Needle base welding system and method for IGBT module packaging
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAIJING ASIA PACIFIC SEMICON TECH (ZHEJIANG) CO LTD
- Filing Date
- 2026-01-31
- Publication Date
- 2026-05-26
Smart Images
Figure CN122094440A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and for example to a pin socket soldering system and method for IGBT module packaging. Background Technology
[0002] In the field of IGBT module packaging, some high-power modules require pin connections. Currently, there are two types of pins available for signal connection: integrated pins, where the pin and socket are molded as one piece, and separate pins, where the pin and socket are separate. The socket is first soldered to the DBC, and then the pin is inserted into the socket. Current soldering methods generally employ reflow soldering.
[0003] Chinese invention patent application number 202411141773.1 discloses a pin suction nozzle, pin assembly equipment and method applicable to DBC boards. The system uses a vibrating feeding tray to sort bulk pins, and after the pins are adsorbed laterally by a vacuum suction nozzle, they are transferred to an independent flipping device for posture adjustment, and finally inserted into the pin holder that has been soldered onto the DBC.
[0004] While existing technologies can automate material feeding, they suffer from the following technical limitations: First, its feeding method is inefficient and uncontrollable. When using a planar vibrating feeding tray to process bulk pins, the pins are simply scattered on the horizontal tray surface without forming a regular arrangement or orderly posture. Most pins are randomly tilted and overlapping, requiring the vision system to individually identify and locate the position and posture of each pin, resulting in a large computational load and recognition accuracy significantly affected by the randomness of the operation.
[0005] Secondly, the grasping process is complex and inefficient. Because the pins are not pre-arranged, the vacuum nozzle needs to move repeatedly above the tray and attempt to grasp multiple times to complete the pickup of a batch of pins. This "identify-move-grab" cyclical operation mode not only increases the movement path and cycle time of the robotic arm, but also easily leads to problems such as missed or incorrect grasping due to the random distribution of pins in actual production, requiring additional material replenishment and error correction mechanisms.
[0006] Third, there is redundancy in process connections. This solution requires a dedicated flipping station: first, the horizontally gripped PIN pins are placed on an independent flipping table, where their posture is adjusted, and then a suction nozzle performs a secondary adsorption from the end face. This process of planar vibration feeding, horizontal gripping, transfer to an independent flipping table, active flipping, and vertical gripping not only increases the complexity and floor space of the equipment, but also requires vacuum nozzles to repeatedly grip and place the pins between processes, further reducing the overall cycle time efficiency.
[0007] Fourth, and more importantly, this technical solution is designed entirely for the mechanical insertion of PIN pins into a fixed pin holder. Its entire system architecture serves the specific purpose of PIN pin insertion and cannot be applied to the soldering and fixing of the pin holder itself. When the technical problem becomes "how to fix the pin holder itself to the DBC with high precision and high reliability," this solution cannot provide a suitable connection method, and its inefficient feeding and attitude adjustment scheme is unsuitable for tasks like the pin holder, which differs significantly from the PIN pin in shape, size, and weight. Summary of the Invention
[0008] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.
[0009] This disclosure provides a pin socket welding system and method for IGBT module packaging, which solves the problems of low production efficiency and insufficient precision in the pin socket welding and feeding process in the prior art.
[0010] In some embodiments, a pin socket welding system for IGBT module packaging is provided, characterized in that it includes: a vibratory feeding device, a pin socket guiding mechanism, an ultrasonic welding mechanism, and a calibration and detection mechanism; the vibratory feeding device includes a vibratory feeding bowl, the vibratory feeding bowl having a spiral climbing track inside, the spiral climbing track having an inclination angle and branching at the end to form a single-row track; the pin socket guiding mechanism is disposed below the single-row track, including vertical tracks corresponding one-to-one with the single-row track, the starting end of the vertical track being lower than the rim of the vibratory feeding bowl; the ultrasonic welding mechanism includes an ultrasonic welding head with suction holes, the ultrasonic welding head being used to adsorb the pin socket and perform welding operations; the visual calibration mechanism includes a first camera and a laser rangefinder sensor disposed on the ultrasonic welding head, used to perform position calibration and height detection of the pin socket.
