A power chip reliability test system and method

Abstract

This invention relates to the field of chip testing technology, specifically to a power chip reliability testing system and method, including a loading assembly, a connection assembly, a testing assembly, and an unloading assembly. The loading assembly feeds the power chip into a corresponding position on a lifting mounting platform. The lifting mounting platform has a connection hole, a clamping head is slidably disposed on one side of the connection hole, and a connection head is disposed on one side of the clamping head for electrical connection with the power chip. The liquid circulation tank of the testing assembly is located below the lifting mounting platform. A first control valve is connected to the liquid circulation tank, an inlet pump is connected to the first control valve, a heat preservation chamber is connected to the inlet pump, and a return pipe is connected to the liquid circulation tank. A second control valve is connected to the return pipe and the heat preservation chamber. A temperature controller is used to control the liquid temperature in the return pipe. The unloading assembly is used to discharge the tested power chip. This method can quickly generate temperature changes to improve testing efficiency.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a power chip reliability testing system and method. Background Technology

[0002] As a core component of electronic devices, the reliability of power chips directly determines the lifespan and stability of end products. During the research and development and production stages, power chips must undergo rigorous aging tests and reliability verification to screen out products that fail early. Existing testing equipment often suffers from the following drawbacks: Traditional air-cooled or simple heating platforms cannot quickly and uniformly simulate the temperature rise environment of power chips under high-power operation, resulting in a large deviation between test data and actual operating conditions.

[0003] During the alternation of high and low temperatures, the chip and the test socket are prone to micro-displacement due to thermal expansion and contraction, which may lead to poor contact or test interruption. Summary of the Invention

[0004] The purpose of this invention is to provide a power chip reliability testing system and method, which aims to rapidly generate temperature changes to improve testing efficiency.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a power chip reliability testing system, including a feeding component, a connection component, a detection component, and a discharging component. The connection component includes a base, a lifting mounting platform, a clamping head, and a connector. The lifting mounting platform is slidably disposed on the base. The feeding component is used to feed the power chip into a corresponding position on the lifting mounting platform. The lifting mounting platform is provided with a connection hole. The clamping head is slidably disposed on one side of the connection hole. The connector is disposed on one side of the clamping head and is used for electrical connection with the power chip. The detection assembly includes a liquid circulation tank, an inlet pump, a first control valve, a return pipe, a second control valve, a temperature controller, and an insulated box. The liquid circulation tank is located below the lifting mounting platform. The first control valve is connected to the liquid circulation tank, the inlet pump is connected to the first control valve, the insulated box is connected to the inlet pump, the return pipe is connected to the liquid circulation tank, the second control valve is connected to both the return pipe and the insulated box, and the temperature controller is used to control the liquid temperature in the return pipe. The discharge assembly is used to deliver the power chip that has completed testing.

[0006] The feeding assembly includes a support platform, a feeding plate, a control cylinder, an inclined slide, and a pushing structure. The support platform is fixed to one side of the base, the inclined slide is fixed to the support platform, the feeding plate is slidably disposed below the inclined slide, the output end of the control cylinder is connected to the feeding plate, and the pushing structure is disposed on one side of the inclined slide for pushing the power chip on the inclined slide onto the feeding plate.

[0007] The connecting hole has a chamfer.

[0008] The clamping head includes two clamping plates, two push rods, a clamping slider, and a clamping cylinder. The two clamping plates are slidably disposed on one side of the connecting hole, and the clamping slider is slidably disposed on one side of the clamping plates. One end of each of the two push rods is rotatably connected to the two clamping plates, and the other end of each push rod is rotatably connected to the clamping slider. The output end of the clamping cylinder is connected to the clamping slider.

[0009] The clamping head also includes a return spring, which is disposed between the clamping slider and the lifting mounting platform.

[0010] The connector includes multiple movable blocks, multiple metal plates, multiple connecting lines, and a detection module. The multiple movable blocks are slidably disposed on the lifting mounting platform, the multiple metal plates are disposed corresponding to the multiple movable blocks, and the multiple connecting lines are connected to the multiple metal plates and to the detection module.

[0011] The connecting assembly further includes a sealing box, which is disposed outside the liquid circulation pool.

[0012] The temperature controller includes a temperature detector, a refrigeration module, and a heating module. The temperature detector is disposed inside the refrigeration pipe, and the refrigeration module and the heating module are disposed on one side of the refrigeration pipe.

[0013] The insulated box includes a first box and a second box, wherein the liquid temperature in the first box is higher than that in the second box.

[0014] Secondly, the present invention also provides a power chip reliability testing method, which employs the aforementioned power chip reliability testing system.

