Organic light emitting display device

By using a three-dimensional pixel design and a three-dimensional structural spacing, the manufacturing challenges of high-precision, high-resolution organic light-emitting display devices have been solved, achieving efficient pixel spacing and high-brightness display, reducing costs and improving lifespan and luminous efficiency.

CN122123162APending Publication Date: 2026-05-29YASHI ELECTRONIC TECH CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
YASHI ELECTRONIC TECH CO LTD
Filing Date
2024-11-18
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing technologies for manufacturing high-precision and high-resolution organic light-emitting display devices using FMM (fine metal mask) suffer from problems such as high difficulty, low yield, high cost, and short lifespan. Furthermore, as resolution increases, pixel spacing narrows, resulting in low lifetime luminous efficiency.

Method used

The pixel design employs a three-dimensional structure, including a first sub-pixel, a second sub-pixel, and a third sub-pixel, which are respectively configured on different sides and surfaces of the three-dimensional structure. By utilizing the spacing and insulating layer between the three-dimensional structures, the use of FMM is avoided, thereby improving process freedom and yield.

Benefits of technology

It achieves high-precision and high-resolution display, reduces manufacturing costs, improves lifespan luminous efficiency, avoids lateral current leakage between pixels, and enhances image quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

An organic light emitting display device can include a plurality of stereoscopic structures on a substrate and a plurality of pixels on the substrate. The plurality of pixels can each include a first sub-pixel, a second sub-pixel, and a third sub-pixel having a three-dimensional structure. The first sub-pixel can be disposed on a first side surface of the stereoscopic structure, and the second sub-pixel can be disposed on a second side surface of the stereoscopic structure. The second sub-pixel can be disposed horizontally overlapping the first sub-pixel, and the third sub-pixel can be disposed on the first sub-pixel and the second sub-pixel. The first sub-pixel can include a first organic light emitting member, the second sub-pixel can include a second organic light emitting member, and the third sub-pixel can include a third organic light emitting member.
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Description

Technical Field

[0001] The embodiments relate to an organic light-emitting display device. Background Technology

[0002] Recently, as society has entered a fully information-based era, interest in information displays capable of processing and displaying large amounts of information is increasing. Furthermore, the display industry is experiencing rapid development due to the growing demand for portable information media. Therefore, various lightweight and thin flat panel display devices are attracting considerable attention.

[0003] Among these flat panel display devices, organic light-emitting displays (OLEDs) have attracted considerable attention. OLEDs are being actively developed for use in head-mounted displays (HMDs) that are installed close to the human eye. HMDs are worn in the form of helmets or glasses and can realize virtual reality (VR) or augmented reality (AR).

[0004] HMDs feature high-resolution, miniature OLEDs. High-resolution miniature OLEDs utilize organic light-emitting elements (OLEDs) arranged on driving circuits formed using wafer-based semiconductor processes. On the other hand, glasses-style HMDs require brighter, more vivid images within a very small screen size. Therefore, brightness and light extraction efficiency must be maximized starting from the OLEDs themselves. Furthermore, it is necessary to suppress light leakage between pixels to improve image quality. Technologies for improving light extraction efficiency applicable to ultra-high resolution are expected to be extended to the large-screen display industry, including mobile devices and IT equipment.

[0005] On the one hand, in the prior art, in order to deposit the organic light-emitting layer constituting the organic light-emitting element by sub-pixel, an FMM (fine metal mask) is used as a pattern mask for deposition.

[0006] However, when manufacturing high-resolution (e.g., 500 PPI or higher) or large-area (e.g., 8th generation or higher) display devices, forming organic light-emitting layers per subpixel using a f-MM is quite difficult. Furthermore, there are limitations to further increasing the resolution when using a f-MM. Additionally, using a f-MM results in reduced yield and increased manufacturing costs. Moreover, optimizing the deposition process is difficult, and product lifespan is shortened.

[0007] Meanwhile, recently, with the increase in display resolution, pixel resolution (ppi) has also increased, and the spacing between pixels (or subpixels) is gradually narrowing. Furthermore, with the improvement in the efficiency of light-emitting materials used in organic light-emitting elements, high brightness can be achieved with low current and voltage, offering the advantage of reduced power consumption.

[0008] However, even with higher resolution displays, the problem of low lifetime luminous efficiency persists. Lifetime luminous efficiency can be defined as the ratio of lifetime or brightness to the luminous area ratio. For example, from a product perspective, an increase in the luminous area ratio can mean an increase in brightness relative to the same lifetime, an increase in lifetime relative to the same brightness, or an increase in both lifetime and brightness. Summary of the Invention

[0009] Technical problems to be solved The purpose of these embodiments is to solve the aforementioned problems and other issues.

[0010] Another objective of the embodiments is to provide a high-precision and high-resolution organic light-emitting display device.

[0011] Another objective of the embodiments is to provide an organic light-emitting display device that does not use FFM.

[0012] Another objective of the embodiments is to provide an organic light-emitting display device that can improve image quality.

[0013] The technical problems to be solved by the embodiments are not limited to those described in this project, but include those that can be understood through the invention.

[0014] Technical solution To achieve the above or other objectives, according to one aspect of an embodiment, an organic light-emitting display device includes: a plurality of three-dimensional structures on a substrate; and a plurality of pixels on the substrate, each of the plurality of pixels including a first sub-pixel, a second sub-pixel, and a third sub-pixel having a three-dimensional structure, the first sub-pixel being disposed on a first side of the three-dimensional structure, the second sub-pixel being disposed on a second side of the three-dimensional structure, the second sub-pixel being horizontally overlapping the first sub-pixel, and the third sub-pixel being disposed on the first sub-pixel and the second sub-pixel, the first sub-pixel including a first organic light-emitting element, the second sub-pixel including a second organic light-emitting element, and the third sub-pixel including a third organic light-emitting element.

[0015] The third sub-pixel can be configured on the upper surface of the three-dimensional structure.

[0016] The second organic light-emitting element can be configured to horizontally overlap with the first organic light-emitting element, and the third organic light-emitting element can be configured on the upper surface of the three-dimensional structure.

[0017] The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element may each include an anode electrode, a low-resistivity layer, an organic light-emitting layer, and a cathode electrode.

[0018] The anode electrode can be independently configured in the first sub-pixel, the second sub-pixel, and the third sub-pixel.

[0019] The low-resistance layer of the first organic light-emitting element and the low-resistance layer of the second organic light-emitting element may be spaced apart and disposed between the plurality of three-dimensional structures. The first organic light-emitting layer of the first organic light-emitting element and the second organic light-emitting layer of the second organic light-emitting element may be disposed vertically overlapping between the plurality of three-dimensional structures.

[0020] The low-resistance layer, organic light-emitting layer, and cathode electrode of the first organic light-emitting element and the low-resistance layer, organic light-emitting layer, and cathode electrode of the second organic light-emitting element can be spaced apart from each other and disposed on the upper surface of the three-dimensional structure.

[0021] The first anode electrode of the first organic light-emitting element and the second anode electrode of the second organic light-emitting element may include reflective metal. The first cathode electrode of the first organic light-emitting element and the second cathode electrode of the second organic light-emitting element may include transparent or translucent conductive films.

[0022] The third sub-pixel can be disposed between the plurality of 3D structures on the first sub-pixel and the second sub-pixel.

[0023] The size of the pixel can be the same as the size of the third sub-pixel.

[0024] The size of the pixel can be equal to the sum of the size of the first sub-pixel and the size of the second sub-pixel.

[0025] The second organic light-emitting element can be configured to horizontally overlap with the first organic light-emitting element. The third organic light-emitting element can be configured to vertically overlap with both the first and second organic light-emitting elements.

[0026] The first, second, and third organic light-emitting elements may each include an anode electrode, an organic light-emitting layer, and a cathode electrode. The anode electrode may be independently disposed in the first, second, and third sub-pixels. The cathode electrode may be jointly disposed in the first and second sub-pixels.

[0027] The first sub-pixel, the second sub-pixel, and the third sub-pixel may each include a light-emitting region and a non-light-emitting region, and the light-emitting region may have a size corresponding to the anode electrode.

[0028] The size of the third anode electrode of the third organic light-emitting element can be larger than the size of the first anode electrode of the first organic light-emitting element or the size of the second anode electrode of the second organic light-emitting element.

[0029] The third anode electrode of the third organic light-emitting element can be vertically overlapped with the first anode electrode of the first organic light-emitting element and the second anode electrode of the second organic light-emitting element.

[0030] The ends of the organic light-emitting layers of the first organic light-emitting element and the second organic light-emitting element may be lower than the upper surface of the three-dimensional structure.

[0031] The organic light-emitting display device may include a plurality of first dikes between the plurality of three-dimensional structures; and a plurality of second dikes between the plurality of third sub-pixels.

[0032] The distance between the plurality of second dikes can be the same as the width of the pixel or the width of the third sub-pixel.

[0033] The organic light-emitting display device may include a first organic light-emitting element, a second organic light-emitting element and a third organic light-emitting element, and a plurality of insulating layers may include at least one organic insulating layer and at least one inorganic insulating layer.

[0034] The first and second sides of the three-dimensional structure can be tilted to the ground or perpendicular to the ground.

[0035] Beneficial effects The effects of the organic light-emitting display device according to the embodiment are explained below.

[0036] According to at least one of the embodiments, the first sub-pixel, the second sub-pixel, and the third sub-pixel constituting the pixel are configured in three dimensions, thereby further reducing the size of the pixel and having the advantage of enabling high-precision, ultra-high-resolution displays.

[0037] According to at least one of the embodiments, the first sub-pixel, the second sub-pixel, and the third sub-pixel constituting the pixel are configured in three dimensions, and the size of the blue sub-pixel is increased to the size of the pixel to significantly increase the light-emitting area, thereby improving the lifetime luminescence rate.

[0038] According to at least one of the embodiments, since the organic light-emitting material constituting the third organic light-emitting layer is deposited on the entire area of ​​the substrate, no additional mask is required, thereby providing the advantages of increased process freedom and increased yield.

[0039] According to at least one of the embodiments, since the first sub-pixel and the second sub-pixel are disposed on the first side and the second side of the stereoscopic structure, they have the advantage of achieving high precision and high resolution without reducing the light-emitting area of ​​each of the first and second sub-pixels. Furthermore, by utilizing the stereoscopic structure and disposing the first and second sub-pixels on the first and second side of the stereoscopic structure, high precision (e.g., 500 PPI or higher) or large area (e.g., 8th generation or higher) displays can be achieved without the need for an femto-metal mask (FMM). Since no additional deposition pattern mask as an FMM is used, manufacturing costs can be significantly reduced.

[0040] According to at least one of the embodiments, the low-resistance layers of the first organic light-emitting element and the second organic light-emitting element can be cut off on the first dam between the three-dimensional structures or on the upper surface of the three-dimensional structure, thereby having the advantage of preventing lateral current leakage between the first sub-pixel and the second sub-pixel. The low-resistance layer may, for example, include a hole injection layer, a charge generation layer, etc.

