Laser treatment device for surface treatment of micro blind hole

Abstract

The invention discloses a laser treatment device for micro blind hole surface treatment, and relates to the related technical field of micro blind hole laser treatment.The laser treatment device comprises a laser treatment rack, a laser device, a dust treatment mechanism, a sealing device, an air blowing flowing unit and a controller, and a three-axis linear motor adjusting platform is installed on the surface of the bottom side of an inner cavity of the laser treatment rack; the laser is installed on the surface of the three-axis linear motor adjusting platform driving base, and the dust treatment mechanism comprises an adsorption table. The problems that some existing laser treatment devices are low in dust collection and treatment efficiency, filter assemblies are prone to being blocked, frequent shutdown cleaning is needed, machining continuity is affected, meanwhile, airflow control of existing devices is unreasonable, dust centralized collection is difficult to effectively guide, laser transmission paths are interfered, the dust is attached to the surfaces of workpieces, machining defects are caused, and the like are solved. And the sealing performance of a machining area is poor, so that laser and dust leakage can be caused, the working environment is polluted, and the health of operators is harmed.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology for micro-blind holes, specifically to a laser processing device for surface treatment of micro-blind holes. Background Technology

[0002] In fields such as electronic components and precision machinery, micro blind hole processing is a key process to ensure product performance. Laser processing has become the mainstream method for micro blind hole surface treatment due to its advantages such as high precision, high efficiency and minimal damage to the workpiece.

[0003] However, existing laser micro-blind hole processing devices still have some shortcomings in use: the metal or non-metal dust generated during processing is easy to disperse everywhere, and the dust collectors of some existing laser processing devices have low dust collection and processing efficiency, the filter components are easy to clog, and frequent shutdowns are required for cleaning, which affects the continuity of processing. At the same time, the airflow control of existing devices is unreasonable, making it difficult to effectively guide the dust to be collected, which will interfere with the laser transmission path, adhere to the workpiece surface and cause processing defects. In addition, the poor sealing of the processing area may lead to the leakage of laser and dust, which will pollute the working environment and endanger the health of operators. To solve the above-mentioned problems, a laser processing device for micro-blind hole surface treatment is provided. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problems existing in the laser processing device for micro blind hole surface treatment mentioned above, the present invention is proposed.

[0006] Therefore, the object of the present invention is to provide a laser processing apparatus for surface treatment of micro-blind holes.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution, which includes: A laser processing rack, wherein a triaxial linear motor adjustment platform is mounted on the bottom surface of the inner cavity of the laser processing rack; A laser, which is mounted on the surface of the triaxial linear motor adjustment platform drive seat, is used to precisely adjust the laser head to perform micro blind hole processing on the workpiece; A dust treatment mechanism, comprising an adsorption table installed on the inner wall of the bottom side of the inner cavity of the laser processing frame, the adsorption table being used for dust extraction and workpiece placement; A sealing device is installed on the front side of the laser processing rack and is used to control the opening and closing of the operation port of the laser processing rack processing area. A blowing air flow unit is installed on the top of the laser processing rack. The blowing air flow unit is used to deliver clean air into the sealed cavity formed between the laser processing rack and the sealing device. The controller is mounted on the outside right side of the laser processing rack.

[0008] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, the sealing device includes a hydraulic cylinder installed on the top side surface of the laser processing frame, an adjustment seat fixedly installed on the output top of the hydraulic cylinder, a sealing plate disposed on the side surface of the adjustment seat, a transparent observation window fitted and installed on the surface of the sealing plate, and an anti-pinch buffer mechanism installed on the bottom side of the sealing plate. The sealing plate is slidably attached to the front surface of the laser processing frame, and a limiting frame is fixedly installed on the front top of the laser processing frame. The sealing plate passes through the inner cavity of the limiting frame, and the limiting frame restricts the sealing plate to move only in the vertical direction.

[0009] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, wherein: the anti-pinch buffer mechanism includes a base, the base is disposed at the bottom end of the sealing plate, a sliding column is slidably passed through the surface of the base, a buffer plate is fixedly installed at the bottom end of the sliding column, a buffer spring is sleeved at the bottom end of the sliding column, a pressure sensor is installed at the bottom of the buffer plate, a base is installed at the bottom of the pressure sensor, a side plate is installed at the top front end of the base, and the base is made of elastic rubber material; The number of sliding columns is several, and adjacent sliding columns are equidistantly distributed; and / or, the top of the buffer plate is elastically connected to the bottom of the base plate through a buffer spring; and / or, the side plate has a U-shaped cross-section when viewed from above; and / or, the inner wall of the side plate is slidably attached to the front surface of the base plate.