[0015] This invention provides a power chip reliability testing system and method. The connection component is the core execution unit of the system, responsible for the physical fixation and electrical connection of the chip. The base serves as the supporting foundation, upon which a lifting mounting platform slides. This platform not only supports the chip under test but also possesses vertical freedom to facilitate loading / unloading operations and adjust the test height. Precision-machined connection holes are present on the platform to accommodate the power supply chip. A clamping head slides to one side of the connection holes, employing servo or pneumatic drive to adaptively adjust the clamping force according to the chip size. Its unique lateral sliding design effectively avoids damage to the chip pins caused by vertical pressure, while ensuring the chip remains secure even in high-temperature environments.

[0016] The connector is located inside the clamping head and directly contacts the pins or pads of the power chip. The connector integrates flexible probes or spring pins to ensure a low-impedance, highly stable electrical connection even under minor vibrations caused by fluid circulation.

[0017] To simulate the operating conditions of power chips under extreme temperatures, this invention innovatively introduces a liquid circulation temperature control system, replacing the traditional air convection heating method. The system constructs a closed liquid circulation loop, the core of which includes a liquid circulation tank, an inlet pump, a return pipe, and a control valve assembly.

[0018] The liquid circulation tank is located directly below the lifting mounting platform and serves as the heat exchange medium. When the lifting mounting platform descends, the chip or its heat dissipation substrate can be partially immersed in or exchange heat efficiently with the liquid in the tank through a thermally conductive interface.

[0019] The inlet pump provides circulation power, the first control valve controls the liquid to flow into the insulation box, and the second control valve, in conjunction with the return pipe, controls the liquid to flow back to the circulation tank, forming a bidirectional controllable flow path.

[0020] The insulated chamber serves as the main heat exchange chamber and is connected to the liquid inlet pump. The liquid flowing through it is heated or cooled to the target temperature here.

[0021] The temperature controller monitors the liquid temperature in the return pipe in real time and dynamically adjusts the power of the heating / cooling elements through a PID algorithm to ensure that the temperature fluctuation of the liquid entering the circulation pool is controlled within ±0.5℃, thereby providing an extremely stable thermal environment for the power chip.

[0022] The specific heat capacity of liquids is much greater than that of air, enabling the system to achieve rapid heating and cooling, significantly shortening the testing cycle, and more realistically simulating the junction temperature changes of chips under high loads.

[0023] The feeding assembly precisely delivers the power chip under test to the preset position on the lifting mounting platform (i.e., above the connection hole).

[0024] After testing, the lifting platform resets, the clamping head releases, and the discharge assembly (such as a pusher mechanism or a gripping robot) removes the tested chip. The system can automatically sort the chips to different receiving areas based on the test results (pass / fail), achieving automatic sorting of good and defective products.

[0025] The workflow is as follows: the loading assembly delivers the power chip to the bottom of the lifting mounting platform, the lifting platform descends and places the chip into the connection hole; the clamping head slides and closes to lock the chip; the connection head is pressed simultaneously to establish an electrical path.

[0026] The lifting platform descends to the liquid circulation tank area. The inlet pump starts, and the temperature controller adjusts the liquid to the set temperature (e.g., -40℃ to 150℃). The liquid circulates between the insulation chamber and the circulation tank, rapidly heating or cooling the chip. During constant or variable temperature processes, the detection component applies a voltage / current load to the chip through the connector and collects parameters such as the chip's output characteristics, leakage current, and response time in real time.

[0027] After the test, the system analyzes the data. If the product passes, the discharge assembly sends it to the good product area; if it fails, it sends it to the defective product area. The system then resets and prepares for the next round of testing.

[0028] This invention's liquid circulation temperature control system significantly improves the heating and cooling rates, shortening the single test cycle time. Immersion or near-field liquid cooling technology eliminates air thermal resistance, enabling more precise chip junction temperature control and test results that more closely reflect real-world application scenarios. The unique sliding clamping head design, combined with the lifting structure, effectively compensates for deformation caused by thermal expansion and contraction, eliminating intermittent connection issues during testing. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a structural diagram of a power chip reliability testing system according to the present invention.

[0031] Figure 2 This is a right-side structural diagram of a power chip reliability testing system according to the present invention.

[0032] Figure 3 This is a left-side structural diagram of a power chip reliability testing system according to the present invention.

[0033] Figure 4 yes Figure 3A magnified view of detail A.

[0034] Figure 5 This is a cross-sectional structural diagram of a power chip reliability testing system according to the present invention.

[0035] Figure 6 This is a structural diagram of the temperature controller of the present invention.

