A heat conducting device

Abstract

The application provides a heat conduction device, which has a hollow structure, a base material of the heat conduction device is a carbon heat conduction film formed integrally, and part of the base material of the heat conduction device has a metal plating layer. The metal plating layer is arranged so that the carbon heat conduction film has better longitudinal heat conduction performance, the structural strength of the heat conduction device is enhanced, and a welding site is provided for the connection of the heat conduction device. By using the heat conduction device, heat can be efficiently transferred in two vertically opposite components.

Description

Technical Field

[0001] This application relates to the field of thermal management, specifically to a thermally conductive device. Background Technology

[0002] In many heat dissipation applications, efficient heat transfer is required between two vertically opposed components. The traditional solution involves using gasket-type thermal interface materials to fill the space between the two components. However, most traditional gasket-type thermal interface materials are composed of polymers (primarily silicone oil) and thermally conductive fillers. The limited filler content (typically 50%-70wt%) prevents them from achieving higher thermal conductivity (>10W / mK). Furthermore, the volatility of silicone oil results in poor aging resistance of the material components, making them unsuitable for prolonged use or high-temperature applications in electronic products.

[0003] Carbon thermally conductive films (such as graphene films, artificial graphite films, and graphite films) are widely used in the field of thermal management due to their excellent thermal conductivity and heat dissipation capabilities and high-temperature stability. However, the advantage of carbon thermally conductive films lies in their horizontal (in-plane) thermal conductivity, while their vertical thermal conductivity is relatively weak. Taking graphene films as an example, the horizontal thermal conductivity of currently commercially available graphene films is greater than 1000 W / (m·K), but their vertical thermal conductivity is typically less than 5 W / (m·K). Some existing technologies coat the surface of the graphene film with an adhesive and then use it in the vertical direction after vertically oriented multiple layers of graphene film. However, the adhesive is easily peeled off from the graphene film under pressure, and the presence of the adhesive can hinder phonon propagation within the thermal interface material, reducing thermal conductivity. Uneven adhesive coating can also easily lead to cracking and delamination of the thermal interface material.

[0004] Meanwhile, when using carbon thermal conductive film as a thermal conductive material, the connection method between the carbon thermal conductive film and external components is one of the issues that researchers should consider. Using adhesives for connection often leads to the loss of thermal conductivity and the problem of unstable connection points; and due to its own properties, carbon thermal conductive film is also difficult to achieve a stable electrical connection with metal in macroscopic applications.

[0005] Based on the above-mentioned technical problems, this application is hereby submitted. Summary of the Invention

[0006] Some embodiments of this application provide a heat-conducting device, and the following multiple embodiments and beneficial effects can be referenced together.

[0007] A heat-conducting device having a hollow structure; The substrate of the thermally conductive device is a one-piece molded carbon thermally conductive film; Some of the substrates of the heat-conducting device have a metal plating layer.

[0008] Using a one-piece molded carbon thermal conductive film as the substrate, the thermal conductive component is set as a hollow structure. Typically, but not limitingly, in some embodiments, the one-piece molded carbon thermal conductive film can be wrapped or folded into a circular, polygonal or irregular shape with the ends connected. Relying on the excellent in-plane thermal conductivity of the carbon thermal conductive film, the entire thermal conductive device has a good thermal conductivity foundation in the plane.

[0009] Carbon thermal conductive films have high bending resistance, poor structural strength, and strong chemical inertness. Therefore, a metal coating is applied to part of the substrate of the thermal conductive device. The metal coating serves three purposes: first, it improves the structural strength and connection reliability of the thermal conductive device; second, it provides welding points for the connection between the thermal conductive device and external metal components; and third, it enhances the longitudinal thermal conductivity of the carbon thermal conductive film. Unlike carbon thermal conductive films, metals are isotropic thermal conductive materials. Coating metals onto carbon thermal conductive films can significantly improve the longitudinal thermal conductivity of the carbon thermal conductive film. Typically, but not limitingly, in some embodiments, the first and last portions of the carbon thermal conductive film have metal coatings, and the metal coatings of the first and last portions are welded together, so that the structure of the thermal conductive device has a reliable connection. The welded metal coatings can also be further welded to external components.

