A multi-test-station translation type light sensing chip sorting machine layout
By using a multi-station translational photosensitive chip sorting machine layout, independent parallel operations of loading, testing, and unloading are achieved, solving the problems of low output and low applicability of existing photosensitive chip sorting machines, improving production efficiency and chip protection, and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI UNIQUE TEST TECH CO LTD
- Filing Date
- 2026-03-25
- Publication Date
- 2026-05-29
AI Technical Summary
Existing photosensitive chip sorting machines have low output, low applicability, and suffer from problems such as high replacement costs, inconvenient maintenance, and easy chip damage.
The multi-station translational photosensitive chip sorting machine adopts a layout with parallel test modules and loading/unloading shuttle modules to achieve independent parallel operation of loading, testing and unloading, thereby improving production cycle time. High-precision chip handling and positioning also reduce space occupation and cost.
It improves the yield and production efficiency of photosensitive chips, reduces the unit chip cost, ensures high-precision positioning and protection, has wider adaptability, reduces failure rate and debugging difficulty, and is suitable for mass production.
Smart Images
Figure CN122098949A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of photosensitive chip sorting machine technology, and specifically to a multi-test station translational photosensitive chip sorting machine layout. Background Technology
[0002] There are two types of translation sorting machines on the market: one is a translation sorting machine for ordinary ICs; the other is a sorting machine for photosensitive chips.
[0003] The first type is a translational sorting machine for conventional ICs (chips). It generally adopts a double shuttle structure. Its disadvantages are: (1) high replacement cost and inconvenient maintenance; (2) low pick-up and put-down accuracy, which can only adapt to the tolerance range of ±0.1mm; (3) through mechanical guidance and positioning, it is easy to cause product scratches, especially for photosensitive chips, which are easily damaged.
[0004] The second type is a translational sorting machine for photosensitive chips. It does not use a shuttle structure. The product is placed into the test socket through the pick-and-place module. Its disadvantages are: (1) low UPH; (2) limited adaptability to test machines. It is only applicable to the test card test method and cannot adapt to various test machines, especially the test machine installed from the bottom. Summary of the Invention
[0005] The technical problem to be solved by this invention is that existing photosensitive chip sorting machines have low output and low applicability.
[0006] To solve the above-mentioned technical problems, the technical solution of the present invention is to provide a multi-test station translational photosensitive chip sorting machine layout, including an operating table. The operating table has an installation surface. On one side of the installation surface, a tray loading module, an empty tray output module, an empty tray input module, and an automatic sorting module are arranged side-by-side. Above the tray loading module, empty tray output module, empty tray input module, and automatic sorting module, an empty tray handling module is provided. On the side of the tray loading module away from the empty tray output module, a loading and unloading module is provided on the side of the automatic sorting module away from the empty tray input module. The loading and unloading module is located on the side of the installation table perpendicular to the side where the tray loading module is located, and its inner end has a loading shuttle module. A loading camera positioning module is provided between the tray loading module and the loading shuttle module. On the side of the loading shuttle module away from the tray loading module, a testing module is provided. On the other side of the testing module, an unloading shuttle module is provided. The unloading shuttle module is adjacent to the unloading and unloading module. An NG sorting module is provided between the unloading shuttle module and the automatic sorting module.
[0007] Optionally, the pallet feeding module includes a conveyor track, one end of which is provided with a destacking position, and the other end is provided with a suction nozzle for picking up materials.
[0008] Optionally, the empty pallet module includes a second conveyor track, with an empty pallet stacking position at one end and an empty pallet placement position at the other end.
[0009] Optionally, the empty pallet module includes a conveyor track three, one end of which is provided with a destacking position two, and the other end is provided with an empty pallet retrieval position.
[0010] Optionally, the automatic sorting module includes multiple conveying tracks, each conveying track having a material stacking position at one end and a suction nozzle dispensing position at the other end.
[0011] Optionally, the loading and unloading module includes a loading and unloading track, a loading and unloading positioning camera is provided at one end of the loading and unloading track near the pallet loading module, and a loading and unloading suction nozzle is provided on the loading and unloading track.
[0012] Optionally, the loading shuttle module and the unloading shuttle module are located at both ends of the same track, and the testing module is located between the loading shuttle module and the unloading shuttle module.
[0013] Optionally, the loading shuttle module and the unloading shuttle module are each equipped with two shuttles, each shuttle has eight workstations, and the testing module has 16 testing workstations.
[0014] Optionally, the loading shuttle module and the unloading shuttle module each have four shuttles, each shuttle has eight workstations, and the testing module has 32 testing workstations.
[0015] Optionally, the loading shuttle module and the unloading shuttle module each have six shuttles, each shuttle has eight workstations, and the testing module has 48 testing workstations.
