A film defect recognition processing system
By integrating lighting, image acquisition, microscopic interference, and information processing modules into the thin film production line, and combining them with a control terminal, the detection and active elimination of surface and internal defects in thin films were achieved. This solved the problem that existing systems could not detect internal defects and improved the detection and intervention capabilities of the production line.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HOLOTEK TECH (ZHUHAI) CO LTD
- Filing Date
- 2026-02-05
- Publication Date
- 2026-05-29
AI Technical Summary
Existing thin film production inspection systems cannot detect internal defects in thin films, nor can they proactively intervene to eliminate defects after they are detected.
The system employs an illumination module, a pattern acquisition module, a microscopic interferometry module, an information processing module, and a control terminal. Combined with multispectral illumination, a linear scanning camera, and an interferometer, it acquires and analyzes pattern information on the surface and interior of thin films. Defects are identified through the Retinex algorithm or frequency domain analysis, and the production line process parameters are adjusted under the control of the control terminal to eliminate defects.
It enables comprehensive detection of surface and internal defects in thin films, preventing missed detections, and eliminates defects by proactively adjusting production line process parameters, thereby improving production quality.
Smart Images
Figure CN122109097A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of thin film production inspection technology, and in particular to a thin film defect identification and processing system. Background Technology
[0002] Thin film products represent a vast and technologically intensive field, permeating almost every aspect of modern industry and daily life. Thin films typically refer to thin, flexible sheet materials whose thickness is much less than their length and width, characterized by their lightness, flexibility, high plasticity, and specific functions. Existing thin film production processes include production lines that require printing patterns on the film surface. During production, these patterned films need to be inspected to prevent defective products from leaving the factory. However, existing thin film inspection systems have two main problems: 1. They only inspect the film surface. Since patterned films have a certain thickness, defects (such as bubbles and cracks) can occur inside the film during the printing process. These defects cannot be detected by surface inspection, leading to missed inspections of internally defective products; 2. Existing inspection systems only detect defects and cannot intervene in the production line to eliminate them after detection. Summary of the Invention
[0003] To overcome the above problems, the present invention provides a thin film defect identification and processing system. The technical solution adopted by the present invention to solve its technical problems is as follows: A thin film pattern defect identification and processing system for a continuously produced and dynamically transported thin film product production line includes: an illumination module for exposing the surface of a thin film product moved to a specific position; a pattern acquisition module for acquiring and transmitting pattern information of the thin film product surface; a microscopic interference module for acquiring and transmitting pattern information of the subsurface of the thin film product; an information processing module for receiving and analyzing the pattern information transmitted by the pattern acquisition module and the microscopic interference module to identify and transmit pattern defect information; and a control terminal for analyzing the pattern defect information transmitted by the information processing module and adjusting the process parameters of the production line based on the analysis results.
[0004] Furthermore, it also includes a diversion module, which receives graphic defect information transmitted by the information processing module and diverts defective film products out of the production line.
[0005] Furthermore, the lighting module includes at least two multispectral lights, which are distributed at equal angles above the production line to provide different angles and different spectra of exposure to the surface of the thin film products passing through.
[0006] Furthermore, the image acquisition module includes a linear scan camera located directly above the production line, which is electrically connected to a multispectral illumination lamp to synchronize exposure and shooting actions.
[0007] Furthermore, the micro-interference module includes an interferometer to send interference waves to the thin-film product and receive feedback signals.
[0008] Furthermore, the information processing module includes a graphic acquisition card, a counting control card, and an industrial computer. The graphic acquisition card collects graphic information and transmits it to the industrial computer. The industrial computer analyzes and processes the graphic information and transmits it to the control terminal and the counting control card. The counting control card counts the number of defects and transmits the number information to the control terminal.
[0009] Furthermore, the industrial control computer processes and analyzes the graphical information, including the following steps: S1. Obtain graphic information of five points of a normal thin film product through the graphic acquisition module and the micro-interference module, and use this graphic information as a comparison sample. S2. Acquire graphic information of five points corresponding to the thin film product transmitted by the graphic acquisition module and the micro-interference module during the production process; S3. Preprocess the graphic information of the five points obtained, and perform compensation and noise reduction; S4. Use the Retinex algorithm or frequency domain analysis (FFT / DWT) to analyze the graphic information of the five points after compensation and denoising to highlight the defect area; and compare it with the graphic information of the five points of the comparison sample to identify whether the thin film product has defects.
[0010] Furthermore, the control terminal includes an interactive terminal and an alarm.
[0011] Furthermore, the graphical defect information analyzed by the control terminal includes the defect type and the number of defects. If the same type of defect occurs continuously, the control terminal will issue an early warning through an alarm and adjust the process parameters.