[0011] Preferably, it further includes: an air blowing device, wherein the air blowing device is provided on the side of the vibrating feeding bowl, the air blowing device being used to blow the needle seats that have not entered the single track back into the vibrating feeding bowl.
[0012] Preferably, it further includes: a flipping mechanism, which is disposed at the end of the vertical track, and the flipping mechanism drives the needle holder to flip to a preset welding posture by vacuum adsorption of the needle holder.
[0013] Preferably, the inclination angle of the spiral climbing track is set to 30° to 60°, and the width of the single track is adapted to the thickness of a single needle seat.
[0014] Preferably, it includes: a second camera disposed on the working platform, a concentric circle moving arm disposed above the second camera, the second camera being used to detect the qualification of the needle holder, and moving unqualified needle holders to the throwing box for throwing and picking up the needle holders again.
[0015] Preferably, the system further includes: an image processing and decision-making unit, which is communicatively connected to the second camera; the image processing and decision-making unit is pre-loaded with a neural network model, which is used to intelligently analyze the pin seat images acquired by the second camera, identify pin seat defects and determine their qualification; the system controls the actuator to discard unqualified pin seats according to the judgment result.
[0016] In some embodiments, a pin socket welding method for IGBT module packaging is disclosed. The method includes: pouring bulk pin sockets into a vibrating feeding bowl, causing them to move along a spiral climbing track and enter a single-row track via vibration; the pin sockets falling through the single-row track into a vertical track below, arranged vertically under gravity; the pin sockets moving to the end of the vertical track as a preset welding posture; performing ultrasonic welding on the pin sockets; calibrating the position and height of the pin sockets using a first camera and a laser rangefinder; and moving the calibrated pin sockets to a designated position on the DBC substrate and completing the welding via ultrasonic welding.
[0017] Preferably, the pin holder welding system for IGBT module packaging with a flipping mechanism is used, wherein the pin holder moves to the end of a vertical track as a preset welding posture, including: at the end of the vertical track, the pin holder is attracted by the flipping mechanism and flipped to the preset welding posture.
[0018] Preferably, the method is applied to a pin holder welding system for IGBT module packaging with an image processing and decision unit. Before the pin holder moves to the end of the vertical track as a preset welding posture, the method further includes: blowing the pin holder that has not fallen into the vertical track back to the vibrating feed bowl by a side air blowing device.
[0019] Preferably, the method, applied to an IGBT module packaging pin socket welding system with a second camera and an air blowing device, further includes, before calibrating the position and height of the pin socket using a first camera and a laser rangefinder: acquiring a pin socket image using a second camera mounted on the work platform; inputting the image into a pre-trained neural network model for defect identification and classification; if the pin socket is identified as defective, controlling a ejector mechanism to reject it; if the pin socket is identified as qualified, continuing.
[0020] The present disclosure provides a pin socket soldering system and method for IGBT module packaging, which can achieve the following technical effects: By designing a spiral climbing track inside the vibrating bowl, the needle holders automatically queue up and approach the track during the rotation and ascent, significantly improving the low production efficiency during the needle holder welding and feeding process.
[0021] The above general description and the description below are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description
[0022] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein: Figure 1 This is a schematic diagram of a pin socket welding system for IGBT module packaging provided in an embodiment of this disclosure; Figure 2 This is a schematic diagram of a vibratory feeding device provided in an embodiment of this disclosure; Figure 3 This is a schematic diagram of an ultrasonic welding mechanism and a visual calibration mechanism provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram showing the position of a pin socket welding system for IGBT module packaging provided in an embodiment of this disclosure; Figure 5 This is a flowchart of a pin socket soldering method for IGBT module packaging provided in this embodiment; Figure 6 This is a schematic diagram of another IGBT module packaging pin socket welding system provided in this embodiment; Figure label: 1: Vibrating feeding device; 2: Needle seat guiding mechanism; 3: Ultrasonic welding mechanism; 4: Calibration and testing mechanism; 5: Air blowing device; 6: Tilting mechanism; 11: Vibrating feeding bowl; 12: Spiral climbing track; 41: First camera; 42: Laser rangefinder sensor; 43: Second camera; 44: Moving arm. Detailed Implementation
[0023] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and push rods may be simplified in their depiction to simplify the drawings.
