A polishing device for an ultra-high vacuum cryopump housing

Abstract

This invention discloses a polishing device for a cryogenic pump housing, comprising a clamping platform, a control arm, and a polishing assembly. The clamping platform includes a base plate, a turntable, and a clamping assembly. The clamping assembly is mounted on the turntable to clamp and fix the cryogenic pump housing. The turntable is rotatably mounted on the base plate. The control arm is used to adjust the movement of the polishing assembly in the vertical and horizontal directions. The polishing assembly includes a support frame, a deflection bracket, a telescopic rod, and a polishing unit. One end of the support frame is connected to the control arm, and the other end is hinged to the deflection bracket. Both ends of the telescopic rod are connected to the support frame and the deflection bracket, respectively. The polishing unit includes a pivot shaft, a polishing wheel, and a first driver. One end of the pivot shaft is connected through the deflection bracket, and the polishing wheel is sleeved on the other end of the pivot shaft and is poweredly connected to the first driver. Therefore, this invention adjusts the deflection angle of the polishing wheel by means of a telescopic adjustment rod, thereby meeting the polishing needs of the bottom of various housings with different curvature sizes. At the same time, it can also improve the fit between the polishing wheel and the curved area at the bottom of the housing, ensure the fit between the polishing wheel and the curved surface of the inner wall of the housing, and avoid problems such as local missed polishing, uneven polishing or over-grinding caused by angular deviation, thus effectively improving the polishing quality of the curved area of ​​the housing.

Description

Technical Field

[0001] This invention relates to the field of ultra-vacuum equipment technology, and in particular to a polishing device for ultra-vacuum cryogenic pump housings. Background Technology

[0002] A cryogenic vacuum pump is a device that uses cryogenic condensation and adsorption to capture gas molecules to achieve a high vacuum environment. High-sealing, large-diameter cryogenic vacuum pumps are widely used in semiconductor manufacturing, aerospace simulation, high-energy physics research and other fields due to their unique ability to handle large gas volumes. Its core structure includes a pump casing, a primary cold head and an outer radiation baffle, a secondary cold head and an outer condensation array. The cryogenic condensation array is cooled to an extremely low temperature below 20K by a refrigerant (such as liquid nitrogen, liquid helium or GM refrigerator), thereby condensing and capturing gas molecules.

[0003] The inner wall of the pump body vacuum chamber usually needs to be mirror-finished. If the inner wall of the pump body vacuum chamber is rough, the surface area is larger than that of a mirror-finished inner wall, making it easier to adsorb gases and water vapor. Under high vacuum, these adsorbed gases will slowly be released, destroying the vacuum. In addition, the rough surface is prone to shedding and dust accumulation, which can easily contaminate wafers, targets, and coated products during vacuum operations. Therefore, polishing the inner wall of the pump body vacuum chamber to a "mirror-finish" state can make the inner wall of the vacuum chamber cleaner.

[0004] Although using traditional polishing equipment to polish the inner wall of the pump body vacuum chamber is effective and efficient, the bottom of the existing pump body vacuum chamber is curved, which inevitably creates polishing "dead corners". As a result, employees can only use small handheld polishing machines to perform local polishing operations. This not only makes it easy for the polishing quality to be inconsistent and difficult to achieve a mirror finish, but also makes the polishing efficiency quite low, affecting the production efficiency of the cryogenic vacuum pump. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a polishing device for the housing of an ultravacuum cryogenic pump.

[0006] A polishing apparatus for a cryogenic pump housing according to an embodiment of the present invention includes: A clamping platform, comprising a base plate, a turntable, and a clamping assembly, wherein the clamping assembly is disposed on the turntable to clamp and fix the cryogenic pump housing, and the turntable is disposed on the base plate; A control arm, fixedly mounted on the base plate, is used to adjust the movement of the polishing assembly in the vertical and horizontal directions; A polishing assembly includes a support frame, a deflection bracket, a telescopic rod, and a polishing unit. One end of the support frame is connected to the control arm, and the other end is hinged to the deflection bracket. Both ends of the telescopic rod are connected to the support frame and the deflection bracket, respectively. The polishing unit includes a pivot shaft, a polishing wheel, and a first driver. One end of the pivot shaft is connected through the deflection bracket, and the polishing wheel is sleeved on the other end of the pivot shaft and is poweredly connected to the first driver.