[0041] The additional scope of application possibilities of the embodiments will become apparent from the following detailed description. However, those skilled in the art will clearly understand that various modifications and alterations are possible within the spirit and scope of the embodiments; therefore, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are provided only as examples. Attached Figure Description

[0042] Figure 1 This is a plan view of an organic light-emitting display device according to a first embodiment.

[0043] Figure 2 A cross-sectional view of the organic light-emitting display device according to the first embodiment is shown.

[0044] Figure 3 The stacked structure of each organic light-emitting element is shown.

[0045] Figure 4 The design structure of the three-dimensional structure and the design structure of the second evaporation source device are shown in outline.

[0046] Figure 5A and Figure 5B The diagram shows the configuration of the first organic light-emitting element and the second organic light-emitting element disposed on the first embankment between the three-dimensional structures according to the comparative example and the embodiment.

[0047] Figure 6A and Figure 6BThe first organic light-emitting element and the second organic light-emitting element according to the comparative example and embodiment are shown in the form of the first organic light-emitting element and the second organic light-emitting element disposed on the upper surface of the three-dimensional structure.

[0048] Figure 7 A cross-sectional view of an organic light-emitting display device according to a second embodiment is shown.

[0049] Figure 8 This is a plan view of an organic light-emitting display device according to a second embodiment.

[0050] Figure 9 This is a cross-sectional view of an organic light-emitting display device according to a third embodiment.

[0051] Figures 10A to 10C The manufacturing process according to a first embodiment for preventing transverse current leakage is shown.

[0052] Figures 11A to 11C The manufacturing process according to a second embodiment for preventing transverse current leakage is shown.

[0053] Figure 12 The diagram shows the configuration of an additional embankment on the upper surface of a three-dimensional structure.

[0054] Figures 13A to 13D The manufacturing process of the additional embankment disposed on the upper surface of the three-dimensional structure is shown.

[0055] Figure 14 This is a cross-sectional view of an organic light-emitting display device according to a fourth embodiment.

[0056] Figure 15 Show Figure 14 The path of light in region L.

[0057] The size, shape, and values ​​of the constituent elements shown in the accompanying drawings may differ from the actual figures. Furthermore, even if the same constituent element is shown in the accompanying drawings with different sizes, shapes, and values, it is merely an example in the accompanying drawings, and for the same constituent element, the figures may have the same size, shape, and values. Detailed Implementation

[0058] The embodiments disclosed in this specification will now be described in detail with reference to the accompanying drawings. Regardless of the drawing numbers, the same or similar constituent elements are given the same reference numerals, and repeated descriptions of them are omitted. The suffixes "module" and "part" used for constituent elements in the following specification are assigned or used interchangeably for the sake of brevity in writing the specification, and do not necessarily have different meanings or functions. Furthermore, the drawings are provided to facilitate a clearer understanding of the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited by the drawings. Additionally, when a constituent element such as a layer, region, or substrate is described as existing "on" other constituent elements, this includes elements that can exist directly on other constituent elements or where other intermediate elements exist between them.

[0059] The following description is limited to displays with an upper light emission method, but the embodiments can also be applied to displays with a lower light emission method. An organic light-emitting display device with an upper light emission method emits light in an upward direction, i.e., forward, to display an image. An organic light-emitting display device with a lower light emission method emits light in a downward direction, i.e., rearward, to display an image.

[0060] Figure 1 This is a plan view of an organic light-emitting display device according to a first embodiment.

[0061] like Figure 1 As shown, the organic light-emitting display device according to the embodiment may include a plurality of pixels P arranged on a substrate 100.

[0062] The substrate 100 may include a display area and a non-display area surrounding the display area. A plurality of pixels P may be disposed on the display area. Driving devices such as gate driving and data driving may be disposed on the non-display area, but are not limited thereto. The plurality of pixels P may be arranged along a first direction X. The plurality of pixels P may be arranged along a second direction Y. The plurality of pixels P may be arranged in a matrix. The first direction X may be horizontal or transverse, and the second direction Y may be vertical or longitudinal.

[0063] Each pixel P may include multiple sub-pixels SPr, SPg, and SPb. Each pixel P may include at least three sub-pixels SPr, SPg, and SPb of different colors. Although not shown, pixel P may also include a colorless transparent area for achieving transparent display.

[0064] Each pixel P may include a first sub-pixel SPr, a second sub-pixel SPg, and a third sub-pixel SPb. In this case, the first sub-pixel SPr may be a red sub-pixel, the second sub-pixel SPg may be a green sub-pixel, and the third sub-pixel SPb may be a blue sub-pixel.

[0065] exist Figure 1In the diagram, a pixel P is defined that is configured along the first direction X in the order of second sub-pixel SPg, third sub-pixel SPb, and first sub-pixel SPr. However, it is also possible to configure it along the first direction X in the order of first sub-pixel SPr, second sub-pixel SPg, and third sub-pixel SPb, or in the order of third sub-pixel SPb, first sub-pixel SPr, and second sub-pixel SPg.

[0066] At this point, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can overlap each other without being perpendicular.

[0067] As a first example, multiple sub-pixels SPr, SPg, and SPb can be separated along the second direction Y by more than one pixel P unit or row line unit. For example, the first sub-pixel SPr can be separated along the second direction Y by more than one pixel P unit or row line unit, the second sub-pixel SPg can be separated along the second direction Y by more than one pixel P unit or row line unit, and the third sub-pixel SPb can be separated along the second direction Y by more than one pixel P unit or row line unit.

[0068] As a second example, multiple sub-pixels SPr, SPg, and SPb can be arranged in a strip along the second direction Y. In the strip structure, each of the multiple sub-pixels SPr, SPg, and SPb can be arranged continuously without separation along the second direction Y. For example, the second sub-pixel SPg can be arranged continuously along the second direction Y, the first sub-pixel SPr can be arranged continuously along the second direction Y, and the third sub-pixel SPb can be arranged continuously along the second direction Y.

[0069] On one hand, in the first and second examples, the second sub-pixel SPg, the first sub-pixel SPr, and the third sub-pixel SPb can be arranged alternately along the first direction X using column line units. That is, in the embodiments, the second sub-pixel SPg, the first sub-pixel SPr, and the third sub-pixel SPb with different colors can be arranged in a side-by-side structure along the first direction X. In the side-by-side structure, it is very important to achieve high precision and high resolution without reducing their respective light-emitting areas.

[0070] On the other hand, such as Figure 1 As shown, in this embodiment, multiple pixels P may include a first sub-pixel SPr, a second sub-pixel SPg, and a third sub-pixel SPb, each having a three-dimensional structure. That is, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be arranged in three dimensions to form pixel P. Specifically, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be arranged horizontally or vertically relative to each other to form pixel P.

[0071] For example, the second sub-pixel SPg can be configured to horizontally overlap with the first sub-pixel SPr, and the third sub-pixel SPb can be configured to vertically overlap with both the first sub-pixel SPr and the second sub-pixel SPg.

[0072] As described below, the first sub-pixel SPr and the second sub-pixel SPg can be configured on the first side SS1 and the second side SS2 of the stereo structure 130. Therefore, the first sub-pixel SPr and the second sub-pixel SPg can achieve high precision and high resolution without reducing their respective light-emitting areas. Furthermore, since the first sub-pixel SPr and the second sub-pixel SPg can be configured on the first side SS1 and the second side SS2 of the stereo structure 130 even without using an FMM, high-precision (e.g., 500 PPI or higher) displays or large-area (e.g., 8th generation or higher) displays can be achieved. Because no additional deposition pattern mask such as an FMM is used, manufacturing costs can be significantly reduced.

[0073] On one hand, the first sub-pixel SPr can emit a first color light, the second sub-pixel SPg can emit a second color light, and the third sub-pixel SPb can emit a third color light. Therefore, by using the first color light, the second color light, and the third color light, according to the unit pixel P, a full-color image can be displayed. For example, the first color light can be red light, the second color light can be green light, and the third color light can be blue light, but it is not limited to these.

[0074] According to an embodiment, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be configured in three dimensions to form pixel P, thereby further reducing the size of pixel P and achieving high-definition and ultra-high-resolution display.

[0075] On the other hand, such as Figure 1 As shown, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb each include luminous regions EAr, EAG, and EAb, as well as non-luminous regions. The luminous regions EAr, EAG, and EAb are the areas that emit light of the corresponding colors; the wider the luminous regions EAr, EAG, and EAb, the greater the lifetime luminous efficiency. The non-luminous regions can be the remaining areas in the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb, excluding the luminous regions EAr, EAG, and EAb.

[0076] The first light-emitting area EAr of the first sub-pixel SPr, the second light-emitting area EAG of the second sub-pixel SPg, and the third light-emitting area EAB of the third sub-pixel SPb can overlap each other without being perpendicular.

[0077] [First Embodiment] Figure 2 A cross-sectional view of the organic light-emitting display device according to the first embodiment is shown. Figure 2 In order to be in Figure 1 A cross-sectional view taken along line A-A' in an organic light-emitting display device.

[0078] Reference Figure 1 as well as Figure 2 The organic light-emitting display device according to the first embodiment may include: a substrate 100; a plurality of driving circuits 101r, 101g, 101b; a protective layer 110; a plurality of three-dimensional structures 130; a plurality of dams 120, 125; a plurality of organic light-emitting elements 140r, 140g, 140b; and a plurality of insulating layers 150-153, 160, 161, etc.

[0079] Multiple pixels P can be disposed on the substrate 100. Each of the multiple pixels P may include a first sub-pixel SPr, a second sub-pixel SPg, and a third sub-pixel SPb, each having a three-dimensional structure.

[0080] As described above, to achieve high-definition and ultra-high-resolution displays, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be configured in three dimensions. The third sub-pixel SPb can be configured on the first sub-pixel SPr and vertically overlap with it. The third sub-pixel SPb can be configured on the second sub-pixel SPg and vertically overlap with it.

[0081] Multiple driving circuits 101r, 101g, and 101b can be disposed on the substrate 100, and a protective layer 110 can be disposed on the multiple driving circuits 101r, 101g, and 101b.

[0082] The substrate 100 may be a substrate with rigid, flexible, foldable, and rollable properties. The substrate 100 may be made of silicon wafers, glass, plastic, ceramics, etc. The substrate 100 may be made of transparent or opaque materials.

[0083] The multiple driving circuits may include a first driving circuit 101r, a second driving circuit 101g, and a third driving circuit 101b. The first driving circuit 101r may be connected to a first sub-pixel SPr to drive the emission of a first color light from the first sub-pixel SPr. The second driving circuit 101g may be connected to a second sub-pixel SPg to drive the emission of a second color light from the second sub-pixel SPg. The third driving circuit 101b may be connected to a third sub-pixel SPb to drive the emission of a third color light from the third sub-pixel SPb.

