Semiconductor process wafer transfer device

Abstract

The invention discloses a semiconductor process wafer transshipment device which comprises a receiving and feeding device and further comprises a transferring device, the tail end of the receiving and feeding device and the front end of the transferring device are parallel and spaced, the receiving and feeding device and the transferring device are consistent in structure, and the receiving and feeding device is used for feeding materials into processing equipment and transporting the processed equipment out. The material transferring device receives the machined equipment on the material receiving and feeding device and feeds the machined equipment into the next machining equipment, the material receiving and feeding device comprises a track and a walking trolley moving on the track, and second reciprocating lead screws which are symmetrically and vertically arranged are installed on the walking trolley. The device is composed of the material receiving and feeding device and the material transferring device, the material receiving and feeding device is used for feeding and taking materials in the machining equipment, the material transferring device is used for butting the machined materials on the material receiving and feeding device and transferring the machined materials into the next working procedure, and therefore the stroke of the material receiving and feeding device and the stroke of the material transferring device each time are shortened, and the material receiving and feeding device and the material transferring device can operate at the same time. And the processing efficiency of the whole processing production line is improved.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, specifically to a semiconductor process wafer transfer device. Background Technology

[0002] With the rapid development of technology, LED lighting fixtures and LED displays are widely used in people's lives. LEDs are the main components of LED lighting fixtures or LED displays. During LED production, a thin film needs to be deposited on a wafer to improve its brightness. Semiconductor process equipment is typically used to perform the film deposition on the wafer. During wafer processing, the wafer is placed on a tray. After processing at one location, it needs to be transferred to the next processing location. This usually requires a transfer device or carrier to move the wafer tray. However, the transfer of the wafer tray from the processing location to the transfer device or carrier requires manual operation, which is not only costly but also prone to causing injury to workers.

[0003] Therefore, in order to correct the above-mentioned defects, we propose a semiconductor process wafer transfer device. Summary of the Invention

[0004] The technical problem solved by this invention is to provide a semiconductor wafer transfer device.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor process wafer transfer device, which is used in semiconductor processes to send a wafer tray into a processing device and then transport it from the processing device to the next processing device. It includes a receiving and feeding device and a transfer device. The end of the receiving and feeding device is parallel to and spaced from the front end of the transfer device, and both have the same structure. The receiving and feeding device is used to feed materials into the processing device and transport the processed equipment out. The transfer device picks up the processed equipment from the receiving and feeding device and sends it into the next processing device. The receiving and feeding device includes a track and a traveling trolley moving on the track. The traveling trolley is equipped with symmetrically placed vertically reciprocating screws II. A bearing platform I is installed between the sliders of the symmetrical reciprocating screws II. A symmetrically placed horizontally reciprocating screw I is installed on the bearing platform I. A material carrier plate I is connected to the sliders of the symmetrical reciprocating screws I. The material carrier plate I has two sets of symmetrical support rods, and a receiving rod is fixed to each set of support rods.

[0006] Furthermore, above the first bearing platform is a second bearing platform, on which symmetrical and horizontally positioned reciprocating screws are installed. The third reciprocating screw is parallel to the first reciprocating screw. A material carrier plate is installed on the slider of the symmetrical third reciprocating screw. The material carrier plate also has two sets of symmetrical support rods, and a receiving rod is fixed on each set of support rods.

[0007] Furthermore, both the second and first carrying platforms are raised and lowered by symmetrical reciprocating screws. Each of the symmetrical reciprocating screws has two sliders. The lower slider is connected to the first carrying platform, and the upper slider is connected to the second carrying platform.

[0008] Furthermore, two reciprocating lead screws are provided on both sides of the first bearing platform, and the second bearing platform is connected between the sliders on the four reciprocating lead screws.

[0009] Furthermore, the length of the second bearing platform is less than the length of the first bearing platform, and the second bearing platform is flush with the end of the first bearing platform that is close to the processing equipment. The length of the third reciprocating screw is less than the length of the first reciprocating screw, and the third reciprocating screw is flush with the end of the first reciprocating screw that is close to the processing equipment.

[0010] Furthermore, the end of the receiving rod closest to the processing equipment extends towards the processing equipment.

