Temperature control-based micro-electromechanical gyroscope zero bias compensation method, device and equipment

Abstract

This invention relates to a method, apparatus, and device for zero-bias compensation of microelectromechanical gyroscopes (MEMS) based on temperature control, and pertains to the field of inertial sensor technology. The method includes: placing a heating chip on the back of the MEMS chip and constructing a chip-level temperature control system; adjusting the temperature to a preset desired temperature and maintaining a constant temperature state using the driving frequency as the controlled variable; collecting zero-bias output data, driving force data, and driving frequency data of the MEMS chip under constant temperature conditions as a sample set to calculate a final bivariate cubic fitting model; continuously maintaining the constant temperature state of the MEMS chip and collecting real-time driving force and driving frequency under the current operating state; then substituting these values ​​into the final bivariate cubic fitting model to calculate the zero-bias compensation value; and finally subtracting the zero-bias compensation value from the current zero-bias output result of the MEMS chip to complete the zero-bias compensation. This invention effectively suppresses the influence of temperature and operating parameters on zero-bias, improving the measurement accuracy and stability of the MEMS gyroscope.

Description

Technical Field

[0001] This invention relates to the field of inertial sensor technology, and in particular to a method, apparatus, and device for zero-bias compensation of a microelectromechanical gyroscope based on temperature control. Background Technology

[0002] Microelectromechanical (MEMS) gyroscopes, as important inertial measurement elements, have been widely used in devices requiring attitude sensing and motion state measurement, such as automotive electronics, industrial control, and consumer electronics, due to their advantages of small size, light weight, low cost, low power consumption, high reliability, and ease of digitization. Their zero-bias stability directly determines the measurement accuracy and operational reliability of these devices. In practical applications, temperature variation is a key factor affecting the zero-bias stability of MEMS gyroscopes. Fluctuations in ambient temperature can cause changes in material properties, structural dimensions, and residual stress, leading to zero-bias drift in key parameters such as the gyroscope's resonant frequency, quality factor, and detection sensitivity. If this drift cannot be effectively controlled, it will severely impact the overall performance of the device, making it difficult to meet the stringent requirements of high-precision applications.

[0003] To reduce the impact of temperature variations on the zero bias of microelectromechanical gyroscopes (MEMS), existing technologies mainly employ two types of techniques: hardware temperature control and software compensation. Hardware temperature control often relies on a constant temperature chamber or external heating element to construct the temperature control system. This system regulates the temperature of the gyroscope's environment or overall structure to suppress zero bias changes caused by temperature fluctuations. However, these methods generally suffer from large size and high power consumption. Furthermore, they exhibit strong thermal inertia and slow temperature response during the temperature control process, making it difficult to achieve precise and rapid temperature control of the gyroscope chip itself. This makes them particularly unsuitable for miniaturized applications with strict limitations on size and power consumption.

[0004] Software compensation methods mainly establish a mathematical model between zero bias and temperature, and correct the zero bias drift based on temperature parameters. Existing software compensation schemes mostly use a single temperature parameter to build a fitting model. However, in practical applications, the zero bias drift of a microelectromechanical gyroscope is not only affected by temperature, but also has a complex relationship with the driving force, driving frequency and other operating parameters during the gyroscope's operation. A fitting model based on a single temperature parameter is difficult to fully reflect the changing law of zero bias drift. Especially in scenarios with rapid temperature changes or local temperature gradients, the compensation accuracy is limited, and it is impossible to effectively eliminate residual zero bias errors, making it difficult to meet the requirements of high-precision measurement. Summary of the Invention

[0005] Therefore, it is necessary to provide a temperature-controlled microelectromechanical gyroscope zero-bias compensation method, device, and equipment that can balance temperature control accuracy and compensation effect to address the above-mentioned technical problems.

