LED lamp bead die bonding and wire welding device

Abstract

The invention relates to the technical field of semiconductor packaging equipment, in particular to an LED lamp bead die bonding and wire welding device which comprises an equipment work station and an automatic base station arranged in the equipment work station. A leading-in unit, an operation bearing unit and an output unit are sequentially arranged on the automatic base table. The leading-in unit is provided with an input conveying belt and a light pressing unit at the tail end. The operation bearing unit is located below the welding tool, comprises a bearing part capable of moving in a fine adjustment mode and is used for receiving and fixing the LED light bar. A positioning assembly is arranged between the light pressing unit and the operation bearing unit; a fine adjustment distance sensor is arranged on the side edge of the operation bearing unit and used for sensing the position of the bearing part in real time and feeding data back to the control system so as to cooperatively adjust actions of the light pressing unit and the positioning assembly. And full-process automatic integration of material feeding, accurate positioning, welding, online detection and post-treatment is achieved. And through sensing and cooperative control, high precision and stability of material transfer are ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging equipment technology, specifically to an LED lamp bead die bonding and wire bonding device. Background Technology

[0002] Die bonding and wire bonding of LED chips are critical processes in semiconductor packaging production, and their processing accuracy and efficiency directly affect the luminous efficacy, reliability, and production cost of the final product. In traditional production models or equipment with low levels of automation, these processes are usually completed on multiple independent or semi-integrated workstations.

[0003] Existing typical die bonding wire bonding equipment usually includes basic modules such as a material conveyor belt, positioning fixtures, a welding worktable, and a feeding mechanism. The workflow is roughly as follows: LED strip substrates are fed into the equipment via a conveyor belt, and are then pushed by cylinders or gripped by a robotic arm onto a fixed welding carrier; the carrier itself may have a vacuum suction function to fix the product, and then the welding head performs the work above it; after completion, another robotic arm removes the finished product and places it on the output line. Some more advanced equipment will have a separate quality inspection station in the output section.

[0004] However, existing technologies of this kind have a drawback: the transfer process of materials from high-speed conveying to precision welding positioning lacks adaptive, high-precision dynamic collaborative control. Specifically, the fixed positioning mechanism and the mobile support platform are rigidly coupled, unable to compensate in real time for micron-level positional drift caused by long-term operation, thermal deformation, or mechanical clearances. This often leads to positioning deviations during material handover, which may result in reduced production speed to ensure yield, or even serious quality problems such as material jams, product scratches, or wire bonding misalignment. This restricts further improvements in production speed and precision, and makes it difficult to meet the stringent consistency requirements of high-end LED products. Summary of the Invention

[0005] This invention aims to provide an LED chip die bonding and wire bonding device to solve the aforementioned technical problems. Through integrated design, the device organically integrates functional modules such as material feeding, precise positioning, welding support, finished product output, and post-processing inspection. A specific sensing and control system enables collaborative operation between these modules, thereby improving production accuracy, efficiency, and automation.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] An LED bead die bonding and wire bonding device includes an equipment station and an equipment compartment mounted thereon. An automated base is installed inside the equipment compartment. An inlet unit, a work-bearing unit, and an output unit are sequentially arranged on the automated base. The inlet unit has an input conveyor belt, and a light-pressure unit is located at the end of the input conveyor belt. The light-pressure unit includes a light-pressure bracket, a rotating shaft mounted on the light-pressure bracket, and a closing pressure plate mounted on the rotating shaft. The closing pressure plate is used to rotatably close onto the surface of the input conveyor belt.

[0008] The work support unit is located below the welding tool and docks with the end of the input conveyor belt, used to support and position the LED light strip; the work support unit includes a support base and a work support component mounted on it, the support base is provided with a horizontal plate and a fine-tuning track set on the horizontal plate, and the bottom of the work support component is provided with a sliding block to be installed on the fine-tuning track; the support base is also provided with a fine-tuning motor and a fine-tuning motion belt, the work support component is connected to the belt surface of the fine-tuning motion belt, and is driven by the fine-tuning motor to adjust its position along the fine-tuning track;

[0009] A positioning component is provided between the working bearing unit and the light pressing unit. The positioning component includes a positioning base and a lifting support plate installed thereon. A positioning pressure block is provided on the lifting support plate, and a contact piece is provided at the bottom of the positioning pressure block.

[0010] The work-bearing unit also includes a fine-tuning distance sensor, which is disposed on the side edge of the work-bearing component; the fine-tuning distance sensor is communicatively connected to the control terminal of the light-pressing unit and the positioning component, and is used to coordinate and control the closing action of the light-pressing unit and the pressing action of the positioning component according to the sensed motion distance data.