[0084] Each driving circuit may include multiple transistors and at least one capacitor. One of the multiple transistors may be a driving transistor.

[0085] The protective layer 110 can be disposed on multiple drive circuits 101r, 101g, 101b to protect the multiple drive circuits 101r, 101g, 101b. The protective layer 110 can be a planarization layer to stably form other layers on it.

[0086] The protective layer 110 can be a single layer formed of an inorganic or organic film. The protective layer 110 can also be a combination of multiple layers of inorganic and organic films. The protective layer 110 can be formed of a silicon oxide film (SiOx), a silicon nitride film (SiNx), or multiple films thereof.

[0087] For example, the protective layer 110 can be composed of multiple structures, including organic and inorganic films. In this case, the organic film may include acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc. The inorganic film may include silicon oxide film (SiOx), silicon nitride film (SiNx), etc.

[0088] On one hand, multiple three-dimensional structures 130 can be disposed on the substrate 100. Multiple three-dimensional structures 130 can be disposed on the protective layer 110. As described later, multiple first dikes 120 can be disposed on the protective layer 110 between the multiple three-dimensional structures 130. Multiple first dikes 120 may also be omitted.

[0089] The three-dimensional structure 130 may have a first side SS1, a second side SS2, and a top surface TS. The top surface TS may be omitted, so that the upper ends of the first side SS1 and the upper ends of the second side SS2 can contact each other.

[0090] The first sub-pixel SPr can be configured on the first side surface SS1 of the stereo structure 130, the second sub-pixel SPg can be configured on the second side surface SS2 of the stereo structure 130, and the third sub-pixel SPb can be configured on the upper surface TS of the stereo structure 130. The third sub-pixel SPb may not horizontally overlap with the first sub-pixel SPr or the second sub-pixel SPg, and the third sub-pixel SPb may be configured on both the first sub-pixel SPr and the second sub-pixel SPg.

[0091] With this structure, a pixel P comprising a first sub-pixel SPr, a second sub-pixel SPg, and a fourth sub-pixel can be formed using a three-dimensional structure. In this case, the number of pixels P can be the same as that of the three-dimensional structure 130.

[0092] It can achieve high precision and high resolution without reducing the light-emitting area of ​​each sub-pixel SPg and SPr.

[0093] In the accompanying drawings, although the sides of the three-dimensional structure 130 have straight surfaces, they can also have curved or concave / convex surfaces, unlike this. The side surface can be referred to as a wall surface. The terms "side surface" and "wall surface" can be used interchangeably.

[0094] The 3D structure 130 can have a dot structure. The 3D structure 130 can be arranged in a matrix form along a first direction X and a second direction Y. The 3D structure 130 can be separated into pixel P units or column line units along the first direction X. The 3D structure 130 can be separated into pixel P units or row line units along the second direction Y. The 3D structure 130 can be separated into two or more pixel P units or row line units along the second direction Y. The 3D structure 130 can be arranged in a continuous stripe pattern along the second direction Y. That is, the 3D structure 130 can be arranged relatively long without being separated along the second direction Y.

[0095] The three-dimensional structure 130 can be separated into two or more pixel P units or line units along the second direction Y.

[0096] The first side SS1 and the second side SS2 of the three-dimensional structure 130 may each have a slope that is tilted at a predetermined angle relative to the ground.

[0097] The height or width of the three-dimensional structure 130, as well as the manufacturing method of the three-dimensional structure 130, can be determined based on the resolution of the organic light-emitting display device.

[0098] Multiple 3D structures 130 can be separated by interval regions. Multiple pixels P can be distinguished through these interval regions. That is, a pixel P can be defined between adjacent interval regions.

[0099] Multiple dikes 120 and 125 may include multiple first dikes 120, multiple second dikes 125, etc.

[0100] Multiple first barriers 120 may be disposed on a protective layer 110 between multiple first sub-pixels SPr and multiple sub-pixels SPr, SPg, SPb. Multiple first barriers 120 may be disposed in the spacing region between multiple three-dimensional structures 130. Multiple second barriers 125 may be disposed on a second inorganic insulating layer 151 between multiple third sub-pixels SPb.

[0101] The first dike 120 can distinguish pixel P, and the second dike 125 can distinguish the adjacent third sub-pixel SPb.

[0102] In the accompanying drawings, the thickness, size, shape, etc. of the first dike 120 and the second dike 125 are shown to be different from each other, and the thickness, size, shape, etc. can be changed.

[0103] The first dike 120 and / or the second dike 125 may comprise inorganic or organic materials. For example, the first dike 120 and / or the second dike 125 may comprise inorganic materials such as SiNx, SiON, etc.

[0104] After forming the first organic light-emitting element 140r and the second organic light-emitting element 140g, when forming the second dam 125, if the second dam 125 is made of an organic material, the temperature should not be raised above 80 to 100°C to avoid affecting the lifespan of the first organic light-emitting element 140r and the second organic light-emitting element 140g. In this case, organic components may leak from the resin fired at below 100°C, which may also affect the lifespan of the third organic light-emitting element 140b. Therefore, the second dam 125 can preferably be made of an inorganic material.

[0105] Although not shown, when the second dike 125 is formed with black resin, the color viewing angle and visibility can be improved. In this case, an inorganic film can be used to cover the black resin to prevent leakage of organic components.

[0106] On the one hand, the multiple organic light-emitting elements may include a first organic light-emitting element 140r, a second organic light-emitting element 140g, and a third organic light-emitting element 140b.

[0107] In this embodiment, since the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb are arranged in three dimensions, the first organic light-emitting element 140r, the second organic light-emitting element 140g, and the third organic light-emitting element 140b can also be arranged in three dimensions.

[0108] A first organic light-emitting element 140r may be disposed on a first sub-pixel SPr. The first organic light-emitting element 140r may be disposed on a first sub-pixel SPr located on a first side surface SS1 of the stereostructure 130. A second organic light-emitting element 140g may be disposed on a second sub-pixel SPg. The second organic light-emitting element 140g may be disposed on a second sub-pixel SPg located on a second side surface SS2 of the stereostructure 130. A third organic light-emitting element 140b may be disposed on a third sub-pixel SPb. The third organic light-emitting element 140b may be disposed on the upper surface TS of the stereostructure 130. The third organic light-emitting element 140b may be disposed on a third sub-pixel SPb located on the upper surface TS of the stereostructure 130.

[0109] The first organic light-emitting element 140r and the second organic light-emitting element 140g can be arranged with the three-dimensional structure 130 placed between them and horizontally overlapping each other. The third organic light-emitting element 140b can be disposed on the first organic light-emitting element 140r and the second organic light-emitting element 140g.

[0110] The first organic light-emitting element 140r and the second organic light-emitting element 140g may be disposed on the protective layer 110, and the third organic light-emitting element 140b may be disposed on the second inorganic insulating layer 151. The first organic light-emitting element 140r and the second organic light-emitting element 140g may be disposed under the first inorganic insulating layer 150.

[0111] One of the first organic light-emitting element 140r and the second organic light-emitting element 140g may include a red organic light-emitting element, and the other may include a green organic light-emitting element. The third organic light-emitting element 140b may include a blue organic light-emitting element.

[0112] In the upper light mode, the first color light, the second color light, and the third color light generated from the first organic light-emitting element 140r, the second organic light-emitting element 140g, and the third organic light-emitting element 140b, respectively, can be emitted forward through the third inorganic insulating layer 153. For example, the first color light can be a first color light, the second color light can be a second color light, and the third color light can be blue light, but it is not limited to these.

[0113] On the other hand, the first organic light-emitting element 140r may include a first anode electrode 141r, a first organic light-emitting layer 142r, a first cathode electrode 143r, etc. The second organic light-emitting element 140g may include a second anode electrode 141g, a second organic light-emitting layer 142g, a second cathode electrode 143g, etc. The third organic light-emitting element 140b may include a third anode electrode 141b, a third organic light-emitting layer 142b, a third cathode electrode 143b, etc. The first organic light-emitting layer 142r can generate a first color light using the power supply between the first anode electrode 141r and the first cathode electrode 143r, the second organic light-emitting layer 142g can generate a second color light using the power supply between the second anode electrode 141g and the second cathode electrode 143g, and the third organic light-emitting layer 142b can generate a third color light using the power supply between the third anode electrode 141b and the third cathode electrode 143b.

[0114] The first anode electrode 141r, the second anode electrode 141g, and the third anode electrode 141b can be independently configured on the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb. That is, the first anode electrode 141r can be configured only on the first sub-pixel SPr, the second anode electrode 141g can be configured only on the second sub-pixel SPg, and the third anode electrode 141b can be configured only on the third sub-pixel SPb.

[0115] As an example, a conductive material can be formed and patterned on a substrate 100, and the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can each independently form a first anode electrode 141r, a second anode electrode 141g, and a third anode electrode 141b.

[0116] A plurality of first anode electrodes 141r and a plurality of second anode electrodes 141g may be disposed therebetween and arranged at intervals between each other. A plurality of third anode electrodes 141b may be disposed therebetween and arranged at intervals between each other.

[0117] The first anode electrode 141r can be electrically connected to the first drive circuit 101r. Since the first anode electrode 141r and the first drive circuit 101r are configured with the protective layer 110 placed therebetween, the first anode electrode 141r can be electrically connected to the first drive circuit 101r through the protective layer 110.

[0118] The second anode electrode 141g can be electrically connected to the second drive circuit 101g. Since the second anode electrode 141g and the second drive circuit 101g are configured with the protective layer 110 placed therebetween, the second anode electrode 141g can be electrically connected to the first drive circuit 101r through the protective layer 110.

[0119] The first anode electrode 141r and the second anode electrode 141g can be electrically connected to the first driving circuit and the second driving circuit through the auxiliary electrode 111. The auxiliary electrode 111 can be disposed on the protective layer 110, can penetrate the protective layer 110, and is electrically connected to the first driving circuit and the second driving circuit.

[0120] The third anode electrode 141b can be electrically connected to the third driving circuit 101b via a connecting portion (not shown). The third anode electrode 141b can be electrically connected to the third driving circuit 101b in a non-light-emitting area between the first sub-pixel SPr and the second sub-pixel SPg, or in a non-light-emitting area between it and an adjacent pixel P. For example, the third anode electrode 141b can be electrically connected to the third driving circuit 101b via multiple insulating layers 150, 160, 151, a first dam 120, and a protective layer 110.

[0121] Cathode electrodes 143r and 143g can be disposed on the entire area of ​​the substrate. In this case, the cathode electrode included in the first sub-pixel SPr can be the first cathode electrode 143r, and the cathode electrode included in the second sub-pixel SPg can be the second cathode electrode 143g.