[0007] According to some embodiments of the present invention, the clamping platform includes a second driver that is poweredly connected to the turntable to drive the turntable to rotate.

[0008] According to some embodiments of the present invention, the polishing assembly further includes: a driving wheel, a driven wheel, a guide wheel, and a transmission belt. The first driver is disposed on the support frame, the driving wheel is connected to the output shaft of the first driver, the driven wheel is connected to the polishing wheel, the guide wheel is hinged to the support frame and coaxially arranged with the deflection bracket, and the transmission belt is simultaneously embedded in the driving wheel, the driven wheel, and the guide wheel.

[0009] According to some embodiments of the present invention, the polishing wheel includes an upper cover plate, a polishing disc, and a lower cover plate. The upper cover plate is detachably connected to the driven wheel, and the lower cover plate is detachably connected to the upper cover plate. The polishing disc is limited and sleeved between the upper cover plate and the lower cover plate.

[0010] In some embodiments of the present invention, a pressure sensor is provided at the inner diameter of the polishing wheel.

[0011] According to some embodiments of the present invention, the control arm includes a lifting arm and a horizontal arm. The lifting arm is fixedly mounted on the base plate, the horizontal arm is mounted on the lifting arm and moves up and down along the lifting arm, and the support frame is connected to the horizontal arm and moves left and right along the horizontal arm.

[0012] According to some embodiments of the present invention, the lifting arm includes a lifting screw and a lifting slider, the lifting slider being limitedly connected to the lifting screw, and the transverse arm being connected to the lifting slider; and / or The transverse arm includes a transverse lead screw and a transverse slider, the transverse slider being limited and connected to the transverse lead screw, and the support frame being connected to the transverse slider.

[0013] According to some embodiments of the present invention, the lifting arm adopts a telescopic rod structure, and / or the lateral arm adopts a telescopic rod structure.

[0014] According to some embodiments of the present invention, the clamping assembly includes slide rails arranged in a ring array, a limiting slider is slidably embedded on the slide rails, a limiting screw is provided on the limiting slider, and when the limiting slider abuts against the cryogenic pump housing, the end of the limiting screw abuts against the slide rails.

[0015] According to some embodiments of the present invention, the surface of the limiting slider is provided with a rubber layer. Beneficial effects

[0016] This invention adjusts the deflection angle of the polishing wheel by using a telescopic adjustment rod, thereby meeting the polishing needs of the bottom of various housings with different curvature sizes. At the same time, it can improve the fit between the polishing wheel and the curved area at the bottom of the housing, and ensure the fit between the polishing wheel and the curved surface of the inner wall of the housing. This avoids problems such as local missed polishing, uneven polishing, or over-polishing caused by angular deviation, and effectively improves the polishing quality of the curved area of ​​the housing. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the overall structure of the polishing device for the housing of the ultra-vacuum cryogenic pump according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of the polishing assembly according to an embodiment of the present invention; Figure 3 This is a cross-sectional structural diagram of the polishing unit according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the polishing wheel in a vertical position according to an embodiment of the present invention.

[0018] Figure label: 100. Polishing device for ultra-vacuum cryogenic pump housing; 1. Base plate; 11. Second driver; 2. Turntable; 3. Clamping assembly; 4. Lifting arm; 5. Lateral arm; 6. Polishing assembly; 61. Support frame; 62. Deflection bracket; 63. Drive wheel; 64. Driven wheel; 65. Guide wheel; 66. Drive belt; 7. Telescopic rod; 8. Polishing unit; 81. Pivot shaft; 82. Polishing wheel; 821. Upper cover plate; 822. Lower cover plate; 823. Polishing disc; 83. First driver. Detailed Implementation

[0019] The technical solutions of the embodiments disclosed in this application will be clearly and completely described below with reference to the accompanying drawings. The descriptions of the embodiments are merely illustrative and exemplary, and are not intended to limit the scope of this disclosure or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort should fall within the scope of protection of this disclosure. Furthermore, techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification.

