Deposition apparatus, deposition method of display device, and electronic device

Abstract

The invention relates to a deposition apparatus, a deposition method of a display device, and an electronic device including the display device. The deposition apparatus includes: a deposition source including a plurality of deposition nozzles arranged in a direction to spray a deposition material; a rail disposed above the deposition source in a direction in which the deposition nozzles are disposed; and a moving module disposed on the track and moving along the track. The moving module includes: a carrier on which a substrate is loaded; a deposition mask supported by the carrier and disposed below the substrate; a camera disposed on the carrier to capture an image of the deposition nozzle; a laser irradiator disposed on the carrier to radiate laser light toward the deposition nozzle; and a controller analyzing an image captured by the camera and controlling the laser irradiator.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and all benefits arising therefrom to Korean Patent Application No. 10-2024-0168141, filed on November 22, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to deposition equipment, deposition methods for display devices, and electronic devices including display devices. Background Technology

[0004] Organic light-emitting display devices utilize the recombination of electrons injected from the cathode and holes injected from the anode in an organic thin film to form excitons, and when the excitons relax from the excited state to the ground state, they generate light of a specific wavelength as energy is released.

[0005] In organic light-emitting display devices, vacuum deposition using a deposition apparatus can be used as a method for depositing organic materials or metals used as electrodes. Vacuum deposition can be performed by placing a substrate on which an organic thin film is to be grown inside a vacuum chamber, bringing a deposition mask with the same pattern as the pattern of the thin film to be formed into contact with the substrate, and then using a deposition source to evaporate or sublimate a deposition material such as an organic material to deposit the deposition material on the substrate. Summary of the Invention

[0006] In the deposition process, the deposited material can accumulate at the deposition nozzle of the deposition source. Therefore, the angle at which the deposited material is ejected from the deposition nozzle may change.

[0007] Embodiments of this disclosure provide a deposition apparatus that prevents changes in the spray angle of the deposition material by avoiding accumulation of deposition material at the deposition nozzle, thereby ensuring continuous operation of the deposition process. Embodiments of this disclosure also provide a deposition method for a display device (i.e., a deposition method for manufacturing a display device) and an electronic device including a display device.

[0008] However, the embodiments of this disclosure are not limited to those described herein. The above and other embodiments of this disclosure will become more apparent to those skilled in the art upon which this disclosure pertains from the following detailed description.

[0009] According to an embodiment of this disclosure, a deposition apparatus includes: a deposition source including a plurality of deposition nozzles arranged in one direction to spray deposition material; a track disposed above the deposition source along the direction in which the deposition nozzles are arranged; and a moving module disposed on the track, wherein the moving module moves along the track. In such an embodiment, the moving module includes: a carrier on which a substrate is loaded; a deposition mask supported by the carrier and disposed below the substrate; a camera disposed on the carrier, wherein the camera captures images of the deposition nozzles; a laser irradiator disposed on the carrier, wherein the laser irradiator radiates laser light toward the deposition nozzles; and a controller that analyzes the images captured by the camera and controls the laser irradiator.

[0010] In one embodiment, the deposition apparatus may further include a chamber therein housing a deposition source, a track, and a moving module. The moving module may further include a sound sensor that detects sound inside the chamber, and a controller that can analyze the sound detected by the sound sensor to control the operation of the track.

[0011] In one embodiment, the substrate may be disposed below the carrier, and the moving module may also include a mask support extending downward from the carrier to support the deposition mask in such a way that the deposition mask is spaced apart from the carrier.

[0012] In one embodiment, an opening may be defined in the carrier that extends through the carrier in the thickness direction, and the substrate and the deposition mask may at least partially overlap the opening.

[0013] In one implementation, the camera and laser irradiator can be positioned at the end of the carrier in the direction of carrier movement.

[0014] In one implementation, the camera can be positioned ahead of the laser irradiator in the direction of carrier movement.

[0015] In one implementation, the controller can compare an image of the deposition nozzle captured by the camera with a pre-acquired image of the deposition nozzle, and when it is determined that foreign matter has accumulated at the deposition nozzle, control the laser irradiator to radiate laser light toward the foreign matter at the deposition nozzle.

[0016] In one implementation, the controller can compare the sound inside the chamber detected by the sound sensor with the pre-acquired sound inside the chamber, and interrupt the operation of the track based on the comparison result when the sound inside the chamber detected by the sound sensor is different from the pre-acquired sound inside the chamber.

[0017] In one implementation, the controller can interrupt track operation when the decibel level of the sound detected by the sound sensor differs from the decibel level of the pre-acquired sound.

[0018] In one implementation, the controller can interrupt track operation when the sound wave detected by the sound sensor is different from the sound wave of a pre-acquired sound.

[0019] According to embodiments of the present disclosure, a deposition method for a display device includes: loading a substrate on a carrier of a mobile module, wherein a deposition material is to be deposited on the substrate; moving the mobile module along a track disposed above the deposition nozzles in a direction for arranging deposition nozzles; capturing an image of the deposition nozzles by a camera of the mobile module; and controlling a laser irradiator of the mobile module by a controller of the mobile module by analyzing the image captured by the camera.

[0020] In one implementation, controlling the laser irradiator by analyzing images captured by the camera may include: the controller comparing images of the deposition nozzle captured by the camera with pre-acquired images of the deposition nozzle; and the controller controlling the laser irradiator to radiate laser light based on the comparison results.

[0021] In one implementation, controlling the laser irradiator to radiate laser light based on a comparison result may include: if a foreign object is present in an image captured by a camera and the foreign object is not in a pre-acquired image, then the controller controls the laser irradiator to radiate laser light toward the foreign object.

[0022] In an embodiment, the deposition method of the display device may further include: detecting sound inside the chamber containing the deposition nozzle, the track, and the moving module by a sound sensor of the moving module; and controlling the operation of the track by a controller of the moving module by analyzing the sound detected by the sound sensor.

[0023] In one implementation, controlling the operation of the track by the controller through analyzing the sound detected by the sound sensor may include: the controller comparing the sound inside the chamber detected by the sound sensor with the pre-acquired sound inside the chamber; and the controller interrupting the operation of the track based on the comparison result.

