Electroplating system

Abstract

Provided is an electroplating system capable of appropriately performing localized electroplating with respect to an electroplating target region. The electroplating system (10) includes an electrolyte circulation structure (31) having an electrolyte circulation path (310), a plated object conveying structure (32) having a lower extension portion (3211) having a plurality of opening portions (321b) and conveying a plated object (P) along the cylindrical surface in conjunction with rotation of the cylindrical surface, a flow rate adjusting portion (20, 33), and an electrolyte flowing in the electrolyte circulation path adhering to the plated object (P) via the opening portions.

Description

Technical Field

[0001] This invention relates to an electroplating system that performs electroplating only on necessary parts of the object to be plated. Background Technology

[0002] Currently, in electronic components and the like, there are cases where electroplating is performed only on necessary portions. For example, in electrode terminal components, by performing localized electroplating of Au only on the areas that become contacts, the amount of Au used in the electroplating process can be reduced, thus helping to lower costs.

[0003] Patent document 1 discloses an electroplating apparatus in which a pair of through holes are provided on a disc that is rotatably mounted relative to a fixed axis, and electroplating is performed on the inner surface of the object to be plated by spraying electroplating liquid through the pair of through holes onto the object to be plated.

[0004] Patent document 2 discloses a local electroplating apparatus in which a slit-shaped window portion that opens to the outside is provided in a part of the electrolyte circulation path, and the electroplating area on one side of the object to be plated is opposite to the window portion, and the object to be plated is transported along the window portion, thereby performing local electroplating in the electroplating area.

[0005] Patent Document 1: CN216192790U

[0006] Patent Document 2: JP2021-165423A Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] In the electroplating apparatus of the spray method disclosed in Patent Document 1, the electroplating solution can be forcefully blown onto the object to be plated. Therefore, there is a problem that the cost increases due to the excessive use of electroplating metal (e.g., Au) because electroplating is performed on unnecessary areas.

[0009] In the partial electroplating apparatus disclosed in Patent Document 2, electroplating can be performed on only one side of the object to be plated. However, since the electrolyte comes into contact with one side of the object to be plated through a slit-shaped window, electroplating is performed over a relatively large area on that side. Therefore, when the area to be plated is small, it is possible to perform electroplating on areas other than the target area. That is, from the viewpoint of reducing the amount of electroplated metal, there is room for improvement.

[0010] One aspect of the present invention is made in view of the above-mentioned problems, and its object is to provide an electroplating system capable of appropriately performing local electroplating relative to the area to be electroplated.

[0011] Technical solutions for solving technical problems

[0012] To solve the above-mentioned technical problems, the electroplating system of the first aspect of the present invention performs electroplating on a portion of the object to be plated, characterized in that it comprises: an electrolyte circulation section having an electrolyte circulation path for electrolyte flow inside; an object transport section having a cylindrical surface with multiple openings, along which the object to be plated is transported as the cylindrical surface rotates; and a flow rate regulating section for regulating the flow rate of the electrolyte flowing in the electrolyte circulation path; wherein the openings communicate the electrolyte circulation path inside the cylindrical surface with the outside of the cylindrical surface, and are positioned opposite the electroplating target area of ​​the object to be plated being transported along the cylindrical surface, so that the electrolyte flowing in the electrolyte circulation path adheres to the object to be plated via the openings.

[0013] According to the above structure, the electroplating system prevents the electrolyte from adhering to areas of the workpiece other than the area to be plated that are far from the opening. Therefore, the electroplating system can appropriately perform localized electroplating relative to specific areas of the workpiece. This helps to reduce the amount of plating metal (e.g., Au) used in the workpiece, thereby contributing to lower costs for localized electroplating.

[0014] In the electroplating system of the second aspect of the present invention, based on the first aspect described above, the flow regulating unit may include: an electrolyte supply unit that supplies the electrolyte from the upstream side of the electrolyte circulation path at a predetermined supply pressure; and an electrolyte absorption unit that absorbs the electrolyte from the downstream side of the electrolyte circulation path at a predetermined absorption pressure.

[0015] According to the above structure, the electroplating system can perform good local electroplating on the workpiece by appropriately adjusting the flow rate of the electrolyte supplied by the electrolyte supply unit and the suction force of the electrolyte suction unit.

[0016] In the electroplating system of the third embodiment of the present invention, based on the first or second embodiment described above, the flow regulating unit may regulate the flow rate so that the electrolyte protrudes from the outside of the opening due to surface tension, so that the electrolyte protruding from the opening adheres to the electroplating target area of ​​the object to be plated.

[0017] Based on the above structure, when the area to be plated is flat, localized electroplating can be performed on that area. Furthermore, by adjusting the flow rate of the electrolyte flowing in the electrolyte circulation path through the flow regulating unit, the amount of electrolyte protruding from the opening can be controlled, thereby changing the size of the area to be plated locally. In other words, the electroplating system adjusts the electrolyte flow rate according to the size of the area to be plated, enabling localized electroplating to be performed for areas of various sizes.

[0018] In the electroplating system of the fourth aspect of the present invention, based on the first or second aspect described above, the flow rate adjustment unit adjusts the flow rate to such a degree that the electrolyte does not protrude outward from the outside of the opening due to surface tension, and the electrolyte adheres to the electroplating target area of ​​the workpiece protruding from the opening towards the electrolyte circulation path.

[0019] Based on the above structure, when the electroplating target area of ​​the object to be plated is convex, local electroplating can be performed in the electroplating target area.