[0006] A temperature-controlled microelectromechanical gyroscope zero-bias compensation method, the method comprising:

[0007] Step 1: A heating chip is placed on the back of the microelectromechanical gyroscope chip, and a chip-level temperature control system is constructed based on the heating chip; the temperature of the microelectromechanical gyroscope chip is adjusted to a preset desired temperature and maintained at a constant temperature using the driving frequency of the microelectromechanical gyroscope as the controlled variable. The preset desired temperature is higher than the highest temperature of the microelectromechanical gyroscope in the entire temperature range; the zero-bias output data, driving force data, and driving frequency data of the microelectromechanical gyroscope under constant temperature conditions are collected simultaneously. Step 2: Construct a bivariate cubic fitting model. Using the zero-biased output data, the driving force data, and the driving frequency data as the sample set, solve the bivariate cubic fitting model to obtain the final bivariate cubic fitting model. Step 3: Continuously maintain the constant temperature state of the microelectromechanical gyroscope chip through the chip-level temperature control system, and collect the real-time driving force and real-time driving frequency of the microelectromechanical gyroscope in the current working state; substitute the real-time driving force and real-time driving frequency into the final bivariate cubic fitting model to calculate the zero bias compensation value, and then subtract the zero bias compensation value from the current zero bias output result of the microelectromechanical gyroscope to complete the zero bias compensation.

[0008] On the other hand, a temperature-controlled microelectromechanical gyroscope zero-bias compensation device is also provided, comprising: A data acquisition module is used to install a heating chip on the back of the microelectromechanical gyroscope chip and construct a chip-level temperature control system based on the heating chip; using the driving frequency of the microelectromechanical gyroscope as the controlled variable, the temperature of the microelectromechanical gyroscope chip is adjusted to a preset desired temperature and maintained in a constant temperature state, wherein the preset desired temperature is higher than the highest temperature of the microelectromechanical gyroscope in the entire temperature range; and the zero-bias output data, driving force data and driving frequency data of the microelectromechanical gyroscope under constant temperature state are acquired simultaneously. The model building module is used to build a bivariate cubic fitting model. Using the zero-biased output data, the driving force data and the driving frequency data as a sample set, the module solves the bivariate cubic fitting model to obtain the final bivariate cubic fitting model. The zero-bias compensation module is used to continuously maintain the constant temperature state of the microelectromechanical gyroscope chip through the chip-level temperature control system, and to collect the real-time driving force and real-time driving frequency of the microelectromechanical gyroscope in the current working state in real time; to substitute the real-time driving force and real-time driving frequency into the final bivariate cubic fitting model to calculate the zero-bias compensation value, and then to subtract the zero-bias compensation value from the current zero-bias output result of the microelectromechanical gyroscope to complete the zero-bias compensation.

[0009] On another front, a computer device is also provided, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps of the above-described temperature-controlled microelectromechanical gyroscope zero-bias compensation method.

[0010] Compared with existing technologies, the temperature-controlled microelectromechanical gyroscope zero-bias compensation method, device, and equipment provided by this invention have the following beneficial effects: 1. A chip-level temperature control structure with a heating chip on the back of the microelectromechanical gyroscope chip is adopted. Compared with the traditional external temperature control method, the heat conduction path is shorter, the thermal response speed is faster, and the temperature control volume is smaller. It can achieve precise local temperature control of the gyroscope chip and significantly reduce the heat loss and thermal inertia of the temperature control system.

[0011] 2. By using the driving frequency as the controlled variable, the chip temperature is stabilized at the desired temperature, which is higher than the highest temperature in the entire temperature range of the gyroscope. This ensures that the temperature control system is always in heating mode, avoiding temperature fluctuations and control lag. It eliminates the interference of ambient temperature changes on the gyroscope's zero bias from the source, ensuring a highly stable chip operating state.

[0012] 3. Zero-bias output, driving force, and driving frequency data were collected under constant temperature conditions, eliminating the interference of temperature fluctuations on the sample data, ensuring the accuracy and consistency of the modeling samples, and providing a reliable data foundation for subsequent model fitting.

[0013] 4. Based on the construction of a bivariate cubic fitting model with two parameters, it can accurately characterize the nonlinear relationship between the zero bias and the driving force and driving frequency. Compared with the traditional single-parameter linear fitting model, the zero bias prediction accuracy is higher and the compensation fit is stronger.

[0014] 5. By continuously maintaining the chip temperature and combining real-time parameters to complete dynamic zero-bias compensation, the zero-bias error of the gyroscope can be corrected in real time, significantly improving the measurement accuracy, output stability and environmental adaptability of the microelectromechanical gyroscope, and effectively solving the problems of poor temperature drift suppression and low compensation accuracy of traditional compensation methods. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention, and those skilled in the art can obtain other related drawings based on these drawings without creative effort.