[0024] In one implementation, the controller interrupting track operation based on the comparison result may include: when the sound detected by the sound sensor is different from the pre-acquired sound, the controller interrupting track operation.

[0025] In one implementation, the operation of the track by the controller based on the comparison result may include: when the decibel level of the sound detected by the sound sensor is different from the decibel level of the pre-acquired sound, the operation of the track by the controller may be interrupted.

[0026] In one implementation, the operation of the track by the controller based on the comparison result may include: when the sound wave detected by the sound sensor is different from the sound wave of the pre-acquired sound, the operation of the track by the controller may be interrupted.

[0027] According to an embodiment of this disclosure, an electronic device includes: a display device manufactured by a deposition apparatus, wherein the deposition apparatus includes: a deposition source having a plurality of deposition nozzles arranged in one direction for spraying deposition material; a track disposed above the deposition source along the direction in which the deposition nozzles are arranged; and a moving module disposed on the track and moving along the track. In such an embodiment, the moving module includes: a carrier on which a substrate is mounted; a deposition mask supported by the carrier and disposed below the substrate; a camera disposed on the carrier, wherein the camera captures images of the deposition nozzles; a laser irradiator disposed on the carrier, wherein the laser irradiator radiates laser light toward the deposition nozzles; and a controller that analyzes the images captured by the camera and controls the laser irradiator.

[0028] In one embodiment, the deposition apparatus may further include a chamber therein housing a deposition source, a track, and a moving module. The moving module may further include a sound sensor that detects sound inside the chamber, and a controller that can analyze the sound detected by the sound sensor to control the operation of the track.

[0029] According to embodiments of this disclosure, by preventing the accumulation of deposited material at the deposition nozzle of the deposition equipment, it is possible to effectively prevent changes in the spray angle of the deposited material, thereby ensuring continuous operation of the deposition process.

[0030] The effects of embodiments according to this disclosure are not limited to those mentioned above, and many more effects are included in the following description of this disclosure. Attached Figure Description

[0031] The above and other features of the embodiments of this disclosure will become more apparent from the detailed description of the embodiments with reference to the accompanying drawings, in which: Figure 1 This is a side view showing a deposition apparatus according to an embodiment of the present disclosure; Figure 2 yes Figure 1 Front view of the deposition equipment; Figure 3 yes Figure 1 Side view of the moving module; Figure 4 yes Figure 3 Front view of the moving module; Figure 5 yes Figure 3 A floor plan of the moving module; Figure 6 It is shown Figure 3 A block diagram of the track, camera, laser irradiator, sound sensor, and controller; Figure 7This is a view showing a moving module on which a substrate is disposed in a method for manufacturing a display device according to an embodiment of the present disclosure, moving along a track. Figure 8 It is shown Figure 7 A view of a laser irradiator removing foreign matter from a deposition nozzle; Figure 9 It is shown in Figure 7 A view of the laser irradiator moving along a track after removing foreign matter from the deposition nozzle; Figure 10 This is a plan view of a display device manufactured using a deposition apparatus according to an embodiment of the present disclosure; Figure 11 It is along Figure 10 A cross-sectional view of the display device taken by line A-A'; Figure 12 It is shown Figure 11 A cross-sectional view of the display panel; and Figure 13 This is a plan view of an electronic device manufactured by a deposition apparatus according to an embodiment of the present disclosure. Detailed Implementation

[0032] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals throughout denote the same elements.

[0033] It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element, or there can be an intervening element between them. Conversely, when an element is referred to as being "directly" on another element, there is no intervening element.

[0034] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, and / or part from another element, component, region, layer, and / or part. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. Thus, reference to “a” element in a claim followed by “the” element includes one element and multiple elements. For example, “element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that when the terms “comprising” and / or “including” or “containing” and / or “containing” are used in this specification, they specify the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, and / or groups thereof.

[0036] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used herein to describe the relationship between one element and another, as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the relative terms are intended to also encompass different orientations of the device. For example, if a device in one of the drawings is flipped, an element described as being “below” the other elements will subsequently be oriented “above” the other elements. Thus, the term “below” can encompass both “below” and “above” orientations, depending on the specific orientation of the drawing. Similarly, if a device in one of the drawings is flipped, an element described as being “below” or “under” the other elements will subsequently be oriented “above” the other elements. Thus, the term “below” or “under” can encompass both “above” and “below” orientations.

[0037] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms such as those defined in common dictionaries shall be interpreted as having meanings consistent with their meanings in the relevant technical context and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0038] Embodiments are described herein with reference to cross-sectional views, which are schematic diagrams of idealized embodiments. Therefore, deviations from the illustrated shapes will be anticipated, for example, due to manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but should include, for example, deviations in shape due to manufacturing processes. For instance, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0039] Features of the various exemplary embodiments of this disclosure can be combined in part or in whole. As will be clearly understood by those skilled in the art, various technical interactions and operations are possible. The various exemplary embodiments can be practiced individually or in combination.

[0040] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0041] Figure 1 This is a side view showing a deposition apparatus according to an embodiment of the present disclosure. Figure 2 yes Figure 1 Front view of the deposition equipment.

[0042] refer to Figure 1 and Figure 2 The deposition apparatus 100 according to embodiments of the present disclosure may include a chamber 110, a deposition source 120, a track 130, and a moving module 140.

[0043] Chamber 110 provides space for performing deposition processes. During the deposition process, the interior of chamber 110 can be maintained under vacuum. Being under vacuum means maintaining a low pressure inside chamber 110. Chamber 110 may include an inlet / outlet (not shown) for loading / unloading the substrate SUB. Furthermore, chamber 110 may include a vacuum pump (not shown) for controlling the pressure inside chamber 110 and discharging any deposited material not deposited on the substrate SUB, and an exhaust port (not shown) connected to the vacuum pump.

