Multi-chip fixed-distance mounting method

Abstract

The invention discloses a multi-chip fixed-distance mounting method. A target substrate located on a first carrier plate is moved to a preset position of a second carrier plate; a high-power microscope lens provided with an industrial camera is moved to the position above the target substrate, the industrial camera collects an image of the target substrate, and data information of a contour line corresponding to the chip mounting area is generated and stored; the vacuum transparent suction nozzle moves the target chip to the second carrier plate; the industrial camera collects a front image of the target chip and compares the front image with the contour line, the target substrate is moved, the front image of the target chip is aligned with the compared contour line, and the target chip aligned with the mounting area of the target substrate is mounted on the target substrate; copying data information of the contour line, moving the target substrate, and generating a new contour line by taking a previous mounted target chip as a reference; and the plurality of target chips are mounted on the target substrate according to the set mode. According to the invention, multi-chip mounting is realized, the positioning is accurate and rapid, and the production efficiency is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a method for mounting multiple chips at a fixed distance. Background Technology

[0002] With the development of electronic products, surface mount technology (SMT) has become one of the core technologies in the electronics manufacturing industry. The substrate is placed on a carrier stage, and then a pick-and-place nozzle picks up the chip and places it on top of the substrate. After aligning the chip and substrate, the chip is then mounted onto the substrate. Currently, chip mounting mainly includes eutectic bonding, conductive adhesive bonding, glass adhesive bonding, and soldering bonding. During chip mounting, the substrate is first positioned, then the chip is aligned with the substrate, and the pick-and-place nozzle lowers the chip onto the substrate. The positioning of the chip and substrate is crucial to the packaging quality. Currently, pick-and-place machines first photograph the surface of the substrate on the carrier stage, generating an image on the screen. Then, the lens is flipped to photograph the chip picked up by the nozzle. When the photographed chip image aligns with the mounting area of ​​the substrate, the chip is considered to be aligned with the substrate mounting position.

[0003] Chinese invention patent CN119581385B discloses a binding assembly, a eutectic bonding device, and a chip mounting method. The method includes the following steps: transferring a substrate onto a eutectic stage, the substrate having at least two chip mounting positions; transferring a chip to the first chip mounting position via a nozzle assembly, during which a vision component observes the chip's orientation through a through-hole and an adsorption channel, and adjusts the chip's orientation based on the observation results; when transferring the chip to other chip mounting positions via the nozzle assembly, the nozzle picks up the corresponding chip and moves it directly above the corresponding chip mounting position on the substrate, at which point the adsorption channel and the observation window are aligned with the chip mounting positions of the already mounted chip and the chip mounting positions of the chip to be mounted, respectively; the vision component identifies the feature points of the two chips through the adsorption channel and the observation window, and simultaneously corrects the relative position and angle of the two chips through a drive assembly, thereby completing the mounting.

[0004] In the chip mounting process, the vision component observes the chip to be mounted through through-holes and adsorption channels, and opens an observation hole on the observation window. The vision component identifies the chip to be mounted through the adsorption channel and the observation window, and identifies the mounted chip through the observation hole. The vision component observes the mounted and the chip to be mounted through two holes with different axes, respectively. The imaging and observation effects are not good, and there is no relevant reference when aligning the chip with the mounting position. The chip needs to be moved in real time according to the image.

[0005] In existing chip placement machines, the positioning of the chip and the placement position is achieved solely by moving the chip in real time according to an image until it is aligned with the placement position on the substrate. The chip has no reference during positioning, and its production efficiency is difficult to meet the needs of mass production. Summary of the Invention

[0006] The purpose of this invention is to provide a multi-chip fixed-distance mounting method. An industrial camera acquires an image of the front of the target substrate and generates multiple sequentially arranged contour lines corresponding to the mounting area of ​​the target substrate. The industrial camera sequentially acquires images of the target chips and compares the target chips with the multiple contour lines in turn. The target chips are then sequentially mounted on the chip mounting area of ​​the target substrate. At the same time, the target chips and chip mounting positions are accurately positioned to ensure mounting quality and improve production efficiency.

