Single-layer circuit board production equipment and production method

Abstract

The invention relates to the technical field of single-layer circuit board production, and discloses single-layer circuit board production equipment and a production method.The single-layer circuit board production equipment comprises a workbench, and the upper side of the workbench is fixedly connected with a fixing frame; a thermosetting adhesive discharging rotating shaft, a metal foil discharging rotating shaft, a waste discharging micro-adhesive film discharging rotating shaft, a waste collecting rotating shaft and a thermosetting adhesive protective film collecting rotating shaft are sequentially and rotationally connected to the fixing frame, and a protective film is adhered to the lower side of the thermosetting adhesive. A traditional copper-clad plate is replaced by the foil and the insulating base material, a traditional chemical etching circuit is replaced by processing the circuit on the foil through a hob, and the circuit and the base material are attached through a heating rolling method, so that a circuit pattern is made through a copper foil or aluminum foil material through the technological method; and then, the substrate is coated with the printed circuit board, so that chemical etching processing is avoided, the limitation of circuit board processing on sites and matched environmental protection equipment is reduced to the minimum, meanwhile, chemical emission is reduced to the maximum extent, the cost is saved, and the pollution to the environment is reduced.

Description

Technical Field

[0001] This invention relates to the field of single-layer circuit board manufacturing technology, specifically to a single-layer circuit board manufacturing equipment and manufacturing method. Background Technology

[0002] A single-layer circuit board has only one conductive layer, which is usually composed of a substrate, copper foil and silkscreen layer. Traditional single-layer circuit boards usually use a single-sided copper-clad laminate as the substrate, which is pre-cut into a sheet and then made into the required circuit pattern by chemical etching and other methods.

[0003] However, traditional methods for manufacturing single-layer circuit boards using chemical etching and other processes require a large amount of chemicals and supporting environmental protection equipment. This necessitates a large space to accommodate both the equipment and the etching process. The etching process, by dissolving excess copper foil to form circuits, leads to copper waste (only about 20-50% of the copper-clad area is retained). The etching solution needs frequent replacement or regeneration, resulting in continuous investment in chemicals. Furthermore, waste liquid recycling technology is complex, and the manufacturing process is extremely cumbersome, requiring multiple steps such as copper-clad laminate cutting, photoresist coating, exposure and development, etching, cleaning, drilling, and solder mask / screen printing. This process is time-consuming and requires large equipment such as chemical etching tanks, cleaning lines, and waste liquid storage pools, occupying a large area and restricting production line flexibility. Therefore, our company has proposed a roll-to-roll continuous and rapid production method for single-layer circuit boards that reduces the process flow and saves labor time. Summary of the Invention

[0004] The purpose of this invention is to provide a single-layer circuit board manufacturing equipment and manufacturing method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a single-layer circuit board production equipment, including a workbench, a fixed frame fixedly connected to the upper side of the workbench, and a thermosetting adhesive feeding shaft, a metal foil feeding shaft, a waste discharge micro-adhesive film feeding shaft, a waste collection shaft, and a thermosetting adhesive protective film collection shaft sequentially rotatably connected to the fixed frame. A protective film is adhered to the lower side of the thermosetting adhesive. The protective film is guided by a set of spare shafts behind the thermosetting adhesive protective film collection shaft and fixedly connected to the thermosetting adhesive protective film collection shaft. At the same time, a fourth motor is started, which drives the thermosetting adhesive protective film collection shaft to rotate, thereby separating the protective film from the thermosetting adhesive. The fixed frame is also rotatably connected to evenly distributed spare shafts; The upper side of the workbench is also sequentially and fixedly connected to a roller cutter assembly, an automatic feeding mechanism, a preheating and pressing assembly, a cutting assembly, and multiple sets of hot pressing assemblies, and multiple sets of transmission shaft assemblies are interspersed among the roller cutter assembly, the automatic feeding mechanism, the preheating and pressing assembly, the cutting assembly, and the multiple sets of hot pressing assemblies.

[0006] Before fabricating the single-layer circuit board, rolls of thermosetting adhesive are mounted on thermosetting adhesive feeding spools, rolls of metal foil are mounted on metal foil feeding spools, and rolls of micro-adhesive film are mounted on waste discharge micro-adhesive film feeding spools. Then, the thermosetting adhesive is pulled out from the thermosetting adhesive feeding spools, the metal foil is pulled out from the metal foil feeding spools, and the micro-adhesive film is pulled out from the waste discharge micro-adhesive film feeding spools. The thermosetting adhesive is passed between multiple sets of transmission spools, and the metal foil is also passed between multiple sets of transmission spools, so that the metal foil covers the top of the thermosetting adhesive. The metal foil and thermosetting adhesive are guided by multiple sets of transmission spools. The automatic feeding mechanism includes a rigid substrate; The thermosetting adhesive and metal foil are respectively led out by the thermosetting adhesive feeding shaft and the metal foil feeding shaft, and then guided by the conveyor shaft assembly to be die-cut by the roller cutter assembly. The waste micro-adhesive film feeding shaft leads out the waste micro-adhesive film, which is then guided by the conveyor assembly to adhere the die-cutting waste and collected by the waste collection shaft. The thermosetting adhesive protective film is collected by the thermosetting adhesive protective film collection shaft. The die-cut metal foil circuit, thermosetting adhesive, and rigid board substrate are quickly hot-pressed into shape by the preheating pressing assembly and the hot pressing assembly, and then cut by the cutting assembly to obtain the circuit board.

[0007] Furthermore, the transmission shaft assembly includes a support plate, a transmission shaft, and an adjusting component. Multiple sets of support plates are fixedly installed on the upper side of the worktable, and two sets of transmission shafts are arranged between two sets of support plates on opposite sides. An adjusting component is fixedly connected to the outer side of one set of support plates. Motor 4 and Motor 6 are fixedly installed on the back of the fixing frame. The output end of Motor 4 is fixedly connected to one end of the thermosetting adhesive protective film collecting shaft, and the output end of Motor 6 is fixedly connected to one end of the waste collecting shaft.

[0008] Furthermore, the adjusting component includes a track housing, a motor, a lead screw, and a moving block. The track housing is fixedly connected to the outer side of the set of support plates, and the motor is fixedly connected to the upper side of the track housing. The output end of the motor is fixedly connected to the lead screw. The lead screw has two opposite threads, and the moving block is threadedly connected to them. The moving block is rotatably connected to the transmission shaft. The two sets of moving blocks slide synchronously closer or synchronously farther away on the inner side of the track housing.

