Self-adaptive heat dissipation module and production method thereof

Abstract

The invention relates to the technical field of mainboard heat dissipation, in particular to a self-adaptive heat dissipation module and a production method thereof, and the self-adaptive heat dissipation module comprises a base, a plurality of liquid cooling plates, a liquid inlet joint, a liquid inlet pipe, a liquid outlet joint and a liquid outlet pipe. The height of the bottom surface of each liquid cooling plate can be adaptively adjusted according to the height of the top surface of the corresponding to-be-cooled part, so that the bottom surface of each liquid cooling plate is in good contact with the top surface of the corresponding to-be-cooled part. In this way, the multiple pieces to be cooled on the mainboard can be effectively cooled. Every two adjacent liquid cooling plates are communicated with each other through the floating communication piece. Therefore, after the two adjacent liquid cooling plates relatively move up and down, the communication state is still kept, and then the cooling liquid path is always kept in a smooth state. And the liquid inlet joint is communicated with one of the liquid cooling plates through a floating communicating piece. And the liquid outlet joint is communicated with the other liquid cooling plate through a floating communication piece.

Description

Technical Field

[0001] This application relates to the field of motherboard heat dissipation technology, and in particular to an adaptive heat dissipation module and its manufacturing method. Background Technology

[0002] When the motherboard is working, the central processing unit, chipset, memory, graphics card and network card and other components on the motherboard need to be cooled to ensure the stability and reliability of their operation.

[0003] Currently, existing heat dissipation modules consist of a base and a liquid cooling plate. The liquid cooling plate is mounted on the base, with its bottom surface in contact with the component to be cooled on the motherboard, thus dissipating heat from the component.

[0004] The existing technical solutions mentioned above have the following drawbacks: the top surfaces of multiple heat-dissipating components on the motherboard have a height difference in the vertical direction, which makes it impossible for the top surfaces of some heat-dissipating components to make good contact with the bottom surface of the liquid cooling plate, thus making it impossible to effectively dissipate heat from these heat-dissipating components using the liquid cooling plate. Summary of the Invention

[0005] In order to effectively dissipate heat from multiple components on the motherboard, this application provides an adaptive heat dissipation module and its manufacturing method.

[0006] The primary objective of this application is to provide an adaptive heat dissipation module, employing the following technical solution: An adaptive heat dissipation module includes: Base; Multiple liquid cooling plates are mounted on the base, each floating vertically. Their bottom surfaces contact the components to be cooled in a corresponding manner with the adaptive heat dissipation modules. Each pair of adjacent liquid cooling plates is connected to each other by a floating connector. The liquid inlet connector is connected to one of the liquid cooling plates via a floating connector. The inlet pipe is detachably connected to the inlet connector at one end. The liquid outlet connector is connected to another liquid cooling plate via a floating connector. The liquid outlet pipe is detachably connected to the liquid outlet connector at one end. The cooling medium flows sequentially through the inlet pipe, inlet connector, each liquid cooling plate, outlet connector, and outlet pipe.

[0007] By adopting the above technical solution, the existing monolithic liquid cooling plate is divided into multiple liquid cooling plates, achieving independent heat dissipation in different areas. The height of the bottom surface of each liquid cooling plate can be adaptively adjusted according to the height of the top surface of the corresponding component to be cooled, ensuring good contact between the bottom surface of each liquid cooling plate and the top surface of the corresponding component, effectively eliminating height differences. This allows for effective heat dissipation for multiple components on the motherboard. Each pair of adjacent liquid cooling plates is interconnected by a floating connector. This ensures that even after relative vertical movement between adjacent liquid cooling plates, they remain connected, thus maintaining the integrity and unobstructed flow of the coolant path. To ensure that the liquid cooling plates that may move vertically remain connected to the inlet connector, the inlet connector is connected to one of the liquid cooling plates via a floating connector. To ensure that the liquid cooling plates that may move vertically remain connected to the outlet connector, the outlet connector is connected to the other liquid cooling plate via a floating connector. One end of the inlet pipe is detachably connected to the inlet connector, facilitating disassembly, replacement, and reassembly of the inlet pipe and inlet connector. One end of the liquid outlet tube is detachably connected to the liquid outlet connector, so that the liquid outlet tube and the liquid outlet connector can be disassembled, replaced and assembled for use.

[0008] This application further specifies that each floating connector is a flexible tube.

