Display module and display device

Abstract

The embodiment of the invention provides a display module and a display device. According to the display module, the edge covering adhesive comprises the conductive layer and the insulating layer, the conductive layer is attached to the display panel in the second edge covering area and extends to the first edge covering area, the insulating layer is attached to the display panel in the second edge covering area and extends to the arrangement area of the driving chip, and the insulating layer and the conductive layer are arranged in the second edge covering area in a non-overlapping mode. Therefore, when an electrostatic test is carried out, static electricity can be led out through the conductive layer, display abnormity caused by accumulation of the static electricity in the display area is avoided, the insulating layer can protect the driving chip, the problem that the driving chip is hit and hung due to the fact that the static electricity hits the driving chip is avoided, and the yield of the display module is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the development of display technology, in order to reduce costs, the integration of ICs (driver chips) is becoming increasingly higher. Existing display devices often incorporate tTED ICs (eDP Timing Controller Embedded Driver ICs). The tTED IC integrates a TCON IC, a Level Shifter IC, and a source driver IC, thereby increasing the integration of the driver chip and reducing costs. In current display devices, the tTED IC is directly bonded to the display panel, and celltape is used to wrap the edges of the display panel to prevent exposed glass and damage to the PCBA (Printed Circuit Board Assembly) and IC from impacts or electrostatic discharge. However, current testing processes have revealed that display devices fail tests, resulting in low yield rates.

[0003] Therefore, existing display devices have a technical problem where the protective effect of the edge-sealing adhesive is insufficient, causing them to fail the electrostatic discharge test. Summary of the Invention

[0004] This application provides a display module and a display device to improve the technical problem that existing display devices have insufficient protective effect of edge-sealing adhesive, which causes them to fail the electrostatic test.

[0005] To achieve the above objectives, according to a first aspect of this application, a display module is provided, the display module comprising: The display panel includes a display area and a non-display area. The non-display area includes a first border area and a second border area, and the second border area is disposed between the first border area and the display area. The driver chip is located within the first border area of ​​the display panel; Edge-sealing adhesive is provided on one side of the display panel and is provided corresponding to the non-display area; The edge-sealing adhesive includes a conductive layer and an insulating layer. The conductive layer is attached to the display panel in the second edge-sealing area and extends to the first edge-sealing area. The insulating layer is attached to the display panel in the second edge-sealing area and extends to the setting area of ​​the driver chip. The insulating layer and the conductive layer are not overlapped in the second edge-sealing area.

[0006] According to a second aspect of this application, a display device is provided, the display device including a display panel as described in any of the above embodiments.

[0007] This application provides a display module and a display device. The display module includes a conductive layer and an insulating layer in the edge-sealing adhesive. The conductive layer is attached to the display panel in the second edge-sealing area and extends to the first edge-sealing area. The insulating layer is attached to the display panel in the second edge-sealing area and extends to the area where the driver chip is located. The insulating layer and the conductive layer are not overlapped in the second edge-sealing area. Therefore, during electrostatic discharge testing, static electricity can be discharged through the conductive layer, preventing static electricity from accumulating in the display area and causing display abnormalities. The insulating layer can also protect the driver chip, preventing electrostatic discharge from damaging the driver chip and improving the yield of the display module.

[0008] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0011] Figure 1 This is a schematic diagram of a first type of contrast display device provided in an embodiment of this application.

[0012] Figure 2 A schematic diagram of a second contrast display device provided in an embodiment of this application; Figure 2 (a) in the figure is a cross-sectional schematic diagram of the second type of contrast display device; Figure 2 (b) is a planar schematic diagram of the edge-sealing adhesive material of the second type of comparative display device.

[0013] Figure 3 A schematic diagram of a third type of contrast display device provided in an embodiment of this application; Figure 3 (a) in the figure is a cross-sectional schematic diagram of the third type of contrast display device; Figure 3 (b) is a planar schematic diagram of the edge-sealing adhesive material of the third type of comparison display device.

[0014] Figure 4 This is a schematic diagram of the various points taken during the electrostatic discharge test of the display device provided in the embodiments of this application.

[0015] Figure 5 This is a plan view of the display panel provided in an embodiment of this application.

[0016] Figure 6 A first schematic diagram of the lower border area of ​​a display module provided in an embodiment of this application; Figure 6 (a) is a first planar schematic diagram of the edge-sealing adhesive and the driver chip of the lower frame area of ​​the display module provided in the embodiment of this application; Figure 6 (b) in the middle is Figure 6 (a) is a schematic diagram of the A1-A2 cross section of the display module; Figure 6 (c) in the middle is Figure 6 (a) is a schematic diagram of the B1-B2 cross section of the display module.

[0017] Figure 7 This is a second schematic diagram of the lower border area of ​​the display module provided in an embodiment of this application; Figure 7 (a) is a second planar schematic diagram of the edge-sealing adhesive and the driver chip of the lower frame area of ​​the display module provided in the embodiment of this application; Figure 7 (b) in the middle is Figure 7 (a) is a schematic diagram of the A1-A2 cross section of the display module; Figure 7 (c) in the middle is Figure 7 (a) is a schematic diagram of the B1-B2 cross section of the display module.