[0009] Furthermore, the hobbing cutter assembly includes a hobbing cutter and a hobbing cutter auxiliary shaft. The upper side of the worktable is provided with the hobbing cutter auxiliary shaft, and the upper side of the hobbing cutter auxiliary shaft is provided with the hobbing cutter. The preheating and pressing assembly includes a preheating and pressing rotating shaft one and a preheating and pressing rotating shaft two. The preheating and pressing rotating shaft one is located on the upper side of the worktable and near the automatic feeding mechanism, and the preheating and pressing rotating shaft two is located on the upper side of the preheating and pressing rotating shaft one. The hot pressing assembly includes a hot pressing shaft one and a hot pressing shaft two. The hot pressing shaft two is located on the upper side of the worktable and near the cutting blade assembly, and the hot pressing shaft one is located on the upper side of the hot pressing shaft two.

[0010] Furthermore, the hobbing cutter assembly, the preheating pressing assembly, and the hot pressing assembly are all connected to driving components. The driving components include a helical gear one, a motor five, a spur gear one, a spur gear two, a mounting platform, and a helical gear two. Multiple mounting platforms are fixedly connected to the upper side of the worktable. The side of the helical gear one closest to the fixed frame is fixedly connected to the motor five. The output end of the motor five is fixedly connected to the helical gear one. The lower side of the helical gear one meshes with the helical gear two. The end of the helical gear two away from the motor five is fixedly connected to the spur gear two through a connecting shaft. The upper side of the spur gear two meshes with the spur gear one. The hobbing cutter, the preheating and pressing shaft II, the hot pressing shaft I and their corresponding spur gear I are fixedly connected, and their corresponding mounting platforms are rotatably connected. The hobbing cutter auxiliary shaft, the preheating and pressing shaft one, and the hot pressing shaft two are fixedly connected to their corresponding hobbing cutter auxiliary shafts, and are rotatably connected to their corresponding mounting platforms.

[0011] The integral roll of metal foil coated on thermosetting adhesive is guided by the transmission shaft to the roller cutter assembly. At the same time, the drive unit of the roller cutter assembly is activated. The motor five of the roller cutter assembly drives the first helical gear to rotate. The first helical gear meshes with the second helical gear to rotate. The second helical gear drives the second spur gear fixed to it to rotate synchronously through the connecting shaft. The second spur gear meshes with the first spur gear on the upper side to rotate, so that the second spur gear drives the roller cutter auxiliary shaft to rotate. The first spur gear drives the roller cutter to rotate, so that the roller cutter and the roller cutter auxiliary shaft rotate simultaneously to die-cut the required circuit pattern on the metal foil. The micro-adhesive film is inserted from the rear side of the roller assembly into the space between the conveyor shafts and covered on the metal foil that has been die-cut by the roller assembly. The other end of the micro-adhesive film is fixedly connected to the waste collection shaft. The motor is started and the motor drives the waste collection shaft to rotate, so that the moving micro-adhesive film adheres to and carries away other die-cut waste materials and rolls them up onto the waste collection shaft. Furthermore, the automatic feeding mechanism includes a feeding body, a displacement component, an adsorption component, and a conveying component. The feeding body is fixedly connected to the upper side of the worktable, the displacement component is fixedly connected to the outer side of the feeding body, the adsorption component is provided on the upper side of the feeding body, and the conveying component is fixedly connected to the side of the feeding body near the fixed frame.

[0012] Furthermore, the feeding body also includes a feeding shell and a feeding rack. The feeding shell is fixedly connected to the upper side of the workbench, and the feeding rack is fixedly connected to the inner side of the feeding shell. Hardboard substrates are stacked on the inner side of the feeding rack. After transportation, the rigid substrate is guided by the rear transmission shaft and comes into contact with the thermosetting adhesive. This allows the three layers—the upper layer of die-cut metal foil forming the circuit pattern, the middle layer of thermosetting adhesive, and the lower layer of rigid substrate—to pass through a preheating and pressing assembly. A drive unit rotates preheating and pressing shafts one and two. Both preheating and pressing shafts one and two are equipped with evenly distributed electric heating elements, which heat the shafts to a specific temperature. At around 100 degrees Celsius, the metal foil, the middle layer of thermosetting adhesive, and the lower layer of rigid substrate are preheated and pressed. After preheating and pressing, the metal foil, the middle layer of thermosetting adhesive, and the lower layer of rigid substrate enter multiple sets of hot pressing components. The driving component drives the first and second hot pressing shafts to rotate. The first and second hot pressing shafts are also equipped with evenly distributed electric heating tubes inside, which raise the temperature of the first and second hot pressing shafts to around 165 degrees Celsius and perform multiple hot pressing operations. The displacement assembly includes a guide rail, a motor, a track housing, a lead screw, and a motion frame. The guide rail is fixedly connected to the upper side of the feeding housing, and the track housing is fixedly connected to the outer side of the feeding housing. The motor is fixedly connected to one side of the track housing, and the lead screw is fixedly connected to the output end of the motor. The other end of the lead screw is rotatably connected to the inner wall of the track housing. The motion frame is threadedly connected to the outer side of the lead screw, and the motion frame slides on the inner side of the track housing.

[0013] Motor 2 drives screw 2 to rotate. While screw 2 rotates, it drives the motion frame to move linearly along track housing 2. The motion frame drives the adsorption component to slide linearly on guide rail 1, thereby moving the suction cup to the corresponding position on the feeding rack. The lifting cylinder is then activated, which drives the bearing plate 2 and mounting plate to move upward, thereby driving the connecting plate to move upward synchronously. Then, the suction cup comes into contact with the hard plate substrate inside the feeding rack. Since the upper side of the air collecting block is connected to an external air extraction device through a pipe, air is extracted from the suction cup, thereby adsorbing the hard plate substrate. The hard plate substrate is then moved to the upper side of the conveying shaft. The lifting cylinder is then activated, which drives the hard plate substrate to move downward and place it on the conveying shaft. At this time, motor 3 is activated, which drives the conveying shaft to rotate. Through the transmission of the belt, multiple sets of conveying shafts are driven to rotate, thereby continuously transporting the hard plate substrate backward. Furthermore, the adsorption assembly includes a first support plate, a connecting plate, a second support plate, a mounting plate, a gas collecting block, support rods, a suction cup, a lifting cylinder, and a sliding block. A sliding block is slidably connected to the upper side of the first guide rail. The first support plate is fixedly connected to the upper side of the sliding block. A lifting cylinder is fixedly connected to the upper side of the first support plate. The second support plate is fixedly connected to the upper output end of the lifting cylinder. A mounting plate is fixedly connected to the upper side of the second support plate. A connecting plate is provided between adjacent first support plates. The connecting plate and the mounting plate are fixedly connected. A gas collecting block is fixedly connected to the upper side of the connecting plate. Two sets of support rods are fixedly connected to the lower side of the connecting plate. A suction cup is fixedly connected to the inner side of the support rod. The suction cup and the gas collecting block are connected through a flexible hose. The conveying assembly includes a protective plate, a third motor, a conveying shaft, a belt, and a baffle. Two sets of protective plates are provided on the side of the loading housing near the fixed frame. One set of protective plates is fixedly connected to the loading housing. A conveying shaft is rotatably connected between the two sets of protective plates. A third motor is fixedly connected to the outer side of the set of protective plates away from the loading housing. The output end of the third motor is fixedly connected to a set of conveying shafts. Adjacent conveying shafts are driven by belts. A baffle is fixedly connected to the set of protective plates away from the loading housing, and the conveying shaft passes through the baffle.