[0036] Base 101, lifting mounting platform 102, clamping head 103, connector 104, liquid circulation tank 105, liquid inlet pump 106, first control valve 107, return pipe 108, second control valve 109, temperature controller 110, insulation box 111, support platform 112, feeding plate 113, control cylinder 114, inclined rail 115, pushing structure 116, clamping plate 117, push rod 118, clamping slider 119, clamping cylinder 120, return spring 121, moving block 122, metal sheet 123, connecting wire 124, detection module 125, sealing box 126, temperature detector 127, refrigeration module 128, heating module 129, first box 130, second box 131. Detailed Implementation

[0037] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of this invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, in the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] First Embodiment Please see Figure 1Figure 6 illustrates a power chip reliability testing system provided by this invention, comprising a loading assembly, a connection assembly, a detection assembly, and an unloading assembly. The connection assembly includes a base 101, a lifting mounting platform 102, a clamping head 103, and a connector 104. The lifting mounting platform 102 is slidably mounted on the base 101. The loading assembly is used to feed the power chip into a corresponding position on the lifting mounting platform 102. The lifting mounting platform 102 has a connection hole. The clamping head 103 is slidably mounted on one side of the connection hole. The connector 104 is located on one side of the clamping head 103 and is used for electrical connection with the power chip. The detection assembly includes a liquid circulation tank 105, a liquid inlet pump 106, and a first control... The system includes a control valve 107, a return pipe 108, a second control valve 109, a temperature controller 110, and an insulation box 111. The liquid circulation tank 105 is located below the lifting mounting platform 102. The first control valve 107 is connected to the liquid circulation tank 105. The inlet pump 106 is connected to the first control valve 107. The insulation box 111 is connected to the inlet pump 106. The return pipe 108 is connected to the liquid circulation tank 105. The second control valve 109 is connected to both the return pipe 108 and the insulation box 111. The temperature controller 110 is used to control the liquid temperature in the return pipe 108. The discharge assembly is used to discharge the power chip after testing.

[0040] In this embodiment, the connection component is the core execution unit of the system, responsible for the physical fixation and electrical connection of the chip. The base 101 serves as a supporting foundation, on which a lifting mounting platform 102 is slidably mounted. The lifting mounting platform 102 not only supports the chip under test but also possesses vertical freedom to facilitate loading / unloading actions and adjust the test height. The lifting mounting platform 102 has precision-machined connection holes for accommodating power chips. A clamping head 103 is slidably mounted on one side of the connection holes, employing servo or pneumatic drive, and can adaptively adjust the clamping force according to the chip size. Its unique lateral sliding design effectively avoids damage to the chip pins caused by vertical pressure, while ensuring that the chip will not loosen under high-temperature environments.

[0041] The connector 104 is located inside the clamping head 103 and directly contacts the pins or pads of the power chip. The connector 104 integrates a flexible probe or pogo pin to ensure a low-impedance, highly stable electrical connection even under minor vibrations caused by liquid circulation.

[0042] To simulate the operating conditions of a power chip under extreme temperatures, this invention innovatively introduces a liquid circulation temperature control system, replacing the traditional air convection heating method. The system constructs a closed liquid circulation loop, the core of which includes a liquid circulation tank 105, an inlet pump 106, a return pipe 108, and a control valve assembly.

[0043] The liquid circulation tank 105 is located directly below the lifting mounting platform 102 and serves as a heat exchange medium. When the lifting mounting platform 102 descends, the chip or its heat dissipation substrate can be partially immersed in or exchange heat efficiently with the liquid in the tank through a thermally conductive interface.

[0044] The inlet pump 106 provides circulation power, the first control valve 107 controls the liquid to flow into the insulation box 111, and the second control valve 109, in conjunction with the return pipe 108, controls the liquid to flow back to the circulation pool, forming a bidirectional controllable flow path.

[0045] The insulated chamber 111 serves as the main heat exchange chamber and is connected to the liquid inlet pump 106. The liquid flowing through it is heated or cooled to the target temperature here.

[0046] Temperature controller 110 monitors the liquid temperature in return pipe 108 in real time and dynamically adjusts the power of heating / cooling elements through PID algorithm to ensure that the liquid temperature fluctuation entering the circulation pool is controlled within ±0.5℃, thereby providing an extremely stable thermal environment for the power chip.

[0047] The specific heat capacity of liquids is much greater than that of air, enabling the system to achieve rapid heating and cooling, significantly shortening the testing cycle, and more realistically simulating the junction temperature changes of chips under high loads.

[0048] The feeding assembly precisely delivers the power chip under test to the preset position (i.e. above the connection hole) on the lifting mounting platform 102.

[0049] After testing, the lifting mounting platform 102 resets, the clamping head 103 releases, and the unloading component removes the tested chips. The unloading component includes a good product receiving tray and a defective product receiving tray, and automatically sorts the chips to the corresponding trays according to the judgment results of the testing module. The system can automatically divert chips to different receiving areas according to the test results (pass / fail), realizing automatic sorting of good and defective products.