[0018] Figure 8 This is a third schematic diagram of the lower border area of ​​the display module provided in an embodiment of this application; Figure 8 (a) is a third planar schematic diagram of the edge-binding adhesive and the driver chip of the lower frame area of ​​the display module provided in the embodiment of this application; Figure 8 (b) in the middle is Figure 8 (a) is a schematic diagram of the A1-A2 cross section of the display module; Figure 8 (c) in the middle is Figure 8 (a) is a schematic diagram of the B1-B2 cross section of the display module.

[0019] Figure 9 This is a fourth schematic diagram of the lower border area of ​​the display module provided in the embodiments of this application; Figure 9 (a) is a fourth planar schematic diagram of the edge-sealing adhesive and the driver chip of the lower frame area of ​​the display module provided in the embodiment of this application; Figure 9 (b) in the middle is Figure 9 (a) is a schematic diagram of the A1-A2 cross section of the display module; Figure 9 (c) in the middle is Figure 9 (a) is a schematic diagram of the B1-B2 cross section of the display module.

[0020] Figure 10 A schematic diagram of the left border area, right border area, and top border area of ​​the display module provided in the embodiments of this application; Figure 10(a) is a planar schematic diagram of the edge-binding adhesive of the left frame area, right frame area and top frame area of ​​the display module provided in the embodiment of this application; Figure 10 (b) in the middle is Figure 10 (a) is a schematic diagram of the B1-B2 cross section of the display module. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0022] To illustrate the principle behind the technical problems in the embodiments of this application, some comparative display devices are provided. It should be understood that these comparative display devices are not considered prior art in the embodiments of this application. Figures 1 to 3 As shown, the contrast display device includes a backlight 11, an array substrate 121, a color filter substrate 122, a polarizing plate 13, a tTED IC 14, an FPC 15, a PBCA 16, and an edge-sealing adhesive. The edge-sealing adhesive includes an insulating material 171 and a conductive material 172. The edge-sealing adhesive is attached to the edge of the color filter substrate 122. Due to the height limitation between the color filter substrate 122 and the polarizing plate 13, only one layer of the edge-sealing adhesive can be attached to the color filter substrate 122; otherwise, the height of the edge-sealing adhesive would exceed the height of the polarizing plate 13. For example, in... Figure 1 In this design, both layers of the edge-sealing adhesive are attached to the color filter substrate 122. This results in the height of the edge-sealing adhesive exceeding the height of the polarizing plate 13, which is not permitted in the product design (the edge-sealing adhesive attached to the color filter substrate 122 can only use one layer of material in the product design). Therefore, as... Figure 2 As shown, some contrast display devices attach insulating material 171 to the color filter substrate 122, such as... Figure 3 As shown, some contrast display devices attach conductive material 172 to the color filter substrate 122.

[0023] like Figure 4 As shown, regardless of Figure 2 The comparison display device shown is still Figure 3 The comparison display devices shown will all undergo electrostatic discharge (ESD) testing to verify their anti-static capabilities. Specifically, 1 to 9 points will be selected on the comparison display device, static electricity will be released at each point, and then the function of the comparison display device will be tested to determine whether the anti-static capability of the comparison display device is malfunctioning.

[0024] The specific test conditions are as follows: under the conditions of a temperature of around 23 degrees Celsius (the temperature can vary by 3 degrees Celsius) and a relative humidity of less than 50%, an ESD electrostatic generator is used to test 4 samples. The test results are judged by computer-generated graphs. During the test, an adapter board is used to illuminate the screen in a loop.

[0025] The specific testing steps are as follows: First, ground the sample backlight and the turntable; Second, resistor-capacitor kit: 150pF + 330 ohms, test points: test the above nine points in the display area, 10 times for each point, with an interval of 1 second. After each release of static electricity, the static discharge brush needs to be brought to the sample surface along the gun head; one test uses contact discharge with a voltage of 6KV or 8KV, and air discharge (non-contact discharge) with a voltage of 8KV, 10KV, or 15KV.

[0026] The specific criteria are as follows: For contact discharge: a voltage of 6KV requires Class B, and a voltage of 8KV requires Class C; for air discharge: a voltage of 15KV requires Class C, and a voltage of 8KV to 10KV requires Class B. Class A: The product displays normally during the electrostatic discharge process without any abnormalities (such as uneven printing, flashing lines, or shaking), meaning there is no change. Class B: The product may exhibit abnormalities such as uneven printing, flashing lines, shaking, or a black screen during the electrostatic discharge process, but the product will automatically recover to normal. Class C: The product may exhibit abnormalities such as uneven printing, flashing lines, shaking, or a black screen during the electrostatic discharge process, requiring a restart to restore normal operation. Class D: The product may exhibit abnormalities such as uneven printing, flashing lines, shaking, or a black screen during the electrostatic discharge process, and restarting does not restore normal operation; the abnormality is permanent and cannot be corrected.

