Chip testing connection device and testing method
By designing a stable chip testing connection device, the problem of uneven probe wear was solved, enabling high-precision chip testing and an efficient testing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUNRISTAR ELECTRONICS CO (SHENZHEN) LTD
- Filing Date
- 2026-02-11
- Publication Date
- 2026-06-02
AI Technical Summary
Existing chip testing connection devices suffer from uneven probe wear due to improper operation when frequently inserting and removing chips, which affects the accuracy of test results.
A chip testing connection device was designed, including a base and a top cover, which are locked by a buckle. The device contains components such as a bracket, probes, clamping blocks and suction cups to achieve stable placement, fixation and removal of chips, reduce probe wear and improve detection accuracy.
The design of the bracket and clamping block reduces probe wear, improves the accuracy and applicability of test results, simplifies the chip removal process, and increases testing efficiency.
Smart Images
Figure CN122131119A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip testing technology, and more specifically, to a chip testing connection device and testing method. Background Technology
[0002] Chip testing is a crucial step in the semiconductor manufacturing process. Its core purpose is to ensure that the quality, performance, and reliability of chips fully meet design specifications through a series of rigorous testing methods before they leave the factory. This allows for the selection of qualified products, optimization of production processes, and reduction of overall costs. Chip testing requires the use of connection devices. The most common chip testing connection device is the chip test socket. The chip test socket mainly serves to connect and conduct, making chip replacement and testing more convenient. It eliminates the need for repeated soldering and disassembly of chips, thereby reducing damage to ICs and PCBs and achieving the goal of fast and efficient testing.
[0003] However, in actual operation, the frequent insertion and removal of chips in the test socket can easily cause wear on the test probes. Especially when placing the chip manually, it is usually tilted before being placed flat. This causes different areas of the probe to wear differently, which can lead to a lack of stable connection between the probe and the chip pins, resulting in poor contact and reduced accuracy of the test results. Summary of the Invention
[0004] This invention provides a chip testing connection device and testing method, which solves the technical problem in related technologies where probes are worn to varying degrees due to frequent chip insertion and removal, as well as improper operation during insertion and removal, leading to inaccurate test results.
[0005] The present invention provides a chip testing connection device, including a base and a top cover movably connected to the top of the base, and the base and the top cover are locked together by a snap fastener. The base has a detection cavity inside, and the detection cavity has a probe inside. The detection cavity also has a chip mounting assembly for stably placing the chip inside. The chip mounting assembly includes a second groove formed in the inner wall of the detection cavity, and a bracket is rotatably connected inside the second groove via a second rotating shaft. The second rotating shaft passes through the inner wall of the second groove and is connected to it via a coil spring. The bracket is L-shaped and always extends out of the interior of the second groove and is located in the detection cavity when the bracket rotates.
[0006] As a further optimization of the present invention, a first sliding groove is provided in the middle of the bracket, and the second rotating shaft is located inside the first sliding groove and is fixedly connected to the first sliding groove by a spring.
[0007] As a further optimization of the present invention, a chip contact assembly is provided inside the second groove. The chip contact assembly includes a second sliding groove formed on the inner wall of the second groove, and a lifting frame is slidably connected inside the second sliding groove. A third rotating shaft is rotatably connected to the top of the lifting frame. A third sliding groove is formed at the bottom of the base, and a fixing plate for fixing the probe is slidably connected inside the third sliding groove. The fixing plate is fixedly connected to the lifting frame. A through hole for probe movement is formed between the detection cavity and the third sliding groove.
[0008] As a further optimization of the present invention, the bottom of the upper cover is provided with a movable groove, and a pressing block is slidably connected inside the movable groove. The upper end of the upper cover is provided with a knob, and the knob is connected to the pressing block through a screw.
[0009] As a further optimization of the present invention, the interior of the movable groove is provided with a pressure stabilizing component, the pressure stabilizing component is movably embedded in the movable ball at the bottom of the pressing block, and the bottom of the movable ball is fixedly connected to a counterweight plate through a connecting shaft.