[0011] As a further aspect of the present invention: the fine-tuning distance sensor includes a sensor base, a signal processor disposed on the sensor base, and a probe head bracket mounted on both sides of the signal processor. The probe head bracket is provided with a distance detection block, which extends to the inner edge of the frame of the work carrier and is used to sense the movement distance of the work carrier.

[0012] As a further aspect of the present invention: the import unit includes an import frame, which is mounted on the platform of the automated base. An inner support plate is provided in the inner section of the import frame, and a conveyor belt support plate is provided between the inner support plates on both sides. The input conveyor belt is mounted between the conveyor belt support plates, and guide rollers are provided at both ends of the input conveyor belt. A feed sensor for sensing the feed is provided on the feed side of the input conveyor belt.

[0013] As a further aspect of the present invention: the working support includes a support frame and a carrier disposed on the support frame, the carrier is provided with a working adsorption surface, and a plurality of adsorption joints are installed on the side edge of the carrier.

[0014] As a further aspect of the present invention: a height adjuster is provided on the positioning base, the height adjuster being used to adjust the pressing height of the lifting support plate.

[0015] As a further aspect of the present invention: the light pressure bracket is provided with an installation slot, the shaft end of the rotating shaft is installed in the installation slot, and a height adjustment pin is also provided in the installation slot, with a support pad and a buffer spring provided on the height adjustment pin.

[0016] As a further aspect of the present invention: an output carrier is slidably mounted on the output unit, and a transfer robot is provided on the side edge of the work carrier unit for transferring the welded LED light strip from the work carrier unit to the output carrier; a handling robot is also provided on the automated base, and an output port and an export platform located at the output port are provided on the equipment housing, and the handling robot is used to transport the LED light strip on the output carrier to the export platform.

[0017] As a further aspect of the present invention: the working bearing unit further includes a turnover positioning sensor, which is disposed between the working bearing and the output bearing; the turnover positioning sensor includes a sensor base and a sensing beam frame disposed on the sensor base, and the two sides of the sensing beam frame are provided with a bearing sensing end and an output sensing end, the working bearing moves to a point where it generates a contact sensing with the bearing sensing end, and the output bearing moves to a point where it generates a contact sensing with the output sensing end.

[0018] As a further aspect of the present invention: the output carrier is provided with an output adsorption surface, the side edge of the output unit is provided with a wire bonding detector, the wire bonding detector is provided with a detector bracket, the detector bracket is located above the movement path of the output carrier, and the detector bracket is provided with a cursor mounting plate and a plurality of detection cursors arranged on the cursor mounting plate.

[0019] As a further embodiment of the present invention: an auxiliary equipment rack is also provided on the other side of the output unit, a visual detector is installed on the auxiliary equipment rack, a lifting platform is also provided on the auxiliary equipment rack, a curing blowing rack is provided on the lifting platform, a blowing machine and a curing cold air fan are respectively installed on the curing blowing rack, the blowing machine and the curing cold air fan are arranged in an inclined stepped manner, and the height of the blowing machine from the output adsorption surface is greater than the height of the curing cold air fan from the output adsorption surface.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] This invention constructs a closed-loop production system based on real-time perception and dynamic collaborative control, realizing seamless connection and autonomous optimization of the entire process from material feeding, precise positioning, welding and bearing to finished product output, online detection and post-processing.

[0022] The device incorporates a high-precision, fine-tuning distance sensor to monitor the precise position of the core operating carrier in real time and feeds this data back to the central control system. Based on this data, the system dynamically coordinates the closing action of the light-pressure unit and the pressing action of the positioning component, enabling them to adaptively and precisely cooperate with the moving carrier platform. This revolutionarily solves the problem of flexible positioning and stable docking when transferring materials at high speeds to precision workstations. Furthermore, the device innovatively integrates a multimodal online detection and post-processing unit in the output section: combining rapid initial screening of wire bonding based on optical reflection principles with precise quantitative detection of weld points using machine vision, a three-dimensional quality monitoring system is formed; the stepped spatial layout of the blowing and forced cooling mechanism sequentially completes cleaning and dust removal and rapid weld point curing within a compact space, achieving process integration.

[0023] This invention significantly improves production accuracy and repeatability, effectively avoiding material jamming and processing deviation; its online quality inspection and integrated post-processing greatly shorten the production cycle and improve the consistency of product quality.