[0122] When the cathode electrodes 143r and 143g are disposed over the entire area of ​​the substrate, a short circuit may occur between the connecting electrode and the cathode electrodes 143r and 143g when the connecting electrode (or auxiliary electrode) between the third anode electrode 141b and the third drive circuit 101b penetrates multiple insulating layers 150, 160, 151, the first dam 120, and the protective layer 110. To prevent this, through-holes can be formed in the cathode electrodes 143r and 143g to physically separate them from the connecting electrode. Simultaneously, an insulating layer can be formed between the connecting electrode and the cathode electrodes 143r and 143g at the through-holes, but this is not a limitation.

[0123] In top-emitting displays with large areas of 15 inches or more, the cathode electrodes 143r and 143g are relatively thin and can be made of low-resistance material, and the power line can be positioned within the display area. In this case, the cathode electrodes 143r and 143g can be connected to the power line via EVSS electrodes (auxiliary electrodes). The third cathode electrode 143b can penetrate multiple insulating layers 150, 160, and 151 and be connected to the same power line.

[0124] In the case of small-area screens of 15 inches or less, the power lines can be directly connected to the non-display areas surrounding the display area. For example, in the deposition process, in the cell metalmask distinguished by panel units, the power lines and organic light-emitting layers 142r, 142g, and 142b can be covered to prevent deposition, while the cathode electrodes 143r, 143g, and 143b can be left open for deposition, thereby allowing the cathode electrodes 143r, 143g, and 143b to be electrically connected to the power lines.

[0125] When the third cathode electrode 143 is connected to the power line through multiple insulating layers 150, 160, and 151, an EVSS electrode (auxiliary electrode) can be configured as an intermediate layer on the same layer as the anode electrode 141b of the third sub-pixel SPb. In this case, reliability is improved because the third cathode electrode 143 is connected to the power line through the EVSS electrode (auxiliary electrode).

[0126] On the other hand, such as Figure 1 as well as Figure 2As shown, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb each may include a light-emitting region EAr, an EAg, an EAb, and a non-light-emitting region. In this case, the first light-emitting region EAr of the first sub-pixel SPr may have a size corresponding to the first anode electrode 141r. The second light-emitting region EAG of the second sub-pixel SPg may have a size corresponding to the second anode electrode 141g. The third light-emitting region EAb of the third sub-pixel SPb may have a size corresponding to the third anode electrode 141b.

[0127] like Figure 2 As shown, the third anode electrode 141b can be disposed above the first anode electrode 141r and above the second anode electrode 141g.

[0128] The first organic light-emitting layer 142r, the second organic light-emitting layer 142g, and the third organic light-emitting layer 142b can be independently disposed on the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb. That is, the first organic light-emitting layer 142r can be disposed only on the first sub-pixel SPr, and the second organic light-emitting layer 142g can be disposed only on the second sub-pixel SPg.

[0129] A first organic light-emitting layer 142r may be disposed on the first anode electrode 141r of the first sub-pixel SPr, a second organic light-emitting layer 142g may be disposed on the second anode electrode 141g of the second sub-pixel SPg, and a third organic light-emitting layer 142b may be disposed on the third anode electrode 141b of the third sub-pixel SPb. The first organic light-emitting layer 142r may be disposed on a portion of the upper side of the first dam 120 located on both sides of the first sub-pixel SPr. The second organic light-emitting layer 142g may be disposed on a portion of the upper side of the first dam 120 located on both sides of the second sub-pixel SPg. The first organic light-emitting layer 142r and the second organic light-emitting layer 142g may be disposed alternately on the upper side of the first dam 120. The third organic light-emitting layer 142b may be disposed on a portion of the upper side of the second dam 125 located on both sides of the third sub-pixel SPb.

[0130] The third organic light-emitting layer 142b may be disposed only in the region corresponding to the third sub-pixel SPb on the second inorganic insulating layer 151, and may not be disposed in the region corresponding to the first sub-pixel SPr or the second sub-pixel SPg. Therefore, since the third color light of the third organic light-emitting layer 142b is not generated in the region of the second inorganic insulating layer 151 corresponding to the first sub-pixel SPr or the second sub-pixel SPg, the first color light generated at the first organic light-emitting element 140r or the second color light generated at the second organic light-emitting element 140g can be emitted forward without being hindered by the third color light.

[0131] The second dam 125 can be formed with black resin. That is, the second dam 125 can be referred to as a black layer, a black matrix, etc.

[0132] Although not shown, when the second dike 125 is formed with black resin, the color viewing angle and visibility can be improved. In this case, the inorganic film can be covered with black resin to prevent leakage of organic components.

[0133] On one hand, the first cathode electrode 143r and the second cathode electrode 143g can be disposed on the substrate 100. That is, the first cathode electrode 143r and the second cathode electrode 143g can be integrally disposed on the substrate 100 without being distinguishable from each other. For example, the first cathode electrode 143r and the second cathode electrode 143g, as cathode electrodes, can be disposed together only on the first sub-pixel SPr and the second sub-pixel SPg.

[0134] The third cathode electrode 143b may be disposed only on the third sub-pixel SPb. That is, the third cathode electrode 143b may not be disposed among the multiple third sub-pixels SPb. For example, the third cathode electrode 143b may not be disposed on the multiple second inorganic insulating layers 151 among the multiple third sub-pixels SPb.

[0135] Therefore, in the area of ​​the third organic light-emitting layer 142b, except for the area corresponding to the third sub-pixel SPb, the third organic light-emitting layer 142b, the third cathode electrode 143b, the second dam 125, etc., can be omitted, thus minimizing the number of layers. Therefore, the first color light of the first organic light-emitting element 140r and the second color light of the second organic light-emitting element 140g can be emitted forward without light loss, thereby improving lifetime luminous efficiency.

[0136] On the other hand, in an embodiment, the first anode electrode 141r and the second anode electrode 141g may include reflective electrodes with excellent reflective properties. In this case, the first color light generated at the first organic light-emitting layer 142r and the second color light generated at the second organic light-emitting layer 142g can each be reflected by the first anode electrode 141r and the second anode electrode 141g and emitted forward, thereby improving the light extraction rate and enhancing image quality.

[0137] In an embodiment, the first cathode electrode 143r and the second cathode electrode 143g may include transparent or translucent conductive films.

[0138] When the first cathode electrode 143r and the second cathode electrode 143g include a semi-transparent conductive film, the recovery of the first color light between the first anode electrode 141r and the first cathode electrode 143r, and between the second anode electrode 141g and the second cathode electrode 143g, can improve the light extraction efficiency. Specifically, the first color light generated by the first organic light-emitting layer 142r can be reflected by the first cathode electrode 143r and travel downwards, and is reflected again by the first anode electrode 141r and travels upwards. A portion of the first color light traveling upwards can pass through the first cathode electrode 143r and be emitted forwards, while another portion can be reflected by the first cathode electrode 143r. Thus, the first color light is recovered between the first cathode electrode 143r and the first anode electrode 141r, allowing more first color light to be emitted forwards, thereby improving light efficiency.

[0139] Similarly, the second color light generated by the second organic light-emitting layer 142g is recovered between the second cathode electrode 143g and the second anode electrode 141g, so that more second color light can be emitted forward, thereby improving the luminous efficiency.

[0140] On the other hand, refer to Figure 1 as well as Figure 2 Multiple insulating layers 150-153, 160, and 161 may be disposed on the substrate 100. These multiple insulating layers may include at least one inorganic insulating layer 150-153 and at least one organic insulating layer 160 and 161. For example, the inorganic insulating layer may include SiNx, SiO2, etc., but is not limited thereto.

[0141] In the plurality of insulating layers 150, 160, and 151 disposed between the first organic light-emitting element 140r and the third organic light-emitting element 140b, the bottommost layer 150 and the topmost layer 151 may be inorganic insulating layers. For example, the plurality of insulating layers may include a first inorganic insulating layer 150, a first organic insulating layer 160, a second inorganic insulating layer 151, etc., but are not limited thereto. At least one of the first inorganic insulating layer 150, the first organic insulating layer 160, and the second inorganic insulating layer 151 may be omitted. The first organic insulating layer 160 may be disposed between the first inorganic insulating layer 150 and the second inorganic insulating layer 151. The first inorganic insulating layer 150 and the second inorganic insulating layer 151 may each include a plurality of insulating films.

[0142] A first inorganic insulating layer 150 may be disposed on the first organic light-emitting element 140r and the second organic light-emitting element 140g. The first inorganic insulating layer 150 may be disposed on the upper side of the first cathode electrode 143r of the first organic light-emitting element 140r and the upper side of the second cathode electrode 143g of the second organic light-emitting element 140g. The first inorganic insulating layer 150 can prevent moisture, oxygen, etc., from penetrating into the first organic light-emitting layer 142r below the first cathode electrode 143r and the second organic light-emitting layer 142g below the second cathode electrode 143g.

[0143] The second inorganic insulating layer 151 may be disposed below the third organic light-emitting element 140b. The second inorganic insulating layer 151 may be disposed below the third anode electrode 141b of the third organic light-emitting element 140b. The second inorganic insulating layer 151 can prevent moisture, oxygen, etc. from penetrating into the third organic light-emitting layer 142b above the third anode electrode 141b.

[0144] On one hand, the insulating pattern 152 may include a multilayer inorganic film disposed on the capping layer CPL to protect the third cathode electrode 143b and the third organic light-emitting layer 142b. The multilayer inorganic film prevents the penetration of the developer solution during the exposure and development processes in the patterning process.

[0145] On the other hand, instead of the second organic insulating layer 161, an inorganic membrane or a multilayer structure including both inorganic and organic membranes can be provided. Therefore, the penetration of the developer can be prevented at the source.

[0146] The third inorganic insulating layer 153 may be disposed on the third organic light-emitting element 140b. The third inorganic insulating layer 153 may be disposed on the third cathode electrode 143b of the third organic light-emitting element 140b. The third inorganic insulating layer 153 can prevent moisture, oxygen, etc. from penetrating to the third organic light-emitting layer 142b below the third cathode electrode 143b.

[0147] Figure 3 The stacked structure of each organic light-emitting element is shown. Figure 3 The stacked structure of each organic light-emitting element shown illustrates a single stack structure.

[0148] like Figure 3 As shown, the first organic light-emitting element 140r, the second organic light-emitting element 140g, and the third organic light-emitting element 140b may include anode electrodes 141r, 141g, and 141b, multiple organic layers, cathode electrodes 143r, 143g, and 143b, and a capping layer CPL.

[0149] For example, a hole injection layer HIL, a hole transport layer HTL, an electron transport layer ETL, and an electron injection layer EIL can be collectively included in the first organic light-emitting element 140r, the second organic light-emitting element 140g, and the third organic light-emitting element 140b. The hole injection layer HIL, the hole transport layer HTL, the electron transport layer ETL, and the electron injection layer EIL can be collectively formed on the substrate 100.