[0014] Furthermore, the cutting blade assembly includes a mounting plate, a cutting blade fixing plate, a second guide rail, an upper moving plate, an upper cutting blade, a lower moving plate, a lower cutting blade, and a push cylinder. The mounting plate is fixedly connected to the upper side of the worktable, and the cutting blade fixing plate is fixedly connected to the upper side of the mounting plate. The second guide rail is fixedly connected to the cutting blade fixing plate, and the upper moving plate and the lower moving plate are slidably connected to the outer side of the second guide rail. The upper cutting blade is fixedly connected to the lower side of the upper moving plate, and the lower cutting blade is fixedly connected to the upper side of the lower moving plate. Push cylinders are fixedly connected to both the upper and lower sides of the cutting blade fixing plate, and the output ends of the push cylinders on the upper and lower sides are fixedly connected to the upper moving plate and the lower moving plate, respectively.

[0015] After the semi-finished circuit board is hot-pressed, the push cylinder is activated, which drives the lower and upper moving plates to move close to each other on the guide rail, thereby driving the upper and lower cutting blades to cut the metal foil and the middle layer of thermosetting adhesive on the front side of the semi-finished circuit board. The semi-finished circuit board is transferred to the next process via the rear conveyor shaft. After being baked in an external oven at a certain temperature set according to the material characteristics, it can be processed into solder resist, surface treatment, shape processing and other subsequent processes according to traditional production technology.

[0016] A method for producing a single-layer circuit board using a manufacturing equipment includes the following steps: S1. The thermosetting adhesive and metal foil are guided and pulled by the transmission shaft so that the metal foil is covered on the thermosetting adhesive. S2. Use a roller cutter to die-cut the metal foil into the required circuit pattern; S3. The waste material after die-cutting is carried away by the micro-adhesive membrane and collected by the waste discharge micro-adhesive membrane discharge shaft. The thermosetting adhesive protective film collection shaft collects the thermosetting adhesive protective film. S4. The rigid substrate is automatically fed by the automatic feeding mechanism and transported to the underside of the thermosetting adhesive. S5. The metal foil circuit, thermosetting adhesive, and rigid board substrate are quickly pressed together by the preheating pressing component and the hot pressing component.

[0017] Compared with the prior art, the present invention provides a single-layer circuit board manufacturing equipment and manufacturing method, which has the following beneficial effects: 1. This invention achieves automated, continuous, and simplified production of single-layer circuit boards through the coordinated action of the thermosetting adhesive feeding shaft, the metal foil feeding shaft, the waste collection shaft, the thermosetting adhesive protective film collection shaft, the spare shaft, the transmission shaft assembly, the automatic feeding mechanism, the roller cutter assembly, the preheating pressing assembly, the hot pressing assembly, and the cutting blade assembly, thus achieving the effect of high-efficiency production.

[0018] 2. This invention replaces traditional copper-clad laminates with foil and an insulating substrate, uses a rolling cutter to process circuits on the foil instead of traditional chemical etching, and employs a heated rolling method to bond the circuits to the substrate. This process allows circuit patterns to be created using copper or aluminum foil through the above-mentioned process and then laminated onto the substrate, thus avoiding chemical etching. This minimizes the limitations of circuit board processing on site and supporting environmental protection equipment, while also minimizing chemical emissions, saving costs, reducing environmental pollution, reducing equipment investment, lowering processing site costs, enabling continuous and rapid roll-to-roll production, streamlining the process, saving labor hours, reducing industrial wastewater discharge, and protecting the natural environment. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 For the present invention Figure 1 Enlarged view of point A in the middle; Figure 3 This is a three-dimensional structural schematic diagram of the present invention from another angle; Figure 4 For the present invention Figure 3 Enlarged view of point B in the middle; Figure 5 This is a schematic diagram of the planar structure of the present invention; Figure 6 This is a schematic diagram illustrating the fabrication process of the present invention; Figure 7 This is a three-dimensional structural schematic diagram of the driving component of the present invention; Figure 8 This is a three-dimensional structural diagram of the preheating pressing assembly and the hot pressing assembly of the present invention; Figure 9 This is a three-dimensional structural schematic diagram of the adjusting component of the present invention; Figure 10 This is a three-dimensional structural schematic diagram of the cutting blade assembly of the present invention; Figure 11 This is a three-dimensional structural diagram of the automatic feeding mechanism of the present invention; Figure 12 This is an exploded three-dimensional structural diagram of the automatic feeding mechanism of the present invention; Figure 13 For the present invention Figure 12 Enlarged diagram of point C in the middle.

[0020] In the diagram: 1. Workbench; 2. Thermosetting adhesive feeding shaft; 3. Metal foil feeding shaft; 4. Waste collection shaft; 5. Thermosetting adhesive protective film collection shaft; 6. Spare shaft; 7. Transmission shaft assembly; 71. Support plate; 72. Transmission shaft; 73. Adjusting component; 731. Track housing one; 732. Motor one; 733. Lead screw one; 734. Moving block; 8. Automatic feeding mechanism; 81. Feeding body; 811. Feeding housing; 812. Feeding... Material rack; 813. Hardboard substrate; 82. Displacement assembly; 821. Guide rail one; 822. Motor two; 823. Track housing two; 824. Lead screw two; 825. Motion frame; 83. Adsorption assembly; 831. Bearing plate one; 832. Connecting plate; 833. Bearing plate two; 834. Mounting plate; 835. Air collection block; 836. Support rod; 837. Suction cup; 838. Lifting cylinder; 839. Sliding rod block; 84. Conveying assembly; 84 1. Protective plate; 842. Motor 3; 843. Conveying shaft; 844. Belt; 845. Baffle; 9. Hob assembly; 91. Hob; 92. Hob auxiliary shaft; 10. Preheating press assembly; 1001. Preheating press shaft 1; 1002. Preheating press shaft 2; 11. Hot press assembly; 1101. Hot press shaft 1; 1102. Hot press shaft 2; 12. Fixing frame; 13. Cutting knife assembly; 1301. Mounting support plate; 1302. Cutting... 1303. Blade fixing plate; 1304. Guide rail 2; 1305. Upper motion plate; 1306. Upper cutting blade; 1307. Lower motion plate; 1308. Lower cutting blade; 1309. Push cylinder; 14. Motor 4; 15. Drive component; 1501. Helical gear 1; 1502. Motor 5; 1503. Spur gear 1; 1504. Spur gear 2; 1505. Mounting platform; 1506. Helical gear 2; 16. Waste discharge micro-adhesive film feeding shaft; 17. Motor 6. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Example

