Busbar structure and preparation method thereof

Abstract

This invention discloses a busbar structure and its manufacturing method, relating to the field of electrical components. It includes a lower base, with an upper base and a heat sink plate sequentially mounted on the top of the lower base. Multiple sets of heat sink rods are mounted on the top of the upper base. The top of the heat sink plate has heat dissipation holes that engage with the heat sink rods. The heat sink plate is hollow and contains heat dissipation pipes connected to an external cooling source. A feed pipe is located in the middle of each heat sink rod. This invention, through the upper base and heat sink plate, and the mounting of multiple sets of heat sink rods on the top of the upper base, with the heat dissipation holes on the heat sink plate engaging with the heat sink rods, not only secures the heat sink plate but also facilitates the injection of heat generated by the heat sink rods into the heat sink plate, improving heat dissipation. Furthermore, the heat dissipation pipes inside the heat sink plate allow for the injection of additional cooling air, further enhancing the heat dissipation effect.

Description

Technical Field

[0001] This invention relates to the field of electrical components, specifically to a busbar structure and its preparation method. Background Technology

[0002] Busbars are conductive metal materials widely used in power distribution systems, primarily for transmitting electricity from the power source to various loads. They are mainly made of copper and aluminum, with brass as a secondary material, and feature high conductivity and corrosion resistance. Common forms include flat bars, rectangular bars, and tubular bars. Tin plating can enhance oxidation resistance, and electroplating can increase contact resistance.

[0003] Existing technology, such as Chinese Patent Publication No. CN211128734U, discloses a heat dissipation device for a busbar capacitor assembly. The busbar capacitor assembly includes a capacitor and a stacked busbar connected to the capacitor. The stacked busbar includes a PN copper busbar and an output copper busbar stacked on top of each other, and the stacked busbar is connected to the internal copper busbar of the capacitor through the PN copper busbar. The heat dissipation device includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component dissipates heat from the PN copper busbar through contact heat transfer, and the second heat dissipation component dissipates heat from the output copper busbar through contact heat transfer.

[0004] However, existing technologies typically use aramid paper for insulation during use. However, aramid paper requires precise cutting and manual / mechanical assembly, which can easily lead to positioning deviations and gaps. The yield rate is greatly affected by the precision of operation. Aramid paper is also prone to absorbing moisture under long-term high temperature and high humidity, which can cause a decrease in insulation resistance. Therefore, new materials need to be used to replace it. Secondly, existing busbars usually dissipate heat directly through heat-conducting structures, which results in poor heat dissipation. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a busbar structure and its preparation method to solve the technical problems of poor performance and poor heat dissipation of existing barrier materials.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a busbar structure, comprising a lower seat, an upper seat and a heat sink plate sequentially mounted on the top of the lower seat, multiple sets of heat sinks mounted on the top of the upper seat, heat sink holes with engaging connections between the heat sink holes and the heat sinks, a hollow interior of the heat sink plate, and heat sink pipes installed inside the heat sink plate, the heat sink pipes being connected to an external cooling source, a feed pipe extending into the lower seat from the middle of the heat sinks, a multi-layered stacked sheet mounted between the upper and lower seats, the edges of the stacked sheet extending to the outer side of the lower seat, a circuit board connected to the top of the stacked sheet, a control circuit on the inner wall of the circuit board, the control circuit being connected to the stacked sheet, a base plate mounted on the bottom of the lower seat, and multiple sets of pins mounted on the edge of the lower seat.

[0007] By adopting the above technical solution, it is convenient to assemble the busbar, and the heat dissipation plate and the upper body facilitate heat dissipation of the busbar.

[0008] The present invention is further configured such that wiring shells are provided on both sides of the lower seat, and corresponding connectors are also provided on the edge of the laminated piece, and the connectors extend into the interior of the wiring shells. Fixing bolts are installed inside the wiring shells, and the fixing bolts are fitted with the connectors.

[0009] Preferably, the busbar can be easily connected to an external power source.

[0010] The present invention is further configured such that the top end of the lower seat has multiple sets of lower fixing holes, the top end of the heat sink has a mounting hole, the lower fixing holes are aligned with the mounting holes, and the upper seat also has corresponding mounting holes inside. The bolt passes through the mounting hole and is inserted into the lower fixing hole for fixing.

[0011] Preferably, the upper and lower seats can be easily connected, and the heat sink can also be fixed.

[0012] The present invention is further configured such that a positioning block is provided on the inner wall of the lower seat, the bottom plate is fixedly connected to the lower seat through the positioning block, and an insulating layer is connected to the top of the bottom plate, the insulating layer being aligned with the bottom end of the laminated sheet.

[0013] Preferably, the lower seat body can be easily sealed.