[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Furthermore, these drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to specific embodiments.

[0026] Figure 1 This is a schematic diagram of the overall structure of the LED bead die bonding and wire bonding device provided in an embodiment of the present invention.

[0027] Figure 2 This is a schematic diagram of the internal structure of the equipment compartment provided in an embodiment of the present invention.

[0028] Figure 3 This is a schematic diagram of the import unit provided in an embodiment of the present invention.

[0029] Figure 4 This is a schematic diagram of the structure of the work-bearing unit provided in an embodiment of the present invention.

[0030] Figure 5This is a schematic diagram of the structure of a fine-tuning distance sensor provided in an embodiment of the present invention.

[0031] Figure 6 This is a schematic diagram of the structure of the turnover positioning sensor provided in an embodiment of the present invention.

[0032] Figure 7 This is a schematic diagram of the structure of the light pressure unit and positioning component provided in an embodiment of the present invention.

[0033] Figure 8 For the present invention Figure 7 A schematic diagram of the structure of region A in the middle.

[0034] Figure 9 This is a schematic diagram of the structure of the auxiliary equipment rack provided in an embodiment of the present invention.

[0035] In the diagram: 1. Equipment workstation; 11. Equipment housing; 12. Automation base; 13. Export platform; 14. Auxiliary equipment rack; 15. Vision detector; 16. Lifting platform; 17. Curing blower; 18. Blower; 19. Curing air cooler; 10. Handling robot; 2. Import unit; 21. Import frame; 22. Inner support plate; 23. Guide roller; 24. Conveyor belt pallet; 25. Feed sensor; 3. Input conveyor belt; 4. Light pressure unit; 41. Light pressure bracket; 42. Rotating shaft; 43. Cover plate; 44. Mounting slot; 45. Height adjustment pin; 46. Support pad; 47. Buffer spring; 5. Positioning assembly; 51. Positioning base; 52. Height adjuster; 53. Lifting support plate; 54. Positioning block; 55. Contact piece; 6. Operation 61. Load-bearing unit; 611. Working load-bearing component; 612. Support frame; 613. Carrier; 614. Working adsorption surface; 615. Adsorption connector; 616. Sliding block; 62. Load-bearing base; 63. Horizontal plate; 64. Fine-tuning track; 65. Fine-tuning motor; 66. Fine-tuning motion belt; 67. Fine-tuning distance sensor; 671. Sensor base; 672. Signal processor; 673. Probe head bracket; 674. Distance detection band; 68. Turnover positioning sensor; 681. Sensor seat; 682. Sensing beam frame; 683. Load-bearing component sensing end; 684. Output component sensing end; 7. Output unit; 71. Wire bonding detector; 72. Detector bracket; 73. Cursor mounting plate; 74. Detection cursor; 8. Output load-bearing component; 81. Output adsorption surface; 9. Turnover robot. Detailed Implementation

[0036] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, examples of which are illustrated in the drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or identical elements.

[0037] Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0038] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0039] Example 1: This example provides an LED bead die bonding and wire bonding device, including a workstation 1. The workstation 1 serves as a stable mounting base, with a housing 11 mounted on top, forming a closed or semi-closed working environment. An automated platform 12 is installed inside the housing 11, serving as the mounting base for all functional modules.

[0040] On the platform of the automated base 12, an inlet unit 2, a work-bearing unit 6, and an output unit 7 are arranged sequentially along the material handling flow direction. The inlet unit 2 is located at the input end of the automated base 12, and its core is the input conveyor belt 3, which is used to continuously feed the carrier board loaded with LED light strips to be processed into the device. A light pressing unit 4 is provided at the end of the input conveyor belt 3. The light pressing unit 4 specifically includes a light pressing bracket 41 fixed to the automated base 12 or its own support. A rotatable rotating shaft 42 is mounted on the light pressing bracket 41 via bearings. A long strip-shaped cover plate 43 is fixedly connected to the rotating shaft 42. The free end of the cover plate 43 faces the material feeding direction of the input conveyor belt 3 and can be controlled by a drive mechanism to rotate downward around the rotating shaft 42, finally gently covering the belt surface of the input conveyor belt 3 with its pressing surface.