[0020] Combination Figures 1 to 4 As shown in the figure, a polishing device for a cryogenic pump housing according to an embodiment of the present invention includes: a clamping platform, a control arm, and a polishing assembly 6. The clamping platform includes a base plate 1, a turntable 2, and a clamping assembly 3. The clamping assembly 3 is disposed on the turntable 2 to clamp and fix the cryogenic pump housing. The turntable 2 is rotatably disposed on the base plate 1. The control arm is fixedly disposed on the base plate 1 and is used to adjust the movement of the polishing assembly 6 in the vertical and horizontal directions. The polishing assembly 6 includes a support frame 61, a deflection bracket 62, a telescopic rod 7, and a polishing unit 8. One end of the support frame 61 is connected to the control arm, and the other end is hinged to the deflection bracket 62. The two ends of the telescopic rod 7 are respectively connected to the support frame 61 and the deflection bracket 62. The polishing unit 8 includes a pivot shaft 81, a polishing wheel 82, and a first driver 83. One end of the pivot shaft 81 is connected through to the deflection bracket 62, and the polishing wheel 82 is sleeved on the other end of the pivot shaft 81 and is poweredly connected to the first driver 83.

[0021] During polishing, the opening of the cryogenic pump housing to be polished is placed vertically upward on the clamping platform, and the housing and the clamping platform are set coaxially to ensure that the housing can rotate synchronously with the turntable 2. After the cryogenic pump housing is fixed by the clamping platform, the polishing assembly 6 is moved up and down and horizontally by the control arm to adjust the position between the polishing wheel 82 and the inner wall of the housing. At the same time, the extension and retraction of the telescopic rod 7 can drive the deflection bracket 62 to swing, adjust the deflection angle of the polishing wheel 82, and thus polish the inner wall of the housing to achieve a "mirror" state.

[0022] Specifically, when the telescopic rod 7 reaches its maximum extension, the polishing wheel 82 is in a vertical position, allowing it to polish the bottom wall of the housing. When the telescopic rod 7 reaches its minimum extension, the polishing wheel 82 is in a horizontal position, allowing it to polish the inner wall of the housing. When the telescopic rod 7 is between its maximum and minimum extension, the polishing wheel 82 is in an inclined position, allowing the extension to be adjusted according to the curvature of the bottom of the housing to be polished. This ensures that the deflection angle of the polishing wheel 82 matches the curved area at the bottom of the housing, thereby improving the polishing efficiency of the curved area.

[0023] Therefore, the present invention adjusts the deflection angle of the polishing wheel 82 by means of a telescopic adjustment rod, thereby meeting the polishing requirements of the bottom of various housings with different curvature sizes. At the same time, it can also improve the fit between the polishing wheel 82 and the curved area at the bottom of the housing, ensure the fit between the polishing wheel 82 and the curved surface of the inner wall of the housing, avoid problems such as local missed polishing, uneven polishing or over-grinding caused by angular deviation, and effectively improve the polishing quality of the curved area of ​​the housing.

[0024] Furthermore, the polishing wheel 82 of the present invention, combined with the drive structure, can achieve continuous polishing of the entire inner wall of the housing, realizing automated polishing operations, thereby significantly reducing the intensity of manual labor and improving the overall efficiency and consistency of polishing operations.

[0025] Furthermore, based on the above embodiments, one alternative method for the power connection between the first driver 83 and the polishing wheel 82 is that the first driver 83 can be mounted on the deflection bracket 62. In this case, the pivot shaft 81 can directly become the power output shaft of the first driver 83, or the power output shaft of the first driver 83 can be connected to the pivot shaft 81, so that the power of the first driver 83 can be directly transmitted to the polishing wheel 82, driving the polishing wheel 82 to rotate. This power connection method has a simple structure and high transmission efficiency.

[0026] However, since the polishing assembly 6 needs to be angled, in order to avoid interference between the telescopic rod 7 and the first driver 83, it is often necessary to lengthen the deflection bracket 62. However, this will increase the lateral operating width of the polishing assembly 6. When the polishing assembly 6 is inserted into the cryogenic pump housing, the size of the widened deflection bracket 62 has higher requirements on the inner diameter of the housing. This will limit the use of the polishing assembly 6 in this embodiment in a smaller cryogenic pump housing.