[0011] Furthermore, the upper end face of the receiving rod is provided with several receiving grooves at equal intervals. There is a protruding rod in the middle of the receiving groove. The height of the protruding rod is less than the depth of the receiving groove. The bottom of the protruding rod is connected to the receiving groove by a spring. Under the support of the spring, the upper end of the protruding rod protrudes out of the receiving groove. There are limiting slide rods of the same height on both sides of the receiving groove. Slip rings slide on the limiting slide rods and are fixed to the protruding rod.

[0012] Furthermore, the top of the protruding rod has a conical structure.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: The device consists of two parts: a feeding device and a transfer device. The feeding device feeds and picks up materials inside the processing equipment, while the transfer device receives the processed materials from the feeding device and transfers them to the next process. In this way, the stroke of the feeding device and the transfer device is shortened each time, and they can operate simultaneously, thereby speeding up the processing efficiency of the entire production line. In addition, the feeding device can enter the processing equipment to complete the feeding and picking up of materials inside the processing equipment without manual intervention. Moreover, the picking and feeding can be completed simultaneously by entering the processing equipment once, without having to go in to pick up materials first, then come out and then go in to feed materials again, thereby further improving processing efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the feeding device structure in this invention; Figure 3 This is a schematic diagram of the structure of the support platform in this invention; Figure 4 This is a schematic diagram of the second supporting platform structure in this invention; Figure 5 This is a side view of the receiving rod structure in this invention; Figure 6 This is a top view of the receiving rod structure in this invention; Figure 7 This is a schematic diagram of the pallet positioning structure in this invention.

[0015] Numbering on the map: 1. Feeding device; 2. Transfer device; 3. Track; 4. Traveling trolley; 5. Supporting platform one; 6. Reciprocating screw one; 7. Reciprocating screw two; 8. Carrying plate one; 9. Supporting platform two; 10. Receiving rod; 11. Support rod; 12. Carrying plate two; 13. Protruding rod; 14. Receiving groove; 15. Limiting slide rod; 16. Slip ring; 17. Spring; 18. Reciprocating screw three; 19. Reciprocating screw four. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] This invention provides a technical solution: Please see Figure 1-7 A semiconductor manufacturing wafer transfer device is disclosed. This device, used in semiconductor manufacturing processes, delivers a wafer tray to one processing unit and then transports it from that unit to the next. It includes a feeding device 1 and a transfer device 2. The end of the feeding device 1 and the front end of the transfer device 2 are parallel and spaced apart, and both have identical structures. The feeding device 1 delivers materials into the processing unit and transports the processed equipment out. The transfer device 2 receives the processed equipment from the feeding device 1 and delivers it to the next processing unit. A processing equipment includes a feeding device 1 comprising a track 3 and a traveling trolley 4 moving on the track 3. The traveling trolley 4 is equipped with symmetrical and vertically placed reciprocating screws 7. A bearing platform 5 is installed between the sliders of the symmetrical reciprocating screws 7. A symmetrical and horizontally placed reciprocating screw 6 is installed on the bearing platform 5. A material carrier plate 8 is connected to the sliders of the symmetrical reciprocating screws 6. The material carrier plate 8 has two sets of symmetrical support rods 11. A receiving rod 10 is fixed on each set of support rods 11.

[0018] The feeding device 1 moves to the initial end via the traveling trolley 4, placing the wafer tray carrying the wafers on the two receiving rods 10 of the feeding device 1. The feeding device 1 then moves to the inlet of the processing equipment via the traveling trolley 4. The reciprocating screw 1 6 drives the two receiving rods 10 and the wafer tray into the processing equipment. Then, the reciprocating screw 2 7 drives the two receiving rods 10 and the wafer tray to descend. After descending, the carrier inside the processing equipment is positioned between the two receiving rods 10. As it continues to descend, the wafer tray is carried by the carrier inside the processing equipment. The reciprocating screw 6 drives the two receiving rods 10 to exit from the processing equipment. Through this operation, when the two receiving rods 10 enter the equipment, the reciprocating screw 6 drives the two receiving rods 10 to rise and receive the wafer trays that have been processed on the carrier. After exiting, the two receiving rods 10 in the transfer device 2 receive the wafer trays on the two receiving rods 10 of the receiving and feeding device 1. The distance between the two receiving rods 10 in the transfer device 2 is smaller than the distance between the two receiving rods 10 in the receiving and feeding device 1.

