Housing, electronic device, method of manufacturing a housing

Abstract

The application provides a shell, an electronic device and a preparation method of the shell. It relates to the technical field of electronic products. The shell can include an insulating base, an insulating layer and a metal trace. The metal trace is arranged on the insulating layer and forms a line structure. The insulating base surrounds the insulating layer and the line structure. The shell further includes an electrical connection structure arranged on the surface of the insulating base and connected with the metal trace through the insulating base. In addition, the insulating base of the application extends into the gap of the line structure and is an integral structure. Since the insulating base in the gap of the line structure and the peripheral insulating base are an integral structure, the connection strength between the line structure and the insulating base can be improved, and the connection reliability can be improved. Compared with the way of embedding a line board through slotting, the application can effectively weaken the delamination and warping between the line structure and the peripheral insulating base.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to a housing, an electronic device containing the housing, and a method for manufacturing the housing. Background Technology

[0002] With the development of communication technology, some electronic devices are becoming increasingly feature-rich, such as having wireless charging capabilities and Near Field Communication (NFC) functionality. For example, see... Figure 1 As shown, the flexible printed circuit (FPC) 102 for the wireless charging coil and the NFC antenna 103 are both disposed between the mobile phone battery 104 and the mobile phone back cover 101. The wireless charging coil FPC 102 occupies part of the mobile phone thickness (e.g., along the...). Figure 1 The Z-axis dimension is 0.15mm to 0.17mm, and the NFC antenna 103 occupies the thickness of the phone (e.g., along the Z-direction). Figure 1 The Z-direction dimension is approximately 0.16 mm.

[0003] Internal space in electronic devices is precious, such as Figure 1 The structure shown can easily lead to resource constraints in the overall system architecture. How to improve the utilization rate of internal space within the constraints of external dimensions and thickness is a key issue currently facing electronic devices. For example... Figure 2 It is a structure that can improve the utilization of internal space. In this structure, an embedding groove is provided on the inner surface of the back cover 101, and the wireless charging coil FPC102 is embedded in the embedding groove.

[0004] Figure 2 The technology involves forcibly integrating the wireless charging coil FPC102 of different materials with the back cover 101. However, due to the different materials of the wireless charging coil FPC102 and the back cover 101, the process of embedding the wireless charging coil FPC102 is very difficult. In addition, because the wireless charging coil FPC102 and the back cover 101 are made of different materials, their coefficients of thermal expansion differ significantly, which can easily lead to delamination, warping, bulging, and other phenomena. Summary of the Invention

[0005] This application provides a housing, an electronic device having the housing, and a method for manufacturing the housing. The main objective is to provide a housing that includes a circuit layer and is integrally formed. When used in electronic devices, this housing can not only improve the utilization of internal space but also enhance the connection strength between the circuit layer and the housing substrate, suppressing phenomena such as circuit layer delamination and warping.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In one aspect, this application provides a housing that can be used in electronic devices, such as terminal devices.

[0008] The housing may include: an insulating substrate, an insulating layer, and metal traces. The metal traces are disposed on the insulating layer and form a circuit structure. The insulating substrate surrounds the insulating layer and the circuit structure. The circuit structure and the insulating layer can be collectively referred to as a circuit board. In other words, in this application, the circuit board is embedded in the insulating substrate and is enclosed by the insulating substrate.

[0009] Furthermore, the insulating substrate extends into the gaps of the circuit structure, and the insulating substrate is an integral structure. That is, the insulating medium used for electrically isolating different metal traces (i.e., the insulating substrate extending into the gaps of the circuit structure) and the surrounding insulating substrate are integrated. This can improve the connection strength between the circuit structure and the surrounding insulating substrate, and improve the connection reliability between the two. Compared with the method of using slotted embedded circuit boards, this application can effectively reduce the occurrence of delamination, warping and other phenomena between the circuit structure and the surrounding insulating substrate.

[0010] When using an embedded circuit board, the mechanical strength of the housing is reduced because the circuit board is embedded in the embedding groove. However, this application integrates the circuit board and the surrounding insulating substrate into a single structure, which can improve the mechanical strength of the housing. For example, if the housing is a mobile phone back cover, the mobile phone back cover can have strong anti-drop and anti-puncture performance.

[0011] In addition, existing technologies using embedded circuit boards embed multiple independent modules with different functions into the inner surface of the housing using slots. Considering tolerances, gaps exist between the devices and the slots, wasting housing area. Since the area of ​​the inner surface of the housing is limited, the number of integrated modules is also limited. However, this application integrates the devices into the housing during the manufacturing process, eliminating gaps. Therefore, the integration degree between the devices and the housing is higher, and the utilization rate of the housing is higher. Thus, more circuits can be integrated, enabling the housing to have multiple electrical functions, such as integrating not only wireless charging coils but also antennas and other signal lines.

[0012] In order to interconnect the metal traces embedded in the insulating substrate with the external structure (such as the mobile phone motherboard), an electrical connection structure is provided on the surface of the insulating substrate. The electrical connection structure passes through the insulating substrate and connects to the metal traces. For example, the electrical connection structure can be connected to the mobile phone motherboard, thereby realizing the interconnection between the circuit structure and the external structure (such as the mobile phone motherboard).

[0013] This application can fully utilize the surface of the insulating substrate to flexibly position the electrical connection structure. For example, when the casing is a mobile phone back cover, the battery is located inside the back cover. To avoid interference between the electrical connection structure and the battery, the electrical connection structure can be positioned close to the periphery of the battery. Alternatively, if the back cover has a motherboard, the electrical connection structure can be positioned close to the motherboard for easy electrical connection. In short, the electrical connection structure can be flexibly configured according to different scenario requirements.

[0014] In one feasible approach, the insulating matrix comprises a resin material.

[0015] The resin material has good fluidity. In feasible processes, a hot melt pressing process can be used to allow the resin material to flow into the gaps in the circuit structure, thereby integrating the insulating substrate in the circuit structure with the surrounding insulating substrate and improving the connection strength between the circuit structure and the surrounding insulating substrate.

[0016] In one possible implementation, the insulating layer has opposing first and second surfaces, and the circuit structure includes a first circuit structure disposed on the first surface; the thickness of the insulating substrate on the first surface is less than the thickness of the insulating substrate on the second surface; and an electrical connection structure is disposed on the surface of the insulating substrate adjacent to the first circuit structure.

[0017] The shell is applied to the back cover of a mobile phone, with the first surface facing the inside of the phone and the second surface facing the outside of the phone. The thickness of the insulating substrate on the first surface is less than the thickness of the insulating substrate on the second surface. In this way, a thicker outer insulating substrate can be used as a protective structure, thereby improving the protective function of the back cover of the mobile phone.

[0018] Since the electrical connection structure is located on the surface of the insulating substrate near the first circuit structure, and the first circuit structure is close to the inner wall of the phone's back cover, it can be connected to the motherboard inside the phone through the electrical connection structure located near the first circuit structure.

[0019] In one possible implementation, the circuit structure further includes a second circuit structure disposed on the second surface; the housing also includes a conductive channel penetrating the insulating layer and connecting the metal traces of the first circuit structure and the metal traces of the second circuit structure.

[0020] In this example, circuit structures (such as a first circuit structure and a second circuit structure) can be provided on both opposite surfaces of the insulating layer, which improves the circuit integration of the housing and makes the housing more functional. For example, it can integrate a wireless charging coil or an antenna.

