Substrate transport system electrostatic elimination apparatus and method
By introducing an electrostatic elimination unit and a detection unit into the substrate transfer system, the problem of substrate static electricity was solved, ensuring improved substrate cleanliness and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ACM RES (SHANGHAI) INC
- Filing Date
- 2024-11-26
- Publication Date
- 2026-05-29
AI Technical Summary
Existing substrate transfer systems cannot effectively eliminate static electricity on the substrate, leading to the attraction of impurities and dust by static electricity, which affects the substrate quality.
An electrostatic discharge (ESD) elimination unit is introduced into the substrate transfer system, including an ESD eliminator and a moving mechanism. The substrate is moved under the ESD eliminator by a robotic arm to eliminate ESD. An optional ESD detection unit can be added for precise detection and elimination.
It effectively eliminates static electricity on the substrate, prevents impurities from being attracted by static electricity, and improves the cleanliness of the substrate and the yield rate.
Smart Images
Figure CN122121029A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing equipment, and specifically to an electrostatic discharge device and method for a substrate transmission system. Background Technology
[0002] Substrate transfer systems, such as FIMS (Front-Opening Interface Mechanical Standard), are systems that transfer substrates stored in substrate cassettes into a predetermined process under clean and airtight conditions. First, the substrate cassette is placed in front of the FIMS door. Then, the FIMS mates with the substrate cassette, and the FIMS door opens. For enclosed substrate cassettes, the door also needs to be opened, the substrate transfer robot arm's fork picks up the substrate, places it on a crystal boat, and the doors of the substrate cassette and FIMS close. The crystal boat carrying the substrate is then transported to the reaction chamber. After the reaction is complete, the crystal boat is removed from the reaction chamber, the substrate is picked up by the substrate transfer robot arm's fork, and simultaneously, the doors of the substrate cassette and FIMS open again, the substrate is placed back into the substrate cassette, and finally, the doors of the substrate cassette and FIMS close.
[0003] In semiconductor manufacturing, multiple photolithography, etching, and thin-film deposition processes are involved. During these continuous transfers and processing, the substrate gradually accumulates static electricity. This static electricity makes it easy for impurities, dust, and other contaminants to adhere to the substrate surface, and subsequent processes cannot effectively eliminate this static electricity, thus affecting substrate quality. Current substrate transfer systems cannot effectively eliminate static electricity on the substrate. Summary of the Invention
[0004] This application provides an electrostatic discharge (ESD) elimination device and method for a substrate transmission system, which can effectively eliminate static electricity on the substrate.
[0005] This application solves the above-mentioned technical problems through the following technical solution:
[0006] An electrostatic discharge device for a substrate transmission system includes:
[0007] The device body has a communication port for connecting the outside and the inside of the device body.
[0008] The loading end is located outside the device body and is used to place the substrate box, which is used to store multiple substrates. The substrate box is positioned opposite to the communication port.
[0009] A door is provided at the connecting opening;
[0010] A door opening / closing mechanism for driving the door to open or close the connection port;
[0011] A robotic arm, disposed inside the main body of the device, is configured to remove at least one substrate from the substrate cassette when the door is opened;
[0012] An electrostatic elimination unit is disposed inside the device body. The electrostatic elimination unit includes a first moving mechanism and at least one electrostatic eliminator. The electrostatic eliminator is connected to the first moving mechanism. The electrostatic elimination unit is configured such that when the robot arm holds at least one substrate, the first moving mechanism drives the electrostatic eliminator to move above the substrate, and the electrostatic eliminator eliminates the static electricity on the substrate.
[0013] A substrate processing apparatus includes an electrostatic discharge device for a substrate transfer system as described above.
[0014] A method for electrostatic discharge elimination in a substrate transmission system includes:
[0015] Open the door to the substrate transmission system;
[0016] Remove the substrate from the substrate cassette and move the substrate to the first preset position;
[0017] Eliminate static electricity on the substrate.