[0027] Using the above testing methods Figure 2 and Figure 3 When testing the comparison display devices shown, it was found that ESD was detected at points 1, 2, and 3. Figure 2 The comparison display device shown exhibits a whitening effect, especially at ESD point 2. Figure 3 The comparison shows that the tTED IC in the device will fail and requires a restart to return to normal, which does not meet the Class B standard.

[0028] Research has found that, for example Figure 2 (a) and Figure 2 As shown in (b), the insulating material 171 is attached to the color filter substrate 122, while the conductive material 172 is only disposed in the first edge area and does not contact the color filter substrate 122. This causes static electricity to travel into the panel when ESD dots 1, 2, and 3 are applied, accumulating in the display area. After accumulating to a certain extent, a whitening phenomenon occurs. Figure 3 (a) and Figure 3 As shown in (b), the conductive material is attached to the color filter substrate 122. During ESD testing (point 2), static electricity travels to the conductive material 172. Due to the gap between the insulating material 171 and the color filter substrate 122, static electricity can strike the tTED IC from this gap, causing the tTED IC to fail. Some comparative display devices are designed to eliminate the gap between the insulating material 171 and the color filter substrate 122. However, during bonding, due to precision limitations, gaps inevitably exist, allowing static electricity to still be transmitted to the driver chip. Furthermore, static electricity can also travel from the conductive material 172 to the color filter substrate and then laterally to the driver chip, causing driver chip malfunction. Therefore, existing display devices suffer from insufficient protection from the edge-sealing adhesive, leading to failure in electrostatic discharge (ESD) testing.

[0029] This application provides a display module and a display device to address the aforementioned technical problems.

[0030] like Figure 5 As shown, this application embodiment provides a display panel, the display panel 21 including a display area 201 and a non-display area 202. The non-display area 202 can be arranged around the display area 201, and a portion of the non-display area 202 can be bent to the back of the display panel, thereby achieving narrow bezels or even bezel-less bezels on one or more sides.

[0031] Understandable Figure 5 The display panel in this application can be considered as the display panel when the non-display area 202 is not bent, or as the display panel after the non-display area 202 has been bent. Figure 5 The following explanation uses the non-display area 202 of the display panel as an example, without bending.

[0032] Specifically, such as Figure 5 As shown, the non-display area 202 includes a lower border area 202a, a left border area 202b, a right border area 202c, and a top border area 202d. The lower border area 202a includes a second border area 301 and a first border area 302. The first border area 302 includes a bonding area. At least one of the left border area 202b and the right border area 202c may be equipped with a gate driving circuit.

[0033] Specifically, it can be understood that the lower border area 202a will have a boundary area with the left border area 202b and the right border area 202c, and the upper border area 202d will have a boundary area with the left border area 202b and the right border area 202c. The embodiments of this application do not limit the area to which the boundary area belongs. For example, the boundary area between the lower border area 202a and the left border area 202b can belong to the lower border area 202a or the left border area 202b. It is also possible that a part of the boundary area belongs to the lower border area 202a and another part belongs to the left border area 202b. Similarly, the areas described in other boundary areas can be determined.

[0034] In this embodiment, the boundary area between the lower border area 202a and the left border area 202b can belong to the left border area 202b. In this case, the edge binding adhesive of the boundary area between the lower border area 202a and the left border area 202b is designed as the edge binding adhesive of the left border area 202b. Alternatively, the boundary area between the lower border area 202a and the left border area 202b can belong to the lower border area 202a. In this case, the edge binding adhesive of the boundary area between the lower border area 202a and the left border area 202b is designed as the lower border area 202b. The design of the edge binding adhesive for frame area 202a allows for the following: half of the area near the lower frame area 202a at the junction of the lower frame area 202a and the left frame area 202b belongs to the lower frame area 202a, and the other half belongs to the left frame area 202b. This results in a portion of the junction area using the edge binding adhesive design of the lower frame area 202a, and the other portion using the edge binding adhesive design of the left frame area 202b. Similarly, edge binding adhesive can be applied to the junction area between the lower frame area 202a and the right frame area 202c, the junction area between the upper frame area 202d and the right frame area 202c, and the junction area between the upper frame area 202d and the left frame area 202b.

[0035] Specifically, it can be understood that each area of ​​the display panel 21 can also be regarded as a different area of ​​the display module.

[0036] Specifically, it is understandable that in Figures 6 to 10 To clearly illustrate the design of the display module, the diagram shows the structure of the display module when it is not bent. The flexible circuit board 25 of the display module can be bent to the back of the display module. However, the embodiments of this application are not limited to this. Some display modules do not bend the flexible circuit board 25 and other structures. Figure 6 and Figure 10 It can be the structure of the final form of the display module.

[0037] like Figures 5 to 10As shown in the figure, this application embodiment provides a display module 2, which includes a display panel 21, a driver chip 22, and an edge-sealing adhesive 23. The display panel 21 includes a display area 201 and a non-display area 202. The non-display area 202 includes a first edge-sealing area 302 and a second edge-sealing area 301. The second edge-sealing area 301 is disposed between the first edge-sealing area 302 and the display area 201. The driver chip 22 is disposed within the first edge-sealing area 302 of the display panel 21. The edge-sealing adhesive 23 is disposed on one side of the display panel 21 and is correspondingly disposed with respect to the non-display area 202. The edge-sealing adhesive 23 includes a conductive layer 231 and an insulating layer 232. The conductive layer 231 is attached to the display panel 21 in the second edge-sealing area 301 and extends to the first edge-sealing area 302. The insulating layer 232 is attached to the display panel 21 in the second edge-sealing area 301 and extends to the setting area of ​​the driver chip 22. The insulating layer 232 and the conductive layer 231 are disposed in a non-overlapping manner within the second edge-sealing area 301.

