Chip packaging production equipment with glue filling mechanism

Abstract

The invention relates to the technical field of chip packaging and glue filling, and discloses chip packaging production equipment with a glue filling mechanism, which comprises a packaging table, a feeding table arranged on the packaging table, an attaching unit positioned on one side of the feeding table, and an adjusting unit fixedly connected with the packaging table, the fitting unit and the pressing unit are arranged on the adjusting unit; the manipulator is fixedly arranged on the packaging table and is used for carrying the packaged chip; the glue filling mechanism is connected with the packaging table and is used for filling the packaged chip with glue so as to complete the connection between the substrate and the chip; according to the equipment, the free end of the gummed paper can be bent so as to be attached to the lower surface of the substrate, the substrate and the chip are limited, failure of glue injection caused by displacement between the substrate and the chip in the glue injection or carrying process is avoided, meanwhile, the attached gummed paper can play a role in protecting the chip or the substrate, and the service life of the chip or the substrate is prolonged. And the chip or the substrate is prevented from being damaged.

Description

Technical Field

[0001] This invention relates to the technical field of chip packaging adhesive filling, specifically a chip packaging production equipment with an adhesive filling mechanism. Background Technology

[0002] After the chip and the substrate are connected by solder balls, the solder balls themselves are relatively fragile. Temperature changes and external vibrations during chip operation will put stress on the solder balls, making them prone to breakage. Bottom filler can fill the gap between the chip and the substrate, wrap and fix the solder balls, greatly improve the mechanical strength and impact resistance of the connection, and at the same time enhance heat dissipation, isolate moisture and impurities, ultimately ensuring that the chip can work stably for a long time in complex environments.

[0003] For example, Chinese patent application CN108493163A discloses a chip packaging structure and its process based on a strip-type rigid frame, including a rigid frame and a chip packaging substrate; the rigid frame is provided with chip mounting holes, and the chip packaging substrate is provided with an adhesive layer, and the rigid frame is bonded to the chip packaging substrate through the adhesive layer; a bare chip is placed on the chip packaging substrate; the process includes: chip pretreatment, adhesive coating, bonding, removing residual adhesive, bonding the bare chip, reflow soldering, plasma cleaning, bottom filling with epoxy resin, and after completion, removing residual adhesive and slicing.

[0004] However, there are still some problems in the chip packaging process. During the packaging process, most of the substrates are located at the bottom, followed by solder balls and chips. The glue filling area is the area between the chip and the substrate. Therefore, during the glue injection process, due to the chip's external exposure, glue can easily stick to the chip's external surface or other devices can come into contact with the chip's external surface. The former can easily affect the chip's transmission function, while the latter can damage the chip.

[0005] Therefore, how to package the chip is a problem that needs to be solved. Summary of the Invention

[0006] This invention provides a chip packaging production equipment with a glue filling mechanism to solve the above-mentioned problems existing in the prior art.

[0007] A chip packaging production equipment with a filler mechanism includes:

[0008] A packaging platform, a loading platform on the packaging platform, an attachment unit located on one side of the loading platform, an adjustment unit fixedly connected to the packaging platform, and a bonding unit and a pressing unit disposed on the adjustment unit.

[0009] A robotic arm, fixedly mounted on the packaging platform, is used to handle the packaged chips.

[0010] The glue-filling mechanism, connected to the packaging stage, is used to fill the packaged chip with glue, thereby completing the connection between the substrate and the chip.

[0011] Furthermore, the loading platform includes a rotating disk mounted on the packaging platform, a rotating motor mounted on the rotating disk, and a negative pressure adsorption platform connected to the output end of the rotating motor.

[0012] Furthermore, the bonding unit includes a first adjustment part fixedly mounted on the packaging platform, a second adjustment part connected to the first adjustment part, a mounting plate disposed on the second adjustment part, a take-up motor fixedly connected to the mounting plate, at least two take-up wheels disposed on the mounting plate, an output wheel disposed at the output end of the take-up motor, a take-up belt for connecting the output wheel and the take-up wheel, and take-up rollers respectively connected to the take-up wheels; the first adjustment part and the second adjustment part have the same structure, including a limiting tube frame and a lead screw linear motion structure disposed on the limiting tube frame.