[0012] Furthermore, the control terminal has different process parameter adjustment schemes set according to different defect types. When a corresponding defect type is encountered, the control terminal automatically calls the corresponding process parameter adjustment scheme.
[0013] The beneficial effects of this invention are: This thin-film defect identification and processing system includes an illumination module, an image acquisition module, a microscopic interference module, an information processing module, and a control terminal. The image acquisition module, in conjunction with the photographic module, acquires surface image information of the thin-film product, while the microscopic interference module acquires internal image information. Both types of image information are transmitted to the information processing module, which analyzes the image information and determines whether the product has defects. The information processing module then transmits the analyzed and identified image defect information to the control terminal. The control terminal analyzes the image defect information and adjusts the production line's process parameters based on the analysis results, thereby eliminating production defects. This system can acquire both surface and internal images of the thin-film product, ensuring no missed detections. Furthermore, in addition to the information processing module, the system also includes a control terminal. The control terminal further analyzes the image defect information analyzed by the information processing module and then adjusts the production line's process to proactively intervene and eliminate defects. Attached Figure Description
[0014] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, wherein: Figure 1 This is a diagram of the modules in this system. Detailed Implementation
[0015] To better understand the purpose, structure, and function of this invention, the following detailed description of specific embodiments of the "Thin Film Defect Identification and Processing System" is provided in conjunction with the accompanying drawings.
[0016] See Figure 1In this embodiment, the thin film defect identification and processing system is used in a continuously producing and dynamically transported thin film product production line. The system includes an illumination module, a pattern acquisition module, a microscopic interference module, an information processing module, and a control terminal. The illumination module exposes the surface of the thin film product at a specific location, highlighting the pattern changes on the surface for easier pattern acquisition. The pattern acquisition module acquires pattern information from the surface of the thin film product and transmits this information to the information processing module. The microscopic interference module acquires pattern information from the subsurface of the thin film product and transmits this information to the information processing module. The information processing module receives and analyzes the pattern information transmitted by the pattern acquisition module and the microscopic interference module to identify whether there are pattern defects, determines the presence of defects, and transmits the corresponding pattern defect information to the control terminal. The control terminal analyzes the pattern defect information transmitted by the information processing module and adjusts the process parameters of the production line based on the analysis results to eliminate production defects in subsequent thin film products. This system includes a microscopic interference module in addition to the graphic acquisition module. The microscopic interference module can acquire graphic information inside the thin film product, so that the subsequent information processing module can also detect internal defects in the thin film product, preventing defective thin film products from being shipped out. Furthermore, in addition to the information processing module, this system also includes a control terminal. The control terminal will further analyze the graphic defect information analyzed by the information processing module, and then adjust the production line process to actively intervene and eliminate defects.
[0017] More specifically, in this embodiment, the thin film pattern defect identification and processing system also includes a diversion module. The diversion module receives the graphic defect information transmitted by the information processing module and diverts the defective thin film products out of the production line to prevent defective products from flowing into the next process. Preferably, the diversion module is a robotic arm, which picks up the defective thin film products and transfers them to the waste product storage station.
[0018] Furthermore, in this embodiment, the lighting module includes at least two multispectral lights, which are distributed at equal angles above the production line. When the thin film product passes the irradiation position of the multispectral lights, the multispectral lights will provide exposure to the surface of the thin film product at different angles and with different spectra. By combining bright field, dark field, polarized light and different colored light, the contrast of different defects on the thin film surface (such as microcracks and oil stains) is enhanced, which facilitates subsequent identification.
[0019] More specifically, in this embodiment, the image acquisition module includes a line scan camera located directly above the production line. The line scan camera uses a high dynamic range sensor paired with a telecentric lens to achieve accurate capture of defects. Furthermore, the line scan camera is electrically connected to the multispectral illumination lamp to achieve synchronization of exposure and shooting actions.
[0020] More specifically, in this embodiment, the micro-interference module includes an interferometer, which emits interference waves to the thin film product and receives feedback signals, and obtains the internal graphic information of the thin film product based on the feedback signals.
[0021] More specifically, in this embodiment, the information processing module includes a graphics acquisition card, a counting control card, and an industrial control computer. The graphics acquisition card collects the graphics information acquired by the graphics acquisition module and the microscopic interference module and transmits it to the industrial control computer. The industrial control computer processes and analyzes the graphics information and transmits it to the control terminal and the counting control card. The counting control card counts the number of defects and transmits the number information to the control terminal.