[0038] This application provides a display module in which the edge-sealing adhesive 23 includes a conductive layer 231 and an insulating layer 232. The conductive layer 231 is attached to the display panel 21 in the second edge-sealing area 301 and extends to the first edge-sealing area 302, and the insulating layer 232 is attached to the display panel 21 in the second edge-sealing area 301 and extends to the area where the driver chip 22 is located. The insulating layer 232 and the conductive layer 231 are not overlapped in the second edge-sealing area 301. Therefore, during electrostatic discharge testing, the conductive layer 231 can conduct static electricity, preventing static electricity from accumulating in the display area and causing display abnormalities. The insulating layer 232 can protect the driver chip 22, preventing the driver chip from being damaged by electrostatic discharge, thus improving the yield of the display module.

[0039] Specifically, it can be understood that because the conductive layer 231 is attached to the display panel 21 in the second edge area 301 and extends into the first edge area, static electricity will be discharged from the conductive layer 231 during the electrostatic discharge test. The conductive layer 231 can contact the backplate or other substrates to achieve grounding, thereby discharging the static electricity and preventing it from extending to the display area of ​​the display panel and causing display abnormalities. Furthermore, because the insulating layer 232 is attached to the display panel 21 in the second edge area 301 and extends into the area where the driver chip 22 is located, the insulating layer 232 can shield the driver chip 22, thus protecting it. In the area between the display panel and the driver chip, there are no gaps between the insulating layer 232 and the display panel, preventing static electricity from being transmitted to the driver chip through gaps. This reduces the risk of the driver chip being damaged, improves the success rate of the display module in passing the electrostatic discharge test, and increases the yield rate of the display module.

[0040] Specifically, it is understandable that in the actual design process, even if there is no gap between the insulating layer 232 and the display panel 21 in the theoretical design, due to the influence of bonding accuracy and process accuracy, a gap will inevitably appear between the insulating layer 232 and the display panel 21. When static electricity is discharged to the non-display area, the static electricity will be released from the gap to the driver chip, causing the driver chip to be damaged. However, in this embodiment, an insulating layer is provided from the setting area of ​​the driver chip to the non-display area of ​​the display panel. Therefore, the insulating layer will overlap on the display panel. Even if there is an influence of bonding accuracy, the insulating layer extends from the second edge area of ​​the display panel to the corresponding area of ​​the driver chip. There is no gap between the second edge area of ​​the display panel and the corresponding area of ​​the driver chip, thereby reducing the risk of static electricity being released to the driver chip and improving the yield of the display module.

[0041] Specifically, the portion of the display module located in the first edge-sealing area 302 can be bent to the back of the display panel, for example, a portion of the edge-sealing adhesive 23 and a portion of the flexible circuit board 25 can be bent to the back of the display module.

[0042] In some embodiments, such as Figures 5 to 10 As shown, the second edging area 301 includes a first left area 301a, a first middle area 301b, and a first right area 301c, with the first middle area 301b disposed between the first left area 301a and the first right area 301c. The first edging area 302 includes a second left area 302a, a second middle area 302b, and a second right area 302c, with the second middle area 302b disposed between the second left area 302a and the second right area 302c. The driving chip 22 is disposed within the second central region 302b. The insulating layer 232 is disposed in at least a portion of the first central region 301b and the second central region 302b. The conductive layer 231 is disposed in at least one of the first left region 301a and the first right region 301c and extends to the first edge region 302. By disposing of the insulating layer 232 in at least a portion of the first central region 301b and the second central region 302b, the insulating layer 232 is continuous in the longitudinal direction during electrostatic conduction, preventing electrostatic discharge from entering without gaps and thus avoiding electrostatic damage to the driving chip. Furthermore, the conductive layer 231, disposed in at least one of the first left region 301a and the first right region 301c and extending to the first edge region 302, can conduct electrostatic discharge through the conductive layer 231, preventing it from entering the display area and affecting the display, thereby improving the yield of the display module.

[0043] Specifically, compared to comparative display devices where the second edge region is entirely made of conductive material, causing static electricity to damage the driver chip, or where the second edge region is entirely made of insulating material, causing static electricity to be conducted to the display area of ​​the display panel, in this embodiment, the insulating layer 232 is disposed in the extension direction of the area where the driver chip 22 is located. This avoids gaps in the insulating layer 232 that could lead to static electricity intrusion and prevent the driver chip 22 from being damaged. Furthermore, the conductive layer 231 is disposed in the second edge region, which can discharge static electricity, reduce or even eliminate static electricity entering the display panel 21, improve the anti-static performance of the display module, and improve the yield of the display module.