[0021] In one possible implementation, the housing also includes electronic components disposed on the circuit structure, with the electronic components exposed on the insulating substrate.

[0022] This application implies that the housing provided can integrate not only circuitry but also electronic components, thus enhancing its functionality. For instance, when the housing is a mobile phone back cover, the electronic components include a temperature sensor. This temperature sensor is used to sense the user's temperature. By placing the temperature sensor on the back cover, which is relatively close to the user's body, the measurement accuracy of the temperature sensor can be improved, thereby enhancing the user experience.

[0023] In one possible implementation, the insulating substrate includes a straight section and a bent section, the bent section being arranged circumferentially along the straight section; a portion of the circuit structure and a portion of the insulating layer are disposed in the straight section; a portion of the circuit structure and a portion of the insulating layer are disposed in the bent section.

[0024] The substrate includes a straight section and a bent section. In this example, not only is the circuit board placed in the straight section, but the space in the bent section can also be fully utilized to place the circuit board in the bent section. In this way, more circuit layers can be laid out in the housing, increasing the integration density of the circuit layers and enabling the housing to have more electrical functions. For example, it can integrate not only wireless charging coils and various antennas, but also other signal lines.

[0025] In one possible implementation, the housing further includes a second wiring layer and a conductive channel, the second wiring layer being disposed on the second surface; the conductive channel penetrates the insulating layer and connects the first wiring layer and the second wiring layer.

[0026] In one possible implementation, the electrical connection structure includes a first flexible circuit board and a first connector; the first connector is connected to the first flexible circuit board, and the first flexible circuit board passes through an insulating substrate and is connected to a metal trace.

[0027] In this implementation, the electrical connection structure includes a flexible circuit board. When the electrical connection structure is connected to the mobile phone motherboard, the redundancy and flexibility of the flexible circuit board can improve the reliability of the electrical connection. For example, if the casing is impacted, the redundancy and flexibility of the flexible circuit board can reduce the probability of the electrical connection structure being subjected to a large impact, thereby improving the reliability of the electrical connection between the casing's circuit layer and the motherboard.

[0028] In one possible implementation, the electrical connection structure includes a second connector that connects to a metal trace through an insulating substrate.

[0029] In some examples, the second connector can be connected to a flexible circuit board, which in turn connects to a connector on the phone's motherboard. The redundancy and flexibility of the flexible circuit board can improve the reliability of the electrical connections.

[0030] In one possible implementation, the electrical connection structure includes a first pad disposed on the circuit structure and exposed through an insulating substrate.

[0031] When the first pad is used as the electrical connection structure, for example, a second pad can be set on the motherboard. The first and second pads can be electrically connected using conductive adhesive film. Using pads as the electrical connection structure not only simplifies the structure and reduces manufacturing costs, but also ensures higher electrical connection reliability.

[0032] In one possible implementation, the first pads are multiple, arranged side-by-side at intervals; the housing also includes idle pads that are not electrically connected to the first circuit layer, and the idle pads are arranged around the multiple first pads.

[0033] In one possible implementation, the electrical connection structure includes a conductive sheet that passes through an insulating substrate and is connected to a first circuit layer.

[0034] Using conductive sheets as the electrical connection structure is simple, easy to implement, and has a low manufacturing cost.

[0035] In one feasible approach, the insulating matrix comprises glass fiber material.

[0036] Fiberglass material can enhance the strength of the housing, making it highly reliable.

[0037] Secondly, this application provides an electronic device, which includes: a circuit board and a housing in any of the above implementations, wherein the circuit board is connected to an electrical connection structure in the housing.

[0038] Since the housing of an electronic device contains a circuit board with a circuit structure, compared to placing the circuit board outside the housing and then connecting it to the circuit board inside the electronic device, this application can reduce the thickness of the electronic device by absorbing the thickness of the circuit board in the thickness direction of the housing. In addition, the circuit structure integrated into the housing is integrated with the surrounding insulating substrate, that is, there is a strong connection between the circuit structure and the surrounding insulating substrate, which improves the connection reliability between the two. Compared with the method of using slotted embedded circuit board, this application can effectively reduce the occurrence of delamination, warping and other phenomena between the circuit structure and the insulating substrate.

[0039] In one possible implementation, the electronic device further includes a third connector, and the electrical connection structure includes a first flexible circuit board and a first connector, the first connector being connected to the first flexible circuit board; the first flexible circuit board is connected to a metal trace through an insulating substrate; the third connector is disposed on the circuit board, and the first connector is plugged into the third connector.

[0040] In this implementation, the electrical connection structure includes a flexible circuit board with redundancy and flexibility. The redundancy and flexibility of the flexible circuit board can improve the reliability of the electrical connection between the circuit board and the circuit layer in the housing.

[0041] In one possible implementation, the electronic device further includes a fourth connector and a second flexible circuit board. The electrical connection structure includes the second connector, which is connected to a metal trace through an insulating substrate. The fourth connector is disposed on the circuit board, and the second connector and the fourth connector are connected through the second flexible circuit board.

[0042] In this implementation, the connectors mounted on the housing and the connectors mounted on the circuit board are connected by a flexible circuit board. Similarly, the redundancy and flexibility of the flexible circuit board can improve the reliability of the electrical connection between the circuit board and the circuit layer in the housing.

[0043] In one possible implementation, the electronic device further includes a sixth connector, and the electrical connection structure includes a fifth connector that passes through an insulating substrate and is connected to a metal trace; the sixth connector is disposed on a circuit board, and the fifth connector is plugged into the sixth connector.

[0044] In some application scenarios, such as when there are few circuit signals, connectors can be used for plugging together.

[0045] In one possible implementation, the electronic device further includes a conductive film layer and a second pad. The electrical connection structure includes a first pad disposed on the circuit structure and exposed through an insulating substrate; a second pad disposed on a circuit board; a first side of the housing having the first pad is opposite to a second side of the circuit board having the second pad; the conductive film layer is located between the first and second sides, and the first pad is connected to the second pad through the conductive film layer.

[0046] In this implementation, a conductive film layer is used as the electrical connection structure between the circuit board and the circuit layer inside the housing. The conductive film layer occupies a small area, which can further reduce the thickness of the electronic device.

[0047] In one possible implementation, the first circuit layer includes at least one of a wireless charging coil, an antenna, and a short-range wireless communication coil. Of course, circuits with other functions can also be integrated into the circuit layer.

[0048] In one possible implementation, the electronic device also includes a battery and a camera; the camera penetrates the housing; the battery is located inside the electronic device and is positioned opposite the wireless charging coil; and there are multiple antennas surrounding the periphery of the camera.

[0049] For example, when the electronic device is a mobile phone, the phone casing has a camera. Multiple antennas located inside the casing can be arranged around the camera to make full use of the space.

[0050] When a wireless charging coil is integrated into the housing, the battery inside the electronic device can be positioned opposite the wireless charging coil, improving charging efficiency.

[0051] In one possible implementation, the housing also includes electronic components disposed on the circuit structure and exposed on the insulating substrate, and the electronic components are connected to the circuit board.

[0052] Thirdly, this application also provides a method for preparing a shell, which may include:

[0053] The metal layer in the core board to be processed is etched to form metal traces, and the metal traces form a circuit structure. The core board to be processed includes an insulating layer and a metal layer disposed on the insulating layer.