[0023] Please see Figures 1-13 A single-layer circuit board production equipment includes a workbench 1, a fixed frame 12 fixedly connected to the upper side of the workbench 1, and a thermosetting adhesive feeding shaft 2, a metal foil feeding shaft 3, a waste discharge micro-adhesive film feeding shaft 16, a waste collection shaft 4, and a thermosetting adhesive protective film collection shaft 5 rotatably connected in sequence on the fixed frame 12. A protective film is adhered to the lower side of the thermosetting adhesive. The protective film is guided by a set of spare shafts 6 behind the thermosetting adhesive protective film collection shaft 5 and fixedly connected to the thermosetting adhesive protective film collection shaft 5. At the same time, a motor 14 is started, which drives the thermosetting adhesive protective film collection shaft 5 to rotate, thereby separating the protective film from the thermosetting adhesive. The fixed frame 12 is also rotatably connected to evenly distributed spare rotating shafts 6; On the upper side of the workbench 1, a roller cutter assembly 9, an automatic feeding mechanism 8, a preheating and pressing assembly 10, a cutting blade assembly 13, and multiple sets of hot pressing assemblies 11 are also fixedly connected in sequence. Multiple sets of transmission shaft assemblies 7 are interspersed among the roller cutter assembly 9, the automatic feeding mechanism 8, the preheating and pressing assembly 10, the cutting blade assembly 13, and the multiple sets of hot pressing assemblies 11.

[0024] Before fabricating a single-layer circuit board, rolls of thermosetting adhesive are mounted on thermosetting adhesive feeding shaft 2, rolls of metal foil are mounted on metal foil feeding shaft 3, and rolls of micro-adhesive film are mounted on waste discharge micro-adhesive film feeding shaft 16. Then, the thermosetting adhesive is pulled out from the thermosetting adhesive feeding shaft 2, the metal foil is pulled out from the metal foil feeding shaft 3, and the micro-adhesive film is pulled out from the waste discharge micro-adhesive film feeding shaft 16. The thermosetting adhesive is passed between multiple sets of transmission shafts 72, and the metal foil is also passed between multiple sets of transmission shafts 72, so that the metal foil covers the top of the thermosetting adhesive. The multiple sets of transmission shafts 72 guide the metal foil and the thermosetting adhesive. The automatic feeding mechanism 8 includes a rigid substrate 813; Thermosetting adhesive and metal foil are drawn out by thermosetting adhesive feeding spindle 2 and metal foil feeding spindle 3 respectively, and guided by conveyor spindle assembly 7 and die-cut by roller cutter assembly 9. Waste discharge micro-adhesive film is drawn out by waste discharge micro-adhesive film feeding spindle 16, and collected by waste collection spindle 4 after being guided by conveyor spindle assembly 7. Thermosetting adhesive protective film is collected by thermosetting adhesive protective film collection spindle 5. The die-cut metal foil circuit, thermosetting adhesive and rigid board substrate 813 are quickly hot-pressed into shape by preheating pressing assembly 10 and hot pressing assembly 11, and then cut by cutting assembly 13 to obtain circuit board.

[0025] Furthermore, the transmission shaft assembly 7 includes a support plate 71, a transmission shaft 72, and an adjusting member 73. Multiple sets of support plates 71 are fixedly installed on the upper side of the workbench 1. Two sets of transmission shafts 72 are arranged between two sets of support plates 71 on opposite sides, and an adjusting member 73 is fixedly connected to the outer side of one set of support plates 71. Motor 4 14 and Motor 6 17 are fixedly installed on the back of the mounting bracket 12. The output end of Motor 4 14 is fixedly connected to one end of the thermosetting adhesive protective film collecting shaft 5, and the output end of Motor 6 17 is fixedly connected to one end of the waste collecting shaft 4.

[0026] Furthermore, the adjusting component 73 includes a track housing 731, a motor 732, a lead screw 733, and a moving block 734. The track housing 731 is fixedly connected to the outer side of a set of support plates 71, and the motor 732 is fixedly connected to the upper side of the track housing 731. The lead screw 733 is fixedly connected to the output end of the motor 732. The lead screw 733 is provided with two opposite threads, and the moving block 734 is threadedly connected to it. The moving block 734 is rotatably connected to the transmission shaft 72. The two sets of moving blocks 734 slide synchronously closer or synchronously farther away on the inner side of the track housing 731.

[0027] Furthermore, the hobbing cutter assembly 9 includes a hobbing cutter 91 and a hobbing cutter auxiliary shaft 92. The hobbing cutter auxiliary shaft 92 is provided on the upper side of the worktable 1, and the hobbing cutter 91 is provided on the upper side of the hobbing cutter auxiliary shaft 92. The preheating and pressing assembly 10 includes a first preheating and pressing rotating shaft 1001 and a second preheating and pressing rotating shaft 1002. The first preheating and pressing rotating shaft 1001 is located on the upper side of the workbench 1 and near the automatic feeding mechanism 8. The second preheating and pressing rotating shaft 1002 is located on the upper side of the first preheating and pressing rotating shaft 1001. The hot pressing assembly 11 includes a hot pressing rotating shaft 1101 and a hot pressing rotating shaft 1102. The hot pressing rotating shaft 1102 is located on the upper side of the worktable 1 and near the cutting blade assembly 13. The hot pressing rotating shaft 1101 is located on the upper side of the hot pressing rotating shaft 1102.

[0028] Furthermore, the hobbing cutter assembly 9, the preheating pressing assembly 10, and the hot pressing assembly 11 are all connected to a drive unit 15. The drive unit 15 includes a helical gear 1501, a motor 5 1502, a spur gear 1503, a spur gear 2 1504, a mounting platform 1505, and a helical gear 2 1506. Multiple mounting platforms 1505 are fixedly connected to the upper side of the worktable 1. The side of the helical gear 1501 near the fixed frame 12 is fixedly connected to the motor 5 1502. The output end of the motor 5 1502 is fixedly connected to the helical gear 1501. The lower side of the helical gear 1501 meshes with the helical gear 2 1506. The end of the helical gear 2 1506 away from the motor 5 1502 is fixedly connected to the spur gear 2 1504 through a connecting shaft. The upper side of the spur gear 2 1504 meshes with the spur gear 1503. The hobbing cutter 91, the preheating and pressing shaft 1002, the hot pressing shaft 1101 and their corresponding spur gear 1503 are fixedly connected, and their corresponding mounting platform 1505 is rotatably connected. The hobbing cutter auxiliary shaft 92, the preheating and pressing shaft 1001, and the hot pressing shaft 2 1102 are fixedly connected to their corresponding hobbing cutter auxiliary shaft 92, and are rotatably connected to their corresponding mounting platform 1505.