[0050] The workflow is as follows: the feeding component delivers the power chip to the lower part of the lifting mounting platform 102, the lifting platform descends and places the chip into the connection hole; the clamping head 103 slides and closes to lock the chip; the connector head 104 presses it in sync to establish an electrical path.

[0051] The lifting platform 102 descends to the liquid circulation tank 105 area. The liquid inlet pump 106 starts, and the temperature controller 110 adjusts the liquid to the set temperature (e.g., -40℃ to 150℃ range). The liquid circulates between the insulation box 111 and the circulation tank, rapidly heating or cooling the chip. During constant or variable temperature processes, the detection component applies a voltage / current load to the chip through the connector 104 and collects parameters such as the chip's output characteristics, leakage current, and response time in real time.

[0052] After the test, the system analyzes the data. If the product passes, the discharge assembly sends it to the good product area; if it fails, it sends it to the defective product area. The system then resets and prepares for the next round of testing.

[0053] This invention's liquid circulation temperature control system significantly improves the heating and cooling rates, shortening the single test cycle time. Immersion or near-field liquid cooling technology eliminates air thermal resistance, enabling more precise chip junction temperature control and test results that more closely reflect real-world application scenarios. The unique sliding clamping head 103 design, combined with the lifting structure, effectively compensates for deformation caused by thermal expansion and contraction, eliminating intermittent connection issues during testing.

[0054] The feeding assembly includes a support platform 112, a feeding plate 113, a control cylinder 114, an inclined chute 115, and a pushing structure 116. The support platform 112 is fixed to one side of the base 101, the inclined chute 115 is fixed on the support platform 112, the feeding plate 113 is slidably disposed below the inclined chute 115, the output end of the control cylinder 114 is connected to the feeding plate 113, and the pushing structure 116 is disposed on one side of the inclined chute 115 for pushing the power chip on the inclined chute 115 onto the feeding plate 113.

[0055] The support platform 112 serves as the rigid frame of the feeding unit and is firmly fixed to the side of the system base 101. The support platform 112 not only supports all feeding components but also isolates vibrations from the liquid circulation pump and lifting mechanism through a shock-absorbing design, ensuring the stability of the feeding process.

[0056] The inclined chute 115 is fixedly installed above the support platform 112, arranged at a specific angle or in a straight line. The cross-sectional shape of the inclined chute 115 matches the outline of the power chip, and uses gravity or a vibrating feeder to arrange the chips in an orderly manner and transport them to the standby position.

[0057] The pusher structure 116 is located on one side of the ramp 115. Upon receiving a signal, it rotates to horizontally push out the single power chip at the end of the ramp 115. The flexible pusher design effectively prevents scratches on the chip package surface caused by hard contact.

[0058] The loading plate 113 is slidably positioned directly below the inclined chute 115. The surface of the loading plate 113 is machined with positioning grooves that are consistent with the size of the chip, ensuring that the chip has a unique and stable posture after falling in.

[0059] When material needs to be received, the control cylinder 114 drives the loading plate 113 to rise to its highest position, so that the positioning groove of the loading plate 113 is precisely aligned with the outlet of the inclined chute 115 and the pushing line of the pushing structure 116. At this time, the pushing structure 116 is activated, smoothly pushing the chip into the groove of the loading plate 113.

[0060] After receiving the material, the control cylinder 114 drives the loading plate 113 to move below the lifting mounting platform 102.

[0061] The connection hole is chamfered.

[0062] At the entrance of the connector hole (i.e., the chip entry point), a tapered or arc-shaped chamfer is machined. The chamfer angle is precisely calculated (typically 30°-45°) to form a flared guide area. The taper of the chamfer matches the edge or pin carrier shape of the power chip, forming a progressive mating space.

[0063] The clamping head 103 includes two clamping plates 117, two push rods 118, a clamping slider 119, and a clamping cylinder 120. The two clamping plates 117 are slidably disposed on one side of the connecting hole, and the clamping slider 119 is slidably disposed on one side of the clamping plate 117. One end of each of the two push rods 118 is rotatably connected to the two clamping plates 117, and the other end of each push rod 118 is rotatably connected to the clamping slider 119. The output end of the clamping cylinder 120 is connected to the clamping slider 119.

[0064] Two clamping plates 117 are symmetrically slidably arranged on both sides of the connecting hole (or a bidirectional sliding structure on one side). Their inner working surfaces are hardened and conform to the shape of the chip for directly clamping the power chip. One end of the push rod 118 is rotatably connected to the two clamping plates 117 respectively (as the first hinge point); the other end of the push rod 118 is rotatably connected to the clamping slider 119 together (as the second hinge point).