[0054] The structure, which includes an insulating layer and a circuit structure, is stacked between multiple layers of solid insulating films. The multiple layers of solid insulating films are heated and pressed together. The heated multiple layers of solid insulating films form a molten insulating substrate. The molten insulating substrate flows into the gaps in the circuit structure and is then cooled, so that the insulating substrate surrounds the insulating layer and the circuit structure.

[0055] When preparing the shell using this method, the metal layer of the core board to be processed is first etched to form metal traces; then the structure is sandwiched between multiple solid insulating films, and these solid insulating films are pressed together. Under certain temperature and pressure, these solid insulating films will melt, and the molten material will flow into the gaps of the circuit structure, so that the dielectric material filling the metal traces and the substrate that ultimately supports these structures are integrated. Compared with the method of slotting and embedding the circuit board in the shell, this application can improve the connection strength between the circuit board and the substrate.

[0056] In addition, since this application presses the circuit structure into the insulating substrate, applying this housing to terminal equipment can make higher space utilization within the equipment and accommodate more structures.

[0057] In one feasible approach, after etching the metal layer in the core board to be processed to form metal traces, the fabrication method further includes: setting electronic devices such that the electronic devices are exposed to the insulating substrate.

[0058] In some implementation processes, electronic devices can be integrated onto the housing; for example, these electronic devices can be various sensors.

[0059] In one possible implementation, the metal layer of the core board to be processed includes: a first metal layer disposed on one surface of the insulating layer and a second metal layer disposed on the other surface; etching the metal layer in the core board to be processed to form metal traces includes: etching the first metal layer to form a first metal trace, etching the second metal layer to form a second metal trace, and forming a conductive channel penetrating the insulating layer within the insulating layer.

[0060] In this example, the metal layers of the core board to be processed include a first metal layer and a second metal layer, which can be understood as a double-sided copper-clad board. This allows for the fabrication of double-sided circuit layers and increases the circuit integration density.

[0061] In one feasible manner, the fabrication method further includes, before stacking the structure comprising insulating layers and circuit structures between multiple layers of solid insulating films:

[0062] Fill the gaps in the circuit structure with insulating medium;

[0063] When a multilayer solid insulating film is heated to form a molten insulating matrix, the insulating medium melts to form a molten insulating medium.

[0064] In some structures, after etching to form the circuit structure, the gap depth in the circuit structure is relatively large. In order to avoid the occurrence of voids in the gap, an insulating medium can be used to fill the gap before pressing the solid insulating film. However, when the solid insulating film is heated after pressing, the insulating medium located in the gap will also melt and mix with the molten insulating film, so that the insulating medium located in the gap of the circuit layer structure is finally fused with the outer insulating medium. Attached Figure Description

[0065] Figure 1 This is a schematic diagram of a partial structure of an electronic device;

[0066] Figure 2 This is a partial structural diagram of another electronic device;

[0067] Figure 3 An exploded view of an electronic device provided in an embodiment of this application;

[0068] Figure 4 A partial circuit diagram of an electronic device provided in an embodiment of this application;

[0069] Figure 5 for Figure 3 AA cross-section view;

[0070] Figure 6 A top view of a housing provided in an embodiment of this application;

[0071] Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0072] Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0073] Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0074] Figure 10 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0075] Figure 11 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0076] Figure 12 This is a schematic diagram of the outer wall structure of a shell provided in an embodiment of this application;

[0077] Figure 13 A schematic diagram of the structure of a shell provided in an embodiment of this application;

[0078] Figure 14 for Figure 13 The BB cross-sectional view shows the structure and its positional relationship with the internal structural components of the electronic device;

[0079] Figure 15 A schematic diagram of the structure of a shell provided in an embodiment of this application;

[0080] Figure 16 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0081] Figure 17 A flowchart illustrating a method for preparing a shell according to an embodiment of this application;

[0082] Figures 18 to 23 This is a schematic diagram showing the structure after each step in the manufacturing process of a housing provided in this application embodiment.

[0083] Figure 24 A schematic diagram of the structure of a shell provided in an embodiment of this application;

[0084] Figure 25 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0085] Figure 26 An exploded view of an electronic device provided in an embodiment of this application;

[0086] Figure 27 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0087] Figure 28 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0088] Figure 29 An exploded view of an electronic device provided in an embodiment of this application;

[0089] Figure 30This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0090] Figure 31 This is a schematic diagram of the electrical connection structure of an electronic device provided in an embodiment of this application;

[0091] Figure 32 This is a schematic diagram of the electrical connection structure of an electronic device provided in an embodiment of this application.

[0092] Figure label:

[0093] 101 - Phone back cover; 102 - Wireless charging coil FPC; 103 - NFC antenna; 104 - Phone battery;

[0094] 100 - Display screen; 200 - Housing / back cover; 300 - Mid-frame; 400 - Battery; 500 - Circuit board; 600 - Camera;

[0095] 200A - Straight section; 200B - Bending section; 501 - Main board; 502 - Small board; 500A - Connector; 500B - Second solder pad;

[0096] 11-Insulating substrate; 12-Circuit board; 13-Electrical connection structure; 14-Electronic components; 15-Solder resist layer;

[0097] 11A - Straight section; 11B - Bending section; 121, 128 - Insulation layer; 122 - First circuit structure; 123 - Second circuit structure;

[0098] 124, 125, 127 - Conductive channels; 126 - Third circuit structure; 131, 134 - Flexible circuit board; 132, 133, 135, 136 - Connectors;

[0099] 137 - First pad; 138 - Conductive film layer; 139 - Empty pad; 141 - Temperature sensor; 142 - Thermistor;

[0100] 1221 - Metallic trace; 1222 - Insulating medium;

[0101] 10 - Core board to be processed; 20 - First metal layer; 30 - Second metal layer; 40 - Prepreg; 50 - Gap;

[0102] 401 - Resin substrate; 402 - Glass fiber. Detailed Implementation

[0103] The solutions involved in the embodiments of this application will be described below with reference to the accompanying drawings.

[0104] This application provides an electronic device that may include a mobile phone, tablet computer, smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) devices, augmented reality (AR) devices, drones, or other terminal devices, or it may be a base station, television, router, automobile, or other devices. This application does not impose any special limitations on the specific form of the aforementioned electronic device.

[0105] like Figure 3 As shown in the embodiment of this application, taking a mobile phone as an example, the electronic device may include a display screen 100, a back cover 200 located on the back of the display screen 100 (distributed opposite to the display surface of the display screen 100), and a mid-frame 300 located between the display screen 100 and the back cover 200. The mid-frame 300 can support the display screen 100.

[0106] The display screen 100 can be a liquid crystal display (LCD), an organic light emitting diode (OLED) display, a micro (or mini) light-emitting diode (LED) display, or a quantum dot light-emitting diode (QLED) display, etc. This application does not limit the type of the above-mentioned display screen.

[0107] The aforementioned electronic device may also include at least one of the following: a processor electrically connected to the display screen 100, a sensor, a memory, a charging management module, a power management module, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, a headphone jack, and a camera electrically connected to the processor.

[0108] See Figure 3 The electronic device may also include a circuit board 500, on which electronic components such as the processor, memory, charging management module, and power management module in the above example may be integrated.

[0109] In some electronic devices, such as Figure 3 The circuit board 500 may include a main board 501 and a secondary board 502. Some of the electronic components in the above example are located on the main board 501, and others are located on the secondary board 502.

