inductor component

Abstract

An inductor component includes at least one inductor element. The inductor element includes a magnetic layer having uniaxial magnetic anisotropy, a first inductor wiring located on one side of the magnetic layer in a first direction and extending along an imaginary plane intersecting the first direction, a second inductor wiring located on the other side of the magnetic layer in the first direction, and a first via portion electrically connecting the first inductor wiring and the second inductor wiring. The first inductor wiring, the second inductor wiring, and the first via portion constitute at least a part of an inductor that rotates around an axis of rotation extending along a second direction intersecting the first direction. An absolute value of an angle formed by a hard axis or an easy axis of the magnetic layer and the axis of rotation is zero degrees or more and less than 10 degrees.

Description

Technical Field

[0001] This disclosure relates to inductor components. Background Technology

[0002] Patent Document 1 discloses a wire-wound magnetic thin-film inductor. In the inductor of Patent Document 1, a magnetic thin film is formed on a glass substrate.

[0003] Patent document 1: Japanese Patent Application Publication No. 2000-252127.

[0004] In the inductor of Patent Document 1, the glass substrate needs to be thickened for winding rotation, which makes it difficult to miniaturize and reduces the efficiency of inductance acquisition. Summary of the Invention

[0005] The purpose of this disclosure is to provide an inductor component that can be miniaturized and has high inductance acquisition efficiency.

[0006] An inductor component according to one aspect of this disclosure includes at least one inductor element, the inductor element comprising: a magnetic layer having uniaxial magnetic anisotropy; a first inductor wiring located on one side of the magnetic layer in a first direction and extending along an imaginary plane intersecting the first direction; a second inductor wiring located on the other side of the magnetic layer in the first direction; and a first via portion electrically connecting the first inductor wiring and the second inductor wiring, the first inductor wiring, the second inductor wiring, and the first via portion constituting at least a portion of an inductor, the inductor rotating about a rotation axis extending along a second direction intersecting the first direction, the absolute value of the angle between the difficult or easy axis of the magnetic layer and the rotation axis being 0 degrees or more and less than 10 degrees.

[0007] The inductor component described above enables miniaturization and high inductance acquisition efficiency. Attached Figure Description

[0008] Figure 1 This is a plan view of an inductor component representing one aspect of the present disclosure.

[0009] Figure 2 It is along Figure 1 A cross-sectional schematic diagram of the X1-X2 line.

[0010] Figure 3 It is along Figure 1 A schematic diagram of the cross section of line Y1-Y2.

[0011] Figure 4 It means Figure 1 A graph showing an example of the BH curve of the magnetic layer of an inductor component.

[0012] Figure 5 It is used for Figure 1 A first cross-sectional schematic diagram illustrating an example of a method for manufacturing an inductor component.

[0013] Figure 6 It is used for Figure 1 The second cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0014] Figure 7 It is used for Figure 1 The third cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0015] Figure 8 It is used for Figure 1 The fourth cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0016] Figure 9 It is used for Figure 1 The fifth cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0017] Figure 10 It is used for Figure 1 The sixth cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0018] Figure 11 It is used for Figure 1 The seventh cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0019] Figure 12 It is used for Figure 1 The eighth cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0020] Figure 13 It is used for Figure 1 The ninth cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0021] Figure 14 It is used for Figure 1 The tenth cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0022] Figure 15 It is used for Figure 1 The eleventh cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0023] Figure 16 It is used for Figure 1The twelfth cross-sectional view illustrates an example of a method for manufacturing an inductor component.

[0024] Figure 17 It means Figure 1 A plan view of the first modified example of the inductor component.

[0025] Figure 18 It is along Figure 17 A sectional view along lines A1-A2.

[0026] Figure 19 It is along Figure 17 A sectional view along line B1-B2.

[0027] Figure 20 It means Figure 1 A cross-sectional schematic diagram of a second modified example of an inductor component.

[0028] Figure 21 It is along Figure 20 A cross-sectional view of the Z1-Z2 line.

[0029] Figure 22 It means Figure 1 A plan view of the third variant of the inductor component.

[0030] Figure 23 It means Figure 1 A plan view of the fourth variant of the inductor component.

[0031] Figure 24 It means Figure 23 A diagram showing the location of the external terminals of the inductor component.

[0032] Figure 25 It means Figure 23 A diagram of an inductor component.

[0033] Figure 26 It means Figure 1 A plan view of the fifth variation of the inductor component.

[0034] Figure 27 It means Figure 26 A diagram showing the location of the external terminals of the inductor component.

[0035] Figure 28 It means Figure 26 A diagram of an inductor component.

[0036] Figure 29 It is along Figure 26 A sectional view of the C1-C2 line.

[0037] Figure 30 It means Figure 1A cross-sectional schematic diagram of the sixth modified example of the inductor component.

[0038] Figure 31 It is used for the formation Figure 30 The first figure illustrates an example of a method for constructing a magnetic layer for an inductor component.

[0039] Figure 32 It is used for the formation Figure 30 The second figure illustrates an example of a method for constructing a magnetic layer for an inductor component.

[0040] Figure 33 It is used for the formation and Figure 30 The first figure illustrates an example of a method for different magnetic layers in an inductor component.

[0041] Figure 34 It is used for the formation and Figure 30 The second figure illustrates an example of a method for different magnetic layers in an inductor component. Detailed Implementation

[0042] The various methods of this disclosure are described.

[0043] The inductor component of the first embodiment includes at least one inductor element, the inductor element comprising: a magnetic layer having uniaxial magnetic anisotropy; a first inductor wiring located on one side of the magnetic layer in a first direction and extending along an imaginary plane intersecting the first direction; a second inductor wiring located on the other side of the magnetic layer in the first direction; and a first via portion electrically connecting the first inductor wiring and the second inductor wiring, the first inductor wiring, the second inductor wiring, and the first via portion constituting at least a portion of an inductor, the inductor rotating about a rotation axis extending along a second direction intersecting the first direction, the absolute value of the angle between the difficult or easy axis of the magnetic layer and the rotation axis being 0 degrees or more and less than 10 degrees.

[0044] According to the inductor component of the first embodiment, since most of the magnetic flux is oriented towards the anisotropic axis, the inductance acquisition efficiency and DC superposition characteristics can be improved. In addition, since the first inductor wiring, the second inductor wiring, and the first via portion extending along the imaginary plane constitute part of the inductor, the inductor component can be easily miniaturized (e.g., thin-film).

[0045] In the inductor component of the second embodiment, according to the inductor component of the first embodiment, the absolute value of the angle between the aforementioned free axis and the aforementioned rotation axis is more than zero degrees and less than 10 degrees.

[0046] According to the inductor component of the second method, most of the magnetic flux passes through the easy axis, thus improving the inductance acquisition efficiency of the inductor component.

[0047] In the third-party type of inductor component, according to the first type of inductor component, the absolute value of the angle between the aforementioned pivot axis and the aforementioned rotation axis is more than zero degrees and less than 10 degrees.

[0048] According to the third-party inductor components, most of the magnetic flux passes through the hard axis, thus reducing the increase in DC superposition characteristics and iron loss of the inductor components.

[0049] In the fourth type of inductor component, according to any one of the first to third types of inductor components, the magnetic layer has a rectangular shape when viewed along the first direction, and the easy axis extends along the long side direction of the magnetic layer.