[0065] When the clamping cylinder 120 pushes the clamping slider 119 to move linearly, the horizontal thrust is converted into a component force perpendicular to the direction of movement of the clamping plate 117 by the angle change of the push rod 118, driving the two clamping plates 117 to move towards or away from each other. This linkage structure has self-locking and force-amplifying characteristics: at the final clamping position, the linkage is close to the dead point, which can generate a huge clamping force with a small cylinder output force, ensuring that the chip remains motionless under high temperature and high pressure environment; at the same time, the rotating connection design allows the clamping plate 117 to finely adjust the angle within a certain range, adapting to the small deformation of the chip.

[0066] The output end of the clamping cylinder 120 is directly connected to the clamping slider 119, providing a stable and adjustable driving force.

[0067] The clamping head 103 also includes a return spring 121, which is disposed between the clamping slider 119 and the lifting mounting platform 102.

[0068] When the system suddenly loses power or the air supply fails, the elastic force of the reset spring 121 can push the clamping slider 119 to move in the opposite direction, and drive the clamping plate 117 to automatically loosen through the connecting rod, so as to prevent the chip from being damaged due to prolonged tight clamping and facilitate emergency material removal.

[0069] During the micro-vibrations generated by liquid circulation or the movement of the lifting platform, the spring acts as a damping buffer, absorbing impact energy and protecting the precision linkage mechanism and chip pins.

[0070] The connector 104 includes multiple moving blocks 122, multiple metal pieces 123, multiple connecting lines 124, and a detection module 125. The multiple moving blocks 122 are slidably disposed on the lifting mounting platform 102. The multiple metal pieces 123 are disposed corresponding to the multiple moving blocks 122. The multiple connecting lines 124 are connected to the multiple metal pieces 123 and to the detection module 125.

[0071] To address the challenges posed by small chip pin pitch, high coplanarity requirements, and contact issues caused by thermal deformation, connector 104 employs a modular, floating, multi-point contact design.

[0072] Multiple movable blocks 122 are independently slidably mounted on the lifting mounting platform 102. Each movable block 122 corresponds to one or a group of pins of the chip. The movable blocks 122 can float slightly in the vertical or horizontal direction to compensate for positional errors during chip placement and expansion displacement after heating. Each movable block 122 is equipped with a highly conductive metal sheet 123 (such as a gold-plated beryllium copper probe or a spring). The metal sheet 123 has excellent elasticity and can form a stable connection with low contact resistance with the chip pins.

[0073] Each metal plate 123 is led out via an independent connecting line 124. All connecting lines 124 converge and connect to an external detection module 125. The detection module 125 is responsible for applying test voltage / current and acquiring various electrical parameters of the chip in real time (such as VI characteristics, switching losses, temperature drift coefficient, etc.).

[0074] This "one-to-one" or "many-to-many" independent floating connection method avoids the problem of traditional integrated sockets failing the entire test due to poor contact at a single point, and significantly improves the accuracy and repeatability of test data.

[0075] The connection assembly also includes a sealing box 126, which is disposed outside the liquid circulation pool 105.

[0076] Given that the detection components involve a liquid circulation system and that the liquid coexists with high-voltage electrical components, the design of the sealed enclosure 126 is crucial.

[0077] The sealing box 126 is located outside the liquid circulation pool 105, completely enclosing the entire liquid circulation loop (including the circulation pool, pipe interfaces, pump body connections, etc.) to reduce leakage.

[0078] Even if the liquid circulation tank 105 or the pipeline accidentally ruptures or leaks, the sealed box 126 can completely confine the coolant inside the box, preventing liquid from splashing onto high-voltage electrical components, control circuits or chip surfaces, and eliminating short-circuit accidents.

[0079] The temperature controller 110 includes a temperature detector 127, a cooling module 128, and a heating module 129. The temperature detector 127 is disposed inside the return pipe 108, and the cooling module 128 and the heating module 129 are disposed on one side of the return pipe 108.

[0080] A temperature detector 127 is installed inside the return pipe 108 as a feedback sensing element of the temperature control system, monitoring the temperature of the medium returning from the liquid circulation pool 105 to the insulation box 111 in real time. The temperature detector 127 uses a high-precision platinum resistance temperature sensor (Pt100 or Pt1000) or a K-type / T-type thermocouple, with a measurement range covering -50℃ to +200℃, an accuracy class of A (±0.15℃) or I (±0.5℃), and a response time of less than 1 second. The sensor probe is inserted into the center of the return pipe 108, maintaining a certain distance from the pipe wall to ensure that the measured value is the temperature of the medium itself, not the pipe wall temperature.