[0041] The work support unit 6 is located in the central area of ​​the automated base 12, directly above the working heads of welding tools such as die bonders and wire bonders. This unit is the core of the device, used to receive, precisely position, and securely support the LED light strips to be processed. The work support unit 6 includes a fixed support base 62 and a work support component 61 that is finely adjustable and movable on it. The work support component 61 further includes a rectangular support frame 611, with a dedicated carrier 612 mounted on the top of the support frame 611. The upper surface of the carrier 612 is a flat work adsorption surface 613 with micropores, which is connected to several adsorption joints 614 located on the side of the carrier 612 via vacuum lines, generating negative pressure to adsorb and fix the LED light strip substrate. Sliding blocks 615 are fixed on both sides of the bottom of the support frame 611. A horizontal plate 63 is mounted on the support base 62, and two parallel fine-tuning tracks 64 are precisely mounted on the upper surface of the plate 63. The sliding block 615 at the bottom of the work support 61 is precisely fitted onto the two fine-tuning tracks 64, allowing the entire work support 61 to slide along the track direction. A fine-tuning motor 65 is installed at one end of the support base 62. The fine-tuning motor 65 drives a fine-tuning motion belt 66 via a belt or synchronous belt, and the bottom of the support frame 611 is fixedly connected to the surface of the fine-tuning motion belt 66. Therefore, activating the fine-tuning motor 65 drives the work support 61 to perform precise lateral position adjustment along the fine-tuning tracks 64.

[0042] A positioning component 5 is installed at the critical connection point between the light pressure unit 4 and the work-bearing unit 6. The positioning component 5 includes a positioning base 51 fixed to the automation base 12, on which a height adjuster 52 (such as a precision lead screw module) is vertically mounted. The movable end of the height adjuster 52 is connected to a lifting support plate 53, and a positioning block 54 is horizontally mounted at the end of the lifting support plate 53. The bottom surface of the positioning block 54 is inlaid with a flexible contact piece 55 (such as silicone or engineering plastic). The lifting height of the positioning block 54 can be precisely controlled by the height adjuster 52.

[0043] A fine-tuning distance sensor 67 is integrated on the work carrier unit 6. This sensor is mounted on the outer side of one side edge of the support frame 611 of the work carrier 61. The fine-tuning distance sensor 67 includes an L-shaped sensor base 671, the horizontal portion of which is fixed to the carrier base 62. A signal processor 672 is mounted at the center of the vertical portion of the sensor base 671. Symmetrically mounted on both sides of the signal processor 672 are forward-facing probe brackets 673, each probe bracket 673 having a distance probe 674 (such as a high-precision laser rangefinder or capacitive proximity sensor) mounted at its end. The probe ends of these two distance probes 674 extend inward and are aligned (non-contact) with the inner edges of the front and rear sides of the support frame 611, respectively, for real-time, high-precision measurement of the lateral movement distance of the support frame 611 (i.e., the work carrier 61) relative to its initial or target position.

[0044] Output unit 7 is located at the output end of automation base 12. The main body of output unit 7 is a linear module or guide rail slide, on which an output carrier 8 is slidably mounted. The structure of output carrier 8 can be similar to that of work carrier 61, and its upper surface is provided with an output adsorption surface 81 for adsorbing and fixing the welded LED light strips. On the side of work carrier unit 6, a multi-degree-of-freedom turnover robot 9 is installed, and its end effector is usually a vacuum suction cup or mechanical gripper.

[0045] On the automated base 12, next to the output unit 7, a handling robot 10 is also installed. The side wall of the equipment housing 11 has an output port, and an export platform 13 is fixed to the outside of the output port. The range of motion of the handling robot 10 can cover the output carrier 8 and the export platform 13.

[0046] The working process begins at the inlet unit 2. LED light strips are placed on the input conveyor belt 3 and transported into the device along the belt. When the light strip reaches the end of the conveyor belt and is about to enter the work carrier unit 6 area, the process is triggered. First, the fine-tuning motor 65, according to a preset program or instruction, drives the work carrier 61 to move along the fine-tuning track 64 to a receiving position precisely aligned with the end of the input conveyor belt 3. Next, the carrier 612 on the work carrier 61 initiates vacuum adsorption, preparing to receive the material. Simultaneously, the height adjuster 52 of the positioning component 5 activates, driving the positioning block 54 to descend to a preset height. Its bottom contact piece 55 gently presses against the front edge of the LED light strip, which has just moved into position, achieving initial longitudinal stopping and positioning. Almost simultaneously, the cover plate 43 of the light pressure unit 4 rotates downwards, gently pressing against the rear area of ​​the LED light strip to prevent it from tilting or sliding during transfer. At this time, the input conveyor belt 3 may pause briefly or continue running slowly. Under the stop of the positioning block 54 and the light pressure of the closing plate 43, the LED light strip is precisely pushed onto the working adsorption surface 613 of the working carrier 61 and is firmly adsorbed. Subsequently, the positioning block 54 is lifted, the closing plate 43 rotates and opens, and the input conveyor belt 3 resumes operation, preparing for the next cycle.