[0050] According to the inductor component of the fourth method, if the influence of shape magnetic anisotropy is taken into account, the anisotropy axis can be easily controlled by setting the long side direction of the magnetic layer as the easy axis.

[0051] In the fifth type of inductor component, according to any one of the first to fourth types of inductor components, the magnetic layer includes an inorganic insulating layer and an inorganic magnetic layer stacked along the first direction, and the dimension, i.e. the thickness, of the magnetic layer in the first direction is smaller than the thickness of the first inductor wiring and the thickness of the second inductor wiring.

[0052] According to the inductor component of the fifth method, eddy currents can be reduced and the Q value of the inductor can be increased.

[0053] In the inductor component of the sixth method, according to the inductor component of the fifth method,

[0054] The aforementioned inorganic insulating layer is located at both ends of the aforementioned magnetic layer in the aforementioned first direction.

[0055] According to the inductor component of the sixth method, insulation between the inductor component and peripheral components such as wiring can be reliably obtained.

[0056] In the seventh type of inductor component, the inductor component according to any one of the first to sixth types has an external terminal having a recess that is recessed toward the magnetic layer.

[0057] According to the inductor component of the seventh method, the connection area of ​​the external terminals is increased by the recess, thereby improving the fixing strength of the external terminals.

[0058] In the inductor component of the eighth embodiment, when viewed along the rotation axis, at least a portion of the first through-hole overlaps with the magnetic layer.

[0059] According to the inductor component of the eighth method, since the magnetic flux is blocked by the first through-hole, noise leakage to the vicinity of the inductor component can be prevented.

[0060] In the inductor component of the ninth embodiment, according to the inductor component of the eighth embodiment, when viewed along the aforementioned rotation axis, more than half of the aforementioned magnetic layer overlaps with the aforementioned first through-hole portion.

[0061] According to the inductor component of the ninth method, noise leakage to the surrounding environment can be prevented more reliably.

[0062] In the inductor component of the tenth embodiment, according to any one of the first to ninth embodiments, the first through hole penetrates the magnetic layer along the first direction.

[0063] According to the inductor component of the tenth method, since the magnetic layer can be maximized along the imaginary plane, the inductance acquisition efficiency of the inductor component can be improved and leakage flux can be suppressed.

[0064] In the eleventh embodiment of the inductor component, the inductor component according to any one of the first to tenth embodiments includes: a first insulating layer covering the first inductor wiring; and a second insulating layer located further away from the magnetic layer in the first direction than the first insulating layer, and having a smaller coefficient of linear expansion than the first insulating layer.

[0065] According to the eleventh method of the inductor component, for example, by connecting the substrate via a second insulating layer, the strength of the substrate can be improved.

[0066] In the twelfth embodiment of the inductor component, the inductor component according to the eleventh embodiment includes a vertical wiring that is configured to penetrate the second insulating layer along the first direction and is capable of being electrically connected to an external circuit.

[0067] According to the inductor component of the twelfth method, the freedom of installation location of the inductor component can be increased by vertical wiring.

[0068] In the thirteenth embodiment of the inductor component, the inductor component according to any one of the first to twelfth embodiments includes a blank body, which includes a first main surface and a second main surface located at both ends of the first direction, and is provided with the magnetic layer, the first inductor wiring, the second inductor wiring and the first through hole. An external terminal is provided on at least one of the first main surface and the second main surface, and the external terminal is electrically connected to at least one of the first inductor wiring and the second inductor wiring. The surface roughness of the first main surface and the second main surface are different.

[0069] According to the inductor component of the thirteenth method, by molding resin on the main surface with a larger surface roughness, the adhesion to the molding material can be improved.

[0070] In the inductor component of the fourteenth embodiment, according to the inductor component of the thirteenth embodiment, the external terminal is located on the first main surface, the blank has a recess extending from the first main surface toward the first direction and the magnetic layer is recessed, and the first main surface is located closer to the magnetic layer than the external terminal.

[0071] According to the fourteenth method of the inductor component, since the external terminal is located at the position furthest from the magnetic layer, the inductor component can be easily mounted on a substrate or the like.

[0072] In the inductor component of the fifteenth embodiment, according to any one of the first to fourteenth embodiments, when viewed along the first direction, the magnetic layer is located inside the outer shape of the inductor component.

[0073] According to the inductor component of the fifteenth method, for example, it is possible to prevent damage to the magnetic layer due to mechanical stress or other factors caused by cutting during monolithization.

[0074] In the sixteenth embodiment of the inductor component, the inductor component according to any one of the first to fifteenth embodiments includes an external terminal, the external terminal comprising: a first external terminal electrically connected to at least one of the first inductor wiring and the second inductor wiring; and a second external terminal as a dummy terminal, not electrically connected to either the first inductor wiring or the second inductor wiring, the second external terminal having a different shape than the first external terminal.

[0075] According to the inductor component of the sixteenth embodiment, the mounting strength of the inductor component can be improved. Furthermore, by making the shape of the second external terminal different from that of the first external terminal, the mounting orientation of, for example, the inductor component can be easily identified.

[0076] In the inductor component of the seventeenth embodiment, the inductor component according to any one of the first to sixteenth embodiments includes a plurality of the aforementioned inductor elements.

[0077] According to the inductor component of the seventeenth embodiment, by having multiple inductor elements in one inductor component, the mounting area of ​​the inductor component can be reduced.

[0078] In the eighteenth embodiment of the inductor component, according to the seventeenth embodiment of the inductor component, the spacing of the first inductor wiring or the second inductor wiring of the adjacent inductor elements is different along the direction in which the first inductor wiring or the second inductor wiring extends.

[0079] The inductor component according to the eighteenth method allows for greater design flexibility in the placement of external terminals. Furthermore, the coupling coefficient can be adjusted.

[0080] In the inductor component of the nineteenth embodiment, the inductor component according to the seventeenth or eighteenth embodiment includes 2N (N is a natural number) of the aforementioned inductor elements.

[0081] According to the inductor component of the nineteenth method, the space of the magnetic layer can be effectively utilized.

[0082] In the inductor component of the twentieth embodiment, according to any one of the first to nineteenth embodiments, the magnetic layer includes a through hole disposed at its center and extending along the first direction.

[0083] According to the inductor component of the twentieth method, an inductor component with small leakage flux can be realized.

[0084] In the inductor component of the twenty-first embodiment, according to the inductor component of any one of the seventeenth to nineteenth embodiments, as the aforementioned rotating axis, there is a first rotating axis and a second rotating axis parallel to the aforementioned first rotating axis and not overlapping with the aforementioned first rotating axis. A plurality of first aforementioned inductors and a plurality of second aforementioned inductors are provided. The plurality of first aforementioned inductors rotate around the aforementioned first rotating axis, and the plurality of second aforementioned inductors rotate around the aforementioned second rotating axis. The coupling coefficient of the first aforementioned inductors is greater than the coupling coefficient of the second aforementioned inductors.

[0085] According to the inductor component of the twenty-first method, fluctuations can be suppressed by increasing coupling, and by combining it with a weakly coupled inductor to form a multiphase circuit, the efficiency of the DC-DC converter can be improved.