[0081] The refrigeration module 128 is located on one side of the return pipe 108 and is used to rapidly cool the high-temperature return medium. It includes a compressor, condenser, expansion valve, evaporator, and circulating fan. The compressor is a fully enclosed scroll or rotary refrigeration compressor, with its cooling capacity determined based on system heat load calculations (typically 1-5kW), using environmentally friendly refrigerants (R134a, R410A, or R404A). The evaporator is a co-type or plate heat exchanger, with the inner tube carrying the circulating medium and the outer tube carrying the refrigerant, achieving efficient heat transfer through counter-current heat exchange. The evaporator is arranged close to the outer wall of the return pipe 108 or connected in series with it, ensuring that the cooling capacity directly acts on the medium to be cooled. The start / stop and cooling capacity adjustment of the refrigeration module 128 are achieved by controlling the compressor's inverter driver via a PWM signal or a 4-20mA signal output from the control unit, with an adjustment range of 10%-100% and a cooling rate of 5-15℃ / min.

[0082] The heating module 129 is located on one side of the reflux pipe 108 (usually arranged opposite to the cooling module 128 or arranged alternately in sections) and is used to rapidly heat the low-temperature reflux medium. It includes an electric heating element, a solid-state relay, heat sink fins, and safety protection devices. The electric heating element is a stainless steel armored heater or a flange immersion heater. The heating power is calculated and determined according to the required heating rate (usually 2-10kW), and the surface load of the tube is less than 5W / cm². 2 To prevent localized overheating and carbonization of the medium, the heating element is embedded in the spiral groove on the outer wall of the return pipe 108 or directly inserted into the guide sleeve inside the pipe, ensuring uniform heat transfer to the medium. The solid-state relay, as a contactless switching device, receives the PID output signal from the control unit and continuously adjusts the heating power by changing the conduction angle, with an adjustment resolution of 0.1%, fast response, no mechanical wear, and long service life. Heat dissipation fins are located on the outside of the heating element to accelerate heat dissipation when heating stops, preventing temperature overshoot. Safety protection devices include an over-temperature fuse (operating temperature set at the maximum allowable temperature of the medium + 10℃) and a leakage current protector, automatically cutting off the power supply in abnormal situations.

[0083] The control unit, as the core of the temperature controller 110, employs an industrial-grade PLC or a dedicated temperature control instrument, and incorporates a built-in PID self-tuning algorithm and fuzzy control algorithm. The control unit receives feedback signals from the temperature detector 127, compares them with the set temperature value to calculate the deviation, and outputs control quantities to the refrigeration module 128 and the heating module 129 through PID calculation, achieving closed-loop temperature control. Control parameters (proportional band P, integral time I, derivative time D) can be automatically optimized through the self-tuning function or manually fine-tuned to adapt to different media and heat load characteristics. The control unit also features temperature curve programming capabilities, allowing for the preset of multiple temperature rise and fall programs (e.g., a temperature cycle of -40℃→25℃→125℃→25℃). The temperature value, heating / cooling rate, and holding time for each segment can be independently set, meeting the requirements of various reliability testing standards (e.g., JEDEC JESD22, MIL-STD-883). The human-machine interface uses a touchscreen or industrial computer to display the temperature curve, operating status, and alarm information in real time, and records historical data for traceability and analysis.

[0084] The insulated box 111 includes a first box 130 and a second box 131, wherein the liquid temperature in the first box 130 is higher than that in the second box 131.

[0085] The first chamber 130 serves as a high-temperature liquid storage area, where the temperature of the liquid stored is higher than that of the second chamber 131. Its operating temperature range is +20℃ to +150℃ (expandable to +200℃ depending on testing requirements). The first chamber 130 employs a double-layer stainless steel structure, with an inner liner made of 316L stainless steel (oil-resistant and corrosion-resistant) and an outer shell made of 304 stainless steel. The interlayer is filled with high-temperature resistant insulation material (such as aluminum silicate fiber felt or aerogel). The chamber volume is designed based on system circulation volume and thermal inertia requirements, typically ranging from 10 to 30L. The outlet of the first chamber 130 is connected to the inlet of the inlet pump 106 via a high-temperature circulation pump, providing the high-temperature medium to the liquid circulation tank 105. The return port is connected to the liquid circulation tank 105 via a second control valve 109 and a return pipe 108, receiving the returned medium after testing.

[0086] The second chamber 131 serves as a cryogenic liquid storage area, where the temperature of the stored liquid is lower than that of the first chamber 130, with an operating temperature range of -40℃ to +20℃. The second chamber 131 also employs a double-layer stainless steel structure, with an inner liner made of 304 stainless steel (resistant to low temperatures and ethylene glycol solutions), and a sandwich layer filled with cryogenic insulation material (such as polyurethane foam). The chamber volume is comparable to or slightly larger than that of the first chamber 130 (due to the large density variations of the cryogenic medium, a larger volume is required for compensation). It is equipped with an evaporator coil (connected to the compressor system of the refrigeration module 128), a cryogenic stirrer (using cryogenic bearings and seals), and a cryogenic liquid level sensor. The outlet of the second chamber 131 is connected to the inlet of the inlet pump 106 via a cryogenic circulation pump, providing the cryogenic medium to the liquid circulation tank 105; the return port is also connected to the liquid circulation tank 105 via a second control valve 109 and a return pipe 108.