[0018] A method for electrostatic discharge elimination in a substrate transmission system includes:
[0019] Open the door to the substrate transmission system;
[0020] Remove the substrate from the substrate cassette and move the substrate to the second preset position;
[0021] Detect whether there is static electricity on the substrate.
[0022] If static electricity is detected on the substrate, the substrate is moved to a first preset position to eliminate the static electricity on the substrate.
[0023] If no static electricity is detected on the substrate, the substrate is moved to a third preset position.
[0024] The positive advancements of this application lie in the fact that by introducing an electrostatic elimination unit inside the equipment body, accumulated static electricity on the substrate surface can be eliminated promptly when the robotic arm removes the substrate. The electrostatic elimination unit employs a first moving mechanism, which can flexibly move the electrostatic eliminator above the substrate after the robotic arm removes it, eliminating static electricity on the substrate and preventing the attraction of impurity particles by static electricity. This ensures the cleanliness of the substrate in subsequent processing, improving the overall quality and yield of the substrate. Attached Figure Description
[0025] Figure 1This is a schematic diagram of the electrostatic elimination device of the substrate transmission system of this application with the door open.
[0026] Figure 2 This is a schematic diagram of the electrostatic discharge device of the substrate transmission system in the closed state of the present application;
[0027] Figure 3 This is a schematic diagram of the electrostatic elimination device of the substrate transmission system in the electrostatic elimination state according to another embodiment of this application;
[0028] Figure 4 This is a schematic diagram of the electrostatic detection state of the electrostatic elimination device of the substrate transmission system according to another embodiment of this application;
[0029] Figure 5 This is a flowchart of the electrostatic discharge method for the substrate transmission system of this application;
[0030] Figure 6 This is a flowchart of an electrostatic discharge (ESD) elimination method for a substrate transmission system according to another embodiment of this application. Detailed Implementation
[0031] The present application is further illustrated below by way of embodiments, but this does not limit the present application to the scope of the embodiments.
[0032] Example 1
[0033] like Figure 1 and Figure 2 As shown, this embodiment provides an electrostatic discharge (ESD) elimination device for a substrate transmission system, including a device body 200, a loading end 210, a door 230, a door opening and closing mechanism 240, a robotic arm 500, and an ESD elimination unit 300.
[0034] The device body 200 is provided with a connection port 220, which is used to connect the outside and inside of the device body 200.
[0035] The loading end 210 is located outside the device body 200 and is used to place the substrate box 100. The substrate box 100 is used to store multiple substrates W. The substrate box 100 is arranged opposite to the communication port 220, that is, the opening of the substrate box 100 is opposite to the communication port 220.
[0036] Door 230 is located at the connecting port 220.
[0037] The door opening / closing mechanism 240 is used to drive the door 230 to open or close the connection port 220.
[0038] The robotic arm 500 is located inside the device body 200 and is configured to remove a substrate W from the substrate box 100 when the door 230 is opened.
[0039] The static elimination unit 300 is disposed inside the device body 200. The static elimination unit 300 includes a static eliminator 310 and a first moving mechanism 320. The static eliminator 310 is connected to the first moving mechanism 320. The static elimination unit 300 is configured such that when the robot arm 500 holds a substrate W, the first moving mechanism 320 drives the static eliminator 310 to move above the substrate W, and the static eliminator 310 eliminates the static electricity on the substrate W.
[0040] By introducing an electrostatic eliminator 300 inside the equipment body 200, static electricity accumulated on the surface of the substrate W can be eliminated in a timely manner when the robot arm 500 removes the substrate W. The electrostatic eliminator 300 adopts a first moving mechanism 320, which can flexibly move the electrostatic eliminator 310 above the substrate W after the robot arm 500 removes the substrate W, eliminating static electricity on the substrate W and avoiding the phenomenon of electrostatic adsorption of impurity particles. This ensures the cleanliness of the substrate W in subsequent processing, improves the overall quality and yield of the substrate W.