[0020] In the electroplating system of the fifth aspect of the present invention, based on the first to fourth aspects described above, the electrolyte circulation path may have a portion that is a curved shape that convexes outward in a cross-section that passes through the central axis of the cylindrical surface and is parallel to the central axis, and the opening is provided at the outermost part of the curved shape.

[0021] Based on the above structure, the electrolyte flowing along the curved electrolyte circulation path can be smoothly guided to the opening.

[0022] In the electroplating system of the sixth embodiment of the present invention, based on the first to fifth embodiments described above, the corner of the edge of the electrolyte circulation section on the upstream side of the opening in the direction of electrolyte flow, which is in contact with the electrolyte circulation path, is chamfered.

[0023] According to the above structure, the electrolyte flowing near the opening can be introduced into the plated object side through the adhesion effect generated at the corner.

[0024] In the electroplating system of the seventh embodiment of the present invention, based on the first to sixth embodiments described above, the electrolyte circulation path may include: an electrolyte inlet path, which is coaxial with the central axis of the cylindrical surface and introduces the electrolyte; an electrolyte diffusion path, which guides the electrolyte from the electrolyte inlet path in a fan-shaped expansion toward the cylindrical surface; and an opening is provided at the end of the electrolyte diffusion path.

[0025] According to the above structure, multiple openings can be provided at the end of the electrolyte diffusion path that expands in a fan shape. Therefore, local electroplating can be performed simultaneously on each electroplating target area of ​​multiple objects.

[0026] In the electroplating system of the eighth embodiment of the present invention, based on the second embodiment described above, the electrolyte supply unit may have: a first chamber for receiving electrolyte flowing in from the outside via a liquid inlet, and having an electrolyte supply port at the bottom; a second chamber arranged adjacent to the first chamber when viewed from above, and having an electrolyte outlet at the bottom; a flow control partition wall provided between the first chamber and the second chamber, and the upper parts of the first chamber and the second chamber being spatially connected.

[0027] According to the above structure, by fixing the liquid level in the first chamber and the flow path area of ​​the electrolyte supply unit, the flow rate supplied from the electrolyte supply unit to the outside can be controlled to be constant. Furthermore, by setting either the liquid level or the flow path area to be variable, the flow rate supplied from the electrolyte supply unit to the outside can be adjusted. By adjusting the flow rate supplied from the electrolyte supply unit to the outside, the electroplating system can perform localized electroplating corresponding to electroplating target areas of various sizes.

[0028] The effects of the invention

[0029] According to one aspect of the present invention, localized electroplating can be appropriately performed relative to the area to be electroplated. Attached Figure Description

[0030] Figure 1 This is a front view showing the appearance of the electrolyte supply device and the local electroplating device, which are the main parts of the electroplating system of this embodiment.

[0031] Figure 2 This is a longitudinal sectional view of the electrolyte supply device described above.

[0032] Figure 3 This is a three-dimensional view of the aforementioned partial electroplating device.

[0033] Figure 4 This is a longitudinal sectional view of the aforementioned partial electroplating apparatus.

[0034] Figure 5 This is an enlarged cross-sectional view of the partial electroplating apparatus, showing the holding position where the conveying body of the aforementioned partial electroplating apparatus holds the object to be plated.

[0035] Figure 6 This is an enlarged perspective view of the local electroplating apparatus, showing the holding position of the conveying body of the aforementioned local electroplating apparatus in which the workpiece is held.

[0036] Figure 7 This is a perspective view showing the transport configuration of the object to be plated in the aforementioned local electroplating apparatus.

[0037] Figure 8This is a diagram showing the relationship between the electrolyte level at the opening of the aforementioned local electroplating apparatus and the area to be electroplated.

[0038] Figure 9 This is a diagram showing the relationship between the electrolyte level at the opening of the aforementioned local electroplating apparatus and the area to be electroplated.

[0039] Figure 10 This is a diagram showing the relationship between the electrolyte level at the opening of the aforementioned local electroplating apparatus and the area to be electroplated.

[0040] Figure 11 This is a diagram showing the relationship between the electrolyte level at the opening of the aforementioned local electroplating apparatus and the area to be electroplated.

[0041] Figure 12 This is a longitudinal sectional view of a syringe used as an electrolyte extraction device.

[0042] Figure 13 This is a schematic diagram illustrating an example of an electroplating system.

[0043] Explanation of reference numerals in the attached figures

[0044] 10 Electroplating system; 20 Electrolyte supply device (flow regulation unit, electrolyte supply unit); 21 Inflow chamber; 22 Supply chamber (first chamber); 23 Discharge chamber (second chamber); 24 First partition wall; 25 Second partition wall (flow control partition wall); 211 Liquid inlet; 221 Liquid supply port (electrolyte supply port); 231 Liquid outlet (electrolyte outlet); 30 Local electroplating device; 31 Electrolyte circulation structure; 31 0 Electrolyte circulation path; 311 Electrolyte inlet; 312 Electrolyte outlet; 313 Electrolyte inlet path; 314 Electrolyte diffusion path; 315 Electrolyte contraction path; 316 Electrolyte discharge path; 32 Plating object conveying structure (plating object conveying part); 321 Conveying main body; 321b Opening part; 321c Corner part; 3211 Lower extension part (cylindrical surface); 33 Electrolyte suction device (flow regulation part, electrolyte suction part). Detailed Implementation

[0045] [Implementation Method 1]

[0046] Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described based on the accompanying drawings. However, the embodiment described below is merely an example of the present invention at all points. Various modifications and variations can obviously be made without departing from the scope of the present invention. That is, in the implementation of the present invention, specific configurations corresponding to the embodiments can be appropriately adopted.