[0016] In summary, this invention redesigns the photosensitive chip sorting machine, with the testing module and the loading / unloading shuttle module arranged in parallel. After the testing head module retrieves a chip from the loading shuttle, it enters the testing station for testing. At this time, the loading shuttle can move to the loading station to load the chip. The unloading shuttle module can unload the chip at the unloading position using the unloading pick-and-place module. After testing, the testing head module raises the unloading shuttle to place the chip into the unloading shuttle module and removes it. At this time, the loading shuttle module moves the chip into the loading position for the testing head module to retrieve. In other words, loading, testing, and unloading are independent and can be carried out simultaneously, thereby improving the production cycle. Through high-precision chip handling and positioning, it has high output and production efficiency, low space occupation, and low operating cost. Attached Figure Description
[0017] Figure 1 This is a top view of the layout structure of the multi-test station translational photosensitive chip sorting machine of the present invention;
[0018] Figure 2 This is a schematic diagram of the layout tray loading module of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 3 This is a schematic diagram of the layout of the empty tray module of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 4 This is a schematic diagram of the layout and empty tray module structure of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 5 This is a schematic diagram of the automatic classification module layout of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 6 This is a schematic diagram of the layout and empty pallet handling module of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 7 This is a schematic diagram of the layout, feeding, and loading / unloading module structure of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 8 This is a schematic diagram of the layout, loading, and positioning module structure of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 9 This is a schematic diagram of the loading shuttle module and unloading shuttle module of the multi-test station translational photosensitive chip sorting machine of the present invention. Figure 10 This is a schematic diagram of the layout and testing module structure of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 11 This is a schematic diagram of the layout of the NG classification module of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 12 This is a schematic diagram of the layout, unloading, and loading / unloading module of the multi-testing station translational photosensitive chip sorting machine of the present invention; Figure 13 This is a schematic diagram of the loading shuttle module and unloading shuttle module of the second embodiment of the layout of the multi-test station translational photosensitive chip sorting machine of the present invention; Figure 14 This is a schematic diagram of the loading shuttle module and unloading shuttle module of the multi-test station translational photosensitive chip sorting machine layout embodiment three of the present invention; Figure 15 This is a schematic diagram of the layout and testing docking structure of the multi-test station translational photosensitive chip sorting machine of the present invention; In the diagram: 1. Pallet loading module; 101. Conveyor track one; 102. Destacking position one; 103. Suction nozzle picking position; 2. Empty pallet output module; 201. Conveyor track two; 202. Empty pallet stacking position; 203. Empty pallet placement position; 3. Empty pallet input module; 301. Conveyor track three; 302. Destacking position two; 303. Empty pallet picking position; 4. Automatic sorting module; 401. Conveyor track four; 402. Unloading stacking position; 403. Suction nozzle unloading position; 5. Empty pallet handling module; 6. Loading and picking module; 601. Loading and picking positioning camera; 602. Loading and picking suction nozzle; 7. Loading camera positioning module; 8. Loading shuttle module; 9. Testing module; 10. Unloading shuttle module; 11. NG sorting module; 12. Unloading and picking module. Detailed Implementation
[0019] The following combination Figure 1-15 The present invention will be described in further detail below.
[0020] This invention discloses a layout for a multi-test station translational photosensitive chip sorting machine, referring to... Figures 1-12 The system includes an operating platform with an installation surface. On one side of the installation surface, a pallet loading module 1, an empty pallet output module 2, an empty pallet input module 3, and an automatic sorting module 4 are arranged side by side. Above the pallet loading module 1, empty pallet output module 2, empty pallet input module 3, and automatic sorting module 4, an empty pallet handling module 5 is located. On the side of the pallet loading module 1 away from the empty pallet output module 2, a loading and unloading module 6 is located. On the side of the automatic sorting module 4 away from the empty pallet input module 3, a unloading and unloading module 12 is located. The loading and unloading module 6 is located on the side of the installation surface perpendicular to the side where the pallet loading module 1 is located, and on its inner end, a loading shuttle module 8 is located. Between the pallet loading module 1 and the loading shuttle module 8, a loading camera positioning module 7 is located. On the side of the loading shuttle module 8 away from the pallet loading module 1, a testing module 9 is located. On the other side of the testing module 9, an unloading shuttle module 10 is located. The unloading shuttle module 10 is adjacent to the unloading and unloading module 12. Between the unloading shuttle module 10 and the automatic sorting module 4, an NG sorting module 11 is located.
[0021] Specifically, the NG classification module 11 can hold multiple defective chips, and the automatic classification module 4 can also be equipped with an NG module, which can be temporarily placed when the NG classification module 11 is full, so as to relieve the pressure on the NG classification module 11.