[0086] In the inductor component of the twenty-second embodiment, according to the inductor component of any one of the first to twenty-first embodiments, the magnetic layer has a first end portion that faces the first through-hole portion in a third direction intersecting the first direction and the second direction, the first through-hole portion has a second end portion that faces the magnetic layer in the third direction, and the first end portion and the second end portion are inclined in the same direction relative to the first direction.

[0087] According to the inductor component of the twenty-second embodiment, the first end of the magnetic layer can be brought close to the second end of the first via portion, thereby enabling miniaturization of the inductor. Furthermore, by bringing the first end of the magnetic layer close to the second end of the first via portion, the volume of the magnetic layer can be increased, thereby improving the inductance acquisition efficiency.

[0088] In the inductor component of the twenty-third embodiment, according to the inductor component of any one of the first to twenty-second embodiments, the magnetic layer is disposed along a first imaginary plane intersecting the first direction, the first inductor wiring is arranged at intervals from the first imaginary plane in the first direction, and disposed along a second imaginary plane parallel to the first imaginary plane, and the roughness of the planar portion of the magnetic layer located on the first imaginary plane is 3 nm or more and 10 nm or less.

[0089] According to the inductor component of the twenty-third embodiment, the adhesion of the magnetic layer can be ensured, and the inductance acquisition efficiency can be improved. For example, when the roughness of the planar portion of the magnetic layer is less than 3 nm, the contact area of ​​the magnetic layer becomes smaller, and its adhesion decreases. When the roughness of the planar portion of the magnetic layer is greater than 10 nm, the crystalline structure of the magnetic material contained in the magnetic layer is randomly arranged, the uniaxial magnetic anisotropy of the magnetic layer is destroyed, and the inductance acquisition efficiency cannot be improved.

[0090] The following is a reference to the appendix. Figure 1 The embodiments of this disclosure will be described below. The following description is not intended to limit this disclosure, but is merely illustrative and can be appropriately modified without departing from the spirit of this disclosure. The accompanying drawings are schematic, and the proportions of the dimensions may not necessarily correspond to actual conditions.

[0091] like Figure 1 As shown, an inductor component 1 according to one embodiment of the present disclosure includes an inductor element 10. The inductor element 10 includes a magnetic layer 20, a first inductor wiring 30, a second inductor wiring 40, and a first via portion 50 (see reference 1). Figure 2 ).

[0092] like Figures 1-3As shown, in this embodiment, the inductor component 1 further includes a blank 2, a second through-hole portion 60, an external terminal 70, and pad portions 81 and 82. The inductor element 10, the second through-hole portion 60, and the pad portions 81 and 82 are located inside the blank 2, while the external terminal 70 is located outside the blank 2. The pad portions 81 and 82 may also form part of the first inductor wiring 30 and the second inductor wiring 40, or they may have a different structure from the first inductor wiring 30 and the second inductor wiring 40.

[0093] As an example, the billet 2 has a generally rectangular parallelepiped shape. Let the height direction of the billet 2 be defined as the first direction (e.g., the Z direction), the direction of the shorter side of the billet 2 when viewed along the first direction Z be defined as the second direction (e.g., the Y direction), and the direction of the longer side of the billet 2 when viewed along the first direction Z be defined as the third direction (e.g., the X direction). Figure 2 as well as Figure 3 As shown, the blank 2 includes a first main surface 201 and a second main surface 202 located at both ends in the first direction Z.

[0094] The blank 2 comprises four insulating layers 210, 220, 230, and 240 stacked sequentially along the first direction Z. Insulating layer 220 is an example of a first insulating layer, covering the first inductor wiring 30 and the pad portion 81. Insulating layer 230 covers the magnetic layer 20. Insulating layer 240 covers the second inductor wiring 40 and the pad portion 82. A first main surface 201 is formed by the outer surface of insulating layer 240 in the first direction Z, and a second main surface 202 is formed by the outer surface of insulating layer 210 in the first direction Z. Insulating layer 210 is an example of a second insulating layer located in the first direction Z further away from the magnetic layer 20 than insulating layer 220, and having a smaller coefficient of linear expansion compared to insulating layer 220.

[0095] Insulating layers 210, 220, 230, and 240 respectively comprise epoxy resin, polyimide, phenol, or combinations thereof. Insulating layer 210 may also comprise insulating fillers, or inorganic insulating materials such as SiO2 and TaO.

[0096] As an example, the inductor element 10 includes three first inductor wirings 30, two second inductor wirings 40, and six first through-hole portions 50. The first inductor wirings 30, the second inductor wirings 40, and the first through-hole portions 50 constitute at least a portion of a so-called helical inductor (coil) that rotates about a rotation axis AX extending along a second direction Y. A helical shape refers to a shape where the overall number of turns of the coil is greater than one turn, but the number of turns of the coil in a cross-section orthogonal to the rotation axis AX is less than one turn. More than one turn means that in a cross-section orthogonal to the rotation axis AX, the wirings of the coil have radially adjacent portions. Less than one turn means that in a cross-section orthogonal to the rotation axis AX, the wirings of the coil do not have radially adjacent portions.

[0097] The magnetic layer 20 exhibits uniaxial magnetic anisotropy. In this configuration, the magnetic layer 20, when viewed along the first direction Z, has a rectangular shape and is located closer to the inside of the outer shape of the inductor component 1. "Rectangular shape" includes "generally rectangular shape." The outer shape of the inductor component 1 is, for example, the shape of the blank 2. Eight pad portions 81 and 82 are located on both sides of the long side of the magnetic layer 20. Pad portion 81 is located on the same side as the first inductor wiring 30 relative to the magnetic layer 20, and pad portion 82 is located on the same side as the second inductor wiring 40 relative to the magnetic layer 20.

[0098] exist Figure 4 An example of the BH curve of magnetic layer 20 is shown. Figure 4 In the diagram, the easy axis is represented by a solid line, and the difficult axis by a dashed line. One method for measuring the easy and difficult axes of uniaxial magnetic anisotropy is to use a VSM (vibrating sample magnetometer) to measure the BH curve of the magnetic layer 20. In this method, the BH curve is measured after rotating the sample by 90 degrees; the vertical side of the BH curve is designated as the easy axis, and the horizontal side as the difficult axis. To eliminate the influence of shape anisotropy, O-shaped or square-shaped samples are preferred, but other types of samples can also be used.

[0099] Magnetic layer 20 is configured such that the angle θ between the difficult or easy axis and the rotation axis AX (refer to) Figure 1The absolute value of the angle between the magnetic layer 20 and the rotation axis AX is greater than zero and less than 10 degrees (for example, the easy or difficult axis is approximately parallel to the rotation axis AX). For example, suppose the easy axis extends along the short side direction of the magnetic layer 20 (i.e., the second direction Y), and the difficult axis extends along the long side direction of the magnetic layer 20 (i.e., the third direction X). In this case, the absolute value of the angle between the easy axis of the magnetic layer 20 and the rotation axis AX is greater than zero and less than 10 degrees. For example, suppose the easy axis extends along the long side direction of the magnetic layer 20 (i.e., the third direction X), and the difficult axis extends along the short side direction of the magnetic layer 20 (i.e., the second direction Y). In this case, the absolute value of the angle between the difficult axis of the magnetic layer 20 and the rotation axis AX is greater than zero and less than 10 degrees.