[0044] Specifically, the conductive layer 231 can be disposed in the first left region 301a and extend to the first edge region 302, or the conductive layer 231 can be disposed in the first right region 301c and extend to the first edge region 302, or the conductive layer 231 can be disposed in the first left region 301a and extend to the first edge region 302, and the conductive layer 231 can be disposed in the first right region 301c and extend to the first edge region 302.

[0045] In some embodiments, such as Figure 6 , Figure 7 As shown, the conductive layer 231 is disposed on the side of the insulating layer 232 near the display panel 21. The insulating layer 232 is disposed in the first central region 301b and in various areas of the first edge-protecting region 302. By disposing the conductive layer 231 on the side of the insulating layer 232 near the display panel 21, the conductive layer 231 can easily discharge static electricity, preventing static electricity from entering the display area of ​​the display panel and causing display abnormalities, thus improving the yield of the display panel. Furthermore, by disposing the insulating layer 232 in the first central region 301b and in various areas of the first edge-protecting region 302, the insulating layer 232 can be stacked with the conductive layer 231 to achieve edge protection of the display module. The insulating layer being disposed in various areas of the first edge-protecting region 302 can further protect the driver chip, preventing the driver chip from being damaged, improving the anti-static performance of the display module, and increasing the yield of the display module.

[0046] In some embodiments, such as Figure 6As shown, the conductive layer 231 includes a first conductive portion 231a and a second conductive portion 231b. The first conductive portion 231a is disposed in the first left region 301a and extends to the second left region 302a, and the second conductive portion 231b is disposed in the first right region 301c and extends to the second right region 302c. The first conductive portion 231a and the second conductive portion 231b are spaced apart. By including the spaced first conductive portion 231a and the second conductive portion 231b in the conductive layer 231, the conductive layer 231 is not disposed in the area where the driver chip 22 is disposed or in the longitudinal direction of the area where the driver chip 22 is disposed. This avoids damage to the driver chip 22 when static electricity is discharged from the conductive layer 231, thus improving the anti-static capability of the display module. Furthermore, since the conductive layer 231 is disposed in the first left region 301a and the first right region 301c, it can discharge static electricity during electrostatic testing and when static electricity is generated on the display panel, preventing static electricity from accumulating in the display area and causing display abnormalities, thereby improving the yield of the display module.

[0047] Specifically, such as Figure 6 (a) and Figure 6 As shown in (c), it can be seen that within the lower border area 202a of the display panel, the insulating layer 232 is disposed in the middle area of ​​the second border area 301 and in various areas of the first border area 302. Furthermore, the insulating layer 232 can extend from the first border area 302 to the boundary of the lower border area 202a, thereby bordering the display module. Figure 6 As shown in (b), it can be seen that the conductive layer 231 extends from the left side of the second edge area 301 to the boundary of the lower edge area 202a, and from the right side of the second edge area 301 (i.e., the first left area 301a) to the boundary of the lower edge area 202a. The conductive layer 231 extends from the second edge area 301 to the boundary of the lower edge area 202a. The left and right sides of the second edge area 301 contain only the conductive layer 231, while the middle area of ​​the second edge area 301 contains only the insulating layer 232. This avoids setting two stacked layers in the second edge area 301, and the static electricity is discharged through the conductive layer 231. The insulating layer 232 located in the first edge area 302 can fix the conductive parts on both sides.

[0048] Specifically, such as Figure 6 As shown, it can be understood that in order to avoid the influence of bonding error or process error, the boundary of the conductive layer 231 will be recessed relative to the boundary of the insulating layer 232. However, the embodiments of this application are not limited to this. In the region where both the conductive layer 231 and the insulating layer 232 are provided, the boundary of the conductive layer 231 can be flush with the boundary of the insulating layer 232.

[0049] In some embodiments, such as Figure 7As shown, the conductive layer 231 is disposed in the first left region 301a, the second left region 302a, the first right region 301c, the second right region 302c, and the second middle region 302b. The portion of the conductive layer 231 located in the second left region 302a is connected to the portion of the conductive layer 231 located in the second right region 302c through the portion of the conductive layer 231 located in the second middle region 302b. The orthographic projection of the portion of the conductive layer 231 located in the second middle region 302b is spaced from the orthographic projection of the driving chip 22. By placing the conductive layer in the first left region 301a, the second left region 302a, the first right region 301c, the second right region 302c, and the second middle region 302b, the area of ​​the conductive layer can be increased, thereby increasing the grounding area of ​​the conductive layer, improving the efficiency of the conductive layer 231 in releasing static electricity, and improving the anti-static capability of the display module. Furthermore, the orthographic projection of the portion of the conductive layer 231 located in the second middle region 302b has a gap with the orthographic projection of the driver chip 22, which can prevent electrostatic discharge from damaging the driver chip 22 and prevent the driver chip from being damaged, thereby improving the anti-static performance of the display module and increasing the yield of the display module.

[0050] Specifically, such as Figure 7 As shown in (a), it can be seen that within the lower border area 202a of the display panel, the insulating layer 232 is disposed in the middle area of ​​the second border area 301 and in each area of ​​the first border area 302. The insulating layer 232 can also extend from the first border area 302 to the boundary of the lower border area 202a, thereby bordering the display module.