[0013] Furthermore, the attachment unit also includes a second take-up frame and a tensioning frame respectively sleeved on the take-up roller, a first take-up frame connected to the mounting plate, a limiting frame and a bending plate respectively disposed on the mounting plate, and a plurality of support rollers respectively disposed on the mounting plate;

[0014] There is a gap between the limiting frame and the bending plate, which is used for the tape to pass through. The tape is covered with adhesive paper, and the bending plate has a predetermined curvature so that the adhesive paper can be detached from the tape.

[0015] Furthermore, the adjustment unit includes a support frame fixedly installed on the packaging platform, a lifting cylinder fixedly connected to the support frame, a lifting frame connected to the output end of the lifting cylinder, a rotary table disposed on the lifting frame, an adjustment frame fixedly connected to the rotary table, and at least two adjustment cylinders symmetrically disposed on the adjustment frame.

[0016] Furthermore, the bonding unit includes a connecting frame connected to the output end of one of the adjusting cylinders, a rotary motor fixedly mounted on the connecting frame, two arc-shaped guide rails symmetrically arranged on the connecting frame, a bonding component disposed at the output end of the rotary motor, at least two limiting pipes connected to the bonding component, a connecting rod symmetrically arranged on and connected to the limiting pipes, and an offset block and a slider disposed on the connecting rod.

[0017] The slider is located on the guide rail and is slidably connected to the guide rail.

[0018] Furthermore, the fitting component includes an output block fixedly installed at the output end of the rotary motor, a rotating plate passing through the output block, a rotating shaft passing through the rotating plate and horizontal to the axial direction of the output end of the rotary motor, and a pressure plate disposed on the offset block;

[0019] The lower pressure plate has a predetermined elasticity, and the output end of the rotating shaft is disposed on the offset block.

[0020] Furthermore, the pressing unit includes a protective frame connected to the output end of another adjusting cylinder, a first mounting seat, a second mounting seat and a support arm disposed within the protective frame, a sliding plate slidably connected to the second mounting seat, a drive plate disposed on the sliding plate, a driven member connected to the drive plate, and a pressing member connected to the sliding plate.

[0021] The driven member is mounted on the support arm.

[0022] Furthermore, the pressing component includes an active plate connected to the sliding plate, at least three limiting frames evenly arranged on the active plate, the limiting frames having a hollow structure, a return spring arranged in the limiting frame, and at least three limiting rods arranged on the active plate;

[0023] The limiting rod passes through the limiting frame, and the reset spring is sleeved on the limiting rod;

[0024] The other end of the reset spring abuts against the active plate, and one end of the reset spring abuts against the limiting frame.

[0025] Furthermore, the driven member includes a plurality of adapter seats evenly arranged on the first mounting base, a first traction rope connected to the drive plate, a connecting spring connected to the other end of the first traction rope, a second traction rope connected to the other end of the connecting spring, an adjusting arm connected to the second traction rope and movably connected to the support arm, a lower pressure block arranged on the adjusting arm, and a torsion spring arranged on the support arm and abutting against the adjusting arm.

[0026] The first traction rope passes through the adapter and connects to the connecting spring in sequence.