[0041] The static eliminator 310 eliminates static electricity by purging ionized gas. By purging ionized gas, static electricity on the surface of the substrate W can be quickly and effectively neutralized. The ionized gas can rapidly combine with the static charge on the substrate W, resulting in uniform distribution and complete elimination of static electricity, making it more efficient and reliable. The static eliminator 310 may include a slender nozzle, such as a rod-shaped nozzle, for spraying the ionized gas. The static eliminator 310 is a mature product and can be purchased from the market. Of course, the structure of the static eliminator 310 is not limited to this; other structures can also be used.
[0042] When the static eliminator 310 blows ionized gas onto the substrate W, the robotic arm 500 moves the substrate W within the plane where the substrate W is located, so that the blowing area of the static eliminator 310 can cover the substrate W. This full-coverage elimination method ensures that the static eliminator 310 can completely eliminate static electricity from the substrate W, improving the static elimination effect.
[0043] In some embodiments, the door opening / closing mechanism 240 drives the door 230 to move horizontally, thereby opening or closing the communication port 220. An electrostatic eliminator 300 is disposed on the door 230, and a first moving mechanism 320 drives the electrostatic detector 410 to move horizontally relative to the door 230. The electrostatic eliminator 300 is disposed on the door 230, achieving integration of functional components. This design saves space inside the device body 200, making the overall layout of the device more compact, thus increasing electrostatic elimination functionality within a limited space. After the door 230 is opened, the robot arm 500 removes the substrate W, and the first moving mechanism 320 can drive the electrostatic eliminator 310 to move horizontally above the substrate W to eliminate static electricity on the substrate W.
[0044] The substrate cassette 100 can be either open or closed. When a closed substrate cassette 100 is used, the door of the substrate cassette 100 needs to be opened to remove the substrate W.
[0045] In some embodiments, the door opening and closing mechanism 240 includes: a guide rail 241, a connecting component 243, and a cylinder 242. The connecting component 243 is disposed on the guide rail 241 and is connected to the door 230 and the cylinder 242 respectively. The cylinder 242 drives the connecting component 243 to reciprocate along the guide rail 241 to open or close the door 230. In some embodiments, the door opening and closing mechanism 240 is not limited to this and may be other mechanisms capable of reciprocating movement.
[0046] In some embodiments, the first moving mechanism 320 includes a guide rail 322 and a cylinder 321. An electrostatic eliminator 310 is disposed on the guide rail 322, and the cylinder 321 drives the electrostatic eliminator 310 to reciprocate along the guide rail 322. In some embodiments, the first moving mechanism 320 is not limited to this and may be other mechanisms capable of reciprocating movement.
[0047] In some embodiments, the electrostatic discharge (ESD) elimination device for the substrate transfer system further includes an ESD detection unit 400 disposed inside the device body 200. The ESD detection unit 400 includes an ESD detector 410 and a second moving mechanism 420, with the ESD detector 410 connected to the second moving mechanism 420. The ESD detection unit 400 is configured such that when the robotic arm 500 holds a substrate W, the second moving mechanism 420 moves the ESD detector 410 above the substrate W, and the ESD detector 410 detects whether static electricity exists on the substrate W.
[0048] The electrostatic detector 410 detects static electricity on the surface of the substrate W, enabling precise detection of the presence and intensity of static electricity on the substrate W as it is removed by the robotic arm 500. When no static electricity is present on the substrate W, static elimination is unnecessary; it is only required when static electricity is present. This makes the static elimination process more precise and effective, avoiding unnecessary operations, reducing time, and conserving energy. Furthermore, the electrostatic detector 410 can perform static electricity detection after static elimination is complete, ensuring that static electricity on the substrate W is thoroughly eliminated.
[0049] When the electrostatic detector 410 performs electrostatic detection on the substrate W, the robotic arm 500 moves the substrate W within the plane where the substrate W is located, so that the detection area of the electrostatic detector 410 can cover the substrate W. By moving the substrate W within the plane with the robotic arm 500, the electrostatic detector 410 can perform comprehensive electrostatic detection on the surface of the substrate W, improving the accuracy and reliability of electrostatic detection.