[0051] like Figure 7 As shown in (b), it can be seen that the conductive layer 231 extends from the left side of the second edging region 301 to the boundary of the lower frame region 202a, and from the right side of the second edging region 301 to the boundary of the lower frame region 202a. The left and right sides of the second edging region 301 contain only the conductive layer 231, while the middle area of ​​the second edging region 301 contains only the insulating layer 232. This avoids setting two stacked layers in the second edging region 301, and the static electricity is discharged through the conductive layer 231. The insulating layer 232 located in the first edging region 302 can fix the conductive parts on both sides.

[0052] like Figure 7As shown in (c), it can be seen that within the lower border area 202a of the display panel, the conductive layer 231 is disposed in the middle region of the first border area 302 on the side away from the second border area 301. The portion of the conductive layer 231 located in the first border area 302 is farther away from the second border area 301 relative to the driving chip 22 and extends to the boundary of the lower border area 202a, so that the various parts of the conductive layer 231 can be connected, and the area of ​​the conductive layer 231 is increased, thereby improving the anti-static performance of the display module and increasing the yield of the display module.

[0053] In some embodiments, such as Figure 8 , Figure 9 As shown, the conductive layer 231 is disposed on the side of the insulating layer 232 away from the display panel 21. The conductive layer 231 is disposed in each region of the first left region 301a, the first right region 301c, and the first edge region 302. By disposing the conductive layer 231 in each region of the first left region 301a, the first right region 301c, and the first edge region 302, the conductive layer 231 can conduct static electricity, preventing static electricity from entering the display area and affecting the display, thereby improving the yield of the display module.

[0054] In some embodiments, such as Figure 8 As shown, the insulating layer 232 is disposed in a portion of the first central region 301b and extends into the second central region 302b. The orthographic projection of the portion of the insulating layer 232 disposed in the second central region 302b surrounds the orthographic projection of the driver chip 22. By disposing the insulating layer 232 in a portion of the first central region 301b and extending into the second central region 302b, the insulating layer 232 can extend from the middle region of the second edge region 301 to the placement area of ​​the driver chip 22. There are no gaps between the insulating layer 232 in the middle region of the second edge region 301 and the middle region of the first edge region 302, thereby preventing static electricity from entering the driver chip 22, avoiding electrostatic damage to the driver chip 22, preventing the driver chip from being damaged, improving the anti-static performance of the display module, and improving the yield of the display module.

[0055] Specifically, such as Figure 8 As shown in (a), it can be seen that within the lower border area 202a of the display panel, the conductive layer 231 is disposed in the left and right areas of the second border area 301 and in each area of ​​the first border area 302. The conductive layer 231 can also extend from the first border area 302 to the boundary of the lower border area 202a, thereby bordering the display module.

[0056] like Figure 8As shown in (b), it can be seen that the conductive layer 231 extends from the left side of the second edging region 301 to the boundary of the lower frame region 202a, and from the right side of the second edging region 301 to the boundary of the lower frame region 202a. The left and right sides of the second edging region 301 and the first edging region 302 contain only the conductive layer 231, while the middle area of ​​the second edging region 301 contains only the insulating layer 232. This avoids setting two stacked layers in the second edging region 301, and the static electricity is discharged through the conductive layer 231.

[0057] like Figure 8 As shown in (c), it can be seen that within the lower border area 202a of the display panel, the insulating layer 232 is disposed in the middle area of ​​the second border area 301 and extends to the lower side of the setting area of ​​the driver chip 22, thereby protecting the driver chip 22.

[0058] In some embodiments, such as Figure 9 As shown, the insulating layer 232 is disposed within the first central region 301b and extends to each region of the first edge-covering region 302. By disposing of the insulating layer 232 within the first central region 301b and each region of the first edge-covering region 302, the insulating layer 232 can be stacked with the conductive layer 231 to achieve edge-covering of the display module. Furthermore, the insulating layer's placement in each region of the first edge-covering region 302 further protects the driver chip, preventing it from being damaged, improving the anti-static performance of the display module, and increasing the yield rate of the display module.

[0059] Specifically, such as Figure 9 As shown in (a), it can be seen that within the lower border area 202a of the display panel, the insulating layer 232 is disposed in the middle area of ​​the second border area 301 and in each area of ​​the first border area 302. The insulating layer 232 can also extend from the first border area 302 to the boundary of the lower border area 202a. The conductive layer 231 is disposed in the left and right areas of the second border area 301 and in each area of ​​the first border area 302. The conductive layer 231 can also extend from the first border area 302 to the boundary of the lower border area 202a, thereby bordering the display module.

[0060] like Figure 9 (b) and Figure 9As shown in (c), it can be seen that the conductive layer 231 extends from the left side of the second edging region 301 to the boundary of the lower frame region 202a, and from the right side of the second edging region 301 to the boundary of the lower frame region 202a. The left and right sides of the second edging region 301 contain only the conductive layer 231, while the middle area of ​​the second edging region 301 contains only the insulating layer 232. This avoids setting two stacked layers in the second edging region 301, and the static electricity is discharged through the conductive layer 231. The insulating layer 232 located in the first edging region 302 can fix the conductive parts on both sides.