[0027] Beneficial Effects: This invention discloses a chip packaging production equipment with a glue-filling mechanism. To complete the chip packaging process, the device includes an attachment unit, a bonding unit, and a pressing unit. The attachment unit attaches adhesive tape to the chip. The bonding unit rotates the pressing plate in a circular trajectory, allowing the adhesive tape to adhere to the surface of the circular chip. The pressing unit then moves, causing the free end of the adhesive tape to contact the bottom of the substrate. During this process, the active plate contacts the adhesive tape on the chip, limiting its position. The pressing unit then bends the free end of the adhesive tape, bonding it to the lower surface of the substrate, thus limiting the position of the substrate and chip. This prevents displacement between the substrate and chip during glue filling or handling, thus avoiding glue filling failure. Simultaneously, the attached adhesive tape protects the chip or substrate, preventing damage. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a chip packaging production equipment with a glue filling mechanism according to the present invention;

[0029] Figure 2 This is a schematic diagram of the attachment unit structure of the present invention;

[0030] Figure 3 This is a schematic diagram of the attachment unit of the present invention;

[0031] Figure 4 This is a front view of the bonding unit of the present invention;

[0032] Figure 5 This is a structural diagram of the bonding unit of the present invention;

[0033] Figure 6 This is a schematic diagram of the bonding unit of the present invention;

[0034] Figure 7 This is a bottom view of the pressing unit of the present invention;

[0035] Figure 8 This is a schematic diagram of the pressing unit structure of the present invention;

[0036] Figure 9 This is a schematic diagram of the adjusting arm structure of the present invention;

[0037] Figure 10 This is a schematic diagram of the first traction rope structure of the present invention.

[0038] Explanation of reference numerals in the attached drawings: 1. Packaging platform; 2. Loading platform; 21. Rotary disk; 22. Rotary motor; 23. Negative pressure adsorption platform; 3. Bonding unit; 31. First adjustment section; 32. Second adjustment section; 33. Mounting plate; 34. First winding frame; 35. Second winding frame; 36. Winding motor; 37. Winding roller; 38. Winding belt; 39. Support roller; 310. Limiting frame; 311. Bending plate; 312. Tensioning frame; 4. Adjustment unit; 41. Support frame; 42. Lifting cylinder; 43. Lifting frame; 44. Rotary table; 45. Adjustment frame; 5. Bonding unit; 51. Connecting frame; 5 2. Rotary motor; 53. Guide rail; 54. Output block; 55. Rotating plate; 56. Rotating shaft; 57. Offset block; 58. Lower pressure plate; 59. Connecting rod; 510. Slider; 6. Lower pressure unit; 61. Protective frame; 62. First mounting base; 63. Support arm; 64. Second mounting base; 65. Sliding plate; 66. Drive plate; 67. Active plate; 68. Limit frame; 69. Return spring; 610. Limit rod; 611. Adapter; 612. First traction rope; 613. Connecting spring; 614. Second traction rope; 615. Torsion spring; 616. Adjusting arm; 617. Lower pressure block. Detailed Implementation

[0039] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0040] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0041] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places throughout this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.

[0042] This invention discloses a chip packaging production equipment with a filler mechanism, referring to... Figures 1-10 ,include:

[0043] The package includes a packaging platform 1, a loading platform 2 mounted on the packaging platform 1, an attachment unit 3 located on one side of the loading platform 2, an adjustment unit 4 fixedly connected to the packaging platform 1, and a bonding unit 5 and a pressing unit 6 mounted on the adjustment unit 4; a robotic arm fixedly mounted on the packaging platform 1 for handling the packaged chip; a glue filling mechanism connected to the packaging platform 1 for filling the packaged chip with glue to complete the connection between the substrate and the chip; the attachment unit 3 can attach adhesive tape to the chip, and the movement of the bonding unit 5 causes the pressing plate 58 to rotate in a circular trajectory, so that the adhesive tape can be attached to the surface of the circular chip; the movement of the pressing assembly causes the free end of the adhesive tape to contact the bottom of the substrate, and during this process, the active plate 67 contacts the adhesive tape on the chip to limit its position; then the pressing unit 6 starts to work, bending the free end of the adhesive tape to adhere to the lower surface of the substrate, thereby completing the limiting and attachment work between the substrate and the chip.

