Chip layout processing method, device, equipment and storage medium

Abstract

The application discloses a chip layout processing method and device, equipment and a storage medium, and relates to the technical field of computers. The method comprises the following steps: identifying N transmission lines in a chip layout, wherein N is a positive integer; identifying a coupling pair from the chip layout based on the N transmission lines, the coupling pair comprising one transmission line in the N transmission lines and one resonant cavity having a coupling relationship with the transmission line; and extracting geometric parameters of the coupling pair from the chip layout, wherein the geometric parameters refer to the design size and positional relationship of the transmission line and the resonant cavity in the coupling pair in the chip layout, and the geometric parameters are used for chip preparation. The above method improves the extraction efficiency of the geometric parameters of the coupling pair in the chip layout.

Description

Technical Field

[0001] This application relates to the field of computer technology, and in particular to a method, apparatus, device, and storage medium for processing chip layouts. Background Technology

[0002] There are two types of devices on a chip layout: transmission lines and resonant cavities. When these two types of devices couple, a coupling pair is formed. The coupling strength varies depending on the coupling configuration.

[0003] In related technologies, it is necessary to manually select the coupled transmission line and resonant cavity from the device layout on the chip as a coupling pair. Then, the geometric parameters of the coupled part in the coupling pair are manually extracted to further calculate the coupling strength of the coupling pair.

[0004] Therefore, the parameter extraction methods in related technologies have low efficiency. Summary of the Invention

[0005] This application provides a method, apparatus, device, and storage medium for processing chip layouts, which can improve parameter extraction efficiency. The technical solution provided by this application is as follows:

[0006] According to one aspect of the embodiments of this application, a method for processing chip layout is provided, the method comprising:

[0007] Identify N transmission lines in the chip layout, where N is a positive integer;

[0008] Based on the N transmission lines, a coupling pair is identified from the chip layout. The coupling pair includes one of the N transmission lines and a resonant cavity that is coupled to the transmission line.

[0009] The geometric parameters of the coupling pair are extracted from the chip layout. The geometric parameters refer to the design dimensions and positional relationship of the transmission line and the resonant cavity in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

[0010] According to one aspect of the embodiments of this application, a chip layout processing apparatus is provided, the apparatus comprising:

[0011] The identification module is used to identify N transmission lines in the chip layout, where N is a positive integer;

[0012] A matching module is used to identify coupling pairs from the chip layout based on the N transmission lines. The coupling pair includes one of the N transmission lines and a resonant cavity coupled to the transmission line.

[0013] An extraction module is used to extract the geometric parameters of the coupling pair from the chip layout. The geometric parameters refer to the design dimensions and positional relationship of the transmission line and the resonant cavity in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

[0014] According to one aspect of the embodiments of this application, a computer device is provided, the computer device including a processor and a memory, the memory storing a computer program, the computer program being loaded and executed by the processor to implement the above-described chip layout processing method.

[0015] According to one aspect of the embodiments of this application, a chip product is provided, the chip product including programmable logic circuits and / or computer programs, which, when the chip product is run, are used to implement the processing method for implementing the above-described chip layout.

[0016] According to one aspect of the embodiments of this application, a computer-readable storage medium is provided, wherein a computer program is stored in the storage medium, the computer program being loaded and executed by a processor to implement the above-described chip layout processing method.

[0017] According to one aspect of the embodiments of this application, a computer program product is provided, the computer program product including a computer program stored in a computer-readable storage medium, and a processor reading from the computer-readable storage medium and executing the computer program to implement the above-described chip layout processing method.

[0018] The technical solutions provided in this application have at least the following beneficial effects:

[0019] By automatically identifying transmission lines from the chip layout and recognizing resonant cavities coupled to the transmission lines as a coupling pair, the geometric parameters of this coupling pair are further automatically extracted. The technical solution provided in this application improves parameter extraction efficiency by automatically identifying coupling pairs on the chip layout and further automatically extracting their geometric parameters.

[0020] Furthermore, the geometric parameters automatically extracted in this application can be used to determine the predicted device properties of the coupling pairs. That is, before chip fabrication, the device properties of the coupling pairs on the chip fabricated from the chip layout can be predicted in advance. This enables the perception of the device properties of the coupling pairs on the chip before chip fabrication. This helps improve chip fabrication efficiency, minimizes the fabrication of erroneous chips, and reduces chip fabrication costs. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a chip layout processing method provided in one embodiment of this application;

[0022] Figure 2 This is a flowchart of a chip layout processing method provided in one embodiment of this application;

[0023] Figure 3 This is a flowchart of a chip layout processing method provided in another embodiment of this application;

[0024] Figure 4 This is a flowchart of a chip layout processing method provided in another embodiment of this application;

[0025] Figure 5 This is a flowchart of a chip layout processing method provided in another embodiment of this application;

[0026] Figure 6 This is a schematic diagram of a coplanar waveguide on a chip layout provided in one embodiment of this application;

[0027] Figure 7 This is a schematic diagram of a coupled transmission line and resonant cavity provided in one embodiment of this application;

[0028] Figure 8 This is a schematic diagram of a coupled transmission line and resonant cavity provided in another embodiment of this application;

[0029] Figure 9 This is a schematic diagram of the geometric parameters of a coupling pair provided in another embodiment of this application;

[0030] Figure 10 This is a schematic diagram illustrating the use of a probe rectangle to detect geometric parameters according to an embodiment of this application;

[0031] Figure 11 This is a block diagram of a chip layout processing method provided in one embodiment of this application;

[0032] Figure 12 This is a block diagram of a transmission line identification method provided in one embodiment of this application;

[0033] Figure 13 This is a block diagram of a matching method for coupling pairs provided in one embodiment of this application;

[0034] Figure 14 This is a block diagram of a chip layout processing apparatus provided in one embodiment of this application;

[0035] Figure 15 This is a structural block diagram of a computer device provided in one embodiment of this application. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0037] Before describing the embodiments of this application, some terms used in this application will be explained. The following explanations are optional and can be combined with the technical solutions of the embodiments of this application in any way, all of which fall within the protection scope of the embodiments of this application. The embodiments of this application include at least some of the following contents.

[0038] 1. Superconducting quantum chip: The central processing unit of a superconducting quantum computer. A quantum computer is a machine that uses the principles of quantum mechanics to perform calculations. Based on the superposition principle and quantum entanglement in quantum mechanics, quantum computers have strong parallel processing capabilities and can solve some problems that are difficult for classical computers to compute. The zero-resistance characteristic of superconducting qubits and their manufacturing process, which is similar to that of integrated circuits, make quantum computing systems built using superconducting qubits one of the most promising systems for realizing practical quantum computing.

[0039] 2. Co-planar Waveguide (CPW): A high-performance, easy-to-fabricate planar microwave transmission line used to transmit microwave signals. Co-planar waveguide technology is extensively used in superconducting quantum chips.

[0040] 3. Layout: Also known as circuit layout, it is a design drawing that describes how the components in a circuit are arranged, placed, and connected. It is a planar geometric description of the actual physical state of the circuit. The layout design must comply with constraints such as manufacturing process, timing, area, and power consumption. The layout design file contains the shape, area, and location information of each hardware unit on the chip.

[0041] 4. Component: In the field of circuit design, a component refers to an independent unit that makes up the overall system. For example, in integrated circuits, components can be transistors, resistors, capacitors, etc. In superconducting quantum chips, components can be resonant cavities, cross-shaped large capacitors, test junctions, superconducting qubits, etc.

[0042] 5. Resonator: A miniature electromagnetic structure integrated on a quantum chip that supports electromagnetic wave modes of a specific frequency through reflection and refraction boundary conditions, forming standing waves or resonant modes.

[0043] 6. Transmission line: A conductive path integrated on a quantum chip for transmitting and manipulating microwave signals that are used to drive and read out qubits.

[0044] 7. Coupling: On a quantum chip, the interaction between qubits or other quantum devices occurs through specific physical mechanisms, which allows their quantum states to influence each other and exchange information.

[0045] 8. Quality factor: Used to describe the energy storage efficiency and loss characteristics of resonators, transmission lines or other quantum devices on a quantum chip.

[0046] 9. Characteristic frequency: The frequency at which a resonant cavity, qubit, or other quantum device on a quantum chip oscillates naturally without external excitation.

[0047] In related technologies, the coupling strength between transmission lines and resonant cavities needs to be precisely controlled to achieve efficient quantum gate operations. Therefore, it is necessary to probe the coupled transmission lines and resonant cavities on the quantum chip layout. Since the geometric parameters of the coupling pair affect the coupling strength, automatically extracting the geometric parameters of the coupled portions of the transmission lines and resonant cavities is essential for controlling the coupling strength.

[0048] like Figure 1 The diagram shown is a schematic diagram of a chip layout processing method provided in an embodiment of this application. The method includes at least one of the following steps 101 to 103.

[0049] Step 101: Identify the transmission lines from the chip layout. For example, such as... Figure 1 As shown, transmission line 110 is generally a long, straight, coplanar waveguide.

[0050] Step 102: Determine a resonant cavity that matches the transmission line. For example, such as... Figure 1 As shown, the resonant cavity 120 refers to a coplanar waveguide that bends multiple times within a small range. In some embodiments, when the resonant cavity 120 and the transmission line 110 have mutually parallel coplanar waveguide portions 130, and the distance between the resonant cavity 120 and the transmission line 110 is less than or equal to a set coupling distance threshold, the transmission line 110 and the resonant cavity 120 are considered to constitute a coupling pair. Exemplarily, the mutually parallel coplanar waveguide portions 130 between the resonant cavity 120 and the transmission line 110 are also referred to as the coupling portions of this coupling pair.

[0051] Step 103: Automatically extract the geometric parameters of the coupling pair. For example, the geometric parameters of the coplanar waveguide portions 130 that are parallel to each other between the resonant cavity 120 and the transmission line 110 are automatically extracted, that is, the geometric parameters of the coupling portion are automatically extracted. For example, the geometric parameters include the coupling length. The coupling length is the length of the coplanar waveguide portions 130 that are parallel to each other.

[0052] In some embodiments, geometric parameters are used to calculate the coupling strength. For example, geometric parameters are used to calculate coupling strength indices such as intrinsic frequencies and quality factors, which indicate the coupling strength of the coupled pair.

[0053] The technical solution provided in this application automatically identifies transmission lines and resonant cavities matching the transmission lines as a coupling pair from the chip layout. Furthermore, it automatically extracts the geometric parameters of this coupling pair. The technical solution provided in this application improves parameter extraction efficiency by automatically identifying coupling pairs and further automatically extracting their geometric parameters.

[0054] Please refer to Figure 2 This document illustrates a flowchart of a chip layout processing method according to an embodiment of this application. This method can be executed by a computer device, which can be any electronic device with computing and storage capabilities, such as a PC (Personal Computer), tablet computer, server, etc. Exemplarily, the computer device can run a computer program for executing this method, thereby implementing the chip layout processing method provided in this embodiment. Figure 2 As shown, the method may include at least one of the following steps 210 to 230.

[0055] Step 210: Identify N transmission lines in the chip layout, where N is a positive integer.