[0150] For example, a red organic light-emitting layer (R-EML) may be included in the first organic light-emitting element 140r, a green organic light-emitting layer (G-EML) may be included in the second organic light-emitting element 140g, and a blue organic light-emitting layer (B-EML) may be included in the third organic light-emitting element 140b. The red organic light-emitting layer (R-EML) may be formed only on the first sub-pixel SPr on the substrate 100. The green organic light-emitting layer (G-EML) may be formed only on the second sub-pixel SPg on the substrate 100. The blue organic light-emitting layer (B-EML) may be formed only on the third sub-pixel SPb on the substrate 100.

[0151] For example, a red hole transport layer (R-HTL) may be included in the first organic light-emitting element 140r. A green hole transport layer may be included in the second organic light-emitting element 140g. The red hole transport layer (R-HTL) may be formed only on the first sub-pixel SPr on the substrate 100.

[0152] The stacked structure of organic light-emitting elements can also be applied to stacked structures of two or more elements.

[0153] In two or more stacked structures, the hole injection layer HIL, hole transport layer HTL, first organic light-emitting layer, electron transport layer ETL, electron injection layer EIL, etc. can be disposed between the anode electrodes 141r, 141g, 141b and the charge generation layer, and the hole transport layer HTL, second organic light-emitting layer, electron transport layer ETL, electron injection layer EIL, etc. can be disposed between the charge generation layer and the cathode electrodes 143r, 143g, 143b.

[0154] Figure 4 The design structure of the three-dimensional structure and the design structure of the second evaporation source device are shown in outline. Figure 4 For ease of illustration, the deposition of the green luminescent layer G-EML is shown, but the deposition of the red luminescent layer G-EML can be similarly applied.

[0155] like Figure 4 As shown, the green luminescent material of the second evaporation source device 430 can be deposited on the second side SS2 of the three-dimensional structure 130, so that the second organic light-emitting element 140g can be formed on the second side SS2. The second evaporation source device 430 can be installed in the second deposition chamber.

[0156] Although not shown, the red luminescent material of the first evaporation source device can be deposited on the first side SS1 of the three-dimensional structure 130, thereby forming the first organic light-emitting element 140r on the first side SS1. The first evaporation source device can be installed in the first deposition chamber.

[0157] Key design factors for the three-dimensional structure 130 include height H, first width W1, and second width W2. Height H can be the height of the three-dimensional structure 130. First width W1 can be the width of the vertical projection of the first side SS1 of the three-dimensional structure 130. Second width W2 can be the width of the interval between adjacent three-dimensional structures 130.

[0158] The deposition angle θ (or maximum deposition angle) used to deposit green luminescent material on the second side SS2, through the shadow effect, can be expressed by mathematical formula 1.

[0159] [Mathematical Expression 1] tanθe = H / (W1 + W2) When the plane of the substrate 100 is taken as a reference, when a virtual line is shown connecting one end of the upper surface TS of the three-dimensional structure 130 to one end of the effective light-emitting area of ​​the first sub-pixel SPr, the virtual line can actually correspond to the deposition angle θ of mathematical expression 1.

[0160] On the other hand, the second evaporation source device 430 for depositing the second side SS2 of the three-dimensional structure 130 can be configured to satisfy the deposition angle θ.

[0161] In this regard, within the second deposition chamber, an angle limiting plate 436 may be disposed between the second evaporation source device 430 of the green luminescent material and the substrate 100.

[0162] The angle limiting plate 436 may actually have a wider width than the second evaporation source device 430 and be configured to completely cover the second evaporation source device 430.

[0163] On the one hand, the nozzle 435 of the second evaporation source device 430 can be installed such that the nozzle 435 is tilted downwards to face the second side SS2.

[0164] The second evaporation source device 430 and the angle limiting plate 436 can be configured such that the virtual line connecting the nozzle 435 and the rear end (i.e., one end in the deposition direction) of the angle limiting plate 436 becomes the deposition angle θ product. This can be expressed by mathematical formula 2.

[0165] [Mathematical Expression 2] tanθe=ET / Loffset ET can represent the vertical distance between the substrate 100 and the second evaporation source device 430 (more specifically, the nozzle 435), and Loffset can represent the shortest horizontal distance from the second evaporation source device 430 to the location of the substrate 100 where the green luminescent material can be deposited.

[0166] To satisfy mathematical formulas 1 and 2, a three-dimensional structure 130 and a second evaporation source device 430 are preferably designed.

[0167] Figure 5A and Figure 5B The diagram illustrates the configuration of the first organic light-emitting element and the second organic light-emitting element disposed on a first embankment between three-dimensional structures, according to comparative examples and embodiments. Figure 5A and Figure 5B for Figure 2 A magnified view of the J region.

[0168] like Figure 2 as well as Figure 5A As shown, the hole injection layer HIL, hole transport layer HTL, red hole transport layer R-HTL, green organic light-emitting layer G-EML, red organic light-emitting layer R-EML, electron transport layer ETL, electron injection layer EIL, and cathode electrode 143 can be disposed on the first embankment 120. The cathode electrode 143 can be the first cathode electrode 141r of the first organic light-emitting element 140r and / or the second cathode electrode 141g of the second organic light-emitting element 140g.

[0169] The red hole transport layer R-HTL and the red organic light-emitting layer R-EML can be disposed on one side of the first dam 120, and the green organic light-emitting layer G-EML can be disposed on the other side of the first dam 120. The green organic light-emitting layer G-EML can be perpendicularly overlapped with each of the red hole transport layer R-HTL and the red organic light-emitting layer R-EML. The green organic light-emitting layer G-EML can be perpendicularly disposed between the red hole transport layer R-HTL and the red organic light-emitting layer R-EML.

[0170] Hole injection layer HIL, hole transport layer HTL, electron transport layer ETL, electron injection layer EIL, and cathode electrode 143 can be disposed over the entire area of ​​the first dam 120.

[0171] The hole injection layer HIL can be made of a low-resistance organic material. The hole injection layers of the first organic light-emitting element 140r and the second organic light-emitting element 140g can be interconnected on the first dam 120. As a result, lateral current leakage may occur between the first sub-pixel SPr and the second sub-pixel SPg. If light leakage occurs due to lateral current leakage, it may cause problems such as decreased yield due to the formation of color spots.

[0172] To solve such problems, such as Figure 2 as well as Figure 5B As shown, hole injection layers HIL1 and HIL2 can be arranged at intervals on the first dam 120. Therefore, the hole injection layer HIL1 of the first organic light-emitting element 140r and the hole injection layer HIL2 of the second organic light-emitting element 140g can be cut off on the first dam 120, thereby preventing lateral current leakage between the first sub-pixel SPr and the second sub-pixel SPg.

[0173] like Figure 4 As shown, in order to form the second organic light-emitting element 140g, when multiple organic layers are deposited, the hole injection layer HIL2, which is a low-resistance organic material, and the green organic light-emitting layer G-EML, which is a high-resistance organic material, can be adjusted to be sprayed toward the substrate 100 at different deposition angles. For example, with the horizontal line as a reference, since the deposition angle of the hole injection layer HIL2 is set to be smaller than that of the green organic light-emitting layer G-EML, the end of the hole injection layer HIL2 can be located closer to the side of the first embankment 120 than the end of the green organic light-emitting layer G-EML.

[0174] Hole injection layer HIL2 can be called a low-resistance layer, while green organic light-emitting layer G-EML can be called a high-resistance layer.

[0175] Although not shown, when multiple organic layers are deposited to form the first organic light-emitting element 140r, the hole injection layer HIL1, which is a low-resistance organic material, and the red organic light-emitting layer R-EML, which is a high-resistance organic material, can be adjusted to be sprayed toward the substrate 100 at different deposition angles. For example, with the horizontal line as a reference, since the deposition angle of the hole injection layer HIL1 is set to be smaller than that of the red organic light-emitting layer R-EML, the end of the hole injection layer HIL1 is located closer to the side of the first embankment 120 than the end of the red organic light-emitting layer R-EML.

[0176] Therefore, the ends of the hole injection layer HIL1 of the first organic light-emitting element 140r and the ends of the hole injection layer HIL2 of the second organic light-emitting element 140g can be arranged at intervals from each other.

[0177] On the other hand, when using organic light-emitting elements with two or more stacked structures, since the charge-generating layer disposed between the first stack and the second stack is also a low-resistance organic material, the charge-generating layer can be disposed at intervals on the first dam 120.

[0178] Figure 6A as well as Figure 6BThe first organic light-emitting element and the second organic light-emitting element according to the comparative example and embodiment are shown in the form of the first organic light-emitting element and the second organic light-emitting element disposed on the upper surface of the three-dimensional structure. Figure 6A as well as Figure 6B for Figure 2 A magnified view of the K region.

[0179] like Figure 2 as well as Figure 6A As shown, the hole injection layer HIL, hole transport layer HTL, red hole transport layer R-HTL, green organic light-emitting layer G-EML, red organic light-emitting layer R-EML, electron transport layer ETL, electron injection layer EIL, and cathode electrode 143 can be disposed on the upper surface TS of the three-dimensional structure 130.

[0180] Hole injection layer HIL, hole transport layer HTL, electron transport layer ETL, electron injection layer EIL, and cathode electrode 143 can be disposed over the entire area of ​​the first dam 120.

[0181] In particular, since the hole injection layer HIL, which is a low-resistance organic material, is disposed over the entire area of ​​the first dam 120, the hole injection layers of the first organic light-emitting element 140r and the second organic light-emitting element 140g can be connected to each other on the upper surface TS of the three-dimensional structure 130. Therefore, lateral current leakage may occur between the first sub-pixel SPr and the second sub-pixel SPg.

[0182] To solve this problem, such as Figure 2 as well as Figure 6B As shown, a patterning process can be used to remove the cathode electrode 143 and multiple organic layers disposed on the upper surface TS of the three-dimensional structure 130. That is, the cathode electrode 143 and multiple organic layers can be removed to expose the upper surface TS of the three-dimensional structure 130. Therefore, because the hole injection layer HIL1 of the first organic light-emitting element 140r and the hole injection layer HIL2 of the second organic light-emitting element 140g are cut off from each other on the upper surface TS of the three-dimensional structure 130, lateral current leakage between the first sub-pixel SPr and the second sub-pixel SPg can be prevented.

[0183] On the other hand, when using organic light-emitting elements with two or more stacked structures, the charge-generating layers disposed between the first stack and the second stack can be disposed at intervals on the upper surface TS of the three-dimensional structure 130.

[0184] [Second Embodiment] Figure 7 A cross-sectional view of an organic light-emitting display device according to a second embodiment is shown. Figure 7 In order to be in Figure 1 A cross-sectional view taken along line A-A' in an organic light-emitting display device.

[0185] Except that the first side SS1 and the second side SS2 of the three-dimensional structure 130 are each perpendicular to the substrate 100, the second embodiment and the first embodiment ( Figure 2 The second embodiment is the same as the first embodiment. Figure 2 Components having the same structure, shape and / or function are given the same reference numerals and their detailed descriptions are omitted.