[0009] This application further specifies that each liquid cooling plate includes: The bottom plate has contact protrusions on its bottom surface, working fluid inlet and working fluid outlet on its side, and multiple fins inside; a flow channel is formed between the adjacent sides of each pair of adjacent fins. The bottom of the pad is fixedly connected to the top of multiple fins; A hard plastic shell is formed on the inner periphery, outer periphery, and top of the base plate; A soft plastic frame is formed on the outer periphery of a hard plastic shell; a working fluid inlet hole and a working fluid outlet hole are formed on the soft plastic frame; the working fluid inlet hole is connected to the working fluid inlet; the working fluid outlet hole is connected to the working fluid outlet; the soft plastic frame of one liquid cooling plate is connected to the liquid inlet connector through a floating connector; the soft plastic frame of the other liquid cooling plate is connected to the liquid outlet connector through a floating connector; the soft plastic frames of every two adjacent liquid cooling plates are connected by a floating connector.

[0010] By adopting the above technical solution, the gasket serves both a sealing function at the top of multiple fins and a supporting and isolating function, preventing plastic material from flowing into the flow channel, facilitating the formation of the hard plastic shell, and resisting the upward impact force of the coolant flow, thus preventing the coolant from flowing upward. The hard plastic shell seals the sides and top of the hard plastic shell, preventing coolant leakage. The use of a soft plastic frame connected to the floating connector, compared to the direct connection of the hard plastic shell to the floating connector, allows the soft plastic frame to undergo elastic deformation, adaptively eliminating the fit gap with the floating connector and achieving a gapless seal. When the liquid cooling plate floats up and down, the deformation of the soft plastic frame can offset the pulling or squeezing of the floating connector, maintaining stable pressure on the sealing surface and preventing coolant leakage. Simultaneously, the elasticity of the soft plastic frame can compensate for processing and assembly errors. Furthermore, the soft plastic material has good fatigue resistance, can withstand repeated deformation caused by the floating of the liquid cooling plate for a long time, and is not prone to aging and cracking.

[0011] This application further specifies that the rigid plastic shell includes: An inner rigid plastic top cover is formed on the top surface of the pad; A rigid plastic frame is formed on the inner and outer peripheries of the base plate, and a receiving groove for accommodating a soft plastic frame is formed on the outer wall in the circumferential direction. The bottom of the outer hard plastic top cover is fixedly connected to the top of the inner hard plastic top cover and the top of the hard plastic frame, respectively.

[0012] By adopting the above technical solution, the inner rigid plastic top cover provides a sealing function at the top of multiple fins. The rigid plastic frame provides a sealing function around the base plate. The rigid plastic frame provides a sealing function at the top of the entire base plate.

[0013] This application is further configured such that: a plurality of limiting holes are formed on the pad; the bottom opening size of each limiting hole is larger than the top opening size.

[0014] By adopting the above technical solution, multiple limiting holes can be used to form multiple limiting posts on the bottom surface of the inner hard plastic top cover. The multiple limiting posts are embedded in the limiting holes one-to-one. This effectively improves the stability of the connection between the inner hard plastic top cover and the pad plate, and prevents the inner hard plastic top cover from moving up and down later, thereby preventing the outer hard plastic top cover from moving up and down, thus ensuring the continuous sealing of the outer hard plastic top cover to the top of the entire base plate.

[0015] This application further specifies that: multiple through holes are formed on the four sides of the base plate.

[0016] By adopting the above technical solution, the through holes facilitate the flow of injection plastic into the inner sidewall of the base plate, thereby improving the subsequent sealing performance. Simultaneously, the through holes allow for the formation of multiple connecting posts within the four sidewalls of the rigid plastic frame. These connecting posts correspond one-to-one with the multiple through holes on each side, effectively enhancing the stability of the connection between the rigid plastic frame and the base plate.

[0017] This application is further configured such that: the base has a plurality of clearance holes for avoiding the liquid cooling plate; Also includes: The first pressure plate consists of multiple plates, each detachably installed on one side of the top of the base; The second pressure plate consists of multiple plates, each detachably installed on the other side of the top of the base; There are multiple first guide bolts, all of which are vertically arranged; every two first guide bolts are installed on the same first pressure plate. There are multiple second guide bolts, all of which are vertically installed; every two second guide bolts are installed on the same second pressure plate. There are multiple first compression springs, each corresponding to a first guide bolt and fitted onto the first guide bolt; the bottom end of every two first compression springs abuts against one end of the top surface of the same liquid cooling plate. There are multiple second compression springs, each corresponding to a second guide bolt and fitted onto the second guide bolt; the bottom end of every two second compression springs abuts against the other end of the top surface of the same liquid cooling plate.

[0018] By adopting the above technical solution, every two first compression springs and every two second compression springs cooperate to apply downward pressure to the same liquid cooling plate, so that the bottom surface of the liquid cooling plate fits well with the top surface of the corresponding heat dissipation component, thus ensuring heat dissipation efficiency and effect.

[0019] This application further specifies that: each liquid cooling plate is provided with a flexible support foot with adjustable axial length at the four corners of its bottom end.

[0020] By adopting the above technical solution, excessive pressure can be avoided on the component to be cooled by the liquid cooling plate, thereby preventing damage to the component, while ensuring good contact between the bottom surface of the liquid cooling plate and the top surface of the component to be cooled.