[0016] Figure 1 This is a flowchart illustrating the temperature-controlled microelectromechanical gyroscope zero-bias compensation method in Example 1. Figure 2 This is a structural block diagram of the chip-level temperature control system in Example 1; Figure 3This is a schematic diagram comparing the effects of multi-factor compensation across the entire temperature range in a chip-level temperature control system according to Example 1; Figure 4 This is a comparison chart of the zero-bias stability of a microelectromechanical gyroscope under different experimental conditions across the entire temperature range in Example 1; Figure 5 This is a structural block diagram of a temperature-controlled microelectromechanical gyroscope zero-bias compensation device in Embodiment 2. Figure 6 This is an internal structural diagram of a computer device in Embodiment 3.

[0017] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0019] It is understood that the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0020] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0021] Example 1 This invention addresses the shortcomings of existing temperature error compensation technologies for microelectromechanical gyroscopes (MEMS) by proposing a temperature-controlled zero-bias compensation method. The core idea is as follows: First, a high-precision chip-level temperature control system is integrated onto the MEMS gyroscope chip. Utilizing the linear relationship between the gyroscope's driving frequency and temperature as feedback, a PI control algorithm is employed to rapidly raise and stabilize the gyroscope's operating temperature at a preset desired value, thereby physically suppressing most temperature drift. Building upon this, residual temperature-related errors, such as those caused by changes in driving force, are further modeled using multivariate parameters and compensated via software. This combination of hardware and software achieves high-precision suppression of temperature errors in the MEMS gyroscope.

[0022] like Figure 1 As shown, the temperature-controlled microelectromechanical gyroscope zero-bias compensation method provided in this embodiment includes the following steps: Step 1: Place a heating chip on the back of the microelectromechanical gyroscope chip and build a chip-level temperature control system based on the heating chip; use the driving frequency of the microelectromechanical gyroscope as the controlled variable to regulate the temperature of the microelectromechanical gyroscope chip to a preset desired temperature and maintain a constant temperature state. The preset desired temperature is higher than the highest temperature in the entire temperature range of the microelectromechanical gyroscope; simultaneously collect the zero-bias output data, driving force data and driving frequency data of the microelectromechanical gyroscope under constant temperature state.

[0023] Step 2: Construct a bivariate cubic fitting model. Using the zero-biased output data, driving force data, and driving frequency data as the sample set, solve the bivariate cubic fitting model to obtain the final bivariate cubic fitting model.

[0024] Step 3: Continuously maintain the constant temperature of the microelectromechanical gyroscope chip through the chip-level temperature control system, and collect the real-time driving force and real-time driving frequency of the microelectromechanical gyroscope in the current working state. Substitute the real-time driving force and real-time driving frequency into the final bivariate cubic fitting model to calculate the zero bias compensation value, and then subtract the zero bias compensation value from the current zero bias output result of the microelectromechanical gyroscope to complete the zero bias compensation.

[0025] In the specific implementation of step 1, the resonant structure of the microelectromechanical gyroscope adopts a butterfly-wing topology, which includes four mass blocks, a polygonal vibrating inclined beam and anchor points. Its driving mode and detection mode are both degenerate modes. The driving frequency shows a good linear relationship with temperature. Therefore, the driving frequency can be used as a physical quantity to characterize the chip temperature.

[0026] Based on this structural characteristic, a surface mount technology (SMT) is first used to attach the heating chip to the back of the microelectromechanical gyroscope chip using a highly thermally conductive adhesive, allowing direct contact between the heating chip and the gyroscope chip for efficient heat conduction. For example... Figure 2 As shown, the chip-level temperature control system based on the heating chip includes an FPGA module, a heating chip, and a temperature controller. The temperature controller is a hardware logic unit that can be integrated into the FPGA module and is mainly used to achieve constant temperature control of the heating chip.

[0027] The FPGA module includes an automatic gain control loop connected to the resonant structure. The FPGA module is also connected to the drive detection circuit of the microelectromechanical gyroscope to read the drive frequency signal of the gyroscope in real time and provide chip-level precise temperature control for the gyroscope chip.