[0010] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, the blowing flow unit includes an air inlet pipe fixedly installed at the top of the laser processing frame, a blower installed on the inner wall of the air inlet pipe, a dust filter screen disposed at the air inlet port of the air inlet pipe, and a flow divider plate fixedly connected to the inner wall of the top side of the laser processing frame through a connecting column. The top of the flow divider is elliptical; and / or, there is a cavity between the flow divider and the inner wall of the laser processing rack, so that the gas used for flow divider flows along the inner wall of the laser processing rack.

[0011] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, the dust treatment mechanism further includes a dust suction pipe, a dust removal shell, a filter assembly, a vibration mechanism, and a negative pressure unit. The dust suction pipe is used to connect the adsorption platform and the dust removal shell. A vibration mechanism is installed on the inner wall of the dust removal shell. A filter assembly for filtering and separating dust from the intake air is installed on the vibration mechanism. A negative pressure unit is installed on the top of the vibration mechanism.

[0012] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, the adsorption stage includes an adsorption shell and adsorption holes. The adsorption shell is installed at the bottom of the inner cavity of the laser processing frame, and the top surface of the adsorption shell is uniformly covered with adsorption holes.

[0013] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, the dust suction pipe includes a dust suction pipe and an anti-backflow plate. The top end of the dust suction pipe is connected to the bottom of the adsorption shell, and the bottom end of the dust suction pipe is connected to the left side of the dust removal processing shell. An anti-backflow plate is hinged to the top side of the bottom end of the dust suction pipe. The anti-backflow plate is attached to the bottom end of the dust suction pipe to prevent dust from flowing back.

[0014] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, the vibration mechanism includes a partition plate disposed on the inner wall of the dust removal processing shell, a through hole being opened in the middle of the partition plate, a driving part being installed on the top of the partition plate, and a shaking part being disposed on one side of the driving part and installed on the inner wall of the dust removal processing shell, the driving end of the shaking part being connected to the inner wall of the top of the filter assembly disposed at the bottom of the through hole. The drive unit includes a servo motor, the output end of which is connected to a drive shaft, and an eccentric wheel is fixedly sleeved on the surface of the drive shaft. The shaking part includes a fixed column, an elastic spring, and a connecting plate. The fixed column is fixedly installed on the inner wall of the dust removal processing shell. An elastic spring is sleeved on the surface of the fixed column. The connecting plate is slidably sleeved on the surface of the fixed column. The connecting plate is elastically connected to the inner wall of the dust removal processing shell through the elastic spring. The connecting plate is fixedly connected to the top of the filter assembly. The connecting plate is in contact with an eccentric wheel provided on one side.

[0015] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, the filter assembly includes a filter frame and a plate-shaped filter core. The top end of the filter frame is fixedly connected to a connecting plate, and the top end of the filter frame is slidably attached to the bottom surface of the partition plate. The bottom end of the filter frame is fixedly installed with a plate-shaped filter core, and the bottom of the plate-shaped filter core is attached with a plurality of equally spaced scrapers. The scrapers are fixedly installed on the inner wall of the dust removal processing shell.

[0016] As a preferred embodiment of the laser processing device for micro-blind hole surface treatment according to the present invention, the negative pressure unit includes a negative pressure pump, an exhaust pipe and an anti-backflow filter. The negative pressure pump is fixedly installed on the top of the partition plate. The output end of the negative pressure pump is fixedly connected to the exhaust pipe. The end of the exhaust pipe penetrates the side surface of the laser processing frame and extends to the outside. An anti-backflow filter is installed at the end of the exhaust pipe.

[0017] Compared with the prior art, the beneficial effects of the present invention are: This invention relates to a laser processing device for micro-blind hole surface treatment. Under the action of the set airflow unit, the generated clean airflow can be blown into the processing cavity of the laser processing frame, and the dust generated during processing can be continuously and stably pushed into the adsorption shell. This can avoid dust floating and interfering with the laser transmission path, prevent dust from adhering to the workpiece and causing processing defects, and significantly improve the dimensional accuracy and surface quality of micro-blind hole processing.