[0021] The second objective of this application is to provide a method for manufacturing an adaptive heat dissipation module, which adopts the following technical solution: A method for manufacturing an adaptive heat dissipation module includes: S1. Fix the bottom end of the pad to the top end of the multiple fins of the base plate; S2. A hard plastic frame is formed on the inner and outer periphery of the base plate, and an inner hard plastic top cover is formed on the top of the pad plate; S3. A soft plastic frame and a floating connector are formed on the outer periphery of the hard plastic frame; S4. Fix the bottom of the outer hard plastic top cover to the top of the inner hard plastic top cover and the top of the hard plastic frame respectively. S5. Install multiple liquid cooling plates onto the base respectively; S6. Install multiple first pressure plates, multiple first guide bolts and multiple first compression springs on one side of the top of the base, and install multiple second pressure plates, multiple second guide bolts and multiple second compression springs on the other side of the top of the base; S7. Connect the inlet connector and one of the liquid cooling plates through one of the floating connectors, and connect the outlet connector and another liquid cooling plate through the other floating connector; S8. Connect one end of the inlet pipe to the inlet connector and connect one end of the outlet pipe to the outlet connector.

[0022] In summary, the beneficial technical effects of this application are as follows: 1. The existing monolithic liquid cooling plate was divided into multiple liquid cooling plates, achieving independent heat dissipation in different areas. The height of the bottom surface of each liquid cooling plate can adaptively adjust according to the height of the top surface of the corresponding component to be cooled, ensuring good contact between the bottom surface of each liquid cooling plate and the top surface of the corresponding component, effectively eliminating height differences. This allows for effective heat dissipation for multiple components on the motherboard. Each pair of adjacent liquid cooling plates is interconnected by a floating connector. This ensures that even after relative vertical movement between adjacent liquid cooling plates, they remain connected, maintaining the integrity and unobstructed flow of the coolant. To ensure that the liquid cooling plates that may move vertically remain connected to the inlet connector, the inlet connector is connected to one of the liquid cooling plates via a floating connector. To ensure that the liquid cooling plates that may move vertically remain connected to the outlet connector, the outlet connector is connected to the other liquid cooling plate via a floating connector. One end of the inlet pipe is detachably connected to the inlet connector, facilitating disassembly, replacement, and reassembly of the inlet pipe and connector. One end of the liquid outlet tube is detachably connected to the liquid outlet connector, so that the liquid outlet tube and the liquid outlet connector can be disassembled, replaced and assembled for use.

[0023] 2. The gasket serves both a sealing and supporting function at the top of multiple fins, preventing plastic material from flowing into the flow channel, facilitating the formation of the rigid plastic shell, and resisting the upward impact force of the coolant flow, thus preventing the coolant from flowing upwards. The rigid plastic shell seals the sides and top of the rigid plastic shell, preventing coolant leakage. A soft plastic frame is used to connect to the floating connector. Compared to a rigid plastic shell where the rigid plastic frame is directly connected to the floating connector, the soft plastic frame can elastically deform, adaptively eliminating the fit gap with the floating connector and achieving a gapless seal. When the liquid cooling plate floats up and down, the deformation of the soft plastic frame can offset the pulling or squeezing of the floating connector, maintaining stable pressure on the sealing surface and preventing coolant leakage. Simultaneously, the elasticity of the soft plastic frame can compensate for processing and assembly errors. Furthermore, the soft plastic material has good fatigue resistance, can withstand repeated deformation caused by the floating of the liquid cooling plate for a long time, and is not prone to aging and cracking.

[0024] 3. The inner rigid plastic top cover provides a seal at the top of multiple fins. The rigid plastic frame provides a seal around the base plate. The rigid plastic frame provides a seal at the top of the entire base plate.

[0025] 4. Multiple limiting holes on the pad allow for the formation of multiple limiting posts on the bottom surface of the inner rigid plastic top cover. These limiting posts are fitted into the limiting holes one-to-one. This effectively improves the stability of the connection between the inner rigid plastic top cover and the pad, and prevents the inner rigid plastic top cover from moving up and down later, thereby preventing the outer rigid plastic top cover from moving up and down, thus ensuring the continuous sealing of the entire top of the base plate by the outer rigid plastic top cover.

[0026] 5. The through holes facilitate the flow of injection molding compound into the inner sidewalls of the base plate, improving subsequent sealing. Simultaneously, the through holes allow for the formation of multiple connecting posts within the four sidewalls of the rigid plastic frame. These connecting posts correspond one-to-one with the multiple through holes on each side, effectively enhancing the stability of the connection between the rigid plastic frame and the base plate.