[0047] After the light strip is fixed to the working support 61, the fine-tuning motor 65 can again precisely drive the working support 61, moving it to the precise processing coordinates below the wire bonding machine's working head. Throughout the fine-tuning movement, the fine-tuning distance sensor 67 operates continuously. Its two side distance detectors 674 non-contactly measure the actual displacement of the side edge of the support frame 611 and transmit the data to the signal processor 672 in real time. The signal processor 672 processes the data and feeds back the processed precise position information to the device's main controller. This information is not only used for the closed-loop position control of the fine-tuning motor 65, but more importantly, the main controller will coordinate the pressing timing of the light pressure unit 4 covering the pressure plate 43 and the pressing height and timing of the positioning component 5 positioning block 54 in the next working cycle based on the current precise position of the working support 61, ensuring that they can adaptively match the positional changes of the working support 61 and achieve dynamic and precise docking.

[0048] After the welding process is completed, the work carrier 61 can be moved to a fixed handover position. The turnover robot 9 starts, moves its end effector above the work carrier 61, picks up the completed LED light strip, and then moves laterally to place the light strip on the output suction surface 81 of the output carrier 8, which has been moved into place. After the output carrier 8 picks up the light strip, it slides along the track of the output unit 7 and transports it to a fixed unloading position. The handling robot 10 then moves to remove the LED light strip from the output carrier 8 and places it smoothly on the export platform 13 outside the equipment, completing a full production cycle.

[0049] The core technical principle of this embodiment lies in the closed-loop control logic of "perception-decision-coordination". The fine-tuning distance sensor 67, acting as a high-precision "sensing organ", monitors the position of the core moving platform, the work carrier 61, in real time. Due to potential micron-level hysteresis in mechanical transmission or drift caused by thermal expansion, the actual stopping position of the work carrier 61 after each movement is not absolutely constant. In traditional equipment, the fixed mechanism of subsequent processes and the moving platform are rigidly coupled, which can easily lead to docking failure or material damage due to positional deviations. This invention digitizes the position variable by introducing the fine-tuning distance sensor 67 and the signal processor 672. The signal processor 672, acting as a "nerve node", not only processes data but also converts it into control commands. The main controller, acting as the "decision center", dynamically calculates and adjusts the action parameters of the actuators of the light pressure unit 4 and the positioning component 5 based on real-time position data. This allows the light pressure and positioning actions to adaptively follow the positional changes of the work carrier 61, forming a flexible and intelligent collaborative working system, rather than a fixed, sequential combination of mechanical actions.

[0050] Example 2 includes all the structures of Example 1. Based on this, the functions of output unit 7 and its surrounding components are expanded.

[0051] The structure of the output carrier 8 is specifically designed to have an output adsorption surface 81 that functions similarly to the working adsorption surface 613, ensuring that the LED light strip remains stably adsorbed during transfer and subsequent processing, preventing displacement or damage to the precision bonding wire due to movement or processing actions.

[0052] A wire bonding detector 71 is fixedly installed on one side of the track of the output unit 7. The wire bonding detector 71 mainly includes a vertical detector bracket 72, which spans above the track of the output unit 7, forming a gate-like structure. A long strip-shaped cursor mounting plate 73 is fixed on the crossbeam of the detector bracket 72. On the cursor mounting plate 73, along the movement direction of the output carrier 8, several detection cursors 74 are arranged in high density. These detection cursors 74 can be lasers that emit parallel beams of specific wavelengths, or they can be spot projectors composed of high-brightness LED point light sources and precision optical lenses. The optical axes of all detection cursors 74 are vertically downward, forming a precise array of spot patterns with known spacing on the movement plane of the output carrier 8.

[0053] On the other side of the output unit 7 track (opposite to the wire bonding detector 71), an auxiliary equipment rack 14 is fixedly mounted on the automation base 12. The auxiliary equipment rack 14 is a robust frame structure. On its upper part, a vision detector 15 is mounted, which typically includes an industrial camera, lens, and ring light source, with its field of view aimed at the solder joint area of ​​the LED light strip carried on the output carrier 8 passing below.