[0050] The second moving mechanism 420 has the same structure as the first moving mechanism 320. In some embodiments, the second moving mechanism 420 may also have a different structure from the first moving mechanism 320 as needed.
[0051] In some embodiments, the electrostatic detection unit 400 is also disposed on the door 230, and the second moving mechanism 420 is used to drive the electrostatic detector 410 to move horizontally relative to the door 230. This design saves space inside the device body 200, making the overall layout of the device more compact, thereby increasing the electrostatic detection function within a limited space. After the door 230 is opened, the robot arm 500 removes the substrate W, and the second moving mechanism 420 can drive the electrostatic detector 410 to move horizontally above the substrate W to eliminate static electricity on the substrate W.
[0052] In some embodiments, the static elimination unit 300 and the static detection unit 400 are distributed vertically, and the robot arm 500 can move the substrate W vertically. Since the static elimination unit 300 and the static detection unit 400 are distributed vertically and do not interfere with each other, they can perform static detection and static elimination tasks respectively with the cooperation of the robot arm 500.
[0053] like Figure 3 and Figure 4As shown, in some embodiments, the static elimination unit 300 includes a plurality of static eliminators 310, which are spaced apart vertically. Each static eliminator 310 is connected to a first moving mechanism 320. When the door 230 is opened, the robot arm 500 is configured to hold multiple substrates W, and the static elimination unit 300 is configured such that the first moving mechanism 320 moves the plurality of static eliminators 310 to above the corresponding substrates W. The number of static eliminators 310 and the number of substrates W removed can be the same or different.
[0054] This solution utilizes multiple static eliminators 310 operating simultaneously, enabling simultaneous static elimination of multiple substrates W, thus significantly improving the overall efficiency of static elimination.
[0055] There are multiple first moving mechanisms 320, and each first moving mechanism 320 is connected to a static eliminator 310. In some embodiments, only one first moving mechanism 320 may be provided to drive multiple static eliminators 310 at the same time. For example, the first moving mechanism 320 is connected to multiple static eliminators 310 at the same time through a connecting rod, and thus multiple static eliminators 310 are driven by one first moving mechanism 320 at the same time.
[0056] In some embodiments, the electrostatic detection unit 400 includes a plurality of electrostatic detectors 410, each of which is connected to a second moving mechanism 420. When the door 230 is opened, the robotic arm 500 is configured to hold multiple substrates W, and the electrostatic elimination unit 300 is configured such that the second moving mechanism 420 moves the plurality of electrostatic detectors 410 to the top of their respective substrates W. The plurality of electrostatic detectors 410 can simultaneously perform electrostatic detection on multiple substrates W, significantly improving the electrostatic detection efficiency of the substrates W.
[0057] There are multiple second moving mechanisms 420, and each second moving mechanism 420 is connected to an electrostatic detector 410. In some embodiments, only one second moving mechanism 420 may be provided to drive multiple electrostatic detectors 410 at the same time. For example, the second moving mechanism 420 is connected to multiple electrostatic detectors 410 at the same time through a connecting rod, and thus multiple electrostatic detectors 410 are driven by one second moving mechanism 420.
[0058] In some embodiments, the robotic arm 500 includes a plurality of pick-up forks 510, the spacing between which is adjustable. After picking up the substrate W, the robotic arm 500 increases the spacing between the pick-up forks 510 so that the spacing of the substrate W matches the spacing of the electrostatic eliminator 310 or electrostatic detector 410. The electrostatic eliminator 310 or electrostatic detector 410 can then move between the substrates W, thereby achieving electrostatic elimination or electrostatic detection for each substrate W. This design allows for the provision of space for electrostatic elimination or electrostatic detection after picking up the substrate, and restores the original spacing after electrostatic elimination or electrostatic detection for subsequent substrate W transfer.