[0044] The substrate SUB on which organic materials or metals used as electrodes are deposited can be configured as an insulating substrate, a semiconductor substrate, a display device substrate, etc., but this disclosure is not limited thereto. According to embodiments, a substrate SUB used in an organic light-emitting display device is described as an example. A predetermined structure can be formed on the substrate SUB via a deposition process. Depending on the manufacturing process of the organic light-emitting display device, structures formed on the substrate SUB via deposition processes can be formed in various ways. In embodiments, for example, in the process of forming a hole injection layer, a pixel defining layer and an anode electrode can be formed on the substrate SUB. Furthermore, in the process of forming an organic light-emitting layer, not only can a pixel defining layer and an anode electrode be formed on the substrate SUB, but also a hole injection layer and a hole transport layer can be formed on the substrate SUB.

[0045] The deposition source 120 can provide the deposition material to be deposited on the substrate SUB. The deposition source 120 can be disposed on the lower side of the chamber 110. The deposition source 120 may include a deposition source body 121 and a plurality of deposition nozzles 122.

[0046] The deposition source body 121 can support a plurality of deposition nozzles 122. The deposition source body 121 can be configured as a block with a predetermined thickness and can extend at the bottom in a first direction D1 within the chamber 110 (or on the inner bottom surface of the chamber 110). A space for accommodating the deposition material can be provided or formed in the deposition source body 121.

[0047] The deposition nozzle 122 can provide deposition material to the substrate SUB by spraying deposition material. The deposition nozzle 122 can be disposed on the upper surface of the deposition source body 121 and supported by the deposition source body 121. The deposition nozzles 122 can be spaced apart from each other on the upper surface of the deposition source body 121 in a first direction D1.

[0048] Track 130 may be disposed above deposition source 120. Track 130 may be disposed above deposition source 120 along the direction in which deposition nozzle 122 is arranged. In some embodiments, track 130 may be disposed above deposition source 120 along a first direction D1. Track 130 may include a plurality of rollers. Rollers may be spaced apart from each other above deposition source 120 along the first direction D1. Track 130 may be disposed above deposition source 120 at two opposite sides of deposition source 120. In some embodiments, track 130 may be disposed on two opposite sides of deposition source 120 to form a space for flow of deposited material. Track 130 may be disposed below moving module 140, and moving module 140 may be moved in the first direction D1 by operation of track 130.

[0049] Figure 3 yes Figure 1 Side view of the mobile module. Figure 4 yes Figure 3 The front view of the moving module. Figure 5 yes Figure 3 A floor plan of the mobile module. Figure 6 It is shown Figure 3 A block diagram of the track, camera, laser irradiator, sound sensor, and controller.

[0050] refer to Figures 3 to 6 In one embodiment, the moving module 140 may be mounted on and movable along the track 130. In some embodiments, the moving module 140 may be moved in a first direction D1 by operation of the track 130. The moving module 140 may include a carrier 141, a deposition mask 142, a mask support 143, a camera 144, a laser irradiator 145, a sound sensor 146, and a controller 147.

[0051] The carrier 141 can hold the substrate SUB. When viewed from above (or in a plan view), the carrier 141 can be rectangular in shape and can have a predetermined thickness. An opening can be defined or formed by passing through the center of the carrier 141 or by penetrating the carrier 141 in the thickness direction (or third direction D3). The opening can overlap with the substrate SUB and the deposition mask 142. The substrate SUB can be disposed below the carrier 141 and held by the carrier 141.

[0052] A deposition mask 142 may be supported by a carrier 141 and may be disposed below a substrate SUB. The deposition mask 142 may be connected to the carrier 141 via a mask support 143. The deposition mask 142 may define an area of ​​the substrate SUB where deposition material ejected from the deposition source 120 is deposited. The deposition mask 142 may include a mask portion and a transmission portion. The mask portion may cover an area of ​​the substrate SUB to prevent deposition material ejected from the deposition source 120 from depositing in that area of ​​the substrate SUB. The transmission portion exposes an area of ​​the substrate SUB and may be an opening defined or formed in the mask portion. Deposition material may be deposited on the area of ​​the substrate SUB exposed by the transmission portion.

[0053] Mask support 143 can extend downward from carrier 141 and can be connected to deposition mask 142. In some embodiments, mask support 143 can connect carrier 141 to deposition mask 142 such that deposition mask 142 is supported by carrier 141. Because mask support 143 extends downward from carrier 141, mask support 143 can support deposition mask 142 in a manner that spaced the deposition mask 142 from carrier 141.

[0054] A camera 144 can be positioned at the carrier 141 to capture images of the deposition nozzle 122. The camera 144 can also be positioned at an end of the carrier 141 in the direction of movement of the carrier 141. In an embodiment, for example, in... Figure 3 In this configuration, camera 144 can be positioned at the right end of carrier 141 in the first direction D1. When the moving module 140 moves, camera 144 can capture an image of the deposition nozzle 122 positioned in front of the moving module 140 in the direction of movement. Camera 144 can then transmit the captured image of the deposition nozzle 122 to controller 147.

[0055] A laser irradiator 145 can be mounted on the carrier 141 to radiate laser light toward the deposition nozzle 122. The laser irradiator 145 can be positioned at an end of the carrier 141 in the direction of movement of the carrier 141. In some embodiments, for example, the laser irradiator 145 can be positioned at the right end of the carrier 141 in a first direction D1. The laser irradiator 145 can be positioned behind the camera 144 in the direction of movement of the moving module 140. In some embodiments, the camera 144 can be positioned forward of the laser irradiator 145 in the direction of movement of the moving module 140.

[0056] A sound sensor 146 can be mounted on the carrier 141 to detect sound in the chamber 110. The sound sensor 146 can transmit the detected sound in the chamber 110 to the controller 147.

[0057] Controller 147 can analyze the images captured by camera 144 to control laser irradiator 145. In some embodiments, controller 147 can compare an image of the deposition nozzle 122 captured by camera 144 with a pre-acquired image of the deposition nozzle 122 (e.g., a reference image of the deposition nozzle 122), and can control laser irradiator 145 based on the comparison result (i.e., the result obtained by comparing the image of the deposition nozzle 122 captured by camera 144 with the pre-acquired image of the deposition nozzle 122). In embodiments, for example, when a foreign object or similar object is present in the image of the deposition nozzle 122 captured by camera 144 and the foreign object or similar object is not in the pre-acquired image of the deposition nozzle 122, controller 147 can determine that a foreign object is present at the deposition nozzle 122. When it is determined that a foreign object is present at the deposition nozzle 122, controller 147 can control laser irradiator 145 to irradiate laser light onto the foreign object. The foreign object accumulated at the deposition nozzle 122 can be removed by the laser light irradiated from laser irradiator 145.