[0024] The following description and accompanying drawings fully illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. The scope of embodiments of the invention includes the entire scope of the claims and all available equivalents of the claims. In the embodiments disclosed herein, each embodiment may be referred to individually or collectively with the term "invention," which is merely for convenience and is not intended to automatically limit the scope of application to any single invention or inventive concept if more than one invention is disclosed. In the embodiments disclosed herein, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another entity or operation, without requiring or implying any actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, system, or module that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, system, or module. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, system, or module that includes said element. The various embodiments in this disclosure are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems, products, etc., disclosed in the embodiments, since they correspond to the system portion disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the system portion description.
[0025] Currently, there is a lack of a pin socket welding system and method for IGBT module packaging to solve the problems of low production efficiency and insufficient precision in the pin socket welding and feeding process.
[0026] To address the problems existing in the relevant technologies, see [link to relevant documentation]. Figure 1 This disclosure provides a pin socket welding system for IGBT module packaging, including: a vibration feeding device 1, a pin socket guiding mechanism 2, a flipping mechanism 6, an ultrasonic welding mechanism 3, and a calibration and testing mechanism 4.
[0027] See Figure 2This is a schematic diagram of the vibrating feeding device 1. The vibrating feeding device 1 includes a vibrating feeding bowl 11. A spiral climbing track 12 is machined inside the feeding bowl. The bottom of the track connects to the bottom of the bowl, and the top extends to the edge of the bowl's rim. The entire track is inclined at a certain angle relative to the horizontal plane. At the end of the spiral climbing track 12, its width narrows and branches into multiple parallel single-row tracks. The width of each single-row track is slightly greater than the thickness of a single needle seat, ensuring that the needle seats can pass through in a single row, lying flat.
[0028] Directly below the multiple single-row tracks, a needle holder guide mechanism 2 is installed, which includes multiple vertical tracks corresponding one-to-one with the single-row tracks. The upper entrance of the vertical track is located below the rim plane of the vibrating feed bowl 11, allowing the needle holders sliding out from the single-row tracks to fall naturally into the vertical tracks under the influence of gravity. During this process, the needle holders automatically change from a flat position to a vertical position, meaning that the central axis of the needle holders is approximately perpendicular to the horizontal plane. An air blowing device 5 is installed on the side of the junction between the single-row tracks and the vertical tracks. If any individual needle holder fails to fall accurately into the vertical track, the air blowing device 5 will spray air to blow it back into the vibrating feed bowl 11, allowing it to rejoin the feeding cycle.
[0029] At the end of each vertical track, a flipping mechanism 6 is installed. The flipping mechanism 6 is a vacuum suction head that can rotate around a horizontal axis. When the needle holder slides down the vertical track to the end, the vacuum suction head is activated and adsorbs the bottom of the needle holder. Then, the flipping mechanism 6 drives the vacuum suction head to rotate a certain angle, flipping the originally vertical needle holder to a horizontal position with the welding surface, i.e., the end to be welded to the DBC, facing downwards in the preset welding posture.
[0030] See Figure 3 This is a schematic diagram of an ultrasonic welding mechanism 3 and a visual calibration mechanism. The ultrasonic welding mechanism 3 includes a welding head module that can move along multiple axes. An ultrasonic welding head is installed at the end of the module, and an adsorption hole is formed at the center of the end face of the ultrasonic welding head. When the welding head module moves above the flipping mechanism 6, the ultrasonic welding head descends, and the negative pressure generated by its adsorption hole adsorbs and fixes the needle seat, which is in a horizontal position.
[0031] The calibration and testing mechanism 4 consists of two parts. The first part is a first camera 41 and a laser rangefinder 42 integrated near the ultrasonic welding head. The first camera 41 is used to observe the adsorbed needle holder from the side and perform horizontal position calibration. The laser rangefinder 42 emits a laser vertically downward to accurately measure the distance between the welding head end face and the surface of the DBC substrate below, providing key data for controlling the welding pressure.
