A radio frequency device and radio frequency power supply

Abstract

This invention discloses a radio frequency (RF) device and an RF power supply. The RF device includes: a metal cover plate, an organic printed circuit board, a ceramic plate, and a metal liquid cooling plate stacked sequentially; the organic printed circuit board includes an organic substrate and conductive lines located on a first surface of the organic substrate; the conductive lines are in contact with the ceramic plate; the conductive lines are used to receive a first RF signal and output a second RF signal, wherein the power of the second RF signal is greater than the power of the first RF signal; the metal cover plate and the metal liquid cooling plate together constrain the first RF signal on the ceramic plate so that the first RF signal is transmitted on the ceramic plate. This invention provides an RF device and an RF power supply that can transmit high-power RF signals and significantly reduce the manufacturing cost of the RF device.

Description

Technical Field

[0001] This invention relates to the field of radio frequency technology, and more particularly to a radio frequency device and a radio frequency power supply. Background Technology

[0002] In traditional radio frequency (RF) device design, organic printed circuit boards (PCBs) are widely used for RF signal transmission and processing due to their low cost and mature manufacturing process. However, organic substrate materials have low thermal conductivity, and during high-power RF signal transmission, heat can easily accumulate locally, leading to increased substrate temperature. This, in turn, causes changes in dielectric constant, increased transmission loss, and even problems such as circuit stripping or substrate burnout.

[0003] To address the aforementioned issues, some improvements have been proposed in existing technologies. For example, ceramic substrates can be used instead of organic substrates to improve thermal conductivity; however, ceramic PCBs are expensive and difficult to manufacture. Therefore, achieving good signal integrity and low-cost structural design in high-power radio frequency transmission scenarios has become a key technical problem that needs to be solved. Summary of the Invention

[0004] This invention provides a radio frequency (RF) device and a radio frequency power supply, which can transmit high-power RF signals and significantly reduce the manufacturing cost of the RF device.

[0005] According to one aspect of the present invention, a radio frequency device is provided, comprising: a metal cover plate, an organic printed circuit board, a ceramic plate, and a metal liquid cooling plate arranged in sequence;

[0006] The organic printed circuit board includes an organic substrate and conductive lines located on a first surface of the organic substrate.

[0007] The conductive line is in contact with the ceramic plate; the conductive line is used to receive a first radio frequency signal and output a second radio frequency signal, wherein the power of the second radio frequency signal is greater than the power of the first radio frequency signal;

[0008] The metal cover plate and the metal liquid cooling plate are used together to confine the first radio frequency signal on the ceramic plate so that the first radio frequency signal can be transmitted on the ceramic plate.

[0009] Optionally, the conductive line includes a first quarter-wavelength transmission line, a second quarter-wavelength transmission line, and a first composite transmission line;

[0010] The organic printed circuit board further includes a first connection line and a second connection line located on the second surface of the organic substrate, wherein the first surface and the second surface are disposed opposite to each other.

[0011] Both the first quarter-wavelength transmission line and the second quarter-wavelength transmission line include an input terminal and an output terminal;

[0012] Both the input terminals of the first quarter-wavelength transmission line and the second quarter-wavelength transmission line are used to receive the first radio frequency signal;

[0013] The first synthesizing transmission line is connected to the output of the first quarter-wavelength transmission line via the first connecting line, and is also connected to the output of the second quarter-wavelength transmission line via the second connecting line. The first synthesizing transmission line is used to synthesize the two first radio frequency signals to form the second radio frequency signal.

[0014] Optionally, the structure of the first quarter-wavelength transmission line is the same as that of the second quarter-wavelength transmission line;

[0015] The first quarter-wavelength transmission line has a square spiral orientation and is wound counterclockwise.

[0016] Optionally, the organic printed circuit board further includes a second synthetic transmission line located on the second surface of the organic substrate;

[0017] The first composite transmission line is connected to the second composite transmission line.

[0018] Optionally, the organic printed circuit board further includes a first capacitor and a second capacitor;

[0019] The first terminal of the first capacitor is electrically connected to the input terminal of the first quarter-wavelength transmission line, and the second terminal of the first capacitor is grounded.

[0020] The first terminal of the second capacitor is electrically connected to the input terminal of the second quarter-wavelength transmission line, and the second terminal of the second capacitor is grounded.