[0014] The present invention is further configured such that air inlets are provided at both ends of the heat dissipation pipe, the air inlets extend to the outer side of the heat dissipation plate, multiple sets of heat dissipation fins are provided on the outer wall of the heat dissipation pipe, the heat dissipation fins are located inside the heat dissipation plate, and reinforcing plates are provided between the heat dissipation fins.

[0015] Preferably, it can facilitate further heat dissipation of the heat sink and improve the heat dissipation effect.

[0016] The present invention is further configured such that multiple sets of sleeves are provided in the middle of the heat sink, and a feed pipe is installed inside the sleeve, the feed pipe penetrates the upper body and extends into the interior of the lower body.

[0017] Preferably, epoxy resin can be injected into the housing through a feed pipe.

[0018] The present invention is further configured such that a cover plate is provided at the top of the circuit board, and there are two sets of cover plates, and a gap is provided between the cover plates, through which the feed pipe extends into the interior of the lower body.

[0019] Preferably, it facilitates the entry of epoxy resin into the equipment.

[0020] A method for preparing a busbar structure, the process comprising the following steps: Step 1: Each set of laminated sheets needs to be installed inside the lower base. The outer side of the laminated sheets is attached with a PI film. Then, it is installed inside the lower base through the connector, with the end extending into the lower fixing hole and limited by the fixing bolt. Step 2: Install each set of circuit boards on top of the laminate, and connect and control the laminate via wires. Then install the insulating layer on top of the circuit boards. Step 3: Install the upper seat body on top of the lower seat body. At this time, insert the sleeve between the cover plates. Finally, fix the upper and lower seats together with the fixing bolts to complete the assembly of the busbar. Step 4: Install the heat sink onto the upper body and insert each set of heat dissipation holes into the outside of the heat sink rod to fix the heat sink and complete the assembly of the busbar. Step 5: Install the heat sink onto the upper body and insert each set of heat dissipation holes into the outside of the heat sink rod to fix the heat sink and complete the assembly of the busbar. Step Six: When sufficient volume has been injected, switch to the other half of the feed pipe for injection, allowing air to escape from the other side; Step 7: Leave the middle of the feed pipe empty, and inject epoxy resin from both sides of the multiple feed pipes until the epoxy resin is discharged from the middle feed pipe. At this point, stop the epoxy resin injection and remove any excess epoxy resin to improve the sealing effect.

[0021] In summary, the present invention has the following main beneficial effects: 1. The present invention, through the design of the lower seat, can seal the epoxy resin during potting in use, and through the protective structure, can protect the laminated sheets, thereby improving safety.

[0022] 2. The present invention has an upper base and a heat sink plate. Multiple heat sink rods are installed on the top of the upper base, and the heat sink plate has heat sink holes that are inserted into the heat sink rods. This not only fixes the heat sink plate, but also allows the heat generated by the heat sink rods to be injected into the heat sink plate, thereby improving the heat dissipation effect. In addition, heat sink pipes are installed inside the heat sink plate, which can inject additional cooling air. The airflow into the heat sink plate further improves the heat dissipation effect.

[0023] 3. The present invention, through the upper seat, enables sufficient epoxy resin to be injected into the lower seat through the feed pipe after the equipment is assembled, thereby improving the injection effect. Furthermore, the segmented and layered injection of epoxy resin can effectively reduce residual air inside the equipment, reduce bubbles, and improve the injection molding effect. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the structure at the bottom of the present invention; Figure 3 This is a schematic diagram of the exploded structure of the present invention; Figure 4 This is a schematic diagram of the internal structure of the heat sink of the present invention; Figure 5 This is a schematic diagram of the heat dissipation pipe of the present invention; Figure 6 This is a schematic diagram of the structure of the upper seat of the present invention; Figure 7 This is a schematic diagram of the structure of the bottom end of the upper seat of the present invention; Figure 8 This is a schematic diagram of the structure of the base of the present invention; Figure 9 This is an exploded view of the internal circuitry of the base of the present invention. Figure 10 This is a schematic diagram of the internal structure of the base plate of the present invention.

[0025] Explanation of reference numerals in the attached figures: 1. Lower base; 101. Wiring shell; 102. Lower fixing hole; 103. Fixing bolt; 104. Positioning block; 2. Heat sink plate; 201. Heat dissipation hole; 202. Mounting hole; 3. Upper base; 301. Heat sink rod; 302. Sleeve; 303. Feed pipe; 4. Heat dissipation pipe; 401. Air inlet; 402. Heat sink fin; 403. Reinforcing plate; 5. Base plate; 501. Insulation layer; 6. Cover plate; 601. Opening; 7. Circuit board; 701. Control circuit; 8. Laminated plate; 801. Connector; 9. Lead pin. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0027] The embodiments of the present invention will now be described.