[0019] As can be seen from the above, the feeding device 1 requires two in-and-out operations to complete the removal and loading of the wafer tray in the processing equipment. Through improvement, the feeding device 1 can achieve simultaneous material removal and loading in a single in-and-out operation. Specifically, there is a second carrying platform 9 above the first carrying platform 5. The second carrying platform 9 is equipped with symmetrical and horizontally placed reciprocating screws 18. The reciprocating screws 18 are parallel to the first reciprocating screw 6. A material carrier plate 12 is installed on the slider of the symmetrical reciprocating screws 18. The material carrier plate 12 also has two sets of symmetrical support rods 11. A receiving rod 10 is fixed on each set of support rods 11. As can be seen from the above, the feeding device 1 is equipped with two sets of receiving structures, as is the transfer device 2. During operation, the receiving rod 10 on the second carrier plate 12 is used to carry the wafer tray containing unprocessed wafers, and the receiving rod 10 on the first carrier plate 8 is in an empty state. Alternatively, the receiving rod 10 on the first carrier plate 8 can carry the wafer tray containing unprocessed wafers, in which case the receiving rod 10 on the second carrier plate 12 is in an empty state. Under the action of the reciprocating screw 6, the first carrier plate 8 and the second carrier plate 12 enter the processing equipment simultaneously, and the wafer tray containing unprocessed wafers is in the loading position. When the receiving rod 10 on the second plate 12 is lifted, the reciprocating screw 7 is controlled to rise, and the receiving rod 10 on the first plate 8 supports the wafer tray on the carrier inside the processing equipment. At this time, the reciprocating screw 6 drives the receiving rod 10 on the first plate 8 to retract, and the transfer device 2 receives the wafer tray on the retracted receiving rod 10. During this process, the reciprocating screw 7 descends, driving the receiving rod 10 on the second plate 12 containing the wafer tray to descend, so that the wafer tray containing the unprocessed wafer is received by the carrier inside the processing equipment. After completion, it retracts again.

[0020] Based on the above, the motion system of the second platform 9 is selected in the following two ways: Method 1: The second carrier platform 9 and the first carrier platform 5 share a motion system. Specifically, the second carrier platform 9 and the first carrier platform 5 are both raised and lowered by symmetrical reciprocating screws 7. Each symmetrical reciprocating screw 7 is equipped with two sliders. The lower slider is connected to the first carrier platform 5, and the upper slider is connected to the second carrier platform 9.

[0021] Method 2: The carrier platform 2 9 and the carrier platform 1 5 each have their own corresponding motion system. Specifically, there are two reciprocating lead screws 4 19 on both sides of the carrier platform 1 5, and the carrier platform 2 9 is connected between the sliders on the four reciprocating lead screws 4 19.

[0022] Compared to Method 1, Method 2 allows for a controlled reduction in the distance between the second support platform 9 and the first support platform 5, making it suitable for small spaces within processing equipment.

[0023] In addition, the length of the second bearing platform 9 is less than the length of the first bearing platform 5, and the end of the second bearing platform 9 and the first bearing platform 5 near the processing equipment are flush. The length of the third reciprocating screw 18 is less than the length of the first reciprocating screw 6, and the end of the third reciprocating screw 18 and the first reciprocating screw 6 near the processing equipment are flush. The end of the receiving rod 10 near the processing equipment extends towards the processing equipment. This is so that the receiving rod 10 of the feeding device 1 can be inserted into the processing equipment, and the receiving rod 10 of the transfer device 2 can be connected with the receiving rod 10 of the feeding device 1.

[0024] In addition, to prevent the pallet from sliding on the receiving rod 10, a pallet positioning structure is provided on the receiving rod 10. Specifically, several receiving grooves 14 are equally spaced on the upper end face of the receiving rod 10. A protruding rod 13 is located in the middle of the receiving groove 14. The height of the protruding rod 13 is less than the depth of the receiving groove 14. The bottom of the protruding rod 13 is connected to the receiving groove 14 by a spring 17. Under the support of the spring 17, the upper end of the protruding rod 13 protrudes out of the receiving groove 14. There are limiting slide rods 15 of the same height on both sides of the receiving groove 14. Slip rings 16 slide on the limiting slide rods 15 and are fixed to the protruding rods 13. That is, when the pallet is not placed on it, all the protruding rods 13 are protruding on the receiving rod 10. When the pallet is placed on it, the protruding rods 13 pressed by the pallet will be pressed down, while the protruding rods 13 on both sides of the pallet will abut against the sides of the pallet, so that the pallet does not slide.