[0044] The loading platform 2 includes a rotating disk 21 mounted on the packaging platform 1, a rotating motor 22 mounted on the rotating disk 21, and a negative pressure adsorption platform 23 connected to the output end of the rotating motor 22. There are two rotating motors 22, which move intermittently so that the chip can intermittently contact the bonding unit 3, the bonding unit 5, or the pressing unit 6 to complete the bonding work.

[0045] The bonding unit 3 includes a first adjustment part 31 fixedly mounted on the packaging table 1, a second adjustment part 32 connected to the first adjustment part 31, a mounting plate 33 disposed on the second adjustment part 32, a take-up motor 36 fixedly connected to the mounting plate 33, at least two take-up rollers 37 disposed on the mounting plate 33 (for example, the two take-up rollers 37 are disposed on opposite sides of the mounting plate 33), an output roller disposed at the output end of the take-up motor 36, a take-up belt 38 for connecting the output roller and the take-up rollers 37, and take-up rollers respectively connected to the take-up rollers 37; in some embodiments, the bonding unit 3... The element 3 also includes a second take-up frame 35 and a tensioning frame 312 respectively sleeved on the take-up roller, a first take-up frame 34 connected to the mounting plate 33, a limiting frame 310 and a bending plate 311 respectively disposed on the mounting plate 33, and a plurality of support rollers 39 respectively disposed on the mounting plate 33; there is a gap between the limiting frame 310 and the bending plate 311, the gap corresponding to the tape, the gap is used for the tape to pass through, the tape is provided with adhesive paper, the bending plate 311 has a predetermined curvature so that the adhesive paper can be detached from the tape; the tensioning frame 312 has an L-shaped structure, wherein the take-up roller is located on the tensioning frame 312 to form an H-shaped structure.

[0046] Before attaching the adhesive tape to the chip, first adjust the first adjusting part 31 and the second adjusting part 32. The first adjusting part 31 and the second adjusting part 32 have the same structure and are placed perpendicular to each other in their length directions. The positions of the first adjusting part 31 and the second adjusting part 32 are the same as the positions for adjusting the adhesive tape, which is all prior art. Then, the tape roll is placed on the first take-up frame 34, and then the free end of the tape roll is sequentially brought into contact with the support roller 39, the bending plate 311, the limiting frame 310, and the tensioning frame 312. Then, the free end of the tape roll is positioned on the second take-up frame 35. Next, the take-up motor 36 starts working, and the moving take-up... The winding motor 36 drives the output wheel to rotate, which in turn drives the winding wheel 37 to rotate via the winding belt 38. The rotating winding wheel 37 then drives the winding roller, which in turn drives the second winding frame 35 to rotate, thereby winding the tape. During this process, the bending plate 311 allows the adhesive tape to detach from the tape, enabling it to adhere to the chip and complete the adhesion process. The support roller 39, tensioning frame 312, and other components can accommodate tapes of different thicknesses and viscosities, avoiding problems such as conveying jams or peeling failures caused by differences in tape material.

[0047] In some embodiments, the adjustment unit 4 includes a support frame 41 fixedly mounted on the packaging platform 1, a lifting cylinder 42 fixedly connected to the support frame 41, a lifting frame 43 connected to the output end of the lifting cylinder 42, a rotary table 44 disposed on the lifting frame 43, an adjustment frame 45 fixedly connected to the rotary table 44, and at least two adjustment cylinders symmetrically disposed on the adjustment frame 45. When it is necessary to adjust the position of the bonding unit 5 and the pressing unit 6, the lifting cylinder 42 starts to work. The moving lifting cylinder 42 can drive the lifting frame 43 to move vertically. Then, the moving lifting frame 43 can change the height of the adjustment frame 45. Then, the rotary table 44 rotates, and the moving rotary table 44 can drive the adjustment frame 45 to rotate, thereby changing the position of the bonding unit 5 and the pressing unit 6, changing their working area, and completing the bonding and pressing work of the adhesive paper.