[0010] In some embodiments, in addition to the metal coating on the first and last parts of the carbon thermal conductive film, other parts are also provided with metal coating at intervals to improve the support strength of the thermal conductive device.

[0011] As part of the embodiments of this application, the welding methods are soldering, brazing, laser welding, ultrasonic welding, etc.

[0012] As part of the embodiments of this application, the thermal conductive device has an n-layer structure, where n≥1.

[0013] Multilayer structures can provide more heat conduction paths. Typically, but not limitingly, in some embodiments, the carbon thermal conductive film is connected in a multi-layered, surrounding manner, with a metal plating layer disposed at the same location in each layer. The carbon film is welded between layers through the metal plating layer, further ensuring the structural strength and reliability of the multi-layered, surrounding thermal conductive device.

[0014] As part of the embodiments of this application, the carbon thermal conductive film has a bending resistance of ≥100,000 times. Through multiple bending or extrusion, the carbon thermal conductive film does not delaminate, crack, or break. Moreover, the carbon thermal conductive film has strong bending resistance. In some embodiments, the presence of the unplated metal carbon thermal conductive film enables the thermal conductive device to have a certain deformation capability.

[0015] As part of the embodiments of this application, the carbon thermal conductive film is one or more of graphene film, artificial graphite film, and graphite film.

[0016] As part of the embodiments of this application, the hollow space of the heat-conducting device is filled with support material. The support material may or may not have thermal conductivity, and may or may not have compression resilience. The main purpose of filling with support material is to further improve the structural strength of the heat-conducting device.

[0017] As part of the embodiments of this application, the supporting material possesses compressibility and resilience. Some heat dissipation scenarios not only require heat dissipation but also cushioning. Taking the heat dissipation of the under-display fingerprint area in 3C products as an example, while dissipating heat, it is also necessary to provide necessary support and cushioning for the screen. The uncoated metal carbon thermal conductive film has bending resistance, giving the thermal conductive device a certain degree of deformation capability and deformable space. The material with compressibility and resilience filling the hollow space of the thermal conductive device gives it compressibility and resilience. The combined effect of these two elements enables the thermal conductive device to have both support and cushioning functions.

[0018] As part of the embodiments of this application, the support material is an elastic element or foam.

[0019] As part of the embodiments of this application, the elastic element is a spring or a metal sheet.

[0020] As part of the embodiments of this application, the foam is any one or more of graphene foam, graphite foam, EPE foam, PVC foam, EVA foam, PU foam, silicone foam, and EPDM foam. Among them, graphene foam and graphite foam have both compression resilience and thermal conductivity.

[0021] As part of the embodiments of this application, the metal coating is one or more of copper, iron, aluminum, gold, silver, nickel, and zinc.

[0022] As part of the embodiments of this application, the coating method is one or more of electroplating, physical vapor deposition, and chemical vapor deposition.

[0023] As part of the embodiments of this application, a through hole is provided on the substrate having a metal coating.

[0024] As part of the embodiments of this application, the through holes provided on the substrate with the metal coating penetrate the upper and lower surfaces.

[0025] The presence of through-holes allows for a tighter bond between the metal coating and the substrate carbon thermally conductive film. In electroplating, the carbon thermally conductive film, due to its excellent conductivity, allows electrons to be evenly distributed on its surface (acting as the cathode), creating a stable potential difference. This allows metal ions to uniformly approach these electrons, undergoing an electrochemical reaction on the film surface to obtain a stable and uniformly distributed elemental metal. Because the surface of the carbon thermally conductive film is relatively smooth, the bonding force is weak during nucleation, even though the metal coating adheres to the surface. The metal coating is easily peeled off. The purpose of through-holes is to ensure that the metal nuclei on the upper and lower surfaces of the carbon thermally conductive film can grow together at the through-hole location, forming a stable coating with connected upper and lower surfaces. For physical vapor deposition and chemical vapor deposition, through-holes can also connect the upper and lower surfaces of the metal coating, resulting in better adhesion between the metal coating and the thermally conductive film.