[0010] As a further optimization of the present invention, a chip removal assembly is provided between the counterweight plate and the pressing block. The chip removal assembly includes a suction cup movably embedded in the bottom of the counterweight plate. A sleeve is fixedly connected to the top of the pressing block. A screw passes through the inside of the sleeve and is fixedly connected to a piston that is slidably connected to the sleeve. A hose is fixedly connected to the bottom of the sleeve, and the other end of the hose passes through a movable ball and a connecting shaft and is fixedly connected to the suction cup.
[0011] As a further optimization of the present invention, the front ends of the base and the top cover are provided with a first groove, and the interiors of the upper and lower first grooves are respectively fixedly connected with a first rotating shaft and a locking post. One end of the buckle is sleeved on the outside of the first rotating shaft, and the bottom of the buckle is provided with a locking groove that matches the locking post.
[0012] A chip testing method includes the following steps: S1: Assembly, which involves combining and installing the test connection device with the test equipment; S2: Chip installation, placing the chip to be tested into the test connection device and fixing it in place; S3: Test, to test the chip placed inside the test connection device to determine whether the chip is functioning properly.
[0013] The beneficial effects of this invention are as follows: 1. The chip testing connection device and testing method described in this invention uses the short arm of the bracket to lift the placed chip, so that the chip will not rub against the probe when it is placed into the detection cavity. Throughout the process, the chip only makes stable contact with the probe under the push of the clamping block, which minimizes the friction between the chip and the probe and makes the friction uniform in all areas. This reduces the probability of insufficient accuracy of the test results due to probe wear and different degrees of wear, and improves the accuracy of the test. At the same time, when the chip moves down along the inside of the detection cavity under the push of the clamping block, the chip pushes the bracket to rotate around the second rotating shaft until the short arm of the bracket rotates 90 degrees and is in a vertical state to clamp and fix the chip from all sides. The long arm of the bracket rotates 90 degrees and is in a horizontal state. Under the pressure, the long arm can slide through the first sliding groove on the surface of the second rotating shaft to adjust the distance of the bracket extending into the detection cavity, thereby adapting to fix chips of different sizes and improving applicability.
[0014] 2. The chip testing connection device and testing method described in this invention, by retracting the probe inside the third slide groove, can effectively reduce the probability of oxidation of the probe due to contact with air, and also reduce the probability of wear caused by accidental probe contact, thus improving the protection of the probe. After the chip is placed inside the detection cavity, the pressing block pushes the chip down and pushes the bracket to rotate. During the rotation of the bracket, its long arm extends into the lifting frame and pushes the lifting frame to move up along the second slide groove. When the lifting frame moves up, the fixed plate drives the probe to move up and extend into the detection cavity through the through hole to contact the chip's pins, thereby completing the connection between the chip and the test socket, further reducing the wear of the probe and improving the accuracy of the test.
[0015] 3. The chip testing connection device and testing method described in this invention uses a counterweight plate to rotate a movable ball via a connecting shaft, ensuring that the counterweight plate remains vertically downward. This allows the counterweight plate to make stable contact with the chip when the top cover is closed, preventing chip displacement and thus ensuring the accuracy of the test results.
[0016] 4. The chip testing connection device and testing method described in this invention, by rotating the knob, causes the screw to move upward. When the screw moves upward, it drives the piston to generate suction inside the sleeve, thereby drawing the air between the suction cup and the chip into the sleeve through the hose, so that the suction cup is firmly attached to the chip. This allows the chip to be removed from the detection cavity after opening the top cover, without the need for manual chip removal, reducing the wear on the probes during chip removal, and speeding up the chip removal process, thus improving testing efficiency. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a view of the base and top cover of the present invention combined; Figure 3 This is a schematic diagram of the snap-fit structure of the present invention; Figure 4 This is a schematic diagram of the base structure of the present invention; Figure 5 This is the present invention. Figure 4 Enlarged view of point A in the middle; Figure 6 This is a partial structural diagram of the chip mounting assembly of the present invention; Figure 7 This is a schematic diagram of the upper cover structure of the present invention; Figure 8 This is a schematic diagram of the voltage regulator component structure of the present invention; Figure 9 This is a schematic diagram of a partial structure of the chip removal component of the present invention.