[0027] 6. Every two first compression springs and every two second compression springs work together to apply downward pressure to the same liquid cooling plate, so that the bottom surface of the liquid cooling plate fits well with the top surface of the corresponding heat dissipation component, ensuring heat dissipation efficiency and effect. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of an embodiment of an adaptive heat dissipation module; Figure 2 yes Figure 1 A schematic diagram of the adaptive heat dissipation module from another perspective; Figure 3 This is a schematic diagram showing the state of the cooling medium within the adaptive heat dissipation module; Figure 4 yes Figure 1 An exploded view of the adaptive heat dissipation module shown. Figure 5 yes Figure 1 A cross-sectional view of the adaptive heat dissipation module shown; Figure 6 This is a schematic diagram of the internal structure of an embodiment of a liquid cooling plate; Figure 7 This is a cross-sectional view of the pad; Figure 8 This is a structural schematic diagram of one embodiment of the base plate; Figure 9 This is a schematic diagram of the internal structure of another embodiment of the liquid cooling plate.

[0029] Reference numerals: 110, base; 111, clearance hole; 120, liquid cooling plate; 121, bottom plate; 1211, contact protrusion; 1212, working fluid inlet; 1213, working fluid outlet; 1214, fin; 1215, through hole; 122, pad; 1221, limiting hole; 123, hard plastic shell; 1231, inner hard plastic top cover; 1232, hard plastic frame; 12321, receiving groove; 1233, outer hard plastic shell. 124. Plastic top cover; 1241. Soft plastic frame; 1242. Working fluid inlet; 1243. Working fluid outlet; 125. Flexible support foot; 130. Floating connector; 141. Liquid inlet connector; 142. Liquid outlet connector; 151. Liquid inlet pipe; 152. Liquid outlet pipe; 161. First pressure plate; 162. Second pressure plate; 171. First guide bolt; 172. Second guide bolt; 181. First compression spring; 182. Second compression spring. Detailed Implementation

[0030] It should be noted that the components to be cooled can be the central processing unit, chipset, memory, graphics card, network card, etc. on the motherboard.

[0031] The following is in conjunction with the appendix Figure 1-9 This application will be described in further detail.

[0032] Reference Figure 1 and Figure 2This application discloses an adaptive heat dissipation module, including a base 110, multiple liquid cooling plates 120, a liquid inlet connector 141, a liquid inlet pipe 151, a liquid outlet connector 142, and a liquid outlet pipe 152. The multiple liquid cooling plates 120 are respectively mounted vertically on the base 110, with their bottom surfaces corresponding to the multiple components to be cooled, which are used in conjunction with the adaptive heat dissipation module. By dividing the existing single liquid cooling plate into multiple liquid cooling plates 120, the purpose of independent heat dissipation in different areas is achieved. The height of the bottom surface of each liquid cooling plate 120 can be adaptively adjusted according to the height of the top surface of the corresponding component to be cooled, ensuring good contact between the bottom surface of each liquid cooling plate 120 and the top surface of the corresponding component to be cooled, effectively eliminating height differences. In this way, multiple components on the motherboard can be effectively cooled. Each pair of adjacent liquid cooling plates 120 is interconnected through a floating connector 130. Thus, even after the relative vertical movement of two adjacent liquid cooling plates 120, they remain connected, ensuring that the coolant path remains intact and unobstructed. It should be noted that the vertical height of the inlet connector 141, inlet pipe 151, outlet connector 142, and outlet pipe 152 remains constant. To ensure that the liquid-cooled plate 120, which may move vertically, remains in communication with the inlet connector 141, the inlet connector 141 is connected to one of the liquid-cooled plates 120 via a floating connector 130. Similarly, to ensure that the liquid-cooled plate 120, which may move vertically, remains in communication with the outlet connector 142, the outlet connector 142 is connected to the other liquid-cooled plate 120 via a floating connector 130. One end of the inlet pipe 151 is detachably connected to the inlet connector 141, facilitating disassembly, replacement, and assembly of both. One end of the outlet pipe 152 is detachably connected to the outlet connector 142, facilitating disassembly, replacement, and assembly of both. For ease of understanding, Figure 3 The diagram shows the state of the cooling medium inside the adaptive heat dissipation module, with the arrows indicating the flow direction of the cooling medium. The cooling medium flows sequentially through the inlet pipe 151, the inlet connector 141, each liquid cooling plate 120, the outlet connector 142, and the outlet pipe 152, effectively carrying away heat.

[0033] Preferably, one end of the inlet pipe 151 is detachably connected to the inlet connector 141 by means of bolting, snap-fitting, or plugging. One end of the outlet pipe 152 is detachably connected to the outlet connector 142 by means of bolting, snap-fitting, or plugging.

[0034] In one embodiment, each floating connector 130 is a flexible tube made of polyethylene, polyurethane, polytetrafluoroethylene or EPDM rubber, etc., which can produce a certain degree of deformation.