[0054] On the auxiliary equipment rack 14, below the vision detector 15, a liftable post-processing mechanism is also installed. Specifically, a lifting platform 16 is provided, and a long, narrow curing blower 17 is installed on the top platform of the lifting platform 16. Two sets of equipment with different functions are installed side by side on the curing blower 17: a blower 18 and a curing cooler 19. It is worth noting that these two devices are not at the same horizontal level, but are arranged in an inclined, stepped manner. Specifically, the blower 18 (integrating an ionizing air bar and a precision nozzle) is installed at a higher position, with its air outlet tilted downwards, but at a large working distance (e.g., 50-100 mm) from the light strip on the output adsorption surface 81, to blow out high-pressure, clean ionizing air to remove micro-dust and static electricity that may be generated during the wire bonding process. The curing air cooler 19 (typically a low-temperature air knife using semiconductor or eddy tube cooling) is installed at a lower position, with its outlet almost touching the surface of the LED strip on the output adsorption surface 81 (e.g., 5-15 mm). It sprays a low-temperature, dry airflow onto the solder joint area of ​​the completed LED strip, accelerating the crystallization and curing process of the solder joint metal and aiding in heat dissipation. The turnover positioning sensor 68 of the work-bearing unit 6 is structurally and functionally connected to this embodiment. Its sensor base 681 has a sensing beam frame 682 spanning the intersection path between the work-bearing component 61 and the output-bearing component 8, sensing the positioning status of both and providing precise gripping and placement trigger signals for the turnover robot 9.

[0055] After the transfer robot 9 transfers the welded LED light strip from the working carrier 61 to the output carrier 8, the output carrier 8 begins to move step by step along the track of the output unit 7 in the output direction. The work process then enters the output detection and processing stage.

[0056] First, the output carrier 8 carries the LED strip at a constant speed beneath the wire bonding detector 71. As it passes, a row of detection cursors 74 emits vertical beams of light that illuminate the surface of the LED strip. Operators or machine vision systems can directly observe the reflection of these light spots on the bonding wire (usually tiny gold or alloy wires) through an observation window on the side of the device or via an auxiliary monitoring camera. Because intact bonding wires have regular, smooth, curved surfaces, they produce clear, continuous reflective stripes on the light spots; while bonding wires with defects such as breaks, warping, or insufficient curvature will cause the reflective stripes to be interrupted, distorted, or disappear. This optical reflection detection method provides operators with a fast and intuitive online initial screening method.

[0057] Subsequently, the output carrier 8 moves to directly below the vision detector 15 and pauses. The vision detector 15 is activated, its ring light source illuminates the solder joint area, and the industrial camera takes a high-resolution picture. The acquired image is transmitted to the image processing system, which automatically analyzes the shape, size, position, and the height and span of the solder joint arc using pre-set algorithms (such as contour extraction, size measurement, and position comparison) to determine whether it meets the process standards, thus achieving automated and precise quality inspection.

[0058] After visual inspection, the output carrier 8 continues to the post-processing station. The lifting platform 16 adjusts the overall height of the curing blower 17 to the optimal position according to the thickness of the LED strip or process requirements. First, the LED strip passes under the blower 18, where the high-speed clean ion air sprayed by the blower 18 thoroughly sweeps across the surface of the strip, effectively removing particles adsorbed in previous processes and eliminating static electricity to prevent secondary dust adsorption. Next, the LED strip comes to the curing cooler 19, where a low-temperature air knife close to the strip forces cooling at the solder joint area. This stepped layout ensures that high-flow blowing and precise point cooling do not interfere with each other; the wide-range airflow of the blower does not excessively affect the temperature and flow field stability of the subsequent cooling air, while the close-range spray of the cooling air achieves optimal heat exchange efficiency. After blowing and cooling, the output quality of the LED strip is further improved. Finally, the output carrier 8 delivers the processed LED strip to the unloading position, where it is removed by the handling robot 10.

[0059] This embodiment designs a wire bonding detector 71 that utilizes the principle of regular reflection optics on the surface of intact metal wires, providing a low-cost, real-time method for screening macroscopic defects, serving as the first rapid checkpoint in quality control. The vision detector 15 employs digital image processing technology to achieve precise quantitative detection of microscopic dimensions. The combination of the two constitutes a three-dimensional detection system from macroscopic to microscopic. In post-processing, a creative "dust removal followed by rapid cooling" stepped spatial layout design is adopted. The principle lies in separating the functional areas of two airflows: blowing requires a certain distance to form a wide-coverage, uniformly sized flow field to achieve overall cleaning; while curing and cooling require the airflow to closely adhere to the solder joint surface to maximize the convective heat transfer coefficient and achieve rapid cooling. Separating the two vertically (stepped) and arranging them sequentially in the horizontal flow direction avoids mutual interference between airflows and achieves close connection between processes, efficiently completing two important post-processing steps within a limited space.