[0028] After completing the chip-level temperature control system construction, the chip temperature is adjusted using the driving frequency of the microelectromechanical gyroscope as the controlled variable, including: Step 101: The FPGA module acquires the current driving frequency of the microelectromechanical gyroscope in real time. System preset and preset desired temperature Corresponding target driving frequency .

[0029] Step 102: Calculate the error signal between the current driving frequency and the target driving frequency, expressed as: .

[0030] Step 103: The temperature controller receives the error signal, and then, based on the error signal, calculates the control quantity according to the preset proportional and integral parameters using a PI closed-loop control algorithm. The control quantity is then converted into an analog voltage signal and output to the heating chip. The heating chip generates corresponding Joule heat according to the received voltage, thereby adjusting the temperature of the microelectromechanical gyroscope chip and increasing the driving frequency. Always closely track the desired frequency The process continues until the current driving frequency stabilizes at the target driving frequency, at which point the gyroscope chip temperature reaches the preset desired temperature. Preferably, the microelectromechanical gyroscope operates in a full temperature range of -40℃ to +60℃, with a preset desired temperature of 85℃. This preset desired temperature is higher than the highest ambient temperature in the full temperature range of the microelectromechanical gyroscope, ensuring that the temperature control system is always in heating mode.

[0031] Although the chip-level temperature control system locks the gyroscope's driving frequency (i.e., temperature) at a constant value, due to factors such as temperature control accuracy and heat distribution, there may be slight residual stress or temperature gradients inside the gyroscope, and changes in the driving force itself may also introduce errors. To eliminate these residual errors, this invention further introduces multi-element temperature compensation.

[0032] Specifically, after the gyroscope chip maintains a constant temperature, zero-bias output data, driving force data, and driving frequency data are simultaneously collected, including: Step 111: Place the microelectromechanical gyroscope with integrated chip-level temperature control system in a controllable temperature chamber, adjust the temperature change according to the preset program, and conduct a high and low temperature cycle experiment. Preferably, the temperature change rate of the chamber is set to 1℃ / min, changing from -40℃ to +60℃.

[0033] Step 112: When the temperature chamber reaches any temperature point, stop the temperature change and maintain the temperature for a preset time. Preferably, each temperature point is maintained for 2 hours until a stable ambient temperature is reached.

[0034] Step 113: In this stable ambient temperature, the chip-level temperature control system operates at a driving frequency. As the controlled quantity, it is precisely controlled within Nearby, the temperature of the microelectromechanical gyroscope chip is adjusted to the preset desired temperature and maintained at a constant temperature.

[0035] Step 114: Simultaneously, under this constant temperature condition, zero-bias output data is acquired at a preset sampling frequency. Driving force data and drive frequency data .

[0036] Step 115: Repeat steps 112 to 114 until all discrete temperature points have been collected, forming the sample data required for modeling.

[0037] Among them, the chip-level temperature control system is a miniaturized temperature control structure that is different from traditional external constant temperature chambers and external heating elements. It is a temperature control system integrated into the microelectromechanical gyroscope chip level, which can achieve precise local temperature control of the gyroscope chip, rather than temperature adjustment of the environment or the overall structure of the gyroscope.

[0038] This step leverages the linear frequency-temperature characteristics of the microelectromechanical gyroscope's butterfly-wing topology, using the driving frequency as the controlled variable for temperature control. This makes the temperature control more closely aligned with the gyroscope's structural properties, improving temperature control accuracy. High thermal conductivity adhesive is used to bond the heating chip to the gyroscope chip, further shortening the heat conduction path and improving heat conduction efficiency, significantly reducing thermal inertia. Combined with a chip-level temperature control system consisting of an FPGA module, heating chip, and integrated temperature controller, this effectively reduces the system's size and heat loss, achieving rapid chip-level temperature control. A PI closed-loop control algorithm, combined with error signals, is then employed. The heating power is calculated and adjusted, and a preset desired temperature setting higher than the highest temperature in the entire temperature range is used to ensure that the temperature control system always works in heating mode. This avoids temperature fluctuations and control lag caused by the cooling process, and completely eliminates the interference of ambient temperature changes on the gyroscope from a physical perspective. By combining high and low temperature cycling experiments with chip constant temperature data acquisition, and by setting reasonable temperature change rate and holding time, the interference of temperature fluctuations and thermal transient effects on sample data is eliminated. This ensures the accuracy and consistency of the acquired zero-bias output data, driving force data, and driving frequency data, providing a reliable data source for subsequent model construction.