[0035] Reference Figure 4 , Figure 5 and Figure 6 Each liquid cooling plate 120 includes a base plate 121, a pad plate 122, a rigid plastic shell 123, and a flexible plastic frame 124. The bottom surface of the base plate 121 has contact protrusions 1211 (e.g., ...). Figure 2 (As shown). The contact protrusion 1211 can contact the component to be cooled, ensuring good contact between the base plate 121 and the component, reducing the heat dissipation gap and improving heat dissipation efficiency. The base plate 121 has a working fluid inlet 1212 for the cooling working fluid to flow into the base plate 121 and a working fluid outlet 1213 for the cooling working fluid to flow out of the base plate 121, and multiple fins 1214 are formed inside. A flow channel is formed between adjacent sides of every two adjacent fins 1214. The multiple fins 1214 effectively increase the contact area between the base plate 121 and the cooling working fluid, thereby improving the heat dissipation effect and efficiency. The bottom end of the pad 122 is fixedly connected to the top end of the multiple fins 1214. On one hand, the gasket 122 acts as a seal at the top of the multiple fins 1214; on the other hand, the gasket 122 provides support and isolation, preventing plastic material from flowing into the flow channel and facilitating the formation of the rigid plastic shell 123; furthermore, the rigidity of the gasket 122 resists the upward impact force during the flow of the cooling medium, preventing the cooling medium from flowing upward. The rigid plastic shell 123 is formed on the inner periphery, outer periphery, and top of the base plate 121, sealing the periphery and top of the rigid plastic shell 123 to prevent the cooling medium from leaking outward. A soft plastic frame 124 is formed on the outer periphery of the rigid plastic shell 123. A working medium inlet hole 1241 and a working medium outlet hole 1242 are formed on the soft plastic frame. The working medium inlet hole 1241 is connected to the working medium inlet 1212. The working medium outlet hole 1242 is connected to the working medium outlet 1213. One of the liquid cooling plates 120 has a soft plastic frame 124 connected to the liquid inlet connector 141 via a floating connector 130. The other liquid cooling plate 120 has a soft plastic frame 124 connected to the liquid outlet connector 142 via a floating connector 130. Every two adjacent liquid cooling plates 120 have their soft plastic frames 124 connected via a floating connector 130. Compared to the hard plastic frame 1232 of the hard plastic shell 123 being directly connected to the floating connector 130, this connection of the soft plastic frame 124 to the floating connector 130 allows the soft plastic frame 124 to undergo elastic deformation, adaptively eliminating any gaps in the fit with the floating connector 130 and achieving a gapless seal. When the liquid cooling plate 120 floats up and down, the deformation of the soft plastic frame 124 can counteract the pulling or squeezing of the floating connector 130, maintaining stable pressure on the sealing surface and preventing coolant leakage. Simultaneously, the elasticity of the soft plastic frame 124 can compensate for processing and assembly errors. In addition, the soft plastic material has good fatigue resistance and can withstand repeated deformation caused by the 120° floating of the liquid cooling plate for a long time, and is not easy to age and crack.

[0036] Preferably, the base plate 121 and the pad plate 122 are made of copper, which has good thermal conductivity. The hard plastic shell 123 is made of high-temperature nylon, polyphenylene sulfide, or polycarbonate, etc. The soft plastic frame 124 is made of polyethylene, polyurethane, polytetrafluoroethylene, or EPDM rubber, etc., which can deform to a certain extent.

[0037] Preferably, the multiple fins 1214 of the pad 122 and the base plate 121 are connected by welding, which ensures the stability of the connection between the base plate 121 and the pad 122.

[0038] Preferably, the soft plastic frame 124 and the floating connector 130 are integrally formed. This reduces the number of processing steps and shortens the processing time. At the same time, it ensures the sealing of the connection between the soft plastic frame 124 and the floating connector 130.

[0039] Reference Figure 6 In one embodiment, the rigid plastic shell 123 includes an inner rigid plastic top cover 1231, a rigid plastic frame 1232, and an outer rigid plastic top cover 1233. The inner rigid plastic top cover 1231 is formed on the top surface of the pad 122 and serves to seal the tops of the plurality of fins 1214. The rigid plastic frame 1232 is formed on the inner and outer peripheries of the base plate 121 and serves to seal the periphery of the base plate 121. The outer wall of the rigid plastic frame 1232 has a receiving groove 12321 formed circumferentially for accommodating a soft plastic frame 124. The receiving groove 12321 facilitates the subsequent formation of the soft plastic frame 124 and improves space utilization. The bottom end of the outer rigid plastic top cover 1233 is fixedly connected to the top end of the inner rigid plastic top cover 1231 and the top end of the rigid plastic frame 1232, respectively, and serves to seal the top of the entire base plate 121.