[0061] like Figure 9 (b) and Figure 9 As shown in (c), it can be seen that within the lower border area 202a of the display panel, the conductive layer 231 extends from the first border area 302 to the boundary of the lower border area 202a, and the insulating layer 232 extends from the first border area 302 to the boundary of the lower border area 202a, so that the various parts of the conductive layer 231 can be connected, the various parts of the insulating layer 232 can be connected, and the area of ​​the conductive layer 231 is increased, thereby improving the antistatic performance of the display module and increasing the yield of the display module.

[0062] Specifically, the conductive layer 231 can be disposed in the upper region of the first middle region 301b, and the insulating layer 232 can be disposed in the lower region of the first middle region 301b and extend into the first edge region.

[0063] Specifically, such as Figures 6 to 9 As shown, there is a gap between the conductive layer 231 and the insulating layer 232 within the second edge area 301. This is to account for errors that may occur during the actual manufacturing process. To avoid the conductive layer 231 and the insulating layer 232 not meeting the requirements due to their stacked arrangement in the second edge area 301, a certain gap is created between the conductive layer 231 and the insulating layer 232. However, without considering factors such as bonding accuracy and process accuracy, or when the bonding accuracy and process accuracy can be achieved, the boundaries of the conductive layer 231 and the insulating layer 232 can be aligned. Alternatively, the design may leave a gap between the boundaries of the conductive layer 231 and the insulating layer 232, but due to the influence of process accuracy and bonding accuracy, the boundaries of the conductive layer 231 and the insulating layer 232 may be aligned.

[0064] In some embodiments, such as Figures 6 to 10As shown, the display panel 21 includes a first substrate 211 and a second substrate 212 disposed opposite to each other. The first substrate 211 extends beyond the second substrate 212, and the driving chip 22 is bonded to the area of ​​the first substrate 211 that extends beyond the second substrate 212. The display module 2 also includes a polarizer 24, with the second substrate 212 extending beyond the polarizer 24. The edge-sealing adhesive 23 is attached to the area of ​​the second substrate 212 that extends beyond the polarizer 24. By attaching the edge-sealing adhesive 23 to the area of ​​the second substrate 212 that extends beyond the polarizer 24, the edge-sealing adhesive 23 can wrap the edge of the display module, protecting the display module and avoiding increasing the thickness of the display module.

[0065] Specifically, such as Figures 6 to 10 As shown, the display module 2 also includes a flexible circuit board 25, a printed circuit board 26, and a backlight module 27.

[0066] Specifically, the first substrate 211 can be an array substrate, the second substrate 212 can be a color filter substrate, and a liquid crystal layer can be disposed between the first substrate 211 and the second substrate 212; or the first substrate 211 can be a COA (color on array, with the color filter disposed on the array side) substrate.

[0067] In some embodiments, such as Figure 5 , Figure 10 As shown, the non-display area 202 includes a left border area 202b, a right border area 202c, and a top border area 202d. The top border area 202d is disposed opposite to the first border area 302 on both sides of the display area 201. The left border area 202b and the right border area 202c are disposed opposite to each other on both sides of the display area 201. In at least one of the left border area 202b, the right border area 202c, and the top border area 202d, the conductive layer 231 is attached to the display panel 21 and extends to the boundary of the display module 2. The insulating layer 232 is spaced apart from the display panel 21 and extends to the boundary of the display module 2. By attaching the conductive layer 231 to the display panel 21 and extending it to the boundary of the display module 2 in at least one of the left border area 202b, the right border area 202c, and the top border area 202d, and by spacing the insulating layer 232 from the display panel 21 and extending it to the boundary of the display module 2, the conductive layer 231 can discharge static electricity, preventing static electricity from entering the display area and causing display abnormalities, thereby improving the anti-static capability of the display module and increasing the yield of the display module.

[0068] Specifically, the insulating layer 232 can be disposed on the side of the conductive layer 231 that is close to the display panel 21.

[0069] Specifically, such as Figure 10 (a) and Figure 10As shown in (b), only the conductive layer 231 is present in the area that is attached to the display panel 21, thus avoiding the superposition of the conductive layer 231 and the insulating layer 232 in the area that is attached to the display panel 21.

[0070] Specifically, such as Figure 10 As shown in (b) in the figure, Figure 10 Example (b) is given by setting the first substrate 211 to extend beyond the second substrate 212 in the left border area 202b, right border area 202c and top border area 202d. However, the embodiments of this application are not limited to this and the first substrate 211 can be flush with the second substrate 212.

[0071] Specifically, in at least one of the left frame area 202b, right frame area 202c, and top frame area 202d, the insulating layer 232 can be attached to the display panel 21 and extended to the boundary of the display module 2, and the conductive layer 231 can be spaced apart from the display panel 21 and extended to the boundary of the display module 2.