[0110] like Figure 3The electronic device may also include a battery 400, which can power some components in the electronic device. The battery 400 is disposed between the display screen 100 and the rear cover 200, which may also be referred to as a battery cover or housing 200.

[0111] With the development of communication technology, some electronic devices are becoming increasingly feature-rich, such as having wireless charging capabilities and Near Field Communication (NFC) functionality. For example... Figure 4 As shown, Figure 4 A simplified example shows that an electronic device may include a wireless charging coil, an NFC antenna, an FPC signal line, and an RF antenna, which are electrically connected to a circuit board.

[0112] In some electronic devices, the wireless charging coil is integrated on a flexible printed circuit board (FPC), while the radio frequency antenna, NFC antenna, or other antennas are mounted on the housing. The wireless charging coil FPC or various antennas occupy the internal space of the electronic device, causing a shortage of overall system resources.

[0113] Based on this, this application provides some exemplary solutions for integrating wireless charging coils and various antennas, as described above, onto a circuit board, and integrally molding the circuit board inside the housing, such as integrally molding it into... Figure 3 The interior of the rear shell 200 is shown. This application is not limited to... Figure 4 The wireless charging coil, NFC antenna, FPC signal line, and RF antenna shown are integrated into the housing, and other circuits may also be used.

[0114] like Figure 5 As shown, Figure 5 It can be along Figure 3 A cross-sectional view of AA, this example shows a cross-sectional structural view of housing 200 (or rear housing 200). Housing 200 includes an insulating substrate 11, within which a circuit board 12 is provided, the insulating substrate 11 surrounding the circuit board 12.

[0115] The circuit board 12 is located within the insulating substrate 11, or the circuit board 12 is located within the insulating substrate 11. This can be understood as the insulating substrate 11 surrounding the circuit board 12, meaning that the circuit board 12 is not exposed outside the insulating substrate 11.

[0116] Among them, such as Figure 5 The circuit board 12 may include an insulating layer 121 and a first circuit structure 122 disposed on the insulating layer 121. In some examples, it may be... Figure 4At least one of the wireless charging coil, NFC antenna, FPC signal line and radio frequency antenna shown is integrated in the first line structure 122.

[0117] In other words, this application integrates some circuits in the electronic device inside the housing. Compared to using a separate circuit board to carry these circuits, the solution in this application can utilize the thickness direction of the housing 200 (e.g., ...). Figure 5 The thickness of the spatial absorption circuit board in the Z direction.

[0118] In some structures, Figure 5 The casing shown is Figure 1 When the back cover is 200mm thick, it can improve the utilization of the internal space of the phone, thus reducing the overall thickness of the device (e.g., ...). Figure 1 Thinning the battery in the Z direction allows for more space to be allocated to other structures. For example, the size of the battery 400 can be increased, thereby increasing its capacity and improving battery life. For instance, the increased capacity could be around 100mAh. Alternatively, the size of the circuit board 500 can be increased to accommodate more electronic components.

[0119] For example, integrating the wireless charging coil into Figure 5 The first circuit structure 122 shown can save 0.15mm-0.17mm of thickness space; as another example, the NFC antenna is integrated into... Figure 5 In the first circuit structure 122 shown, 0.16mm of thickness space can be saved.

[0120] The circuit structure illustrated in this application, disposed on an insulating layer, may include metal traces and a dielectric material that electrically isolates different metal traces. For example... Figure 5 As shown, the first circuit structure 122 includes metal traces 1221. To ensure electrical insulation between different metal traces 1221, a dielectric material needs to be filled between them. Figure 5 In the example, the insulating layer 121 and the metal traces 1221 are not only covered by the insulating substrate 11, but the gaps between adjacent metal traces 1221 are also filled by the insulating substrate 11. That is, there is an insulating substrate 11 between adjacent metal traces 1221, or the insulating substrate 11 extends into the gaps between adjacent metal traces 1221, using the insulating substrate 11 to electrically isolate different metal traces 1221. In the example, the insulating substrate 11 is an integral structure.

[0121] This can be understood as: such as Figure 5 In the example, the insulating substrate 11 located between different metal traces 1221 and the insulating substrate 11 covering the insulating layer 121 and the metal traces 1221 are an integral structure.

[0122] The insulating substrate 11 located in the gap of the first circuit structure 122, and the insulating substrate 11 covering the insulating layer 121 and the first circuit structure 122 are an integral insulating substrate structure, which can be understood as:

[0123] In terms of materials, the insulating substrate 11 located in the gap of the first circuit structure 122 is made of the same material as the insulating substrate 11 covering the insulating layer 121 and the insulating substrate 11 covering the first circuit structure 122.

[0124] In the structure, the insulating substrate 11 located in the gap of the first circuit structure 122 will not have a significant interface with the insulating layer 121 and the insulating substrate 11 covering the first circuit structure 122.

[0125] In actual production, the metal layer on the core board to be processed is first etched to obtain metal traces 1221. There are gaps between different metal traces 1221. Then, a prepreg is pressed onto the metal traces 1221. The prepreg is heated to form a molten medium. The molten medium flows into the gaps between the metal traces 1221. After the molten medium cools, it forms an insulating substrate. Thus, the insulating substrate 11 located in the gap of the first circuit structure 122, and the insulating substrate 11 covering the insulating layer 121 and the first circuit structure 122 are an integral structure.

[0126] In the example of this application, such as Figure 5 Since the insulating substrate 11 located in the gap of the first circuit structure 122 and the insulating substrate 11 covering the insulating layer 121 and the first circuit structure 122 are an integral structure, the circuit board 12 and the insulating substrate 11 given in this application can be regarded as an integral structure, that is, the housing 200 is an integral structure.

[0127] Furthermore, since the insulating substrate 11 located in the gap of the first circuit structure 122, and the insulating substrate 11 covering the insulating layer 121 and the first circuit structure 122 are integrated into one structure, the connection strength between the circuit board 12 and the insulating substrate 11 can be improved, thus enhancing the connection reliability between the circuit board 12 and the insulating substrate 11. (Comparison) Figure 2 and this application Figure 5 ,relatively Figure 2 By using a slotted embedded circuit board, this application can enhance the connection strength between the circuit board 12 and the insulating substrate 11, thereby suppressing or even preventing delamination and warping between the circuit board 12 and the insulating substrate 11, and improving the reliability of the housing.

[0128] Continue the comparison Figure 2 and Figure 5 ,exist Figure 2In this process, an embedding slot needs to be provided inside the housing to accommodate the independent circuit board; that is, a slot needs to be opened inside the housing. The inclusion of this embedding slot reduces the overall mechanical strength of the housing. However, in... Figure 5 In this example, the circuit board 2 and the insulating substrate 11 are fused together, thereby significantly enhancing the mechanical strength.

[0129] contrast Figure 2 and Figure 5 ,exist Figure 2 In the manufacturing process, a module that can be embedded in an embedding slot is obtained, such as a wireless charging coil FPC carrying a wireless charging coil, and the wireless charging coil FPC is placed in the embedding slot. That is, in Figure 2 In this structure, independent modules are embedded into the inner surface of the housing using slotted designs. Since the area of ​​the inner surface of the housing is limited, the number of modules that can be installed is also limited. For example, in... Figure 2 In this case, the wireless charging coil FPC occupies a large area, making it difficult to place other modules on the surface of the housing. However, in the example of this application... Figure 5 In this way, the space within the housing can be fully utilized in multiple directions, such as the thickness direction (Z direction), length direction (X direction), and width direction (Y direction). More circuitry can be integrated without increasing the housing size. Figure 6 In the example, Figure 6 The circuit structure integrated into the insulating substrate can include wireless charging coils, antenna 1, antenna 2, antenna 3, antenna 4, and NFC antennas, which obviously gives the housing more electrical functions.