[0018] In the picture: 10. Base; 11. Top cover; 12. Buckle; 13. Knob; 14. First groove; 15. Locking post; 16. First pivot; 17. Slot; 18. Probe; 19. Screw; 191. Movable groove; 192. Clamping block; 20. Chip mounting assembly; 21. Second groove; 22. Second pivot; 23. Bracket; 24. Coil spring; 25. First slide groove; 26. Spring; 30. Chip contact assembly; 31. Second slide rail; 32. Lifting frame; 33. Third rotating shaft; 34. Third slide rail; 35. Fixing plate; 40. Voltage stabilizing component; 41. Moving ball; 42. Connecting shaft; 43. Counterweight plate; 50. Chip removal assembly; 51. Suction cup; 52. Sleeve; 53. Piston; 54. Hose.
[0019] 60. Detection chamber. Detailed Implementation
[0020] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the subject matter described herein, and changes may be made to the function and arrangement of the elements discussed without departing from the scope of this specification. Various processes or components may be omitted, substituted, or added as needed in the examples. Furthermore, features described in some examples may be combined in other examples.
[0021] like Figures 1 to 6As shown, a chip testing connection device according to an embodiment of the present invention includes a base 10 and an upper cover 11 movably connected to its top, and the base 10 and the upper cover 11 are locked together by a buckle 12. The base 10 has a detection cavity 60 inside, and the detection cavity 60 has a probe 18 inside. The base 10 and the top cover 11 are both provided with a first groove 14 at their front ends. The first rotating shaft 16 and the locking post 15 are respectively fixedly connected inside the upper and lower first grooves 14. One end of the buckle 12 is sleeved on the outside of the first rotating shaft 16, and the bottom of the buckle 12 is provided with a slot 17 that matches the locking post 15. The bottom of the upper cover 11 is provided with a movable groove 191, and a pressing block 192 is slidably connected inside the movable groove 191. The upper end of the upper cover 11 is provided with a knob 13, and the knob 13 is connected to the pressing block 192 through a screw 19. The inside of the detection cavity 60 is provided with a chip mounting assembly 20 for stably placing the chip. The chip mounting assembly 20 includes a second groove 21 formed in the inner wall of the detection cavity 60, and a bracket 23 is rotatably connected inside the second groove 21 via a second rotating shaft 22. The second rotating shaft 22 passes through the inner wall of the second groove 21 and is connected to it via a coil spring 24. The bracket 23 is L-shaped and always extends out of the interior of the second groove 21 and is located in the detection cavity 60 when the bracket 23 rotates. A first sliding groove 25 is formed in the middle of the bracket 23, and the second rotating shaft 22 is located inside the first sliding groove 25 and is fixedly connected to the first sliding groove 25 by a spring 26.
[0022] It should be noted that, firstly, the top cover 11 is opened, and then the chip to be tested is placed into the detection chamber 60. In the initial state, the short arm of the bracket 23 is kept horizontal, which supports the placed chip. Therefore, the chip will not rub against the probe 18 when it is placed. Then, the top cover 11 is closed, and then the buckle 12 is rotated with the first rotating shaft 16 as the pivot point. The buckle 12 is locked onto the buckle post 15 by the buckle groove 17, which completes the locking of the base 10 and the top cover 11 and ensures the stability during the detection process. After the top cover 11 is closed, the knob 13 is rotated. When the knob 13 is rotated, the screw 19 press block 192 moves down inside the movable groove 191. The press block 192 pushes the chip down to the bottom of the detection chamber 60 and contacts the probe 18, thus completing the connection between the chip and the test base. Then, the chip is tested by the detection equipment. When the chip is pushed down into the detection cavity 60 by the clamping block 192, the chip pushes the bracket 23 to rotate around the second rotating shaft 22 until the short arm of the bracket 23 rotates 90 degrees and becomes vertical, clamping and fixing the chip from all sides. The long arm of the bracket 23 rotates 90 degrees and becomes horizontal. Under the pressure, the long arm can slide through the first sliding groove 25 on the surface of the second rotating shaft 22 to adjust the distance of the bracket 23 into the detection cavity 60, thereby adapting to fix chips of different sizes and improving applicability. After the chip is removed after the test, the bracket 23 is pushed back by the spring 26 and rotated back to its original position by the coil spring 24. Throughout the process, the chip is only pushed by the clamping block 192 to make stable contact with the probe 18, so that the friction between the chip and the probe 18 is minimized and the friction in each area is the same. This reduces the probability of insufficient accuracy of the test results due to wear of the probe 18 and different degrees of wear, and improves the accuracy of the test.