[0040] Preferably, the outer hard plastic top cover 1233 is connected to the inner hard plastic top cover 1231 and the hard plastic frame 1232 by welding, which ensures the stability of the connection between the outer hard plastic top cover 1233, the inner hard plastic top cover 1231 and the hard plastic frame 1232, and ensures the sealing of the connection.

[0041] Preferably, such as Figure 7As shown, multiple limiting holes 1221 are formed on the pad 122. The bottom opening size of each limiting hole 1221 is larger than the top opening size. Specifically, each limiting hole 1221 is a conical hole. When the inner hard plastic top cover 1231 is formed on the top surface of the pad 122 using injection molding, multiple limiting posts can be formed on the bottom surface of the inner hard plastic top cover 1231 using the multiple limiting holes 1221. The multiple limiting posts are embedded in the limiting holes 1221 one-to-one with the multiple limiting holes 1221. In this way, the stability of the connection between the inner hard plastic top cover 1231 and the pad 122 is effectively improved, and the inner hard plastic top cover 1231 can be prevented from moving up and down later, thereby preventing the outer hard plastic top cover 1233 from moving up and down, thus ensuring the continuous sealing of the outer hard plastic top cover 1233 to the top of the entire base plate 121.

[0042] Preferably, such as Figure 8 As shown, multiple through holes 1215 are formed on the four side walls of the base plate 121. When the rigid plastic frame 1232 is formed around the base plate 121 using injection molding, the through holes 1215 facilitate the flow of injection plastic into the inner side walls of the base plate 121, thereby improving the sealing performance later. Simultaneously, the through holes 1215 allow the formation of multiple connecting posts within the four side walls of the rigid plastic frame 1232. These connecting posts are correspondingly embedded within the through holes 1215. This effectively improves the stability of the connection between the rigid plastic frame 1232 and the base plate 121.

[0043] Reference Figure 1 and Figure 4In one embodiment, the base 110 has a plurality of clearance holes 111 for avoiding the liquid cooling plate 120. The adaptive heat dissipation module also includes a plurality of first pressure plates 161, a plurality of second pressure plates 162, a plurality of first guide bolts 171, a plurality of second guide bolts 172, a plurality of first compression springs 181, and a plurality of second compression springs 182. The plurality of first pressure plates 161 are detachably mounted on one side of the top end of the base 110 to facilitate the installation and removal of the plurality of first pressure plates 161. The plurality of second pressure plates 162 are detachably mounted on the other side of the top end of the base 110 to facilitate the installation and removal of the plurality of second pressure plates 162. The plurality of first guide bolts 171 are all vertically arranged. Every two first guide bolts 171 are mounted on the same first pressure plate 161. The plurality of second guide bolts 172 are all vertically arranged. Every two second guide bolts 172 are mounted on the same second pressure plate 162. Multiple first compression springs 181 are correspondingly fitted onto multiple first guide bolts 171. The bottom ends of every two first compression springs 181 abut against one end of the top surface of the same liquid cooling plate 120. Multiple second compression springs 182 are correspondingly fitted onto multiple second guide bolts 172. The bottom ends of every two second compression springs 182 abut against the other end of the top surface of the same liquid cooling plate 120. Every two first compression springs 181 and every two second compression springs 182 cooperate to apply downward pressure to the same liquid cooling plate 120, ensuring good contact between the bottom surface of the liquid cooling plate 120 and the top surface of the corresponding heat-dissipating component, thus guaranteeing heat dissipation efficiency and effect. Each first guide bolt 171 is used to limit the deformation direction of the corresponding first compression spring 181, ensuring that the force applied by the first compression spring 181 is vertically downward. Each second guide bolt 172 is used to limit the deformation direction of the corresponding second compression spring 182, so that the force applied by the second compression spring 182 is vertically downward.

[0044] Preferably, each first pressure plate 161 is detachably connected to the base 110 by means of bolts, snap-fit, or plug-in. Each second pressure plate 162 is detachably connected to the base 110 by means of bolts, snap-fit, or plug-in.

[0045] In another embodiment, such as Figure 9As shown, each liquid cooling plate 120 has a flexible support foot 125 with adjustable axial length at one of its four corners at the bottom. The top of each flexible support foot 125 is fixedly connected to the bottom of the base plate 121 by a heat insulation sheet. Each flexible support foot 125 is a bellows. By introducing or releasing gas into each flexible support foot 125, the axial length of each flexible support foot 125 can be adjusted, thereby adjusting the support force provided by each flexible support foot 125 to the base plate 121. When the top surface of the component to be cooled is higher, the bottom surface of the liquid cooling plate 120 is also higher. At this time, the deformation of the corresponding first compression spring 181 and second compression spring 182 is larger, and the downward pressure applied to the liquid cooling plate 120 is larger. To prevent the liquid cooling plate 120 from applying excessive pressure to the component to be cooled, thereby avoiding damage to the component, and to ensure good contact between the bottom surface of the liquid cooling plate 120 and the top surface of the component to be cooled, the axial length of each flexible support foot 125 can be adjusted to share some of the pressure.