[0058] In one implementation, the controller 147 can analyze the sound detected by the sound sensor 146 to control the operation of the track 130. In some implementations, the controller 147 can compare the sound detected by the sound sensor 146 in the chamber 110 with a pre-acquired sound in the chamber 110 (e.g., a reference sound), and can control the operation of the track 130 based on the comparison result. In one implementation, for example, when the sound detected by the sound sensor 146 inside the chamber 110 is different from the pre-acquired sound inside the chamber 110, the controller 147 can determine that an anomaly exists in the deposition apparatus 100. When the normal sound inside the chamber 110 (i.e., the sound pre-acquired inside the chamber 110 while the deposition apparatus 100 is operating normally) is different from the current sound detected by the sound sensor 146 inside the chamber 110, the controller 147 can determine that an anomaly has occurred in the deposition apparatus 100. When an anomaly is determined to exist in the deposition apparatus 100, the controller 147 can interrupt the operation of the track 130 to stop the movement of the movement module 140.

[0059] When the decibel level of the sound inside chamber 110 detected by sound sensor 146 differs from the pre-acquired decibel level of the sound inside chamber 110, controller 147 can determine that an anomaly exists in deposition apparatus 100 and interrupt operation of track 130.

[0060] In the following description, a deposition method for a display device according to an embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0061] A deposition method for a display device according to embodiments of the present disclosure may include: loading a substrate SUB on a carrier 141, wherein a deposition material is to be deposited on the substrate SUB; moving a moving module 140 along a track 130 disposed above the deposition nozzle 122 in a direction in which the deposition nozzle 122 is arranged; capturing an image of the deposition nozzle 122 by a camera 144; and controlling a laser irradiator 145 by a controller 147 analyzing the image captured by the camera 144.

[0062] Figure 7 This is a view showing a moving module on which a substrate is disposed in a method for manufacturing a display device according to an embodiment of the present disclosure, moving along a track.

[0063] refer to Figure 7In embodiments of the deposition method for a display device, mounting the substrate SUB on the carrier 141 may include mounting the substrate SUB below the carrier 141. In some embodiments, the substrate SUB may be disposed on the carrier 141 between the carrier 141 and the deposition mask 142.

[0064] In an embodiment of the deposition method for a display device, a moving module 140, which moves along a track 130 in the direction in which the deposition nozzle 122 is arranged, may include a carrier 141 on which a substrate SUB is mounted, moving along the track 130 in a first direction D1 according to the operation of the track 130. In some embodiments, the carrier 141 may pass through the deposition nozzle 122 along the track 130. As the carrier 141 passes through the deposition nozzle 122, deposition material ejected from the deposition nozzle 122 may pass through the deposition mask 142 and may be deposited on the substrate SUB.

[0065] During the process of capturing images of the deposition nozzle 122 via camera 144, the camera 144, positioned at the end of the carrier 141 in the direction of movement of the carrier 141, can capture images of the deposition nozzle 122 positioned on the front side in the direction of movement of the moving module 140, while the moving module 140 is moving. The camera 144 can then transmit the captured images of the deposition nozzle 122 to the controller 147.

[0066] Figure 8 It is shown Figure 7 A view of a laser irradiator removing foreign matter from a deposition nozzle.

[0067] refer to Figure 8 Controlling the laser irradiator 145 by the controller 147 through analysis of images captured by the camera 144 may include: the controller 147 comparing an image of the deposition nozzle 122 captured by the camera 144 with a pre-acquired image of the deposition nozzle 122; and the controller 147 controlling the laser irradiator 145 to radiate laser light based on the comparison result. In an embodiment, for example, the controller 147 may compare an image of the deposition nozzle 122 captured by the camera 144 with a pre-acquired image of the deposition nozzle 122, and may control the laser irradiator 145 based on the comparison result. When it is determined that a foreign object FS or similar object is present in the image of the deposition nozzle 122 captured by the camera 144 and that the foreign object FS or similar object is not present in the pre-acquired image of the deposition nozzle 122, the controller 147 may determine that a foreign object FS is present at the deposition nozzle 122. When it is determined that a foreign object FS is present at the deposition nozzle 122, the controller 147 may control the laser irradiator 145 to radiate laser light onto the foreign object FS. Foreign matter FS accumulated at the deposition nozzle 122 can be removed by laser radiation from the laser irradiator 145.

[0068] The deposition method of the display device according to the embodiments of the present disclosure may further include: detecting sound inside the chamber 110 by a sound sensor 146; and controlling the operation of the track 130 by a controller 147 by analyzing the sound detected by the sound sensor 146.

[0069] Figure 9 It is shown in Figure 7 A view of the laser irradiator moving along a track after removing foreign matter from the deposition nozzle.

[0070] refer to Figure 9 Foreign matter FS accumulated at the deposition nozzle 122 is removed by laser irradiator 145 (see Figure 8 Afterward, the moving module 140 can move along the track 130, and deposition material can be deposited on the substrate SUB. Detecting sound inside the chamber 110 via the sound sensor 146 can include detecting sound inside the chamber 110 via the sound sensor 146 during the process of continuously depositing deposition material on the substrate SUB. The sound sensor 146 can send the detected sound in the chamber 110 to the controller 147.

[0071] Controlling the operation of the track 130 by the controller 147 through analysis of the sound detected by the sound sensor 146 may include: the controller 147 comparing the sound inside the chamber 110 detected by the sound sensor 146 with a pre-acquired sound inside the chamber 110; and the controller 147 interrupting the operation of the track 130 based on the comparison result. In an embodiment, for example, the controller 147 may compare the sound in the chamber 110 detected by the sound sensor 146 with a pre-acquired sound in the chamber 110, and may control the operation of the track 130 based on the comparison result. When the sound inside the chamber 110 detected by the sound sensor 146 differs from the pre-acquired sound inside the chamber 110, the controller 147 may determine that an anomaly exists in the deposition apparatus 100. When the normal sound inside the chamber 110 (i.e., the sound inside the chamber 110 pre-acquired while the deposition apparatus 100 is operating normally) differs from the current sound inside the chamber 110 detected by the sound sensor 146, the controller 147 may determine that an anomaly has occurred in the deposition apparatus 100. When an anomaly is detected in the deposition equipment 100, the controller 147 can interrupt the operation of the track 130 to stop the movement of the moving module 140.