[0056] In some embodiments, a chip layout is a design drawing describing how components in a circuit are arranged, placed, and connected; it is a planar geometric description of the actual physical state of the circuit. The chip layout can be a quantum chip layout, such as that of a superconducting quantum chip. Superconducting quantum chips use extensive coplanar waveguide technology to transmit microwave signals. The chip layout can also be a layout of other chips, such as memory chips, digital multimedia chips, etc. This application does not limit the type of chip corresponding to the chip layout. The chip layout design file contains information such as the shape, area, and position of each hardware unit on the chip. Through automatic routing, routing information connecting each point can be added to the layout design file, ultimately generating a layout design file with routing information.

[0057] In some embodiments, a center conductor is fabricated on one side of a dielectric substrate, and ground planes are fabricated on both sides immediately adjacent to the center conductor, thus forming a CPW, also called a coplanar microstrip transmission line. A CPW comprises two parallel slots of equal width. In the chip layout, these slots are typically drawn as grooves (i.e., slots) between the center conductor and the two ground planes. Generally, the spacing between the center conductor and the two ground planes is the same, meaning that the two slots drawn in the chip layout have the same width. In other embodiments within the context of this application, these slots are also referred to as slot lines.

[0058] In some embodiments, such as Figure 6 As shown, a central conductor 620 and two ground planes 630 on both sides of the central conductor 620 exist on one surface of the dielectric substrate 610. The central conductor 620, the two slots (grooves) 640 between the central conductor 620 and the two ground planes 630, and the two ground planes 630 together constitute the CPW. That is, the CPW in this application can be broadly understood to include the conductor (the central conductor and the two ground planes) and the two slots, and narrowly understood to include only the two slots. For example, the coplanar waveguide in this application refers to the two slots here, such as considering the two slots (grooves) 640 as the first groove line (one of the two slots 640) and the second groove line (the other of the two slots 640). For a specific description of the first groove line and the second groove line, please refer to the following embodiments, which will not be repeated here. In some other embodiments, an air bridge can be arranged on the coplanar waveguide to connect the two ground planes. Figure 6 As shown, an airbridge 650 connects the two ground planes 630. Of course, the airbridge can also be placed outside the coplanar waveguide; this application does not limit this. Exemplarily, an airbridge is a circuit structure that uses a three-dimensional bridge structure to bridge planar circuits, ensuring equal potentials on both sides of the central conductor and suppressing the excitation of parasitic modes. It is suitable for various chips, particularly flip-chip and superconducting quantum chips. Because the medium between the bridge and the circuit is air or vacuum, it is called an air bridge or vacuum bridge, and is often simply referred to as an airbridge.

[0059] In some embodiments, a computer device acquires a chip layout. Exemplarily, the computer device identifies transmission lines from the acquired chip layout. In some embodiments, a layout design file for the chip layout is acquired. The layout design file contains information such as the shape, area, and location of each hardware unit on the chip. Through automatic routing, routing information connecting each point can be added to the layout design file, ultimately generating a layout design file with routing information. The routing information may include coplanar waveguides, which define the location information of the coplanar waveguides laid out in the chip layout. Exemplarily, the computer device reads the layout design file of the chip layout and acquires all the coplanar waveguides on the chip layout. Different coplanar waveguides, with different shapes, lengths, etc., constitute different devices on the chip layout. Devices composed of coplanar waveguides include transmission lines and resonant cavities.

[0060] In some embodiments, because coplanar waveguide technology is used on the chip layout to transmit microwave signals, there are numerous coplanar waveguides on the chip layout used to transmit microwave signals. In some embodiments, transmission lines are a type of device, or element, composed of coplanar waveguides. Exemplarily, a transmission line is a conductive path integrated on a quantum chip for transmitting and manipulating microwave signals used to drive and read out qubits. In some embodiments, all coplanar waveguides are first identified on the chip layout, and then transmission lines are determined from the identified coplanar waveguides.

[0061] In some embodiments, a transmission line is at least one of signal lines, wires, etc., used for transmitting signals in a chip layout. Exemplarily, the transmission line is generally long. Exemplarily, the transmission line is a coplanar waveguide with a length greater than or equal to a third preset threshold. Exemplarily, the third preset threshold is a preset value. For a detailed explanation of how to identify a transmission line, please refer to the following embodiments; further details are omitted here.

[0062] It should be noted that the transmission lines, resonant cavities, coupling pairs, and other devices identified from the chip layout mentioned in the embodiments of this application do not refer to actual physical devices, but rather to analog devices corresponding to actual physical devices, or device patterns. For example, each actual device corresponds to a device pattern on the chip layout, which is used to simulate the actual device. For example, the chip layout includes transmission line patterns, resonant cavity patterns, coplanar waveguide patterns, etc. The transmission line patterns included on the chip layout correspond to transmission lines in the actual chip; in this application, the transmission line pattern is simply referred to as a transmission line. The resonant cavity patterns included on the chip layout correspond to resonant cavities in the actual chip; in this application, the resonant cavity pattern is simply referred to as a resonant cavity. The coplanar waveguide patterns included on the chip layout correspond to coplanar waveguides in the actual chip; in this application, the coplanar waveguide pattern is simply referred to as a coplanar waveguide.

[0063] Step 220: Based on the N transmission lines, identify the coupling pairs from the chip layout. Each coupling pair includes one of the N transmission lines and a resonant cavity that is coupled to the transmission line.

[0064] In some embodiments, the number of resonant cavities matched to the N transmission lines is 0 or at least one. In some embodiments, when the number of resonant cavities matched to a transmission line is 0, it is considered that the transmission line has no matched resonant cavity. In some embodiments, when the number of resonant cavities matched to a transmission line is 1, it is considered that the transmission line and the resonant cavity matched to the transmission line constitute a coupling pair. In some embodiments, when the number of resonant cavities matched to a transmission line is at least two, it is considered that the transmission line and the at least two resonant cavities matched to the transmission line constitute at least two coupling pairs.

[0065] In some embodiments, a resonant cavity is also a type of device, or element, constructed from coplanar waveguides. Exemplarily, a resonant cavity is a miniature electromagnetic structure integrated on a quantum chip that supports electromagnetic wave modes of specific frequencies through reflection and refraction boundary conditions, forming standing waves or resonant modes.

[0066] In some embodiments, all coplanar waveguides are first identified on the chip layout, and then resonant cavities are determined from the identified coplanar waveguides. In some embodiments, the resonant cavity is a coplanar waveguide that bends multiple times within a small range. For a detailed explanation of how the resonant cavity is identified, please refer to the following embodiments; further details are omitted here. Further, a resonant cavity that matches the transmission line is then determined from the identified resonant cavities.

[0067] In some embodiments, a transmission line and a resonant cavity with a coupling relationship can be considered as a transmission line and a resonant cavity that satisfy a coupling condition. In some embodiments, devices that satisfy the coupling condition with the transmission line are directly identified from the chip layout. When the device is a resonant cavity, the resonant cavity and the transmission line are considered to form a coupling pair. In some embodiments, when the coupling condition is satisfied between the resonant cavity and the transmission line, the resonant cavity is considered to be a resonant cavity matched with the transmission line. Exemplarily, the coupling condition is a condition used to determine whether coupling occurs, that is, a condition used to determine mutually matched transmission lines and resonant cavities. In some embodiments, the coupling condition is related to the geometric position of the transmission line and the resonant cavity. Exemplarily, the coupling condition is a preset geometric relationship. When the preset geometric relationship is satisfied, it is said that the transmission line and the resonant cavity have a coupling relationship. Exemplarily, when the respective geometric positions of the transmission line and the resonant cavity have the preset geometric relationship, it is said that the transmission line and the resonant cavity have a coupling relationship. In some embodiments, the coupling condition includes one of the following: there are mutually parallel portions of the two, or the distance between them is less than or equal to a set threshold. In some embodiments, a resonant cavity matched with the transmission line is determined according to the coupling condition.

[0068] In some embodiments, the order of determining the resonant cavity and transmission line in steps 210 and 220 above can be interchanged. For example, step 210 can be implemented as: identifying at least one resonant cavity in the chip layout. For example, step 220 can be implemented as: identifying transmission lines from the chip layout that are respectively matched with at least one resonant cavity, wherein each resonant cavity is matched with at least one transmission line, and a transmission line with a matching relationship and a resonant cavity constitute a coupling pair.

[0069] In some embodiments, N transmission lines are first identified, and then coupling pairs are identified from the chip layout. For example, for each of the N transmission lines, a matching resonant cavity is found for each transmission line. Each transmission line and resonant cavity with a coupling relationship is considered a coupling pair. That is, the resonant cavity matched with a transmission line, along with that transmission line, is automatically identified as a coupling pair. In this application, "matching" can be understood as "coupling." If a and b have a coupling relationship, it can be understood as a matching with b, or b matching with a, or a and b coupling, or b and a coupling.

[0070] In some embodiments, step 210 is not performed, and coupling pairs are identified directly from the chip layout. For example, for all devices on the chip layout, a coupling pair is identified for each transmission line and resonant cavity that are coupled.

[0071] In some embodiments, N transmission lines are first identified, then Q resonant cavities on the chip layout are identified, and then multiple pairs of coupled transmission lines and resonant cavities are found based on whether there is a coupling relationship between the transmission lines and resonant cavities. These multiple pairs of coupled transmission lines and resonant cavities are considered as multiple coupling pairs.

[0072] Step 230: Extract the geometric parameters of the coupling pair from the chip layout. The geometric parameters refer to the design dimensions and positional relationships of the transmission lines and resonant cavities in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

[0073] In some embodiments, geometric parameters refer to the positional relationship between the transmission line and resonant cavity in the coupled pair on the chip layout. In some embodiments, geometric parameters are parameters relating to the positional relationship between the transmission line and resonant cavity in the coupled pair on the chip layout. In some embodiments, geometric parameters relate to the respective positions of the transmission line and resonant cavity in the coupled pair. Exemplarily, geometric parameters refer to parameters relating to the respective positions of the transmission line and resonant cavity in the coupled pair. Exemplarily, geometric parameters are used to indicate parameters of the coupling portion in the coupled pair. The coupling portion refers to the coplanar waveguide portion between the transmission line and resonant cavity in the coupled pair that are parallel to each other.