[0021] Optionally, the radio frequency device provided in this embodiment further includes a plurality of first fastening structures and a plurality of second fastening structures;

[0022] The first fastening structure is used to apply pressure to the organic printed circuit board to make the conductive lines in close contact with the ceramic plate;

[0023] The first fastening structure includes a first component and a second component that are fixedly connected. The first component is located on the surface of the organic printed circuit board away from the conductive lines, and the second component is detachably connected to the metal liquid cooling plate.

[0024] The second fastening structure is used to fix the metal cover plate to the metal liquid cooling plate. The second fastening structure is integrally connected to the metal cover plate and located on the side of the metal cover plate. The second fastening structure is detachably connected to the metal liquid cooling plate.

[0025] Optionally, in the first direction, the length of the metal cover is greater than or equal to the length of the organic printed circuit board, and the length of the ceramic plate is greater than or equal to the length of the organic printed circuit board;

[0026] In the second direction, the length of the metal cover plate is greater than or equal to the length of the organic printed circuit board, and the length of the ceramic plate is greater than or equal to the length of the organic printed circuit board;

[0027] The length of the organic printed circuit board ranges from 15cm to 30cm in the first direction and from 15cm to 30cm in the second direction, wherein the first direction and the second direction intersect.

[0028] Optionally, the frequency range of the first radio frequency signal received by the conductive line is 10MHz~100MHz, and the power of the first radio frequency signal is greater than or equal to 6kW.

[0029] Optionally, the metal liquid cooling plate is grounded; the metal cover plate is grounded.

[0030] According to another aspect of the present invention, a radio frequency (RF) power supply is provided, which includes a plurality of RF devices provided in any embodiment of the present invention; the metal liquid cooling plates in each of the RF devices are integrally connected.

[0031] This invention provides a radio frequency (RF) device in which a metal cover plate and a liquid metal cooling plate can confine a first RF signal received by conductive lines in an organic printed circuit board (PCB) to a ceramic plate, thereby enabling the first RF signal to be transmitted on the ceramic plate. The conductive lines can also output a second RF signal, achieving power combining and amplification. In this embodiment, the conductive lines in the PCB are in close contact with the ceramic plate, which can be understood as the ceramic plate surface having conductive lines. This embodiment achieves the same function as a ceramic PCB using an organic PCB and a regular ceramic plate. However, the manufacturing cost of a ceramic PCB is much higher than the combined cost of an organic PCB and a regular ceramic plate. Therefore, the RF device provided by this invention can reduce manufacturing costs. In summary, the RF device provided by this invention can transmit high-power RF signals and significantly reduce the manufacturing cost of RF devices.

[0032] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of a radio frequency device according to an embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram of the structure of another radio frequency device provided according to an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of the structure of the first surface of an organic printed circuit board according to an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the structure of the second surface of an organic printed circuit board according to an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of the structure of a metal cover plate according to an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the structure of a radio frequency power supply according to an embodiment of the present invention. Detailed Implementation

[0040] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0041] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0042] Figure 1 This is a schematic diagram of the structure of a radio frequency device according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of another radio frequency device provided according to an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of the first surface of an organic printed circuit board according to an embodiment of the present invention, with reference to... Figures 1-3 The radio frequency device 100 provided in this embodiment includes: a metal cover plate 110, an organic printed circuit board 120, a ceramic plate 130, and a metal liquid cooling plate 140 stacked sequentially; the organic printed circuit board 120 includes an organic substrate 121 and conductive lines 122 located on the first surface S1 of the organic substrate 121; the conductive lines 122 are in contact with the ceramic plate 130; the conductive lines 122 are used to receive a first radio frequency signal and output a second radio frequency signal, wherein the power of the second radio frequency signal is greater than the power of the first radio frequency signal; the metal cover plate 110 and the metal liquid cooling plate 140 are used together to bind the first radio frequency signal to the ceramic plate 130 so that the first radio frequency signal is transmitted on the ceramic plate 130.