[0072] When the decibel level of the sound inside chamber 110 detected by sound sensor 146 differs from the pre-acquired decibel level of the sound inside chamber 110, controller 147 can determine that an anomaly exists in deposition apparatus 100 and interrupt operation of track 130.

[0073] Figure 10 This is a plan view of a display device manufactured by a deposition apparatus according to an embodiment of the present disclosure. Figure 11 It is along Figure 10 A cross-sectional view of the display device taken by line A-A'.

[0074] The display device 10 manufactured by the deposition apparatus 100 according to embodiments of the present disclosure may be a light-emitting display device, such as an organic light-emitting display device using organic light-emitting diodes, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including inorganic semiconductors, and a micro light-emitting display device using micro light-emitting diodes (LEDs). Hereinafter, for ease of description, embodiments in which the display device 10 is an organic light-emitting display device will be described primarily as examples. However, it should be understood that the present disclosure is not limited thereto.

[0075] In one embodiment, when viewed from above, the display device 10 may have a quadrilateral shape, such as a rectangle. For example, when viewed from above, the display device 10 may have a rectangular shape having a long side in a first direction D1 and a short side in a second direction D2 intersecting the first direction D1. The corner where the long side in the first direction D1 meets the short side in the second direction D2 may be rounded with a predetermined curvature or may be a right angle. When viewed from above, the shape of the display device 10 is not limited to a rectangular shape, but may be formed into different polygonal shapes, circular shapes, or elliptical shapes.

[0076] refer to Figure 10 and Figure 11 The display device 10 manufactured by the deposition apparatus 100 according to the embodiments of the present disclosure may include a cover window 11, a display panel 12, a panel bottom member 13, a connecting member 14, and a driver circuit board 15.

[0077] Cover window 11 may include a material with high light transmittance. Cover window 11 may include a polymer resin such as polyimide or glass. Cover window 11 may be attached to the polarizing film PF of display panel 12 by an adhesive member such as an optically clear adhesive (OCA) film.

[0078] The display panel 12 can be disposed below the cover window 11. When viewed from above, the display panel 12 can have a rectangular shape having a long side in a first direction D1 and a short side in a second direction D2. In the display panel 12, the corner where the long side in the first direction D1 and the short side in the second direction D2 meet can be formed at a right angle or can be rounded with a predetermined curvature. When viewed from above, the display panel 12 can have a quadrilateral shape other than a rectangle, a polygonal shape other than a quadrilateral shape, a circular shape, an elliptical shape, or an irregular shape.

[0079] The display panel 12 may include a display area where multiple light-emitting regions are arranged, and a non-display area surrounding the display area. The non-display area may surround the display area. Multiple display pads may be located in the non-display area at one edge of the display panel 12.

[0080] The display panel 12 may include a substrate SUB, a display unit PAL, a sensor unit SENL, and a polarizing film PF.

[0081] The substrate SUB can include insulating materials such as glass, quartz, and polymer resin, or be made of insulating materials such as glass, quartz, and polymer resin. The substrate SUB can be a rigid substrate or a flexible substrate that can be bent, folded, rolled, etc.

[0082] The display unit (PAL) can be disposed on the substrate (SUB). The display unit (PAL) can be a layer comprising multiple emitting regions that emit light. The display unit (PAL) may include a buffer film, a thin-film transistor layer on which thin-film transistors are disposed, a light-emitting element layer, and an encapsulation layer for encapsulating the light-emitting element layer.

[0083] The sensor unit SENL can be mounted on the display unit PAL. The sensor unit SENL may include sensor electrodes and can sense whether a user is touching the screen.

[0084] A polarizing film PF can be disposed on the sensor unit SENL. The polarizing film PF can effectively prevent the degradation of image visibility of the display panel 12 due to reflection of external light. The polarizing film PF may include a linear polarizer and a phase retardation film such as a λ / 4 (quarter wavelength) plate. The phase retardation film can be disposed on the sensor unit SENL, and the linear polarizer can be disposed on the phase retardation film. A cover window 11 can be disposed on the polarizing film PF.

[0085] The bottom panel member 13 may be disposed below the substrate SUB. The bottom panel member 13 may be attached to the lower surface of the substrate SUB by means of an adhesive member. The adhesive member may be a pressure-sensitive adhesive (PSA). The bottom panel member 13 may include at least one selected from light-absorbing members for absorbing light incident from the outside, buffer members for absorbing external impacts, and heat-dissipating members for effectively dissipating heat from the display panel 12.

[0086] A light-absorbing component may be disposed beneath the substrate SUB. The light-absorbing component blocks light transmission to effectively prevent components disposed beneath it (such as driver circuit board 15) from being seen from above the display panel 12. The light-absorbing component may comprise a light-absorbing material such as black pigment and black dye.

[0087] A buffer member can be disposed below the light-absorbing member. The buffer member absorbs external impacts to prevent damage to the display panel 12. The buffer member can be composed of a single layer or multiple layers. In embodiments, for example, the buffer member can include or be formed of a polymer resin, such as polyurethane, polycarbonate, polypropylene, and polyethylene, or can include or be formed of an elastic material, such as rubber and a sponge obtained by foaming a polyurethane-based material or an acrylic-based material.

[0088] The heat dissipation component can be disposed below the buffer component. The heat dissipation component may include a first heat dissipation layer and a second heat dissipation layer, wherein the first heat dissipation layer comprises graphite or carbon nanotubes, and the second heat dissipation layer is formed of a thin metal film, such as copper, nickel, ferrite, and silver, which can block electromagnetic waves and has high thermal conductivity.

[0089] The connecting member 14 can be connected to a plurality of display pads on the display panel 12 via a conductive adhesive member such as an anisotropic conductive film. Therefore, the display panel 12 and the connecting member 14 can be electrically connected to each other.