[0047] §1 Application Examples

[0048] First, the main components of the electroplating system 10 of this embodiment (details will be described later) will be explained. Figure 1 This is a front view showing the appearance of the electrolyte supply device 20 and the local electroplating device 30, which are the main parts of the electroplating system 10.

[0049] The electroplating system 10 includes an electrolyte supply device 20 (electrolyte supply unit) and a local electroplating unit 30. The electrolyte supply device 20 is a device that continuously supplies a constant amount of electrolyte to the local electroplating unit 30. Furthermore, as... Figure 13 As shown, the electroplating system 10 also includes an electrolyte suction device 33, which will be described in detail later.

[0050] Electrolyte supply device 20 supplies electrolyte to the local electroplating device 30 via electrolyte circulation path 310 (see reference) at a specified supply pressure. Figure 4 The electrolyte is supplied to the upstream side of the electrolyte circulation path 310, thereby regulating the flow rate of the electrolyte flowing in the electrolyte circulation path 310. The electrolyte suction device 33 is a flow regulation unit that draws electrolyte from the downstream side of the electrolyte circulation path 310 at a predetermined suction pressure, thereby regulating the flow rate of the electrolyte flowing in the electrolyte circulation path 310.

[0051] The local electroplating apparatus 30 has an electrolyte circulation function and a workpiece transport function. That is, the local electroplating apparatus 30 circulates the electrolyte supplied from the electrolyte supply device 20 along a predetermined electrolyte circulation path 310. Additionally, the local electroplating apparatus 30, while transporting the workpiece P (refer to…)… Figures 8 to 11 A portion of the electroplating area is exposed to one side of the electrolyte circulation path 310 for transport, thereby performing local electroplating on the object P.

[0052] In particular, in this embodiment, via the opening 321b provided in the local electroplating apparatus 30 (see reference) Figure 5 This allows the electrolyte flowing in the electrolyte circulation path 310 to adhere to the electroplating target area of ​​the object P. Furthermore, the flow rate of the electrolyte flowing in the electrolyte circulation path 310 is adjusted by the electrolyte supply device 20, and the liquid surface shape of the electrolyte at the opening 321b is controlled (see reference). Figures 8 to 11 More specifically, the amount of electrolyte adhering to the workpiece P via the opening 321b is adjusted by balancing the electrolyte supply pressure of the electrolyte supply device 20 and the electrolyte absorption pressure of the electrolyte absorption device 33.

[0053] With this structure, the local electroplating apparatus 30 prevents the electrolyte from adhering to areas of the workpiece P outside the electroplating target area away from the opening 321b. Therefore, the local electroplating apparatus 30 can appropriately perform local electroplating relative to specific electroplating target areas of the workpiece P. This helps reduce the amount of electroplating metal (e.g., Au) used in the workpiece P, and consequently contributes to lowering the cost of local electroplating.

[0054] The electrolyte supply device 20 and the local electroplating device 30 will be described in detail below.

[0055] §2 Structural Examples

[0056] [Electrolyte supply device 20]

[0057] Figure 2 This is a longitudinal sectional view of the electrolyte supply device 20. The electrolyte supply device 20 has an inflow chamber 21, a supply chamber 22 (first chamber), and an outlet chamber 23 (second chamber) that are respectively arranged extending in the vertical direction.

[0058] Inflow chamber 21 has a connection with pump 50 (see reference) Figure 13 The electrolyte is connected to the liquid inlet 211. That is, in the inflow chamber 21, the electrolyte delivered by the pump 50 flows in through the liquid inlet 211. It should be noted that... Figure 2 In the inlet chamber 21, the liquid inlet 211 is located on the bottom surface of the inlet chamber 21, but the liquid inlet 211 can also be located on the side of the inlet chamber 21.

[0059] The supply chamber 22 is configured to be adjacent to the inflow chamber 21 and the discharge chamber 23 when viewed from above. A first partition wall 24 is provided between the supply chamber 22 and the inflow chamber 21, and a second partition wall 25 (flow control partition wall) is provided between the supply chamber 22 and the discharge chamber 23. A liquid supply port 221 (electrolyte supply port) for supplying electrolyte to the local electroplating apparatus 30 is provided on the bottom surface of the supply chamber 22. A liquid discharge port 231 (electrolyte discharge port) for discharging excess electrolyte supplied relative to the electrolyte supply device 20 is provided on the bottom surface of the discharge chamber 23. Furthermore, a cover 26 for preventing electrolyte evaporation is provided on the upper surface of the electrolyte supply device 20.

[0060] In the electrolyte supply device 20, the electrolyte delivered by the pump 50 to the inflow chamber 21 flows over the first partition wall 24 into the supply chamber 22. At this time, if the flow rate of the electrolyte delivered by the pump 50 to the inflow chamber 21 is above a predetermined flow rate, the liquid level in the supply chamber 22 reaches the height of the second partition wall 25, and the excess electrolyte overflows over the second partition wall 25 towards the discharge chamber 23. Moreover, as long as the liquid level in the supply chamber 22 is maintained at the height of the second partition wall 25, the electrolyte supply device 20 can continuously supply a constant amount of electrolyte from the liquid supply port 221. That is, when the liquid level height in the supply chamber 22 is set to h (m) and the flow path area of ​​the liquid supply port 221 is set to A (m2), the flow rate Q (m3 / s) of the electrolyte supplied from the liquid supply port 221 is expressed by the following formula (1). It should be noted that in equation (1), g is the gravitational acceleration (9.8 m / s2), and C is the flow coefficient determined by the density, viscosity, etc. of the electrolyte.