[0032] See Figure 4 This is a schematic diagram showing the location of the pin socket soldering system for IGBT module packaging.
[0033] See Figure 5This disclosure provides a flowchart of a pin socket soldering method for IGBT module packaging, applied to the aforementioned pin socket soldering system for IGBT module packaging. The method includes: S110, the bulk needle holder is poured into the vibrating feeding bowl 11, and the vibration causes it to move along the spiral climbing track 12 and enter the single track.
[0034] It should be understood that the spiral climbing track 12 inside the vibrating feeding bowl 11 is a key innovative structure. When the bowl generates high-frequency micro-vibration, the randomly stacked needle seats, driven by the vibration force, will gradually climb along the spiral track and concentrate towards the bowl wall. The specific inclination angle of the track ensures that the needle seats can be stably attached to the track during movement and will not be scattered due to vibration. The single-row track design at the end of the track is only wide enough to allow a single needle seat to pass through, thereby forcibly transforming the disordered loose material into an ordered single-row queue.
[0035] S120, the needle holders fall into the vertical track below through the single-row track and are arranged in a vertical state under the action of gravity.
[0036] It should be understood that the entrance to the vertical track is carefully positioned 11 inch below the rim of the vibrating feeding bowl. When the needle holder slides out from the end of the single-row track, it falls naturally under gravity into the vertical track below. Because the cross-sectional shape of the vertical track matches the cross-section of the needle holder, the needle holder's own gravity automatically aligns its long axis with the track direction as it falls into the track, thus changing from a lying position to a vertical position. Multiple parallel vertical tracks allow multiple needle holders to complete this posture transformation simultaneously and be arranged vertically.
[0037] S130, the needle holder moves to the end of the vertical track as a preset welding posture.
[0038] It should be understood that the needle holder slides down the vertical track to the end under the assistance of gravity or slight vibration, and stays stably there. Equipped with the flipping mechanism 6, at this position, a compact vacuum adsorption flipping action flips the needle holder from bottom to top to a horizontal position with the welding surface facing down.
[0039] S140, ultrasonic welding of the needle holder.
[0040] It should be understood that the ultrasonic welding head with suction port moves above the needle holder and picks up the needle holder in a preset posture through vacuum adsorption. Subsequently, the welding head carries the needle holder to the calibration and welding station. At the designated position in the DBC (Digital Doppler) configuration, the welding head descends to bring the needle holder into contact with the welding pad, while simultaneously applying pressure and initiating high-frequency ultrasonic vibration.
[0041] S150 calibrates the position and height of the needle holder using the first camera 41 and the laser rangefinder 42.
[0042] First camera 41: Typically positioned on the side of the ultrasonic welding head, it visually positions the needle holder horizontally after the welding head adsorbs it, accurately measuring and compensating for the needle holder's positional deviation in the XY plane. Laser range sensor 42: Integrated near the welding head, it emits a laser vertically downwards to measure the precise distance in real-time, non-contact between the bottom surface of the welding head and the adsorbed needle holder and the surface of the underlying DBC substrate. This data is a critical input for controlling the welding pressure and is essential for ensuring consistent strength in ultrasonic welding.
[0043] S160 moves the calibrated needle holder to the designated position on the DBC substrate and completes the welding through ultrasonic welding.
[0044] The system uses the acquired precise position and height data to drive the ultrasonic welding head, carrying the needle holder, to a pre-programmed, absolutely precise coordinate on the DBC. The welding head descends with controlled pressure, bringing the needle holder into contact with the welding pad. Subsequently, ultrasonic vibrations are activated, completing the welding process within a set time. The welding head lifts, completing one welding cycle for the needle holder, and the system prepares for the next cycle.
[0045] In a preferred embodiment, the system further includes an air blowing device 5, which is provided on the side of the vibrating feed bowl 11. The air blowing device 5 is used to blow needle seats that have not entered the single track back into the vibrating feed bowl 11.