[0039] In the specific implementation of step 2, theoretically, due to the existence of chip-level temperature control, the driving frequency data... The range of variation will be very small, but its tiny fluctuations and its relationship with driving force data The correlation may still be coupled into the output. Therefore, a bivariate cubic fitting model is used to describe the relationship between the gyroscope's zero-bias output and the driving force and driving frequency. The expression of the bivariate cubic fitting model is: ; In the formula, express The zero-bias output data of the microelectromechanical gyroscope at any given moment; Represents the multivariate parameters to be fitted; express Drive force data of the microelectromechanical gyroscope at any given time; express The driving frequency data of the microelectromechanical gyroscope at any given time; express Timing error term. It can be seen that the bivariate cubic fitting model is a multivariate nonlinear fitting model with the driving force and driving frequency of the microelectromechanical gyroscope as the two independent variables and the zero-bias output data as the dependent variable. It includes linear, quadratic, cubic and cross terms of the independent variables. It can accurately characterize the complex nonlinear relationship between the zero bias and the driving force and driving frequency, and can effectively eliminate the residual error introduced by residual stress, temperature gradient and driving force changes after chip-level temperature control.

[0040] After constructing the bivariate cubic fitting model, the model is solved using the zero-biased output data, driving force data, and driving frequency data as the sample set, resulting in the final bivariate cubic fitting model, including: Step 201, using the zero-bias output data collected in Step 1 Driving force data and drive frequency data Construct a sample set, substitute the sample set into a bivariate cubic fitting model, and construct a system of multiple linear regression equations.

[0041] Step 202: Solve the system of multiple linear regression equations using the least squares method to obtain the multivariate parameters to be fitted. The specific values ​​are used to form a set of fitting parameters. This set of fitting parameters characterizes the residual coupling relationship between the gyroscope's zero bias and the driving force and driving frequency, based on chip-level temperature control.

[0042] Step 203: Substitute the fitted parameter set back into the cubic fitting model to complete the model construction, obtaining the final cubic fitting model that can be used for real-time compensation. Then, embed this fitted parameter set into the temperature compensation module of the FPGA module connected to the microelectromechanical gyroscope. This temperature compensation module is a software-level algorithm logic module, primarily used to collect real-time driving force, driving frequency, and other data, and substitute them into the cubic fitting model to calculate the compensation value and complete zero-deviation value compensation.

[0043] This step addresses the residual error after chip-level temperature control by constructing a bivariate cubic fitting model with two independent variables. Compared to traditional single-parameter, linear fitting models, this model offers a more comprehensive fitting dimension, accurately reflecting the actual nonlinear relationship between the microelectromechanical gyroscope's zero bias and driving force / frequency. The least squares method is used to solve for the multivariate parameters to be fitted, ensuring the accuracy of the fitted parameters and making the constructed model's representation of the zero bias variation more closely match the actual working conditions of the gyroscope. The set of fitted parameters is then embedded into the temperature compensation module of the FPGA module, providing high-precision mathematical model support for subsequent real-time zero bias compensation. Simultaneously, hardware integration of the compensation algorithm is achieved, improving the response speed of subsequent compensation.

[0044] In the specific implementation of step 3, the real-time driving force and the real-time driving frequency are substituted into the final bivariate cubic fitting model to calculate the zero-bias compensation value, including: Step 301: The microelectromechanical gyroscope chip is continuously kept at a constant temperature by a chip-level temperature control system to ensure that the gyroscope chip is always at the preset desired temperature set in step 1. The FPGA module continuously collects the real-time driving force of the microelectromechanical gyroscope under its current operating state. With real-time drive frequency .

[0045] Step 302, real-time driving force With real-time drive frequency The data is transmitted to the temperature compensation module of the FPGA module. The temperature compensation module substitutes the collected real-time driving force and real-time driving frequency into the final bivariate cubic fitting model for calculation, and obtains the zero-bias compensation value at the current moment, expressed as: ; In the formula, This represents the zero bias compensation value; The row vector representing the independent variable at the current moment is composed of the following elements: , among which, here Substitute as , Substitute as ; This represents the set of fitted parameters that have been solved, and its elements are... The specific value.