[0028] For examples, please refer to Figures 1 to 10 A busbar structure includes a lower seat 1, an upper seat 3 and a heat sink 2 sequentially mounted on the top of the lower seat 1, multiple sets of heat sinks 301 mounted on the top of the upper seat 3, heat sink 2 having heat dissipation holes 201 at the top of the heat sink 2, the heat dissipation holes 201 engaging with the heat sinks 301, the heat sink 2 being hollow inside, and heat dissipation pipes 4 installed inside the heat sink 2, the heat dissipation pipes 4 being connected to an external cooling source, a feed pipe 303 being provided in the middle of the heat sinks 301, multiple sets of sleeves 302 being provided in the middle of the heat sinks 301, and the feed pipes 303 being installed inside the sleeves 302, the feed pipes 303 penetrating the upper seat 3 and extending into the interior of the lower seat 1, a cover plate 6 being provided on the top of the circuit board 7, and two sets of cover plates 6 having a space between them. The feed pipe 303 extends into the interior of the lower body 1 through the gap. The upper body 3 and the lower body 1 are connected by a multi-layered stacked plate 8. The edge of the stacked plate 8 extends to the outside of the lower body 1. The lower body 1 has a wiring shell 101 on both sides. The edge of the stacked plate 8 is also connected to a corresponding connector 801. The connector 801 extends into the interior of the wiring shell 101. The wiring shell 101 is equipped with a fixing bolt 103, which fits into the connector 801. The top of the stacked plate 8 is connected to a circuit board 7. The inner wall of the circuit board 7 has a control circuit 701. The control circuit 701 is connected to the stacked plate 8. The bottom of the lower body 1 is equipped with a base plate 5. The edge of the lower body 1 is equipped with multiple sets of pins 9.

[0029] For details regarding the above embodiments, please refer to [link / reference]. Figure 10 The lower base 1 has a positioning block 104 on its inner wall. The base plate 5 is fixedly connected to the lower base 1 through the positioning block 104. An insulating layer 501 is connected to the top of the base plate 5. The insulating layer 501 is aligned with the bottom end of the laminated sheet 8, which facilitates the fixing of the base plate 5 and improves the installation effect.

[0030] For details regarding the above embodiments, please refer to [link / reference]. Figure 4 Both ends of the heat pipe 4 are provided with air inlets 401, which extend to the outside of the heat sink 2. Multiple sets of heat sinks 402 are provided on the outer wall of the heat pipe 4. The heat sinks 402 are located inside the heat sink 2. Reinforcing plates 403 are provided between the heat sinks 402, so that when automatic heat dissipation is not possible, further heat dissipation can be achieved through external airflow.

[0031] When using the busbar, the following steps are required: Step 1: First, connect the busbar connector to the external power source to supply power to each set of laminated plates; Step 2: During use, the current reaches the interior of each stack of laminates through the input, and the main body is energized for current collection; Step 3: In AC voltage, the busbar forms a stable voltage, a uniform electric field is formed inside the conductor, and the current flows along the low resistance of the copper plate. Step 4: The external current input is turned off, and the current is shunted from the busbar to each group of load circuits; Step 5: During the power-on process of the busbar, it continuously generates heat. The heat is transferred to the heat sink through the epoxy resin and the upper body, and then dissipated through the heat sink. Step Six: When the temperature is too high, inject cooling airflow into the heat pipes through the air inlet to further improve the heat dissipation effect of the heat sink. In use, the present invention first requires installing each set of laminated sheets 8 into the lower base 1. A PI film is attached to the outer side of each laminated sheet 8. Then, it is installed into the lower base 1 via connector 801, with the end extending into the lower fixing hole 102 and limited by fixing bolts 103. Next, each set of circuit boards 7 is installed above the laminated sheets 8, and the laminated sheets 8 are connected and controlled via wires. Then, an insulating layer 501 is installed above the circuit boards 7, and the upper base 3 is installed above the lower base 1. At this time, the sleeve 302 is inserted between the cover plates 6. Finally, the upper and lower bases are fixed together with fixing bolts, completing the assembly of the busbar. Finally, the heat sink 2 is installed above the upper base 3, and each set of heat dissipation holes 201 is inserted into the outer side of the heat sink 301, thereby fixing the heat sink 2 and completing the assembly of the busbar. Epoxy resin is injected into the busbar through one half of the feed pipe 303 using a high-pressure injection device, continuously injecting epoxy resin into the lower seat 1. At this time, the epoxy resin is sealed by the base plate 5 to prevent epoxy resin leakage. The epoxy resin gradually squeezes the air inside the busbar, and the gas is discharged through the remaining feed pipe 303. When sufficient amount is injected (after injection from the bottom of one half of the feed pipe 303), the other half of the feed pipe 303 is switched for injection, allowing the air to be discharged from the other side, improving the air discharge effect. In the final stage, the middle position of the feed pipe 303 is left empty, and injection is carried out from the outermost sides of the multiple sets of feed pipes 303 until the epoxy resin is discharged from the middle feed pipe 303. At this time, the epoxy resin injection ends, and excess epoxy resin is removed to improve the sealing effect. After the epoxy resin dries, the assembly is completed. During use, the busbar is connected to the power supply and controlled by the equipment. When the busbar temperature is too high, cooling gas is introduced through the air inlet 401 to cool the busbar and improve the cooling effect. The cooling airflow is also quickly introduced into the busbar through the feed pipe 303 to improve the cooling effect.