[0046] This application also discloses a method for producing an adaptive heat dissipation module, including: S1. Fix the bottom end of the pad 122 to the top end of the plurality of fins 1214 of the base plate 121.

[0047] In this step, the bottom end of the pad 122 is connected to the multiple fins 1214 of the base plate 121 by welding.

[0048] S2. A hard plastic frame 1232 is formed on the inner and outer peripheries of the base plate 121, and an inner hard plastic top cover 1231 is formed on the top of the pad plate 122.

[0049] In this step, a hard plastic frame 1232 is formed around the base plate 121 using an injection molding process with an injection mold, and an inner hard plastic top cover 1231 is formed on the top of the pad plate 122.

[0050] S3. A soft plastic frame 124 and a floating connector 130 are formed on the outer periphery of the hard plastic frame 1232.

[0051] In this step, a soft plastic frame 124 and a floating connecting member 130 are formed on the outer periphery of the shaped hard plastic frame 1232 using an injection molding process with an injection mold.

[0052] S4. Fix the bottom end of the outer hard plastic top cover 1233 to the top end of the inner hard plastic top cover 1231 and the top end of the hard plastic frame 1232 respectively.

[0053] In this step, an outer hard plastic top cover 1233 is first formed using an injection molding process with an injection mold. Then, the bottom end of the outer hard plastic top cover 1233 is welded to the top end of the inner hard plastic top cover 1231. Finally, the bottom end of the outer hard plastic top cover 1233 is welded to the top end of the hard plastic frame 1232.

[0054] S5. Install multiple liquid cooling plates 120 onto the base 110 respectively.

[0055] S6. Install multiple first pressure plates 161, multiple first guide bolts 171 and multiple first compression springs 181 on one side of the top of the base 110, and install multiple second pressure plates 162, multiple second guide bolts 172 and multiple second compression springs 182 on the other side of the top of the base 110.

[0056] S7. The inlet connector 141 and one of the liquid cooling plates 120 are connected through one of the floating connectors 130, and the outlet connector 142 and the other liquid cooling plate 120 are connected through the other floating connector 130.

[0057] S8. Connect one end of the inlet pipe 151 to the inlet connector 141, and connect one end of the outlet pipe 152 to the outlet connector 142.

[0058] The implementation principle of this embodiment is as follows: the existing monolithic liquid cooling plate is divided into multiple liquid cooling plates 120, achieving independent heat dissipation in different areas. The height of the bottom surface of each liquid cooling plate 120 can be adaptively adjusted according to the height of the top surface of the corresponding component to be cooled, ensuring good contact between the bottom surface of each liquid cooling plate 120 and the top surface of the corresponding component to be cooled, effectively eliminating height differences. This allows for effective heat dissipation for multiple components on the motherboard. Each pair of adjacent liquid cooling plates 120 is interconnected by a floating connector 130. Thus, even after adjacent liquid cooling plates 120 undergo relative vertical movement, they remain connected, ensuring the coolant path remains intact and unobstructed. To ensure that the liquid cooling plates 120, which may move vertically, remain connected to the inlet connector 141, the inlet connector 141 is connected to one of the liquid cooling plates 120 via a floating connector 130. To ensure that the liquid cooling plate 120, which may move vertically, remains in communication with the liquid outlet connector 142, the liquid outlet connector 142 is connected to another liquid cooling plate 120 via a floating connector 130. One end of the liquid inlet pipe 151 is detachably connected to the liquid inlet connector 141 to facilitate disassembly, replacement, and assembly of both. One end of the liquid outlet pipe 152 is detachably connected to the liquid outlet connector 142 to facilitate disassembly, replacement, and assembly of both.

[0059] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. An adaptive heat dissipation module, characterized in that, include: Base (110); Multiple liquid cooling plates (120) are mounted on the base (110) in a floating manner, and their bottom surfaces are in contact with multiple heat dissipation components used in conjunction with the adaptive heat dissipation module. Each pair of adjacent liquid cooling plates (120) are connected to each other through a floating connector (130). The liquid inlet connector (141) is connected to one of the liquid cooling plates (120) via a floating connector (130); One end of the inlet pipe (151) is detachably connected to the inlet connector (141); The liquid outlet connector (142) is connected to another liquid cooling plate (120) via a floating connector (130); One end of the liquid outlet pipe (152) is detachably connected to the liquid outlet connector (142); The cooling medium flows sequentially through the inlet pipe (151), the inlet connector (141), each of the liquid cooling plates (120), the outlet connector (142), and the outlet pipe (152).

2. The adaptive heat dissipation module according to claim 1, characterized in that, Each of the floating connectors (130) is a flexible tube.