[0023] like Figure 4 and Figure 5 As shown, the second groove 21 is provided with a chip contact assembly 30. The chip contact assembly 30 includes a second sliding groove 31 opened in the inner wall of the second groove 21, and a lifting frame 32 is slidably connected inside the second sliding groove 31. The top of the lifting frame 32 is rotatably connected to a third rotating shaft 33. The bottom of the base 10 is provided with a third sliding groove 34, and a fixing plate 35 for fixing the probe 18 is slidably connected inside the third sliding groove 34. The fixing plate 35 is fixedly connected to the lifting frame 32. A through hole for the probe 18 to move is opened between the detection cavity 60 and the third sliding groove 34.
[0024] It should be noted that in the initial state, the probe 18 is retracted inside the third slide groove 34, which can effectively reduce the probability of oxidation of the probe 18 due to contact with air, and also reduce the probability of wear caused by accidental contact with the probe 18, thus improving the protection of the probe 18. Until the chip is placed inside the detection cavity 60, the pressing block 192 pushes the chip down and pushes the bracket 23 to rotate. During the rotation of the bracket 23, its long arm extends into the lifting frame 32 and pushes the lifting frame 32 to move up along the second slide groove 31. When the lifting frame 32 moves up, it drives the probe 18 to move up through the fixing plate 35 and extend into the detection cavity 60 through the through hole to contact the chip's pin, thereby completing the connection between the chip and the test socket, further reducing the wear of the probe 18 and improving the accuracy of the detection. During the rotation, the bracket 23 contacts the third rotating shaft 33 at the upper end of the lifting frame 32. The third rotating shaft 33 is in a rotatable state, so it will not hinder the horizontal displacement of the bracket 23.
[0025] like Figure 7 and Figure 8As shown, the movable groove 191 is provided with a pressure stabilizing component 40. The pressure stabilizing component 40 is movably embedded in the movable ball 41 at the bottom of the pressing block 192, and the bottom of the movable ball 41 is fixedly connected to a counterweight plate 43 through a connecting shaft 42.
[0026] It should be noted that when the top cover 11 is closed, the angle between the top cover 11 and the base 10 changes as the top cover 11 rotates. The chip, supported by the bracket 23, will be higher than the surface of the base 10. This causes the top cover 11 to contact the rear of the chip first when closing, which will cause the chip to be pushed forward, thus posing a risk of displacement. Based on this, when the top cover 11 is closed, the counterweight plate 43 rotates the movable ball 41 through the connecting shaft 42 under the action of gravity, so that the counterweight plate 43 always remains in a vertically downward state. This ensures that when the top cover 11 is closed, the counterweight plate 43 will make smooth contact with the chip, thereby avoiding chip displacement and ensuring the accuracy of the test results.
[0027] like Figure 8 and Figure 9 As shown, a chip removal assembly 50 is provided between the counterweight plate 43 and the clamping block 192. The chip removal assembly 50 includes a suction cup 51 movably embedded in the bottom of the counterweight plate 43. A sleeve 52 is fixedly connected to the top of the clamping block 192. The screw 19 passes through the inside of the sleeve 52 and is fixedly connected to a piston 53 that is slidably connected to the sleeve 52. A flexible hose 54 is fixedly connected to the bottom of the sleeve 52, and the other end of the flexible hose 54 passes through a movable ball 41 and a connecting shaft 42 and is fixedly connected to the suction cup 51.
[0028] It should be noted that after the top cover 11 is closed, the suction cup 51 at the bottom of the counterweight plate 43 contacts the top of the chip. After the test is completed, the knob 13 is turned back, causing the screw 19 to move upward. When the screw 19 moves upward, it drives the piston 53 to generate suction inside the sleeve 52, thereby drawing the air between the suction cup 51 and the chip into the sleeve 52 through the hose 54, so that the suction cup 51 is firmly attached to the chip. This allows the chip to be removed from the detection chamber 60 after the top cover 11 is opened, without the need to manually remove the chip, reducing the wear on the probe 18 when removing the chip, saving the speed of chip removal, and improving the testing efficiency.