[0007] To solve the above-mentioned technical problems, the present invention provides a multi-chip fixed-distance mounting method, the method comprising the following steps: Step S101: Move the target substrate located on the first carrier plate to a preset position on the second carrier plate; Step S102: Move the high-powered microscope lens equipped with an industrial camera above the target substrate. The high-powered microscope lens magnifies the target substrate, the industrial camera acquires the image of the target substrate, and generates the outline of the chip mounting area of ​​the target substrate, and stores the data information of the outline. Step S103: The target chip located on the first carrier plate is adsorbed and moved to the second carrier plate through the vacuum transparent nozzle; Step S104: Acquire a front image of the target chip using an industrial camera, compare the target chip with the outline, and simultaneously move the high-magnification microscope lens and the target chip or simultaneously move the target substrate to determine whether the front image of the target chip is aligned with the generated outline. If the front image of the target chip is aligned with the outline being compared, the target chip is aligned with the mounting area of ​​the target substrate, and step S105 is executed. If the target chip is not aligned with the outline being compared, continue moving the target chip until the front image of the target chip is aligned with the mounting area of ​​the target substrate corresponding to the outline. Step S105: Place the target chip, aligned with the mounting area of ​​the target substrate, onto the target substrate. Step S106: Copy the data information of the outline, move the target substrate, and use the previously mounted target chip as a reference to generate a new outline by setting the direction and distance; Repeat steps S103-S106 until all target chips are mounted on the target substrate according to the set method.

[0008] This invention employs the aforementioned technical solution. First, an industrial camera captures images of the target substrate moved to a preset position on the second carrier board, detecting the surface quality of the chip mounting area on the target substrate. Then, an outline indicating the chip mounting area is generated corresponding to the chip mounting area on the target substrate. Next, the industrial camera captures images of the target chip moved onto the second carrier board, comparing the target chip with the outline. When the target chip aligns with the outline, the target chip aligns with the chip mounting area on the target substrate, and the target chip is mounted onto the target substrate, completing the chip mounting. Multiple outlines are then replicated, the target substrate is moved, and new outlines are generated with a set direction and distance, using the previously mounted target chip as a reference. These new outlines correspond one-to-one with multiple chip mounting areas on the target substrate. Steps S103 to S106 are repeated to sequentially mount multiple target chips onto multiple mounting areas on the target substrate. By using line marking for positioning and chip mounting, production efficiency and chip positioning accuracy are effectively improved.

[0009] In the multi-chip fixed-distance mounting method described above, in step S106, the generated multiple contour lines are arranged sequentially along the X-axis and Y-axis directions, and the spacing between them is equal in the X-axis and Y-axis directions.

[0010] In the multi-chip fixed-distance mounting method described above, in step S106, the position of the target substrate is moved by moving the pneumatic floating stage of the second carrier board, while always keeping the previously mounted target chip within the visible field of view of the high-magnification microscope lens. Maintaining the previously mounted target chip within the visible field of view of the high-magnification microscope lens while moving the target substrate position facilitates observation of the spacing between target chips when mounting the next target chip, ensuring mounting accuracy.

[0011] In the multi-chip fixed-distance mounting method described above, in step S106, the objective lens of the high-power microscope is switched to ensure that at least a portion of the previously mounted target chip and the new contour line are within the visible field of view of the high-power microscope. Moving the target substrate while simultaneously switching the high-power microscope ensures that at least a portion of the previously mounted target chip and the new contour line are within the visible field of view of the high-power microscope. This facilitates the determination and maintenance of the spacing between target chips and the adjustment of chip positions during subsequent chip mounting, ensuring mounting accuracy.

[0012] In the aforementioned multi-chip fixed-distance mounting method, in step S102, the industrial camera generates a marker point P1 within the outline area of ​​the target substrate. In step S104, the industrial camera generates a marker point P2 in the front image of the target chip. During the movement of the target chip or target substrate, when marker point P1 coincides with marker point P2, the mounting areas of the target chip and the target substrate are aligned. The industrial camera generates marker point P1 simultaneously with the outline of the target substrate, and then generates marker point P2 at the same location when generating the front image of the chip. During the movement of the target chip, marker points P1 and P2 are further positioned, and when marker points P1 and P2 are aligned, it indicates that the target chip and the target substrate are aligned.