[0100] The magnetic layer 20 includes an inorganic insulating layer 21 and an inorganic magnetic layer 22 stacked along the first direction Z (see reference). Figure 10 As an example, the magnetic layer 20 consists of six inorganic insulating layers 21 and five inorganic magnetic layers 22. The inorganic insulating layers 21 are located at both ends of the magnetic layer 20 in the first direction Z. The inorganic insulating layers 21 contain, for example, TaO or SiO2. The inorganic magnetic layers 22 contain, for example, CZT (Co-Zr-Ta) or FeNi alloy. If the inorganic magnetic layers 22 are thickened, eddy currents may be generated within the magnetic layer 20. Therefore, the inorganic magnetic layers 22 are configured to be thinner than the skin depth derived from the circuit operating frequency (e.g., the switching frequency in the case of a DC-DC converter).

[0101] like Figure 3 As shown, the magnetic layer 20 is configured such that its dimension, i.e. its thickness T0, in the first direction Z is smaller than the thickness T1 of the first inductor wiring 30 and the thickness T2 of the second inductor wiring 40.

[0102] The first inductor wiring 30 is located on one side of the magnetic layer 20 in the first direction Z, extending along an imaginary plane P intersecting the first direction Z. The second inductor wiring 40 is located on the other side of the magnetic layer 20 in the first direction Z. In this configuration, the imaginary plane P is located at the boundary of the insulating layers 210 and 220 of the blank 2.

[0103] like Figure 1 As shown, when viewed along the first direction Z and from the second inductor wiring 40 toward the first inductor wiring 30, the first inductor wiring 30 connects one of the four pad portions 81 located on one side of the magnetic layer 20 in the third direction X to one of the four pad portions 81 located on the other side of the magnetic layer 20 in the third direction X. The first inductor wiring 30 connects two pad portions 81 located at different positions in the second direction Y, and is inclined relative to the rotation axis AX. The three first inductor wirings 30 extend approximately parallel to each other.

[0104] like Figure 1 As shown, when viewed along the first direction Z and from the second inductor wiring 40 toward the first inductor wiring 30, the second inductor wiring 40 connects one of the four pad portions 82 located on one side of the magnetic layer 20 in the third direction X to one of the four pad portions 82 located on the other side of the magnetic layer 20 in the third direction X. The second inductor wiring 40 connects two pad portions 82 located approximately at the same position in the second direction Y, and is approximately orthogonal to the rotation axis AX. The two second inductor wirings 40 extend approximately parallel to each other.

[0105] The first inductor wiring 30 and the second inductor wiring 40 may contain good conductor materials such as copper, silver, gold, or their alloys. The first inductor wiring 30 and the second inductor wiring 40 may also be metal films formed by plating, evaporation, sputtering, etc., or metal sintered bodies obtained by coating a conductor paste and then sintering. The first inductor wiring 30 and the second inductor wiring 40 may also be multilayer structures obtained by stacking multiple metal layers. The first inductor wiring 30 and the second inductor wiring 40 are configured to be no thicker than the magnetic layer 20. With this configuration, an inductor component with low DC resistance and high inductance acquisition efficiency can be realized.

[0106] The first through-hole portion 50 electrically connects the first inductor wiring 30 and the second inductor wiring 40. In this embodiment, as... Figure 2 As shown, the first via portion 50 extends along the first direction Z, connecting a pair of pad portions 81 and 82 that are approximately at the same position in the first direction Z.

[0107] The second through-hole 60 electrically connects at least one of the first inductor wiring 30 and the second inductor wiring 40 to the external terminal 70. In this embodiment, as... Figure 2 As shown, the second via portion 60 extends along the first direction Z, connecting the pad portions 82 located at both ends in the second direction Y and the external terminal 70. This connection electrically connects the second inductor wiring 40 to the external terminal 70.

[0108] External terminals 70 are located on the first main surface 201 of the blank 2. In this embodiment, the inductor component 1 has two external terminals 70. Each external terminal 70 is configured to have a base layer and a plating layer covering the base layer, covering four pad portions 82 located on the same side of the magnetic layer 20 in the third direction X when viewed along the first direction Z. Figure 2 As shown, each external terminal 70 has four recesses 73 corresponding to the four pad portions 82. When viewed along the first direction Z, each recess 73 is provided at a position overlapping with the pad portion 82 and is recessed toward the magnetic layer 20.

[0109] The base layer of the first via 50, the second via 60, and the external terminal 70 comprises, for example, a conductive material such as Ni or Sn. The first via 50 and the second via 60 can be made of a single layer of conductive material or multiple layers of conductive material. The external terminal 70 can also be made of a single layer of conductive material.

[0110] like Figure 1 As shown, when viewed along the first direction Z, the structures constituting the inductor component 1 are configured symmetrically with respect to the center point CP of the blank 2 located on the rotation axis AX.

[0111] Reference Figure 2 , Figure 3 as well as Figures 5-16 An example of a method for manufacturing inductor component 1 will be described. Figure 5 , Figure 7 , Figure 11 , Figure 13 as well as Figure 15 Is along Figure 1 The attached diagram corresponds to the cross-section of line X1-X2. Figure 6 , Figures 8-10 , Figure 12 , Figure 14 as well as Figure 16 Is along Figure 1 The attached figure shows the cross-section of line Y1-Y2.

[0112] like Figure 5 as well as Figure 6 As shown, an insulating layer 210 is formed on a substrate 1000, and a first inductor wiring 30 and a pad portion 81 are formed on the insulating layer 210 to form a first laminate 1001. The substrate 1000 may be, for example, a substrate with high insulation and capable of suppressing eddy currents (e.g., a semiconductor substrate, a glass substrate, an organic resin substrate, or ceramic). The insulating layer 210 is formed, for example, by coating an organic resin onto the substrate 1000 and then curing it. The first inductor wiring 30 and the pad portion 81 are formed, for example, by seed layer formation (sputtering Ti / Cu), resist coating, development, exposure, electroplating, resist stripping, and seed layer etching.

[0113] like Figure 7 as well as Figure 8 As shown, an insulating layer 220 covering the first inductor wiring 30 and the pad portion 81 is formed on the insulating layer 210 of the first laminate 1001, thereby forming a second laminate 1002. The insulating layer 220 is formed, for example, by coating the insulating layer 210 with an organic resin and then curing it.

[0114] like Figure 9As shown, a magnetic layer 20 is formed on the insulating layer 220 of the second laminate 1002, thus forming a third laminate 1003. Figure 10 As shown, the magnetic layer 20 comprises a plurality of inorganic insulating layers 21 and a plurality of inorganic magnetic layers 22 alternately stacked along a first direction Z. The magnetic layer 20 is formed, for example, by repeatedly performing sputtering insulation and sputtering magnetization processes. The magnetic layer 20 is formed by sputtering in a magnetic field, thereby arranging the atoms in the desired positions, with the applied magnetic field direction being the easy axis direction. After the magnetic layer 20 is formed, it is then subjected to resist coating, exposure, development, etching, and resist stripping, thereby enabling the magnetic layer 20 to be formed at the desired locations.