[0186] Reference Figure 1 as well as Figure 7 The organic light-emitting display device according to the second embodiment may include: a substrate 100; a plurality of driving circuits 101r, 101g, 101b; a protective layer 110; a plurality of three-dimensional structures 130; a plurality of dams 120, 125; a plurality of organic light-emitting elements 140r, 140g, 140b; and a plurality of insulating layers 150-153, 160, 161, etc.

[0187] The first side SS1 and the second side SS2 of the three-dimensional structure 130 may each be perpendicular to the substrate 100. For example, the first side SS1 and the second side SS2 of the three-dimensional structure 130 may each be at a 90-degree angle relative to the substrate 100. In this case, the first organic light-emitting element 140r may be disposed on the first side SS1 of the three-dimensional structure 130 as a first sub-pixel SPr, and the second organic light-emitting element 140g may be disposed on the second side SS2 of the three-dimensional structure 130 as a second sub-pixel SPg.

[0188] Since the first side SS1 and the second side SS2 of the three-dimensional structure 130 are each perpendicular to the substrate 100, when viewed from the front, the occupied area of ​​the first organic light-emitting element 140r and the occupied area of ​​the second organic light-emitting element 140g are minimized, which can achieve ultra-high resolution display.

[0189] In contrast, since the first side SS1 and the second side SS2 of the three-dimensional structure 130 are each ensured by the light-emitting areas of the first sub-pixel SPr and the second sub-pixel SPg, the first color light and the second color light can be emitted fully forward, which can prevent the decrease of lifetime luminous efficiency.

[0190] Figure 6B The structure shown for preventing lateral current leakage can be applied to Figure 7 That is, since the low-resistance layer 140r of the first organic light-emitting element and the low-resistance layer 140g of the second organic light-emitting element are cut off from each other on the upper surface TS of the three-dimensional structure 130, lateral current leakage between the first sub-pixel SPr and the second sub-pixel SPg can be prevented. The low-resistance layer may include, for example, a hole injection layer, a charge generation layer, etc.

[0191] Figure 8 This is a plan view of an organic light-emitting display device according to a second embodiment. Except that the third sub-pixel SPb vertically overlaps with the first sub-pixel SPr and the second sub-pixel SPg, the second embodiment differs from the first embodiment (…). Figure 1 The same as in the first embodiment. In the second embodiment, for the same as in the first embodiment ( Figure 1 Components having the same structure, shape and / or function are given the same reference numerals, and detailed descriptions of them are omitted.

[0192] First embodiment ( Figure 1 In the first embodiment, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb may not overlap perpendicularly to each other. Conversely, in the second embodiment (… Figure 8 In the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb, they can overlap each other perpendicularly.

[0193] In this embodiment, each of the multiple pixels P may include a first sub-pixel SPr, a second sub-pixel SPg, and a third sub-pixel SPb, each having a three-dimensional structure. That is, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be arranged in three dimensions to form pixel P. Specifically, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be arranged horizontally or vertically relative to each other, thereby forming pixel P.

[0194] For example, the sum of the size (or area) of the first sub-pixel SPr and the size (or area) of the second sub-pixel SPg can be equal to the size (or area) of pixel P. For example, the sum of the width of the first sub-pixel SPr and the width of the second sub-pixel SPg can be the same as the width W of pixel P.

[0195] For example, the size (or area) of the third sub-pixel SPb can be the same as the size (or area) of pixel P. For example, the width of the third sub-pixel SPb can be the same as the width W of pixel P.

[0196] In this case, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be configured in three dimensions such that all three are included within pixel P. For this purpose, the second sub-pixel SPg can be configured to horizontally overlap with the first sub-pixel SPr, and the third sub-pixel SPb can be configured to vertically overlap with both the first and second sub-pixels SPr and SPg.

[0197] According to an embodiment, in order to form pixel P, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be configured in three dimensions, thereby further reducing the size of pixel P and enabling high-precision, ultra-high-resolution display.

[0198] On the other hand, such as Figure 8 As shown, the third emitting area EAb of the third sub-pixel SPb can be configured to vertically overlap with the first emitting area EAr of the first sub-pixel SPr. The third emitting area EAb of the third sub-pixel SPb can be configured to vertically overlap with the second emitting area EAg of the second sub-pixel SPg. The first emitting area EAr of the first sub-pixel SPr can not vertically overlap with the second emitting area EAg of the second sub-pixel SPg. That is, the first emitting area EAr of the first sub-pixel SPr and the second emitting area EAg of the second sub-pixel SPg can be configured to horizontally overlap.

[0199] The size of the third light-emitting region EAb of the third sub-pixel SPb can be larger than the size of the first light-emitting region EAr of the first sub-pixel SPr. The size of the third light-emitting region EAb of the third sub-pixel SPb can be larger than the size of the second light-emitting region EAg of the second sub-pixel SPg. Although the sizes of the first light-emitting region EAr and the second light-emitting region EAg are shown to be the same in the accompanying drawings, they can also be different from each other.

[0200] According to this embodiment, the size of the third light-emitting region EAb of the third sub-pixel SPb can be increased to the size of the pixel P, and the third light-emitting region EAb can be significantly increased, thereby improving the lifetime luminous efficiency.

[0201] [Third Embodiment] Figure 9 A cross-sectional view of an organic light-emitting display device according to a third embodiment is shown. Figure 9 In order to be in Figure 8 A cross-sectional view taken along line B-B' in an organic light-emitting display device.

[0202] Except for the third organic light-emitting element 140b, the third embodiment is similar to the first embodiment ( Figure 2 ) and the second embodiment ( Figure 7 Similar to the first embodiment. In the third embodiment, for the same as the first embodiment ( Figure 2 ) or the second embodiment ( Figure 7 Components having the same structure, shape and / or function are given the same reference numerals, and detailed descriptions of them are omitted.

[0203] Reference Figure 8 as well as Figure 9 The organic light-emitting display device according to the third embodiment may include: a substrate 100; a plurality of driving circuits 101r, 101g, 101b; a protective layer 110; a plurality of three-dimensional structures 130; a plurality of dams 120, 125; a plurality of organic light-emitting elements 140r, 140g, 140b; a plurality of insulating layers 150-153, 160, etc.

[0204] To achieve high-definition, ultra-high-resolution displays, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb can be configured in three dimensions. The third sub-pixel SPb can be configured on the first sub-pixel SPr and can vertically overlap with the first sub-pixel SPr. The third sub-pixel SPb can be configured on the second sub-pixel SPg and can vertically overlap with the second sub-pixel SPg.

[0205] The third sub-pixel SPb can be configured among multiple stereo structures 130, on the first sub-pixel SPr and the second sub-pixel SPg.

[0206] The first organic light-emitting element 140r can be configured in the first sub-pixel SPr, the second organic light-emitting element 140g can be configured in the second sub-pixel SPg, and the third organic light-emitting element 140b can be configured in the third sub-pixel SPb.

[0207] Since the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb are arranged in three dimensions, the first organic light-emitting element 140r, the second organic light-emitting element 140g, and the third organic light-emitting element 140b can also be arranged in three dimensions.

[0208] The third organic light-emitting element 140b can be disposed between multiple three-dimensional structures 130 on the upper side of the first organic light-emitting element 140r and the second organic light-emitting element 140g.

[0209] The second organic light-emitting element 140g can be arranged horizontally overlapping the first organic light-emitting element 140r. The third organic light-emitting element 140b can be arranged vertically overlapping the first organic light-emitting element 140r and the second organic light-emitting element 140g.

[0210] The first organic light-emitting element 140r and the second organic light-emitting element 140g may be disposed on the protective layer 110, and the third organic light-emitting element 140b may be disposed on the second inorganic insulating layer 151. Although not shown, the third organic light-emitting element 140b may be disposed on the first inorganic insulating layer 151.

[0211] One of the first organic light-emitting element 140r and the second organic light-emitting element 140g may include a red organic light-emitting element, and the other may include a green organic light-emitting element. The third organic light-emitting element 140b may include a blue organic light-emitting element.

[0212] In the upper light-emitting mode, the first organic light-emitting element 140r, the second organic light-emitting element 140g, and the third organic light-emitting element 140b each generate a first-color light, a second-color light, and a third-color light, which are emitted forward through the third inorganic insulating layer 153. For example, the first-color light can be a first-color light, the second-color light can be a second-color light, and the third-color light can be blue light, but it is not limited to these.

[0213] On the other hand, the first organic light-emitting element 140r may include a first anode electrode 141r, a first organic light-emitting layer 142r, a first cathode electrode 143r, etc. The second organic light-emitting element 140g may include a second anode electrode 141g, a second organic light-emitting layer 142g, a second cathode electrode 143g, etc. The third organic light-emitting element 140b may include a third anode electrode 141b, a third organic light-emitting layer 142b, a third cathode electrode 143b, etc.

[0214] like Figure 8 As shown, the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb may each include a light-emitting region EAr, an EAg, an EAb, and a non-light-emitting region. In this case, the first light-emitting region EAr of the first sub-pixel SPr may have a size corresponding to the first anode electrode 141r. The second light-emitting region EAG of the second sub-pixel SPg may have a size corresponding to the second anode electrode 141g. The third light-emitting region EAb of the third sub-pixel SPb may have a size corresponding to the third anode electrode 141b.

[0215] like Figure 9 As shown, the third anode electrode 141b can be disposed above the first anode electrode 141r and above the second anode electrode 141g. The third anode electrode 141b can overlap perpendicularly with the first anode electrode 141r and the second anode electrode 141g.

[0216] The size of the third anode electrode 141b may be larger than the size of the first anode electrode 141r. The size of the third anode electrode 141b may be larger than the size of the second anode electrode 141g. The size of the third anode electrode 141b may be greater than or equal to the sum of the sizes of the first anode electrode 141r and the second anode electrode 141g, but is not limited thereto.

[0217] According to an embodiment, in a third sub-pixel SPb having the same size as pixel P, the size of the third anode electrode 141b of the third organic light-emitting element 140b can be designed to be greater than or equal to the sum of the sizes of the first anode electrode 141r and the second anode electrode 141g. Therefore, the occupied area of ​​the third light-emitting region EAb of the third sub-pixel SPb within pixel P can be maximized, and the lifetime luminous efficiency of the third color light, i.e., blue light, can be improved, thereby enhancing image quality.

[0218] The first anode electrode 141r, the second anode electrode 141g, and the third anode electrode 141b can be independently configured in the first sub-pixel SPr, the second sub-pixel SPg, and the third sub-pixel SPb.

[0219] The first anode electrode 141r and the second anode electrode 141g can be electrically connected to the first driving circuit and the second driving circuit via the auxiliary electrode 111. The third anode electrode 141b can be electrically connected to the third driving circuit 101b via a connecting portion (not shown). For example, the third anode electrode 141b can be electrically connected to the third driving circuit 101b via the connecting portion, through multiple insulating layers 150, 160, 151, the first dam 120, and the protective layer 110.