[0022] Reference Figures 2-8 The pallet loading module 1 includes a conveyor track 101, one end of which is provided with a destacking position 102, and the other end is provided with a suction nozzle picking position 103. The empty pallet module 2 includes a second conveyor track 201, one end of which is provided with an empty pallet stacking position 202, and the other end is provided with an empty pallet placement position 203; The empty pallet module 3 includes a conveyor track 301, one end of which is provided with a destacking position 302, and the other end is provided with an empty pallet retrieval position 303; The automatic sorting module 4 includes multiple conveying tracks 401, each conveying track 401 has a material unloading and stacking position 402 at one end and a suction nozzle unloading position 403 at the other end; The empty pallet handling module 5 includes a handling rail, and lifting grippers are provided below the handling rail for handling pallets; The loading and unloading module 6 includes a loading and unloading track. A loading and unloading positioning camera 601 is provided at one end of the loading and unloading track near the tray loading module 1. A loading and unloading suction nozzle 602 is provided on the loading and unloading track. The loading camera positioning module 7 uses a camera to take pictures and identify the chip position; The feeding and loading module 12 includes an XY dual-axis motion system, with a suction nozzle below it that can move with the running system. The suction nozzle is used to pick up chips.
[0023] Example 1 In this embodiment, refer to Figure 9 The loading shuttle module 8 and the unloading shuttle module 10 are located at both ends of the same track. The test module 9 is located between the loading shuttle module 8 and the unloading shuttle module 10. Each loading shuttle module 8 and the unloading shuttle module 10 has two shuttles, and each shuttle has eight workstations. The test module 9 has 16 test workstations.
[0024] In this embodiment, the testing module 9 and the loading / unloading shuttle module are arranged in parallel. The testing module 9 includes a testing station and a pick-and-place station. The pick-and-place station is located on one side of the testing station. During testing, the loading shuttle module 8 enters below the testing module 9. After the testing module 9 descends to pick up the material, it rises and moves horizontally into the testing station before pressing down to test. At this time, the loading shuttle can move to the loading station to load the material. The unloading shuttle module 10 can move below the testing module 9 to wait for unloading. After the test is completed, the testing head module will put the chip into the unloading shuttle module 10 and remove it for unloading. At this time, the loading shuttle module 8 will move the chip into the loading position for the testing head module to pick up. During operation, loading, testing and unloading are independent of each other and can be carried out simultaneously, thereby improving the production cycle.
[0025] Example 2 In this embodiment, refer to Figure 13The loading shuttle module 8 and the unloading shuttle module 10 are located at both ends of the same track. The testing module 9 is located between the loading shuttle module 8 and the unloading shuttle module 10. The shuttle module can pass through the middle of the testing module 9. The testing module 9 can move up and down and can pick up the chip from the shuttle module below. The loading shuttle module 8 and the unloading shuttle module 10 each have four shuttles, and each shuttle has eight workstations. The testing module 9 has 32 testing workstations.
[0026] Example 3 In this embodiment, refer to Figure 14 The loading shuttle module 8 and the unloading shuttle module 10 are located at both ends of the same track. The testing module 9 is located between the loading shuttle module 8 and the unloading shuttle module 10. The shuttle module passes through the middle of the testing module 9. The testing module 9 can move up and down and can pick up the chip from the shuttle module below. The loading shuttle module 8 and the unloading shuttle module 10 each have six shuttles, and each shuttle has eight workstations. The testing module 9 has 48 testing workstations.
[0027] In Embodiments 2 and 3, the test station of test module 9 is located below the pick-up and place station, that is, the test station is also located below the shuttle car track. At this time, the loading shuttle car module 8 enters below the test module 9, the test module 9 lowers to pick up the material and then raises, the loading shuttle car module 8 returns to the bottom of the loading and place module 6 to receive the material, the test module 9 presses down to test, after the test is completed, the test module 9 is raised, the unloading shuttle car module 10 enters the bottom of the test module 9 to receive the material, the test module 9 raises after unloading the material, the unloading shuttle car module 10 exits, and the loading shuttle car module 8 enters again.
[0028] The loading shuttle module 8 and unloading shuttle module 10 of the present invention have variable load capacities, and the specific testing station can be changed according to the change in load capacity, which can significantly increase production capacity, greatly improve testing efficiency, and further shorten the testing cycle time, making it suitable for mass production and effectively reducing the unit chip cost.
[0029] Test module 9 eliminates the Y-axis longitudinal translation operation step. After the loading shuttle module 8 enters below test module 9, test module 9 descends to pick up the material and then rises. The loading shuttle module 8 then exits below test module 9, and test module 9 performs a downward test. This simplifies the testing process, resulting in a lower failure rate, higher positioning accuracy, better consistency, shorter cycle time, and higher output. There is no mechanical cumulative error, leading to more stable long-term operation. The downward pressure is more stable, effectively protecting the chip and socket. It has stronger rigidity, making it suitable for high-speed and high-frequency testing. Debugging is simple and convenient, and line changeover is faster. It also has lower cost and a longer service life.