[0061] Formula 1

[0062]

[0063] In the electrolyte supply device 20, if the supply flow rate of the electrolyte supplied by the pump 50 is greater than the flow rate Q when the liquid level in the supply chamber 22 is maintained at the height of the second partition wall 25, the flow rate Q can be maintained at a constant value. At this time, since excess electrolyte supplied by the pump 50 overflows from the supply chamber 22 across the second partition wall 25 towards the discharge chamber 23, the liquid level in the supply chamber 22 is maintained at the height of the second partition wall 25. The electrolyte overflowing into the discharge chamber 23 is discharged from the liquid outlet 231 to the outside of the electrolyte supply device 20. The electrolyte discharged from the liquid outlet 231 can, for example, be transported to the management tank 52 (see reference). Figure 13 The fluid is circulated by pumping it from the management tank 52 back to the inflow chamber 21 via pump 50.

[0064] It should be noted that, in the electrolyte supply device 20, the bottom surface of the inflow chamber 21 is preferably positioned sufficiently higher than the bottom surface of the supply chamber 22. This is to reduce the volume of the inflow chamber 21 and prevent excessive electrolyte buildup in the electrolyte supply device 20. Furthermore, in Figure 2 In this case, the bottom surface of the discharge chamber 23 is at the same height as the bottom surface of the supply chamber 22, but they may not be at the same height.

[0065] As described above, in the electrolyte supply device 20, by fixing the liquid level height h of the supply chamber 22 and the flow path area A of the liquid supply port 221, the flow rate Q can be controlled to be constant. Furthermore, the flow rate Q can be adjusted by making either the liquid level height h or the flow path area A variable. For the flow path area A, for example, it can be easily adjusted by changing the opening of a flow regulating valve installed at the liquid supply port 221. For the liquid level h, it can be adjusted by changing the height of the second partition wall 25. For changing the height of the second partition wall 25, for example, multiple partition wall plates can be stacked in the height direction to form the second partition wall 25, and the height of the second partition wall 25 can be changed by changing the number of partition wall plates used. Alternatively, a portion of the second partition wall 25 can be a movable plate that can slide in the height direction, and the height of the second partition wall 25 can be changed by sliding this movable plate.

[0066] The electrolyte flow control performed by the electrolyte supply device 20 does not require feedback control using flow sensors or the like. Therefore, there is no response delay caused by feedback control, and the flow rate fluctuation of Q is minimized. Furthermore, the electrolyte supplied by the pump 50 flows from the inlet chamber 21 across the first partition wall 24 into the supply chamber 22, and is then supplied from the liquid supply port 221 of the supply chamber 22. Therefore, hydraulic pulsations caused by the pump 50 in the electrolyte supplied from the liquid supply port 221 can be prevented.

[0067] [Local electroplating device 30]

[0068] Figure 3 This is a three-dimensional view of the local electroplating device 30. Figure 4 This is a longitudinal sectional view of the local electroplating device 30.

[0069] The local electroplating apparatus 30 is generally composed of an electrolyte circulation structure (electrolyte circulation section) 31 and a workpiece conveying structure (workpiece conveying section) 32. Figure 4 In the diagram, the electrolyte circulation structure 31 is represented by a slanted line pointing to the upper right, and the plating material transport structure 32 is represented by a slanted line pointing to the lower right.

[0070] (Regarding the electrolyte circulation structure 31)

[0071] The electrolyte circulation structure 31 has an electrolyte circulation path 310 for the internal flow of electrolyte. Specifically, the electrolyte circulation structure 31 has an electrolyte inlet 311 and an electrolyte outlet 312, and internally has an electrolyte circulation path 310 connecting the electrolyte inlet 311 and the electrolyte outlet 312. This electrolyte circulation path 310 consists of an electrolyte inlet path 313, an electrolyte diffusion path 314, an electrolyte contraction path 315, and an electrolyte discharge path 316.

[0072] An electrolyte inlet 311 is located on the upper surface of the local electroplating apparatus 30 and is connected to the liquid supply port 221 of the electrolyte supply device 20. Thus, the local electroplating apparatus 30 continuously supplies a constant amount of electrolyte from the electrolyte supply device 20. An electrolyte outlet 312 is located at the lower part of the local electroplating apparatus 30, and the electrolyte, after circulating in the electrolyte circulation path, is discharged from the electrolyte outlet 312 to the outside of the local electroplating apparatus 30.

[0073] The electrolyte circulation structure 31 is approximately circular in top view. The electrolyte inlet 313 introduces electrolyte supplied from the electrolyte supply device 20 via the electrolyte inlet 311. The electrolyte inlet 313 is arranged vertically at the center of the electrolyte circulation structure 31. The electrolyte inlet 313 and the lower extension 3211 of the workpiece transport structure 32 (see reference) Figure 6 The central axis is coaxial.

[0074] Electrolyte diffusion path 314 to deliver the lower extension 3211 of structure 32 to the object to be plated (see reference) Figure 6 The electrolyte inlet path 313 is guided in a fan-shaped expansion manner. The electrolyte diffusion path 314 is formed in a radial expansion manner from the lower end of the electrolyte inlet path 313 along the horizontal direction. That is, the electrolyte diffusion path 314 is formed in a fan-shaped expansion manner from the center of the electrolyte circulation structure 31 to the outer periphery with a central angle of approximately 180 degrees when viewed from above. It should be noted that the aforementioned central angle can be appropriately changed according to the shape of local electroplating. The aforementioned central angle can be 90 degrees or 120 degrees.