[0074] In some embodiments, geometric parameters refer to the design dimensions of the transmission line and resonant cavity in the coupled pair on the chip layout. These design dimensions refer to the dimensions used when designing the transmission line and resonant cavity on the chip layout. Examples include the width of the center conductor of the coplanar waveguide corresponding to the transmission line, the width of the slot line of the coplanar waveguide corresponding to the transmission line, the number of bends in the resonant cavity, the width of the center conductor of the coplanar waveguide corresponding to the resonant cavity, and the width of the slot line of the coplanar waveguide corresponding to the resonant cavity. In this embodiment, the transmission line and resonant cavity are first identified based on the location of each device on the chip layout. For example, a coplanar waveguide with a length greater than or equal to a third preset threshold is identified as a transmission line. Similarly, a coplanar waveguide with at least two bends within a length of a second preset threshold is identified as a resonant cavity. In some embodiments, if a coplanar waveguide with parallel portions exists in a transmission line and a resonant cavity, and the distance between the transmission line and the resonant cavity is less than or equal to the coupling distance, the transmission line and the resonant cavity are identified as a coupled pair. Further, after identifying the coupled pair, the geometric parameters of the coupled pair are extracted. The geometric parameters of the coupling pair here are determined based on the transmission line and resonant cavity within the coupling pair. On one hand, the geometric parameters of the coupling pair may include positional parameters characterizing the positional relationship between the transmission line and the resonant cavity, such as the coupling distance between the transmission line and the resonant cavity, or the coupling length (length of the parallel portion) between the transmission line and the resonant cavity. On the other hand, the geometric parameters of the coupling pair may include dimensional parameters characterizing the design dimensions of the transmission line and the resonant cavity, such as the width of the center conductor or slot line of the coplanar waveguide corresponding to the transmission line and the resonant cavity, respectively. For further details, please refer to the explanation of the embodiments below.

[0075] In some embodiments, the geometric parameters include at least one of the following: the length of the coupling portion, the distance between the coupled centering transmission line and the resonant cavity, the width of the slot line in the coplanar waveguide where the coupled centering transmission line is located, the width of the center conductor of the coupled centering transmission line, the width of the slot line in the coplanar waveguide where the coupled centering resonant cavity is located, the width of the center conductor of the coupled centering resonant cavity, the number of resonant cavities coupled to the same transmission line, etc. For details of these parameters, please refer to the explanations of the embodiments below; they will not be elaborated upon here.

[0076] In some embodiments, geometric parameters are used to perform chip fabrication. Exemplarily, geometric parameters can determine predicted device properties (such as coupling strength). If the predicted device properties meet set conditions, the chip is fabricated based on these geometric parameters. If the predicted device properties do not meet the set conditions, the device layout on the chip layout is adjusted to obtain coupling pairs where the predicted device properties meet the set conditions, and then chip fabrication is performed. For further details, please refer to the explanation of the embodiments below.

[0077] In some embodiments, the predicted device properties of a coupling pair refer to the properties of the coupling pair itself on the predicted chip layout, such as coupling strength. Exemplarily, the predicted device properties of a coupling pair are determined by the geometric parameters of the coupling pair. Exemplarily, the coupling strength is indicated by a coupling strength parameter index. Specifically, the coupling strength parameter index includes at least one of a quality factor and an eigenfrequency. Exemplarily, the quality factor is used to describe the energy storage efficiency and loss characteristics of a resonator, transmission line, or other quantum device on a quantum chip. Exemplarily, the eigenfrequency refers to the frequency at which a resonant cavity, qubit, or other quantum device on a quantum chip oscillates naturally without external excitation.

[0078] It is important to clarify that, since this application identifies coupling pairs from a chip layout, these coupling pairs are not actual physical devices, but rather simulations of coupling pairs on a real physical chip. The predicted device attributes here refer to calculations of the device attributes of the coupling pairs identified from the chip layout, not direct measurements of the device attributes of coupling pairs on a real physical chip. For example, the device attributes calculated using extracted geometric parameters are based on the positional relationship between transmission lines and resonant cavities in the coupling pairs on the chip layout; this is an estimation or prediction of the device attributes of coupling pairs on a real physical chip. Therefore, the term "predicted device attributes" is used here to distinguish them from the device attributes of coupling pairs actually existing on a real physical chip.

[0079] In some embodiments, each component on the chip layout corresponds to a specific geometric location. Since each component on the chip layout corresponds to a specific position coordinate, for example, the positions of the transmission line and resonant cavity in the coupling pair are obtained from the chip layout, and the geometric parameters of the coupling pair are extracted based on the position coordinates of the transmission line and resonant cavity.

[0080] In some embodiments, after extracting the geometric parameters, the geometric relationship between the coupled-center transmission line and the resonant cavity is obtained based on the geometric parameters. Further, the predicted device properties are determined based on the geometric relationship between the coupled-center transmission line and the resonant cavity. Exemplarily, the geometric relationship between the coupled-center transmission line and the resonant cavity is used as a predicted device property.

[0081] In some embodiments, step 230 may also be described as extracting the geometric parameters of the coupling pair from the chip layout, which are the predicted device properties of the coupling pair. That is, there is no "step to determine the predicted device properties of the coupling pair" in this case.

[0082] In some embodiments, the quality factor and intrinsic frequency are calculated from the geometric parameters of the coupling pair; the specific calculation process will not be described in detail in this application.

[0083] The technical solution provided in this application automatically identifies transmission lines and resonant cavities matching the transmission lines as a coupling pair from the chip layout. Furthermore, it automatically extracts the geometric parameters of this coupling pair. The technical solution provided in this application improves parameter extraction efficiency by automatically identifying coupling pairs and further automatically extracting their geometric parameters.

[0084] Below, in conjunction with Figure 3 The first method for determining a matched resonant cavity is introduced.

[0085] Please refer to Figure 3 This illustrates a flowchart of a chip layout processing method according to another embodiment of this application. This method can be executed by the aforementioned computer device. Figure 3 As shown, the method may include at least one of the following steps 310 to 340.

[0086] Step 310: Identify N transmission lines in the chip layout, where N is a positive integer.

[0087] Specifically, for how to identify transmission lines, please refer to the following: Figure 5 The corresponding implementation examples will not be described in detail here.

[0088] Step 320: From the M coplanar waveguides included in the chip layout, determine at least one undetermined coplanar waveguide. The undetermined coplanar waveguide refers to a coplanar waveguide that has not been identified as a transmission line, and M is a positive integer.

[0089] In some embodiments, after removing the coplanar waveguides containing N transmission lines from the M coplanar waveguides included in the chip layout, at least one undetermined coplanar waveguide is obtained.

[0090] In some embodiments, transmission lines and resonant cavities are two distinct types of devices determined based on coplanar waveguides in the chip layout. For example, after identifying the coplanar waveguides (i.e., M coplanar waveguides) on the chip layout, N transmission lines are further identified from them. After identifying the N transmission lines, a resonant cavity matching each transmission line is identified again from the remaining coplanar waveguides (i.e., at least one undetermined coplanar waveguide). See the explanation of the embodiments below for a detailed description of how transmission lines are identified.

[0091] In some embodiments, the set of coplanar waveguides consisting of at least one undetermined coplanar waveguide is also referred to as the set of non-transmission line coplanar waveguides. In some embodiments, any one of the M coplanar waveguides included in the chip layout is identified as a transmission line, or is not identified as a transmission line and becomes an undetermined coplanar waveguide.

[0092] In some embodiments, prior to step 320, the method further includes identifying M coplanar waveguides from the chip layout. For details on how the M coplanar waveguides are identified, please refer to the explanation of the following embodiments; further details will not be provided here.

[0093] In some embodiments, prior to step 320, the method further includes identifying transmission lines from among the M coplanar waveguides. For details on how to identify the transmission lines, please refer to the explanation of the following embodiments; further details will not be provided here.

[0094] In some embodiments, a coplanar waveguide in this application is considered to be a coplanar waveguide constituting a device. When coplanar waveguides on the same line constitute two devices, they are considered to be two coplanar waveguides, and so on.

[0095] Step 330: Based on at least one undetermined coplanar waveguide that matches the i-th transmission line among the N transmission lines, determine the resonant cavity that matches the i-th transmission line, where i is a positive integer less than or equal to N.

[0096] In some embodiments, step 330 is performed for each of the N transmission lines. After traversing the N transmission lines, a resonant cavity is obtained that matches at least one of the N transmission lines.

[0097] In some embodiments, after determining the resonant cavity that matches the i-th transmission line, the resonant cavity that matches the i-th transmission line is determined again from the coplanar waveguide that matches the (i+1)-th transmission line among the N transmission lines, based on at least one undetermined coplanar waveguide.

[0098] Step 335: The i-th transmission line and a resonant cavity matched with the i-th transmission line are identified as a coupling pair.

[0099] In some embodiments, the same resonant cavity can be matched with multiple transmission lines simultaneously, and the same transmission line can be matched with multiple resonant cavities simultaneously. This application does not limit the number of resonant cavities matched to each transmission line, nor does it limit the number of transmission lines matched to each resonant cavity.

[0100] For example, such as Figure 7 As shown, transmission line 710 is a device constructed from coplanar waveguides, and resonant cavities 720, 730, and 740 are each constructed from different coplanar waveguides. In some embodiments, the resonant cavities matched with transmission line 710 include resonant cavity 720, resonant cavity 730, and resonant cavity 740. Exemplarily, each of the devices in transmission line 710, resonant cavity 720, resonant cavity 730, and resonant cavity 740 corresponds to a different coplanar waveguide.

[0101] In other embodiments, the same transmission line can be matched with multiple resonant cavities simultaneously, but the same resonant cavity can only be matched with one transmission line.

[0102] In some embodiments, a device formed by a coplanar waveguide that matches the i-th transmission line among N transmission lines is determined as a resonant cavity that matches the i-th transmission line, where i is a positive integer less than or equal to N.

[0103] In some embodiments, when the device formed by the coplanar waveguide that matches the i-th transmission line among the N transmission lines is a resonant cavity in at least one undetermined coplanar waveguide, the resonant cavity formed by that coplanar waveguide is determined as the resonant cavity that matches the i-th transmission line, where i is a positive integer less than or equal to N.

[0104] In some embodiments, for the j-th coplanar waveguide among at least one undetermined coplanar waveguide, if the j-th coplanar waveguide contains a first segment, the distance between the first segment and the i-th transmission line is less than or equal to a first preset threshold, and the device formed by the j-th coplanar waveguide is a resonant cavity, the resonant cavity formed by the j-th coplanar waveguide is determined as a resonant cavity matched with the i-th transmission line, where j is a positive integer. In some embodiments, the first segment is a coplanar waveguide that is a straight line segment parallel to the i-th transmission line.

[0105] For example, such as Figure 8 As shown, Figure 8 Sub-figure b shows a partial schematic diagram of a coupled transmission line and a resonant cavity. Further, for Figure 8 After rotating and enlarging a portion 800° of the coupling part in subgraph b, we obtain the following: Figure 8 A schematic diagram of subgraph a. The following is in conjunction with... Figure 8 Subgraph a explains the above steps.

[0106] For example, transmission line 810 ( Figure 8 Sub-figure a only shows a portion of the transmission line and is not actually limited to the coplanar waveguide shown in sub-figure a), resonant cavity 820 ( Figure 8 Sub-figure a only shows a portion of the resonant cavity and is not actually limited to the portion of the coplanar waveguide shown in sub-figure a).

[0107] For example, if the coplanar waveguide where the resonant cavity 820 is located is the j-th coplanar waveguide, and there is a first line segment in the j-th coplanar waveguide, the distance between the first line segment and the i-th transmission line is less than or equal to a first set threshold, and the device formed by the j-th coplanar waveguide is a resonant cavity, then the resonant cavity 820 formed by the j-th coplanar waveguide is determined as a resonant cavity that matches the i-th transmission line (such as transmission line 810), where j is a positive integer.