[0029] A chip testing method includes the following steps: S1: Assembly, which involves combining and installing the test connection device with the test equipment; S2: Chip installation, placing the chip to be tested into the test connection device and fixing it in place; S3: Test, to test the chip placed inside the test connection device to determine whether the chip is functioning properly.
[0030] The embodiments of the present invention have been described above, but the embodiments are not limited to the specific implementation methods described above. The specific implementation methods described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the embodiments described above, all of which are within the protection scope of the embodiments described above.
Claims
1. A chip testing connection device, comprising a base (10) and a top cover (11) movably connected to its top, wherein the base (10) and the top cover (11) are locked together by a snap fastener (12), wherein a detection cavity (60) is provided inside the base (10), and a probe (18) is provided inside the detection cavity (60), characterized in that: The detection cavity (60) is provided with a chip mounting assembly (20) for stably placing the chip inside. The chip mounting assembly (20) includes a second groove (21) formed in the inner wall of the detection cavity (60), and a bracket (23) is rotatably connected inside the second groove (21) via a second rotating shaft (22). The second rotating shaft (22) passes through the inner wall of the second groove (21) and is connected to it via a coil spring (24). The bracket (23) is L-shaped, and the bracket (23) always extends out of the interior of the second groove (21) and is located in the detection cavity (60) when rotating.
2. The chip testing and connection device according to claim 1, characterized in that: The bracket (23) has a first groove (25) in the middle, and the second rotating shaft (22) is located inside the first groove (25) and is fixedly connected to the first groove (25) by a spring (26).
3. The chip testing and connection device according to claim 2, characterized in that: The second groove (21) is provided with a chip contact assembly (30). The chip contact assembly (30) includes a second slide groove (31) opened on the inner wall of the second groove (21). A lifting frame (32) is slidably connected inside the second slide groove (31). A third rotating shaft (33) is rotatably connected to the top of the lifting frame (32). A third slide groove (34) is opened at the bottom of the base (10). A fixing plate (35) for fixing the probe (18) is slidably connected inside the third slide groove (34). The fixing plate (35) is fixedly connected to the lifting frame (32). A through hole for the probe (18) to move is opened between the detection cavity (60) and the third slide groove (34).
4. The chip testing and connection device according to claim 3, characterized in that: The bottom of the cover (11) is provided with a movable groove (191), and a pressing block (192) is slidably connected inside the movable groove (191). The upper end of the cover (11) is provided with a knob (13), and the knob (13) is connected to the pressing block (192) through a screw (19).
5. The chip testing connection device according to claim 4, characterized in that: The movable groove (191) is provided with a pressure stabilizing component (40), which is movably embedded in the movable ball (41) at the bottom of the pressing block (192), and the bottom of the movable ball (41) is fixedly connected to a counterweight plate (43) via a connecting shaft (42).
6. The chip testing and connection device according to claim 5, characterized in that: A chip removal assembly (50) is provided between the counterweight plate (43) and the clamping block (192). The chip removal assembly (50) includes a suction cup (51) movably embedded in the bottom of the counterweight plate (43). A sleeve (52) is fixedly connected to the top of the clamping block (192). The screw (19) passes through the inside of the sleeve (52) and is fixedly connected to a piston (53) that slides with the sleeve (52). A hose (54) is fixedly connected to the bottom of the sleeve (52), and the other end of the hose (54) passes through a movable ball (41) and a connecting shaft (42) and is fixedly connected to the suction cup (51).
7. A chip testing connection device according to claim 6, characterized in that: The base (10) and the top cover (11) are both provided with a first groove (14) at their front ends. The first rotating shaft (16) and the locking post (15) are respectively fixedly connected inside the two first grooves (14). One end of the buckle (12) is sleeved on the outside of the first rotating shaft (16), and the bottom of the buckle (12) is provided with a slot (17) that matches the locking post (15).
8. A chip testing method, applicable to the test connection device according to any one of claims 1-7, characterized in that: Includes the following steps: S1: Assembly, which involves combining and installing the test connection device with the test equipment; S2: Chip installation, placing the chip to be tested into the test connection device and fixing it in place; S3: Test, to test the chip placed inside the test connection device to determine whether the chip is functioning properly.