[0115] like Figure 11 as well as Figure 12 As shown, an insulating layer 230 is formed on the insulating layer 220 of the third laminate 1003, and a via opening 501 is formed in the insulating layer 230, thereby forming a fourth laminate 1004. The insulating layer 230 is formed, for example, by coating the insulating layer 220 with an organic resin and curing it. The via opening 501 is formed, for example, by using a laser to penetrate the insulating layer 230 along the first direction Z and extend it to the insulating layer 220, thereby exposing the pad portion 81 from the bottom surface.

[0116] like Figure 13 as well as Figure 14 As shown, a first via portion 50 is formed in the via opening 501 of the fourth laminate 1004, a pad portion 82 is formed on the first via portion 50 and on the insulating layer 230, and a second inductor wiring 40 is formed on the insulating layer 230, thus forming a fifth laminate 1005. The second inductor wiring 40 and the pad portion 82 are formed, for example, by seed layer formation (sputtering Ti / Cu), resist coating, development, exposure, electroplating, resist stripping, and seed layer etching.

[0117] like Figure 15 as well as Figure 16 As shown, an insulating layer 240 covering the second inductor wiring 40 and the pad portion 82 is formed on the insulating layer 230 of the fifth laminate 1005. A via opening 601 is formed in the insulating layer 240 to form an external terminal 70, thereby forming the sixth laminate 1006. The insulating layer 240 is formed, for example, by coating the insulating layer 230 with an organic resin and curing it. The via opening 601 is formed, for example, by extending along the first direction Z using a laser and exposing the pad portion 82 from the bottom surface. The external terminal 70 is formed, for example, by electroless Ni / Au plating. Before electroless Ni / Au plating, Cu fill plating is performed, thereby enabling the formation of an external terminal 70 without a recess 73.

[0118] By removing the substrate 1000 from the formed sixth-layer stack 1006, monolithization is achieved, thereby manufacturing... Figure 2 as well as Figure 3 The inductor component 1 shown. The substrate 1000 is removed, for example, by grinding or peeling.

[0119] Inductor component 1 can perform the following effects.

[0120] The inductor component 1 includes at least one inductor element 10. The inductor element 10 includes a magnetic layer 20 having uniaxial magnetic anisotropy, a first inductor wiring 30, a second inductor wiring 40, and a first via portion 50. The first inductor wiring 30 is located on one side of the magnetic layer 20 in a first direction and extends along an imaginary plane intersecting the first direction. The second inductor wiring 40 is located on the other side of the magnetic layer 20 in the first direction. The first via portion 50 electrically connects the first inductor wiring 30 and the second inductor wiring 40. The first inductor wiring 30, the second inductor wiring 40, and the first via portion 50 constitute at least a portion of an inductor that rotates about a rotation axis AX extending along a second direction intersecting the first direction. The absolute value of the angle θ between the easy or difficult axis of the magnetic layer 20 and the rotation axis AX is greater than or equal to zero degrees and less than 10 degrees. With this configuration, since most of the magnetic flux is oriented towards the anisotropic axis, the inductance acquisition efficiency and DC superposition characteristics can be improved. Furthermore, the first inductor wiring 30, the second inductor wiring 40, and the first via portion 50 extending along the imaginary plane constitute part of the inductor, thus enabling the inductor component 1 to be easily miniaturized (e.g., thin-film).

[0121] In a configuration where the absolute value of the angle θ between the easy axis and the rotation axis AX is above zero degrees and less than 10 degrees, since most of the magnetic flux passes through the easy axis, the inductance acquisition efficiency of the inductor component 1 can be improved.

[0122] In a configuration where the absolute value of the angle θ between the hard axis and the rotation axis AX is above zero degrees and less than 10 degrees, since most of the magnetic flux passes through the hard axis, the DC superposition characteristics of the inductor component 1 can be improved and the iron loss can be reduced.

[0123] When the magnetic layer 20 is rectangular when viewed along the first direction, the anisotropy axis can be easily controlled by setting the long side direction of the magnetic layer 20 as the easy axis, taking into account the influence of shape magnetic anisotropy.

[0124] The magnetic layer 20 comprises an inorganic insulating layer 21 and an inorganic magnetic layer 22 stacked along a first direction. The dimension, i.e., the thickness T0, of the magnetic layer 20 in the first direction is smaller than the thickness T1 of the first inductor wiring 30 and the thickness T2 of the second inductor wiring 40. With this configuration, eddy currents can be reduced and the Q value of the inductor can be increased.

[0125] The inorganic insulating layer 21 is located at both ends of the magnetic layer 20 in the first direction. With this configuration, reliable insulation between the inductor component 1 and peripheral components such as wiring can be achieved.

[0126] The inductor component 1 includes an external terminal 70, which has a recess 73 recessed toward the magnetic layer 20. With this configuration, the connection area of ​​the external terminal 70 is increased by the recess 73, thereby improving the fixing strength of the external terminal 70.

[0127] The inductor component 1 includes: an insulating layer 220 covering the first inductor wiring 30; and an insulating layer 210 located further away from the magnetic layer 20 in a first direction than the insulating layer 220, and having a smaller coefficient of linear expansion than the insulating layer 220. With this configuration, for example, by connecting the substrate 4 (see reference 1) via the insulating layer 210, it is possible to... Figure 20 This can improve the strength of substrate 4.

[0128] When viewed along the first direction, the magnetic layer 20 is located further inward than the outer shape of the inductor component 1. This configuration, for example, prevents damage to the magnetic layer 20 due to mechanical stress during the cutting process in monolithization. If the magnetic layer 20 stretches due to mechanical stress during cutting, leakage may occur between the stacked magnetic layers 20, increasing iron loss.

[0129] The inductor component 1 can be configured as follows.

[0130] like Figures 17-19 As shown, when viewed along the rotation axis AX, the inductor component 1 may also have a first through-hole portion 50 that overlaps at least partially with the magnetic layer 20. In this case, the magnetic flux can be shielded through the first through-hole portion 50, thus preventing noise leakage to the vicinity of the inductor component 1. Figure 18 As shown, the portion surrounded by the first inductor wiring 30, the second inductor wiring 40, and the first through-hole portion 50 constitutes the core portion 3.

[0131] exist Figures 17-19 In the inductor component 1, when viewed along the first direction Z, one of the two external terminals 70 covers two pad portions 82 located at one end in the second direction Y, and the other of the two external terminals 70 covers two pad portions 82 located at the other end in the second direction Y. Figure 19As shown, the pad portions 81 and 82 located at both ends of the second direction Y have portions 811 and 821 extending along the third direction X. A first via portion 50 connecting the pad portions 81 and 82 located at both ends of the second direction Y is configured to connect portions 811 and 821. Figure 18 as well as Figure 19 As shown, portions 811 and 821 are configured to overlap at least half of the magnetic layer 20 when viewed along the rotation axis AX. Figures 17-19 In the inductor component 1, when viewed along the rotation axis AX, since at least half of the magnetic layer 20 overlaps with the first via portion 50, noise leakage to the vicinity of the inductor component 1 can be prevented more reliably. Figures 17-19 In the inductor component 1, no recess 73 is formed at the external terminal 70.