[0059] The spacing adjustment of the fork 510 of the robotic arm 500 is achieved through multiple lead screws (not shown in the figure) and a gear set (not shown in the figure). The gear set drives the multiple lead screws to rotate. Each lead screw is connected to two forks 510 respectively through two bushings. The threads of the two bushings and the lead screws rotate in opposite directions. Thus, when the lead screw rotates, the two bushings on the same lead screw can drive the two forks 510 to move in opposite directions. The multiple lead screws can adjust the spacing between the multiple forks 510. In some embodiments, the specific structure for adjusting the spacing of the forks 510 of the robotic arm 500 is not limited to this, and adjustment can also be achieved in other ways.
[0060] This embodiment also provides a substrate processing apparatus, which includes the electrostatic discharge device of the substrate transport system as described above.
[0061] Example 2
[0062] like Figure 5 As shown, this embodiment provides a method for electrostatic discharge (ESD) elimination in a substrate transmission system, including:
[0063] S100, Open the door of the substrate transmission system.
[0064] S110. Remove the substrate from the substrate cassette and move it to the first preset position. The first preset position is the working position for static electricity elimination.
[0065] S120, Eliminate static electricity on the substrate.
[0066] This method removes the substrate from the substrate container before eliminating static electricity on the substrate, making it easier and more thorough to eliminate static electricity on the substrate.
[0067] The process also includes the following after step S120:
[0068] S130. Move the substrate to the second preset position. The second preset position is the working position for electrostatic detection. If the first preset position and the second preset position are different, the substrate needs to be moved from the first preset position to the second preset position during electrostatic detection. In some embodiments, if the first preset position and the second preset position are the same, no movement is required.
[0069] S140. Detect whether there is static electricity on the substrate.
[0070] If static electricity is detected on the substrate, the substrate is moved to a first preset position to eliminate the static electricity on the substrate.
[0071] If no static electricity is detected on the substrate, the substrate is moved to the third preset position. The third preset position is the substrate transport position.
[0072] By adding an electrostatic discharge (ESD) detection step after ESD elimination, a closed-loop control system can be formed to ensure that ESD on the substrate is completely eliminated.
[0073] Example 3
[0074] like Figure 6 As shown, this embodiment also provides a method for electrostatic discharge (ESD) elimination in a substrate transmission system, the method comprising:
[0075] S200, Open the door of the substrate transmission system.
[0076] S210. Remove the substrate from the substrate cassette and move the substrate to the second preset position.
[0077] S220, Detect whether there is static electricity on the substrate.
[0078] S221. If static electricity is detected on the substrate, the substrate is moved to the first preset position, and the static electricity elimination unit eliminates the static electricity on the substrate.
[0079] S222. If no static electricity is detected on the substrate, move the substrate to the third preset position.
[0080] In this method, electrostatic discharge (ESD) detection is performed first. When ESD is present on the substrate, ESD elimination is then performed. If there is no ESD on the substrate, ESD elimination is not required, thus reducing ineffective ESD elimination and making the ESD elimination process more intelligent.
[0081] In some embodiments, after step S221, the substrate is moved to a second preset position, step S220 is executed again, and S221 or S222 is executed according to the electrostatic detection result to ensure that the electrostatic charge on the substrate is completely eliminated.
[0082] The first preset position and the second preset position can be the same or different.
[0083] While specific embodiments of this application have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this application is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this application, but all such changes and modifications fall within the scope of protection of this application.
Claims
1. An electrostatic elimination device for a substrate transmission system, characterized in that, include: The device body has a communication port for connecting the outside and the inside of the device body. The loading end is located outside the device body and is used to place the substrate box, which is used to store multiple substrates. The substrate box is positioned opposite to the communication port. A door is provided at the connecting opening; A door opening / closing mechanism for driving the door to open or close the connection port; A robotic arm, disposed inside the main body of the device, is configured to remove at least one substrate from the substrate cassette when the door is opened; An electrostatic elimination unit is disposed inside the device body. The electrostatic elimination unit includes a first moving mechanism and at least one electrostatic eliminator. The electrostatic eliminator is connected to the first moving mechanism. The electrostatic elimination unit is configured such that when the robot arm holds at least one substrate, the first moving mechanism drives the electrostatic eliminator to move above the substrate, and the electrostatic eliminator eliminates the static electricity on the substrate.