[0046] Correspondingly, the method further includes: S121, the needle seat that has not fallen into the vertical track is blown back to the vibrating feeding bowl 11 by the side blowing device 5.
[0047] When the needle holder slides out from the end of the single track, if its trajectory deviates and fails to align with the vertical track entrance below, the air blowing device 5 located on the side will immediately activate, spraying a short, directional airflow. The airflow acts on the side of the needle holder in a non-contact manner, precisely blowing it back into the vibrating feed bowl 11 to rejoin the feeding cycle.
[0048] In another preferred embodiment, see Figure 6 The system further includes: a second camera 43 disposed on the working platform, a concentric circle moving arm 44 disposed above the second camera 43, the second camera 43 being used to detect the qualification of the needle holder, move unqualified needle holders to the throwing box for throwing and pick up the needle holders again; An image processing and decision-making unit is communicatively connected to the second camera 43. The image processing and decision-making unit contains a pre-installed neural network model for intelligent analysis of the needle holder images acquired by the second camera 43, identifying needle holder defects and determining their conformity. Based on the determination result, the system controls the actuator to discard unqualified needle holders. (See also...) Figure 4 This is a schematic diagram showing the location of the corresponding IGBT module packaging pin socket soldering system.
[0049] Correspondingly, the method also includes: S141, acquire the needle holder image through the second camera 43 set on the working platform; S142, the image is input into a pre-trained neural network model for defect identification and classification. If it is identified as a defective needle holder, the ejector mechanism is controlled to remove it; if it is identified as a qualified needle holder, the process continues.
[0050] As the ultrasonic welding head adheres to the needle holder and moves to the welding station, it briefly passes above the field of view of the second camera 43. At this time, the second camera 43 is triggered, capturing high-resolution images of the welding end face and side of the needle holder. The acquired image data is transmitted in real time to the image processing and decision-making unit, which is connected to it. This unit is the brain of this intelligent detection module, and it has a specially trained neural network model pre-installed and running inside.
[0051] The model was trained on a massive dataset of precisely labeled pin holder defect images. This dataset contains various types of defect samples, such as micron-level surface scratches, uneven or peeling nickel plating, minute structural deformations, and contaminants adhering to the surface. By learning the deep visual features of these defects, the model possesses powerful pattern recognition and classification capabilities. During the inference phase, the model performs multi-level feature extraction and analysis on the input real-time images, enabling it not only to determine whether the pin holder is qualified or unqualified, but also to perform fine-grained classification of defect types, such as distinguishing between material defects and process contamination, and to grade the defects according to their severity.
[0052] Upon receiving the output of the neural network model, the image processing and decision-making unit immediately makes a control decision. If the model determines that the current needle holder is a qualified product, the unit will send a pass signal to the main controller, and the welding process continues. If it is determined to be a defective product, the unit will immediately trigger a rejection command. The main controller will guide the ultrasonic welding head to change its path, move it above the dedicated rejection box, release the defective needle holder, and then return to the loading station to pick up a new needle holder, thus forming a rapid online rejection and replenishment closed loop. This process is fully automatic and completed in real time, seamlessly embedded in the main production cycle, with almost no increase in cycle time.
[0053] The foregoing description and accompanying drawings fully illustrate embodiments of this disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terminology used in this invention is for descriptive purposes only and is not intended to limit the claims. As used in the description of the embodiments and claims, the singular forms “a,” “an,” and “the” are intended to equally include the plural forms unless the context clearly indicates otherwise. Similarly, the term “and / or,” as used herein, refers to any and all possible combinations of one or more of the associated listed elements. Additionally, when used in this invention, the terms "comprise" and its variations "comprises" and / or "comprising" refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase "comprising a..." does not exclude the presence of other identical elements in the process, system, or module that includes said element. In the embodiments of this disclosure, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For systems, products, etc., disclosed in the embodiments, if they correspond to the system portion disclosed in the embodiments, then the relevant parts can be referred to the description of the system portion.
[0054] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed in this disclosure can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different systems for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the push rod, push rod, and units described above can be referred to the corresponding processes in the foregoing system embodiments, and will not be repeated here.