[0075] The electrolyte contraction path 315 guides the electrolyte from the electrolyte diffusion path 314 in a manner that contracts towards the center of the electrolyte circulation structure 31. The electrolyte contraction path 315 causes the electrolyte circulation path, which expands radially in the electrolyte diffusion path 314, to contract from the outer periphery of the electrolyte circulation structure 31 towards the center. That is, the electrolyte contraction path 315 is formed in a fan shape with a central angle of approximately 180 degrees, overlapping with the electrolyte diffusion path 314 when viewed from above. It should be noted that the aforementioned central angle can be appropriately varied depending on the local electroplating pattern. The aforementioned central angle can be 90 degrees or 120 degrees.

[0076] exist Figure 4 In the right-hand region of the figure, there is an electrolyte diffusion path 314 and an electrolyte contraction path 315.

[0077] The electrolyte discharge path 316 guides the electrolyte from the electrolyte contraction path 315, thereby discharging the electrolyte from the electrolyte contraction path 315 to the outside of the partial electroplating apparatus 30 via the electrolyte outlet 312. The electrolyte discharge path 316 is connected to the downstream end (central end of the electrolyte circulation structure 31) of the electrolyte contraction path 315, extends vertically, and then bends horizontally, with the electrolyte outlet 312 provided on the side of the electrolyte circulation structure 31.

[0078] The electrolyte diffusion path 314 and the electrolyte contraction path 315 are connected to each other near the outer periphery of the electrolyte circulation structure 31. The portions of the electrolyte diffusion path 314 other than the outer end and the portions of the electrolyte contraction path 315 other than the outer end are separated by an electrolyte partition wall portion 318, which is part of the electrolyte circulation structure 31.

[0079] Furthermore, the electrolyte circulation path 310 has a curved portion that convexes outward in a cross-section parallel to the central axis of the electrolyte inlet path 313 (hereinafter referred to as the curved portion C). In other words, the electrolyte diffusion path 314 and the electrolyte contraction path 315 are connected near the outer periphery of the electrolyte circulation structure 31 in a manner that makes the electrolyte circulation path 310 appear U-shaped when viewed from the horizontal direction. The curved portion C of the electrolyte circulation path 310 is defined by the outer end of the electrolyte partition wall portion 318. The outer end of the electrolyte partition wall portion 318 has a curved shape that convexes outward in a cross-section parallel to the central axis of the electrolyte inlet path 313. With this structure, the electrolyte flowing along the curved electrolyte circulation path can be smoothly guided to the opening. The curved portion C can also be arc-shaped.

[0080] A lower extension 3211 of the workpiece transport structure 32 is provided at a position opposite to the outer end of the electrolyte partition wall 318. The lower extension 3211 has a plurality of openings 321b for adhering the electrolyte to the workpiece P, which will be described in detail below.

[0081] The electrolyte circulation structure 31 also includes a cylindrical surface contact portion 319 that abuts against the lower end of the lower extension 3211. The cylindrical surface contact portion 319 is disposed on the lower side of the electrolyte contraction path 315 and abuts against the inner surface of the lower end of the lower extension 3211 at its outer end.

[0082] (Regarding the plating conveyor structure 32 and the plating object P)

[0083] The object transport structure 32 is disposed overlappingly on the upper part of the electrolyte circulation structure 31 (more specifically, on the upper part of the electrolyte diffusion path 314 and the electrolyte contraction path 315). The object transport structure 32 is rotatably disposed relative to the electrolyte circulation structure 31 about the central axis of the electrolyte circulation structure 31.

[0084] The object-to-coating conveyor 32 includes a conveyor body 321 located on the outer side. The conveyor body 321 holds the object to be coated P and conveys the object to be coated P by rotating it.

[0085] The main conveying unit 321 includes a cylindrical lower extension 3211 (cylindrical surface) extending downward from its outer end. The lower extension 3211 is coaxial with the central axis of the electrolyte inlet path 313. The lower extension 3211 is preferably a thin component with a thickness of about 0.5 mm to 3.0 mm. The lower extension 3211 is positioned opposite the outer end of the electrolyte partition wall 318 of the electrolyte circulation structure 31. That is, the curved portion C of the electrolyte circulation path 310 is defined by the outer end of the electrolyte partition wall 318 and the inner surface of the lower extension 3211.

[0086] Figure 5 This is an enlarged cross-sectional view of the partial electroplating apparatus 30, showing the holding position where the conveying body 321 holds the object P to be plated. Figure 5 Reference numeral 1051 is a cross-sectional view of the partial electroplating apparatus 30. Figure 5 Reference numeral 1052 is an enlarged sectional view of region A1 of reference numeral 1051. Figure 5 Reference numeral 1053 is an enlarged sectional view of region A2 of reference numeral 1052. Figure 6 This is an enlarged perspective view of the partial electroplating apparatus 30, showing the holding position where the conveying body 321 holds the object P to be plated. Hereinafter, refer to... Figure 5 and Figure 6 The detailed structure of the conveying main body 321 will be described below. It should be noted that... Figure 6 In the illustration, only two objects P to be plated are shown.

[0087] like Figure 5 The attached figures 1052 and Figure 6As shown, the transport body 321 has a plurality of grooves 321a arranged along the circumferential direction near the base end of the lower extension 3211. The grooves 321a extend from the outer surface of the transport body 321 inwards. Pins (not shown) are inserted into each groove 321a, and each pin is inserted into a hole provided in the workpiece P, thereby transporting the workpiece. The pin fixing function, in addition to transporting the workpiece, also functions to position the electroplating target area of ​​the workpiece relative to the opening 321b.