[0026] As part of the embodiments of this application, the through hole can be circular, elliptical, triangular, quadrilateral or other irregular shapes, and the specific shape of the through hole is not limited.

[0027] As part of the embodiments of this application, the minimum diameter of the through hole should be ≥0.05mm, because during electroplating, the continuous and orderly growth of metal crystals needs to be at the micrometer level. If the hole is too small, metal crystals cannot be formed in the hole.

[0028] As part of an embodiment of this application, a heat-conducting device is provided, which has a hollow structure; The substrate of the thermally conductive device is a one-piece molded carbon thermally conductive film; The thermally conductive device includes two relatively parallel sides, and the substrate of the two relatively parallel sides has a metal plating.

[0029] Two relatively parallel sides with a metal coating can provide welding points for two vertically opposite components. The integrally formed carbon thermal conductive film substrate enables the thermal conductive device to have good in-plane thermal conductivity. After the two relatively parallel sides are welded to the two opposite components, the thermal conductive device provides a heat conduction path between the opposite components. Typically, but not limitingly, the thermal conductive device can also have an n-layer structure, the hollow positions can be filled with support material, and through holes can be provided on the substrate at the coating position. That is, multiple embodiments and beneficial effects can be referred to each other. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 Schematic diagram of longitudinal heat conduction requirements Figure 2 A photograph of a graphene thermally conductive film. Figure 3 This is a schematic diagram of the structure of a thermally conductive device according to an embodiment of this application. Figure 4 This is a schematic diagram of the structure of a thermally conductive device according to an embodiment of this application. Figure 5 This is a schematic diagram of the structure of a thermally conductive device according to an embodiment of this application. Figure 6 This is a schematic diagram of the through-hole structure of a thermally conductive device according to an embodiment of this application. Figure 7 This is a SEM image of a perforated carbon thermally conductive film with a metal coating in a thermally conductive device according to an embodiment of this application. Figure 8 This is a schematic diagram illustrating the application of a thermally conductive device according to an embodiment of this application. Figure 9 The graph shows the test results of the longitudinal thermal conductivity of the carbon thermally conductive film with a metal coating in a thermally conductive device according to an embodiment of this application. 1-Carbon thermal conductive film; 11-Through hole; 2-Metal coating; 3-Support material Detailed Implementation

[0032] The following detailed description of exemplary embodiments of this application refers to the accompanying drawings, which form part of the description, illustrating exemplary embodiments in which this application may be implemented. The more detailed description of embodiments of this application below is not intended to limit the scope of the claimed application, but is merely illustrative and does not limit the description of the features and characteristics of this application, in order to suggest the best mode for carrying out this application and sufficient to enable those skilled in the art to implement it. However, it should be understood that various modifications and variations can be made without departing from the scope of this application as defined by the appended claims. The detailed description and drawings should be considered illustrative only and not restrictive, and any such modifications and variations shall fall within the scope of this application described herein. Furthermore, the background art is intended to illustrate the current state of research and development and significance of the technology, and is not intended to limit this application or its application areas.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0034] It should be understood that in this application, "connection" and "connected" can both refer to a mechanical or physical connection relationship. For example, "connected to B" or "connected to B" can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0035] Unless otherwise specified in the examples, the procedures should be performed under standard conditions or conditions recommended by the manufacturer. Reagents or instruments whose manufacturers are not specified are all commercially available products.

[0036] To facilitate understanding of the technical solution of this application, the technical problem of this application will be described first below.