[0090] Furthermore, the connecting member 14 can be connected to multiple circuit pads of the driver circuit board 15 via a conductive adhesive member such as an anisotropic conductive film. Therefore, the connecting member 14 and the driver circuit board 15 can be electrically connected to each other.

[0091] The connecting member 14 can be a flexible printed circuit board or a chip on film.

[0092] When the connecting member 14 is bent, the driver circuit board 15 can be positioned below the bottom member 13 of the panel. The driver circuit board 15 can be a flexible printed circuit board (FPCB) that can be bent, a rigid printed circuit board (PCB) that is not easily bent, or a composite printed circuit board that includes both rigid and flexible printed circuit boards.

[0093] The driver circuit board 15 can process the signal converted by the control circuit board (not shown) and send the signal to the display panel 12. The driver circuit board 15 can be electrically connected to the display panel 12 via the connecting member 14.

[0094] Figure 12 It is shown Figure 11 A cross-sectional view of the display panel.

[0095] refer to Figure 12 In an embodiment, the display unit PAL may include a buffer film 202, a thin film transistor layer 203, a light-emitting element layer 204, and an encapsulation layer 205.

[0096] A buffer film 202 can be formed on the substrate SUB. The buffer film 202 can be formed on the substrate SUB to protect the thin-film transistor 235 and the light-emitting element from moisture penetration through the moisture-sensitive substrate SUB. The buffer film 202 can be formed (or defined by) a plurality of inorganic layers stacked alternately on top of each other. In an embodiment, for example, the buffer film 202 can be formed from a silicon oxide layer (SiO2). x ), silicon nitride layer (SiN) x It is a multilayer structure consisting of one or more inorganic layers, including SiON layers, stacked alternately. In another embodiment, the buffer film 202 may be omitted.

[0097] Thin-film transistor layer 203 is formed on buffer film 202. Thin-film transistor layer 203 includes thin-film transistor 235, gate insulator 236, interlayer dielectric film 237, protective film 238 and organic film 239.

[0098] Each of the thin-film transistors 235 includes an active layer 231, a gate electrode 232, a source electrode 233, and a drain electrode 234. In an embodiment, as... Figure 12 As shown, the thin-film transistor 235 can be implemented as a top-gate transistor in which the gate electrode 232 is located above the active layer 231. However, it should be understood that this disclosure is not limited thereto. In another embodiment, the thin-film transistor 235 can be implemented as a bottom-gate transistor in which the gate electrode 232 is located below the active layer 231, or as a dual-gate transistor in which the gate electrode 232 is disposed above and below the active layer 231.

[0099] An active layer 231 is formed on the buffer film 202. The active layer 231 may comprise a silicon-based semiconductor material or an oxide-based semiconductor material, or be formed of either a silicon-based semiconductor material or an oxide-based semiconductor material. In embodiments, for example, the active layer 231 may be formed of polycrystalline silicon, amorphous silicon, or an oxide semiconductor. A light-blocking layer for blocking external light from incident on the active layer 231 may be formed between the buffer film 202 and the active layer 231.

[0100] Gate insulator 236 can be formed on active layer 231. Gate insulator 236 can be made of, for example, silicon oxide layer (SiO2). x ), silicon nitride layer (SiN) x It can be formed by multiple inorganic layers, or by the formation of such layers.

[0101] The gate electrode 232 may be formed on the gate insulator 236. The gate electrode 232 and the gate line may be composed of a single layer or multiple layers of at least one selected from molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof (or defined by a single layer or multiple layers of at least one selected from molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof).

[0102] An interlayer dielectric film 237 may be formed on the gate electrode 232 and the gate line. The interlayer dielectric film 237 may include, for example, a silicon oxide layer (SiO2). x ), silicon nitride layer (SiN) x ) or its multiple inorganic layers or made of materials such as silicon oxide layers (SiO) x ), silicon nitride layer (SiN) x It can be formed by multiple inorganic layers, or by the formation of such layers.

[0103] Source electrode 233 and drain electrode 234 may be formed on interlayer dielectric film 237. Each of source electrode 233 and drain electrode 234 may be connected to active layer 231 through a contact hole defined by gate insulator 236 and interlayer dielectric film 237. Source electrode 233 and drain electrode 234 may consist of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof (or defined by a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof).

[0104] A protective film 238 may be formed on the source electrode 233 and the drain electrode 234 to insulate the thin-film transistor 235. The protective film 238 may include, for example, a silicon oxide layer (SiO2). x ), silicon nitride layer (SiN) x ) or its multiple inorganic layers or made of materials such as silicon oxide layers (SiO) x ), silicon nitride layer (SiN) x It can be formed by multiple inorganic layers, or by the formation of such layers.

[0105] An organic film 239 can be formed on a protective film 238 to provide a flat surface over thin-film transistors 235 with different layers. The organic film 239 can be realized as an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0106] The light-emitting element layer 204 is formed on the thin-film transistor layer 203. The light-emitting element layer 204 includes a light-emitting element and a diaphragm.

[0107] The light-emitting element and the embankment are formed on the organic film 239. An organic light-emitting device including an anode electrode 241, an emitting layer 242 and a cathode electrode 243 is used as an example of a light-emitting element.

[0108] The anode electrode 241 can be formed on the organic film 239. The anode electrode 241 can be connected to the source electrode 233 of the thin-film transistor 235 via a contact hole that penetrates through the protective film 238 and the organic film 239.

[0109] A dam can be formed to cover the edge of the anode electrode 241 on the organic film 239 to define the emission region EA of the pixel. In such an embodiment, the dam can define the emission region EA of the pixel. In each pixel, the anode electrode 241, the emission layer 242, and the cathode electrode 243 are stacked on top of each other in sequence, such that holes from the anode electrode 241 and electrons from the cathode electrode 243 recombine with each other in the emission layer 242 to emit light.

[0110] An emitting layer 242 is formed on the anode electrode 241 and the embankment. The emitting layer 242 can be an organic emitting layer. The emitting layer 242 can emit one of red, green, and blue light. Alternatively, the emitting layer 242 can be a white emitting layer that emits white light. In such an embodiment, the red, green, and blue emitting layers can be stacked on top of each other, or can be formed as a common layer throughout the pixels. In such an embodiment, the display panel 12 may also include additional color filters for representing red, green, and blue colors.