[0088] And, as Figure 5 The attached figures 1052 and Figure 6 As shown, the lower extension 3211 has multiple openings 321b arranged circumferentially at positions corresponding to the curved portion C of the electrolyte circulation path 310 in the vertical direction. The openings 321b connect the electrolyte circulation path 310 inside the lower extension 3211 to the outside of the lower extension 3211. Specifically, the openings 321b are located at the outermost portion of the curved portion C. More specifically, the openings 321b are located at the end portion (outer end) of the electrolyte diffusion path 314.

[0089] The object to be plated, P, is held in contact with the outer surface of the lower extension 3211. For example, as... Figure 6 As shown, the object to be plated, P, has: a first portion p1 having a hole; and a second portion p2 containing a region to be plated. A groove portion 321a is provided opposite to the hole portion of the first portion p1. An opening portion 321b is provided opposite to the region to be plated on the object to be plated, P. In other words, the region to be plated on the object to be plated, where the hole portion of the first portion p1 is aligned with the groove portion 321a, is positioned opposite to the opening portion 321b.

[0090] The workpiece transport structure 32 transports the workpiece P along the lower extension 3211 as the lower extension 3211 rotates. Here, the electroplating target area of ​​the workpiece P transported by the workpiece transport structure 32 is always opposite the opening 321b. Therefore, the local electroplating apparatus 30 allows the electrolyte flowing in the electrolyte circulation path 310 to adhere to the electroplating target area of ​​the workpiece P via the opening 321b.

[0091] Based on the above structure, the local electroplating apparatus 30 prevents the electrolyte from adhering to areas of the workpiece P other than the electroplating target area away from the opening 321b. Therefore, the local electroplating apparatus 30 can appropriately perform local electroplating relative to a specific electroplating target area of ​​the workpiece P (an area of ​​the same size as the opening 321b). This helps reduce the amount of electroplating metal (e.g., Au) used in the workpiece P, and consequently contributes to lowering the cost of local electroplating.

[0092] It should be noted that, as Figure 5 As shown by reference numeral 1053 in the accompanying drawings, the corner 321c of the electrolyte circulation structure 31, on the upstream (upper) edge of the electrolyte flow direction at the opening 321b, on the side (inner) that contacts the electrolyte circulation path 310, is chamfered. With this structure, the electrolyte flowing near the opening 321b can be drawn into the plated object P side through the wall-attaching effect generated at the corner 321c (the effect of the jet of viscous fluid being attracted to a nearby wall). In this embodiment, the opening 321b has an outer orifice with a substantially constant diameter and an inner orifice with a diameter that gradually increases inward (i.e., mortar-shaped). Furthermore, the upper surface of this inner orifice functions as the chamfered corner 321c. It should be noted that in this embodiment, the cross-section of the chamfered corner 321c is straight, but it is not limited to this; the cross-section can also be curved.

[0093] Furthermore, the outer surface of the opening 321b is circular. Therefore, the electroplating apparatus 30 performs electroplating on a circular area of ​​the object to be plated, P. It should be noted that the shape of the outer surface of the opening 321b is not limited to this and can be appropriately changed depending on the area to be plated. The outer surface of the opening 321b can be elliptical, rectangular, etc.

[0094] Furthermore, multiple openings 321b are provided at equal intervals along the circumferential direction in the lower extension 3211. This allows for simultaneous electroplating of each electroplating target area, which is continuously connected in the circumferential direction and is arranged at equal intervals. It should be noted that the arrangement of the multiple openings 321b can be appropriately changed according to the transport configuration of the object P. Alternatively, the multiple openings 321b may be provided at non-equal intervals along the circumferential direction in the lower extension 3211.

[0095] (Transportation mode of the object to be plated P)

[0096] Figure 7 This is a perspective view showing the transport configuration of the workpiece P in the local electroplating apparatus 30. For example... Figure 7 As shown, in the partial electroplating apparatus 30, a series of workpieces P to be plated (each first portion p1 is continuously connected in the conveying direction) are conveyed around the opening 321b of the lower extension 3211. The workpiece conveying structure 32 applies a conveying force to the series of workpieces P by rotating, thereby conveying the workpieces P. After electroplating, the series of workpieces P are separated into individual pieces. It should be noted that the conveying force on the series of workpieces P can be applied directly to the series of workpieces P, or it can be applied via a conveyor belt or the like.

[0097] (Regarding electroplating methods)

[0098] Figures 8 to 11 This is a diagram showing the relationship between the electrolyte level at opening 321b and the area to be electroplated. See below for reference. Figures 8 to 11 The electroplating method in which the local electroplating device 30 electroplats the target area is described.

[0099] As described above, the electrolyte supply device 20 regulates the flow rate of the electrolyte flowing in the electrolyte circulation path 310. As an example of electrolyte flow rate regulation, the electrolyte supply device 20 regulates the flow rate so that the electrolyte protrudes outward from the outer side of the opening 321b due to surface tension. Furthermore, the local electroplating device 30 causes the electrolyte protruding from the opening 321b to adhere to the electroplating target area of ​​the workpiece P.