[0037] In some products, heat dissipation requires vertical heat transfer, such as... Figure 1 As shown, heat needs to be transferred between components A and B, which are vertically aligned. The traditional solution is to use a gasket-type thermal interface material to fill the space between the two components. However, most traditional gasket-type thermal interface materials are composed of polymers (mainly silicone oil) and thermally conductive fillers. The limited filler content (typically 50%-70wt%) prevents them from achieving higher thermal conductivity (>10W / mK). Furthermore, the volatile nature of silicone oil results in poor aging resistance of the material components, making them unsuitable for prolonged use or high-temperature applications in electronic products.

[0038] Carbon thermally conductive films possess excellent in-plane thermal conductivity. Taking graphene films as an example, the horizontal thermal conductivity of commercially available graphene films is above 1000 W / (m·K), but their longitudinal thermal conductivity is typically below 5 W / (m·K). (Reference) Figure 2 , Figure 2The image shows a finished product of a commercially available graphene film. Other carbon thermal conductive films share the following characteristics with graphene films: ① strong bending resistance, ② poor support strength, and ③ strong in-plane thermal conductivity but weak longitudinal thermal conductivity. Due to its poor support strength, using a single-layer carbon thermal conductive film directly in the vertical direction easily leads to collapse and wrinkles, making this method impractical. Some existing technologies coat the graphene film surface with an adhesive and then vertically align multiple layers of graphene films for vertical application. However, the adhesive is easily peeled off from the graphene film under pressure, and its presence hinders phonon propagation within the thermal interface material, reducing thermal conductivity. Uneven adhesive coating can also easily lead to cracking and delamination of the thermal interface material.

[0039] In existing technologies, carbon thermally conductive films are typically connected to external metal components via adhesive media. However, this connection method often results in thermal conductivity loss and unstable connection points. Welding is one of the effective means to improve the reliability of connection points, but because carbon thermally conductive films are non-metallic materials with purely covalent bonds on their surface, while metals exist in the form of ionic bonds, it is difficult for metals to achieve ideal wetting on the surface of carbon thermally conductive films, making it difficult to form a stable electrical connection with metals in macroscopic applications.

[0040] Based on the above, how to improve the longitudinal thermal conductivity of carbon thermal conductive film, how to improve the connection stability between carbon thermal conductive film and external metal components, and how to improve the structural strength of carbon thermal conductive film are all issues that researchers should consider and solve.

[0041] This application provides a thermally conductive device that solves one or more of the aforementioned technical problems by changing the structure of a carbon thermally conductive film.

[0042] In the embodiments of this application, thermal conductive devices can be applied to 3C products to achieve heat conduction and heat dissipation for the heat-generating components in 3C products.

[0043] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0044] This application provides a thermally conductive device.

[0045] refer to Figure 3 , Figure 3 One embodiment of the thermal conductive device is shown, and its tiled view is as follows. Figure 3 As shown in Figure a, the substrate of the thermal conductive device is a carbon thermal conductive film 1, which is integrally formed, meaning that there are no physical connection points between the carbon thermal conductive films. Metal plating layers 2 are spaced apart at certain locations on the carbon thermal conductive film 1. A top view of the thermal conductive device after surround view is shown below. Figure 3 As shown in b, the front view is as follows Figure 3As shown in Figure c, the carbon thermal conductive film 1 has metal plating layers 2 at both ends. The carbon thermal conductive film 1 is wrapped around to form a hollow structure. The metal plating layers at both ends of the carbon thermal conductive film 1 are welded together, and the heat-conducting device is reliably physically connected. Since the carbon thermal conductive film 1 is integrally formed and has high in-plane thermal conductivity, wrapping it around to form a hollow structure gives the entire heat-conducting device excellent in-plane thermal conductivity. Metal is an isotropic thermal conductive material, and the metal plating enhances the longitudinal thermal conductivity of the carbon thermal conductive film, strengthens the supporting strength of the heat-conducting device, and also enables the heat-conducting device to be welded.

[0046] like Figure 3 As shown, in addition to the metal coating 2 on the first and last parts, the carbon thermal conductive film 1 also has metal coating 2 spaced apart on other parts to further enhance the support strength of the thermal conductive device.