[0087] In high-temperature testing mode, when the system needs to supply high-temperature medium to the liquid circulation tank 105, the first control valve 107 switches to connect with the first chamber 130. The high-temperature circulation pump in the first chamber 130 starts, and the high-temperature medium enters the liquid circulation tank 105 after being pressurized by the inlet pump 106. The return medium returns through the return pipe 108. If the temperature is still higher than the set temperature of the first chamber 130, it returns to the first chamber 130 after being cooled by the cooling module 128. If the temperature is close to the set value, it directly returns. The second chamber 131 is in a heat preservation standby state.

[0088] When the system requires a cryogenic medium in the low-temperature test mode, the first control valve 107 switches to connect with the second chamber 131. The cryogenic circulation pump in the second chamber 131 starts, and the cryogenic medium enters the liquid circulation tank 105 via the inlet pump 106. The return medium returns via the return pipe 108. If the temperature is lower than the set temperature of the second chamber 131, it is heated by the heating module 129 and then returns to the second chamber 131. If the temperature is close to the set value, it directly returns. The first chamber 130 can maintain high-temperature standby or turn off heating for energy saving.

[0089] When the test requires rapid temperature conversion (such as a temperature shock test of +125℃↔-40℃), the first chamber 130 and the second chamber 131 are in working condition at the same time. By quickly switching the passage of the first control valve 107 and adjusting the flow rate of the liquid inlet pump 106, the rapid alternation of high and low temperature media can be achieved, and the temperature conversion time can be shortened to less than 30 seconds.

[0090] Second Embodiment The present invention also provides a power chip reliability testing method, which uses the aforementioned power chip reliability testing system.

[0091] Start the central control system and check the status of the feeding, connecting, detecting, and discharging components, confirming that the air pressure, hydraulic, and electrical connections are normal. The operator sets the target test temperature curve (e.g., a cyclic curve from -40℃ to 150℃, or a constant temperature aging temperature) through the temperature controller 110.

[0092] The inlet pump 106 is started, and the first control valve 107 and the second control valve 109 are opened to drive the coolant to circulate between the insulation box 111, the return pipe 108, and the liquid circulation pool 105. The temperature controller 110 monitors the temperature of the return pipe 108 in real time and adjusts the heating or cooling power until the temperature of the medium in the liquid circulation pool 105 stabilizes within ±0.5℃ of the set value. At this time, the sealed box 126 is in a closed and locked state to ensure the isolation of the internal environment.

[0093] The control cylinder 114 drives the feeding plate 113 to move to the receiving position, so that the positioning groove of the feeding plate 113 is aligned with the outlet of the inclined chute 115 and the pushing structure 116.

[0094] When the pusher structure 116 is activated, it pushes the single power chip arranged on the inclined chute 115 horizontally into the positioning groove of the loading plate 113.

[0095] The pusher structure 116 resets, and the control cylinder 114 moves the chip-carrying loading plate 113 to the designated position. The lifting mounting platform 102 moves or, through an auxiliary pushing mechanism, transfers the chip from the loading plate 113 to the connection hole. During this process, the chamfered structure at the entrance of the connection hole acts as a guide, automatically correcting minor positional deviations of the chip to ensure that the chip falls smoothly into the predetermined test position.

[0096] The clamping cylinder 120 extends, pushing the clamping slider 119 to move in the clamping direction, while simultaneously compressing the return spring 121 located between the slider and the lifting mounting platform 102. The movement of the clamping slider 119 is transmitted through two push rods 118. Since both ends of the push rods 118 are rotatably connected, the linear motion of the slider is converted into an angular change in the push rods 118, which in turn drives the two clamping plates 117 to slide towards each other, tightly gripping the power chip.

[0097] The lifting mounting platform 102 is finely adjusted (or the connector 104 assembly is actively activated) to bring the multiple metal plates 123 set on the moving block 122 closer to the chip pins.

[0098] Because the movable block 122 is slidable and the metal sheet 123 is elastic, each contact can float independently, automatically compensating for the coplanarity error and thermal deformation displacement of the chip pins, ensuring that each pin forms a low-impedance, highly reliable physical contact with the metal sheet 123.

[0099] The lifting mounting platform 102 descends, bringing the clamped power chip into the liquid circulation pool 105 area within the sealed enclosure 126. The bottom of the chip package or its heat dissipation surface directly contacts the high-speed flowing temperature-controlled liquid (or contacts it through an extremely thin thermally conductive interface), achieving efficient heat exchange.