[0130] Or, it can be understood as: in Figure 2 In the manufacturing process of traditional devices, considering tolerance issues, gaps will exist between the device and the slot. Because of these gaps, the area of ​​the housing will be wasted, thus limiting the number of integrated modules. However, in this application, the device is integrated into the housing during the manufacturing process, eliminating gaps. Therefore, the integration degree between the device and the housing is higher, and the utilization rate of the housing is higher. As a result, more circuits can be integrated, enabling the housing to have multiple electrical functions.

[0131] Since the first circuit structure 122 and the circuit board 12 are located inside the insulating substrate 11, in order to ensure that the metal traces of the first circuit structure 122 are connected to structures external to the housing 200 (such as...), Figure 3 The connection of the main board 501 or the small board 502 in electronic devices can be achieved by setting an electrical connection structure on the casing.

[0132] Return to Figure 5In this example, an electrical connection structure 13 is provided on the surface of the insulating substrate 11. The electrical connection structure 13 passes through the insulating substrate 11 and connects to the metal traces of the first circuit structure 122. For example, the electrical connection structure 13 can be connected to the motherboard inside the mobile phone to realize the interconnection between the first circuit structure 122 and the motherboard.

[0133] In this application example, the location of the electrical connection structure 13 can be flexibly configured based on the circuit structure. For example, in... Figure 5 and Figure 6 As shown, Figure 6 The diagram simplifies the circuitry that can be integrated into the first circuit structure. For example, the first circuit structure 122 includes a wireless charging coil, and the electrical connection structure 13 for connecting the wireless charging coil to the motherboard can be located at the edge of the housing, close to the motherboard. Furthermore, since the housing and battery are positioned opposite each other, the electrical connection structure 13 can be positioned to avoid the battery, thus providing more space for the battery, increasing its size and capacity, and improving the battery life of the electronic device.

[0134] exist Figure 5 In the example, the circuit structure disposed on the insulating layer 121 includes a first circuit structure 122. The insulating layer 121 has opposing first and second surfaces, which are oriented along the direction of the housing thickness (e.g., ...). Figure 5 The first line structure 122 can be set on the first surface relative to the Z direction.

[0135] In some electronic devices, such as Figure 7 , Figure 7 This illustration shows a partial structural diagram of a housing application in an electronic device, as exemplified by this application. The first wiring structure 122 is closer to the inner wall of the housing than the insulating layer 121, and the electrical connection structure 13 can pass through the insulating substrate 11 and connect to the first wiring structure 122.

[0136] In other electronic devices, such as Figure 8 , Figure 8 This illustration shows a partial structural diagram of another housing application of this application example in an electronic device. The first wiring structure 122 is further away from the inner wall of the housing than the insulating layer 121; that is, the first wiring structure 122 is closer to the outer wall of the housing than the insulating layer 121. To achieve interconnection between the first wiring structure 122 and structures disposed in the electronic device (such as the motherboard 501 or the small board 502), a... Figure 8 The insulating layer 121 shown is provided with a conductive channel 124. The electrical connection structure 13 is connected to the conductive channel 124 to realize the interconnection between the first circuit structure 122 and the motherboard 501, or to realize the interconnection between the first circuit structure 122 and the small board 502.

[0137] exist Figure 8 In the example, since the first circuit structure 122 is closer to the outer wall of the housing than the insulating layer 121, the heat dissipation effect can be improved.

[0138] Figure 9 This is a cross-sectional view of another type of housing provided in this application embodiment. In this example, not only is a first circuit structure 122 provided on the first surface of the insulating layer 121, but a second circuit structure 123 is also provided on the second surface of the insulating layer 121; in order to realize the interconnection of the first circuit structure 122 and the second circuit structure 123, a conductive channel 125 is provided in the insulating layer 121, and the conductive channel 125 connects the metal traces of the first circuit structure 122 and the metal traces of the second circuit structure 123.

[0139] like Figure 9 By setting up a two-layer circuit structure, more circuits can be integrated, giving the housing more electrical functions. For example, a wireless charging coil can be integrated into the first circuit structure 122, and multiple antennas and other signal lines can be integrated into the second circuit structure 123. This application does not impose any special limitations on the functions of the circuits integrated into the first circuit structure 122 and the second circuit structure 123.

[0140] Figure 10 This is a cross-sectional view of another housing provided in an embodiment of this application. In this example, a multi-layered circuit structure is included, such as a first circuit structure 122, a second circuit structure 123, and a third circuit structure 126 that are stacked together. An insulating layer 121 is stacked between the first circuit structure 122 and the second circuit structure 123, and an insulating layer 127 is stacked between the second circuit structure 123 and the third circuit structure 126.

[0141] To achieve interconnection between the second line structure 123 and the third line structure 126, such as Figure 10 A conductive channel 127 is provided through the insulating layer 128, and the metal traces of the second circuit structure 123 and the metal traces of the third circuit structure 126 are connected through the conductive channel 127.

[0142] See Figure 10 The housing can incorporate more circuitry, such as at least three layers of circuitry, which allows for the integration of more circuits and further enhances the electrical functionality of the housing.

[0143] The housing in this application example is a multifunctional housing that not only has circuit functions but also needs to act as a protective shell to protect the internal structure of the electronic device.

[0144] like Figure 11 As shown, Figure 11This illustration shows a partial structural diagram of a housing application in an electronic device, as exemplified by this application. The housing 200 has opposing inner and outer wall surfaces, with the inner wall surface facing the interior of the electronic device and the outer wall surface facing the exterior. The thickness H1 of the insulating substrate 11 near the outer wall surface is greater than the thickness H2 of the insulating substrate 11 near the inner wall surface. That is, the insulating substrate closer to the interior of the electronic device is thinner, while the insulating substrate closer to the exterior is thicker. This thicker outer insulating substrate enhances the protective function of the housing and strengthens its mechanical strength, such as improving puncture resistance and impact resistance.

[0145] See you later Figure 11 In some examples, the first surface of the insulating layer 121 faces the inside of the electronic device, the second surface faces the outside of the electronic device, the electrical connection structure is disposed on the surface of the insulating substrate close to the first circuit structure, and the thickness of the insulating substrate 11 on the first surface is less than the thickness of the insulating substrate 11 on the second surface.

[0146] In the different examples above, the circuit structure is integrated inside the housing; in other examples, the electronic components may also be integrated onto the housing.

[0147] like Figure 11 It also includes an electronic device 14, which is disposed on a circuit structure, such as on the first circuit structure 122, and passes through and is exposed on the insulating substrate 11. In this way, the electronic device 14 can be electrically connected to a circuit board (such as a motherboard or a small board) disposed outside the housing.

[0148] The electronic device 14 may include sensors, passive devices, or active devices of various functions. For example, Figure 11 The electronic device 14 may include a temperature sensor 141 and a thermistor 142.

[0149] Since the electronic device 14 is mounted on the housing, some performance characteristics of the electronic device can be enhanced. For example, the electronic device includes a temperature sensor 141. Compared to mounting the temperature sensor 141 on the motherboard, the temperature sensor 141 in this application is closer to the outside of the housing, that is, closer to the user's skin. This allows for more accurate detection of skin temperature and improves detection accuracy.