[0108] In some embodiments, such as Figure 8 As shown in sub-figure a, the first line segment 830 is parallel to the transmission line 810. Exemplarily, the first line segment 830 is a coplanar waveguide that is a straight line segment parallel to the transmission line 810.

[0109] In some embodiments, for the j-th coplanar waveguide in at least one undetermined coplanar waveguide, three conditions must be met to obtain a resonant cavity matched with the i-th transmission line. The first condition is that the j-th coplanar waveguide contains a first segment (a straight segment of the coplanar waveguide parallel to the transmission line). The second condition is that the distance between the first segment and the i-th transmission line is less than or equal to a first predetermined threshold. The third condition is that the device formed by the j-th coplanar waveguide is a resonant cavity. Only after meeting these three conditions can the resonant cavity formed by the j-th coplanar waveguide be determined as a resonant cavity matched with the i-th transmission line.

[0110] In some embodiments, such as Figure 13 As shown, the method for determining the coupling pair includes at least one of the following steps 1311 to 1313.

[0111] First, obtain transmission line a from the set of transmission lines A, which is the i-th transmission line mentioned above. Then, obtain non-transmission line coplanar waveguide b from the set of non-transmission line coplanar waveguides B, which is the j-th coplanar waveguide among the at least one undetermined coplanar waveguide mentioned above.

[0112] Step 1311, determine whether part a is parallel to part b?

[0113] For example, when part of a is parallel to part of b, that is, there is a first segment in the j-th coplanar waveguide.

[0114] For example, if part a is parallel to part b, then step 1312 is executed. Otherwise, the next non-transmission line coplanar waveguide is obtained from the set B of non-transmission line coplanar waveguides.

[0115] Step 1312, determine if the distance between parallel parts is less than the coupling threshold?

[0116] For example, the distance between the parallel portions is less than the coupling threshold, that is, the first line segment is greater than or equal to the first set threshold.

[0117] For example, if the distance between the parallel portions is less than the coupling threshold, then step 1313 is executed; otherwise, the next non-transmission line coplanar waveguide is obtained from the set B of non-transmission line coplanar waveguides.

[0118] In step 1313, b is a resonant cavity, and (a, b) form a pair of coupling pairs.

[0119] For example, when the device formed by the non-transmission line coplanar waveguide b is a resonant cavity, (a, b) constitute a pair of coupling pairs or a single coupling pair.

[0120] In this embodiment, three conditions are used to screen for resonant cavities on the chip layout that match the transmission lines, ensuring the accuracy of the identified coupling pairs. This also improves the efficiency of coupling pair identification and avoids errors in coupling pair extraction.

[0121] In some embodiments, if the device formed by the j-th coplanar waveguide is a resonant cavity, then the distance between the first line segment and the i-th transmission line is also considered to be the distance between the resonant cavity and the i-th transmission line. In some embodiments, the first set threshold is also considered to be the set coupling distance threshold mentioned above.

[0122] In some embodiments, the coplanar waveguide device in the chip layout includes a central conductor and conductor planes located on both sides of the central conductor. The coplanar waveguide includes a first slot line and a second slot line. The first slot line is a groove between the central conductor and one side of the conductor plane, and the second slot line is a groove between the central conductor and the other side of the conductor plane. In some embodiments, the first slot line and the second slot line constituting the same coplanar waveguide are parallel to each other. Exemplarily, any coplanar waveguide has a first slot line and a second slot line.

[0123] In some embodiments, the distance between the first line segment and the i-th transmission line is any one of the following: the distance between the first slot line of the first line segment and the second slot line of the i-th transmission line; the distance between the second slot line of the first line segment and the first slot line of the i-th transmission line; the distance between the first slot line of the first line segment and the first slot line of the i-th transmission line; the distance between the second slot line of the first line segment and the second slot line of the i-th transmission line; the distance between the center conductor of the first line segment and the center conductor of the i-th transmission line.

[0124] For example, such as Figure 8 As shown in sub-figure a, the first line segment 830 includes a first slot line 831 and a second slot line 832. The transmission line 810 includes a first slot line 811 and a second slot line 812.

[0125] For example, the distance between the first line segment 830 and the transmission line 810 is the distance between the first groove line 831 of the first line segment and the second groove line 812 of the transmission line.

[0126] For example, the distance between the first line segment 830 and the transmission line 810 is the distance between the second slot line 832 of the first line segment and the first slot line 811 of the transmission line.

[0127] For example, the distance between the first line segment 830 and the transmission line 810 is the distance between the first groove line 831 of the first line segment and the first groove line 811 of the transmission line.

[0128] For example, the distance between the first line segment 830 and the transmission line 810 is the distance between the second groove line 832 of the first line segment and the second groove line 812 of the transmission line.

[0129] For example, the distance between the first segment 830 and the transmission line 810 is the distance between the center conductor of the first segment (the conductor between the first slot line 831 and the second slot line 832 of the first segment) and the center conductor of the transmission line (the conductor between the first slot line 811 and the second slot line 812 of the transmission line).

[0130] The technical solution provided in this application offers multiple methods for determining whether a set coupling distance threshold (i.e., the first set threshold) is met. Regarding the distance between the first line segment and the transmission line, considering the presence of a first slot line and a second slot line in the coplanar waveguide, and that the first and second slot lines form a central conductor, there are multiple ways to calculate the distance between the first line segment and the transmission line. This reflects the flexibility and diversity of distance determination, which is beneficial for improving the efficiency of determining the coupling pair.

[0131] In some embodiments, if the j-th coplanar waveguide bends at least twice within the length of a second set threshold, the device formed by the j-th coplanar waveguide is a resonant cavity.

[0132] For example, such as Figure 7 As shown, the coplanar waveguides containing resonant cavities 720, 730, and 740 each bend at least twice within the length of the second set threshold.

[0133] For example, when the j-th coplanar waveguide has at least two bends within a length of a second preset threshold, and the directions of any two adjacent bends are opposite, the device formed by the j-th coplanar waveguide is a resonant cavity. In some embodiments, the second preset threshold is a predetermined value. When the j-th coplanar waveguide has at least two bends within a length of the second preset threshold, and the directions of any two adjacent bends are opposite, the j-th coplanar waveguide is a special shape formed by multiple bends within a small range, and the device formed by the j-th coplanar waveguide is a resonant cavity. For example, the second preset threshold is determined by the developer based on the length of the coplanar waveguide that has two bends in a conventional resonant cavity.

[0134] The technical solution provided in this application improves the extraction efficiency of coupling pairs and further ensures the parameter extraction efficiency by setting the identification conditions of the resonant cavity.

[0135] Step 340: Extract the geometric parameters of the coupling pair from the chip layout. The geometric parameters refer to the design dimensions and positional relationships of the transmission lines and resonant cavities in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

[0136] In some embodiments, such as Figure 11 As shown, the chip layout processing method provided in this application embodiment includes at least one of the following steps (steps 341 to 344).

[0137] Step 341, Identify the transmission line.

[0138] For example, the input layout to be processed, i.e., the chip layout to be processed, is obtained. Transmission lines are identified from the layout to be processed.

[0139] Step 342: Identify the resonant cavity.

[0140] Step 343: Detect the transmission line and resonant cavity, and match them as a coupling pair.

[0141] Step 344: Fine-tune the exploration parameters.

[0142] The exploration parameters here refer to the parameters used to probe the rectangle when extracting geometric parameters. By fine-tuning the exploration parameters, the geometric parameters are automatically extracted. Finally, the required geometric parameters are output.

[0143] This application provides a method for determining a resonant cavity matched with a transmission line. First, it determines whether a first segment exists in the coplanar waveguide to be determined and whether the distance between the first segment and the transmission line is less than a threshold (i.e., matching first to determine if the coupling condition is met). Further, if the device formed by the coplanar waveguide to be determined is a resonant cavity (further identification to determine if it constitutes a resonant cavity), then the resonant cavity formed by the coplanar waveguide to be determined is taken as the resonant cavity matched with the transmission line. By using a matching-then-identification method, resonant cavity identification can be performed only on coplanar waveguides matched with the transmission line, reducing the number of identification steps and thus improving the efficiency of determining the coupling pair.

[0144] Below, in conjunction with Figure 4 The second method for determining the matching resonant cavity is introduced.

[0145] Please refer to Figure 4 This illustrates a flowchart of a chip layout processing method according to another embodiment of this application. This method can be executed by the aforementioned computer device. Figure 4 As shown, the method may include at least one of the following steps 410 to 440.

[0146] Step 410: Identify N transmission lines in the chip layout, where N is a positive integer.

[0147] Specifically, for how to identify transmission lines, please refer to the following: Figure 5 The corresponding implementation examples will not be described in detail here.

[0148] Step 420: Based on N transmission lines, determine at least one undetermined coplanar waveguide from the M coplanar waveguides included in the chip layout. The undetermined coplanar waveguide refers to a coplanar waveguide that has not been identified as a transmission line, and M is a positive integer.

[0149] In some embodiments, transmission lines and resonant cavities are determined based on coplanar waveguides in the chip layout. Exemplarily, after identifying the coplanar waveguides (i.e., M coplanar waveguides) on the chip layout, N transmission lines are identified from the M coplanar waveguides. After identifying the N transmission lines, Q resonant cavities are identified from the remaining coplanar waveguides (i.e., at least one undetermined coplanar waveguide). The N transmission lines and Q resonant cavities are then paired to obtain multiple matched coupling pairs. For specific matching methods, please refer to the explanation of the embodiments below.

[0150] Step 430: Based on at least one coplanar waveguide that satisfies the second condition, determine Q resonant cavities. The second condition is related to the shape of the coplanar waveguide, and Q is a positive integer.

[0151] In some embodiments, the second condition is a condition for identifying the resonant cavity. Exemplarily, as shown in the above embodiments, the second condition is that at least two bends occur within a length of a second predetermined threshold. Exemplarily, the second condition is that at least two bends occur within a length of a second predetermined threshold, and the directions of any two adjacent bends are opposite.

[0152] In some embodiments, if the j-th coplanar waveguide in at least one undetermined coplanar waveguide experiences at least two bends within a length of a second predetermined threshold, the device formed by the j-th coplanar waveguide is defined as a resonant cavity. For example, as... Figure 8 As shown, there are three bends in the coplanar waveguide where the resonant cavity is located: one bend 850, another bend 851, yet another bend 852, and yet another bend 853.

[0153] In some embodiments, if the j-th coplanar waveguide experiences at least two bends within a second predetermined threshold length, and the directions of any two adjacent bends are opposite, the device formed by the j-th coplanar waveguide is defined as a resonant cavity. For example, as... Figure 8 As shown, a bend 850 and another bend 851 of the coplanar waveguide containing the resonant cavity are two adjacent bends, with opposite directions. Another bend 851 and yet another bend 852 of the coplanar waveguide containing the resonant cavity are two adjacent bends, with opposite directions. Yet another bend 852 and yet another bend 853 of the coplanar waveguide containing the resonant cavity are two adjacent bends, with opposite directions. Conversely, when a coplanar waveguide has at least two bends within a second predetermined threshold length, and any two adjacent bends are in opposite directions, the device formed by that coplanar waveguide is defined as a resonant cavity.