[0047] Further reference Figure 4 , Figure 4 Another embodiment of the thermal conductive device is shown, and its tiled view is as follows. Figure 4 As shown in Figure a, multiple metal plating layers 2 are spaced apart on the carbon thermally conductive film 1. A top view of the thermally conductive device after it has been surrounded is shown below. Figure 4 As shown in b, the front view is as follows Figure 4 As shown in Figure c, it is surrounded by an integrally formed carbon thermally conductive film, forming a multi-layer structure. Each layer has a metal plating layer 2 at the same location, and the metal plating layers 2 between the layers are welded together, thereby ensuring the structural strength and reliability of the multi-layered thermally conductive device. On the one hand, due to the welding between the metal plating layers, the multi-layer structure further enhances the support strength of the thermally conductive device; on the other hand, the multi-layer structure provides more heat conduction paths.

[0048] refer to Figure 4 In this embodiment, the heat-conducting device is designed with a hollow structure. The substrate of the heat-conducting device is an integrally formed carbon heat-conducting film 1, and the heat-conducting device includes two relatively parallel sides. The substrate of the two relatively parallel sides has a metal plating layer 2. In the application of this heat-conducting device, the two relatively parallel sides are directly welded to two opposite components, and the heat-conducting device can provide a good heat conduction path between the components.

[0049] Furthermore, in the embodiments of this application, the carbon thermal conductive film 1 has a bending resistance of ≥100,000 cycles. Through repeated bending or extrusion, the carbon thermal conductive film does not delaminate, crack, or break, and the carbon thermal conductive film has strong bending resistance. The presence of the uncoated metal carbon thermal conductive film enables the thermal conductive device to have a certain deformation capability.

[0050] Furthermore, in the embodiments of this application, the carbon thermal conductive film 1 can be any one of graphene film, artificial graphite film, and graphite film, and the metal coating 2 can be one or more of copper, iron, aluminum, gold, silver, nickel, and zinc.

[0051] Furthermore, in the embodiments of this application, a support material 3 is filled into the hollow space of the heat-conducting device. The support material 3 may or may not have thermal conductivity, and may or may not have compression resilience. The main purpose of filling with the support material 3 is to further improve the structural strength of the heat-conducting device and prevent it from collapsing during use.

[0052] Furthermore, such as Figure 5 As shown, the support material 3 possesses compression resilience. Figure 5 The supporting material shown in a is an elastic component. Figure 5 The supporting material shown in b is foam. In some heat dissipation scenarios, there is not only a need for heat dissipation but also a need for cushioning. Taking the heat dissipation of the under-display fingerprint area in 3C products as an example, while dissipating heat, it is also necessary to provide necessary support and cushioning for the screen. The presence of the uncoated metal carbon thermal conductive film gives the thermal conductive device a certain degree of deformation capability and deformable space. The material with compressibility and resilience filling the hollow part of the thermal conductive device gives it compressibility and resilience. The combined effect of these two factors gives the thermal conductive device both support and cushioning functions.

[0053] In the embodiments of this application, specifically, Figure 5 The elastic element shown in a is a spring.

[0054] In the embodiments of this application, specifically, Figure 5 The foam shown in b is graphene foam. Graphene foam can be compressed to 80% of its own weight, and it also has good thermal conductivity.

[0055] Furthermore, in the embodiments of this application, the elastic element may also be a metal spring sheet, and the foam may also be any one or more of graphite foam, EPE foam, PVC foam, EVA foam, PU foam, silicone foam, and EPDM foam.

[0056] Furthermore, in the embodiments of this application, the plating method is electroplating.

[0057] Furthermore, the substrate carbon thermal conductive film 1 with a metal coating has through holes 11.