[0111] The emitting layer 242 may include a hole transport layer, a light-emitting layer, and an electron transport layer. Furthermore, the emitting layer 242 may be formed in a series structure of two or more stacks, in which case a charge-generating layer may be formed between the stacks.

[0112] A cathode electrode 243 is formed on the emitter layer 242. The cathode electrode 243 may be formed to cover the emitter layer 242. The cathode electrode 243 may be a common layer formed throughout the pixels.

[0113] In an embodiment where the light-emitting element layer 204 is a top-emitting type in which light is emitted upwards, the anode electrode 241 can be made of a metallic material with high reflectivity (such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO)). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). The cathode electrode 243 can be formed of a transparent conductive material (TCP) capable of transmitting light (such as ITO and IZO) or a semi-transmissive conductive material (such as magnesium (Mg), silver (Ag), and an alloy of magnesium (Mg) and silver (Ag)). In an embodiment where the cathode electrode 243 is formed of a transparent conductive material, the light extraction efficiency can be improved by using a microcavity.

[0114] In an embodiment where the light-emitting element layer 204 is a bottom-emitting type in which light is emitted downwards, the anode electrode 241 may include a transparent conductive material (TCP) or a semi-transparent conductive material, or be formed of a transparent conductive material (TCP) or a semi-transparent conductive material, wherein the transparent conductive material (TCP) is, for example, ITO and IZO, which are transmissive to light, and the semi-transparent conductive material is, for example, magnesium (Mg), silver (Ag), and alloys of magnesium (Mg) and silver (Ag). The cathode electrode 243 may be made of a metallic material with high reflectivity (such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO)). In an embodiment where the anode electrode 241 is formed of a semi-transparent conductive material, the light extraction efficiency can be improved by using a microcavity.

[0115] An encapsulation layer 205 is formed on the light-emitting element layer 204. The encapsulation layer 205 serves to prevent oxygen or moisture from penetrating into the emitting layer 242 and the cathode electrode 243. In such embodiments, the encapsulation layer 205 may include at least one inorganic film. The inorganic film may include silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide, or may be formed from silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. In embodiments, the encapsulation layer 205 may also include at least one organic film. The organic film may have sufficient thickness to effectively prevent particles from penetrating into the encapsulation layer 205 and entering the emitting layer 242 and the cathode electrode 243. The organic film may include at least one selected from epoxy resins, acrylates, and polyurethane acrylates.

[0116] The sensor unit SENL can be formed on the encapsulation layer 205. When the sensor unit SENL is formed directly on the encapsulation layer 205, the thickness of the display device 10 can be reduced compared to a display device in which a separate touch panel is attached to the encapsulation layer 205.

[0117] The sensor unit SENL may include sensor electrodes for sensing a user's touch via capacitive sensing and touch lines for connecting pads to the sensor electrodes. In some embodiments, for example, the sensor unit SENL may sense the user's touch via self-capacitance sensing or mutual capacitance sensing. In other embodiments, such as... Figure 12 As shown, the sensor unit SENL is composed of two layers (or defined by two layers including a driving electrode TE, a sensing electrode RE, and a bridge BE connected between the driving electrodes TE for mutual capacitance sensing).

[0118] The bridge BE can be formed on the encapsulation layer 205. The bridge BE can include, but is not limited to, a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO), or a stacked structure of aluminum and titanium (Ti / Al / Ti), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). In embodiments, for example, the bridge BE can have a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0119] The first sensing insulating film TINS1 is formed on the bridge BE. The first sensing insulating film TINS1 may be formed of an inorganic film (e.g., a silicon nitride layer, a silicon oxide nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0120] The driving electrode TE and the sensing electrode RE can be formed on the first sensing insulating film TINS1. The driving electrode TE and the sensing electrode RE can be formed as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO), but are not limited thereto. In embodiments, for example, the driving electrode TE and the sensing electrode RE can have a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0121] A contact hole can be formed in the first sensing insulating film TINS1, which penetrates the first sensing insulating film TINS1 to expose the bridge BE. The drive electrode TE can be connected to the bridge BE through the contact hole.

[0122] A second sensing insulating film TINS2 is formed on the driving electrode TE and the sensing electrode RE. The second sensing insulating film TINS2 can provide a flat surface on the driving electrode TE, the sensing electrode RE, and the bridge BE, which have different heights. The second sensing insulating film TINS2 may include or be formed of an organic layer, such as an acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0123] A bridge BE connecting adjacent driving electrodes TE can be disposed on the encapsulation layer 205, and the driving electrode TE and the sensing electrode RE can be disposed on the first sensing insulating film TINS1. Therefore, the driving electrode TE and the sensing electrode RE can be electrically separated from each other at their intersection, while the sensing electrode RE can be electrically connected to each other in one direction, and the driving electrode TE can be electrically connected to each other in the other direction.

[0124] The polarizing film PF can be set on the second sensing insulating film TINS2 and can effectively prevent the degradation of the image visibility of the display panel 12 due to the reflection of external light.

[0125] Figure 13 This is a plan view of an electronic device manufactured by a deposition apparatus according to an embodiment of the present disclosure.

[0126] refer to Figure 13 An electronic device 1 manufactured by the deposition apparatus 100 according to embodiments of the present disclosure may include a display device 10 providing a display screen. Examples of electronic device 1 may include, but are not limited to, mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic managers, e-books, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation devices, ultra-mobile PCs (UMPCs), televisions, game consoles, watch-type electronic devices, head-mounted displays, personal computer monitors, laptop computers, vehicle dashboards, digital cameras, portable video cameras, outdoor billboards, electronic billboards, various medical devices, various examination devices, various household appliances including display areas (such as refrigerators and washing machines), Internet of Things (IoT) devices, etc. Examples of electronic device 1 may include, but are not limited to, smartphones, tablet PCs, laptop computers, etc.

[0127] Electronic device 1 may include a display area DA and a non-display area NDA. When viewed from above, the shape of the display area DA may follow the shape of electronic device 1. In an embodiment, for example, when electronic device 1 has a rectangular shape when viewed from above or on a third-party view D3, the display area DA may also have a rectangular shape when viewed from above.