[0018] Thanks to the sealing device, the laser processing machine frame operating port can be quickly sealed to form a closed processing chamber, effectively preventing laser leakage and avoiding laser radiation damage to operators. The anti-pinch buffer mechanism at the bottom of the sealing plate is equipped with a pressure sensor, which can stop the hydraulic cylinder and reverse the reset when an obstruction is encountered, preventing operators from accidentally entering the operating port and being pinched.

[0019] The dust treatment mechanism can completely collect the dust and fumes generated during processing, preventing dust from escaping and polluting the workshop environment. The anti-backflow plate at the end of the dust collection pipe and the anti-backflow filter at the end of the exhaust pipe can prevent dust from flowing back and external air from flowing in reverse, further ensuring a clean working environment.

[0020] The slight positive pressure generated by the clean airflow at the top pushes the dust downwards toward the adsorption platform. The negative pressure unit creates negative pressure in the adsorption platform and dust removal housing, quickly removing the dust-laden air. The vibration mechanism drives the filter assembly to vibrate at high frequency through an eccentric wheel, which, together with the scraper, scrapes the surface of the filter element to remove the attached dust in a timely manner, preventing the filter element from clogging, ensuring the continuous and efficient operation of the dust treatment system, extending the service life of the filter assembly, and reducing equipment maintenance costs. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 is a schematic diagram of the overall front structure of the laser processing device for micro-blind hole surface treatment according to the present invention.

[0022] Figure 2 is a schematic diagram of the rear three-dimensional structure of the laser processing device for micro-blind hole surface treatment according to the present invention.

[0023] Figure 3 is a schematic diagram of the internal installation structure of the laser processing frame of the laser processing device for micro blind hole surface treatment of the present invention.

[0024] Figure 4 is a schematic diagram of the dust treatment mechanism installation structure at the bottom of the laser processing frame of the laser processing device for micro-blind hole surface treatment of the present invention.

[0025] Figure 5 is a schematic diagram of the dust treatment mechanism, sealing device, and blowing flow unit of the laser processing device for micro-blind hole surface treatment of the present invention.

[0026] Figure 6 shows the laser processing device of the present invention for micro-blind hole surface treatment. Figure 5 Front view structural diagram.

[0027] Figure 7 shows the laser processing device of the present invention for micro-blind hole surface treatment. Figure 6 Schematic diagram of the AA section along the middle.

[0028] Figure 8 is a schematic diagram of the sealing device structure of the laser processing device for micro-blind hole surface treatment of the present invention.

[0029] Figure 9 is a schematic diagram of the dust treatment mechanism of the laser processing device for micro-blind hole surface treatment of the present invention.

[0030] Figure 10 is a schematic diagram of the top interior of the dust treatment mechanism of the laser treatment device for micro-blind hole surface treatment of the present invention.

[0031] Figure 11 shows the laser processing device of the present invention for micro-blind hole surface treatment. Figure 10 Top view of the structure.

[0032] Figure 12 shows the laser processing device of the present invention for micro-blind hole surface treatment. Figure 11 Schematic diagram of the BB section along the middle.

[0033] Figure 13 shows the laser processing device of the present invention for micro-blind hole surface treatment. Figure 11 Schematic diagram of the CC section along the center line.

[0034] Figure 14 is a schematic diagram of the filter assembly, vibration mechanism, and filter assembly connection of the laser processing device for micro-blind hole surface treatment of the present invention.

[0035] In the diagram: 1. Laser processing rack; 2. Three-axis linear motor adjustment platform; 3. Laser; 4. Dust treatment facility; 41. Dust removal casing; 42. Suction pipe; 421. Suction hose; 422. Anti-backflow plate; 43. Adsorption stage; 431. Adsorption shell; 432. Adsorption pores; 44. Filter assembly; 441. Filter frame; 442. Plate filter element; 45. Scraper; 46. ​​Vibration mechanism; 461. Partition plate; 462. Drive unit; 4621. Servo motor; 4622. Drive shaft; 4623. Eccentric wheel; 463. Vibration unit; 4631. Fixed column; 4632. Elastic spring; 4633. Connecting plate; 47. Negative pressure unit; 471. Negative pressure pump; 472. Exhaust pipe; 473. Anti-backflow filter; 5. Sealing device; 51. Hydraulic cylinder; 52. Adjusting seat; 53. Sealing plate; 54. Transparent observation window; 55. Base; 56. Sliding column; 57. Buffer spring; 58. Buffer plate; 59. Pressure sensor; 510. Side plate; 511. Limiting frame; 512. Base plate; 6. Airflow unit; 61. Air inlet duct; 62. Air blower; 63. Dust filter; 64. Flow divider; 7. Controller. Detailed Implementation