[0027] Therefore, preferably, such as Figure 2 As shown, another alternative method for the power connection between the first driver 83 and the polishing wheel 82 is as follows: the polishing assembly 6 includes a driving wheel 63, a driven wheel 64, a guide wheel 65, and a transmission belt 66. The first driver 83 is mounted on the support frame 61. The driving wheel 63 is connected to the output shaft of the first driver 83. The driven wheel 64 is connected to the polishing wheel 82 and is located above the polishing wheel 82. The guide wheel 65 is hinged to the support frame 61 and coaxially arranged on both sides of the deflection bracket 62. The transmission belt 66 is simultaneously embedded in the driving wheel 63, the driven wheel 64, and the guide wheel 65, thereby using the guide wheel 65 to limit and change the bending angle of the transmission belt 66 to form an inclined transmission path.

[0028] Therefore, with this structural design, the first driver 83 can be positioned away from the polishing wheel 82, and the transmission belt 66 can be used to achieve variable angle power transmission. This can effectively avoid interference between the telescopic rod 7 and the first driver 83, thereby reducing the length of the deflection bracket 62 and facilitating the polishing assembly 6 to perform polishing operations in a smaller housing.

[0029] In some embodiments of this application, such as Figure 3 As shown, a pivot shaft 81 extends vertically through the deflection bracket 62. A polishing wheel 82 and a driven wheel 64 are mounted on the pivot shaft 81. The polishing wheel 82 includes an upper cover plate 821, a polishing disc 823, and a lower cover plate 822. The upper cover plate 821 is detachably connected to the driven wheel 64, and the lower cover plate 822 is detachably connected to the upper cover plate 821 or the end of the pivot shaft 81. The polishing disc 823 is positioned between the upper cover plate 821 and the lower cover plate 822. In use, the polishing wheel 82 can be replaced not only by removing the end cover, but also by replacing the polishing wheel 82 with a different grit to improve the polishing effect on the housing.

[0030] Preferably, a pressure sensor can also be installed at the inner diameter of the polishing wheel 82. The pressure sensor can be a ring pressure sensor. Since applying a certain pressure between the polishing wheel 82 and the inner wall of the housing can improve the polishing effect, the installed pressure sensor is used to monitor the pressure between the polishing wheel 82 and the inner wall of the housing during polishing. The polishing pressure between the polishing wheel 82 and the inner wall of the housing is adjusted according to the pressure data of the pressure sensor, thereby improving the polishing effect.

[0031] In some embodiments of this application, as one of the alternatives to the control arm, an industrial robot arm can be used to meet the needs of the polishing component 6 to move and adjust in the vertical and horizontal directions. However, since the industrial robot arm is expensive and bulky, it is not suitable for use in small-diameter housings.

[0032] Therefore, preferably, as another alternative to the control arm, the control arm includes a lifting arm 4 and a horizontal arm 5. The lifting arm 4 is fixedly mounted on the base plate 1, the horizontal arm 5 is mounted on the lifting arm 4 and moves up and down along the lifting arm 4, and the support frame 61 is connected to the horizontal arm 5 and moves left and right along the horizontal arm 5.

[0033] More specifically, the lifting arm 4 includes a lifting screw and a lifting slider. The lifting slider is threadedly connected to the lifting screw, and both ends of the lifting slider are respectively limited in the slide groove. The transverse arm 5 is connected to the lifting slider. When the lifting screw rotates, the lifting slider moves up and down due to the limiting effect of the slide groove, thereby driving the transverse arm 5 to move up and down.

[0034] Similarly, the transverse arm 5 includes a transverse lead screw and a transverse slider. The transverse slider is threadedly connected to the transverse lead screw, and the two ends of the transverse slider are limited and slidably disposed in the slide groove. The support frame 61 is connected to the transverse slider. In this way, when the transverse lead screw rotates, the transverse slider is limited by the slide groove, which enables it to move up and down, thereby driving the support frame 61 to move up and down.

[0035] Therefore, in this embodiment, the combination of lead screw and slider makes the structure simpler and more efficient, reducing manufacturing and usage costs while improving operational reliability.

[0036] In addition, as one of the alternatives to the lifting arm 4 or the horizontal arm 5, the lifting arm 4 and the horizontal arm 5 can also adopt the telescopic rod 7 structure.