[0055] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of methods, systems, and computer program products according to embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than that shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based push rod that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.
Claims
1. A pin socket soldering system for IGBT module packaging, characterized in that, include: Vibration feeding device, needle seat guiding mechanism, ultrasonic welding mechanism, calibration and testing mechanism; The vibrating feeding device includes a vibrating feeding bowl, and a spiral climbing track is provided inside the vibrating feeding bowl. The spiral climbing track has an inclined angle and branches at the end to form a single track. The needle seat guide mechanism is located below the single-row track and includes vertical tracks that correspond one-to-one with the single-row track. The starting end of the vertical track is lower than the opening of the vibrating feeding bowl. The ultrasonic welding mechanism includes an ultrasonic welding head with suction holes, which is used to adsorb the needle seat and perform the welding operation. The visual calibration mechanism, including a first camera and a laser rangefinder sensor located on the ultrasonic welding head, is used to calibrate the position and detect the height of the needle holder.
2. The system according to claim 1, characterized in that, Also includes: An air blowing device is provided on the side of the vibrating feeding bowl. The air blowing device is used to blow needle seats that have not entered the single track back into the vibrating feeding bowl.
3. The system according to claim 1, characterized in that, Also includes: A flipping mechanism is located at the end of the vertical track. The flipping mechanism uses vacuum to adsorb the needle holder and drives the needle holder to flip to a preset welding posture.
4. The system according to claim 1, characterized in that, The inclination angle of the spiral climbing track is set to 30° to 60°, and the width of the single track is adapted to the thickness of a single needle seat.
5. The system according to claim 1, characterized in that, include: A second camera is installed on the work platform, and a concentric circular moving arm is provided above the second camera. The second camera is used to detect the qualification of the needle holder. Unqualified needle holders are moved to the throwing box for throwing and then picked up again.
6. The system according to claim 5, characterized in that, Also includes: An image processing and decision-making unit is communicatively connected to the second camera; the image processing and decision-making unit is pre-loaded with a neural network model for intelligent analysis of the needle seat images acquired by the second camera, identifying needle seat defects and determining their conformity; the system controls the actuator to discard unqualified needle seats according to the judgment result.
7. A method for soldering pin headers for IGBT module packaging, characterized in that, The pin socket soldering system for IGBT module packaging as described in any one of claims 1 to 6, comprising: Pour the bulk needle hubs into the vibrating feeding bowl, and the vibration causes them to move along the spiral climbing track and enter the single track. The needles fall into the vertical track below through the single-row track and are arranged vertically under the action of gravity; The needle holder moves to the end of the vertical track as the preset welding posture; Ultrasonic welding is performed on the needle holder; The position and height of the needle holder are calibrated using a first camera and a laser rangefinder. The calibrated needle holder is moved to the designated position on the DBC substrate, and welding is completed by ultrasonic welding.
8. The pin socket soldering method for IGBT module packaging according to claim 7, characterized in that, A pin holder welding system for IGBT module packaging with a flipping mechanism, wherein the pin holder moves to the end of a vertical track as a preset welding posture, including: At the end of the vertical track, the needle holder is attracted by the flipping mechanism and flipped to the preset welding posture.
9. The pin socket soldering method for IGBT module packaging according to claim 7, characterized in that, A pin holder welding system for IGBT module packaging with image processing and decision-making units, the method further includes, before the pin holder moves to the end of the vertical track as a preset welding posture: The needle holders that have not fallen into the vertical track are blown back to the vibrating feeding bowl by the side air blowing device.
10. The pin socket soldering method for IGBT module packaging according to claim 7, characterized in that, A method for bonding pin holders for IGBT module packaging, applicable to a system with a second camera and an air blowing device, further comprising, before calibrating the position and height of the pin holder using a first camera and a laser rangefinder: The needle holder image is acquired using a second camera set on the work platform; The image is input into a pre-trained neural network model for defect identification and classification; If a defective needle hub is identified, the ejector mechanism is controlled to reject it; if a qualified needle hub is identified, the process continues.