[0048] In some embodiments, the bonding unit 5 includes a connecting frame 51 connected to the output end of one of the adjusting cylinders, a rotary motor 52 fixedly mounted on the connecting frame 51, two arc-shaped guide rails 53 symmetrically arranged on the connecting frame 51, a bonding member disposed at the output end of the rotary motor 52, at least two limiting pipes connected to the bonding member, a connecting rod 59 symmetrically arranged on and connected to the limiting pipes, and an offset block 57 and a slider 510 disposed on the connecting rod 59; the slider 510 is located on the guide rail 53 and slidably connected to the guide rail 53; the bonding member includes an output block 54 fixedly mounted at the output end of the rotary motor 52, a rotating plate 55 passing through the output block 54, a rotating shaft 56 passing through the rotating plate 55 and horizontal to the axial direction of the output end of the rotary motor 52, and a lower pressure plate 58 disposed on the offset block 57; the lower pressure plate 58 has a predetermined elasticity, and the output end of the rotating shaft 56 is disposed on the offset block 57.

[0049] When the adhesive tape needs to be adhered to the chip, the rotary motor 52 starts working. The rotating motor 52 drives the output block 54 to rotate, which in turn drives the rotating plate 55 to rotate. The rotating plate 55 then rotates the rotating shaft 56, which in turn drives the slider 510 to move. The slider 510 reciprocates in the direction of the limiting channel, which in turn drives the offset block 57 to move on the arc-shaped guide rail 53, thereby moving the lower pressure plate 58. During this process, the free end of the lower pressure plate 58 can abut against and contact the chip, thereby applying a certain pressure to the adhesive tape, allowing the adhesive tape to adhere to the chip, thus completing the adhesive tape adhesion work.

[0050] The top view of the movement trajectory of the lower pressure plate 58 is a circular trajectory, and the front view of its trajectory is an arc structure. Therefore, during the movement, it works in conjunction with the lifting cylinder 42, so that it can first contact the adhesive paper located in the center area of ​​the circular chip. Then the rotary motor 52 rotates, thereby causing the adhesive paper located in the center area to adhere to the chip. Then the lifting cylinder 42 starts to work, thereby enabling the adhesive paper to adhere to the chip in stages, reducing air bubbles between the two and ensuring the smooth progress of the bonding work.

[0051] Furthermore, the bonding unit 5, through the linkage structure of the rotary motor 52, the arc-shaped guide rail 53, and the offset block 57, drives the lower pressure plate 58 to move along the arc-shaped trajectory, so that the free end of the lower pressure plate 58 can smoothly and evenly abut against the chip surface; combined with the predetermined elasticity of the lower pressure plate 58, flexible and constant pressure can be applied to avoid problems such as air bubbles, wrinkles, or local poor adhesion of the adhesive tape, thereby improving the bonding consistency between the adhesive tape and the chip; by limiting the connecting rod 59, the vibration during the movement of the bonding component can be reduced, ensuring that the pressure of the lower pressure plate 58 is applied evenly, thereby ensuring the bonding accuracy of the adhesive tape.

[0052] In some embodiments, the pressing unit 6 includes a protective frame 61 connected to the output end of another adjusting cylinder, a first mounting base 62, a second mounting base 64, and a support arm 63 disposed within the protective frame 61, a sliding plate 65 slidably connected to the second mounting base 64, a drive plate 66 disposed on the sliding plate 65, a driven member connected to the drive plate 66, and a pressing member connected to the sliding plate 65; the driven member is disposed on the support arm 63; the pressing member includes an active plate 67 connected to the sliding plate 65, at least three limiting frames 68 evenly disposed on the active plate 67, the limiting frames 68 having a hollow structure, a return spring 69 disposed in the limiting frame 68, and at least three limiting rods 610 disposed on the active plate 67; the limiting rods 610 penetrate the limiting frames 68, and the return springs 69 are sleeved on the limiting rods 610; the other end of the return springs 69 abuts against the active plate 67.