[0060] Example 3: Based on the high integration of Example 2, this example further introduces a data feedback and process optimization mechanism, enabling the device to evolve from automated execution to intelligent decision-making, forming an intelligent production node with self-optimization capabilities.

[0061] The signal processor 672 of the fine-tuning distance sensor 67, the data output terminal of the wire bonding detector 71, the image processing system of the vision detector 15, and even the signal from the turnover positioning sensor 68 are all connected to a higher-level central process controller. This central process controller has the ability to store data, analyze, and optimize process parameters. The control terminals of actuators such as the fine-tuning motor 65 driver of the work-bearing unit 6, the drive solenoid valve or servo controller of the light pressure unit 4, and the height adjuster 52 driver of the positioning component 5 are also under the unified management and command issuance of this central process controller. On the auxiliary equipment rack 14, a higher resolution camera or multispectral light source can be added to the vision detector 15 to obtain richer information on the weld joint morphology.

[0062] The working process of this embodiment is similar to that of Embodiment 2 in the first half, but it incorporates a loop of data acquisition, analysis, and feedback optimization. After the device is started, it runs according to the predetermined process parameters. In each production cycle, the fine-tuning distance sensor 67 continuously records the actual position trajectory data of the work carrier 61; after the vision detector 15 takes a picture of each completed LED light strip, it not only outputs a "pass / fail" judgment, but also uploads key quantitative data (such as the actual coordinates of each weld point, weld arc height, weld ball diameter, etc.) to the central process controller.

[0063] The central process controller establishes a database indexed by production batch or time series. It not only records data, but based on this deep correlation analysis, the central process controller can perform optimization in two modes: First, a real-time compensation mode: if a slow, trending drift in the platform position fed back by the fine-tuning distance sensor 67 is detected (e.g., due to thermal expansion), the controller can proactively add a reverse compensation amount to the control command of the fine-tuning motor 65 before it accumulates to a threshold affecting positioning, achieving active temperature drift compensation. Second, a process parameter adaptive adjustment mode: when analysis reveals an increase in a certain defect rate and a strong correlation with a certain motion parameter (e.g., the acceleration or deceleration of the work support 61 when moving to the welding point), the controller can automatically fine-tune this motion parameter in subsequent production (e.g., reducing acceleration to reduce vibration), observe whether the defect rate improves, and thus find a better combination of process parameters under the current production conditions.

[0064] For post-processing of the output unit, the central process controller can intelligently adjust the outlet temperature or air volume of the curing cooler 19 based on the solder joint size and shape information fed back by the vision detector 15. For example, if the detected solder joint is too large, the cooling intensity can be appropriately increased to accelerate the solidification speed, refine the grains, and improve the mechanical properties of the solder joint.

[0065] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

[0066] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An LED bead die bonding and wire bonding device, comprising a workstation (1) and a work chamber (11) disposed thereon, wherein an automated base (12) is disposed inside the work chamber (11), and an input unit (2), a work-bearing unit (6) and an output unit (7) are sequentially disposed on the automated base (12); characterized in that: The inlet unit (2) is provided with an input conveyor belt (3), and a light pressure unit (4) is provided at the end of the input conveyor belt (3). The light pressure unit (4) includes a light pressure bracket (41), a rotating shaft (42) mounted on the light pressure bracket (41), and a cover plate (43) provided on the rotating shaft (42). The cover plate (43) is used to rotate and cover the surface of the input conveyor belt (3). The work support unit (6) is located below the welding tool and docks with the end of the input conveyor belt (3) to support and position the LED light strip; the work support unit (6) includes a support base (62) and a work support component (61) mounted thereon. The support base (62) is provided with a horizontal plate (63) and a fine-tuning track (64) on the horizontal plate (63). The bottom of the work support component (61) is provided with a sliding block (615) to be installed on the fine-tuning track (64); the support base (62) is also provided with a fine-tuning motor (65) and a fine-tuning motion belt (66). The work support component (61) is connected to the surface of the fine-tuning motion belt (66) and is driven by the fine-tuning motor (65) to adjust its position along the fine-tuning track (64); A positioning component (5) is provided between the working bearing unit (6) and the light pressure unit (4). The positioning component (5) includes a positioning base (51) and a lifting support plate (53) installed thereon. A positioning block (54) is provided on the lifting support plate (53), and a contact piece (55) is provided at the bottom of the positioning block (54). The work support unit (6) also includes a fine-tuning distance sensor (67), which is disposed on the side edge of the work support (61); the fine-tuning distance sensor (67) is communicatively connected to the control terminal of the light pressure unit (4) and the positioning component (5), and is used to coordinate and control the closing action of the light pressure unit (4) and the pressing action of the positioning component (5) according to the sensed motion distance data.