[0036] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0037] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0038] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0039] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth. Example

[0040] Please see Figures 1-7 and Figures 9-14 This embodiment provides a laser processing device for micro-blind hole surface treatment, which includes: a laser processing frame 1, a laser 3, a dust treatment mechanism 4, a sealing device 5, a blowing flow unit 6, and a controller 7. A triaxial linear motor adjustment platform 2 is installed on the bottom surface of the inner cavity of the laser processing frame 1. The laser 3 is installed on the drive seat surface of the triaxial linear motor adjustment platform 2 for precisely adjusting the laser head to process micro-blind holes in the workpiece. The dust treatment mechanism 4 includes an adsorption platform 43, which is installed on the inner wall of the bottom side of the inner cavity of the laser processing frame 1. The adsorption platform 43 is used for dust suction and workpiece placement. The controller 7 is installed on the right side of the outside of the laser processing frame 1.

[0041] Among them, the controller 7 is used to coordinate the operation of all electrical components such as the laser 3, the three-axis linear motor adjustment platform, the negative pressure pump 471, the vibration mechanism 46, the hydraulic cylinder 51, and the blower 62.

[0042] Before processing begins, the processing path, depth, and other parameters of the micro blind hole are set by the controller 7. The controller 7 instructs the three-axis linear motor adjustment platform 2 to move, driving the laser 3 on its drive seat to be precisely positioned in the X, Y, and Z dimensions. After positioning is completed, the laser 3 emits a high-energy laser beam to process the micro blind hole at the designated position on the workpiece surface according to the preset program. The three-axis linear motor adjustment platform 2 can be continuously fine-tuned during the processing to ensure processing accuracy.

[0043] Reference Figures 1-2 and Figures 4-8 The sealing device 5 is installed on the front side of the laser processing frame 1, and the sealing device 5 is used to control the opening and closing of the operation port of the processing area of ​​the laser processing frame 1.

[0044] The sealing device 5 includes a hydraulic cylinder 51 installed on the top side surface of the laser processing frame 1, an adjustment seat 52 fixedly installed on the output top of the hydraulic cylinder 51, a sealing plate 53 provided on the side surface of the adjustment seat 52, a transparent observation window 54 fitted onto the surface of the sealing plate 53, and an anti-pinch buffer mechanism installed on the bottom side of the sealing plate 53. The sealing plate 53 is slidably attached to the front surface of the laser processing frame 1, and a limiting frame 511 is fixedly installed on the front top of the laser processing frame 1. The sealing plate 53 penetrates the inner cavity of the limiting frame 511, and the limiting frame 511 restricts the sealing plate 53 to move only in the vertical direction.

[0045] The anti-pinch buffer mechanism includes a base 55, which is disposed at the bottom end of the sealing plate 53. A sliding post 56 slides through the surface of the base 55. A buffer plate 58 is fixedly installed at the bottom end of the sliding post 56. A buffer spring 57 is sleeved at the bottom end of the sliding post 56. A pressure sensor 59 is installed at the bottom of the buffer plate 58. A base 55 is installed at the bottom of the pressure sensor 59. A side plate 510 is installed at the top front end of the base 55. The base 55 is made of elastic rubber material. The number of sliding columns 56 is several, and adjacent sliding columns 56 are equidistantly distributed; and / or, the top of the buffer plate 58 is elastically connected to the bottom of the base plate 512 through a buffer spring 57; and / or, the side plate 510 has a U-shaped cross-section when viewed from above; and / or, the inner wall of the side plate 510 is slidably attached to the front surface of the base plate 512.