[0154] The technical solution provided in this application embodiment reflects the characteristics of the resonant cavity by setting conditions such as at least two bends within the length of a second set threshold and opposite directions of any two adjacent bends (i.e., the second condition). It is a special shape composed of multiple bends and meanders within a small range.

[0155] Step 440: From the Q resonant cavities, determine the resonant cavity that matches the i-th transmission line among the N transmission lines, where i is a positive integer less than or equal to N.

[0156] In some embodiments, for each transmission line, each of the Q resonant cavities is traversed to obtain a resonant cavity that is matched to at least one of the N transmission lines respectively.

[0157] In the embodiments of this application, "matching" can also be considered as "coupling," used to indicate the relationship between two devices that can form a coupling pair. For example, when a transmission line and a resonant cavity can form a coupling pair, the transmission line and the resonant cavity are matched (or coupled) to each other; the resonant cavity is a resonant cavity matched (or coupled) to the transmission line, and the transmission line is a transmission line matched (or coupled) to the resonant cavity.

[0158] Step 445: The i-th transmission line and a resonant cavity matched with the i-th transmission line are identified as a coupling pair.

[0159] In some embodiments, for the i-th transmission line among N transmission lines and the k-th resonant cavity among Q resonant cavities, if there is a second line segment in the coplanar waveguide constituting the k-th resonant cavity and the distance between the second line segment and the i-th transmission line is less than or equal to a first preset threshold, the k-th resonant cavity is determined to be a resonant cavity matched with the i-th transmission line, where i is a positive integer less than or equal to N and k is a positive integer.

[0160] In some embodiments, the second line segment here is equivalent to the first line segment mentioned in the above embodiments. Technical details not mentioned in this embodiment will not be elaborated further with reference to the explanations in the above embodiments.

[0161] In some embodiments, the distance between the second line segment and the i-th transmission line is any one of the following: the distance between the first slot line of the second line segment and the second slot line of the i-th transmission line; the distance between the second slot line of the second line segment and the first slot line of the i-th transmission line; the distance between the first slot line of the second line segment and the first slot line of the i-th transmission line; the distance between the second slot line of the second line segment and the second slot line of the i-th transmission line; the distance between the center conductor of the second line segment (the conductor between the first slot line and the second slot line of the second line segment) and the center conductor of the i-th transmission line (the conductor between the first slot line and the second slot line of the i-th transmission line).

[0162] In some embodiments, the second line segment is a coplanar waveguide that is a straight line segment parallel to the i-th transmission line.

[0163] In this embodiment, the resonant cavities on the chip layout are selected using a second condition, ensuring the accuracy of the determined resonant cavities. Furthermore, the resonant cavities matched with the transmission line are determined using two conditions (the existence of a second line segment and the distance between the second line segment and the transmission line being less than or equal to a second set threshold), which also improves the efficiency of coupler pair determination and avoids errors in coupler pair extraction.

[0164] Step 450: Extract the geometric parameters of the coupling pair from the chip layout. The geometric parameters refer to the design dimensions and positional relationships of the transmission lines and resonant cavities in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

[0165] This application provides another method for determining resonant cavities matched with transmission lines. First, resonant cavities are identified from the undetermined coplanar waveguides (identification first, to determine if a resonant cavity is formed). Then, resonant cavities matched with the transmission line are determined from these resonant cavities (matching second, to determine if coupling conditions are met). By identifying first and then matching, all resonant cavities on the chip layout can be identified, and resonant cavities matched with the transmission line can be further determined from all resonant cavities. This method avoids omissions of coupling pairs to a certain extent, ensuring that all coupling pairs on the chip layout can be extracted, thus improving the comprehensiveness and accuracy of coupling pair determination.

[0166] Below, in conjunction with Figure 5 This section introduces methods for identifying transmission lines and automatically extracting geometric parameters.

[0167] Please refer to Figure 5 This illustrates a flowchart of a chip layout processing method according to another embodiment of this application. This method can be executed by the aforementioned computer device. Figure 5 As shown, the method may include at least one of the following steps 510 to 540.

[0168] Step 510: Identify M coplanar waveguide lines in the chip layout, where M is a positive integer.

[0169] Considering the characteristics of coplanar waveguides, i.e., the coplanar waveguide device in the chip layout includes a central conductor and conductor planes located on both sides of the central conductor, the coplanar waveguide in the chip layout includes a first slot line and a second slot line. The first slot line is a groove between the central conductor and one side conductor plane, and the second slot line is a groove between the central conductor and the other side conductor plane. The first and second slot lines constituting the same coplanar waveguide are parallel to each other. Therefore, after reading the chip layout design file, the wiring information on the chip layout is obtained. Based on the signal line position information indicated by the wiring information on the chip layout, the signal lines on the chip layout are obtained. Furthermore, lines with two parallel slot lines are considered as coplanar waveguides.

[0170] In some embodiments, after obtaining all signal lines on the chip layout, when the signal lines form a polygon, the polygon is considered to correspond to a device on the chip layout. For example, all polygons composed of signal lines on the chip layout are read to obtain the devices included on the chip layout. For example, if the signal lines constituting the device are coplanar waveguides, the device is retained, and the coplanar waveguide constituting the device is used as one of the coplanar waveguides in step 510 above.

[0171] Step 520: Among the M coplanar waveguides, the coplanar waveguide that satisfies the first condition is determined as a transmission line. The first condition is related to the length of the coplanar waveguide.

[0172] In some embodiments, the transmission line is considered to be a signal line used for transmitting signals. Exemplarily, the transmission line is generally quite long. Therefore, the length of the coplanar waveguide is used as a filtering criterion to identify the transmission line.

[0173] In some embodiments, for the p-th coplanar waveguide among M coplanar waveguides, if the length of the p-th coplanar waveguide is greater than or equal to a third preset threshold, the p-th coplanar waveguide is determined as a transmission line, where p is a positive integer less than or equal to M.

[0174] In some embodiments, the p-th coplanar waveguide can be a single straight line segment or a coplanar waveguide composed of multiple straight line segments. When the p-th coplanar waveguide is composed of multiple straight line segments, adjacent straight line segments may not lie on the same straight line.

[0175] In some embodiments, for the p-th coplanar waveguide among M coplanar waveguides, if there is a coplanar waveguide with a straight line segment greater than or equal to a third set threshold, the p-th coplanar waveguide is considered to be a transmission line.

[0176] In some embodiments, the third set threshold is a preset value. For example, the third set threshold is 2000 micrometers, or 5000 micrometers. The third set threshold is determined by the developers based on the length of a typical transmission line.

[0177] In some embodiments, the first set threshold is also a preset value. For example, the first set threshold ranges from 3 to 5 micrometers, such as 4 or 5 micrometers. The first set threshold is determined by the developers based on the conventional distance between the coupled resonant cavity and the transmission line.

[0178] For example, the third set threshold is greater than the first set threshold.

[0179] For example, such as Figure 12 As shown, the transmission line is identified through at least one of steps 1211 to 1213.

[0180] Step 1211: Extract the polygons from the layout.

[0181] For example, an input layout to be processed is obtained. Polygons are extracted from this layout. For example, different polygons constitute different devices.

[0182] Step 1212: Determine if the polygon is a coplanar waveguide.

[0183] For example, if it is determined that the signal lines constituting the polygon are coplanar waveguides, then step 1213 is executed. If it is determined that the signal lines constituting the polygon are not coplanar waveguides, then the device is considered a non-desired device.

[0184] Step 1213: Determine whether the coplanar waveguide contains a straight segment portion larger than a set threshold.

[0185] For example, if it is determined that the coplanar waveguide contains a straight line segment greater than a set threshold, that is, when there is a coplanar waveguide segment with a straight line segment greater than or equal to a third set threshold, then the coplanar waveguide is considered to be a transmission line to be matched.

[0186] For example, if it is determined that the coplanar waveguide does not contain a straight segment portion greater than a set threshold, then the device formed by the coplanar waveguide is considered not a transmission line, and the coplanar waveguide is considered to be a coplanar waveguide to be matched, that is, a coplanar waveguide to be determined.

[0187] Step 530: Based on the N transmission lines, identify the coupling pairs from the chip layout. Each coupling pair includes one of the N transmission lines and a resonant cavity that is coupled to the transmission line.

[0188] Step 540: Extract the geometric parameters of the coupling pair from the chip layout. The geometric parameters refer to the design dimensions and positional relationships of the transmission lines and resonant cavities in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

[0189] The technical solution provided in this application first identifies transmission lines from the chip layout, and then determines the resonant cavity that matches the transmission lines. Considering that the identification of transmission lines is relatively simple, identifying the transmission lines first and then the resonant cavity can reduce the difficulty of extracting the coupling pairs to a certain extent.

[0190] In addition, by setting the identification conditions for transmission lines, the correct identification of transmission lines on the chip layout can be ensured, thereby improving the extraction efficiency of coupling pairs and further ensuring the parameter extraction efficiency.

[0191] In some embodiments, step 540 includes at least one of steps 541 to 542 (not shown in the figures).

[0192] In some embodiments, the geometric parameters of the coupling pair include at least one of the following: the width of the center conductor of the transmission line in the coupling pair, the width of the center conductor of the resonant cavity in the coupling pair, the distance between the transmission line and the resonant cavity in the coupling pair, the width of the slot line of the transmission line in the coupling pair, and the width of the slot line of the resonant cavity in the coupling pair.

[0193] For example, the width of the center conductor of the transmission line in the coupling pair refers to the distance between the first slot line and the second slot line of the transmission line. Figure 9 As shown, the width 920 of the center conductor of the transmission line in the coupling pair is the distance between the first slot line 911 and the second slot line 912 of the transmission line.

[0194] For example, the width of the center conductor of the resonant cavity in the coupling pair refers to the distance between the first slot line and the second slot line of the resonant cavity. Figure 9 As shown, the width 960 of the center conductor of the resonant cavity in the coupling pair is the distance between the first slot line 913 and the second slot line 914 of the resonant cavity.

[0195] For example, the distance between the transmission line in the coupling pair and the resonant cavity in the coupling pair includes the distance between the first slot line 911 of the transmission line and the first slot line 913 of the resonant cavity, or the distance between the first slot line 911 of the transmission line and the second slot line 914 of the resonant cavity, or the distance 940 between the second slot line 912 of the transmission line and the first slot line 913 of the resonant cavity, or the distance between the second slot line 912 of the transmission line and the second slot line 914 of the resonant cavity.

[0196] For example, the width of the slot line in the coupling pair includes the width 910 of the first slot line 911 of the transmission line, or the width 930 of the second slot line 912 of the transmission line. In some embodiments, the width 910 of the first slot line 911 of the transmission line and the width 930 of the second slot line 912 of the transmission line are the same.

[0197] For example, the width of the slot line in the resonant cavity of the coupling pair includes the width 950 of the first slot line 913 of the resonant cavity, or the width 970 of the second slot line 914 of the resonant cavity. In some embodiments, the width 950 of the first slot line 913 of the resonant cavity and the width 970 of the second slot line 914 of the resonant cavity are the same.