[0013] In the multi-chip fixed-distance mounting method described above, marker point P1 is the geometric center point of the chip mounting area outline, and marker point P2 is the geometric center point of the target chip. Marker points P1 and P2, which are both geometric center points, assist in the outline positioning, thereby better positioning the target chip and the target substrate.

[0014] The aforementioned multi-chip fixed-distance mounting method utilizes a high-magnification microscope with multiple objective lenses, providing magnification of 5-100 times for the target substrate and chip. Depending on the target substrate, the objective lens of the high-magnification microscope can be selected, allowing for 5-100x magnification of the target substrate and chip. When the image captured by the industrial camera is displayed on the screen, the surfaces of the target substrate and chip can be clearly identified, enabling a direct assessment of any defects on their surfaces.

[0015] In the above-described multi-chip fixed-distance mounting method, in step S103: the target chip located on the first carrier board can be moved to the second carrier board using a chip fixture; a vacuum transparent nozzle is embedded in the chip fixture, which includes two clamping rods, a servo drive mechanism, and a drive rod. The tail ends of the two clamping rods are respectively provided with bearings. The drive rod is U-shaped, with its inner side of the U-shape being a beveled surface that contacts and abuts against the bearing. The servo drive mechanism drives the drive rod to descend, and the drive rod controls the two clamping rods to move towards each other and clamp the target chip by pressing down on the bearing. Clamping blocks extend from the front ends of the clamping rods away from the bearings, forming a clamping part between the two clamping blocks. The vacuum transparent nozzle is located above the clamping part. The servo drive mechanism can drive the drive rod to descend via a servo motor connected to a lead screw and nut pair. The drive rod presses down on the bearing through the beveled surface on the inner side of its U-shape, causing the bearing to drive the two clamping rods to move towards each other under the guidance of the beveled surface, thus clamping the target chip.

[0016] In the aforementioned multi-chip fixed-distance mounting method, the observation groove and adsorption hole inside the vacuum transparent nozzle form an optical channel for a high-magnification microscope to observe the substrate or chip. A transparent cover plate is sealed over the observation groove. The vacuum transparent nozzle is embedded in the chip fixture, integrating the nozzle and fixture into one unit, simplifying the structure of the pick-and-place machine and reducing the space occupied by multiple components. The observation groove and adsorption hole form an optical channel aligned with the objective lens of the high-magnification microscope, allowing the microscope to observe the chip adsorbed at the bottom of the adsorption hole through the transparent cover plate.

[0017] The beneficial effects of this invention are as follows: Utilizing the characteristics of a high-magnification microscope lens, an industrial camera captures a clear frontal image of the target substrate and target chip, allowing for timely screening of defective products. The industrial camera generates a contour line corresponding to the chip mounting area of ​​the target substrate and replicates it multiple times, creating new contour lines with set directions and distances. These new contour lines can also be arranged along the X and Y axes. Then, the industrial camera captures an image of the target chip, aligning the image of the target chip sequentially with the contour lines. This achieves precise alignment of the mounting positions of multiple target chips with the target substrate mounting area, enabling accurate positioning. A frontal image of the substrate and chip can be captured from a single direction, effectively improving production efficiency for multi-chip mounting. Attached Figure Description

[0018] Figure 1 This is a schematic diagram illustrating the specific implementation steps of the multi-chip mounting method according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the array arrangement of the outline corresponding to the target substrate mounting area in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the target chip corresponding to the outline of the target chip being mounted on the target substrate mounting area according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the chip mounter in this method according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the placement machine from another angle in this embodiment of the invention. Figure 6 yes Figure 5 Enlarged structural diagram of position A in the middle; Figure 7 This is a schematic diagram of the structure of the vacuum transparent suction nozzle according to an embodiment of the present invention; Figure 8 This is a cross-sectional structural diagram of the vacuum transparent suction nozzle according to an embodiment of the present invention; Figure 9 yes Figure 8 A magnified structural diagram of position B in the middle; Figure 10 This is a schematic diagram of the chip fixture according to an embodiment of the present invention; Figure 11 This is a schematic diagram of the servo drive mechanism of the chip fixture according to an embodiment of the present invention; Figure 12 This is a structural schematic diagram of the chip fixture from the rear view angle according to an embodiment of the present invention.