[0025] In order to allow the edge of the pallet to slide down the protruding rods 13 on both sides of the pallet when the protruding rods 13 are in close contact with the sides of the pallet, the top of the protruding rods 13 is a conical structure, that is, the ends of the protruding rods 13 are all inclined surfaces, and the edge can slide down along the inclined surfaces.

[0026] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer transfer device, used in a semiconductor manufacturing process to feed a wafer tray into one processing device and then transport it from the processing device to the next processing device, comprising a receiving and feeding device (1), characterized in that: it further comprises a transfer device (2), wherein the end of the receiving and feeding device (1) is parallel to and spaced from the front end of the transfer device (2), and the two have the same structure; the receiving and feeding device (1) is used to feed materials into the processing device and transport the processed equipment out; the transfer device (2) receives the processed equipment from the receiving and feeding device (1) and feeds it into the next processing device. The feeding device (1) includes a track (3) and a traveling trolley (4) moving on the track (3). The traveling trolley (4) is equipped with two symmetrical and vertically placed reciprocating screws (7). A bearing platform (5) is installed between the sliders of the two symmetrical reciprocating screws (7). A symmetrical and horizontally placed reciprocating screw (6) is installed on the bearing platform (5). A material carrier plate (8) is connected to the sliders of the two symmetrical reciprocating screws (6). The material carrier plate (8) has two sets of symmetrical support rods (11). A receiving rod (10) is fixed on each set of support rods (11).

2. The semiconductor wafer transfer apparatus according to claim 1, characterized in that: Above the first (5) bearing platform is a second (9) bearing platform. The second (9) bearing platform is equipped with a symmetrical and horizontally placed reciprocating screw three (18). The reciprocating screw three (18) is parallel to the first (6) reciprocating screw. A material plate two (12) is installed on the slider of the symmetrical reciprocating screw three (18). The material plate two (12) also has two sets of symmetrical support rods (11). A receiving rod (10) is fixed on each set of support rods (11).

3. The semiconductor wafer transfer apparatus according to claim 2, characterized in that: Both the second (9) and the first (5) of the carrying platform are raised and lowered by symmetrical reciprocating screws (7). Each of the symmetrical reciprocating screws (7) has two sliders. The lower slider is connected to the first (5) of the carrying platform, and the upper slider is connected to the second (9) of the carrying platform.

4. The semiconductor process wafer transfer apparatus according to claim 2, characterized in that: Two reciprocating lead screws (19) are provided on both sides of the bearing platform one (5), and the bearing platform two (9) is connected between the sliders on the four reciprocating lead screws (19).

5. The semiconductor wafer transfer apparatus according to any one of claims 2-4, characterized in that: The length of the second bearing platform (9) is less than the length of the first bearing platform (5), and the second bearing platform (9) is flush with the end of the first bearing platform (5) near the processing equipment. The length of the third reciprocating screw (18) is less than the length of the first reciprocating screw (6), and the third reciprocating screw (18) is flush with the end of the first reciprocating screw (6) near the processing equipment.

6. The semiconductor process wafer transfer apparatus according to claim 1, characterized in that: The receiving rod (10) extends from the end near the processing equipment toward the processing equipment.

7. The semiconductor process wafer transfer apparatus according to any one of claims 1 or 6, characterized in that: The upper end face of the receiving rod (10) is provided with several receiving grooves (14) at equal intervals. There is a protruding rod (13) in the middle of the receiving groove (14). The height of the protruding rod (13) is less than the depth of the receiving groove (14). The bottom of the protruding rod (13) is connected to the receiving groove (14) by a spring (17). Under the support of the spring (17), the upper end of the protruding rod (13) protrudes out of the receiving groove (14). There are limiting slide rods (15) of the same height on both sides of the receiving groove (14). A sliding ring (16) slides on the limiting slide rod (15). The sliding ring (16) is fixed to the protruding rod (13).

8. The semiconductor process wafer transfer apparatus according to claim 7, characterized in that: The top of the protruding rod (13) has a conical structure.

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