[0046] During operation, the controller 7 issues a command, and the hydraulic cylinder 51 drives the adjusting seat 52 to move downwards, causing the sealing plate 53 to move vertically downwards along the limit frame 511 until it tightly fits against the front operating port of the laser processing frame 1. This seals the front operating port of the laser processing frame 1, providing a closed space for clean airflow circulation and dust collection, preventing dust from escaping and polluting the environment. The enclosed processing area prevents laser leakage during laser processing, ensuring the safety of operators. Furthermore, during the downward movement of the sealing plate 53, its bottom anti-pinch buffer mechanism contacts the bottom of the frame or workpiece table first. If it encounters an obstacle, it will then... When the punch plate 58 is pressed, it causes the sliding column 56 to retract, compressing the buffer spring 57 and triggering the pressure sensor 59. The pressure sensor 59 transmits a signal to the controller 7, which can immediately stop the hydraulic cylinder 51 from moving and reset it in the reverse direction. At the same time, an alarm is issued to prevent the operator's body parts from entering the operating port and being injured. The transparent observation window 54 on the sealing plate 53 allows the operator to observe the internal processing status in real time. After processing is completed, the controller 7 instructs the hydraulic cylinder 51 to retract, causing the sealing plate 53 to rise and open the operating port. The operator can then take out the processed workpiece for the next loading and unloading.

[0047] Reference Figures 1-3 , Figure 5 and Figure 7 The air blowing unit 6 is installed on the top of the laser processing frame 1. The air blowing unit 6 is used to deliver clean air into the sealed cavity formed between the laser processing frame 1 and the sealing device 5.

[0048] The airflow unit 6 includes an air inlet pipe 61 fixedly installed at the top of the laser processing frame 1, a blower 62 installed on the inner wall of the air inlet pipe 61, a dust filter 63 set at the air inlet port of the air inlet pipe 61, and a diverter plate 64 fixedly connected to the inner wall of the top side of the laser processing frame 1 through a connecting column. The top of the diverter plate 64 has an elliptical structure; and / or, there is a cavity between the diverter plate 64 and the inner wall of the laser processing frame 1, so that the gas used for diversion flows along the inner wall of the laser processing frame 1.

[0049] Operation process: After the sealed chamber is formed, the controller 7 starts the blower 62. The blower 62 filters the outside air through the dust filter 63 and pumps it into the top of the sealed chamber through the air inlet pipe 61. The clean airflow first impacts the diverter plate 64 (the top is an elliptical structure). The diverter plate 64 guides the concentrated airflow to the surroundings, so that it flows down evenly and smoothly along the cavity between the inner wall of the laser processing frame 1 and the diverter plate 64, filling the sealed chamber. This forms a continuous downward airflow, and the continuously supplied clean air creates a slightly positive pressure environment in the sealed chamber. The positive pressure can effectively block unfiltered air and pollutants from entering the processing area through the gaps. At the same time, it helps to blow the dust generated during processing downward, making it less likely to spread around. It pushes the dust generated during processing towards the adsorption table 43, avoiding dust floating and affecting the laser transmission accuracy or adhering to the workpiece and causing processing defects.

[0050] The dust treatment mechanism 4 also includes a dust suction pipe 42, a dust removal treatment shell 41, a filter assembly 44, a vibration mechanism 46, and a negative pressure unit 47. The dust suction pipe 42 is used to connect the adsorption platform 43 to the dust removal treatment shell 41. The inner wall of the dust removal treatment shell 41 is equipped with a vibration mechanism 46. The vibration mechanism 46 is equipped with a filter assembly 44 for filtering and separating dust from the intake air. The top of the vibration mechanism 46 is equipped with a negative pressure unit 47.

[0051] The adsorption stage 43 includes an adsorption shell 431 and adsorption holes 432. The adsorption shell 431 is installed at the bottom of the inner cavity of the laser processing frame 1, and the top surface of the adsorption shell 431 is evenly covered with adsorption holes 432.

[0052] The dust suction pipe 42 includes a dust suction pipe 421 and an anti-backflow plate 422. The top end of the dust suction pipe 421 is connected to the bottom of the adsorption shell 431, and the bottom end of the dust suction pipe 421 is connected to the left side of the dust removal shell 41. An anti-backflow plate 422 is hinged to the top side of the bottom end of the dust suction pipe 421. The anti-backflow plate 422 is attached to the bottom end of the dust suction pipe 421 to prevent dust from flowing back.