[0132] It can also be like Figure 20 as well as Figure 21 As shown, the inductor component 1 includes a first through-hole 50 extending through the magnetic layer 20 along a first direction Z. That is, the magnetic layer 20 may have a through-hole 23 capable of accommodating the first through-hole 50. In this case, since the magnetic layer 20 is maximized along the imaginary plane P, the inductance acquisition efficiency of the inductor component 1 can be improved, and leakage flux can be suppressed. Figure 20 as well as Figure 21 In the inductor component 1, the magnetic layer 20 has a plurality of through holes 23 corresponding to all of the first through holes 50. Each through hole 23 is configured to accommodate a first through hole 50 while forming a gap with it. The shape of each through hole 23 is not limited to a rectangle; it can also be a circle or other polygons.

[0133] Figure 20 as well as Figure 21 The inductor component 1 is mounted on the substrate 4. That is, the substrate 4 is connected via the insulating layer 210. The substrate 4 includes, for example, a high-resistivity silicon substrate, a glass substrate, and a ceramic substrate. Terminals 90 capable of being electrically connected to external circuits are formed inside the substrate 4. Figure 20 as well as Figure 21 The inductor component 1 includes a vertical wiring 61 that penetrates the insulating layer 210 along a first direction Z, connecting a pad portion 81 and a terminal 90. That is, Figure 20 as well as Figure 21 The inductor component 1 is configured to be electrically connected to an external circuit via vertical wiring 61 and terminals 90. The vertical wiring 61 can increase the flexibility of the mounting location of the inductor component 1.

[0134] like Figure 22As shown, the inductor component 1 may also have a blank 2 with different surface roughnesses for the first main surface 201 and the second main surface 202. In this case, by performing resin molding on the main surface with the larger surface roughness, the adhesion to the molding material can be improved. Figure 22 In the inductor component 1, the external terminal 70 is located on the first main surface 201, and the blank 2 has a recess 203 extending from the first main surface 201 toward the first direction Z, with the magnetic layer 20 recessed therein. Figure 22 In the inductor component 1, the blank 2 has two recesses 203, but it may also have one recess 203, or more than three recesses 203. As an example, the blank 2 is configured such that the first main surface 201 is located closer to the magnetic layer 20 than the outer terminal 70. Figure 22 In the inductor component 1, since the external terminal 70 is located at the position furthest from the magnetic layer 20, the inductor component 1 can be easily mounted on the substrate 4, etc.

[0135] It can also be like Figures 23-25 As shown, in inductor component 1, external terminal 70 includes a first external terminal 71 and a dummy terminal, i.e., a second external terminal 72, that is not electrically connected to either the first inductor wiring 30 or the second inductor wiring 40. The first external terminal 71 is electrically connected to at least one of the first inductor wiring 30 and the second inductor wiring 40. Figure 23 In the inductor component 1, the magnetic layer 20 is positioned with the long side in the second direction Y and the short side in the third direction X. Two first external terminals 71 and two second external terminals 72 are respectively provided on both sides of the rotation axis AX. In the third direction X, one first external terminal 71 and one second external terminal 72 are opposite each other. Figure 23 In the inductor component 1, the second external terminal 72 includes three terminals 721 having the same shape as the first external terminal 71, and one terminal 722 having a different shape from the first external terminal 71. The terminal 722 is configured to function as a "direction mark" indicating the mounting orientation of the inductor component 1. This configuration improves the mounting strength of the inductor component 1. Furthermore, by making the shape of the second external terminal 72 different from that of the first external terminal 71, the mounting orientation of the inductor component 1 can be easily identified.

[0136] Figures 23-25 The inductor component 1 includes a plurality of inductor elements 10. As an example, Figures 23-25 The inductor component 1 includes two inductor elements 10. Each inductor element 10 constitutes at least a portion of each of the two inductors L1 and L2. Figures 23-25In the inductor component 1, a pair of terminals 711 of the first external terminals 71 are located at both ends of the inductor L1, and a pair of terminals 712 are located at both ends of the inductor L2. In this way, by having multiple inductor elements 10 in one inductor component 1, the mounting area of ​​the inductor component 1 can be reduced.

[0137] The spacing between the first inductor wiring 30 or the second inductor wiring 40 of adjacent inductor elements 10 can also vary along the first inductor wiring or the second inductor wiring 40. This configuration increases the design flexibility of the lead-out position of the external terminal 70. Furthermore, the coupling coefficient can be adjusted. For example, in Figures 23-25 In the inductor component 1, the spacing between the two ends of the second inductor wiring 40 of the adjacent inductor element 10 in the second inductor wiring 40 in the second direction Y is different along the direction in which the second inductor wiring 40 extends (e.g., the third direction X). In other words, two adjacent second inductor wirings 40 are not parallel to each other. Figures 23-25 The external terminals 70 of the inductor component 1 are configured to be asymmetrical relative to the center point CP of the blank 2 when viewed along the first direction Z.

[0138] like Figures 26-29 As shown, the inductor component 1 can also have 2N (N is a natural number) inductor elements 10. Figures 26-29 In the inductor component 1, the inductor component 1 includes four inductor elements 10. Each inductor element 10 constitutes at least a portion of each of the four inductors L1 to L4. Figures 26-29 In the inductor component 1, a pair of terminals 711 of the first external terminals 71 are located at both ends of inductor L1, a pair of terminals 712 are located at both ends of inductor L2, a pair of terminals 713 are located at both ends of inductor L3, and a pair of terminals 714 are located at both ends of inductor L4. Figures 26-29 In the inductor component 1, inductors L1 and L2 rotate about rotation axis AX1, and inductors L3 and L4 rotate about rotation axis AX2. Rotation axes AX1 and AX2 extend parallel (or substantially parallel) at intervals along a third direction X. Thus, by arranging N (=2) inductors L1 and L2 about one rotation axis AX1 and N (=2) inductors L3 and L4 about the other rotation axis AX2, the symmetry of the inductor component 1 can be ensured, and internal stress within the components can be suppressed. For example, if two inductors are arranged about one rotation axis AX1 and one inductor about the other rotation axis AX2, the space of the magnetic layer 20 is sometimes wasted. Therefore, by having 2N (N is a natural number) inductor elements 10 in the inductor component 1, the space of the magnetic layer can be effectively utilized.

[0139] exist Figures 26-29In the inductor component 1, as an example, the magnetic layer 20 includes a through hole 24 disposed in its center and extending along a first direction Z. Figure 29 As shown, the through hole 24 is configured to accommodate two first through holes 50. The magnetic layer 20 is annular as a whole, and each inductor L1, L2, L3, L4 rotates about rotation axes AX1 and AX2 extending along the long side direction (e.g., the second direction Y) of the magnetic layer 20. With this configuration, an inductor component 1 with low leakage flux can be realized.

[0140] exist Figures 26-29 In the inductor component 1, as an example, the coupling coefficient of the first inductor (e.g., inductors L1, L2) is configured to be larger than the coupling coefficient of the second inductor (e.g., inductors L3, L4). Ripple can be suppressed by enhancing coupling, and by combining with inductors with weak coupling to form a multiphase circuit, the efficiency of the DC-DC converter can be improved.