[0019] Explanation of reference numerals in the attached drawings: Base 1a, Stage 1, First Carrier Plate 11, Second Carrier Plate 12, Support Frame 13, First Drive Mechanism 131, Second Drive Mechanism 132, Third Drive Mechanism 133, Fourth Drive Mechanism 134, Industrial Camera 2, High-Magnification Microscope Lens 3, Chip Fixture 4, Clamping Rod 41, Servo Drive Mechanism 42, Drive Rod 43, Bearing 44, Clamping Block 45, Clamping Part 46, Base 47, Pressure Sensor 48, Spring 49, Servo Motor 421, Lead Screw and Nut Pair 422, Nut Seat 423, Vertical Plate 471, Vacuum Transparent Nozzle 5, Nozzle Support 51, Transparent Cover Plate 52, Observation Slot 53, Transparent Nozzle Head 54, Adsorption Part 55, Adsorption Hole 56, Suction Hole 57, Nozzle Rod 58, Vacuum Channel 511, Positioning Hole 531, Seal 532, Vacuum Hole 581. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] Reference Figure 1 As shown, a multi-chip fixed-distance mounting method includes the following steps: Step S101: Move the target substrate A1 located on the first carrier plate 11 to a preset position on the second carrier plate 12; Step S102: Move the high-powered microscope lens 3 equipped with the industrial camera 2 above the target substrate A1. The high-powered microscope lens 3 magnifies the target substrate A1, the industrial camera 2 acquires the image of the target substrate A1, and generates the outline line L of the chip mounting area of ​​the target substrate A1, and stores the data information of the outline line L. Step S103: The target chip A2 located on the first carrier plate 11 is adsorbed and moved to the second carrier plate 12 through the vacuum transparent nozzle 5; Step S104: Acquire a front image of the target chip A2 using the industrial camera 2, and compare the target chip A2 with the contour line L. Simultaneously move the high-magnification microscope lens 3 and the target chip A2, or simultaneously move the target substrate A1, to determine whether the front image of the target chip A2 is aligned with the generated contour line L. If the front image of the target chip A2 is aligned with the outline L being compared, then the target chip A2 is aligned with the mounting area of ​​the target substrate A1, and step S105 is executed. If the target chip A2 is not aligned with the comparison outline L, continue moving the target chip A2 until the front image of the target chip A2 is aligned with the mounting area of ​​the target substrate A1 corresponding to the outline L. Step S105: Place the target chip A2, which aligns with the mounting area of ​​the target substrate A1, onto the target substrate A1; Step S106: Copy the data information of the outline L, move the target substrate A1, and use the previously mounted target chip A2 as a reference to generate a new outline L by setting the direction and distance; Repeat steps S103-S106 until all target chips A2 are mounted on the target substrate A1 according to the set method.

[0022] Combination Figure 1-3 As shown, in step S101, the target substrate A1 is transported from the first carrier plate 11 to a preset position on the second carrier plate 12; in step S102, the high-power microscope lens 3 is moved, and the industrial camera 2 scans the chip mounting area of ​​the target substrate A1, capturing an image and displaying it on the screen of the pick-and-place machine control system; in step S103, the target chip A2 on the first carrier plate 11 is transferred to the second carrier plate 12 through the vacuum transparent nozzle 5; in step S104, the industrial camera 2 captures a frontal image of the target chip A2 and the outline L of the corresponding mounting area of ​​the target chip A2 and the target substrate A1 is generated. During the comparison process, the high-magnification microscope lens 3 and the target chip A2 are moved synchronously, or the target substrate A1 is moved synchronously, so that the target chip A2 is aligned with the first contour line L. After the target chip A2 is aligned with the contour line L, step S105 is executed to attach the target chip A2 to the chip mounting area of ​​the target substrate A1. In step S106, by copying the first contour line L and using the previously mounted target chip A2 as a reference, a new contour line L is generated by setting the direction and distance. Steps S103-S106 are repeated to attach the target chip A2 to the chip mounting area of ​​the target substrate A1 in sequence.