[0100] The detection module 125 applies rated or overload voltage / current load to the power chip through the connecting wire 124 and the metal plate 123 to simulate actual working conditions.

[0101] During the process of liquid temperature changing according to a preset curve (such as rapid heating, constant temperature maintenance, and rapid cooling), the detection module 125 real-time high-frequency acquisition chip acquires key parameters such as output voltage, current, power, leakage current, and response time.

[0102] The system monitors the liquid temperature, flow rate, and estimated chip junction temperature in real time. If any parameter exceeds the threshold (such as overheating, overcurrent, or open circuit), an alarm is immediately triggered and an emergency shutdown procedure is executed (clamping cylinder 120 depressurizes, and reset spring 121 releases clamping plate 117).

[0103] After the test cycle is completed, the lifting platform 102 rises, taking the chip away from the liquid circulation pool 105 and returning it to the dry upper space.

[0104] The clamping cylinder 120 retracts, the reset spring 121 releases its elastic force, pushing the clamping slider 119 to reset, and through the linkage mechanism, the two clamping plates 117 slide in opposite directions, releasing the power chip.

[0105] The unloading component moves to remove the tested chip from the connection hole.

[0106] The above description discloses only one preferred embodiment of the present invention, and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that all or part of the processes of the above embodiments can be implemented, and equivalent changes made in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A power chip reliability testing system, characterized in that, It includes a feeding component, a connecting component, a detection component, and a discharging component. The connecting component includes a base, a lifting mounting platform, a clamping head, and a connector. The lifting mounting platform is slidably disposed on the base. The feeding component is used to feed the power chip into the corresponding position of the lifting mounting platform. The lifting mounting platform is provided with a connecting hole. The clamping head is slidably disposed on one side of the connecting hole. The connector is disposed on one side of the clamping head and is used to electrically connect with the power chip. The detection assembly includes a liquid circulation tank, an inlet pump, a first control valve, a return pipe, a second control valve, a temperature controller, and an insulated box. The liquid circulation tank is located below the lifting mounting platform. The first control valve is connected to the liquid circulation tank, the inlet pump is connected to the first control valve, the insulated box is connected to the inlet pump, the return pipe is connected to the liquid circulation tank, the second control valve is connected to both the return pipe and the insulated box, and the temperature controller is used to control the liquid temperature in the return pipe. The discharge assembly is used to deliver the power chip that has completed testing.

2. The power chip reliability testing system as described in claim 1, characterized in that, The feeding assembly includes a support platform, a feeding plate, a control cylinder, an inclined slide, and a pushing structure. The support platform is fixed to one side of the base, the inclined slide is fixed to the support platform, the feeding plate is slidably disposed below the inclined slide, the output end of the control cylinder is connected to the feeding plate, and the pushing structure is disposed on one side of the inclined slide for pushing the power chip on the inclined slide onto the feeding plate.

3. The power chip reliability testing system as described in claim 2, characterized in that, The connection hole is chamfered.

4. The power chip reliability testing system as described in claim 3, characterized in that, The clamping head includes two clamping plates, two push rods, a clamping slider, and a clamping cylinder. The two clamping plates are slidably disposed on one side of the connecting hole, and the clamping slider is slidably disposed on one side of the clamping plates. One end of each of the two push rods is rotatably connected to the two clamping plates, and the other end of each push rod is rotatably connected to the clamping slider. The output end of the clamping cylinder is connected to the clamping slider.

5. The power chip reliability testing system as described in claim 4, characterized in that, The clamping head also includes a return spring, which is disposed between the clamping slider and the lifting mounting platform.

6. The power chip reliability testing system as described in claim 5, characterized in that, The connector includes multiple movable blocks, multiple metal plates, multiple connecting lines, and a detection module. The multiple movable blocks are slidably disposed on the lifting mounting platform, the multiple metal plates are disposed corresponding to the multiple movable blocks, and the multiple connecting lines are connected to the multiple metal plates and to the detection module.

7. A power chip reliability testing system as described in claim 6, characterized in that, The connection assembly also includes a sealing box disposed outside the liquid circulation pool.

8. The power chip reliability testing system as described in claim 7, characterized in that, The temperature controller includes a temperature detector, a cooling module, and a heating module. The temperature detector is disposed inside the return pipe, and the cooling module and the heating module are disposed on one side of the return pipe.

9. A power chip reliability testing system as described in claim 8, characterized in that, The insulated box includes a first box and a second box, wherein the liquid temperature in the first box is higher than that in the second box.

10. A method for testing the reliability of a power supply chip, characterized in that, It is applied to a power chip reliability testing system as described in any one of claims 1 to 9.

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