[0141] It can also be like Figure 30 As shown, the inductor component 1 is configured as follows: the magnetic layer 20 has a first end portion 25 facing the first through-hole portion 50 in the third direction X, and the first through-hole portion 50 has a second end portion 51 facing the magnetic layer 20 in the third direction X. The first end portion 25 and the second end portion 51 are inclined in the same direction relative to the first direction Z. With this configuration, the first end portion 25 of the magnetic layer 20 and the second end portion 51 of the first through-hole portion 50 can be brought close together, thus enabling miniaturization of the inductor. In addition, by bringing the first end portion 25 of the magnetic layer 20 close together with the second end portion 51 of the first through-hole portion 50, the volume of the magnetic layer 20 can be increased, thereby improving the inductance efficiency. "Inclined in the same direction" means, for example, in a cross-sectional view including the first direction Z and the third direction X, that the angle θ0 formed by the extension line of the first end portion 25 and the extension line of the second end portion 51 is in the range of zero degrees or more and less than 45 degrees.

[0142] The magnetic layer 20 can be tilted at only one end in the third direction X, or at both ends in the third direction X. The magnetic layer 20 is tilted at both ends in the third direction X (i.e., the magnetic layer 20 has a first end 25 at each end in the third direction X). Furthermore, assume that it is stacked in the order of the first inductor wiring 30 and the second inductor wiring 40. In this case, in a cross-sectional view including the first direction Z and the third direction X, the magnetic layer 20 has a trapezoidal shape, in which the end near the first inductor wiring 30 at both ends of the first direction Z is the long side, and the end near the second inductor wiring 40 is the short side. The first via portion 50 has a trapezoidal shape in which the long and short sides are opposite to those of the magnetic layer 20 (in other words, an inverted trapezoidal shape). When the first via portion 50 has an inverted trapezoidal shape relative to the magnetic layer 20, the adhesion uniformity of the seed layer is good. In this case, because the magnetic layer 20 has a trapezoidal shape, the distance between the magnetic layer 20 and the first via portion 50 can be easily maintained, easily ensuring insulation. The stacking order of the first inductor wiring 30 and the second inductor wiring 40 can be identified based on the orientation of the seed layer or the shape of the first inductor wiring 30 and the second inductor wiring 40.

[0143] When the inclination angle between the second end 51 of the first via 50 and the first end 25 of the magnetic layer 20 is small, the size of the first via 50 can be reduced, thus increasing the volume of the magnetic layer 20. When the inclination angle between the second end 51 of the first via 50 and the first end 25 of the magnetic layer 20 is large, and the first via 50 has an inverted trapezoidal shape, the adhesion uniformity of the seed layer can be improved. When the inclination angle between the second end 51 of the first via 50 and the first end 25 of the magnetic layer 20 is large, and the first via 50 has a trapezoidal shape, the first via 50 becomes an anchor, thus improving the adhesion strength between the first via 50 and the first inductor wiring 30. As an example, the inclination angle is defined as the angle relative to an imaginary straight line extending along the first direction Z.

[0144] For example, if the etching rates of the inorganic insulating layer 21 and the inorganic magnetic layer 22 are different, the first end 25 of the magnetic layer 20 may have a stepped shape. In this case, for example, the least squares method is used to calculate an imaginary straight line connecting the edges of the inorganic magnetic layer 22. The calculated imaginary straight line is considered as the first end 25, and the tilt angle of the first end 25 is calculated.

[0145] Reference Figure 31 as well as Figure 32 An example of a method for forming a magnetic layer 20 with a trapezoidal shape having first end 25 at both ends in a third direction X (forming Figure 30 An example of the method for the inductor component 1 will be described.

[0146] like Figure 31 As shown, a cone-shaped resist 310 is formed on the magnetic layer 20 of the third stack 1003. The cone shape refers to a shape that tapers along the first direction Z from the first inductor wiring 30 toward the second inductor wiring 40. If the resist 310 and the magnetic layer 20 are etched by dry etching, the resist 310 retreats, and... Figure 31 The magnetic layer 20 is etched in the direction indicated by the arrow to form... Figure 32 The trapezoidal magnetic layer 20 is shown.

[0147] Reference Figure 33 as well as Figure 34 An example of a method for forming a magnetic layer 20 with a first end 25 at both ends in a third direction X (the inclination direction of the first end 25 in the magnetic layer 20 is the same as...) Figure 30 An example of the method of the opposite inductor component 1 will be described. In this case, the first end 25 is inclined away from the first via portion 50 as it moves along the first direction Z from the second inductor wiring 40 toward the first inductor wiring 30.

[0148] like Figure 33 As shown, a resist 320 with a generally rectangular cross-sectional shape is formed on the magnetic layer 20 of the third stack 1003. If wet etching is performed on the resist 320 and the magnetic layer 20, the etching proceeds from the portion where liquid displacement is easily achieved towards the inclined direction (…). Figure 33 (As indicated by the middle arrow) Etching magnetic layer 20 to form Figure 34 The magnetic layer 20 is shown in the shape of an inverted trapezoid.

[0149] The inductor component 1 only needs to have at least one inductor element 10.

[0150] The inductor component 1 is not limited to having an external terminal 70 located on the first main surface 201 of the blank 2. It may also have an external terminal 70 located on the second main surface 202 of the blank 2, or it may have external terminals 70 located on both the first main surface 201 and the second main surface 202 of the blank 2.

[0151] The magnetic layer 20 is not limited to the case of comprising an inorganic insulating layer 21 and an inorganic magnetic layer 22 stacked along the first direction. For example, the magnetic layer 20 may also be constructed using a composite material of resin and magnetic filler. In this case, the resin may include, for example, epoxy resin, polyimide, acrylic acid, phenol, and combinations thereof. The magnetic filler may include, for example, FeSiCr-based, FeNi-based, FeSi-based, pure Fe-based, and combinations thereof.

[0152] Magnetic layer 20 can also be along the first imaginary plane P1 (refer to...) Figure 3 The first imaginary plane P1 is a plane (e.g., an XY plane) extending in a direction intersecting the height direction (e.g., the first direction Z) of the blank 2, located at the boundary between the insulating layer 220 and the insulating layer 230. In this case, the magnetic layer 20 has a planar portion 26 extending along the first imaginary plane P1. The planar portion 26 is configured to have a roughness of 3 nm or more and 10 nm or less. Figure 3 As shown, the first inductor wiring 30 is disposed along the second imaginary plane P2. The second imaginary plane P2 is arranged at a distance from the first imaginary plane P1 in the first direction Z and extends parallel to the first imaginary plane P1. "Parallel" includes "approximately parallel". With this configuration, the adhesion of the magnetic layer 20 can be ensured, and the inductance acquisition efficiency can be improved. For example, when the roughness of the planar portion 26 of the magnetic layer 20 is less than 3 nm, the contact area of ​​the magnetic layer 20 becomes smaller, and its adhesion decreases. When the roughness of the planar portion 26 of the magnetic layer 20 is greater than 10 nm, the crystalline structure of the magnetic material contained in the magnetic layer 20 is randomly arranged, the uniaxial magnetic anisotropy of the magnetic layer 20 is destroyed, and the inductance acquisition efficiency cannot be improved.

[0153] "Roughness" is, for example, the arithmetic surface roughness Ra obtained within a 10 μm range of the planar portion 26. For example, the arithmetic surface roughness Ra is obtained using a Keyence VK-X1000 laser microscope according to JIS B0601. If it is difficult to obtain the roughness from the vertical direction of the planar portion 26, the line roughness (LER) obtained from the vertical cross-section of the planar portion 26 can also be used as the "roughness" of the planar portion 26.