[0100] Figure 8 Reference numeral 1081 in the accompanying drawing is a diagram showing the electrolyte surface S1 at the opening 321b when the electrolyte flow rate of the electrolyte supply device 20 is set to the first flow rate X1. The vertex (outermost point) of the surface S1 is located slightly outside the outer side of the opening 321b. Figure 8 Reference numeral 1082 in the accompanying drawings indicates the object P to be electroplated, where electroplating of the target area a1 is performed by means of a liquid surface S1 attached to such an electrolyte. The target area a1 is a small region on the surface of the second part p2.

[0101] Figure 9 Reference numeral 1091 in the accompanying drawing shows the electrolyte level S2 at the opening 321b when the electrolyte supply device 20 sets the electrolyte flow rate to a second flow rate X2, which is greater than the first flow rate X1. The electrolyte level S2 is located on the outer side of the electrolyte level S1 and protrudes outward from the opening 321b as a whole. Figure 9 Reference numeral 1092 in the accompanying drawings indicates the object P to be electroplated on the electroplating target area a2 by means of the liquid surface S2 attached to such an electrolyte. The electroplating target area a2 is a larger area on the surface of the second part p2 than the electroplating target area a1. It should be noted that... Figure 9 Reference numeral 1091 is a schematic diagram for clearly indicating the position of the electrolyte surface S2. In reality, the electrolyte surface S2 does not overlap with the second part p2 of the object being plated P.

[0102] Figure 10 Reference numeral 1101 in the accompanying drawing is a diagram showing the electrolyte level S3 at the opening 321b when the electrolyte supply device 20 sets the electrolyte flow rate to a third flow rate X3, which is greater than the second flow rate X2. The electrolyte level S3 protrudes further outward from the opening 321b compared to the electrolyte level S2. Figure 10 Reference numeral 1102 in the accompanying drawing indicates the object P to be electroplated on the electroplating target area a3 by means of the liquid surface S3 attached to such an electrolyte. The electroplating target area a3 is a larger area than the electroplating target area a2, extending across the surface and sides of the second part p2. It should be noted that... Figure 10 The reference numeral 1101 in the accompanying drawing is a schematic representation to clearly indicate the position of the electrolyte surface S3. In reality, the electrolyte surface S3 does not overlap with the second part p2 of the object being plated P.

[0103] like Figures 8 to 10 As shown, the electrolyte supply device 20 regulates the flow rate of the electrolyte flowing in the electrolyte circulation path 310 and controls the amount of electrolyte protruding from the opening 321b, thereby changing the size of the electroplating area where local electroplating is performed. In other words, the local electroplating device 30 regulates the flow rate of the electrolyte according to the size of the area to be electroplated, thus enabling local electroplating to be performed corresponding to various sizes of areas to be electroplated.

[0104] Figure 11 Indicates relative to Figures 8 to 10 The diagram illustrates the relationship between the electrolyte level and the electroplating target area when electroplating is performed on different objects P'. Object P' has a convex portion p21 on the surface of the second part p2, which is the electroplating target area.

[0105] That is, as another example of regulating the electrolyte flow rate, the electrolyte supply device 20 can regulate the electrolyte flow rate to the extent that the electrolyte will not protrude outward from the outside of the opening due to surface tension. Moreover, the electrolyte supply device 20 can regulate the electrolyte flow rate in such a way that the electrolyte adheres to the electroplating target area (convex portion p21) of the workpiece P′ protruding from the opening 321b towards the electrolyte circulation path 310 side (inner side).

[0106] Figure 11 Reference numeral 1111 in the accompanying drawing shows the electrolyte level S4 at the opening 321b when the electrolyte supply device 20 sets the electrolyte flow rate to a fourth flow rate X4, which is less than the first flow rate X1. The electrolyte level S4 is located along the convex portion p21, at a position closer to the inner side than the outer side of the opening 321b. Figure 11 Reference numeral 1112 in the figure indicates the plated object P′ on which the convex portion p21 is electroplated by means of the liquid surface S4 attached to such an electrolyte.

[0107] like Figure 11As shown, the electrolyte supply device 20 regulates the flow rate of the electrolyte to form an electrolyte surface S4 at the opening 321b corresponding to the surface of the protruding portion p21. Therefore, the local electroplating device 30 can perform electroplating only on the protruding portion p21 of the workpiece P′. That is, by regulating the flow rate of the electrolyte, the local electroplating device 30 can perform local electroplating even in protruding areas of the workpiece P′.

[0108] (Methods for adjusting electrolyte flow rate)

[0109] A positive potential can be applied to the electrolyte separator 318 to make it the anode. Furthermore, a negative potential can be applied to the workpiece P to make it the cathode. Therefore, the workpiece P can be electroplated efficiently in a short time using electrolytic electroplating. Moreover, the distance between the anode and cathode remains constant during the transport of the workpiece P, enabling the formation of an electroplated film with a stable thickness relative to the workpiece P.

[0110] Furthermore, generating an electrolyte suction force on the downstream side of the opening 321b (i.e., the electrolyte shrinkage path 315) is effective in suppressing unnecessary electroplating relative to the object being plated P. If an electrolyte suction force is generated in the electrolyte shrinkage path 315, it is possible to more effectively suppress contact between the electrolyte and areas outside the electroplating target area of ​​the object being plated P.

[0111] In order to generate an electrolyte suction force in the electrolyte contraction path 315, a structure is considered in which an electrolyte suction device (electrolyte suction section) 33 is connected to the electrolyte outlet 312 of the electrolyte circulation structure 31. Obviously, the electrolyte suction device 33 can also be regarded as part of the local electroplating device 30.