3. The adaptive heat dissipation module according to claim 1, characterized in that, Each of the liquid cooling plates (120) includes: The bottom plate (121) has a contact protrusion (1211) on its bottom surface, a working fluid inlet (1212) and a working fluid outlet (1213) on its side, and a plurality of fins (1214) inside; a flow channel is formed between adjacent sides of each pair of adjacent fins (1214); The bottom end of the pad (122) is fixedly connected to the top end of the plurality of fins (1214); A hard plastic shell (123) is formed on the inner periphery, outer periphery and top of the base plate (121); A soft plastic frame (124) is formed on the outer periphery of the hard plastic shell (123); a working fluid inlet hole (1241) and a working fluid outlet hole (1242) are formed on the soft plastic frame; the working fluid inlet hole (1241) is connected to the working fluid inlet (1212); the working fluid outlet hole (1242) is connected to the working fluid outlet (1213); the soft plastic frame (124) of one of the liquid cooling plates (120) is connected to the liquid inlet connector (141) through a floating connector (130); the soft plastic frame (124) of the other liquid cooling plate (120) is connected to the liquid outlet connector (142) through a floating connector (130); the soft plastic frames (124) of every two adjacent liquid cooling plates (120) are connected by a floating connector (130).

4. The adaptive heat dissipation module according to claim 3, characterized in that, The hard plastic shell (123) includes: An inner rigid plastic top cover (1231) is formed on the top surface of the pad (122); A hard plastic frame (1232) is formed on the inner and outer peripheries of the base plate (121), and a receiving groove (12321) for accommodating the soft plastic frame (124) is formed on the outer wall in the circumferential direction. The bottom end of the outer hard plastic top cover (1233) is fixedly connected to the top end of the inner hard plastic top cover (1231) and the top end of the hard plastic frame (1232).

5. The adaptive heat dissipation module according to claim 3, characterized in that, The pad (122) has a plurality of limiting holes (1221); the bottom opening size of each limiting hole (1221) is larger than the top opening size.

6. The adaptive heat dissipation module according to claim 3, characterized in that, Multiple through holes (1215) are formed on the four sides of the base plate (121).

7. The adaptive heat dissipation module according to any one of claims 1 to 6, characterized in that, The base (110) has a plurality of clearance holes (111) for avoiding the liquid cooling plate (120); Also includes: Multiple first pressure plates (161) are detachably installed on one side of the top of the base (110); There are multiple second pressure plates (162), each detachably installed on the other side of the top of the base (110); There are multiple first guide bolts (171), all of which are vertically arranged; every two first guide bolts (171) are installed on the same first pressure plate (161); There are multiple second guide bolts (172), all of which are vertically arranged; every two second guide bolts (172) are installed on the same second pressure plate (162); There are multiple first compression springs (181), which are sleeved on the first guide bolts (171) in a one-to-one correspondence with the multiple first guide bolts (171); the bottom ends of every two first compression springs (181) abut against one end of the top surface of the same liquid cooling plate (120); There are multiple second compression springs (182), which are fitted onto the second guide bolts (172) in a one-to-one correspondence with the multiple second guide bolts (172); the bottom ends of every two second compression springs (182) abut against the other end of the top surface of the same liquid cooling plate (120).

8. The adaptive heat dissipation module according to any one of claims 1 to 6, characterized in that, Each of the liquid cooling plates (120) has a flexible support foot (125) with adjustable axial length at one of its four corners at the bottom.

9. A method for producing an adaptive heat dissipation module as described in any one of claims 1 to 8, characterized in that, include: S1. Fix the bottom end of the pad (122) to the top end of the multiple fins (1214) of the base plate (121); S2. A hard plastic frame (1232) is formed on the inner and outer peripheries of the base plate (121), and an inner hard plastic top cover (1231) is formed on the top of the pad plate (122); S3. A soft plastic frame (124) and the floating connector (130) are formed on the outer periphery of the hard plastic frame (1232); S4. The bottom end of the outer hard plastic top cover (1233) is fixedly connected to the top end of the inner hard plastic top cover (1231) and the top end of the hard plastic frame (1232), respectively. S5. Install the plurality of liquid cooling plates (120) onto the base (110) respectively; S6. Install a plurality of first pressure plates (161), a plurality of first guide bolts (171) and a plurality of first compression springs (181) on one side of the top end of the base (110), and install a plurality of second pressure plates (162), a plurality of second guide bolts (172) and a plurality of second compression springs (182) on the other side of the top end of the base (110); S7. The inlet connector (141) and one of the liquid cooling plates (120) are connected through one of the floating connectors (130), and the outlet connector (142) and the other liquid cooling plate (120) are connected through the other floating connector (130); S8. Connect one end of the inlet pipe (151) to the inlet connector (141), and connect one end of the outlet pipe (152) to the outlet connector (142).

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