2. The LED bead die bonding and wire bonding device according to claim 1, characterized in that: The fine-tuning distance sensor (67) includes a sensor base (671), a signal processor (672) disposed on the sensor base (671), and a probe bracket (673) mounted on both sides of the signal processor (672). The probe bracket (673) is provided with a distance detection block (674), which extends to the inner edge of the frame of the work carrier (61) and is used to sense the movement distance of the work carrier (61).

3. The LED bead die bonding and wire bonding device according to claim 1, characterized in that: The import unit (2) includes an import frame (21), which is mounted on the platform of the automated base (12). The inner section of the import frame (21) is provided with an inner support plate (22), and a conveyor belt support plate (24) is provided between the inner support plates (22) on both sides. The input conveyor belt (3) is mounted between the conveyor belt support plates (24), and guide rollers (23) are provided at both ends of the input conveyor belt (3). A feeding sensor (25) for sensing the feeding is provided on the feeding side of the input conveyor belt (3).

4. The LED bead die bonding and wire bonding device according to claim 1, characterized in that: The work carrier (61) includes a support frame (611) and a carrier (612) disposed on the support frame (611). The carrier (612) is provided with a work adsorption surface (613), and a plurality of adsorption joints (614) are installed on the side edge of the carrier (612).

5. The LED bead die bonding and wire bonding device according to claim 1, characterized in that: The positioning base (51) is provided with a height adjuster (52), which is used to adjust the pressing height of the lifting support plate (53).

6. The LED bead die bonding and wire bonding device according to claim 1, characterized in that: The light pressure bracket (41) is provided with an installation slot (44), the shaft end of the rotating shaft (42) is installed in the installation slot (44), and a height adjustment pin (45) is also provided in the installation slot (44). A support pad (46) and a buffer spring (47) are provided on the height adjustment pin (45).

7. The LED bead die bonding and wire bonding device according to claim 1, characterized in that: An output carrier (8) is slidably mounted on the output unit (7), and a turnover robot (9) is provided on the side edge of the work carrier unit (6) for transferring the welded LED light strip from the work carrier unit (6) to the output carrier (8); The automated base (12) is also equipped with a handling robot (10), and the equipment housing (11) is equipped with an output port and an export platform (13) located at the output port. The handling robot (10) is used to transport the LED light strip on the output carrier (8) to the export platform (13).

8. The LED bead die bonding and wire bonding device according to claim 7, characterized in that: The work support unit (6) also includes a turnover positioning sensor (68), which is disposed between the work support component (61) and the output support component (8); the turnover positioning sensor (68) includes a sensor base (681) and a sensing beam frame (682) disposed on the sensor base (681). The sensing beam frame (682) has a support component sensing end (683) and an output component sensing end (684) on both sides. The work support component (61) moves to a point where it generates a contact sensing with the support component sensing end (683), and the output support component (8) moves to a point where it generates a contact sensing with the output component sensing end (684).

9. The LED bead die bonding and wire bonding device according to claim 7, characterized in that: The output carrier (8) is provided with an output adsorption surface (81), and the side edge of the output unit (7) is provided with a wire bonding detector (71). The wire bonding detector (71) is provided with a detector bracket (72). The detector bracket (72) is located above the movement path of the output carrier (8). The detector bracket (72) is provided with a cursor mounting plate (73) and a number of detection cursors (74) arranged on the cursor mounting plate (73).

10. The LED bead die bonding and wire bonding device according to claim 9, characterized in that: An auxiliary equipment rack (14) is also provided on the other side of the output unit (7). A visual detector (15) is installed on the auxiliary equipment rack (14). A lifting platform (16) is also provided on the auxiliary equipment rack (14). A curing blower (17) is provided on the lifting platform (16). A blower (18) and a curing cooler (19) are respectively installed on the curing blower (17). The blower (18) and the curing cooler (19) are arranged in an inclined stepped manner. The height of the blower (18) from the output adsorption surface (81) is greater than the height of the curing cooler (19) from the output adsorption surface (81).

Images