[0112] As described above, the electrolyte suction device 33 is a flow regulating unit that regulates the flow rate of the electrolyte flowing in the electrolyte circulation path 310 by suctioning electrolyte from the downstream side of the electrolyte circulation path 310 at a predetermined suction pressure. The electrolyte suction device 33 can be used with... Figure 12 The general-purpose injector shown is used in the electrolyte extraction device 33. Figure 12 In the case of the ejector, the ejector port Po2 is connected to the electrolyte outlet 312, allowing the electrolyte to flow from port Po1 to port Po3. This creates a negative pressure at port Po2, enabling a suction force to be applied to the electrolyte contraction path 315 via the electrolyte discharge path 316. This suction force can be adjusted by changing the flow rate of the electrolyte to ports Po1 to Po3 (increasing the flow rate from A to C increases the suction force). Furthermore, as... Figure 5As shown by reference numeral 1053 in the attached drawing, the corner of the downstream (lower) edge of the electrolyte flow direction at the opening 321b, on the side (inner) that contacts the electrolyte circulation path 310, is chamfered. Therefore, the electrolyte passing through the opening 321b exhibits a wall-attaching effect, which assists in the absorption of electrolyte in the electrolyte contraction path 315.

[0113] In the local electroplating apparatus 30, by appropriately adjusting the flow rate of the supplied electrolyte and the suction force of the electrolyte suction device 33, good local electroplating can be performed relative to the object to be plated P.

[0114] [Electroplating System 10]

[0115] Figure 13 This is a schematic diagram illustrating an example of the electroplating system 10 of this embodiment. In addition to the electrolyte supply device 20, the local electroplating device 30, and the electrolyte suction device 33 described above, the electroplating system 10 also includes pumps 50 and 51 and a management tank 52.

[0116] like Figure 13 As shown, the liquid inlet 211 of the electrolyte supply device 20 is connected to the management tank 52 via a pump 50. Thus, electrolyte is supplied from the management tank 52 to the liquid inlet 211 via the pump 50. The liquid outlet 231 of the electrolyte supply device 20 is connected to the management tank 52, and electrolyte discharged from the liquid outlet 231 returns to the management tank 52.

[0117] The electrolyte absorption device 33 has port Po2 connected to the electrolyte outlet 312, and ports Po1 and Po3 connected to the management tank 52. A pump 51 is positioned between the management tank 52 and port Po1 (or between the management tank 52 and port Po3), enabling the electrolyte to flow from port Po1 to port Po3. That is, in the electrolyte absorption device 33, the electrolyte flowing in from ports Po1 and Po2 flows out together from port Po3 and returns to the management tank 52.

[0118] This invention is not limited to the above-described embodiments. Various modifications can be made within the scope of the claims. Appropriate combinations of technical means disclosed in different embodiments to obtain embodiments are also included within the technical scope of this invention.

Claims

1. An electroplating system for performing electroplating on a portion of an object to be plated, characterized in that, have: The electrolyte circulation section has an internal electrolyte circulation path for supplying electrolyte flow; The object to be plated is conveyed by a cylindrical surface having multiple openings, and the object to be plated is conveyed along the cylindrical surface as the cylindrical surface rotates. A flow regulating unit that regulates the flow rate of the electrolyte flowing in the electrolyte circulation path; The opening connects the electrolyte circulation path inside the cylindrical surface to the outside of the cylindrical surface, and is positioned opposite the electroplating target area of ​​the workpiece being transported along the cylindrical surface. The electrolyte flowing in the electrolyte circulation path adheres to the object to be plated through the opening.

2. The electroplating system according to claim 1, The flow regulating unit includes: An electrolyte supply unit supplies electrolyte from the upstream side of the electrolyte circulation path at a specified supply pressure; An electrolyte absorption unit draws electrolyte from the downstream side of the electrolyte circulation path at a specified absorption pressure.

3. The electroplating system according to claim 1, The flow regulating unit adjusts the flow rate so that the electrolyte protrudes outward from the outer side of the opening due to surface tension. The electrolyte protruding from the opening adheres to the electroplating target area of ​​the object to be plated.

4. The electroplating system according to claim 1, The flow rate regulating unit adjusts the flow rate to a degree that prevents the electrolyte from protruding outward from the outside of the opening due to surface tension, and to ensure that the electrolyte adheres to the electroplating target area of ​​the workpiece protruding from the opening towards the electrolyte circulation path.

5. The electroplating system according to claim 1, The electrolyte circulation path has a portion that is a curved shape that convexes outward in a cross-section that passes through the central axis of the cylindrical surface and is parallel to the central axis, and the opening is provided at the outermost part of the curved shape.

6. The electroplating system according to claim 1, The corner of the electrolyte circulation section on the upstream edge of the opening in the direction of electrolyte flow is chamfered on the side of the surface that contacts the electrolyte circulation path.

7. The electroplating system according to claim 1, The electrolyte circulation circuit includes: An electrolyte inlet path is coaxial with the central axis of the cylindrical surface and introduces the electrolyte. An electrolyte diffusion path guides the electrolyte from the electrolyte inlet path in a fan-shaped expansion toward the cylindrical surface; The opening is provided at the end of the electrolyte diffusion path.

8. The electroplating system according to claim 2, The electrolyte supply unit has: The first chamber is supplied with the electrolyte flowing in from the outside via a liquid inlet, and has an electrolyte supply port at the bottom; The second chamber is arranged adjacent to the first chamber when viewed from above, and has an electrolyte drain outlet at the bottom; A flow control partition wall is provided between the first chamber and the second chamber, and the upper parts of the first chamber and the second chamber are spatially connected.

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