[0128] The display area DA may include a plurality of pixels of the display device 10 to display an image. Because the non-display area NDA does not include pixels of the display device 10, the non-display area NDA may not display an image. The non-display area NDA may be disposed around the display area DA. The non-display area NDA may surround the display area DA, but the exemplary embodiments of this disclosure are not limited thereto. The display area DA may be partially surrounded by the non-display area NDA.

[0129] This invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

[0130] Although the invention has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. Deposition equipment, including: A deposition source includes multiple deposition nozzles arranged in one direction to spray deposition material; The track is positioned above the deposition source along the direction in which the deposition nozzles are arranged; as well as A moving module is disposed on the track, wherein the moving module moves along the track. The mobile module includes: A carrier on which a substrate is loaded; A deposition mask, supported by the carrier and disposed beneath the substrate; A camera, mounted on the carrier, captures images of the deposition nozzle; A laser irradiator, disposed on the carrier, wherein the laser irradiator radiates laser light toward the deposition nozzle; and The controller analyzes the images captured by the camera and controls the laser irradiator.

2. The deposition apparatus according to claim 1, further comprising: The chamber contains the deposition source, the track, and the moving module. The moving module further includes a sound sensor for detecting sound inside the cavity, and The controller analyzes the sound detected by the sound sensor to control the operation of the track.

3. The deposition apparatus according to claim 1, wherein, The substrate is disposed below the carrier, and The mobile module further includes: A mask support extends downward from the carrier to support the deposition mask in a manner that spaces the deposition mask from the carrier.

4. The deposition apparatus according to claim 1, wherein, An opening is defined in the carrier that extends through the carrier in the thickness direction. The substrate and the deposition mask at least partially overlap with the opening.

5. The deposition apparatus according to claim 1, wherein, The camera and the laser irradiator are positioned at the end of the carrier in the direction of its movement.

6. The deposition apparatus according to claim 5, wherein, The camera is positioned ahead of the laser irradiator in the direction in which the carrier moves.

7. The deposition apparatus according to claim 1, wherein, The controller compares the image of the deposition nozzle captured by the camera with a pre-acquired image of the deposition nozzle, and when it is determined that foreign matter has accumulated at the deposition nozzle, controls the laser irradiator to radiate laser light toward the foreign matter at the deposition nozzle.

8. The deposition apparatus according to claim 2, wherein, The controller compares the sound inside the cavity detected by the sound sensor with the pre-acquired sound inside the cavity, and interrupts the operation of the track based on the comparison result when the sound inside the cavity detected by the sound sensor is different from the pre-acquired sound inside the cavity.

9. The deposition apparatus according to claim 8, wherein, When the decibel level of the sound detected by the sound sensor differs from the pre-acquired decibel level of the sound, the controller interrupts the operation of the track.

10. The deposition apparatus according to claim 8, wherein, When the sound wave detected by the sound sensor is different from the sound wave of the pre-acquired sound, the controller interrupts the operation of the track.

11. A deposition method for a display device, the deposition method comprising: A substrate is mounted on a carrier of a mobile module, wherein a deposition material is to be deposited on the substrate; The moving module moves along a track positioned above the deposition nozzle in the direction in which the deposition nozzle is arranged; The image of the deposition nozzle is captured by the camera of the moving module; and The controller of the mobile module controls the laser irradiator of the mobile module by analyzing the images captured by the camera.

12. The deposition method according to claim 11, wherein, Controlling the laser irradiator by the controller through analysis of the images captured by the camera includes: The controller compares the image of the deposition nozzle captured by the camera with a pre-acquired image of the deposition nozzle; and The controller controls the laser irradiator to radiate laser light based on the comparison results.

13. The deposition method according to claim 12, wherein, The controller controlling the laser irradiator to radiate the laser based on the comparison result includes: When a foreign object is present in the image captured by the camera and the foreign object is not in the previously acquired image, the controller controls the laser irradiator to radiate the laser toward the foreign object at the deposition nozzle.

14. The deposition method according to claim 11, further comprising: The sound sensor of the moving module detects the contents contained therein. There is sound inside the chamber of the deposition nozzle, the track, and the moving module; as well as The controller of the moving module controls the operation of the track by analyzing the sound detected by the sound sensor.

15. The deposition method according to claim 14, wherein, The operation of controlling the track by the controller through analyzing the sound detected by the sound sensor includes: The controller compares the sound inside the cavity detected by the sound sensor with a pre-acquired sound inside the cavity; and The controller interrupts the operation of the track based on the comparison result.

16. The deposition method according to claim 15, wherein, The operation of interrupting the track by the controller based on the comparison result includes: When the sound detected by the sound sensor is different from the pre-acquired sound, the controller interrupts the operation of the track.

17. The deposition method according to claim 15, wherein, The operation of interrupting the track by the controller based on the comparison result includes: When the decibel level of the sound detected by the sound sensor differs from the pre-acquired decibel level of the sound, the controller interrupts the operation of the track.

18. The deposition method according to claim 15, wherein, The operation of interrupting the track by the controller based on the comparison result includes: When the sound wave detected by the sound sensor is different from the sound wave of the pre-acquired sound, the controller interrupts the operation of the track.

19. An electronic device, including a display device manufactured by a deposition apparatus, wherein, The deposition apparatus includes: A deposition source includes multiple deposition nozzles arranged in one direction to spray deposition material; A track is arranged above the deposition source along the direction in which the deposition nozzles are arranged; and A moving module is disposed on the track, wherein the moving module moves along the track. The mobile module includes: A carrier on which a substrate is loaded; A deposition mask, supported by the carrier and disposed beneath the substrate; A camera, mounted on the carrier, captures images of the deposition nozzle; A laser irradiator, disposed on the carrier, wherein the laser irradiator radiates laser light toward the deposition nozzle; and The controller analyzes the images captured by the camera and controls the laser irradiator.

20. The electronic device according to claim 19, wherein, The deposition apparatus also includes: The chamber contains the deposition source, the track, and the moving module. The moving module further includes a sound sensor for detecting sound inside the cavity, and The controller analyzes the sound detected by the sound sensor to control the operation of the track.

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