[0023] In step S106, the generated multiple contour lines L are arranged sequentially along the X-axis and Y-axis directions, with equal spacing in both directions. It should be understood that the arrangement of the multiple contour lines L can be set according to the different chip mounting areas of the target substrate A1. The spacing on the X and Y axes can be equal, or different spacings can be set, and the X and Y axes can be set to be perpendicular or not perpendicular to each other; the selection can be made based on the surface condition of the target substrate A1 in actual use.

[0024] In step S106, the position of the target chip A1 is moved by moving the pneumatic floating platform of the second carrier plate 12, while always keeping the previously mounted target chip A2 within the visible field of view of the high-powered microscope lens 3. Keeping the previous target chip A2 within the visible field of view of the high-powered microscope lens 3 allows for direct observation of the spacing and position between the next mounted target chip and the previous target chip, which is beneficial for the positioning of subsequent target chips mounted in sequence.

[0025] Specifically, in step S106, the objective lens of the high-power microscope lens 3 is switched to ensure that at least a portion of the previously mounted target chip A2 and the new contour line L are both within the visible field of view of the high-power microscope lens 3. Within the visible field of view of the high-power microscope lens 3, the previously mounted target chip A2 serves as a reference when positioning the target chip A2, and the spacing and position between chips are controlled according to the chip mounting area on the target substrate A1.

[0026] The high-magnification microscope lens 3 is equipped with multiple objective lenses, allowing selection of lenses with different magnifications by rotation. The high-magnification microscope lens 3 provides magnification of 5-100 times for the target substrate A1 and target chip A2. The high-magnification microscope lens 3 can move vertically up and down to adjust its field of view, enabling the industrial camera 2 to capture a larger area on the target substrate A1. Based on the area captured on the mounting area of ​​the target substrate A1, a new contour line L is generated after each target chip A2 is mounted. The next target chip A2 is then mounted on the corresponding new contour line L, allowing for the sequential mounting of multiple target chips A2, effectively improving production efficiency.

[0027] In step S102, the industrial camera 2 generates a marker point P1 within the contour line L region of the target substrate A1, such as... Figure 2 As shown, in step S104, the industrial camera 2 generates a marker point P2 in the image of the target chip A2. During the movement of the target chip A2 or the target substrate A1, when marker point P1 coincides with marker point P2, the mounting areas of the target chip A2 and the target substrate A1 are aligned, as shown. Figure 3 As shown. In this embodiment, positioning is achieved by setting marker points. Marker point P1 is set within the contour line L area corresponding to the mounting position of the target substrate A1. After imaging the target chip A2, marker point P2 is set on the target chip A2. When the target chip A2 is moved and marker point P2 coincides with marker point P1, the target chip A2 is positioned to align with the mounting position of the target substrate A1. The alignment of the marker points with the contour line L can be used simultaneously or independently. That is, the target chip A2 can be aligned with the contour line L and marker point P1 with marker point P2 simultaneously, or the target chip A2 can be aligned with the contour line L and the marker point P2 of the target chip A2 can be aligned with the marker point P1 of the target substrate A1 independently.

[0028] In this embodiment, marker point P1 is the geometric center point of the outline L, and marker point P2 is the geometric center point of the target chip. The high-magnification microscope lens 3 provides 5-100x magnification for the target substrate A1 and target chip A2. Using the geometric center points to locate marker points P1 and P2 enables rapid positioning, facilitating quick positioning by operators. Based on the 5-100x magnification of the high-magnification microscope lens 3, the image of the target substrate A1 surface can be clearly observed, allowing for the removal of substrates and chips with surface defects, thus avoiding rework.