[0220] The cathode electrodes 143r and 143g can be disposed on the entire area of ​​the substrate 100, but are not limited thereto. The third cathode electrode 143b can be disposed on the entire area of ​​the second inorganic insulating layer 151, but is not limited thereto.

[0221] The third organic light-emitting layer 142b can be disposed over the entire area of ​​the substrate 100, but is not limited thereto. That is, the third organic light-emitting layer 142b can be disposed not only on the third sub-pixels SPb, but also between the third sub-pixels SPb. For example, the third organic light-emitting layer 142b can be disposed on a plurality of third anode electrodes 141b and a plurality of second diaphragms 125.

[0222] According to the embodiment, since the organic light-emitting material forming the third organic light-emitting layer 142b is deposited over the entire area of ​​the substrate 100, no additional mask, such as an FMM, is required, thereby increasing process freedom and yield.

[0223] The third cathode electrode 143b may be disposed over the entire area of ​​the substrate 100, but is not limited thereto. The third cathode electrode 143b may be disposed on a plurality of third anode electrodes 141b and a plurality of second diaphragms 125.

[0224] The third inorganic insulating layer 153 can be formed as a multilayer inorganic film on the upper surface of the third cathode electrode 143b, as in the first embodiment ( Figure 2 As shown in the figure, a second organic insulating layer 161 and a third inorganic insulating layer 153 can be provided.

[0225] On one hand, multiple first dikes 120 can be configured between multiple three-dimensional structures 130, and multiple second dikes 125 can be configured between multiple pixels P. The multiple second dikes 125 can be configured on the upper side of the multiple three-dimensional structures 130.

[0226] When viewed from above, multiple first dikes 120 may be located between multiple second dikes 125.

[0227] The distance d between multiple second dikes 125 can be the width W of pixel P or the width of the third sub-pixel SPb.

[0228] The distance d between multiple second subpixels 125 can be equal to the sum of the width of the first subpixel SPr and the width of the second subpixel SPb, but is not limited to this.

[0229] On the other hand, although Figure 9 The diagram shows that the first organic light-emitting element 140r and the second organic light-emitting element 140g are connected to the upper surface TS of the three-dimensional structure 130, but they can also be cut off from each other through subsequent processes.

[0230] Referring to Figures 10 and 11, the process of cutting the first organic light-emitting element and the second organic light-emitting element 140g apart on the upper surface TS of the three-dimensional structure 130 will be described.

[0231] Figures 10A to 10C The manufacturing process according to a first embodiment for preventing transverse current leakage is shown.

[0232] like Figure 10A As shown, the first organic light-emitting element 140r, the second organic light-emitting element 140g, the first inorganic insulating layer 150, the first organic insulating layer 160, etc., can be formed on the three-dimensional structure 130.

[0233] like Figure 10B As shown, an ashing process can be performed to remove the first organic insulating layer 160 so that the upper surface of the first inorganic insulating layer 150 can be exposed on the three-dimensional structure 130.

[0234] Subsequently, a dry etching process can be performed to remove the first inorganic insulating layer 150, the first cathode electrode 143r and the first organic light-emitting layer 142r of the first organic light-emitting element 140r, and the second cathode electrode 143g and the second organic light-emitting layer 142g of the second organic light-emitting element 140g. The dry etching process can continue until the upper surface TS of the three-dimensional structure 130 is exposed. As a result of the dry etching process, the upper ends of the first cathode electrode 143r and the first organic light-emitting layer 142r of the first organic light-emitting element 140r, and the upper ends of the second cathode electrode 143g and the second organic light-emitting layer 142g of the second organic light-emitting element 140g, are lower than the upper surface TS of the three-dimensional structure 130.

[0235] like Figure 10C As shown, an additional inorganic insulating layer 150a can be formed on the substrate 100. The additional inorganic insulating layer 150a can be referred to as the fourth inorganic insulating layer.

[0236] An additional inorganic insulating layer 150a may be formed on the upper surface TS of the exposed three-dimensional structure 130. The additional inorganic insulating layer 150a may be formed on the upper ends of the first cathode electrode 143r and the first organic light-emitting layer 142r of the first organic light-emitting element 140r, and on the upper ends of the second cathode electrode 143g and the second organic light-emitting layer 142g of the second organic light-emitting element 140g. The additional inorganic insulating layer 150a may be formed on the first organic insulating layer 160.

[0237] Therefore, the first organic light-emitting layer 142r of the first organic light-emitting element 140r and the second organic light-emitting layer 142g of the second organic light-emitting element 140g can place the three-dimensional structure 130 between them and spaced apart from each other. In this case, the low-resistance layer of the first organic light-emitting layer 142r and the low-resistance layer of the second organic light-emitting layer 142g place the three-dimensional structure 130 between them and spaced apart from each other, thereby preventing lateral current leakage between the first sub-pixel SPr and the second sub-pixel SPg. The low-resistance layer may, for example, include a hole injection layer, a charge generation layer, etc.

[0238] Figures 11A to 11C The manufacturing process according to a second embodiment for preventing transverse current leakage is shown.

[0239] like Figure 11A As shown, the first organic light-emitting element 140r, the second organic light-emitting element 140g, the first inorganic insulating layer 150, the first organic insulating layer 160, etc., can be formed on the three-dimensional structure 130.

[0240] Subsequently, a patterning process is performed to remove the first organic insulating layer 160 on the upper surface TS of the three-dimensional structure 130, thereby forming a contact hole 205 exposed on the upper surface TS of the first inorganic insulating layer 150 on the upper surface TS of the three-dimensional structure 130. The contact hole 205 can be located between the first sub-pixel SPr and the second sub-pixel SPg, along the second direction on the upper surface TS of the three-dimensional structure 130. Figure 8 The Y in the middle is formed.

[0241] like Figure 11B As shown, a dry etching process can remove the first inorganic insulating layer 150, the first cathode electrode 143r and the first organic light-emitting layer 142r of the first organic light-emitting element 140r, and the second cathode electrode 143g and the second organic light-emitting layer 142g of the second organic light-emitting element 140g from the three-dimensional structure 130. The dry etching process can be carried out until the upper surface TS of the three-dimensional structure 130 is exposed.

[0242] The photosensitive pattern used in the dry etching process can be the same as the photosensitive pattern used in the patterning process. Therefore, in the case of a dry etching process, the first inorganic insulating layer 150, the first cathode electrode 143r and the first organic light-emitting layer 142r of the first organic light-emitting element 140r, and the second cathode electrode 143g and the second organic light-emitting layer 142g of the second organic light-emitting element 140g can be removed through the contact hole 205 by the dry etching process.

[0243] like Figure 11C As shown, an additional inorganic insulating layer 150a may be formed on the substrate 100. The additional inorganic insulating layer 150a may be formed on the upper surface of the first organic insulating layer 160 and the contact hole 205.

[0244] Therefore, the first organic light-emitting layer 142r of the first organic light-emitting element 140r and the second organic light-emitting layer 142g of the second organic light-emitting element 140g can place the three-dimensional structure 130 between them and spaced apart from each other. In this case, since the low-resistance layer of the first organic light-emitting layer 142r and the low-resistance layer of the second organic light-emitting layer 142g place the three-dimensional structure 130 between them and spaced apart from each other, lateral current leakage between the first sub-pixel SPr and the second sub-pixel SPg can be prevented. The low-resistance layer may, for example, include a hole injection layer, a charge generation layer, etc.

[0245] On the other hand, such as Figure 11B as well as Figure 11C As shown, the first organic light-emitting layer 142r of the first organic light-emitting element 140r and the second organic light-emitting layer 142g of the second organic light-emitting element 140g can be removed by a dry etching process. In this case, if the three-dimensional structure 130 is made of an organic material, the upper surface TS of the three-dimensional structure 130 may be over-etched. Furthermore, the three-dimensional structure 130 can be made of black resin to prevent light leakage.

[0246] In this case, the organic components of the three-dimensional structure 130 may affect the lifetime of the first organic light-emitting layer 142r of the first organic light-emitting element 140r or the second organic light-emitting layer 142g of the second organic light-emitting element 140g. Furthermore, if the thickness of both the first anode electrode 141r and the second anode electrode 141g is relatively thick (500 Å or more), current concentration may occur at the upper ends or corners of both electrodes. During long-term operation, a short circuit between the anode and cathode electrodes may occur.

[0247] To solve the above problems, such as Figure 12 As shown, an additional embankment 121 can be configured on the upper surface TS of the three-dimensional structure 130.

[0248] After forming a first anode electrode 141r of a first organic light-emitting element 140r on a first side SS1 of the three-dimensional structure 130, and forming a second anode electrode 141g of a second organic light-emitting element 140g on a second side SS2 of the three-dimensional structure 130, an additional dam 121 can be formed.

[0249] One end of the first anode electrode 141r and one end of the second anode electrode 141g can be lower than the upper surface TS of the three-dimensional structure 130. Therefore, after the first anode electrode 141r and the second anode electrode 141g are formed, the upper surface TS of the three-dimensional structure 130, a portion of the upper side of the first side SS1, and a portion of the upper side of the second side SS2 can be exposed.

[0250] The additional dam 121 can be formed in the exposed areas, namely the upper surface TS of the three-dimensional structure 130, a portion of the upper side of the first side SS1, and a portion of the upper side of the second side SS2. The additional dam 121 can be formed on the first side SS1 of the three-dimensional structure 130 in a perpendicular overlap with the upper region of the first anode electrode 141r, and can be formed on the second side SS2 of the three-dimensional structure 130 in a perpendicular overlap with the upper region of the second anode electrode 141g.

[0251] The three-dimensional structure 130 can pass through the first anode electrode 141r, the second anode electrode 141g, and the additional dam 121 without being exposed.

[0252] Therefore, as Figure 10B as well as Figure 11C As shown, although the first organic light-emitting layer 142r of the first organic light-emitting element 140r and the second organic light-emitting layer 142g of the second organic light-emitting element 140g are removed by a dry etching process, the additional dam 121 can act as a stopper, so the upper surface TS of the three-dimensional structure 130 can be prevented from being over-etched.

[0253] Furthermore, by adding a dam 121, the organic components of the three-dimensional structure 130 are physically separated from the first organic light-emitting layer 142r of the first organic light-emitting element 140r or the second organic light-emitting layer 142g of the second organic light-emitting element 140g, which can prevent the lifespan of the first organic light-emitting element 140r or the second organic light-emitting element 140g from being shortened.

[0254] Meanwhile, since the upper ends or corners of the first anode electrode 141r and the second anode electrode 141g are covered by the additional dam 121, the current concentration at the upper ends or corners of the first anode electrode 141r and the second anode electrode 141g can be cut off, so that even if driven for a long time, an electrical short circuit between the anode electrode and the cathode electrode will not occur.