[0043] Specifically, the material of the organic substrate 121 can be FR-4 or polyimide. The conductive lines 122 on the first surface S1 of the organic substrate 121 can achieve power combining. For example, the conductive lines 122 can include two input terminals, and the conductive lines 122 can be a Wilkinson synthesizer, combining the first radio frequency signal received from the two input terminals into a second radio frequency signal. The conductive lines 122 are a metal pattern layer with a thickness of approximately 2 mm. Setting the conductive lines 122 as a metal pattern layer can reduce the area of ​​the Wilkinson synthesizer, thereby reducing the area of ​​the first surface S1 of the organic printed circuit board 120.

[0044] The metal liquid cooling plate 140 has embedded liquid cooling channels that receive the liquid cooling medium, thereby quickly dissipating the heat generated by the RF device 100 during operation. The metal cover plate 110 can be in close contact with the organic printed circuit board 120 (see reference). Figure 1It can also have a certain spatial spacing (see reference). Figure 2 Both the liquid metal cooling plate 140 and the metal cover plate 110 can be grounded.

[0045] The ceramic plate 130 can be made of materials such as alumina, aluminum nitride, or silicon nitride. Due to the excellent thermal conductivity of the ceramic plate 130, the heat generated by the organic printed circuit board 120 receiving the first radio frequency signal can be dissipated quickly, with almost no heat generation problem. The ceramic plate 130 has a specific dielectric constant, and under the combined constraint of the metal liquid cooling plate 140 and the metal cover plate 110, the first radio frequency signal can be transmitted along the ceramic plate 130. When the first radio frequency signal is in the conductive line 122, an electromagnetic field is formed within the radio frequency device 100. The electromagnetic field is mainly concentrated on the ceramic plate 130 between the conductive line 122 and the metal liquid cooling plate 140. The first radio frequency signal is transmitted forward in the direction of the conductive line 122 in the form of electromagnetic waves. Although the first radio frequency signal is transmitted in the ceramic plate 130, its direction is determined by the direction of the conductive line 122.

[0046] In this embodiment, the ceramic plate 130 has no conductive lines and is simply an ordinary ceramic plate 130. The conductive lines 122 in the organic printed circuit board 120 are in close contact with the ceramic plate 130. This arrangement can be understood as the ceramic plate 130 having conductive lines 122. Compared to a ceramic PCB board, this embodiment achieves the same function as a ceramic PCB board by having the conductive lines 122 in the organic printed circuit board 120 in close contact with the ceramic plate 130, while also reducing manufacturing costs. Currently, the price of manufacturing a ceramic PCB board of the same size as the organic printed circuit board 120 in this embodiment is approximately 10,000 yuan or more, while the cost using the structure of this embodiment is only around 100 yuan, a cost reduction of 99%, significantly reducing the manufacturing cost of the radio frequency device 100.

[0047] This embodiment provides a radio frequency (RF) device. The metal cover and liquid metal cooling plate in this RF device can confine a first RF signal received by the conductive lines in an organic printed circuit board (PCB) to a ceramic plate, thereby enabling the first RF signal to be transmitted on the ceramic plate. The conductive lines can also output a second RF signal, achieving power combining and amplification. In this embodiment, the conductive lines in the PCB are in close contact with the ceramic plate; it can be understood that conductive lines are disposed on the surface of the ceramic plate. This embodiment achieves the same function as a ceramic PCB using an organic printed circuit board and a regular ceramic plate. However, the manufacturing cost of a ceramic PCB is much higher than the combined cost of an organic printed circuit board and a regular ceramic plate. Therefore, the RF device provided in this embodiment can reduce manufacturing costs. In summary, the RF device provided in this embodiment can transmit high-power RF signals and significantly reduce the manufacturing cost of RF devices.

[0048] Optional, continue to refer to Figure 3The conductive circuit includes a first quarter-wavelength transmission line 101, a second quarter-wavelength transmission line 102, and a first composite transmission line 105; Figure 4 This is a schematic diagram of the structure of the second surface of an organic printed circuit board according to an embodiment of the present invention, with reference to... Figure 4 The organic printed circuit board 120 also includes a first connection line 103 and a second connection line 104 located on the second surface S2 of the organic substrate 121 (see reference). Figure 4 The first surface S1 and the second surface S2 are disposed opposite to each other; the first quarter-wavelength transmission line 101 and the second quarter-wavelength transmission line 102 both include an input end and an output end; the input end of the first quarter-wavelength transmission line 101 and the input end of the second quarter-wavelength transmission line 102 are both used to receive the first radio frequency signal; the first synthesizing transmission line 105 is connected to the output end of the first quarter-wavelength transmission line 101 through the first connecting line 103, and is also connected to the output end of the second quarter-wavelength transmission line 102 through the second connecting line 104, and the first synthesizing transmission line 105 is used to synthesize the two first radio frequency signals to form a second radio frequency signal.