[0058] Reference Figure 3-4 In some embodiments, the vias are completely filled and covered by a metal plating layer and are not visible in the images; see reference. Figure 6-7 In some embodiments, the through-holes are not completely filled with the metal plating. Figure 6-7A schematic diagram of the through-hole arrangement in some embodiments is shown, wherein Figure 6 'a' is a tiling diagram. Figure 6 b is a top view of the surrounding thermal conductive device. Figure 7 This is a SEM image of a perforated carbon thermal conductive film with a metal coating. The presence of the through-hole 11 allows for a tighter connection between the metal coating and the substrate carbon thermal conductive film. For electroplating, the carbon thermal conductive film itself has good conductivity, allowing electrons to be evenly distributed on the surface of the carbon thermal conductive film, which acts as the cathode, forming a stable potential difference. Therefore, metal ions can uniformly approach these electrons, undergoing an electrochemical reaction on the surface of the carbon thermal conductive film to obtain a stable quantity and uniform distribution of elemental metal. Because the surface of the carbon thermal conductive film is relatively smooth, the bonding force is actually relatively weak during the nucleation process of the elemental metal. The metal coating is easily peeled off from the surface of the carbon thermal conductive film. The purpose of setting the through-hole is to ensure that the metal nuclei on the upper and lower surfaces of the carbon thermal conductive film can grow together at the location of the through-hole during the nucleation process, forming a stable coating with the upper and lower surfaces connected.

[0059] The through-hole 11 penetrates the upper and lower surfaces of the carbon thermal conductive film 1, and the minimum diameter of the through-hole 11 should be ≥0.05mm. This is because during electroplating, the growth of continuous and orderly metal crystals needs to be at the micrometer level. If the hole is too small, it is difficult to form metal crystals in the hole, which will lead to unsuccessful plating. In the embodiments of this application, the diameter of the through-hole 11 can be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.12mm, 0.14mm, 0.15mm, 0.16mm, 0.18mm, 0.20mm, 0.25mm, 0.30mm, 0.35mm, 0.40mm, 0.45mm, or 0.50mm.

[0060] In the embodiments of this application, the metal plating method may also be physical vapor deposition or chemical vapor deposition.

[0061] In the embodiments of this application, the cross-sectional shape of the through hole can be circular, elliptical, triangular, quadrilateral or other irregular shape, and this application does not limit it.

[0062] The following is a detailed description of one application scenario of the heat-conducting device provided in one embodiment of this application.

[0063] refer to Figure 8The heat-conducting device is welded between external components A and B, where A is the heat source and B is the component to conduct and receive heat. The substrate of the heat-conducting device is a carbon thermally conductive film 1, specifically, a graphene film. The heat-conducting device has two relatively parallel sides, and circular through holes are present on these two relatively parallel sides. Figure 8 (Not shown), the aperture of the through hole is 0.15 mm. The metal coating grows on the upper and lower surfaces of the graphene film through the through hole. Specifically, the metal coating is copper, and the coating method is electroplating.

[0064] Figure 8 The heat-conducting device shown has a four-layer structure, with each layer welded together by a metal plating layer 2 to form a reliable hollow structure. The hollow areas of the heat-conducting device are filled with a supporting material 3, specifically, a spring with compression resilience. Except for two relatively parallel edges, no metal plating is applied to the other parts of the graphene film. The graphene film possesses a bending resistance of ≥100,000 cycles. Based on the above... Figure 8 The heat-conducting device shown has a certain degree of deformability and compressive resilience.

[0065] When heat is dissipated from component A, thanks to the superior longitudinal thermal conductivity of the copper-plated graphene film, the heat is transferred along the longitudinal direction of the copper-plated graphene film. At the same time, thanks to the good in-plane thermal conductivity of the thermal conductive device, the heat reaching the copper-plated graphene film is quickly transferred through multiple paths to the copper-plated graphene film in contact with component B, and finally reaches component B.

[0066] Meanwhile, when component A or B is squeezed, the heat-conducting device has a certain degree of deformability, thus providing a buffering effect. When component A or B is subjected to multiple squeezes, the graphene film will not break due to its ≥100,000 bending resistance.