[0053] Because there is a gap between the substrate and the chip, the free end of the adhesive tape on the chip is in a straight state. When the adhesive tape needs to be adhered to the chip to complete the pressing work, the lifting cylinder 42 starts to work. The moving lifting cylinder 42 can change the height of the pressing unit 6 through the adjusting frame 45, and make the chip contact the active plate 67. With the movement of the lifting cylinder 42, the pressure between the chip and the active plate 67 is adjusted. The moving active plate 67 can drive the return spring 69 to deform. Therefore, the active plate 67 can also squeeze and limit the adhesive tape on the chip, preventing the adhesive tape from falling off the chip during the pressing process. The return spring 69 achieves flexible pressing, which can apply a uniform and stable squeezing force to the adhesive tape, preventing the adhesive tape from shifting or falling off during the bonding process, and also buffering the pressing impact force to prevent the chip from being damaged due to rigid contact, ensuring the adhesion between the adhesive tape and the chip.

[0054] In some embodiments, the driven member includes a plurality of adapter seats 611 evenly arranged on the first mounting base 62, a first traction rope 612 connected to the drive plate 66, a connecting spring 613 connected to the other end of the first traction rope 612, a second traction rope 614 connected to the other end of the connecting spring 613, an adjusting arm 616 connected to the second traction rope 614 and movably connected to the support arm 63, a pressing block 617 disposed on the adjusting arm 616, and a torsion spring 615 disposed on the support arm 63 and abutting against the adjusting arm 616; the first The traction rope 612 passes through the adapter 611 and connects to the connecting spring 613. When the active plate 67 starts to move, the moving active plate 67 can drive the drive plate 66 to move. Then the moving drive plate 66 can drive the first traction rope 612 to move. The moving first traction rope 612 can deform the connecting spring 613. Then the connecting spring 613 can drive the second traction rope 614 to move, thereby changing the position of the adjusting arm 616. This causes the lower pressure block 617 to contact the free end of the adhesive tape, and the adhesive tape is attached to the substrate, completing the adhesive tape attachment work.

[0055] The driven component, through the linkage structure of the traction rope, connecting spring 613, and adjusting arm 616, drives the pressing block 617 to precisely act on the free end of the adhesive tape, solving the problem of the adhesive tape being stretched and suspended due to the short distance between the chip and the substrate. The pressing block 617 can apply pressure to the edge of the adhesive tape, ensuring that the adhesive tape not only adheres firmly to the chip body but also tightly adheres to the substrate surface, preventing the adhesive tape from lifting or falling off due to insufficient pressure at the edges, thus improving the yield of the packaging process. At the same time, it integrates dual elastic components: the connecting spring 613 can buffer the tension fluctuations during the transmission of the traction rope, preventing rigid pulling from causing the adjustment range of the adjusting arm 616 to increase; the torsion spring 615 abuts against the adjusting arm 616, which can adaptively adjust the pressure of the pressing block 617, ensuring that the adhesive tape adheres tightly while preventing excessive pressure from damaging the chip or substrate, adapting to the packaging needs of adhesive tapes of different thicknesses and adhesive strengths as well as chips of different sizes.

[0056] Working principle description: Before attaching the adhesive tape to the chip, firstly, the first adjustment part 31 and the second adjustment part 32 are adjusted. The first adjustment part 31 and the second adjustment part 32 have the same structure and are placed vertically, similar to adjusting the placement position of the adhesive tape; both are existing technologies. Then, the tape roll is placed on the first take-up frame 34, and the free end of the tape roll sequentially abuts against the support roller 39, the bending plate 311, the limit frame 310, and the tension frame 312, and then sits on the second take-up frame 35. Next, the take-up motor 36 starts working. The moving take-up motor 36 drives the output wheel to rotate, and then the take-up belt 38 drives the take-up wheel 37 to rotate. The retractable take-up roller 37 drives the take-up roller to move, which in turn drives the second take-up frame 35 to move, thereby enabling the tape to be wound up. When it is necessary to adjust the position of the bonding unit 5 and the pressing unit 6, the lifting cylinder 42 starts to work. The moving lifting cylinder 42 drives the lifting frame 43 to move, and the moving lifting frame 43 changes the height of the adjusting frame 45. Then the rotary table 44 rotates, and the moving rotary table 44 drives the adjusting frame 45 to rotate, thereby changing the position of the bonding unit 5 and the pressing unit 6, changing their working area, and completing the bonding and pressing of the tape.