[0029] In step S102, the position of the target substrate A1 is moved by moving the second carrier plate 12, so that its outline L is aligned with the target chip A2. The second carrier plate 12 can move on the stage 1, eliminating the need for simultaneous movement of the chip fixture 4 and the high-magnification microscope lens 3.

[0030] like Figure 4-6 As shown, the pick-and-place machine includes a base 1a, on which a first carrier plate 11, a second carrier plate 12, and a support frame 13 are provided. A first drive mechanism 131, a second drive mechanism 132, a third drive mechanism 133, and a fourth drive mechanism 134 are provided on the support frame 13. The third drive mechanism 133 is connected to the fourth drive mechanism 134, and the chip clamp 4 is connected to the fourth drive mechanism 134. The third drive mechanism 133 controls the chip clamp 4 to move laterally along the direction of the first carrier plate 11 and the second carrier plate 12, and the fourth drive mechanism 134 controls the vertical lifting movement of the chip clamp 4, thereby enabling the chip clamp 4 to pick up the target chip A2 on the first carrier plate 11 and move it to the second carrier plate 12. The first driving mechanism 131 is connected to the second driving mechanism 132. The high-magnification microscope head 3 is mounted on the second driving mechanism 132. The first driving mechanism 131 controls the high-magnification microscope head 3 to move laterally along a first direction along the length of the first carrier plate 11 and the second carrier plate 12. The second driving mechanism 132 controls the high-magnification microscope head 3 to move laterally perpendicular to the first direction. Thus, when the target substrate A1 is on the second carrier plate 12, the position of the high-magnification microscope head 3 is controlled so that it can be aligned with the target substrate A1. The industrial camera 2 can acquire an image of the target substrate A1 and generate a contour line L corresponding to the mounting area of ​​the target substrate A1. The vacuum transparent nozzle 5 is embedded in the chip fixture 4. After the industrial camera 2 captures an image of the target substrate A1, the chip fixture 4 moves the vacuum transparent nozzle 5 to the first carrier plate 11 to adsorb the target chip A2 and move it onto the first carrier plate 11. At the same time, the high-magnification microscope lens 3 approaches the vacuum transparent nozzle 4 to capture an image of the target chip A2. By comparing the target chip A2 with the outline L of the mounting position, the target chip A2 is accurately mounted on the mounting position of the target substrate A1.

[0031] like Figure 10-12 As shown, in step S103, the target chip A2 located on the first carrier plate 11 can be moved to the second carrier plate 12 by the chip clamp 4. The vacuum transparent nozzle 5 is embedded in the chip clamp 4. The chip clamp 4 includes two clamping rods 41, a servo drive mechanism 42, and a drive rod 43. The tail ends of the two clamping rods 41 are respectively provided with bearings 44. The drive rod 43 is U-shaped, and the inner side of its U-shaped side is inclined and contacts the bearings 44. The servo drive mechanism 42 drives the drive rod 43 to descend. The drive rod 43 controls the two clamping rods 41 to move towards each other and clamp the target chip A2 by pressing down the bearings 44. The head ends of the clamping rods 41 away from the bearings 44 extend towards each other with clamping blocks 45. A clamping part 46 is formed between the two clamping blocks 45. The vacuum transparent nozzle 5 is located above the clamping part 46. The vacuum transparent nozzle 5 is located above the clamping part 46, so that the high-magnification microscope lens 3 can observe the target chip A2 clamped by the clamping part 46 through the vacuum transparent nozzle 5.

[0032] The chip clamp 4 includes a base 47, with two clamping rods 41 movably mounted on the base 47. Two springs 49 are mounted on the base 47, connecting the base 47 to the clamping rods 41. When the drive rod 43 drives the bearing 44 to move the clamping rods 41 towards each other to clamp the target chip, the springs 49 provide a certain elastic force, allowing the clamping rods 41 to clamp the chip. As the drive rod 43 rises, the elastic force of the springs 49 pulls the clamping rods 41 back to their initial position.