[0037] In some embodiments of this application, the clamping component 3 may adopt the structure of a triangular welded chuck. Specifically, the clamping component 3 includes slide rails distributed in a ring array. A limiting slider is slidably embedded on the slide rails, and a limiting screw is passed through the limiting slider. The end of the limiting screw abuts against the slide rail. In use, after the cryogenic pump housing is placed on the turntable 2, the limiting slider can be abutted against the cryogenic pump housing first, and then the limiting screw can be tightened until the end is tightly abutted against the slide rail surface, thereby playing a limiting role.

[0038] Preferably, a rubber layer can be provided on the surface of the limiting slider, at least on the end face that contacts the housing, so as to reduce the damage of the limiting slider to the outer surface of the cryogenic pump housing.

[0039] In some embodiments of this application, the clamping platform further includes a second driver 11, which is poweredly connected to the turntable 2 to drive the turntable 2 to rotate, thereby improving the polishing efficiency.

[0040] In the description of this invention, it should be understood that if terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0041] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0042] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A polishing device for the housing of an ultra-vacuum cryogenic pump, characterized in that, include: A clamping platform, comprising a base plate, a turntable, and a clamping assembly, wherein the clamping assembly is disposed on the turntable to clamp and fix the cryogenic pump housing, and the turntable is disposed on the base plate; A control arm, fixedly mounted on the base plate, is used to adjust the movement of the polishing assembly in the vertical and horizontal directions; A polishing assembly includes a support frame, a deflection bracket, a telescopic rod, and a polishing unit. One end of the support frame is connected to the control arm, and the other end is hinged to the deflection bracket. Both ends of the telescopic rod are connected to the support frame and the deflection bracket, respectively. The polishing unit includes a pivot shaft, a polishing wheel, and a first driver. One end of the pivot shaft is connected through the deflection bracket, and the polishing wheel is sleeved on the other end of the pivot shaft and is poweredly connected to the first driver.

2. The polishing device for a cryogenic pump housing according to claim 1, characterized in that, The clamping platform includes a second driver, which is poweredly connected to the turntable to drive the turntable to rotate.

3. A polishing device for a cryogenic pump housing according to claim 1 or 2, characterized in that, The polishing assembly further includes: a driving wheel, a driven wheel, a guide wheel, and a transmission belt. The first driver is mounted on the support frame. The driving wheel is connected to the output shaft of the first driver. The driven wheel is connected to the polishing wheel. The guide wheel is hinged to the support frame and coaxially arranged with the deflection bracket. The transmission belt is simultaneously embedded in the driving wheel, the driven wheel, and the guide wheel.

4. The polishing device for a cryogenic pump housing according to claim 3, characterized in that, The polishing wheel includes an upper cover plate, a polishing disc, and a lower cover plate. The upper cover plate is detachably connected to the driven wheel, and the lower cover plate is detachably connected to the upper cover plate. The polishing disc is limited and sleeved between the upper cover plate and the lower cover plate.

5. The polishing device for a cryogenic pump housing according to claim 3, characterized in that, A pressure sensor is installed at the inner diameter of the polishing wheel.

6. A polishing device for a cryogenic pump housing according to claim 4 or 5, characterized in that, The control arm includes a lifting arm and a horizontal arm. The lifting arm is fixedly mounted on the base plate, the horizontal arm is mounted on the lifting arm and moves up and down along the lifting arm, and the support frame is connected to the horizontal arm and moves left and right along the horizontal arm.

7. A polishing device for a cryogenic pump housing according to claim 6, characterized in that, The lifting arm includes a lifting screw and a lifting slider, the lifting slider being limited and connected to the lifting screw, and the transverse arm being connected to the lifting slider; and / or The transverse arm includes a transverse lead screw and a transverse slider, the transverse slider being limited and connected to the transverse lead screw, and the support frame being connected to the transverse slider.

8. A polishing device for a cryogenic pump housing according to claim 6, characterized in that, The lifting arm adopts a telescopic rod structure, and / or the lateral arm adopts a telescopic rod structure.

9. A polishing device for a cryogenic pump housing according to claim 3, characterized in that, The clamping assembly includes slide rails arranged in a ring array. A limiting slider is slidably embedded in the slide rails. A limiting screw passes through the limiting slider. When the limiting slider abuts against the cryogenic pump housing, the end of the limiting screw abuts against the slide rail.

10. A polishing device for a cryogenic pump housing according to claim 9, characterized in that, The surface of the limiting slider is provided with a rubber layer.

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