[0029] The integral roll of metal foil coated on thermosetting adhesive is guided by the transmission shaft 72 and introduced into the roller cutter assembly 9. At the same time, the drive component 15 of the roller cutter assembly 9 is activated. The motor 1502 of the roller cutter assembly 9 drives the helical gear 1501 to rotate. The helical gear 1501 meshes and drives the helical gear 2 1506 to rotate. The helical gear 2 1506 drives the spur gear 2 1504 fixedly connected to it to rotate synchronously through the connecting shaft. The spur gear 2 1504 meshes and drives the upper spur gear 1503 to rotate. This causes the spur gear 2 1504 to drive the roller cutter auxiliary shaft 92 to rotate. The spur gear 1503 drives the roller cutter 91 to rotate. As the roller cutter 91 and the roller cutter auxiliary shaft 92 rotate, the required circuit pattern is die-cut on the metal foil. The micro-adhesive film is inserted from the rear side of the roller assembly 9 into the transmission shaft 72 and covered on the metal foil after being die-cut by the roller assembly 9. The other end of the micro-adhesive film is fixedly connected to the waste collection shaft 4. The motor 6 17 is started, and the motor 6 17 drives the waste collection shaft 4 to rotate, so that the moving micro-adhesive film adheres to and carries away other waste materials after die-cutting, and is wound up onto the waste collection shaft 4. Furthermore, the automatic feeding mechanism 8 includes a feeding body 81, a displacement component 82, an adsorption component 83, and a conveying component 84. The feeding body 81 is fixedly connected to the upper side of the workbench 1, the displacement component 82 is fixedly connected to the outer side of the feeding body 81, the adsorption component 83 is provided on the upper side of the feeding body 81, and the conveying component 84 is fixedly connected to the side of the feeding body 81 near the fixed frame 12.

[0030] Furthermore, the feeding body 81 also includes a feeding shell 811 and a feeding rack 812. The feeding shell 811 is fixedly connected to the upper side of the workbench 1, and the feeding rack 812 is fixedly connected to the inner side of the feeding shell 811. Hard board substrate 813 is stacked on the inner side of the feeding rack 812. After transportation, the rigid substrate 813 is guided by the rear transmission shaft 72 and comes into contact with the thermosetting adhesive. This allows the three layers—the upper layer of die-cut metal foil forming the circuit pattern, the middle layer of thermosetting adhesive, and the lower layer of rigid substrate 813—to pass through the preheating and pressing assembly 10. The drive component 15 rotates the preheating and pressing shafts 1001 and 1002. The preheating and pressing shafts 1001 and 1002 are equipped with evenly distributed electric heating tubes, which heat the preheating and pressing shafts 1001 and 1002. The temperature is raised to around 100 degrees Celsius, and then the metal foil, the middle layer thermosetting adhesive, and the lower rigid substrate 813 are preheated and pressed. After preheating and pressing, the metal foil, the middle layer thermosetting adhesive, and the lower rigid substrate 813 are put into multiple sets of hot pressing components 11. The hot pressing shaft 1101 and the hot pressing shaft 2102 are driven to rotate by the driving component 15. The hot pressing shaft 1101 and the hot pressing shaft 2102 are also equipped with evenly distributed electric heating tubes to raise the temperature of the hot pressing shaft 1101 and the hot pressing shaft 2102 to around 165 degrees Celsius and perform multiple hot pressing. The displacement assembly 82 includes a guide rail 821, a motor 822, a track housing 823, a lead screw 824, and a motion frame 825. The guide rail 821 is fixedly connected to the upper side of the loading housing 811, and the track housing 823 is fixedly connected to the outer side of the loading housing 811. The motor 822 is fixedly connected to one side of the track housing 823, and the lead screw 824 is fixedly connected to the output end of the motor 822. The other end of the lead screw 824 is rotatably connected to the inner wall of the track housing 823. The motion frame 825 is threadedly connected to the outer side of the lead screw 824, and the motion frame 825 slides on the inner side of the track housing 823.

[0031] Motor 822 drives lead screw 824 to rotate. Simultaneously, lead screw 824 drives motion frame 825 to move linearly along track housing 823. Motion frame 825 drives adsorption component 83 to slide linearly on guide rail 821, thereby moving suction cup 837 to the corresponding position on discharge rack 812. This activates lifting cylinder 838, which moves bearing plate 833 and mounting plate 834 upwards, simultaneously moving connecting plate 832 upwards. Then, suction cup 837 contacts the hard substrate 813 inside discharge rack 812. Due to the air collection block 835... The upper side is connected to an external air extraction device through a pipe, which allows air to be extracted from the suction cup 837, thereby adsorbing the rigid substrate 813. Then, the rigid substrate 813 is moved to the upper side corresponding to the transport shaft 843. Then, the lifting cylinder 838 is controlled to move the rigid substrate 813 downward and place it on the transport shaft 843. At this time, the motor 842 is started, and the motor 842 drives the transport shaft 843 to rotate. Through the transmission action of the belt 844, multiple sets of transport shafts 843 are driven to rotate, thereby continuously transporting the rigid substrate 813 backward. Furthermore, the adsorption assembly 83 includes a first support plate 831, a connecting plate 832, a second support plate 833, a mounting plate 834, an air collecting block 835, a support rod 836, a suction cup 837, a lifting cylinder 838, and a sliding block 839. The sliding block 839 is slidably connected to the upper side of the first guide rail 821, and the first support plate 831 is fixedly connected to the upper side of the sliding block 839. The lifting cylinder 838 is fixedly connected to the upper side of the first support plate 831, and the upper output end of the lifting cylinder 838... A second bearing plate 833 is fixedly connected, and an mounting plate 834 is fixedly connected to the upper side of the second bearing plate 833. A connecting plate 832 is provided between adjacent first bearing plates 831. The connecting plate 832 and the mounting plate 834 are fixedly connected. An air collecting block 835 is fixedly connected to the upper side of the connecting plate 832. Two sets of support rods 836 are fixedly connected to the lower side of the connecting plate 832. A suction cup 837 is fixedly connected to the inner side of the support rod 836. The suction cup 837 and the air collecting block 835 are connected through a hose. The conveying assembly 84 includes a protective plate 841, a motor 842, a conveying shaft 843, a belt 844, and a baffle 845. Two sets of protective plates 841 are provided on the side of the loading housing 811 near the fixed frame 12. One set of protective plates 841 is fixedly connected to the loading housing 811. The two sets of protective plates 841 are rotatably connected to the evenly distributed conveying shafts 843. The motor 842 is fixedly connected to the outer side of the set of protective plates 841 away from the loading housing 811. The output end of the motor 842 is fixedly connected to the set of conveying shafts 843. Adjacent conveying shafts 843 are driven by belts 844. A baffle 845 is fixedly connected to the set of protective plates 841 away from the loading housing 811. The conveying shaft 843 passes through the baffle 845.