[0198] In some embodiments, the width of the center conductor of the transmission line in the coupling pair is W1, the width of the center conductor of the resonant cavity in the coupling pair is W2, the distance between the transmission line and the resonant cavity in the coupling pair is W3, the width of the slot line of the transmission line in the coupling pair is S1, and the width of the slot line of the resonant cavity in the coupling pair is S2.

[0199] The technical solutions provided in this application have a variety of geometric parameters related to the geometric position of the coupling center resonant cavity and the transmission line, reflecting the diversity and comprehensiveness of the extracted geometric parameters.

[0200] Step 541: Set a probe rectangle on the coupling pair, and the probe rectangle intersects with the coupling pair to obtain a first rectangle, a second rectangle, a third rectangle and a fourth rectangle.

[0201] In some embodiments, the probe rectangle and the coupling portion of the coupling pair are perpendicular to each other. In some embodiments, the probe rectangle and the coupling pair are ANDed to obtain four rectangles.

[0202] In some embodiments, such as Figure 10 As shown, in the coupling pair ( Figure 10 A probe rectangle 1001 is provided on the coupling pair (only a portion of the coupling pair is shown in the image). Exemplarily, the probe rectangle 1001 intersects with the coupling pair to form a first rectangle 1006, a second rectangle 1007, a third rectangle 1008, and a fourth rectangle 1009.

[0203] In some embodiments, the coplanar waveguide in the chip layout includes a first slot line and a second slot line. The first slot line is a groove between the center conductor of the coplanar waveguide and the plane of one side conductor, and the second slot line is a groove between the center conductor of the coplanar waveguide and the plane of the other side conductor. The first slot line and the second slot line constituting the same coplanar waveguide are parallel to each other.

[0204] In some embodiments, the first rectangle 1006 is obtained by probing the intersection of rectangle 1001 with the first slot line 1002 of the transmission line in the coupling pair; the second rectangle is obtained by probing the intersection of rectangle 1001 with the second slot line 1003 of the transmission line in the coupling pair; the third rectangle is obtained by probing the intersection of rectangle 1001 with the first slot line 1004 of the resonant cavity in the coupling pair; and the fourth rectangle is obtained by probing the intersection of rectangle 1001 with the second slot line 1005 of the resonant cavity in the coupling pair.

[0205] Step 542: Extract the geometric parameters of the coupling pair based on the first rectangle, the second rectangle, the third rectangle, and the fourth rectangle.

[0206] In some embodiments, after obtaining the first rectangle, the second rectangle, the third rectangle, and the fourth rectangle, the geometric parameters of the coupling pair can be determined. Exemplarily, after obtaining the first rectangle, the second rectangle, the third rectangle, and the fourth rectangle, at least one of the following can be determined: the width of the center conductor of the transmission line in the coupling pair, the width of the center conductor of the resonant cavity in the coupling pair, the distance between the transmission line and the resonant cavity in the coupling pair, the width of the slot line of the transmission line in the coupling pair, and the width of the slot line of the resonant cavity in the coupling pair.

[0207] In some embodiments, step 542 includes at least one of the following steps S1 to S5 (not shown in the figure).

[0208] Step S1: The distance between the first rectangle and the second rectangle is determined as the width of the center conductor of the transmission line in the coupling pair.

[0209] For example, such as Figure 10 As shown, the distance between the first rectangle 1006 and the second rectangle 1007 is determined as the width of the center conductor of the transmission line in the coupling pair.

[0210] Step S2: The distance between the third rectangle and the fourth rectangle is determined as the width of the center conductor of the resonant cavity in the coupling pair.

[0211] For example, such as Figure 10 As shown, the distance between the third rectangle 1008 and the fourth rectangle 1009 is determined as the width of the center conductor of the resonant cavity in the coupling pair.

[0212] Step S3: The distance between the second rectangle and the third rectangle is determined as the distance between the transmission line and the resonant cavity in the coupling pair.

[0213] For example, such as Figure 10 As shown, the distance between the second rectangle 1007 and the third rectangle 1008 is determined as the distance between the transmission line and the resonant cavity in the coupling pair.

[0214] Step S4: The width of the first rectangle or the second rectangle is determined as the width of the slot line of the transmission line in the coupling pair, and the wide side of the first rectangle or the second rectangle is perpendicular to the slot line of the transmission line in the coupling pair.

[0215] For example, such as Figure 10 As shown, the width of the first rectangle 1006 or the second rectangle 1007 is determined as the width of the slot line of the transmission line in the coupling pair.

[0216] For example, the width of the first rectangle 1006 refers to the length of the vertical wide side of the first rectangle 1006. For example, the vertical wide side of the first rectangle 1006 is perpendicular to the first slot line 1002 of the transmission line in the coupling pair or to the second slot line 1003 of the transmission line in the coupling pair.

[0217] For example, the width of the second rectangle 1007 refers to the length of its vertical wide side. For example, the vertical wide side of the second rectangle 1007 is perpendicular to either the first slot line 1002 of the transmission line in the coupling pair or the second slot line 1003 of the transmission line in the coupling pair.

[0218] Step S5: Determine the width of the third or fourth rectangle as the width of the slot line of the resonant cavity in the coupling pair, with the wide side of the third or fourth rectangle perpendicular to the slot line of the resonant cavity in the coupling pair.

[0219] For example, such as Figure 10 As shown, the width of the third rectangle 1008 or the fourth rectangle 1009 is determined as the width of the slot line of the resonant cavity in the coupling pair.

[0220] For example, the width of the third rectangle 1008 refers to the length of the vertical wide side of the third rectangle 1008. For example, the vertical wide side of the third rectangle 1008 is perpendicular to the first slot line 1004 of the resonant cavity in the coupling pair or to the second slot line 1005 of the resonant cavity in the coupling pair.

[0221] For example, the width of the fourth rectangle 1009 refers to the length of its vertical wide side. For example, the vertical wide side of the fourth rectangle 1009 is perpendicular to the first slot line 1004 of the resonant cavity in the coupling pair or to the second slot line 1005 of the resonant cavity in the coupling pair.

[0222] The technical solution provided in this application improves the accuracy and efficiency of determining geometric parameters by detecting the four rectangles obtained by the intersection of the rectangle and the groove line.

[0223] In some embodiments, the geometric parameters of the coupling pair further include at least one of the following: the number of resonant cavities matched with the transmission lines in the coupling pair, and the length of a third segment present in the coplanar waveguide constituting the resonant cavities in the coupling pair, wherein the third segment is a coplanar waveguide that is a straight line segment parallel to the transmission lines in the coupling pair.

[0224] For example, such as Figure 7 As shown, the number of resonant cavities matched with transmission line 710 is 3. Exemplarily, the third segment here is equivalent to the first and second segments mentioned in the above embodiments, and will not be described again here.

[0225] In some embodiments, this application allows users to adjust deployment parameters through a protobuf configuration file, where proto is defined as follows:

[0226] message SCmappingConfig{

[0227] double transmission_line_min_length=1;

[0228] double sc_pair_match_distance_threshold=2;

[0229] double matched sc_pair_detect_rectangle_length=3;

[0230] uint32 sc_print layer = 4;

[0231] }

[0232] Among them, transmission_line_min_length is the parameter for determining the distance threshold of the transmission line (i.e., the third set threshold mentioned above), sc_pair_match_distance_threshold is the parameter for determining the distance threshold of the coupled pair (i.e., the first set threshold mentioned above), matched_sc_pair_detect_rectangle_length is the length parameter of the detection polygon (i.e., the detection rectangle mentioned above) for detecting the geometric parameters of the coupled pair, and sc_print_layer is the number of printing layers of the output information.

[0233] For example, Electronic Design Automation (EDA) tools are used to probe the geometric parameters of coupling pairs on a chip layout. EDA, for instance, is a design approach in the electronics field that uses computer software (computer-aided design software) to automate design work within electronics. This includes processes such as functional design, functional verification, and placement and routing of integrated circuit chips. The software tools used in this category are collectively referred to as EDA tools.

[0234] For example, in an EDA tool, the layout design file of the chip to be processed is first obtained and placed on the first layer. Further, in the EDA tool, a placement tool is used to place a probe rectangle on the second layer (placement here can also be understood as drawing, and the placement tool can be understood as a tool for drawing the probe rectangle). For example, the first layer is the layer below the second layer. For example, when using the placement tool to draw the probe rectangle on the second layer, the size (length and width) of the placed probe rectangle is determined by the protobuf configuration file. For example, the size of the probe rectangle in this configuration file is entered by the user.

[0235] The following section introduces chip fabrication based on geometric parameters.

[0236] In some embodiments, a chip is fabricated based on the geometric parameters in response to the predicted device properties determined by the geometric parameters satisfying predetermined conditions.

[0237] For example, the predetermined condition is a condition preset by chip developers or chip fabrication personnel, etc., for the attribute value of the predicted device attribute. For example, the predetermined condition is that the attribute value of the predicted device attribute is greater than or equal to a fourth preset threshold. For example, the predetermined condition is that the attribute value of the predicted device attribute is less than or equal to a fifth preset threshold. For example, the predetermined condition is that the attribute value of the predicted device attribute is within a first preset range.

[0238] For example, if the predicted device properties meet predetermined conditions, it indicates that the coupling pairs arranged on the chip layout meet the requirements. Therefore, without modifying the positions of each device on the chip layout, the chip can be fabricated directly based on geometric parameters, or directly based on the positions of each device on the chip layout. For example, the chip layout is converted into a real physical chip according to a preset ratio. The chip in this application is a quantum chip, such as a superconducting quantum chip, but it can also be other types of chips, which are not limited in this application. Since the layout design file of the chip layout contains the shape, area, and position information of each hardware unit on the chip, the real chip can be fabricated directly according to the layout design file of the chip layout, and the shape, area, and position information of each hardware unit in the fabricated chip can be completely consistent with those in the chip layout. For example, the device properties of the coupling pairs in the fabricated chip are completely identical to the predicted device properties of the coupling pairs in the chip layout.

[0239] In some embodiments, in response to a predicted device attribute not meeting a predetermined condition, the geometric positions of the transmission lines and resonant cavities in the coupling pair on the chip layout are adjusted to obtain an adjusted coupling pair. For the adjusted coupling pair, the adjusted geometric parameters of the coupling pair are extracted to determine the adjusted predicted device attribute of the coupling pair. In response to a predicted device attribute meeting a predetermined condition, a chip is fabricated based on the adjusted geometric parameters. In response to a predicted device attribute not meeting a predetermined condition, the geometric positions of the transmission lines and resonant cavities in the coupling pair on the chip layout are adjusted again until the predicted device attribute meets the predetermined condition.

[0240] For example, if the predicted device attributes do not meet the predetermined conditions, it means that the coupling pairs laid out on the chip layout do not meet the requirements. Therefore, it is necessary to modify the positions of each device on the chip layout and further adjust the positions to obtain the predicted device attributes or coupling pairs that meet the requirements.

[0241] In this embodiment, the chip is fabricated based on the geometric parameters of the coupling pairs on the chip layout, provided that the predicted device properties meet predetermined conditions. This ensures that the actual device properties of the coupling pairs on the fabricated chip match the predicted device properties, thereby improving the accuracy and efficiency of chip fabrication.