2. The electrostatic elimination device for a substrate transmission system as described in claim 1, characterized in that, The static elimination unit includes multiple static eliminators, each of which is connected to the first moving mechanism. The static elimination unit is configured such that when the mechanical hand holds multiple substrates, the first moving mechanism drives the multiple static eliminators to move above the corresponding substrates.
3. The electrostatic elimination device for a substrate transmission system as described in claim 1, characterized in that, The static eliminator eliminates static electricity by purging ionized gas.
4. The electrostatic elimination device for a substrate transmission system as described in any one of claims 1-3, characterized in that, The door opening and closing mechanism is used to drive the door to move horizontally so that the door can open or close the connection port. The static electricity elimination unit is disposed on the door. The first moving mechanism is used to drive the static electricity eliminator to move horizontally relative to the door.
5. The electrostatic elimination device for a substrate transmission system as described in claim 1, characterized in that, It also includes an electrostatic discharge (ESD) detection unit disposed inside the device body. The ESD detection unit includes a second moving mechanism and at least one ESD detector. The ESD detector is connected to the second moving mechanism. The ESD detection unit is configured such that when the robotic arm holds at least one substrate, the second moving mechanism moves the ESD detector above the substrate, and the ESD detector detects whether there is static electricity on the substrate.
6. The electrostatic discharge device for a substrate transmission system as described in claim 5, characterized in that, The electrostatic detection unit includes multiple electrostatic detectors, each of which is connected to the second moving mechanism. The electrostatic elimination unit is configured such that, with multiple substrates held in the mechanical hand, the second moving mechanism drives the multiple electrostatic detectors to move above their respective substrates.
7. The electrostatic elimination device for a substrate transmission system as described in claim 5, characterized in that, The door opening and closing mechanism is used to drive the door to move horizontally so that the door can open or close the communication port. The electrostatic detection unit is disposed on the door. The second moving mechanism is used to drive the electrostatic detector to move horizontally relative to the door.
8. The electrostatic elimination device for a substrate transmission system as described in claim 5, characterized in that, The static elimination unit and the static detection unit are distributed vertically, and the robotic arm can drive the substrate to move vertically.
9. The electrostatic elimination device for a substrate transmission system as described in any one of claims 1, 2, and 6, characterized in that, The robotic arm includes multiple forks for picking up pieces, and the spacing between the multiple forks is adjustable.
10. A substrate processing apparatus, characterized in that, Includes the electrostatic elimination device for the substrate transmission system as described in any one of claims 1-9.
11. A method for eliminating electrostatic discharge in a substrate transmission system, characterized in that, include: Open the door to the substrate transmission system; Remove the substrate from the substrate cassette and move the substrate to the first preset position; Eliminate static electricity on the substrate.
12. The electrostatic discharge method for a substrate transmission system as described in claim 11, characterized in that, The method further includes, after the step of eliminating static electricity on the substrate: Move the substrate to the second preset position; Detect whether there is static electricity on the substrate. If static electricity is detected on the substrate, the substrate is moved to a first preset position to eliminate the static electricity on the substrate; If no static electricity is detected on the substrate, the substrate is moved to a third preset position.
13. A method for eliminating electrostatic discharge in a substrate transmission system, characterized in that, include: Open the door to the substrate transmission system; Remove the substrate from the substrate cassette and move the substrate to the second preset position; Detect whether there is static electricity on the substrate. If static electricity is detected on the substrate, the substrate is moved to a first preset position to eliminate the static electricity on the substrate. If no static electricity is detected on the substrate, the substrate is moved to a third preset position.
14. The electrostatic discharge method for a substrate transmission system as described in claim 13, characterized in that, Following the step of eliminating static electricity on the substrate, the method further includes: The substrate is moved to a second preset position, and the presence of static electricity on the substrate is detected. If static electricity is detected on the substrate, the substrate is moved to a first preset position to eliminate the static electricity on the substrate; If no static electricity is detected on the substrate, the substrate is moved to a third preset position.