[0053] The vibration mechanism 46 includes a partition 461 disposed on the inner wall of the dust removal housing 41. A through hole is provided in the middle of the partition 461. A driving part 462 is installed on the top of the partition 461. A shaking part 463 is installed on one side of the driving part 462 and mounted on the inner wall of the dust removal housing 41. The driving end of the shaking part 463 is connected to the inner wall of the top of the filter assembly 44 disposed at the bottom of the through hole. The drive unit 462 includes a servo motor 4621, the output end of which is connected to a drive shaft 4622, and an eccentric wheel 4623 is fixedly sleeved on the surface of the drive shaft 4622. The shaking part 463 includes a fixed post 4631, an elastic spring 4632, and a connecting plate 4633. The fixed post 4631 is fixedly installed on the inner wall of the dust removal housing 41. The elastic spring 4632 is sleeved on the surface of the fixed post 4631. The connecting plate 4633 is slidably sleeved on the surface of the fixed post 4631. The connecting plate 4633 is elastically connected to the inner wall of the dust removal housing 41 through the elastic spring 4632. The connecting plate 4633 is fixedly connected to the top of the filter assembly 44. The connecting plate 4633 is in contact with an eccentric wheel 4623 provided on one side.

[0054] The filter assembly 44 includes a filter frame 441 and a plate-shaped filter element 442. The top end of the filter frame 441 is fixedly connected to the connecting plate 4633. The top end of the filter frame 441 is slidably attached to the bottom surface of the partition plate 461. The plate-shaped filter element 442 is fixedly installed at the bottom end of the filter frame 441. Multiple equally spaced scrapers 45 are attached to the bottom of the plate-shaped filter element 442. The scrapers 45 are fixedly installed on the inner wall of the dust removal housing 41.

[0055] The negative pressure unit 47 includes a negative pressure pump 471, an exhaust pipe 472, and an anti-backflow filter 473. The negative pressure pump 471 is fixedly installed on the top of the partition 461. The output end of the negative pressure pump 471 is fixedly connected to the exhaust pipe 472. The end of the exhaust pipe 472 penetrates the side surface of the laser processing frame 1 and extends outward. An anti-backflow filter 473 is installed at the end of the exhaust pipe 472.

[0056] Operation process: Place the workpiece to be processed on the adsorption platform 43 of the dust treatment mechanism 4. The adsorption holes 432 evenly distributed on the surface of the adsorption platform 43 can assist in adsorbing small particles during processing. The controller 7 issues a command, and the hydraulic cylinder 51 drives the adjusting seat 52 to move downward, which drives the sealing plate 53 to move vertically downward along the limit frame 511 until it is tightly attached to the front operating port of the laser processing frame 1. At this time, the inner cavity of the laser processing frame 1, the sealing plate 53 and the top blowing flow unit 6 together form a processing chamber isolated from the outside. Metal or non-metal dust and fumes generated during laser processing are dispersed downward under the dual action of gravity settling and the downward pressure of clean air at the top. The dust treatment mechanism 4 starts simultaneously, and the negative pressure pump 471 starts working. In the cavity below the adsorption platform 43, the adsorption plate 53 and the vacuum pump 472 are activated. A negative pressure is formed in the dust duct 42 and even the entire dust removal housing 41. Dust-laden air is drawn into the dust removal housing 41 through the suction pipe 421. The anti-backflow plate 422 at the end of the suction pipe 42 opens under the action of negative pressure, allowing airflow to pass through. When the system stops or the pressure is abnormal, it falls and closes by its own weight to prevent dust from flowing back into the processing. After the dust-laden air enters the dust removal housing 41, it first passes through the plate-shaped filter element 442, which intercepts and adsorbs most of the dust particles on its surface or inside. Clean air passes through the filter element, rises through the through hole of the partition 461, and is finally discharged outside the device by the negative pressure pump 471 through the exhaust pipe 472. The anti-backflow filter screen 473 at the end of the exhaust pipe 472 prevents external air from flowing back in.