[0030] When using this invention, refer to Figure 15The trays containing photosensitive chips are placed in batches on the tray loading module 1. The tray loading module 1 will disassemble the trays so that the chips on each tray fall onto the conveyor rail 101. Then, the conveyor rail 101 will transport the trays to the designated position and clamp them (this is the conventional operation mode of existing sorting machines, and this invention only discusses this layout). The loading and unloading positioning camera 601 in the loading and unloading module 6 takes pictures of the chips in the tray for positioning. The loading and unloading suction 602 picks up the chips from the tray and moves them to the loading camera positioning module 7 for taking pictures and positioning. After positioning is completed, the chips are picked up and transferred to the loading shuttle module 8. When 16 / 32 / 48 chips are placed, the loading shuttle moves the chips to the bottom of the testing module 9. Test module 9 picks up the chip from loading shuttle module 8, then loading shuttle module 8 exits below test module 9 and moves to loading pick-up and drop module 6 to pick up the chip again. Test module 9 then loads the chip to the test station for testing. After the test is completed, the test module 9 outputs the tested chip to the unloading shuttle module 10. The unloading shuttle 10 transfers the chip to the unloading position, and the unloading and picking module 12 places the chip into the designated tray according to the test results. Among them, the empty pallet handling module 5 transports the empty pallets from the pallet loading module 1 to the empty pallet output module 2 for stacking and output; it can also transport the empty pallets from the empty pallet input module 3 to the automatic sorting module 4.
[0031] The operating platform of this invention has an open bottom, which can be used for large testing machines to be installed from below, and can also meet the installation and docking of test cards.
[0032] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.
Claims
1. A layout for a multi-testing station translational photosensitive chip sorting machine, characterized in that, The system includes an operating platform with an installation surface. On one side of the installation surface, a pallet loading module (1), an empty pallet dispensing module (2), an empty pallet receiving module (3), and an automatic sorting module (4) are arranged side-by-side. Above the pallet loading module (1), empty pallet dispensing module (2), empty pallet receiving module (3), and automatic sorting module (4), an empty pallet handling module (5) is provided. On the side of the pallet loading module (1) away from the empty pallet dispensing module (2), a loading and unloading module (6) is provided. On the side of the automatic sorting module (4) away from the empty pallet receiving module (3), a unloading and unloading module (12) is provided. The pick-and-place module (6) is located on the side of the mounting platform perpendicular to the side where the pallet loading module (1) is located. The inner side of its end is provided with a loading shuttle module (8). A loading camera positioning module (7) is provided between the pallet loading module (1) and the loading shuttle module (8). A test module (9) is provided on the side of the loading shuttle module (8) away from the pallet loading module (1). A unloading shuttle module (10) is provided on the other side of the test module (9). The unloading shuttle module (10) is adjacent to the unloading pick-and-place module (12). An NG classification module (11) is provided between the unloading shuttle module (10) and the automatic classification module (4).
2. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 1, characterized in that, The pallet loading module (1) includes a conveying track (101), one end of which is provided with a destacking position (102), and the other end is provided with a suction nozzle picking position (103).
3. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 1, characterized in that, The empty pallet module (2) includes a second conveyor track (201), one end of which is provided with an empty pallet stacking position (202), and the other end is provided with an empty pallet placement position (203).
4. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 1, characterized in that, The empty pallet module (3) includes a conveying track three (301), one end of which is provided with a stacking position two (302), and the other end is provided with an empty pallet position (303).
5. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 1, characterized in that, The automatic sorting module (4) includes multiple conveying tracks (401), each conveying track (401) has a material stacking position (402) at one end and a suction nozzle dispensing position (403) at the other end.
6. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 1, characterized in that, The loading and unloading module (6) includes a loading and unloading track. A loading and unloading positioning camera (601) is provided at one end of the loading and unloading track near the pallet loading module (1). A loading and unloading suction nozzle (602) is provided on the loading and unloading track.
7. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 1, characterized in that, The loading shuttle module (8) and the unloading shuttle module (10) are located at both ends of the same track, and the test module (9) is located between the loading shuttle module (8) and the unloading shuttle module (10).
8. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 7, characterized in that, The loading shuttle module (8) and unloading shuttle module (10) are each equipped with two shuttles, each shuttle is equipped with eight workstations, and the testing module (9) is equipped with 16 testing workstations.
9. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 7, characterized in that, The loading shuttle module (8) and unloading shuttle module (10) each have four shuttles, each shuttle has eight workstations, and the testing module (9) has 32 testing workstations.
10. The layout of the multi-test station translational photosensitive chip sorting machine according to claim 7, characterized in that, The loading shuttle module (8) and unloading shuttle module (10) each have six shuttles, each shuttle has eight workstations, and the testing module (9) has 48 testing workstations.