[0072] Specifically, such as Figure 10 As shown, Figure 10 The example described uses the left border area 202b, right border area 202c, and top border area 202d as having the same design for the edge binding adhesive. However, the embodiments of this application are not limited to this; the design of the edge binding adhesive in two or three of the left border area 202b, right border area 202c, and top border area 202d can be different. For example, the design of the edge binding adhesive in the left border area 202b can be... Figure 10 The edge binding design shown can be implemented using the following methods within the upper frame area 202d: Figure 8 The design of the edge binding adhesive shown in (a) can also be used to design various areas as described above, which will not be elaborated further.

[0073] Specifically, the above embodiments use a liquid crystal display panel as an example to illustrate the display panel in the display module. However, the embodiments of this application are not limited to this. For other display modules that require edge-sealing adhesive, the above design can also be adopted. For example, the display panel can be an organic light-emitting diode display panel, and there is no need to set a backlight module.

[0074] Specifically, the conductive layer is made of aluminum, and the insulating layer is made of PET (Polyethylene terephthalate).

[0075] Specifically, the edge-sealing adhesive can be bonded to the display panel using adhesive material, which is not shown in the figure.

[0076] Specifically, the above embodiments have provided a detailed description of the display module from aspects such as the film layer structure of the display module and the specific design of each film layer. It is understood that when there is no conflict between the various embodiments, the various embodiments can be combined. For example, the first substrate 211 can be an array substrate, the second substrate 212 can be a color filter substrate, the conductive layer is disposed on the side of the insulating layer close to the display panel, and the insulating layer is disposed in the first central area and in each area of ​​the first edge area.

[0077] Meanwhile, this application provides a display device, which includes a display module as described in any of the above embodiments.

[0078] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0079] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0080] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0081] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display module, characterized in that, include: The display panel includes a display area and a non-display area. The non-display area includes a first border area and a second border area, and the second border area is disposed between the first border area and the display area. The driver chip is located within the first border area of ​​the display panel; Edge-sealing adhesive is provided on one side of the display panel and is provided corresponding to the non-display area; The edge-sealing adhesive includes a conductive layer and an insulating layer. The conductive layer is attached to the display panel in the second edge-sealing area and extends to the first edge-sealing area. The insulating layer is attached to the display panel in the second edge-sealing area and extends to the setting area of ​​the driver chip. The insulating layer and the conductive layer are not overlapped in the second edge-sealing area.

2. The display module according to claim 1, characterized in that, The second edging area includes a first left area, a first middle area, and a first right area, with the first middle area located between the first left area and the first right area. The first edging area also includes a second left area, a second middle area, and a second right area, with the second middle area located between the second left area and the second right area. The driving chip is disposed in the second central region, the insulating layer is disposed in at least a portion of the first central region and the second central region, and the conductive layer is disposed in at least one of the first left region and the first right region and extends to the first edge region.

3. The display module according to claim 2, characterized in that, The conductive layer is disposed on the side of the insulating layer near the display panel, and the insulating layer is disposed in the first central area and in various areas of the first edge area.

4. The display module according to claim 3, characterized in that, The conductive layer includes a first conductive portion and a second conductive portion. The first conductive portion is disposed in the first left region and extends to the second left region, and the second conductive portion is disposed in the first right region and extends to the second right region. The first conductive portion and the second conductive portion are spaced apart.

5. The display module according to claim 3, characterized in that, The conductive layer is disposed in the first left region, the second left region, the first right region, the second right region, and the second middle region. The portion of the conductive layer located in the second left region is connected to the portion of the conductive layer located in the second right region through the portion of the conductive layer located in the second middle region. The orthographic projection of the portion of the conductive layer located in the second middle region is spaced from the orthographic projection of the driver chip.

6. The display module according to claim 2, characterized in that, The conductive layer is disposed on the side of the insulating layer away from the display panel, and the conductive layer is disposed in each area of ​​the first left area, the first right area, and the first edge area.

7. The display module according to claim 6, characterized in that, The insulating layer is disposed in a portion of the first central region and extends into a portion of the second central region, and the orthographic projection of the portion of the insulating layer disposed in the second central region surrounds the orthographic projection of the driver chip.

8. The display module according to claim 6, characterized in that, The insulating layer is disposed within the first central area and extends to each area of ​​the first edge-sealing area.

9. The display module according to any one of claims 1 to 8, characterized in that, The display panel includes a first substrate and a second substrate disposed opposite to each other, the first substrate extending beyond the second substrate, and the driving chip being bonded to the area of ​​the first substrate extending beyond the second substrate; The display module also includes a polarizer, the second substrate extends beyond the polarizer, and the edge-sealing adhesive is attached to the area of ​​the second substrate that extends beyond the polarizer.

10. The display module according to any one of claims 1 to 8, characterized in that, The non-display area includes a left border area, a right border area, and a top border area. The top border area is disposed opposite to the first border area on both sides of the display area, and the left border area and the right border area are disposed opposite to each other on both sides of the display area. In at least one of the left border area, right border area, and top border area, the conductive layer is attached to the display panel and extends to the boundary of the display module, and the insulating layer is spaced apart from the display panel and extends to the boundary of the display module.

11. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 10.

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