[0057] When the adhesive tape needs to be adhered to the chip, the rotary motor 52 starts working. The rotating motor 52 drives the output block 54 to rotate, which in turn drives the rotating plate 55 to rotate. The rotating plate 55 then drives the rotating shaft 56 to rotate, which in turn drives the slider 510 to move. The slider 510 can reciprocate in the direction of the limiting channel, thereby driving the offset block 57 to move on the arc-shaped guide rail 53, which in turn drives the lower pressure plate 58 to move. During this process, the free end of the lower pressure plate 58 can abut against and contact the chip, thereby applying a certain pressure to the adhesive tape, so that the adhesive tape can adhere to the chip, completing the adhesive tape adhesion work.

[0058] Because the distance between the substrate and the chip is short, the free end of the adhesive tape on the chip is in a straight state. When the adhesive tape needs to be attached to the chip to complete the pressing work, the lifting cylinder 42 starts to work. The moving lifting cylinder 42 can change the height of the pressing unit 6 through the adjusting frame 45 and make the chip contact the active plate 67. As the lifting cylinder 42 moves, it adjusts the pressure between the chip and the active plate 67. The moving active plate 67 can drive the reset spring 69 to deform. Therefore, the active plate 67 can also squeeze and limit the adhesive tape on the chip.

[0059] When the active plate 67 starts to move, the moving active plate 67 can drive the drive plate 66 to move. Then the moving drive plate 66 can drive the first traction rope 612 to move. The moving first traction rope 612 can cause the connecting spring 613 to deform. Then the connecting spring 613 can drive the second traction rope 614 to move, thereby changing the position of the adjusting arm 616. This causes the lower pressure block 617 to contact the free end of the adhesive tape, and the adhesive tape is attached to the substrate, completing the adhesive tape attachment work.

[0060] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various equivalent transformations can be made to the technical solutions of the present invention, and all such equivalent transformations fall within the protection scope of the present invention.

Claims

1. A chip packaging production equipment with a glue-filling mechanism, characterized in that, include: The packaging platform (1), the loading platform (2) provided on the packaging platform (1), the attaching unit (3) located on one side of the loading platform (2), the adjusting unit (4) fixedly connected to the packaging platform (1), and the bonding unit (5) and the pressing unit (6) provided on the adjusting unit (4). A robotic arm is fixedly installed on the packaging stage (1) for transporting the packaged chips. The glue filling mechanism is connected to the packaging stage (1) and is used to fill the packaged chip with glue to complete the connection between the substrate and the chip.

2. The chip packaging production equipment with a glue-filling mechanism according to claim 1, characterized in that: The loading platform (2) includes a rotating disk (21) mounted on the packaging platform (1), a rotating motor (22) mounted on the rotating disk (21), and a negative pressure adsorption platform (23) connected to the output end of the rotating motor (22).

3. The chip packaging production equipment with a filler mechanism according to claim 2, characterized in that: The attaching unit (3) includes a first adjustment part (31) fixedly installed on the encapsulation platform (1), a second adjustment part (32) connected to the first adjustment part (31), a mounting plate (33) provided on the second adjustment part (32), a take-up motor (36) fixedly connected to the mounting plate (33), at least two take-up wheels (37) provided on the mounting plate (33), an output wheel provided at the output end of the take-up motor (36), a take-up belt (38) for connecting the output wheel and the take-up wheel (37), and take-up rollers respectively connected to the take-up wheel (37).