[0057] To prevent the plate-shaped filter element 442 from clogging, the vibration mechanism 46 operates periodically or continuously. The controller 7 starts the servo motor 4621, driving the drive shaft 4622 and the eccentric wheel 4623 to rotate. The eccentric wheel 4623 periodically squeezes the connecting plate 4633 of the shaking part 463. Under the action of the elastic spring 4632, the elastic force of the elastic spring 4632 drives the filter frame 441 and the plate-shaped filter element 442, which are fixed to the connecting plate 4633, to generate high-frequency vibration. At the same time, multiple scrapers 45 fixed to the inner wall of the dust removal housing 41 generate relative movement with the bottom of the vibrating plate-shaped filter element 442, scraping off the attached large dust particles. The dust that is shaken off and scraped off falls into the bottom of the dust removal housing 41 under the action of gravity, which can be cleaned periodically. This process ensures the continuous and efficient filtration capacity of the filter assembly 44. After the processing cycle is completed, the laser 3 stops working, but the air blowing unit 6 can continue to run for a period of time to ensure that the residual dust in the chamber is completely removed.

[0058] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0059] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0060] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0061] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A laser processing apparatus for surface treatment of micro-blind holes, characterized in that, It includes: A laser processing rack (1) is provided with a three-axis linear motor adjustment platform (2) installed on the bottom surface of the inner cavity of the laser processing rack (1). Laser (3), the laser (3) is mounted on the drive seat surface of the triaxial linear motor adjustment platform (2) for precisely adjusting the laser head to perform micro blind hole processing on the workpiece; Dust treatment mechanism (4), the dust treatment mechanism (4) includes an adsorption table (43), the adsorption table (43) is installed on the inner wall of the bottom side of the inner cavity of the laser processing frame (1), the adsorption table (43) is used for dust suction and workpiece placement; A sealing device (5) is installed on the front side of the laser processing rack (1). The sealing device (5) is used to control the opening and closing of the operation port of the processing area of ​​the laser processing rack (1). Airflow unit (6) is installed on the top of the laser processing rack (1). The airflow unit (6) is used to deliver clean air into the sealed chamber formed between the laser processing rack (1) and the sealing device (5). The controller (7) is installed on the outside right side of the laser processing rack (1).

2. The laser processing apparatus for micro-blind hole surface treatment as described in claim 1, characterized in that: The sealing device (5) includes a hydraulic cylinder (51) installed on the top side surface of the laser processing frame (1), an adjustment seat (52) fixedly installed on the output top of the hydraulic cylinder (51), a sealing plate (53) provided on the side surface of the adjustment seat (52), a transparent observation window (54) fitted and installed on the surface of the sealing plate (53), and an anti-pinch buffer mechanism installed on the bottom side of the sealing plate (53). The sealing plate (53) slides against the front surface of the laser processing frame (1), and a limiting frame (511) is fixedly installed on the front top of the laser processing frame (1). The sealing plate (53) penetrates the inner cavity of the limiting frame (511), and the limiting frame (511) restricts the sealing plate (53) to move only in the vertical direction.

3. The laser processing apparatus for micro-blind hole surface treatment as described in claim 2, characterized in that: The anti-pinch buffer mechanism includes a base (55), which is located at the bottom of the sealing plate (53). A sliding column (56) slides through the surface of the base (55). A buffer plate (58) is fixedly installed at the bottom of the sliding column (56). A buffer spring (57) is sleeved at the bottom of the sliding column (56). A pressure sensor (59) is installed at the bottom of the buffer plate (58). A base (55) is installed at the bottom of the pressure sensor (59). A side plate (510) is installed at the top front end of the base (55). The base (55) is made of elastic rubber. The number of sliding columns (56) is several, and adjacent sliding columns (56) are distributed at equal intervals; and / or, the top of the buffer plate (58) is elastically connected to the bottom of the base plate (512) through a buffer spring (57); and / or, the side plate (510) has a U-shaped cross-section when viewed from above; and / or, the inner wall of the side plate (510) is slidably attached to the front surface of the base plate (512).

4. The laser processing apparatus for micro-blind hole surface treatment as described in claim 1, characterized in that: The airflow unit (6) includes an air inlet pipe (61) fixedly installed at the top of the laser processing frame (1), a blower (62) installed on the inner wall of the air inlet pipe (61), a dust filter (63) set at the air inlet port of the air inlet pipe (61), and a diverter plate (64) fixedly connected to the inner wall of the top side of the laser processing frame (1) through a connecting column. The top of the diverter plate (64) is elliptical; and / or, there is a cavity between the diverter plate (64) and the inner wall of the laser processing rack (1), and the gas used for diversion flows along the inner wall of the laser processing rack (1).