[0049] Specifically, the impedance of the first radio frequency signal is equal to the impedance of the second radio frequency signal; for example, the impedance of the first radio frequency signal is 50Ω. The length of the first connecting line 103 can be equal to the length of the second connecting line 104, and the width of the first connecting line 103 can be equal to the width of the second connecting line 104. The width of the first connecting line 103 is greater than the width of the first quarter-wavelength transmission line 101. The width of the first synthesized transmission line 105 is greater than the width of the first quarter-wavelength transmission line 101. A portion of the first connecting line 103 is also located on the first surface S1 of the organic substrate 121, and a portion of the second connecting line 104 is also located on the first surface S1 of the organic substrate 121. The metal cover plate 110 and the metal liquid cooling plate 140 are also used together to bind the second radio frequency signal to the ceramic plate 130 so that the second radio frequency signal is transmitted on the ceramic plate 130. The shape of the vertical projection of the first synthesized transmission line 105, the first connecting line 103, and the second connecting line 104 on the organic substrate 121 is a "cross shape".

[0050] Continue to refer to Figure 3 In order to enable the first quarter-wavelength transmission line 101 and the second quarter-wavelength transmission line 102 to better receive the first radio frequency signal, this embodiment may also provide a first connection port 107 and a second connection port 108, wherein the first connection port 107 is connected to the input end of the first quarter-wavelength transmission line 101, and the second connection port 108 is connected to the input end of the second quarter-wavelength transmission line 102.

[0051] Optional, continue to refer to Figure 3The structure of the first quarter-wavelength transmission line 101 is the same as that of the second quarter-wavelength transmission line 102; the first quarter-wavelength transmission line 101 has a square spiral orientation and is wound counterclockwise.

[0052] Specifically, the output end of the first quarter-wavelength transmission line 101 is located inside the square spiral. The first connecting line 103 is not electrically connected to the first quarter-wavelength transmission line 101 except for the output end. Similarly, the second connecting line 104 is not electrically connected to the second quarter-wavelength transmission line 102 except for the output end.

[0053] Optional, continue to refer to Figure 4 The organic printed circuit board 120 also includes a second synthetic transmission line 106 located on the second surface S2 of the organic substrate 121; the first synthetic transmission line 105 is connected to the second synthetic transmission line 106.

[0054] Specifically, the vertical projection of the first composite transmission line 105 on the organic substrate 121 coincides with the vertical projection of the second composite transmission line 106 on the organic substrate 121. Along the transmission path of the first composite transmission line 105, the organic substrate 121 includes hundreds or even thousands of conductive vias. These conductive vias enable electrical connection between the first composite transmission line 105 and the second composite transmission line 106, thereby ensuring efficient transmission of the high-current second radio frequency signal.

[0055] It should be noted that the metal casing and the conductive lines on the second surface of the organic substrate are mutually insulated.

[0056] Optional, continue to refer to Figure 3 or Figure 4 The organic printed circuit board 120 also includes a first capacitor C1 and a second capacitor C2; the first end of the first capacitor C1 is electrically connected to the input end of the first quarter-wavelength transmission line 101, and the second end of the first capacitor C1 is grounded; the first end of the second capacitor C2 is electrically connected to the input end of the second quarter-wavelength transmission line 102, and the second end of the second capacitor C2 is grounded.

[0057] Specifically, when the impedance of the second radio frequency signal cannot accurately reach the target impedance, the setting of the first capacitor C1 and the second capacitor C2 can achieve impedance fine-tuning, thereby accurately controlling the impedance of the organic printed circuit board so that the impedance of the first radio frequency signal and the impedance of the second radio frequency signal are both 50Ω.