[0255] Figures 13A to 13D The manufacturing process of the additional embankment disposed on the upper surface of the three-dimensional structure is shown.

[0256] like Figure 13A As shown, the first anode electrode 141r and the second anode electrode 141g can be formed on the first side SS1 and the second side SS2 of the three-dimensional structure 130, and a plurality of first embankments 120 can be formed between the three-dimensional structure 130.

[0257] like Figure 13B As shown, the photosensitive film 210 can be formed on the substrate 100, and after a soft baking process, an exposure process can be performed.

[0258] like Figure 13C As shown, the upper region of the photosensitive film 210 can be removed by performing a development process. As a result, the upper surface TS of the three-dimensional structure 130 is exposed, and the upper surface TS of the photosensitive film 210 can be positioned lower than the upper end of the first anode electrode 141r and / or the upper end of the second anode electrode 141g.

[0259] like Figure 13D As shown, after the inorganic film 121a is formed on the substrate 100, a lift-off process can be performed. By performing the lift-off process, the photosensitive film 210 and the inorganic film 121a between the three-dimensional structures 130 can be removed. As a result, an additional dam 121 can be formed on the upper periphery of the three-dimensional structure 130. The additional dam 121 can be formed on the upper surface TS of the three-dimensional structure 130. The additional dam 121 can be formed on the upper region of the first side SS1 and the upper region of the second side SS2 of the three-dimensional structure 130.

[0260] [Fourth Embodiment] Figure 14 This is a cross-sectional view of an organic light-emitting display device according to a fourth embodiment. Figure 14 In order to be in Figure 8 A cross-sectional view taken along line B-B' in an organic light-emitting display device.

[0261] Except that the first side SS1 and the second side SS2 of the three-dimensional structure 130 are each perpendicular to the substrate 100, the fourth embodiment and the third embodiment ( Figure 9 The same as in the third embodiment. In the fourth embodiment, for the same as in the third embodiment ( Figure 9 Components having the same structure, shape and / or function are given the same reference numerals and their detailed descriptions are omitted.

[0262] Reference Figure 8 and Figure 14The organic light-emitting display device according to the fourth embodiment may include: a substrate 100; a plurality of driving circuits 101r, 101g, 101b; a protective layer 110; a plurality of three-dimensional structures 130; a plurality of dams 120, 125; a plurality of organic light-emitting elements 140r, 140g, 140b; a plurality of insulating layers 150-153, 160, etc.

[0263] The first side SS1 and the second side SS2 of the three-dimensional structure 130 can each be perpendicular to the substrate 100. For example, the first side SS1 and the second side SS2 of the three-dimensional structure 130 can each be at a 90-degree angle relative to the substrate 100. In this case, the first organic light-emitting element 140r can be disposed on the first sub-pixel SPr on the first side SS1 of the three-dimensional structure 130, and the second organic light-emitting element 140g can be disposed on the second sub-pixel SPg on the second side SS2 of the three-dimensional structure 130.

[0264] Since the first side SS1 and the second side SS2 of the three-dimensional structure 130 are each perpendicular to the substrate 100, when viewed from the front, the occupied area of ​​the first organic light-emitting element 140r and the occupied area of ​​the second organic light-emitting element 140g can be minimized, thus achieving ultra-high resolution display.

[0265] In contrast, since the first side SS1 and the second side SS2 of the three-dimensional structure 130 each have their own light-emitting areas of the first sub-pixel SPr and the second sub-pixel SPg, the first color light and the second color light can be emitted fully forward, which can prevent the decrease in lifetime luminous efficiency.

[0266] Figures 10A to 10C The illustrated transverse current leakage prevention structure can be applied to Figure 14 .

[0267] In this configuration, multiple insulating layers 150, 150a, 151, 153, 160, and 161 can be disposed between the first organic light-emitting element 140r, the second organic light-emitting element 140g, and the third organic light-emitting element 140b. A first inorganic insulating layer 150 and a first organic insulating layer 160 can be disposed between the first organic light-emitting element 140r and the second organic light-emitting element 140g. The first inorganic insulating layer 150 and the first organic insulating layer 160 can surround the sides SS1 and SS2 of the three-dimensional structure 130.

[0268] An additional inorganic insulating layer 150a, a second organic insulating layer 161, and a second inorganic insulating layer 151 can be disposed on the three-dimensional structure 130 and the first organic insulating layer 160. A third inorganic insulating layer 153 can be disposed on the third cathode electrode 143b of the third organic light-emitting element 140b.

[0269] Figure 15 Show Figure 14 The path of light in region L.

[0270] The first color light emitted from the first organic light-emitting element 140r and the second color light emitted from the second organic light-emitting element 140g can travel to the organic insulating layer 160 between the three-dimensional structures 130.

[0271] For example, the first anode electrode 141r and the second anode electrode 141g may include reflective electrodes. Similarly, the first cathode electrode 143r and the second cathode electrode 143g may include a translucent conductive film. In this case, the first color light or the second color light can be reflected and emitted forward through the reflective electrodes and the conductive film.

[0272] Here, P1 and P2 can represent light paths. For example, the first color light can travel laterally within the first organic light-emitting element 140r towards the organic light-emitting layer 142r (P1). For example, the first color light can be reflected upwards within the first organic light-emitting element 140r and emitted forward (P2).

[0273] That is, the first color light can be enhanced by interference and emit light in the direction of current flow of the first organic light-emitting element 140r, and the light that is totally internally reflected inside the first organic light-emitting element 140r can emit light along the second path P2 in a direction perpendicular to the current direction. In particular, according to Figure 15 In the structure shown, the first color light can be reflected by the auxiliary electrode 111 connected to the first anode electrode 141r and effectively emit light in the upward direction.

[0274] The organic insulating layer 160 may include light-scattering particles. In this case, light traveling along the first path P1 can be scattered by the light-scattering particles at the organic insulating layer 160 and emitted forward. More light is extracted to the outside by the light-scattering particles, and the luminance can be enhanced.

[0275] The detailed description above should be construed as exemplary, not restrictive, in all respects. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and the scope of the embodiments includes all variations within the equivalent scope of the embodiments.

Claims

1. An organic light-emitting display device, wherein, include: Multiple three-dimensional structures on the substrate; as well as Multiple pixels on the substrate Each of the plurality of pixels includes a first sub-pixel, a second sub-pixel, and a third sub-pixel, each having a three-dimensional structure. The first sub-pixel is disposed on the first side of the stereostructure. The second sub-pixel is disposed on the second side of the three-dimensional structure. The second sub-pixel is configured to horizontally overlap with the first sub-pixel. The third sub-pixel is configured on the first sub-pixel and the second sub-pixel. The first sub-pixel includes a first organic light-emitting element. The second sub-pixel includes a second organic light-emitting element. The third sub-pixel includes a third organic light-emitting element.

2. The organic light-emitting display device according to claim 1, wherein, The third sub-pixel is disposed on the upper surface of the stereostructure.

3. The organic light-emitting display device according to claim 2, wherein, The second organic light-emitting element is arranged horizontally overlapping the first organic light-emitting element. The third organic light-emitting element is disposed on the upper surface of the three-dimensional structure.

4. The organic light-emitting display device according to claim 3, wherein, The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element each include an anode electrode, a low-resistivity layer, an organic light-emitting layer, and a cathode electrode. The anode electrode is independently disposed in the first sub-pixel, the second sub-pixel, and the third sub-pixel.

5. The organic light-emitting display device according to claim 4, wherein, The low-resistance layer of the first organic light-emitting element and the low-resistance layer of the second organic light-emitting element are disposed alternately between the plurality of three-dimensional structures. The first organic light-emitting layer of the first organic light-emitting element and the second organic light-emitting layer of the second organic light-emitting element are vertically overlapped and disposed between the plurality of three-dimensional structures.

6. The organic light-emitting display device according to claim 4, wherein, The low-resistance layer, organic light-emitting layer, and cathode electrode of the first organic light-emitting element are spaced apart from and disposed on the upper surface of the three-dimensional structure, along with the low-resistance layer, organic light-emitting layer, and cathode electrode of the second organic light-emitting element.

7. The organic light-emitting display device according to claim 4, wherein, The first anode electrode of the first organic light-emitting element and the second anode electrode of the second organic light-emitting element both include reflective metal. The first cathode electrode of the first organic light-emitting element and the second cathode electrode of the second organic light-emitting element include transparent or semi-transparent conductive films.

8. The organic light-emitting display device according to claim 1, wherein, The third sub-pixel is disposed between the first sub-pixel and the second sub-pixel among the plurality of 3D structures.

9. The organic light-emitting display device according to claim 8, wherein, The size of the pixel is equal to the size of the third sub-pixel.

10. The organic light-emitting display device according to claim 8, wherein, The size of the pixel is equal to the sum of the size of the first sub-pixel and the size of the second sub-pixel.

11. The organic light-emitting display device according to claim 8, wherein, The second organic light-emitting element is arranged horizontally overlapping the first organic light-emitting element. The third organic light-emitting element is arranged to overlap vertically with the first organic light-emitting element and the second organic light-emitting element.

12. The organic light-emitting display device according to claim 8, wherein, The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element each include an anode electrode, an organic light-emitting layer, and a cathode electrode. The anode electrode is independently disposed in the first sub-pixel, the second sub-pixel, and the third sub-pixel. The cathode electrodes are disposed together in the first sub-pixel and the second sub-pixel.

13. The organic light-emitting display device according to claim 12, wherein, The first sub-pixel, the second sub-pixel, and the third sub-pixel each include a light-emitting region and a non-light-emitting region. The luminescent region has a size corresponding to that of the anode electrode.

14. The organic light-emitting display device according to claim 13, wherein, The size of the third anode electrode of the third organic light-emitting element is larger than the size of the first anode electrode of the first organic light-emitting element or the size of the second anode electrode of the second organic light-emitting element.

15. The organic light-emitting display device according to claim 13, wherein, The third anode electrode of the third organic light-emitting element overlaps perpendicularly with the first anode electrode of the first organic light-emitting element and the second anode electrode of the second organic light-emitting element.

16. The organic light-emitting display device according to claim 12, wherein, The ends of the organic light-emitting layers of the first organic light-emitting element and the second organic light-emitting element are below the upper surface of the three-dimensional structure.

17. The organic light-emitting display device according to claim 1, wherein, include: Multiple first dikes between the multiple three-dimensional structures; as well as Multiple second dikes between the plurality of third sub-pixels.

18. The organic light-emitting display device according to claim 17, wherein, The distance between the plurality of second dikes is the same as the width of the pixel or the width of the third sub-pixel.

19. The organic light-emitting display device according to claim 1, wherein, include: Multiple insulating layers between the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element. The plurality of insulating layers includes at least one organic insulating layer and at least one inorganic insulating layer.

20. The organic light-emitting display device according to claim 1, wherein, The first and second sides of the three-dimensional structure are either inclined to the ground or perpendicular to the ground.