[0046] Finally, subtracting the zero-bias compensation value from the current zero-bias output of the microelectromechanical gyroscope yields the final accurate angular velocity output after temperature error compensation, completing the zero-bias compensation. The expression for this calculation process is as follows: ; In the formula, This represents the zero-bias output result after compensation; This indicates the current zero-bias output result of the microelectromechanical gyroscope.

[0047] This step utilizes a chip-level temperature control system to continuously suppress the interference of ambient temperature on the gyroscope's zero bias at the physical level, ensuring the stability of the microelectromechanical gyroscope chip's operating state. By leveraging the temperature compensation module integrated into the FPGA hardware, it achieves rapid acquisition of real-time driving force and driving frequency, and efficient calculation of compensation values. The entire compensation process requires no manual intervention and has a fast response speed. By substituting real-time operating parameters into a high-precision bivariate cubic fitting model to calculate compensation values, and completing real-time dynamic compensation of the zero bias through difference calculations, it can accurately correct residual zero bias errors caused by changes in driving force and driving frequency after chip-level temperature control, significantly reducing zero bias drift and greatly improving the gyroscope's measurement accuracy, output stability, and adaptability to all temperature ranges.

[0048] In summary, this invention employs a dual compensation approach—chip-level temperature control and multi-parameter compensation—firstly stabilizing the gyroscope's operating point at the physical level through hardware closed-loop control, significantly simplifying the complexity of subsequent software compensation; then, it utilizes software to finely model and compensate for residual errors related to driving force and frequency. The combination of these two methods significantly improves the zero-bias stability of the microelectromechanical gyroscope across the entire temperature range, providing an effective technical solution for its application in high-precision fields.

[0049] In one embodiment, such as Figure 3 As shown, this is a schematic diagram comparing the effects of multi-dimensional compensation across the entire temperature range under a chip-level temperature control system. It can be seen that the green curve is the uncompensated curve under temperature control, and the red curve is the compensated curve under temperature control. It can be seen that after constructing a temperature control system, the stability of the microelectromechanical gyroscope can be improved by 32 times through compensation methods.

[0050] In one embodiment, such as Figure 4 As shown in the figure, the zero-bias stability of the microelectromechanical gyroscope under different experimental conditions in the full temperature range is compared. It can be seen that by constructing a temperature control system, the stability of the gyroscope can be improved by 5.48 times, and the stability of the gyroscope can be improved by 32 times after introducing a compensation algorithm.

[0051] It should be understood that, although this embodiment Figure 1 The steps are shown sequentially as indicated by the arrows, but they are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order in which these steps are performed; they can be executed in other orders. Figure 1 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0052] Example 2 Based on the temperature-controlled microelectromechanical gyroscope zero-bias compensation method in Example 1, this example discloses a temperature-controlled microelectromechanical gyroscope zero-bias compensation device, such as... Figure 5 As shown, the temperature-controlled microelectromechanical gyroscope zero-bias compensation device includes: a data acquisition module 401, a model building module 402, and a zero-bias compensation module 403, wherein: The data acquisition module 401 is used to set a heating chip on the back of the microelectromechanical gyroscope chip and build a chip-level temperature control system based on the heating chip; using the driving frequency of the microelectromechanical gyroscope as the controlled variable, the temperature of the microelectromechanical gyroscope chip is adjusted to a preset desired temperature and maintained in a constant temperature state, the preset desired temperature being higher than the highest temperature in the entire temperature range of the microelectromechanical gyroscope; and the zero-bias output data, driving force data and driving frequency data of the microelectromechanical gyroscope under constant temperature state are acquired simultaneously.

[0053] The model building module 402 is used to build a bivariate cubic fitting model. It uses zero-biased output data, driving force data and driving frequency data as sample sets to solve the bivariate cubic fitting model and obtain the final bivariate cubic fitting model.

[0054] The zero-bias compensation module 403 is used to continuously maintain the constant temperature state of the microelectromechanical gyroscope chip through the chip-level temperature control system, and to collect the real-time driving force and real-time driving frequency of the microelectromechanical gyroscope in the current working state. The real-time driving force and real-time driving frequency are substituted into the final bivariate cubic fitting model to calculate the zero-bias compensation value. Then, the current zero-bias output result of the microelectromechanical gyroscope is subtracted from the zero-bias compensation value to complete the zero-bias compensation.