[0150] In addition, the placement of these electronic devices 14 is also quite flexible. For example, in order to interconnect with the motherboard 501, they can be placed close to the motherboard 501; or, in order to interconnect with the small board 502, they can be placed close to the small board 502.

[0151] In some applications, the casing shown in the example above can be used in mobile phones, for example, see... Figure 12As shown, a camera 600 is provided on the phone casing 200. Viewed from the outer wall of the phone casing 200, the casing 200 in this application example is a protective case. However, see Figure 13 As shown, viewed from the inner wall of the phone casing 200, one can see the electronic components 14 integrated on the casing 200, as well as the electrical connection structure 13, such as... Figure 14 , Figure 14 It is along Figure 13 The structural diagram of the BB cross section, combined with Figure 13 and Figure 14 This application integrates a circuit structure inside the housing.

[0152] Continue to combine Figure 13 and Figure 14 Multiple antennas integrated into the circuit structure can surround the camera 600. For example, the NFC antenna surrounds the camera 600, and multiple antennas are located around the NFC antenna.

[0153] In some electronic devices, such as Figure 15 The housing 200 may include not only the straight section 200A, but also the bent section 200B to accommodate a curved display screen. Furthermore, as... Figure 16 As shown, Figure 16 This is a cross-sectional view of another type of housing provided in this application embodiment. The insulating substrate 11 includes a straight plate portion 11A and a bent portion 11B, and the bent portion 11B can be arranged along the circumference of the straight plate portion 11A. It can be understood that the outer edge of the straight plate portion 11A has the bent portion 11B, or that the entire outer edge of the straight plate portion 11A has the bent portion 11B.

[0154] In some examples, the straight section 11A and the bent section 11B can be integrally molded parts.

[0155] In some housing embodiments, a circuit structure can be provided within the straight plate portion 11A of the insulating substrate 11; in other housing embodiments, such as Figure 13 As shown, a partial circuit structure is provided in the straight plate portion 11A of the insulating substrate 11, and a partial circuit structure is provided in the bent portion 11B of the insulating substrate 11.

[0156] exist Figure 16 In the example, partial circuit structures are provided in both the straight section 11A and the bent section 11B. This makes full use of the space in the bent section 11B, increases the integration density of the circuit structure, and enables more electrical functions.

[0157] For example, in some implementations, a relatively small antenna can be integrated into the bend 11B.

[0158] The number of layers of the circuit structure set in the straight section 11A can be the same as the number of layers of the circuit structure set in the bending section 11B. For example, one layer, two layers, or more layers can be set in both sections.

[0159] To prevent the wiring structure in the bend 11B from reducing the strength of the bend 11B, in some examples, the number of wiring layers in the bend 11B can be less than the number of wiring layers in the straight section 11A. For example, two layers of wiring structure are provided in the straight section 11A, and one layer of wiring structure is provided in the bend 11B.

[0160] When the housing includes multiple bends 11B, the wiring structure can be provided in some of the bends 11B or in all of the bends 11B.

[0161] The number of layers of the wiring structure within multiple bends 11 can be the same or different.

[0162] This application also provides an exemplary method for preparing the aforementioned housing containing the circuit structure. Figure 17 This is a process flow diagram of a shell preparation method provided in an embodiment of this application. The steps are as follows:

[0163] Step 1: Etch the metal layer in the core board to be processed to form metal traces. The metal traces form the circuit structure. The core board to be processed includes an insulating layer and a metal layer disposed on the insulating layer.

[0164] Step 2: Stack the structure containing the insulation layer and the circuit structure between multiple layers of solid insulating film, heat and press the multiple layers of solid insulating film together. After being heated, the multiple layers of solid insulating film form a molten insulating substrate. The molten insulating substrate flows into the gaps of the circuit structure and is then cooled, so that the insulating substrate surrounds the insulation layer and the circuit structure.

[0165] The following section details the manufacturing process of a shell, with reference to the accompanying drawings.

[0166] like Figure 18 A core board 10 to be processed is obtained, which can be... Figure 18 The double-sided copper-clad laminate shown can also be a single-sided copper-clad laminate.

[0167] In one example, such as Figure 18 The core board 10 to be processed includes an insulating layer 121, a first metal layer 20 located on one surface of the insulating layer 121, and a second metal layer 30 located on the other surface of the insulating layer 121.

[0168] For example, a 12.5µm thin dielectric thick copper FCCL can be used, wherein the insulating layer 121 is made of µm-level ultrathin polyimide to achieve the high flexibility of the ultrathin dielectric, and 35µm copper foil is bonded on the top and bottom of the dielectric to form a double-sided thick copper CCL.

[0169] In other methods, the insulating layer 121 can be a flexible substrate such as PI or PET, or a high-strength substrate such as glass fiber cloth, synthetic fiber cloth, or non-woven fabric.

[0170] like Figure 19 The core board 10 to be processed is processed by drilling, electroplating and etching processes. The first metal layer 20 is processed into a first circuit structure 122, the second metal layer 30 is processed into a second circuit structure 123, and a conductive channel 125 connecting the first circuit structure 122 and the second circuit structure 123 is formed in the insulating layer 121.

[0171] After etching either the first metal layer 20 or the second metal layer 30 to form the metal trace 1221, as follows: Figure 19 In the middle, there is a gap of 50 between different metal traces 1221.

[0172] like Figure 20 ,exist Figure 19 Solid insulating films are bonded to the top and bottom sides of the structure shown. For example, the solid insulating film can be a prepreg 40. For example, two prepregs 40 are bonded to the top of the circuit board 12 and one prepreg 40 is bonded to the bottom of the circuit board 12.

[0173] The prepreg 40 of this application example may include a resin substrate 401 and glass fiber 402 located within the resin substrate 401.

[0174] like Figure 19 The line etching can be performed with a line width / spacing of 0.25mm / 0.08mm to achieve high-density lines.

[0175] like Figure 21 The process employs hot pressing molding technology, such as a pressurized and heated process, utilizing the molten state of the prepreg during hot pressing to achieve shaping conditions. The circuit board is then pressed into a 3D shape using a mold. In some processes, the edges of the housing can be bent, and the system can also be molded to include housing structures for mounting cameras.

[0176] This can be understood as: in the hot pressing process, combined with Figure 20 and Figure 21 The resin substrate of the prepreg 40 melts and flows into the gap 50 between the metal traces, filling the gap 50. Multiple prepregs 40 are then thermally fused together to form an insulating substrate 11. Furthermore, as... Figure 21The dielectric and insulating substrate 11 located between different metal traces are connected as one unit.

[0177] Therefore, the housing made using the method of this application not only integrates the circuit board inside the housing, but also integrates the circuit board and the insulating substrate of the housing into a single structure, thereby enhancing the connection strength between the circuit board and the insulating substrate and improving the reliability of the circuit board.

[0178] In some other optional processes, during execution Figure 20 Before the prepreg shown in the figure, the following can be performed: Figure 22 The steps shown involve filling the gaps 50 between the metal traces using a filling process, specifically by filling the gaps 50 with an insulating medium 1222. For example, if the gap 50 is deep, a filling process can be used first, followed by bonding the prepreg 40. This can prevent voids between the metal traces on the final circuit board.

[0179] For example, the insulating medium material used in the filling process can be a resin material, which is the same as the resin material of the prepreg 40.