[0242] Furthermore, if the predicted device properties do not meet the predetermined conditions, the geometric positions of the transmission lines and resonant cavities in the coupling pair on the chip layout are adjusted until the predicted device properties meet the predetermined conditions. Considering that the chip layout is a simulation of a real device (or a real chip), the cost of modifying devices on the chip layout, such as readjusting device positions, is relatively low. Compared to directly fabricating a chip and then discovering that the device properties of the coupling pair do not meet the predetermined conditions, resulting in unnecessary fabrication overhead, the chip fabrication method provided in this application embodiment requires lower fabrication costs and has a higher fault tolerance.

[0243] The technical solutions provided in this application, in addition to parameters related to the geometric positions of the transmission lines and resonant cavities in the coupled pair, also include geometric parameters such as the number of resonant cavities matched to the transmission lines in the coupled pair, and the length of the third segment existing in the coplanar waveguides constituting the resonant cavities in the coupled pair. This demonstrates that geometric parameters are not only related to the geometric positions of the transmission lines and resonant cavities in a single coupled pair, but also to the correlation between the coupled pairs, and the length of the coplanar waveguides of the parallel portions of the transmission lines and resonant cavities in the coupled pair. This diversity of geometric parameters is beneficial for further calculation of coupling parameter indices.

[0244] The technical solution provided in this application uses a probing rectangle method to quickly determine geometric parameters. Compared to other shapes, using a probing rectangle perpendicular to the groove line to determine geometric parameters is the fastest. Therefore, it is beneficial to improve the efficiency of determining geometric parameters.

[0245] The following are embodiments of the apparatus described in this application, which can be used to execute the embodiments of the method described in this application. For details not disclosed in the apparatus embodiments of this application, please refer to the embodiments of the method described in this application.

[0246] Please refer to Figure 14 This diagram illustrates a block diagram of a chip layout processing apparatus according to an embodiment of this application. The apparatus has the function of implementing the aforementioned chip layout processing method; this function can be implemented in hardware or by hardware executing corresponding software. The apparatus can be a computer device or can be installed within a computer device. The apparatus 1400 may include: an identification module 1410, a matching module 1420, and an extraction module 1430.

[0247] The identification module 1410 is used to identify N transmission lines in the chip layout, where N is a positive integer.

[0248] Matching module 1420 is used to identify coupling pairs from the chip layout based on the N transmission lines, wherein the coupling pair includes one of the N transmission lines and a resonant cavity coupled to the transmission line.

[0249] Extraction module 1430 is used to extract the geometric parameters of the coupling pair from the chip layout. The geometric parameters refer to the design dimensions and positional relationship of the transmission line and the resonant cavity in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

[0250] In some embodiments, the transmission line and the resonant cavity are determined based on coplanar waveguides in the chip layout. The matching module 1420 is used to determine at least one undetermined coplanar waveguide from M coplanar waveguides included in the chip layout. The undetermined coplanar waveguide refers to a coplanar waveguide that has not been identified as the transmission line, and M is a positive integer.

[0251] The matching module 1420 is used to determine the resonant cavity matched with the i-th transmission line from the at least one undetermined coplanar waveguide that matches the i-th transmission line among the N transmission lines, where i is a positive integer less than or equal to N; and to determine the i-th transmission line and the resonant cavity matched with the i-th transmission line as the coupling pair.

[0252] In some embodiments, the matching module 1420 is configured to, for the j-th coplanar waveguide among the at least one undetermined coplanar waveguide, if the j-th coplanar waveguide contains a first line segment, the distance between the first line segment and the i-th transmission line is less than or equal to a first preset threshold, and the device formed by the j-th coplanar waveguide is a resonant cavity, determine the resonant cavity formed by the j-th coplanar waveguide as a resonant cavity matched with the i-th transmission line, where j is a positive integer; wherein, the first line segment is a coplanar waveguide that is a straight line segment parallel to the i-th transmission line.

[0253] In some embodiments, if the j-th coplanar waveguide bends at least twice within the length of a second predetermined threshold, the device formed by the j-th coplanar waveguide is the resonant cavity.

[0254] In some embodiments, the coplanar waveguide device in the chip layout includes a center conductor and conductor planes located on both sides of the center conductor. The coplanar waveguide includes a first groove and a second groove, wherein the first groove is a groove between the center conductor and one side conductor plane, and the second groove is a groove between the center conductor and the other side conductor plane.

[0255] In some embodiments, the distance between the first line segment and the i-th transmission line is any one of the following: the distance between the first slot line of the first line segment and the second slot line of the i-th transmission line; the distance between the second slot line of the first line segment and the first slot line of the i-th transmission line; the distance between the first slot line of the first line segment and the first slot line of the i-th transmission line; the distance between the second slot line of the first line segment and the second slot line of the i-th transmission line; the distance between the center conductor of the first line segment and the center conductor of the i-th transmission line.

[0256] In some embodiments, the transmission line and the resonant cavity are determined based on coplanar waveguides in the chip layout. The matching module 1420 is used to determine at least one undetermined coplanar waveguide from M coplanar waveguides included in the chip layout. The undetermined coplanar waveguide refers to a coplanar waveguide that has not been identified as the transmission line, and M is a positive integer.

[0257] Matching module 1420 is used to determine Q resonant cavities based on the coplanar waveguides that satisfy a second condition among the at least one undetermined coplanar waveguides, where the second condition is related to the shape of the coplanar waveguides and Q is a positive integer.

[0258] The matching module 1420 is used to determine, from the Q resonant cavities, a resonant cavity that matches the i-th transmission line among the N transmission lines, where i is a positive integer less than or equal to N; and to determine the i-th transmission line and a resonant cavity that matches the i-th transmission line as the coupling pair.

[0259] In some embodiments, the matching module 1420 is configured to determine, for the kth resonant cavity among the Q resonant cavities, that if a second line segment exists in the coplanar waveguide constituting the kth resonant cavity and the distance between the second line segment and the i-th transmission line is less than or equal to a first preset threshold, that the kth resonant cavity is a resonant cavity matched with the i-th transmission line, where k is a positive integer; wherein, the second line segment is a coplanar waveguide that is a straight line segment parallel to the i-th transmission line.

[0260] In some embodiments, the identification module 1410 is used to identify M coplanar waveguides in the chip layout, where M is a positive integer; and to determine the coplanar waveguides that satisfy a first condition among the M coplanar waveguides as the transmission lines, wherein the first condition is related to the length of the coplanar waveguides.

[0261] In some embodiments, the identification module 1410 is used to identify the p-th coplanar waveguide among the M coplanar waveguides as the transmission line if the length of the p-th coplanar waveguide is greater than or equal to a third preset threshold, where p is a positive integer less than or equal to M.

[0262] In some embodiments, the extraction module 1430 is configured to set a probe rectangle on the coupling pair, wherein the probe rectangle intersects with the coupling pair to form a first rectangle, a second rectangle, a third rectangle, and a fourth rectangle, wherein the first rectangle is formed by the probe rectangle intersecting with a first slot line of a transmission line in the coupling pair, the second rectangle is formed by the probe rectangle intersecting with a second slot line of a transmission line in the coupling pair, the third rectangle is formed by the probe rectangle intersecting with a first slot line of a resonant cavity in the coupling pair, and the fourth rectangle is formed by the probe rectangle intersecting with a second slot line of a resonant cavity in the coupling pair.

[0263] Extraction module 1430 is used to extract the geometric parameters of the coupling pair based on the first rectangle, the second rectangle, the third rectangle, and the fourth rectangle; wherein, the coplanar waveguide device in the chip layout includes a central conductor and conductor planes located on both sides of the central conductor, and the coplanar waveguide in the chip layout includes a first slot line and a second slot line, wherein the first slot line is a groove between the central conductor and one side conductor plane, and the second slot line is a groove between the central conductor and the other side conductor plane.

[0264] In some embodiments, the geometric parameters of the coupling pair include at least one of the following: the width of the center conductor of the transmission line in the coupling pair, the width of the center conductor of the resonant cavity in the coupling pair, the distance between the transmission line and the resonant cavity in the coupling pair, the width of the slot line of the transmission line in the coupling pair, and the width of the slot line of the resonant cavity in the coupling pair.

[0265] In some embodiments, the extraction module 1430 is used to determine the distance between the first rectangle and the second rectangle as the width of the center conductor of the transmission line in the coupling pair.

[0266] In some embodiments, the extraction module 1430 is used to determine the distance between the third rectangle and the fourth rectangle as the width of the center conductor of the resonant cavity in the coupling pair.

[0267] In some embodiments, the extraction module 1430 is used to determine the distance between the second rectangle and the third rectangle as the distance between the transmission line in the coupling pair and the resonant cavity in the coupling pair.

[0268] In some embodiments, the extraction module 1430 is used to determine the width of the first rectangle or the second rectangle as the width of the slot line of the transmission line in the coupling pair, wherein the wide side of the first rectangle or the second rectangle is perpendicular to the slot line of the transmission line in the coupling pair.

[0269] In some embodiments, the extraction module 1430 is used to determine the width of the third rectangle or the fourth rectangle as the width of the slot line of the resonant cavity in the coupling pair, wherein the wide side of the third rectangle or the fourth rectangle is perpendicular to the slot line of the resonant cavity in the coupling pair.

[0270] In some embodiments, the geometric parameters of the coupling pair further include at least one of the following: the number of resonant cavities matched with the transmission lines in the coupling pair, and the length of a third segment present in the coplanar waveguide constituting the resonant cavities in the coupling pair, wherein the third segment is a coplanar waveguide that is a straight line segment parallel to the transmission lines in the coupling pair.

[0271] In some embodiments, the extraction module 1430 is further configured to fabricate a chip based on the geometric parameters in response to the predicted device properties determined by the geometric parameters satisfying predetermined conditions.

[0272] It should be noted that the apparatus provided in the above embodiments is only illustrated by the division of the above functional modules when implementing its functions. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the apparatus and method embodiments provided in the above embodiments belong to the same concept, and the specific implementation process can be found in the method embodiments, which will not be repeated here.

[0273] Please refer to Figure 15 The diagram illustrates a structural block diagram of a computer device provided in one embodiment of this application.

[0274] Typically, computer device 1500 includes a processor 1501 and a memory 1502.

[0275] Processor 1501 may include one or more processing cores, such as a quad-core processor, an octa-core processor, etc. Processor 1501 may be implemented using at least one hardware form selected from DSP (Digital Signal Processing), FPGA (Field Programmable Gate Array), and PLA (Programmable Logic Array). Processor 1501 may also include a main processor and a coprocessor. The main processor, also known as a CPU (Central Processing Unit), is used to process data in the wake-up state; the coprocessor is a low-power processor used to process data in the standby state. In some embodiments, processor 1501 may integrate a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content required to be displayed on the screen. In some embodiments, processor 1501 may also include an AI (Artificial Intelligence) processor, which is used to handle computational operations related to machine learning.