[0067] Figure 8 The thermal conductive device shown is connected to each other by welding. Compared with the method of using adhesive, the connection has better reliability, and the presence of metal plating improves the structural strength of the thermal conductive device.

[0068] Testing revealed that the longitudinal thermal conductivity of the carbon thermally conductive film with a metal coating provided in this application is ≥20 W / (m·K), which is more than four times that of conventional carbon thermally conductive films. In the embodiments of this application, the longitudinal thermal conductivity of the carbon thermally conductive film with a metal coating can be 20 W / (m·K), 22 W / (m·K), 22.018 W / (m·K), 24 W / (m·K), 26 W / (m·K), 28 W / (m·K), 30 W / (m·K), 32 W / (m·K), 34 W / (m·K), 36 W / (m·K), 37.310 W / (m·K), 38 W / (m·K), 40 W / (m·K), 45 W / (m·K), or 50 W / (m·K).

[0069] Reference Figure 9 In one embodiment of this application, the longitudinal thermal conductivity of the carbon thermally conductive film with a metal coating is 37.310 W / (m·K).

[0070] The method for detecting longitudinal thermal conductivity in this embodiment is as follows: The sample is cut into circular pieces with a diameter of 12.7 mm, its thickness is measured and recorded, and the pieces are placed in a 4-sample round / 12.7 mm holder and then placed in a Netzsch 467 instrument for testing. The test environment temperature is set to 25-27℃, the temperature threshold (tolerance / stability threshold) is 0.3 K, the number of flash points is 5, the voltage is 260 V, the pulse width is 44 μs, the main gain is adjusted to 6633, the sampling time is adjusted to 6 ms, the detection area is 3.7 mm², and parameter optimization is enabled. After the test, the average longitudinal thermal conductivity data of each group of samples is recorded. Thermal conductivity = thermal diffusivity × density × specific heat capacity.

[0071] It is worth mentioning that one of the advantages of the thermal conductive device provided in this application embodiment is that it has better longitudinal thermal conductivity, but it also has good thermal conductivity in all directions. The specific application direction and application method of the thermal conductive device with the structure described in this application are not limited.

[0072] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat-conducting device, characterized in that, The heat-conducting device has a hollow structure; The substrate of the thermal conductive device is an integrally formed carbon thermal conductive film; The substrate of the heat-conducting device has a metal plating layer.

2. The thermally conductive device according to claim 1, characterized in that, The heat-conducting device has an n-layer structure, where n ≥ 1.

3. The thermally conductive device according to claim 1, characterized in that, The carbon thermal conductive film has a bending resistance of ≥100,000 cycles.

4. The thermally conductive device according to claim 1, characterized in that, The carbon thermal conductive film is one or more of graphene film, artificial graphite film, and graphite film.

5. The thermally conductive device according to claim 1, characterized in that, The hollow space of the heat-conducting device is filled with supporting material.

6. The thermally conductive device according to claim 5, characterized in that, The support material has compressibility and resilience.

7. The thermally conductive device according to claim 6, characterized in that, The supporting material is an elastic element or foam.

8. The thermally conductive device according to claim 7, characterized in that the foam is any one or more of graphene foam, graphite foam, EPE foam, PVC foam, EVA foam, PU foam, silicone foam, and EPDM foam.

9. The thermally conductive device according to claim 1, characterized in that, The metal plating is one or more of copper, iron, aluminum, gold, silver, nickel, and zinc.

10. The thermally conductive device according to claim 1, characterized in that, The coating method is electroplating, physical vapor deposition, or chemical vapor deposition.

11. The thermally conductive device according to claim 1, characterized in that, The substrate with a metal coating has through holes.

12. The thermally conductive device according to claim 11, characterized in that, The diameter of the through hole is ≥0.05mm.

13. The thermally conductive device according to claim 1, characterized in that, The heat-conducting device has a hollow structure; The substrate of the thermal conductive device is an integrally formed carbon thermal conductive film; The thermally conductive device includes two relatively parallel sides, and the substrate of the two relatively parallel sides has a metal plating layer.

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