to claim 12, characterized in that, The terminal portion has a column structure corresponding to the connecting electrode.

20. A display device comprising a light-emitting device package defining a single pixel, characterized in that, The light-emitting device package includes: The light-emitting layer is provided with a light-emitting part including light-emitting devices constituting a unit sub-pixel; A connection layer, located on the first surface of the light-emitting layer, includes a terminal portion and a plurality of connection electrodes connected between the terminal portion and the light-emitting device; and A support layer is located on the second side of the light-emitting layer, through which light emitted from the light-emitting part passes; The connecting electrode has a metal pattern shape located on a column shape including an inclined portion disposed in the connecting layer.

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