[0276] Memory 1502 may include one or more computer-readable storage media, which may be tangible and non-transitory. Memory 1502 may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices or flash memory devices. In some embodiments, the non-transitory computer-readable storage media in memory 1502 stores a computer program that is loaded and executed by processor 1501 to implement the processing method of the chip layout described above.

[0277] Those skilled in the art will understand that Figure 15 The structure shown does not constitute a limitation on the computer device 1500, and may include more or fewer components than shown, or combine certain components, or use different component arrangements.

[0278] In some embodiments, a chip product is also provided, the chip product including programmable logic circuits and / or computer programs, which, when the chip product is run, are used to implement the above-described chip layout processing method.

[0279] In some embodiments, a computer-readable storage medium is also provided, wherein a computer program is stored therein, the computer program being loaded and executed by a processor to implement the above-described chip layout processing method.

[0280] Optionally, the computer-readable storage medium may include: ROM (Read-Only Memory), RAM (Random-Access Memory), SSD (Solid State Drives), or optical disc, etc. The random access memory may include ReRAM (Resistance Random Access Memory) and DRAM (Dynamic Random Access Memory).

[0281] In some embodiments, a computer program product is also provided, the computer program product including a computer program stored in a computer-readable storage medium, and a processor reading from the computer-readable storage medium and executing the computer program to implement the above-described chip layout processing method.

[0282] It should be noted that the data collection and processing in this application should strictly comply with the requirements of relevant national laws and regulations, obtain the informed consent or separate consent of the personal information subject, and carry out subsequent data use and processing within the scope of laws and regulations and the authorization of the personal information subject.

[0283] It should be understood that "multiple" as used herein refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. Furthermore, the step numbers described herein are merely illustrative of one possible execution order. In some other embodiments, the steps may not be executed in numerical order, such as two steps with different numbers being executed simultaneously, or two steps with different numbers being executed in the reverse order of the illustration. This application does not limit this.

[0284] The above are merely exemplary embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application shall be included within the protection scope of this application.

Claims

1. A method for processing chip layout, characterized in that, The method includes: Identify N transmission lines in the chip layout, where N is a positive integer; Based on the N transmission lines, a coupling pair is identified from the chip layout. The coupling pair includes one of the N transmission lines and a resonant cavity that is coupled to the transmission line. The geometric parameters of the coupling pair are extracted from the chip layout. The geometric parameters refer to the design dimensions and positional relationship of the transmission line and the resonant cavity in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

2. The method according to claim 1, characterized in that, The transmission lines and the resonant cavity are determined based on coplanar waveguides in the chip layout. Identifying coupling pairs from the chip layout based on the N transmission lines includes: From the M coplanar waveguides included in the chip layout, at least one undetermined coplanar waveguide is determined. The at least one undetermined coplanar waveguide refers to a coplanar waveguide that has not been identified as the transmission line, where M is a positive integer. Based on the coplanar waveguide that matches the i-th transmission line among the N transmission lines in the at least one undetermined coplanar waveguide, determine the resonant cavity that matches the i-th transmission line, where i is a positive integer less than or equal to N; The i-th transmission line and a resonant cavity matched with the i-th transmission line are defined as the coupling pair.

3. The method according to claim 2, characterized in that, The step of determining the resonant cavity matched with the i-th transmission line based on the coplanar waveguide matched with the i-th transmission line among the N transmission lines from the at least one undetermined coplanar waveguide includes: For the j-th coplanar waveguide in the at least one undetermined coplanar waveguide, if there is a first line segment in the j-th coplanar waveguide, the distance between the first line segment and the i-th transmission line is less than or equal to a first set threshold, and the device formed by the j-th coplanar waveguide is a resonant cavity, the resonant cavity formed by the j-th coplanar waveguide is determined as a resonant cavity that matches the i-th transmission line, where j is a positive integer; The first line segment is a coplanar waveguide that is a straight line segment parallel to the i-th transmission line.

4. The method according to claim 3, characterized in that, If the j-th coplanar waveguide bends at least twice within the length of the second set threshold, the device formed by the j-th coplanar waveguide is the resonant cavity.

5. The method according to claim 3 or 4, characterized in that, The coplanar waveguide device in the chip layout includes a central conductor and conductor planes located on both sides of the central conductor. The coplanar waveguide includes a first groove and a second groove. The first groove is a groove between the central conductor and one side conductor plane, and the second groove is a groove between the central conductor and the other side conductor plane. The distance between the first line segment and the i-th transmission line is any one of the following: The distance between the first slot line of the first line segment and the second slot line of the i-th transmission line; The distance between the second slot line of the first line segment and the first slot line of the i-th transmission line; The distance between the first slot line of the first line segment and the first slot line of the i-th transmission line; The distance between the second slot line of the first line segment and the second slot line of the i-th transmission line; The distance between the center conductor of the first line segment and the center conductor of the i-th transmission line.

6. The method according to any one of claims 1 to 5, characterized in that, The transmission lines and the resonant cavity are determined based on coplanar waveguides in the chip layout. Identifying coupling pairs from the chip layout based on the N transmission lines includes: From the M coplanar waveguides included in the chip layout, at least one undetermined coplanar waveguide is determined. The at least one undetermined coplanar waveguide refers to a coplanar waveguide that has not been identified as the transmission line, where M is a positive integer. Based on the coplanar waveguide that satisfies the second condition among the at least one undetermined coplanar waveguide, Q resonant cavities are determined, where the second condition is related to the shape of the coplanar waveguide and Q is a positive integer. From the Q resonant cavities, determine the resonant cavity that matches the i-th transmission line among the N transmission lines, where i is a positive integer less than or equal to N; The i-th transmission line and a resonant cavity matched with the i-th transmission line are defined as the coupling pair.

7. The method according to claim 6, characterized in that, The step of determining the resonant cavity that matches the i-th transmission line among the N transmission lines from the Q resonant cavities includes: For the kth resonant cavity among the Q resonant cavities, if there is a second line segment in the coplanar waveguide constituting the kth resonant cavity, and the distance between the second line segment and the i-th transmission line is less than or equal to a first set threshold, the kth resonant cavity is determined to be a resonant cavity matched with the i-th transmission line, where k is a positive integer; The second line segment is a coplanar waveguide that is a straight line segment parallel to the i-th transmission line.

8. The method according to any one of claims 1 to 7, characterized in that, The identification of N transmission lines in the chip layout includes: Identify M coplanar waveguide lines in the chip layout, where M is a positive integer; Among the M coplanar waveguides, the coplanar waveguide that satisfies the first condition is determined as the transmission line, where the first condition is related to the length of the coplanar waveguide.

9. The method according to claim 8, characterized in that, The step of determining the coplanar waveguide that satisfies the first condition among the M coplanar waveguides as the transmission line includes: For the p-th coplanar waveguide among the M coplanar waveguides, if the length of the p-th coplanar waveguide is greater than or equal to a third preset threshold, the p-th coplanar waveguide is determined as the transmission line, where p is a positive integer less than or equal to M.

10. The method according to any one of claims 1 to 9, characterized in that, The step of extracting the geometric parameters of the coupling pair from the chip layout includes: A probe rectangle is provided on the coupling pair. The probe rectangle intersects with the coupling pair to form a first rectangle, a second rectangle, a third rectangle, and a fourth rectangle. The first rectangle is formed by the intersection of the probe rectangle with the first slot line of the transmission line in the coupling pair; the second rectangle is formed by the intersection of the probe rectangle with the second slot line of the transmission line in the coupling pair; the third rectangle is formed by the intersection of the probe rectangle with the first slot line of the resonant cavity in the coupling pair; and the fourth rectangle is formed by the intersection of the probe rectangle with the second slot line of the resonant cavity in the coupling pair. Based on the first rectangle, the second rectangle, the third rectangle, and the fourth rectangle, extract the geometric parameters of the coupling pair; The coplanar waveguide device in the chip layout includes a central conductor and conductor planes located on both sides of the central conductor. The coplanar waveguide in the chip layout includes a first groove line and a second groove line. The first groove line is a groove between the central conductor and one side conductor plane, and the second groove line is a groove between the central conductor and the other side conductor plane.

11. The method according to claim 10, characterized in that, The geometric parameters of the coupling pair include at least one of the following: the width of the center conductor of the transmission line in the coupling pair, the width of the center conductor of the resonant cavity in the coupling pair, the distance between the transmission line and the resonant cavity in the coupling pair, the width of the slot line of the transmission line in the coupling pair, and the width of the slot line of the resonant cavity in the coupling pair.

12. The method according to claim 10 or 11, characterized in that, The determination of the geometric parameters of the coupling pair based on the first rectangle, the second rectangle, the third rectangle, and the fourth rectangle includes at least one of the following: The distance between the first rectangle and the second rectangle is determined as the width of the center conductor of the transmission line in the coupling pair; The distance between the third rectangle and the fourth rectangle is determined as the width of the center conductor of the resonant cavity in the coupling pair; The distance between the second rectangle and the third rectangle is determined as the distance between the transmission line in the coupling pair and the resonant cavity in the coupling pair; The width of the first rectangle or the second rectangle is determined as the width of the slot line of the transmission line in the coupling pair, and the wide side of the first rectangle or the second rectangle is perpendicular to the slot line of the transmission line in the coupling pair. The width of the third rectangle or the fourth rectangle is determined as the width of the slot line of the resonant cavity in the coupling pair, and the wide side of the third rectangle or the fourth rectangle is perpendicular to the slot line of the resonant cavity in the coupling pair.

13. The method according to claim 11 or 12, characterized in that, The geometric parameters of the coupling pair also include at least one of the following: The number of resonant cavities matched with the transmission lines in the coupling pair, and the length of the third segment present in the coplanar waveguide constituting the resonant cavities in the coupling pair, wherein the third segment is a straight segment of the coplanar waveguide parallel to the transmission lines in the coupling pair.

14. The method according to any one of claims 1 to 13, characterized in that, The method further includes: In response to the predicted device properties determined by the geometric parameters satisfying predetermined conditions, a chip is fabricated based on the geometric parameters.

15. A chip layout processing apparatus, characterized in that, The device includes: The identification module is used to identify N transmission lines in the chip layout, where N is a positive integer; A matching module is used to identify coupling pairs from the chip layout based on the N transmission lines. The coupling pair includes one of the N transmission lines and a resonant cavity coupled to the transmission line. An extraction module is used to extract the geometric parameters of the coupling pair from the chip layout. The geometric parameters refer to the design dimensions and positional relationship of the transmission line and the resonant cavity in the coupling pair in the chip layout, and the geometric parameters are used to perform chip fabrication.

16. A computer device, characterized in that, The computer device includes a processor and a memory, the memory storing a computer program that is loaded and executed by the processor to implement the chip layout processing method as described in any one of claims 1 to 14.

17. A chip product, characterized in that, The chip product includes programmable logic circuits and / or computer programs, which, when the chip product is running, are used to implement the chip layout processing method as described in any one of claims 1 to 14.

18. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, which is loaded and executed by a processor to implement the chip layout processing method as described in any one of claims 1 to 14.

19. A computer program product, characterized in that, The computer program product includes a computer program stored in a computer-readable storage medium, and a processor reads from and executes the computer program to implement the chip layout processing method as described in any one of claims 1 to 14.

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