[0033] The servo drive mechanism 42 includes a servo motor 421 and a lead screw and nut assembly 422. The servo motor 421 is mounted on the upright plate 471 of the base 47. The lead screw and nut assembly 422 is connected to the output end of the servo motor 421. The drive rod 43 is mounted on the nut seat 423 of the lead screw and nut assembly 422. The servo motor 421 drives the lead screw and nut assembly 422 to move, which in turn drives the drive rod 43 to move up and down via the nut seat 423. When the drive rod 43 moves downward, it drives the clamping rod 41 to clamp the chip.

[0034] A pressure sensor 48 is connected to the inner side of one of the clamping rods 41 to detect the clamping force of the clamping rod 41 on the target chip A2. Specifically, when the clamping part 46 of the clamping rod 41 contacts and clamps the target chip A2, the reaction force of the target chip A2 on the clamping rod 41 is transmitted to the pressure sensor 48 through the clamping rod 41, and the clamping force of the clamping rod 41 is calculated.

[0035] like Figure 7-9As shown, the vacuum transparent suction nozzle 5 includes a suction nozzle support 51, with a vacuum channel 511 inside the suction nozzle support 51. One end of the suction nozzle support 51 has an observation groove 53 and a transparent cover plate 52. The observation groove 53 has a coaxial adsorption hole 56, which is perpendicular to the vacuum channel 511. The vacuum channel 511 communicates with the observation groove 53 and the adsorption hole 56. A transparent suction nozzle head 54 is sealed on the inner wall of the adsorption hole 56. The transparent suction nozzle head 54 has a suction hole 57 communicating with the adsorption hole 56, and the target chip A2 can be adsorbed on the bottom of the transparent suction nozzle head 54. A positioning hole 531 is provided on one side wall of the observation groove 53. The positioning hole 531 is coaxially aligned with the vacuum channel 511. The positioning hole 531 facilitates the formation of the vacuum channel 511 inside the suction nozzle support 51. A sealing element 532 is provided on the positioning hole 531. The suction nozzle bracket 51 is provided with a suction nozzle rod 58 at the end away from the observation slot 53. The suction nozzle rod 58 is provided with a vacuum hole 581 that communicates with the vacuum channel 511. The suction nozzle rod 58 is used to connect to the vacuum equipment.

[0036] In step S103, as Figure 8 As shown, the vacuum transparent suction nozzle 5 is embedded in the chip holder 4. The observation groove 53 and adsorption hole 56 inside the vacuum transparent suction nozzle 5 form an optical channel for light from the high-powered microscope head 3 to pass through. A transparent cover plate 52 is sealed and covered above the observation groove 53. The high-powered microscope head 3 can observe the target chip A2 adsorbed on the transparent suction nozzle head 54 through the transparent cover plate 52, observation groove 53, adsorption hole 56 and transparent suction nozzle head 54 at the bottom of the vacuum transparent suction nozzle 5. The high-powered microscope head 3 is vertically aligned with the observation groove 53 of the vacuum transparent suction nozzle 5.

[0037] In summary, as described in the specification and figures, the present invention has been manufactured into actual samples and subjected to multiple usage tests. The results of these tests demonstrate that the present invention achieves its intended purpose, and its practical value is undeniable. The embodiments described above are merely illustrative examples and are not intended to limit the present invention in any way. Any person skilled in the art who makes partial modifications or alterations to the technical content disclosed in the present invention, without departing from the scope of the technical features of the present invention, shall still fall within the scope of the technical features of the present invention.

