Artificial intelligence algorithm acceleration system and method for IGBT real-time junction temperature prediction
By employing the Zynq7000 series FPGA SoC architecture and dedicated neural network processor in the IGBT system, combined with mixed-precision computing and multi-level cache design, the problems of high accuracy, low latency and energy efficiency in IGBT junction temperature prediction are solved, and efficient junction temperature monitoring at the edge is achieved.
Patent Information
- Application Number
- CN202610150760.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-03
- Publication Date
- 2026-05-26
AI Technical Summary
Existing technologies lack a solution for online prediction of IGBT junction temperature that can achieve high accuracy, low latency, and high energy efficiency at the edge of large-scale power systems, and also suffer from high computational load, high communication costs, and data privacy issues.
It adopts a SoC architecture based on Zynq7000 series FPGA, integrating a dual-core ARM Cortex-A9 processor and a dedicated neural network processor NPU. It combines mixed-precision vector inner product units and three-dimensional matrix inner product operation units to design a multi-level cache system, realize hardware and software co-optimization, and filter effective operations through the approximate prior vector inner product method (AVIP) to reduce computation latency and memory access.
It achieves high-precision, low-latency, and low-energy-consumption IGBT junction temperature prediction at the edge, with an average prediction error of less than 3°C, adapting to the needs of large-scale distributed deployment and avoiding high communication costs and data privacy leakage risks.