4. A chip packaging production equipment with a filler mechanism according to claim 3, characterized in that: The attachment unit (3) also includes a second take-up frame (35) and a tensioning frame (312) respectively sleeved on the take-up roller, a first take-up frame (34) connected to the mounting plate (33), a limiting frame (310) and a bending plate (311) respectively set on the mounting plate (33), and a plurality of support rollers (39) respectively set on the mounting plate (33). There is a gap between the limiting frame (310) and the bending plate (311) for the tape to pass through. The tape is provided with adhesive paper, and the bending plate (311) has a predetermined curvature so that the adhesive paper can be detached from the tape.

5. A chip packaging production equipment with a filler mechanism according to claim 4, characterized in that: The adjustment unit (4) includes a support frame (41) fixedly installed on the packaging platform (1), a lifting cylinder (42) fixedly connected to the support frame (41), a lifting frame (43) connected to the output end of the lifting cylinder (42), a rotating platform (44) set on the lifting platform (43), an adjustment frame (45) fixedly connected to the rotating platform (44), and at least two adjustment cylinders symmetrically arranged on the adjustment frame (45).

6. A chip packaging production equipment with a filler mechanism according to claim 5, characterized in that: The bonding unit (5) includes a connecting frame (51) connected to the output end of one of the adjusting cylinders, a rotary motor (52) fixedly mounted on the connecting frame (51), two arc-shaped guide rails (53) symmetrically arranged on the connecting frame (51), a bonding component arranged at the output end of the rotary motor (52), at least two limiting pipes connected to the bonding component, a connecting rod (59) symmetrically arranged on the limiting pipes and connected to the limiting pipes, and an offset block (57) and a slider (510) arranged on the connecting rod (59). The slider (510) is located on the guide rail (53) and is slidably connected to the guide rail (53).

7. A chip packaging production equipment with a filler mechanism according to claim 6, characterized in that: The fitting component includes an output block (54) fixedly installed at the output end of the rotary motor (52), a rotating plate (55) passing through the output block (54), a rotating shaft (56) passing through the rotating plate (55) and horizontal to the axis of the output end of the rotary motor (52), and a pressure plate (58) disposed on the offset block (57). The lower pressure plate (58) has a predetermined elasticity, and the output end of the rotating shaft (56) is disposed on the offset block (57).

8. A chip packaging production equipment with a filler mechanism according to claim 7, characterized in that: The pressing unit (6) includes a protective frame (61) connected to the output end of another regulating cylinder, a first mounting seat (62), a second mounting seat (64) and a support arm (63) disposed in the protective frame (61), a sliding plate (65) slidably connected to the second mounting seat (64), a drive plate (66) disposed on the sliding plate (65), a follower connected to the drive plate (66), and a pressing member connected to the sliding plate (65); The driven member is mounted on the support arm (63).

9. A chip packaging production equipment with a filler mechanism according to claim 8, characterized in that: The pressing component includes an active plate (67) connected to the sliding plate (65), at least three limiting frames (68) evenly arranged on the active plate (67), the limiting frames (68) having a hollow structure, a return spring (69) arranged in the limiting frame (68), and at least three limiting rods (610) arranged on the active plate (67). The limiting rod (610) passes through the limiting frame (68), and the reset spring (69) is sleeved on the limiting rod (610); The other end of the return spring (69) abuts against the active plate (67).

10. A chip packaging production equipment with a filler mechanism according to claim 9, characterized in that: The driven component includes a plurality of adapter seats (611) evenly arranged on the first mounting base (62), a first traction rope (612) connected to the drive plate (66), a connecting spring (613) connected to the other end of the first traction rope (612), a second traction rope (614) connected to the other end of the connecting spring (613), an adjusting arm (616) connected to the second traction rope (614) and movably connected to the support arm (63), a lower pressure block (617) arranged on the adjusting arm (616), and a torsion spring (615) arranged on the support arm (63) and abutting against the adjusting arm (616). The first traction rope (612) passes through the adapter (611) and connects to the connecting spring (613) in sequence.

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