[0058] Optional, continue to refer to Figure 2 or Figure 3In the first direction X, the length of the metal cover plate 110 is greater than or equal to the length of the organic printed circuit board 120, and the length of the ceramic plate 130 is greater than or equal to the length of the organic printed circuit board 120; in the second direction Y, the length of the metal cover plate 110 is greater than or equal to the length of the organic printed circuit board 120, and the length of the ceramic plate 130 is greater than or equal to the length of the organic printed circuit board 120; the length of the organic printed circuit board 120 in the first direction X ranges from 15cm to 30cm, and the length in the second direction Y ranges from 15cm to 30cm, wherein the first direction X and the second direction Y intersect.

[0059] Specifically, the first direction X can be perpendicular to the second direction Y. By ensuring that the lengths of the metal cover plate 110 and the ceramic plate 130 in the same direction are both greater than the length of the organic printed circuit board 120, efficient transmission of the first and second radio frequency signals can be ensured. The length of the organic printed circuit board 120 in both the first direction X and the second direction Y can be 20cm. Manufacturing a 20*20 ceramic PCB board would cost more than 10,000 yuan, while the cost of an organic printed circuit board 120 of the same size is only one percent of that of a ceramic PCB board. Therefore, the radio frequency device provided in this embodiment has a lower manufacturing cost when forming a large area.

[0060] Optionally, the radio frequency device provided in this embodiment further includes a plurality of first fastening structures and a plurality of second fastening structures; the first fastening structure is used to apply pressure to the organic printed circuit board to make the conductive lines in close contact with the ceramic plate; the first fastening structure includes a first component and a second component fixedly connected, the first component is located on the surface of the organic printed circuit board away from the conductive lines, and the second component is detachably connected to the metal liquid cooling plate. Figure 5 This is a schematic diagram of a metal cover plate connected to a second fastening structure according to an embodiment of the present invention. (Refer to...) Figure 5 The second fastening structure 111 is used to fix the metal cover plate 110 to the metal liquid cooling plate. The second fastening structure 111 is integrally connected with the metal cover plate 110 and is located on the side of the metal cover plate 110. The second fastening structure 111 is detachably connected to the metal liquid cooling plate.

[0061] Specifically, multiple first fastening structures can be spaced apart around the perimeter of the organic printed circuit board, similarly, referring to... Figure 5 Multiple second fastening structures 111 may be spaced apart around the metal cover plate 110.

[0062] The first component can be made of polytetrafluoroethylene (PTFE). In this embodiment, by setting a first fastening structure, the organic printed circuit board and the ceramic plate are tightly bonded together, further reducing the gap between the conductive lines and the ceramic plate, so that the effect of the organic printed circuit board and the ceramic plate after bonding is almost the same as that of the ceramic PCB board.

[0063] Optionally, the frequency range of the first radio frequency signal received by the conductive line is 10MHz~100MHz, and the power of the first radio frequency signal is greater than or equal to 6kW.

[0064] Specifically, the frequency of the first radio frequency signal can be 13.56MHz, 27.12MHz, 40.68MHz, 60MHz or 81.36MHz, etc., and the power of the first radio frequency signal can be 6kW, 8kW, 10kW, 12kW or 15kW, etc.

[0065] When the power of the first radio frequency signal is greater than or equal to 6kW, the power of the second radio frequency signal is greater than or equal to 12kW. The radio frequency device provided in this embodiment can achieve the synthesis of low-frequency high-power signals.

[0066] Optionally, the metal liquid cooling plate is grounded; the metal cover plate is grounded. This configuration can further ensure that the first radio frequency signal is transmitted on the ceramic plate, guaranteeing the high efficiency of signal transmission.

[0067] Figure 6 This is a schematic diagram of the structure of a radio frequency power supply according to an embodiment of the present invention, with reference to... Figure 6 The radio frequency power supply provided in this embodiment includes multiple radio frequency devices 100 provided in any embodiment of the present invention; the metal liquid cooling plates 140 in each radio frequency device 100 are integrally connected.

[0068] For example, the radio frequency power supply includes six radio frequency devices. When the power of the first radio frequency signal is 6kW, the radio frequency devices provided in this embodiment can output a 72kW radio frequency signal. The multiple radio frequency devices 100 are located on the same plane.

[0069] This embodiment provides a radio frequency (RF) power supply, which includes the RF device provided in any embodiment of the present invention. The beneficial effects of the RF power supply provided in this embodiment, including the RF device provided in any embodiment of the present invention, will not be elaborated further here.

