A high-power microwave source cone ceramic vacuum packaging structure

By designing a rotationally symmetrical high-power microwave source conical ceramic vacuum packaging structure, the problems of multiple components, complex connections, and uneven electric field in the existing technology are solved, achieving electric field homogenization and improved vacuum sealing performance, thereby enhancing the reliability and stability of the device.

CN122117722APending Publication Date: 2026-05-29UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
UNIV OF ELECTRONICS SCI & TECH OF CHINA
Filing Date
2026-01-23
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing conical ceramic vacuum packaging structures have problems such as numerous components, complex connections, high assembly difficulty, diverse welding methods, unreasonable electric field distribution, and poor vacuum sealing performance in high-power microwave sources. In particular, micro-leakage and weld cracking are prone to occur during high-temperature vacuum baking, affecting long-term vacuum maintenance capability and operational reliability.

Method used

The high-power microwave source adopts a rotationally symmetrical conical ceramic vacuum packaging structure, which includes a metal packaging shell, a central conductor, a conical ceramic cover, and a pressure equalization cover. Through threaded connection, argon arc welding, and brazing processes, the electric field distribution and vacuum sealing are optimized, reducing assembly and welding difficulty, and improving the bonding strength and long-term vacuum retention capability.

Benefits of technology

It achieves uniform electric field distribution, reduces the risk of high-frequency breakdown, improves the long-term vacuum retention capability and operating voltage tolerance of high-power microwave sources, simplifies the assembly process, and enhances the reliability and stability of devices.

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Abstract

The application discloses a kind of high-power microwave source cone ceramic vacuum packaging structure, belong to high-power microwave technical field.The application adopts rotating axis symmetry integrated structure, including metal packaging shell, center conductor, ceramic cover with large angle conical outer contour and central through passage, and first and second equalizing cover located at the both sides of ceramic cover;Ceramic cover both ends are airtight with center conductor and second metal shell;Two equalizing covers are provided with axial inclined transition surface to homogenize electric field.The application constructs highly coordinated rotating symmetry integrated structure by cone ceramic cover, center conductor, double equalizing cover and metal packaging shell, realizes fourfold optimization of geometry configuration, electric field regulation, vacuum sealing and mechanical assembly, and the application can effectively improve the long-time vacuum ability and withstand operating voltage of high-current diode driving high-power microwave source with magnetic field.
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