5. The laser processing apparatus for micro-blind hole surface treatment as described in claim 1, characterized in that: The dust treatment mechanism (4) further includes a dust suction pipe (42), a dust removal shell (41), a filter assembly (44), a vibration mechanism (46), and a negative pressure unit (47). The dust suction pipe (42) is used to connect the adsorption platform (43) to the dust removal shell (41). The inner wall of the dust removal shell (41) is equipped with a vibration mechanism (46). The vibration mechanism (46) is equipped with a filter assembly (44) for dust filtration and separation of the intake air. The top of the vibration mechanism (46) is equipped with a negative pressure unit (47).

6. The laser processing apparatus for micro-blind hole surface treatment as described in claim 1, characterized in that: The adsorption stage (43) includes an adsorption shell (431) and adsorption holes (432). The adsorption shell (431) is installed at the bottom of the inner cavity of the laser processing frame (1), and the top surface of the adsorption shell (431) is evenly covered with adsorption holes (432).

7. The laser processing apparatus for micro-blind hole surface treatment as described in claim 5, characterized in that: The dust suction pipe (42) includes a dust suction pipe (421) and an anti-backflow plate (422). The top end of the dust suction pipe (421) is connected to the bottom of the adsorption shell (431), and the end of the dust suction pipe (421) is connected to the left side of the dust removal shell (41). An anti-backflow plate (422) is hinged to the top side of the end of the dust suction pipe (421). The anti-backflow plate (422) is attached to the end of the dust suction pipe (421) to prevent dust from flowing back.

8. The laser processing apparatus for micro-blind hole surface treatment as described in claim 5, characterized in that: The vibration mechanism (46) includes a partition (461) disposed on the inner wall of the dust removal shell (41), a through hole is provided in the middle of the partition (461), a drive unit (462) is installed on the top of the partition (461), and a shaking part (463) is provided on one side of the drive unit (462) and installed on the inner wall of the dust removal shell (41). The driving end of the shaking part (463) is connected to the inner wall of the top of the filter assembly (44) disposed at the bottom of the through hole. The drive unit (462) includes a servo motor (4621), the output end of which is connected to a drive shaft (4622), and an eccentric wheel (4623) is fixedly sleeved on the surface of the drive shaft (4622). The shaking part (463) includes a fixed column (4631), an elastic spring (4632), and a connecting plate (4633). The fixed column (4631) is fixedly installed on the inner wall of the dust removal shell (41). The elastic spring (4632) is sleeved on the surface of the fixed column (4631). The connecting plate (4633) is slidably sleeved on the surface of the fixed column (4631). The connecting plate (4633) is elastically connected to the inner wall of the dust removal shell (41) through the elastic spring (4632). The connecting plate (4633) is fixedly connected to the top of the filter assembly (44). The connecting plate (4633) is in contact with an eccentric wheel (4623) provided on one side.

9. The laser processing apparatus for micro-blind hole surface treatment as described in claim 5, characterized in that: The filter assembly (44) includes a filter frame (441) and a plate-shaped filter element (442). The top of the filter frame (441) is fixedly connected to the connecting plate (4633). The top of the filter frame (441) is slidably attached to the bottom surface of the partition plate (461). The plate-shaped filter element (442) is fixedly installed at the bottom of the filter frame (441). Multiple equally spaced scrapers (45) are attached to the bottom of the plate-shaped filter element (442). The scrapers (45) are fixedly installed on the inner wall of the dust removal shell (41).

10. The laser processing apparatus for micro-blind hole surface treatment as described in claim 5, characterized in that: The negative pressure unit (47) includes a negative pressure pump (471), an exhaust pipe (472), and an anti-backflow filter (473). The negative pressure pump (471) is fixedly installed on the top of the partition (461). The output end of the negative pressure pump (471) is fixedly connected to the exhaust pipe (472). The end of the exhaust pipe (472) penetrates the side surface of the laser processing frame (1) and extends outward. An anti-backflow filter (473) is installed at the end of the exhaust pipe (472).

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