[0055] In this embodiment, the specific working process and working principle of the data acquisition module 401, model construction module 402, and zero-bias compensation module 403 are the same as those in Embodiment 1, and therefore will not be described again in this embodiment. Each unit module can be implemented entirely or partially through software, hardware, or a combination thereof. Each unit module can be embedded in or independent of the processor in the computer device in hardware form, or it can be stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to each of the above unit modules.

[0056] Example 3 like Figure 6 The diagram illustrates a computer device disclosed in this embodiment, including a transmitter, a receiver, a memory, and a processor. The transmitter is used to send instructions and data, the receiver is used to receive instructions and data, the memory is used to store computer execution instructions, and the processor is used to execute the computer execution instructions stored in the memory to implement the method in Embodiment 1 above.

[0057] It is important to note that the aforementioned memory can be either standalone or integrated with the processor. When the memory is set up independently, the terminal device also includes a bus for connecting the memory and the processor.

[0058] Example 4 This embodiment discloses a computer-readable storage medium storing computer-executable instructions. When a processor executes the computer-executable instructions, it implements the method in Embodiment 1 above.

[0059] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A method for zero-bias compensation of a microelectromechanical gyroscope based on temperature control, characterized in that, The method includes: Step 1: A heating chip is placed on the back of the microelectromechanical gyroscope chip, and a chip-level temperature control system is constructed based on the heating chip; the temperature of the microelectromechanical gyroscope chip is adjusted to a preset desired temperature and maintained at a constant temperature using the driving frequency of the microelectromechanical gyroscope as the controlled variable. The preset desired temperature is higher than the highest temperature of the microelectromechanical gyroscope in the entire temperature range; the zero-bias output data, driving force data, and driving frequency data of the microelectromechanical gyroscope under constant temperature conditions are collected simultaneously. Step 2: Construct a bivariate cubic fitting model. Using the zero-biased output data, the driving force data, and the driving frequency data as the sample set, solve the bivariate cubic fitting model to obtain the final bivariate cubic fitting model. Step 3: Continuously maintain the constant temperature state of the microelectromechanical gyroscope chip through the chip-level temperature control system, and collect the real-time driving force and real-time driving frequency of the microelectromechanical gyroscope in the current working state; substitute the real-time driving force and real-time driving frequency into the final bivariate cubic fitting model to calculate the zero bias compensation value, and then subtract the zero bias compensation value from the current zero bias output result of the microelectromechanical gyroscope to complete the zero bias compensation.

2. The temperature-controlled microelectromechanical gyroscope zero-bias compensation method according to claim 1, characterized in that, In step 1, when a heating chip is placed on the back of the microelectromechanical gyroscope chip, the heating chip is attached to the back of the microelectromechanical gyroscope chip using a surface mount process, so that the heating chip and the gyroscope chip are in direct contact.

3. The temperature-controlled microelectromechanical gyroscope zero-bias compensation method according to claim 2, characterized in that, In step 1, the temperature of the microelectromechanical gyroscope chip is adjusted to a preset desired temperature using the driving frequency of the microelectromechanical gyroscope as the controlled variable, including: Step 101: Real-time acquisition of the current driving frequency of the microelectromechanical gyroscope; Step 102: Calculate the error signal between the current driving frequency and the target driving frequency corresponding to the preset desired temperature; Step 103: Based on the error signal, adjust the heating power of the heating chip through a PI closed-loop control algorithm until the current driving frequency stabilizes at the target driving frequency. At this time, the temperature of the gyroscope chip reaches the preset desired temperature.

4. The temperature-controlled microelectromechanical gyroscope zero-bias compensation method according to claim 1, characterized in that, In step 1, the zero-bias output data, driving force data, and driving frequency data of the microelectromechanical gyroscope under constant temperature conditions are collected synchronously, including: Step 111: Place the microelectromechanical gyroscope with integrated chip-level temperature control system in a controllable temperature chamber, adjust the temperature change according to the preset program, and conduct a high and low temperature cycle experiment. Step 112: When the temperature reaches any point, the controllable temperature chamber stops temperature change and maintains the temperature for a preset time until a stable ambient temperature is reached. Step 113: In the stable ambient temperature, the chip-level temperature control system uses the driving frequency as the controlled variable to regulate the temperature of the microelectromechanical gyroscope chip to a preset desired temperature and maintain a constant temperature state. Step 114: Under the constant temperature condition, zero bias output data, driving force data and driving frequency data are collected at a preset sampling frequency. Step 115: Repeat steps 112 to 114 until data acquisition for all discrete temperature points is completed.