[0032] Furthermore, the cutting blade assembly 13 includes a mounting plate 1301, a cutting blade fixing plate 1302, a second guide rail 1303, an upper motion plate 1304, an upper cutting blade 1305, a lower motion plate 1306, a lower cutting blade 1307, and a push cylinder 1308. The mounting plate 1301 is fixedly connected to the upper side of the worktable 1, the cutting blade fixing plate 1302 is fixedly connected to the upper side of the mounting plate 1301, and the second guide rail 1303 is fixedly connected to the cutting blade fixing plate 1302. The outer side of the guide rail 1303 is slidably connected to an upper moving plate 1304 and a lower moving plate 1306. An upper cutting blade 1305 is fixedly connected to the lower side of the upper moving plate 1304, and a lower cutting blade 1307 is fixedly connected to the upper side of the lower moving plate 1306. Push cylinders 1308 are fixedly connected to both the upper and lower sides of the cutting blade fixing plate 1302. The output ends of the push cylinders 1308 on the upper and lower sides are fixedly connected to the upper moving plate 1304 and the lower moving plate 1306, respectively.

[0033] After the semi-finished circuit board is hot-pressed, the cylinder 1308 is activated, which drives the lower moving plate 1306 and the upper moving plate 1304 to move close to each other on the guide rail 1303, thereby driving the upper cutting blade 1305 and the lower cutting blade 1307 to cut the metal foil and the middle layer of thermosetting adhesive on the front side of the semi-finished circuit board. The semi-finished circuit board is transferred to the next process via the rear transmission shaft 72. After being baked in an external oven at a certain temperature set according to the material characteristics, it can be processed by traditional production processes such as solder resist, surface treatment, and shape processing.

[0034] A method for producing a single-layer circuit board using a manufacturing equipment includes the following steps: S1. The thermosetting adhesive and metal foil are guided and pulled by the transmission shaft 72 so that the metal foil is covered on the thermosetting adhesive. S2. Use the roller cutter 91 to die-cut the metal foil into the required circuit pattern; S3. The waste material after die-cutting is carried away by the micro-adhesive membrane and collected by the waste discharge micro-adhesive membrane discharge shaft 16. The thermosetting adhesive protective film collection shaft 5 collects the thermosetting adhesive protective film. S4. The rigid substrate 813 is automatically fed by the automatic feeding mechanism 8 and transported to the underside of the thermosetting adhesive. S5. The metal foil circuit, thermosetting adhesive, and rigid board substrate 813 are quickly pressed together by the preheating pressing assembly 10 and the hot pressing assembly 11.

[0035] The specific usage and function of this embodiment are as follows: Before fabricating a single-layer circuit board, rolls of thermosetting adhesive are mounted on thermosetting adhesive feeding shaft 2, rolls of metal foil are mounted on metal foil feeding shaft 3, and rolls of micro-adhesive film are mounted on waste discharge micro-adhesive film feeding shaft 16. Then, the thermosetting adhesive is pulled out from the thermosetting adhesive feeding shaft 2, the metal foil is pulled out from the metal foil feeding shaft 3, and the micro-adhesive film is pulled out from the waste discharge micro-adhesive film feeding shaft 16. The thermosetting adhesive is passed between multiple sets of transmission shafts 72, and the metal foil is also passed between multiple sets of transmission shafts 72, so that the metal foil covers the top of the thermosetting adhesive. The multiple sets of transmission shafts 72 guide the metal foil and the thermosetting adhesive. The substrate insulation material can be in roll form, such as PI, PET, PVC, or FR4. The thermosetting adhesive can be PI, PP, or other materials. The foil can be copper foil or aluminum foil.