[0180] In execution Figure 22 After the filling process shown, the following can be performed: Figure 20 The prepreg shown is 40 and Figure 21 The hot pressing process is shown. During the execution... Figure 21 During the hot pressing process Figure 22 The resin material located in the gap shown will also be heat-melted and fused together with the resin material of the prepreg 40. Thus, in the resulting structure, the insulating medium (such as resin material) located between different metal traces and the insulating substrate 11 are integrated.

[0181] implement Figure 21 After the steps shown, electronic components 14 can be mounted on the side of the insulating substrate 11 closest to the interior of the electronic device, wherein... Figure 21 In the fabricated structure, the insulating substrate 11 has reserved space for the electronic device 14 to extend into the circuit structure so as to fit the electronic device 14.

[0182] In some feasible processes, such as Figure 23 A solder resist layer 15 can be provided on the side of the insulating substrate 11 closest to the inside of the electronic device. For example, the solder resist layer 15 can be obtained by spraying ink.

[0183] In some other processes, it is possible to... Figure 23 In the structure obtained by the solder resist layer 15 shown, the side of the insulating substrate 11 near the outside of the electronic device is subjected to decorative surface treatments such as printing and spraying.

[0184] In addition, in some feasible processes, during execution Figure 20 In the prepreg 40 bonding process shown, a thinner resin-coated copper sheet (RCC) can be used first, for example, a 10μm thick resin-coated copper sheet, and then a thicker ultra-thin fiberglass cloth can be used to bond on the resin-coated copper sheet, for example, a 25μm thick ultra-thin fiberglass cloth.

[0185] This ensures that the gaps between metal traces are fully filled, preventing reliability defects such as voids within the gaps.

[0186] In different housings of this application example, an electrical connection structure is required to bring out the circuit structure integrated in the insulating substrate so as to electrically connect with the external circuit board. There are many ways to implement this electrical connection structure, and several examples are given below.

[0187] Figure 24 This is a structural diagram of a housing example from this application, illustrating an implementation of an electrical connection structure combining a flexible board and a rigid board. The electrical connection structure 13 includes a flexible circuit board 131 and a connector 132 (which may be called a first connector). The flexible circuit board 131 is connected to the connector 132. The flexible circuit board 131 (which may be called the first flexible circuit board) passes through an insulating substrate 11 and connects to metal traces within the insulating substrate 11. For example, in… Figure 24 In the process, the flexible circuit board 131 passes through the insulating substrate 11 and is connected to the metal traces of the first circuit structure 122.

[0188] like Figure 25 As shown, Figure 25 It is Figure 24 The diagram shows the connection between the electrical connection structure 13 and the circuit board. Connectors can be installed on the circuit board. For example, connectors 500A (which can be called third connectors) can be installed on the main board 501 and the small board 502 respectively. Connector 132 of the electrical connection structure 13 is inserted into connector 500A on the circuit board. Connector 132 and connector 500A can be board-to-board (BTB) connectors, thereby realizing the interconnection between the circuit board and the circuit structure inside the housing.

[0189] Figure 26 This is a structural diagram of a housing according to an example of this application, illustrating another implementation of an electrical connection structure. The electrical connection structure 13 includes a connector 133 (which may be called a second connector), which passes through the insulating substrate 11 and connects to metal traces within the insulating substrate 11, for example, in… Figure 26 In the middle, connector 133 passes through insulating substrate 11 and connects to the metal trace of first circuit structure 122.

[0190] like Figure 27 As shown, Figure 27 It is Figure 26 The diagram shows the connection between the electrical connection structure 13 and the circuit board. Connectors can be installed on the circuit board. For example, connectors 500A (which can be called fourth connectors) can be installed on the main board 501 and the small board 502 respectively. The connector 133 of the electrical connection structure 13 is connected to the connector 500A on the circuit board through the flexible circuit board 134 (which can be called the second flexible circuit board), thereby realizing the interconnection between the circuit board and the circuit structure inside the housing.

[0191] For example, such as Figure 26 Connectors 135 and 136 can be set on the flexible circuit board 134. Connector 135 is connected to connector 133 of electrical connection structure 13, and connector 136 is connected to connector 500A on the circuit board, so as to realize the interconnection between the circuit structure inside the housing and the circuit board.

[0192] exist Figures 24 to 27 The electrical connection structures shown all utilize flexible circuit boards. Because flexible circuit boards offer redundancy, good flexibility, bendability, cushioning, and strong impact resistance, they improve the reliability of the connection between the circuit structure and the circuit board.

[0193] For example, in some application scenarios, when the housing is subjected to external impact, the redundancy and buffering properties of the flexible circuit board can be used to weaken the impact of the buffering force on the circuit board and reduce the probability of the circuit structure and the electrical signal of the circuit board being disconnected.

[0194] like Figure 28 This is a structural diagram of a housing according to an example of this application, illustrating another implementation of the electrical connection structure. Connectors can be set on the circuit board. For example, connector 500A (sixth connector) and connector 133 (fifth connector) of the electrical connection structure 13 can be set on the main board 501 and the small board 502 respectively, and connected to connector 500A on the circuit board to realize the interconnection between the circuit board and the circuit structure inside the housing.

[0195] Figure 29 This is a structural diagram of a housing example of the present application, which illustrates another implementation of an electrical connection structure. Figure 30 It is Figure 29 The diagram shows the structure of the electrical connection structure 13 connected to the circuit board. In this example, the electrical connection structure 13 includes a first pad 137, which passes through the insulating substrate 11 and is connected to the circuit structure.

[0196] A second pad 500B is provided on the circuit board 500 (e.g., motherboard 501 or small board 502). A first side of the housing with a first pad 137 is opposite to a second side of the circuit board 500 with the second pad 500B. A conductive film layer 138 is provided between the first and second sides, and the first pad 137 is connected to the second pad 500B through the conductive film layer 138. That is, this example can use a conductive film layer to electrically connect the circuit board and the circuit structure inside the housing. Figure 29 and Figure 30 The black dots in conductive film layer 138 in the example represent conductive particles.

[0197] In some optional structures, the conductive film layer 138 can be an anisotropically conductive adhesive film (ACF). Anisotropically conductive adhesive film (ACF) can be understood as a thin film made by uniformly mixing tiny conductive particles and epoxy resin. When the film is placed between two pads and subjected to temperature and pressure for a period of time, an electrical path will be formed between the two pads.

[0198] Using conductive films such as anisotropic conductive film (ACF) will not exert large stress on the casing and circuit board, reducing the risk of casing deformation. In addition, thinner conductive films can be used, which means that the conductive film occupies a small area, especially in the thickness direction of the casing. For example, when this casing is used on the back cover of a mobile phone, the space saved by the conductive film can be used to increase the battery size, increase the battery capacity, and improve the phone's battery life.

[0199] Furthermore, conductive films such as anisotropic conductive films (ACF) can support a large number of electrical connections.

[0200] In some examples, it is possible to use Figure 29 The method shown produces an anisotropic conductive film (ACF) as an electrical connection structure. The anisotropic conductive film ACF is placed between the first surface of the circuit board 500, where the first pad 137 is located, and the second surface of the circuit board 500, where the second pad 500B is located. Applying temperature and pressure for a period of time will form an electrical path between the two pads.