5. The temperature-controlled microelectromechanical gyroscope zero-bias compensation method according to any one of claims 1 to 4, characterized in that, In step 2, the expression for the bivariate cubic fitting model is: ； In the formula, express The zero-bias output data of the microelectromechanical gyroscope at any given moment; Represents the multivariate parameters to be fitted; express Drive force data of the microelectromechanical gyroscope at any given time; express The driving frequency data of the microelectromechanical gyroscope at any given time; express Timing error term.

6. The temperature-controlled microelectromechanical gyroscope zero-bias compensation method according to claim 5, characterized in that, In step 2, the bivariate cubic fitting model is solved to obtain the final bivariate cubic fitting model, including: Step 201, using the zero-bias output data collected in Step 1 Driving force data and drive frequency data Construct a sample set, substitute the sample set into the bivariate cubic fitting model, and construct a system of multiple linear regression equations; Step 202: Solve the system of multiple linear regression equations using the least squares method to obtain the specific values ​​of the multiple parameters to be fitted, thus forming a set of fitting parameters; Step 203: Substitute the set of fitting parameters back into the bivariate cubic fitting model to complete the model construction and obtain the final bivariate cubic fitting model.

7. The temperature-controlled microelectromechanical gyroscope zero-bias compensation method according to claim 6, characterized in that, In step 3, the real-time driving force and the real-time driving frequency are substituted into the final bivariate cubic fitting model to calculate the zero-bias compensation value, including: Step 301: Collect the real-time driving force under the current working state. With real-time drive frequency ; Step 302, the real-time driving force With the real-time drive frequency Substituting the values ​​into the final bivariate cubic fitting model, we obtain the zero-bias compensation value at the current time, expressed as: ； In the formula, This represents the zero bias compensation value; Represents the row vector of the independent variable at the current moment; This represents the set of fitted parameters that have been solved.

8. The temperature-controlled microelectromechanical gyroscope zero-bias compensation method according to claim 7, characterized in that, In step 3, the current zero-bias output of the microelectromechanical gyroscope is subtracted from the zero-bias compensation value, expressed as: ； In the formula, This represents the zero-bias output result after compensation; This indicates the current zero-bias output result of the microelectromechanical gyroscope.

9. A temperature-controlled microelectromechanical gyroscope zero-bias compensation device, characterized in that, The device includes: A data acquisition module is used to install a heating chip on the back of the microelectromechanical gyroscope chip and construct a chip-level temperature control system based on the heating chip; using the driving frequency of the microelectromechanical gyroscope as the controlled variable, the temperature of the microelectromechanical gyroscope chip is adjusted to a preset desired temperature and maintained in a constant temperature state, wherein the preset desired temperature is higher than the highest temperature of the microelectromechanical gyroscope in the entire temperature range; and the zero-bias output data, driving force data and driving frequency data of the microelectromechanical gyroscope under constant temperature state are acquired simultaneously. The model building module is used to build a bivariate cubic fitting model. Using the zero-biased output data, the driving force data and the driving frequency data as a sample set, the module solves the bivariate cubic fitting model to obtain the final bivariate cubic fitting model. The zero-bias compensation module is used to continuously maintain the constant temperature state of the microelectromechanical gyroscope chip through the chip-level temperature control system, and to collect the real-time driving force and real-time driving frequency of the microelectromechanical gyroscope in the current working state in real time; to substitute the real-time driving force and real-time driving frequency into the final bivariate cubic fitting model to calculate the zero-bias compensation value, and then to subtract the zero-bias compensation value from the current zero-bias output result of the microelectromechanical gyroscope to complete the zero-bias compensation.

10. A computer device, comprising a memory and a processor, characterized in that, The memory stores a computer program, and when the processor executes the computer program, it implements the steps of the temperature-controlled microelectromechanical gyroscope zero-bias compensation method according to any one of claims 1 to 8.

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