[0036] The integral roll of metal foil coated on thermosetting adhesive is guided by the transmission shaft 72 and introduced into the roller cutter assembly 9. At the same time, the drive component 15 of the roller cutter assembly 9 is activated. The motor 1502 of the roller cutter assembly 9 drives the helical gear 1501 to rotate. The helical gear 1501 meshes and drives the helical gear 2 1506 to rotate. The helical gear 2 1506 drives the spur gear 2 1504 fixedly connected to it to rotate synchronously through the connecting shaft. The spur gear 2 1504 meshes and drives the upper spur gear 1503 to rotate. This causes the spur gear 2 1504 to drive the roller cutter auxiliary shaft 92 to rotate. The spur gear 1503 drives the roller cutter 91 to rotate. As the roller cutter 91 and the roller cutter auxiliary shaft 92 rotate, the required circuit pattern is die-cut on the metal foil. The micro-adhesive film is inserted from the rear side of the roller assembly 9 into the transmission shaft 72 and covered on the metal foil after being die-cut by the roller assembly 9. The other end of the micro-adhesive film is fixedly connected to the waste collection shaft 4. The motor 6 17 is started, and the motor 6 17 drives the waste collection shaft 4 to rotate, so that the moving micro-adhesive film adheres to and carries away other waste materials after die-cutting, and is wound up onto the waste collection shaft 4. A protective film is adhered to the underside of the thermosetting adhesive. The protective film is guided by a set of spare shafts 6 behind the thermosetting adhesive protective film collecting shaft 5 and fixedly connected to the thermosetting adhesive protective film collecting shaft 5. At the same time, the motor 4 14 is started, and the motor 4 14 drives the thermosetting adhesive protective film collecting shaft 5 to rotate, thereby separating the protective film from the thermosetting adhesive. The metal foil collected from waste and the thermosetting adhesive after separating the protective film are guided by a set of spare rotating shafts 6 on the rear side, and pass between multiple sets of transmission rotating shafts 72 on the rear side. The second motor 822 is started, which drives the second lead screw 824 to rotate. Simultaneously, the lead screw 824 drives the motion frame 825 to move linearly along the second track housing 823. The motion frame 825 drives the adsorption component 83 to slide linearly on the first guide rail 821, thereby moving the suction cup 837 to the corresponding position on the unloading rack 812. The lifting cylinder 838 is then activated, causing the second bearing plate 833 and the mounting plate 834 to move upwards, which in turn drives the connecting plate 832 to move upwards synchronously. This causes the suction cup 837 to contact the hard substrate 813 inside the unloading rack 812. The upper side of the air block 835 is connected to an external air extraction device through a pipe, which allows air to be extracted from the suction cup 837, thereby adsorbing the rigid substrate 813. Then, the rigid substrate 813 is moved to the upper side corresponding to the transport shaft 843. Then, the lifting cylinder 838 is controlled to move the rigid substrate 813 downward and place it on the transport shaft 843. At this time, the motor 842 is started, and the motor 842 drives the transport shaft 843 to rotate. Through the transmission action of the belt 844, multiple sets of transport shafts 843 are driven to rotate, thereby continuously transporting the rigid substrate 813 backward. After transportation, the rigid substrate 813 is guided by the rear transmission shaft 72 and comes into contact with the thermosetting adhesive. This allows the three layers—the upper layer of die-cut metal foil forming the circuit pattern, the middle layer of thermosetting adhesive, and the lower layer of rigid substrate 813—to pass through the preheating and pressing assembly 10. The drive component 15 rotates the preheating and pressing shafts 1001 and 1002. The preheating and pressing shafts 1001 and 1002 are equipped with evenly distributed electric heating tubes, which heat the preheating and pressing shafts 1001 and 1002. The temperature is raised to around 100 degrees Celsius, and then the metal foil, the middle layer thermosetting adhesive, and the lower rigid substrate 813 are preheated and pressed. After preheating and pressing, the metal foil, the middle layer thermosetting adhesive, and the lower rigid substrate 813 are put into multiple sets of hot pressing components 11. The hot pressing shaft 1101 and the hot pressing shaft 2102 are driven to rotate by the driving component 15. The hot pressing shaft 1101 and the hot pressing shaft 2102 are also equipped with evenly distributed electric heating tubes to raise the temperature of the hot pressing shaft 1101 and the hot pressing shaft 2102 to around 165 degrees Celsius and perform multiple hot pressing. After the semi-finished circuit board is hot-pressed, the cylinder 1308 is activated, which drives the lower moving plate 1306 and the upper moving plate 1304 to move close to each other on the guide rail 1303, thereby driving the upper cutting blade 1305 and the lower cutting blade 1307 to cut the metal foil and the middle layer of thermosetting adhesive on the front side of the semi-finished circuit board. The semi-finished circuit board is transferred to the next process via the rear transmission shaft 72. After being baked in an external oven at a certain temperature set according to the material characteristics, it can be processed by traditional production processes such as solder resist, surface treatment, and shape processing.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A single-layer circuit board production equipment, comprising a workbench (1), wherein a fixing frame (12) is fixedly connected to the upper side of the workbench (1), characterized in that: The fixed frame (12) is rotatably connected in sequence to a thermosetting adhesive feeding shaft (2), a metal foil feeding shaft (3), a waste discharge micro-adhesive film feeding shaft (16), a waste collection shaft (4), and a thermosetting adhesive protective film collection shaft (5). The fixed frame (12) is also rotatably connected to a spare shaft (6) that is evenly distributed. The upper side of the workbench (1) is also fixedly connected to a roller cutter assembly (9), an automatic feeding mechanism (8), a preheating pressing assembly (10), a cutting knife assembly (13), and multiple sets of hot pressing assemblies (11). Multiple sets of transmission shaft assemblies (7) are interspersed among the roller cutter assembly (9), the automatic feeding mechanism (8), the preheating pressing assembly (10), the cutting knife assembly (13), and the multiple sets of hot pressing assemblies (11). The automatic feeding mechanism (8) includes a rigid substrate (813). The thermosetting adhesive and metal foil are drawn out by the thermosetting adhesive feeding shaft (2) and the metal foil feeding shaft (3) respectively. They are guided by the transmission shaft assembly (7) and die-cut by the roller assembly (9). The waste micro-adhesive film feeding shaft (16) draws out the waste micro-adhesive film. The die-cutting waste is collected by the waste collection shaft (4) after being guided by the transmission shaft assembly (7). The thermosetting adhesive protective film is collected by the thermosetting adhesive protective film collection shaft (5). The die-cut metal foil circuit, thermosetting adhesive, and rigid board substrate (813) are quickly hot-pressed into shape by the preheating pressing assembly (10) and the hot pressing assembly (11). The circuit board is then cut by the cutting assembly (13).

2. The single-layer circuit board production equipment according to claim 1, characterized in that: The transmission shaft assembly (7) includes a support plate (71), a transmission shaft (72), and an adjusting member (73). Multiple sets of support plates (71) are fixedly installed on the upper side of the workbench (1). Two sets of transmission shafts (72) are arranged between two sets of support plates (71) on opposite sides, and an adjusting member (73) is fixedly connected to the outer side of one set of support plates (71). Motor 4 (14) and Motor 6 (17) are fixedly installed on the back of the fixed frame (12). The output end of Motor 4 (14) is fixedly connected to one end of the thermosetting adhesive protective film collection shaft (5), and the output end of Motor 6 (17) is fixedly connected to one end of the waste collection shaft (4).

3. The single-layer circuit board production equipment according to claim 2, characterized in that: The adjusting component (73) includes a track housing (731), a motor (732), a lead screw (733), and a moving block (734). The track housing (731) is fixedly connected to the outer side of the set of support plates (71). The motor (732) is fixedly connected to the upper side of the track housing (731). The lead screw (733) is fixedly connected to the output end of the motor (732). The lead screw (733) has two opposite threads and is threaded to the moving block (734). The moving block (734) is rotatably connected to the transmission shaft (72). The two sets of moving blocks (734) slide synchronously closer or synchronously farther away on the inner side of the track housing (731).

4. The single-layer circuit board production equipment according to claim 1, characterized in that: The hobbing cutter assembly (9) includes a hobbing cutter (91) and a hobbing cutter auxiliary shaft (92). The upper side of the worktable (1) is provided with the hobbing cutter auxiliary shaft (92), and the upper side of the hobbing cutter auxiliary shaft (92) is provided with the hobbing cutter (91). The preheating pressing assembly (10) includes a preheating pressing rotating shaft one (1001) and a preheating pressing rotating shaft two (1002). The preheating pressing rotating shaft one (1001) is located on the upper side of the workbench (1) and near the automatic feeding mechanism (8). The preheating pressing rotating shaft two (1002) is located on the upper side of the preheating pressing rotating shaft one (1001). The hot pressing assembly (11) includes a hot pressing shaft one (1101) and a hot pressing shaft two (1102). The hot pressing shaft two (1102) is located on the upper side of the worktable (1) and near the cutting blade assembly (13). The hot pressing shaft one (1101) is located on the upper side of the hot pressing shaft two (1102).