[0201] exist Figure 30 In the electrical connection structure shown, to further improve interconnect reliability, such as... Figure 31 The first pad 137 has multiple pads, which are arranged side by side with intervals. For example, the width of any first pad 137 can be d1, and the spacing between two adjacent first pads 137 can be d2, where d1 can be equal to d2.

[0202] Or, in some examples, such as Figure 31There are multiple second pads 500B, which are arranged side by side with intervals. The width of any second pad 500B can be d1, and the spacing between two adjacent second pads 500B can be d2. d1 can be equal to d2.

[0203] The width of the first pad 137 or the second pad 500B in the above example can be understood as the width dimension being the dimension perpendicular to the extension direction of the pad.

[0204] To improve the reliability of the interconnection between the internal wiring structure and the circuit board, such as Figure 32 As shown, it may also include idle pads 139. For example, idle pads 139 may be provided on the housing or on the circuit board. Idle pads 139 may be located around the plurality of first pads and are not electrically connected to the wiring structure inside the housing. Idle pads may also be located around the plurality of second pads and are not electrically connected to the circuit board. Placing idle pads around the pads with electrical functions (first pads or second pads) can protect the pads with electrical functions and improve reliability.

[0205] The above examples illustrate several electrical connection structures, such as flexible circuit boards, connectors, and conductive film layers. Of course, other structures are also possible, such as conductive sheets.

[0206] In some electronic devices, these electrical connection structures can be used in the same device; for example, there may be not only connectors, but also flexible circuit boards and conductive film layers.

[0207] The above examples use a candybar phone as an example. In other examples, the examples of this application can also be applied to foldable phones, such as double-folding or triple-folding electronic devices.

[0208] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0209] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A housing, characterized in that, include: Insulating substrate; An insulating layer and metal traces are disposed on the insulating layer and form a circuit structure. An insulating substrate surrounds the insulating layer and the circuit structure and extends into the gap of the circuit structure. The insulating substrate is an integral structure. An electrical connection structure is disposed on the surface of the insulating substrate, and the electrical connection structure passes through the insulating substrate and is connected to the metal trace.

2. The housing according to claim 1, characterized in that, The insulating matrix includes a resin material.

3. The housing according to claim 1 or 2, characterized in that, The insulating layer has opposing first and second surfaces, and the circuit structure includes a first circuit structure disposed on the first surface; The thickness of the insulating substrate located on the first surface is less than the thickness of the insulating substrate located on the second surface; The electrical connection structure is disposed on the surface of the insulating substrate near the first circuit structure.

4. The housing according to claim 3, characterized in that, The circuit structure also includes a second circuit structure disposed on the second surface; The housing also includes a conductive channel that penetrates the insulating layer and connects the metal traces of the first circuit structure and the metal traces of the second circuit structure.

5. The housing according to any one of claims 1-4, characterized in that, The housing also includes: An electronic device disposed on the circuit structure, wherein the electronic device exposes the insulating substrate.

6. The housing according to any one of claims 1-5, characterized in that, The insulating substrate includes a straight plate portion and a bent portion, wherein the bent portion is arranged circumferentially along the straight plate portion; Part of the described circuit structure and part of the described insulation layer are disposed on the straight plate portion; Part of the described circuit structure and part of the described insulation layer are disposed at the bend.

7. The housing according to any one of claims 1-6, characterized in that, The electrical connection structure includes: First flexible circuit board; A first connector is connected to the first flexible circuit board; The first flexible circuit board passes through the insulating substrate and connects to the metal trace.

8. The housing according to any one of claims 1-7, characterized in that, The electrical connection structure includes: The second connector passes through the insulating substrate and connects to the metal trace.

9. The housing according to any one of claims 1-8, characterized in that, The electrical connection structure includes: The first pad is disposed on the circuit structure, and the first pad exposes the insulating substrate.

10. The housing according to claim 9, characterized in that, The first pad has multiple pads, which are arranged side by side with intervals. The housing also includes: Idle pads are disposed around a plurality of the first pads.

11. The housing according to any one of claims 1-10, characterized in that, The insulating matrix includes glass fiber material.

12. An electronic device, characterized in that, include: Circuit board; A housing, comprising the housing according to any one of claims 1-11, wherein the circuit board is connected to the electrical connection structure.

13. The electronic device according to claim 12, characterized in that, The electronic device also includes a third connector; The electrical connection structure includes: First flexible circuit board; A first connector is connected to the first flexible circuit board; The first flexible circuit board passes through the insulating substrate and connects to the metal trace; The third connector is disposed on the circuit board, and the first connector is plugged into the third connector.

14. The electronic device according to claim 12 or 13, characterized in that, The electronic device also includes a fourth connector and a second flexible circuit board; The electrical connection structure includes: A second connector passes through the insulating substrate and connects to the metal trace; The fourth connector is disposed on the circuit board, and the second connector is connected to the fourth connector through the second flexible circuit board.

15. The electronic device according to any one of claims 12-14, characterized in that, The electronic device also includes a sixth connector; The electrical connection structure includes: The fifth connector passes through the insulating substrate and connects to the metal trace; The sixth connector is disposed on the circuit board, and the fifth connector is plugged into the sixth connector.

16. The electronic device according to any one of claims 12-15, characterized in that, The electronic device also includes a conductive film layer and a second pad; The electrical connection structure includes: A first pad is disposed on the circuit structure, and the first pad exposes the insulating substrate. The second pad is disposed on the circuit board; The first side of the housing having the first pad is opposite to the second side of the circuit board having the second pad; The conductive film layer is located between the first surface and the second surface, and the first pad is connected to the second pad through the conductive film layer.

17. The electronic device according to any one of claims 12-16, characterized in that, The metal traces include at least one of a wireless charging coil, an antenna, and a short-range wireless communication coil.

18. The electronic device according to claim 17, characterized in that, The electronic device also includes a battery and a camera; The camera penetrates the housing; The battery is located inside the electronic device and is positioned opposite to the wireless charging coil; The antenna has multiple antennas, which surround the outer periphery of the camera.

19. A method for preparing a shell, characterized in that, The preparation method includes: The metal layer in the core board to be processed is etched to form metal traces, which form a circuit structure. The core board to be processed includes an insulating layer and the metal layer disposed on the insulating layer. The structure comprising the insulating layer and the circuit structure is stacked between multiple solid insulating films. The multiple solid insulating films are heated and pressed together. The multiple solid insulating films are heated to form a molten insulating substrate. The molten insulating substrate flows into the gaps of the circuit structure and is then cooled, so that the insulating substrate surrounds the insulating layer and the circuit structure.

20. The preparation method according to claim 19, characterized in that, After etching the metal layer in the core board to be processed to form metal traces, the preparation method further includes: An electronic device is disposed such that the electronic device is exposed on the insulating substrate.

21. The preparation method according to claim 19 or 20, characterized in that, Before stacking the structure comprising the insulating layer and the circuit structure between multiple layers of solid insulating films, the fabrication method further includes: An insulating medium is filled into the gaps in the circuit structure. When the multilayer solid insulating film is heated to form a molten insulating matrix, the insulating medium melts to form a molten insulating medium.

22. The preparation method according to any one of claims 19-21, characterized in that, The metal layer of the core board to be processed includes: a first metal layer disposed on one surface of the insulating layer, and a second metal layer disposed on the other surface; Etching the metal layer in the core board to be processed to form metal traces includes: The first metal layer is etched to form a first metal trace, the second metal layer is etched to form a second metal trace, and a conductive channel penetrating the insulating layer is formed within the insulating layer.

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