[0070] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A radio frequency device, characterized by, include: A metal cover plate, an organic printed circuit board, a ceramic plate, and a metal liquid cooling plate are stacked in sequence. The organic printed circuit board includes an organic substrate and conductive lines located on a first surface of the organic substrate. The conductive line is in contact with the ceramic plate; the conductive line is used to receive a first radio frequency signal and output a second radio frequency signal, wherein the power of the second radio frequency signal is greater than the power of the first radio frequency signal; there are no conductive lines on the ceramic plate; By making close contact between the conductive lines in the organic printed circuit board and the ceramic plate, the same function as the ceramic PCB board can be achieved. The metal cover plate and the metal liquid cooling plate are used together to confine the first radio frequency signal on the ceramic plate so that the first radio frequency signal can be transmitted on the ceramic plate.

2. The radio-frequency device according to claim 1, characterized in that The conductive line includes a first quarter-wavelength transmission line, a second quarter-wavelength transmission line, and a first composite transmission line; The organic printed circuit board further includes a first connection line and a second connection line located on the second surface of the organic substrate, wherein the first surface and the second surface are disposed opposite to each other. Both the first quarter-wavelength transmission line and the second quarter-wavelength transmission line include an input terminal and an output terminal; Both the input terminals of the first quarter-wavelength transmission line and the second quarter-wavelength transmission line are used to receive the first radio frequency signal; The first synthesizing transmission line is connected to the output of the first quarter-wavelength transmission line via the first connecting line, and is also connected to the output of the second quarter-wavelength transmission line via the second connecting line. The first synthesizing transmission line is used to synthesize the two first radio frequency signals to form the second radio frequency signal.

3. The radio-frequency device according to claim 2, characterized in that The structure of the first quarter-wavelength transmission line is the same as that of the second quarter-wavelength transmission line. The first quarter-wavelength transmission line has a square spiral orientation and is wound counterclockwise.

4. The radio-frequency device according to claim 2, characterized in that The organic printed circuit board also includes a second synthetic transmission line located on the second surface of the organic substrate; The first composite transmission line is connected to the second composite transmission line.

5. The radio-frequency device according to claim 2, characterized in that The organic printed circuit board also includes a first capacitor and a second capacitor; The first terminal of the first capacitor is electrically connected to the input terminal of the first quarter-wavelength transmission line, and the second terminal of the first capacitor is grounded. The first terminal of the second capacitor is electrically connected to the input terminal of the second quarter-wavelength transmission line, and the second terminal of the second capacitor is grounded.

6. The radio-frequency device according to claim 1, characterized in that It also includes multiple first fastening structures and multiple second fastening structures; The first fastening structure is used to apply pressure to the organic printed circuit board to make the conductive lines in close contact with the ceramic plate; The first fastening structure includes a first component and a second component that are fixedly connected. The first component is located on the surface of the organic printed circuit board away from the conductive lines, and the second component is detachably connected to the metal liquid cooling plate. The second fastening structure is used to fix the metal cover plate to the metal liquid cooling plate. The second fastening structure is integrally connected to the metal cover plate and located on the side of the metal cover plate. The second fastening structure is detachably connected to the metal liquid cooling plate.

7. The radio frequency device according to claim 1, characterized in that, In the first direction, the length of the metal cover plate is greater than or equal to the length of the organic printed circuit board, and the length of the ceramic plate is greater than or equal to the length of the organic printed circuit board; In the second direction, the length of the metal cover plate is greater than or equal to the length of the organic printed circuit board, and the length of the ceramic plate is greater than or equal to the length of the organic printed circuit board; The length of the organic printed circuit board ranges from 15cm to 30cm in the first direction and from 15cm to 30cm in the second direction, wherein the first direction and the second direction intersect.

8. The radio frequency device according to claim 1, characterized in that, The frequency range of the first radio frequency signal received by the conductive line is 10MHz~100MHz, and the power of the first radio frequency signal is greater than or equal to 6kW.

9. The radio frequency device according to claim 1, characterized in that, The metal liquid cooling plate is grounded; the metal cover plate is grounded.

10. A radio frequency power supply, characterized in that, Includes the radio frequency device as described in any one of claims 1-9; The metal liquid cooling plates in each of the radio frequency devices are integrally connected.

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