5. A single-layer circuit board production equipment according to claim 4, characterized in that: The hobbing cutter assembly (9), the preheating pressing assembly (10), and the hot pressing assembly (11) are all connected to driving components (15). The driving component (15) includes a helical gear one (1501), a motor five (1502), a spur gear one (1503), a spur gear two (1504), a mounting platform (1505), and a helical gear two (1506). Multiple sets of mounting platforms (1505) are fixedly connected to the upper side of the workbench (1). The helical gear one (1501) is close to the fixed platform. A motor (1502) is fixedly connected to one side of the frame (12). A helical gear (1501) is fixedly connected to the output end of the motor (1502). A helical gear (1506) meshes with the lower side of the helical gear (1501). A spur gear (1504) is fixedly connected to the end of the helical gear (1506) away from the motor (1502) through a connecting shaft. A spur gear (1503) meshes with the upper side of the spur gear (1504). The hobbing cutter (91), the preheating and pressing shaft two (1002), and the hot pressing shaft one (1101) are fixedly connected to their corresponding spur gear one (1503), and their corresponding mounting platform (1505) is rotatably connected. The hobbing cutter auxiliary shaft (92), the preheating and pressing shaft one (1001), and the hot pressing shaft two (1102) are fixedly connected to their corresponding hobbing cutter auxiliary shaft (92), and are rotatably connected to their corresponding mounting platform (1505).

6. The single-layer circuit board production equipment according to claim 1, characterized in that: The automatic feeding mechanism (8) includes a feeding body (81), a displacement component (82), an adsorption component (83), and a conveying component (84). The feeding body (81) is fixedly connected to the upper side of the workbench (1). The displacement component (82) is fixedly connected to the outer side of the feeding body (81). The adsorption component (83) is provided on the upper side of the feeding body (81). The conveying component (84) is fixedly connected to the side of the feeding body (81) near the fixed frame (12).

7. A single-layer circuit board production equipment according to claim 6, characterized in that: The feeding body (81) also includes a feeding shell (811) and a feeding rack (812). The feeding shell (811) is fixedly connected to the upper side of the workbench (1), and the feeding rack (812) is fixedly connected to the inner side of the feeding shell (811). Hard board substrate (813) is stacked on the inner side of the feeding rack (812). The displacement assembly (82) includes a guide rail (821), a motor (822), a track housing (823), a lead screw (824), and a motion frame (825). The upper side of the loading housing (811) is fixedly connected to the guide rail (821), and the outer side of the loading housing (811) is fixedly connected to the track housing (823). One side of the track housing (823) is fixedly connected to the motor (822), and the output end of the motor (822) is fixedly connected to the lead screw (824). The other end of the lead screw (824) is rotatably connected to the inner wall of the track housing (823). The outer side of the lead screw (824) is threadedly connected to the motion frame (825), and the motion frame (825) slides on the inner side of the track housing (823).

8. A single-layer circuit board production equipment according to claim 7, characterized in that: The adsorption assembly (83) includes a first support plate (831), a connecting plate (832), a second support plate (833), a mounting plate (834), a gas collecting block (835), a support rod (836), a suction cup (837), a lifting cylinder (838), and a sliding block (839). The upper side of the first guide rail (821) is slidably connected to the sliding block (839), and the upper side of the sliding block (839) is fixedly connected to the first support plate (831). The upper side of the first support plate (831) is fixedly connected to the lifting cylinder (838), and the upper output end of the lifting cylinder (838) is fixed. A second support plate (833) is connected, and an mounting plate (834) is fixedly connected to the upper side of the second support plate (833). A connecting plate (832) is provided between adjacent first support plates (831). The connecting plate (832) and the mounting plate (834) are fixedly connected. An air collecting block (835) is fixedly connected to the upper side of the connecting plate (832). Two sets of support rods (836) are fixedly connected to the lower side of the connecting plate (832). A suction cup (837) is fixedly connected to the inner side of the support rod (836). The suction cup (837) and the air collecting block (835) are connected through a hose. The conveying assembly (84) includes a protective plate (841), a motor (842), a conveying shaft (843), a belt (844), and a baffle (845). Two sets of protective plates (841) are provided on the side of the loading housing (811) near the fixed frame (12). One set of protective plates (841) is fixedly connected to the loading housing (811). The two sets of protective plates (841) are rotatably connected to a conveying shaft (843) with even distribution. The motor (842) is fixedly connected to the outer side of the set of protective plates (841) away from the loading housing (811). The output end of the motor (842) is fixedly connected to a set of conveying shafts (843). The adjacent conveying shafts (843) are driven by a belt (844). A baffle (845) is fixedly connected to the set of protective plates (841) away from the loading housing (811). The conveying shaft (843) passes through the baffle (845).

9. A single-layer circuit board production equipment according to claim 1, characterized in that: The cutting blade assembly (13) includes a mounting plate (1301), a cutting blade fixing plate (1302), a second guide rail (1303), an upper motion plate (1304), an upper cutting blade (1305), a lower motion plate (1306), a lower cutting blade (1307), and a push cylinder (1308). The mounting plate (1301) is fixedly connected to the upper side of the worktable (1), and the cutting blade fixing plate (1302) is fixedly connected to the upper side of the mounting plate (1301). The second guide rail (1303) is fixedly connected to the cutting blade fixing plate (1302). The outer side of the guide rail (1303) is slidably connected to an upper moving plate (1304) and a lower moving plate (1306). An upper cutting blade (1305) is fixedly connected to the lower side of the upper moving plate (1304), and a lower cutting blade (1307) is fixedly connected to the upper side of the lower moving plate (1306). Push cylinders (1308) are fixedly connected to both the upper and lower sides of the cutting blade fixing plate (1302). The output ends of the push cylinders (1308) on the upper and lower sides are fixedly connected to the upper moving plate (1304) and the lower moving plate (1306) respectively.

10. A method for producing a single-layer circuit board manufacturing equipment, applied to the single-layer circuit board manufacturing equipment according to any one of claims 1-9, characterized in that: Includes the following steps: S1. The thermosetting adhesive and metal foil are guided and pulled by the transmission shaft (72) so that the metal foil is covered on the thermosetting adhesive; S2. Use a roller cutter (91) to die-cut the metal foil into the required circuit pattern; S3. The waste material after die-cutting is carried away by the micro-adhesive membrane and collected by the waste discharge micro-adhesive membrane discharge shaft (16). The thermosetting adhesive protective film collection shaft (5) collects the thermosetting adhesive protective film. S4. The rigid substrate (813) is automatically fed by the automatic feeding mechanism (8) and transported to the underside of the thermosetting adhesive. S5. The metal foil circuit, thermosetting adhesive, and rigid board substrate (813) are quickly pressed together by the preheating pressing assembly (10) and the hot pressing assembly (11).

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