[0022] Furthermore, the industrial control computer processes and analyzes the graphic information through the following steps: S1. Acquire graphic information of five points of a normal thin film product through the graphic acquisition module and the microscopic interference module, and use this graphic information as a comparison sample; S2. Acquire graphic information of five points of the thin film product transmitted by the graphic acquisition module and the microscopic interference module during the production process; S3. Preprocess the acquired graphic information of five points, performing compensation and noise reduction (such as non-local mean filtering) to address reflection or texture interference of the thin film product; S4. Analyze the compensated and denoised graphic information of the five points using the Retinex algorithm or frequency domain analysis (FFT / DWT) to highlight defective areas; and compare it with the graphic information of five points of the comparison sample to identify whether the thin film product has defects.
[0023] More specifically, the control terminal includes an interactive terminal and an alarm. The interactive terminal displays and analyzes graphic defect information, including the defect type and quantity. When the same type of defect appears on more than two consecutive film products, the alarm will issue a warning to remind the staff. At the same time, the control terminal will adjust the production line process to eliminate the defect.
[0024] It should be noted that operators set different process parameter adjustment schemes in the control terminal through the interactive terminal. Each adjustment scheme corresponds to a different defect type. The control terminal will automatically call the corresponding process parameter adjustment scheme according to different defect types. When a defect type without a corresponding adjustment scheme occurs, the alarm will sound and control the production line to stop production. Operators will add the process parameter adjustment scheme corresponding to the new process defect through the interactive terminal and then restart the production line to realize the updating and iteration of process parameter adjustment schemes for different defect types.
[0025] It is understood that the present invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, under the teachings of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present invention.
[0026] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this application, "multiple" and "several" are understood as "at least two." "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. A connected to B can represent: A and B directly connected, and A and B connected through C. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
Claims
1. A thin film pattern defect identification and processing system for a continuously producing and dynamically conveying thin film product production line, characterized in that, include: An illumination module is used to expose the surface of a thin-film product that has been moved to a specific location; The image acquisition module is used to acquire and transmit image information of the surface of the thin film product; The micro-interference module is used to acquire and transmit graphic information of the subsurface of thin film products; The information processing module is used to receive and analyze the graphic information transmitted by the graphic acquisition module and the microscopic interference module in order to identify and transmit graphic defect information; The control terminal analyzes the graphic defect information transmitted by the information processing module and adjusts the process parameters of the production line based on the analysis results.
2. The thin film pattern defect identification and processing system according to claim 1, characterized in that, It also includes a diversion module, which receives graphic defect information transmitted by the information processing module and diverts defective film products out of the production line.
3. The thin film pattern defect identification and processing system according to claim 1, characterized in that, The lighting module includes at least two multispectral lights, which are distributed at equal angles above the production line to provide different angles and different spectra of exposure to the surface of the thin film products passing through.
4. The thin film pattern defect identification and processing system according to claim 3, characterized in that, The image acquisition module includes a linear scan camera located directly above the production line. The linear scan camera is electrically connected to the multispectral illumination lamp to synchronize exposure and shooting actions.
5. The thin film pattern defect identification and processing system according to claim 1, characterized in that, The micro-interference module includes an interferometer to send interference waves to the thin film product and receive feedback signals.
6. The thin film pattern defect identification and processing system according to claim 1, characterized in that, The information processing module includes a graphic acquisition card, a counting control card, and an industrial control computer. The graphic acquisition card collects the graphic information and transmits it to the industrial control computer. The industrial control computer analyzes and processes the graphic information and transmits it to the control terminal and the counting control card. The counting control card counts the number of defects and transmits the number information to the control terminal.
7. The thin film pattern defect identification and processing system according to claim 6, characterized in that, The industrial control computer processes and analyzes the graphic information, including the following steps: S1. Obtain graphic information of five points of a normal thin film product through the graphic acquisition module and the micro-interference module, and use this graphic information as a comparison sample. S2. Acquire graphic information of five points corresponding to the thin film product transmitted by the graphic acquisition module and the micro-interference module during the production process; S3. Preprocess the graphic information of the five points obtained, and perform compensation and noise reduction; S4. Use the Retinex algorithm or frequency domain analysis (FFT / DWT) to analyze the graphic information of the five points after compensation and denoising to highlight the defect area; The image information of the film product is compared with that of five points in the comparison sample to identify whether the film product has defects.
8. The thin film pattern defect identification and processing system according to claim 7, characterized in that, The control terminal includes an interactive terminal and an alarm.
9. The thin film pattern defect identification and processing system according to claim 8, characterized in that, The graphical defect information analyzed by the control terminal includes the defect type and the number of defects. If the same type of defect occurs continuously, the control terminal issues a warning through the alarm and adjusts the process parameters.
10. A thin film pattern defect identification and processing system according to claim 9, characterized in that, The control terminal is equipped with different process parameter adjustment schemes for different defect types. When a corresponding defect type is encountered, the control terminal automatically calls the corresponding process parameter adjustment scheme.