[0154] This disclosure allows for the appropriate combination of the various embodiments described above, as well as any embodiments and / or modifications. Combinations of embodiments and / or modifications also include combinations of the configurations included in the embodiments and / or the configurations included in the examples.

[0155] While referring to the appendix Figure 1 This disclosure has been fully described through the above-described embodiments and / or modifications, but the above-described embodiments and / or modifications do not cover the entirety of this disclosure. Many modifications and variations can be made by those skilled in the art. Such modifications and variations should be understood as being included in this disclosure as long as they do not depart from its scope.

[0156] Explanation of reference numerals in the attached figures

[0157] 1…Inductor component; 2…Bulkhead; 201…First main surface; 202…Second main surface; 203…Recess; 210, 220, 230, 240…Insulating layers; 3…Core; 4…Substrate; 10…Inductor element; 20…Magnetic layer; 21…Inorganic insulating layer; 22…Inorganic magnetic layer; 23, 24…Through hole; 25…First end; 30…First inductor wiring; 40…Second inductor wiring; 50…First through hole portion; 51…Second end; 60…Second through hole portion; 61…Vertical wiring; 70…External terminal; 71…First external terminal; 711, 712, 713, 714…Terminals; 72…Second external terminal; 721, 722…Terminals; 73…Recess; 81, 82…Pad portion; 811, 821…Partial portion; 90…Terminal; 501, 601…Through hole opening; 1000…Substrate; 1001…First laminate; 1002…Second laminate; 1003…Third laminate; 1004…Fourth laminate; 1005…Fifth laminate; 1006…Sixth laminate

Claims

1. An inductor component, wherein, It has at least one inductor element. The aforementioned inductor element includes: The magnetic layer exhibits uniaxial magnetic anisotropy. The first inductor wiring is located on one side of the aforementioned magnetic layer in the first direction and extends along an imaginary plane intersecting the aforementioned first direction. The second inductor wiring is located on the other side of the magnetic layer in the first direction. as well as The first through-hole portion electrically connects the wiring of the first inductor and the wiring of the second inductor. The aforementioned first inductor wiring, the aforementioned second inductor wiring, and the aforementioned first via portion constitute at least a portion of an inductor that rotates about a rotation axis extending along a second direction intersecting the aforementioned first direction. The absolute value of the angle between the difficult or easy axis of the aforementioned magnetic layer and the aforementioned rotation axis is greater than zero degrees and less than 10 degrees.

2. The inductor component according to claim 1, wherein, The absolute value of the angle between the aforementioned difficult axis and the aforementioned rotation axis is greater than zero degrees and less than 10 degrees.

3. The inductor component according to claim 1 or 2, wherein, The aforementioned magnetic layer has a rectangular shape when viewed along the first direction. The aforementioned easy axis extends along the long side of the aforementioned magnetic layer.

4. The inductor component according to any one of claims 1 to 3, wherein, The aforementioned magnetic layer comprises an inorganic insulating layer and an inorganic magnetic layer stacked along the aforementioned first direction. The dimension, i.e. the thickness, of the magnetic layer in the first direction is smaller than the thickness of the first inductor wiring and the thickness of the second inductor wiring.

5. The inductor component according to any one of claims 1 to 4, wherein, It has an external terminal with a recess that is recessed toward the magnetic layer.

6. The inductor component according to any one of claims 1 to 5, wherein, When viewed along the aforementioned axis of rotation, at least a portion of the first through-hole overlaps with the aforementioned magnetic layer.

7. The inductor component according to claim 6, wherein, When viewed along the aforementioned axis of rotation, more than half of the aforementioned magnetic layer overlaps with the aforementioned first through-hole portion.

8. The inductor component according to any one of claims 1 to 7, wherein, The first through hole penetrates the magnetic layer along the first direction.

9. The inductor component according to any one of claims 1 to 8, wherein, have: A first insulating layer covers the wiring of the first inductor; and The second insulating layer is located in the first direction at a position farther away from the magnetic layer than the first insulating layer, and its coefficient of linear expansion is smaller than that of the first insulating layer.

10. The inductor component according to claim 9, wherein, It has vertical wiring configured to penetrate the second insulating layer along the first direction, and is capable of being electrically connected to an external circuit.

11. The inductor component according to any one of claims 1 to 10, wherein, The blank includes a first main surface and a second main surface located at both ends in the first direction, and is provided with the magnetic layer, the first inductor wiring, the second inductor wiring, and the first through hole. An external terminal is provided on at least one of the first main surface and the second main surface, and the external terminal is electrically connected to at least one of the first inductor wiring and the second inductor wiring. The surface roughness of the first main surface and the second main surface are different.

12. The inductor component according to claim 11, wherein, The aforementioned external terminals are located on the aforementioned first main surface. The aforementioned blank has a recess extending from the aforementioned first main surface toward the aforementioned first direction, with the aforementioned magnetic layer recessed therein. The first main surface is located closer to the magnetic layer than the external terminal.

13. The inductor component according to any one of claims 1 to 12, wherein, When viewed along the first direction, the magnetic layer is located closer to the inside than the outer shape of the inductor component.

14. The inductor component according to any one of claims 1 to 13, wherein, Equipped with external terminals, The aforementioned external terminals include: a first external terminal electrically connected to at least one of the first inductor wiring and the second inductor wiring; and a second external terminal serving as a dummy terminal, not electrically connected to either the first inductor wiring or the second inductor wiring. The second external terminal has a different shape than the first external terminal.

15. The inductor component according to any one of claims 1 to 14, wherein, It has multiple of the above-mentioned inductor components.

16. The inductor component according to claim 15, wherein, The spacing of the first inductor wiring or the second inductor wiring of adjacent inductor elements differs along the direction in which the first inductor wiring or the second inductor wiring extends.

17. The inductor component according to claim 15 or 16, wherein, It has 2N of the above-mentioned inductor elements, where N is a natural number.

18. The inductor component according to any one of claims 1 to 17, wherein, The magnetic layer includes a through hole located in its center and extending along the first direction.

19. The inductor component according to any one of claims 15 to 18, wherein, As the aforementioned rotation axis, it includes a first rotation axis and a second rotation axis that is parallel to the first rotation axis and does not overlap with the first rotation axis. The system comprises a plurality of first inductors and a plurality of second inductors, wherein the plurality of first inductors rotate about a first rotation axis and the plurality of second inductors rotate about a second rotation axis. The coupling coefficient of the first inductor is larger than that of the second inductor.

20. The inductor component according to any one of claims 1 to 19, wherein, The magnetic layer has a first end portion that faces the first through-hole portion in a third direction intersecting the first direction and the second direction. The first through-hole portion has a second end portion that faces the magnetic layer in the third direction. The first end and the second end are inclined in the same direction relative to the first direction.

21. The inductor component according to any one of claims 1 to 20, wherein, The magnetic layer is disposed along a first imaginary plane intersecting the first direction described above. The aforementioned first inductor wiring is arranged at intervals from the aforementioned first imaginary plane in the aforementioned first direction, and is arranged along a second imaginary plane parallel to the aforementioned first imaginary plane. The roughness of the planar portion of the magnetic layer located on the first imaginary plane is 3 nm or more and 10 nm or less.

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