Claims

1. A multi-chip fixed-distance mounting method, characterized in that, The method includes the following steps: Step S101: Move the target substrate (A1) located on the first carrier plate (11) to a preset position on the second carrier plate (12); Step S102: Move the high-powered microscope lens (3) equipped with the industrial camera (2) above the target substrate (A1), the high-powered microscope lens (3) magnifies the target substrate (A1), the industrial camera (2) acquires the image of the target substrate (A1), and generates the outline (L) of the chip mounting area of ​​the target substrate (A1), and stores the data information of the outline (L). Step S103: The target chip (A2) located on the first carrier plate (11) is adsorbed and moved to the second carrier plate (12) through the vacuum transparent nozzle (5); Step S104: Acquire a front image of the target chip (A2) using an industrial camera (2), compare the target chip (A2) with the outline (L), and simultaneously move the high-power microscope lens (3) and the target chip (A2) or simultaneously move the target substrate (A1) to determine whether the front image of the target chip (A2) is aligned with the generated outline (L). If the front image of the target chip (A2) is aligned with the outline (L) being compared, then the target chip (A2) is aligned with the mounting area of ​​the target substrate (A1), and step S105 is executed. If the target chip (A2) is not aligned with the outline (L) being compared, continue moving the target chip (A2) until the front image of the target chip (A2) is aligned with the mounting area of ​​the target substrate (A1) corresponding to the outline (L); Step S105: Place the target chip (A2) with the mounting area aligned with the target substrate (A1) onto the target substrate (A1); Step S106: Copy the data information of the outline (L), move the target substrate (A1), and use the previously mounted target chip (A2) as a reference to generate a new outline (L) by setting the direction and distance. Repeat steps S103-S106 until all target chips (A2) are mounted on the target substrate (A1) in the set manner.

2. The multi-chip fixed-distance mounting method according to claim 1, characterized in that: In step S106, the generated multiple contour lines (L) are arranged sequentially along the X-axis and Y-axis directions, with equal spacing in the X-axis and Y-axis directions.

3. The multi-chip fixed-distance mounting method according to claim 1, characterized in that: In step S106, the position of the target substrate (A1) is moved by moving the pneumatic floating platform of the second carrier board (12), and the previously mounted target chip (A2) is always kept within the visible field of view of the high-power microscope lens (3).

4. The multi-chip fixed-distance mounting method according to claim 3, characterized in that: In step S106, the objective lens of the high-power microscope lens (3) is switched so that at least a portion of the previously mounted target chip (A2) and the new outline (L) are within the visible field of view of the high-power microscope lens (3).

5. The multi-chip fixed-distance mounting method according to claim 1, characterized in that: In step S102, the industrial camera (2) generates a marker point P1 in the outline (L) area of ​​the target substrate (A1). In step S104, the industrial camera (2) generates a marker point P2 in the front image of the target chip (A2). During the movement of the target chip (A2) or the target substrate (A1), when the marker point P1 coincides with the marker point P2, the mounting area of ​​the target chip (A2) and the target substrate (A1) are aligned.

6. The multi-chip fixed-distance mounting method according to claim 5, characterized in that: The marker point P1 is the geometric center point of the chip mounting area outline (L), and the marker point P2 is the geometric center point of the target chip.

7. The multi-chip fixed-distance mounting method according to claim 1, characterized in that: The high-power microscope lens (3) has multiple objective lenses, which can magnify the target substrate (A1) and target chip (A2) by 5x to 100x.

8. The multi-chip fixed-distance mounting method according to claim 1, characterized in that: In step S103: the target chip (A2) located on the first carrier board (11) can also be moved to the second carrier board (12) by the chip fixture (4); the vacuum transparent nozzle (5) is embedded in the chip fixture (4), the chip fixture (4) includes two clamping rods (41), a servo drive mechanism (42) and a drive rod (43), the tail ends of the two clamping rods (41) are respectively provided with bearings (44), the drive rod (43) is U-shaped, and its U-shaped side is inside The inclined surface contacts and abuts the bearing (44). The servo drive mechanism (42) drives the drive rod (43) to descend. The drive rod (43) controls the two clamping rods (41) to move towards each other and clamp the target chip (A2) through the pressure bearing (44). The clamping rods (41) have clamping blocks (45) extending towards each other from their ends away from the bearing (44). A clamping part (46) is formed between the two clamping blocks (45). The vacuum transparent suction nozzle (5) is located above the clamping part (46).

9. The multi-chip fixed-distance mounting method according to claim 8, characterized in that: The observation groove (53) and adsorption hole (56) inside the vacuum transparent suction nozzle (5) form an optical channel for the high-power microscope lens (3) to observe the substrate or chip. A transparent cover plate (52) is sealed and covered on the observation groove (53).

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