[0032] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A busbar structure, comprising a lower seat (1), characterized in that: The upper seat (3) and the heat sink (2) are sequentially installed on the top of the lower seat (1). Multiple heat sinks (301) are installed on the top of the upper seat (3). The heat sink (2) has heat dissipation holes (201) at its top. The heat dissipation holes (201) are engaged with the heat sinks (301). The heat sink (2) is hollow inside, and a heat dissipation pipe (4) is installed inside the heat sink (2). The heat dissipation pipe (4) is connected to an external cooling source. A feed pipe (303) is opened in the middle of the heat sink (301). The tube (303) extends into the interior of the lower seat (1). A multi-layered stacked sheet (8) is installed between the upper seat (3) and the lower seat (1). The edge of the stacked sheet (8) extends to the outside of the lower seat (1). A circuit board (7) is connected to the top of the stacked sheet (8). A control circuit (701) is located on the inner wall of the circuit board (7). The control circuit (701) is connected to the stacked sheet (8). A base plate (5) is installed at the bottom of the lower seat (1). Multiple sets of pins (9) are installed on the edge of the lower seat (1).

2. The busbar structure according to claim 1, characterized in that: The lower body (1) has wiring shells (101) on both sides, and the edge of the laminated piece (8) also has a corresponding connector (801), and the connector (801) extends into the interior of the wiring shell (101). The interior of the wiring shell (101) is fitted with a fixing bolt (103), and the fixing bolt (103) fits into the connector (801).

3. The busbar structure according to claim 1, characterized in that: The lower seat (1) has multiple sets of lower fixing holes (102) at its top end, and the heat sink (2) has a mounting hole (202) at its top end. The lower fixing holes (102) are aligned with the mounting holes (202), and the upper seat (3) also has corresponding mounting holes inside. The bolt passes through the mounting hole (202) and is inserted into the lower fixing hole (102) for fixing.

4. The busbar structure according to claim 1, characterized in that: The lower seat (1) has a positioning block (104) on its inner wall. The base plate (5) is fixedly connected to the lower seat (1) through the positioning block (104). The top of the base plate (5) is connected to an insulating layer (501), which is aligned with the bottom of the laminate (8).

5. A busbar structure according to claim 1, characterized in that: Both ends of the heat dissipation pipe (4) are provided with air inlets (401), the air inlets (401) extend to the outside of the heat dissipation plate (2), and multiple sets of heat dissipation fins (402) are provided on the outer wall of the heat dissipation pipe (4). The heat dissipation fins (402) are located inside the heat dissipation plate (2), and reinforcing plates (403) are provided between the heat dissipation fins (402).

6. The busbar structure according to claim 1, characterized in that: The heat sink (301) has multiple sets of sleeves (302) in the middle, and a feed pipe (303) is installed inside the sleeve (302). The feed pipe (303) passes through the upper body (3) and extends into the lower body (1).

7. A busbar structure according to claim 6, characterized in that: The circuit board (7) has a cover plate (6) at the top, and there are two sets of cover plates (6), and there is a gap between the cover plates (6). The feed pipe (303) extends into the interior of the lower body (1) through the gap.

8. A method for preparing a busbar structure, characterized in that... Using a busbar structure according to any one of claims 1-7, the process includes the following steps: Step 1: Each set of laminated sheets needs to be installed inside the lower base. The outer side of the laminated sheets is attached with a PI film. Then, it is installed inside the lower base through the connector, with the end extending into the lower fixing hole and limited by the fixing bolt. Step 2: Install each set of circuit boards on top of the laminate, and connect and control the laminate via wires. Then install the insulating layer on top of the circuit boards. Step 3: Install the upper seat body on top of the lower seat body. At this time, insert the sleeve between the cover plates. Finally, fix the upper and lower seats together with the fixing bolts to complete the assembly of the busbar. Step 4: Install the heat sink onto the upper body and insert each set of heat dissipation holes into the outside of the heat sink rod to fix the heat sink and complete the assembly of the busbar. Step 5: Install the heat sink onto the upper body and insert each set of heat dissipation holes into the outside of the heat sink rod to fix the heat sink and complete the assembly of the busbar. Step Six: When sufficient volume has been injected, switch to the other half of the feed pipe for injection, allowing air to escape from the other side; Step 7: Leave the middle of the feed pipe empty, and inject epoxy resin from both sides of the multiple feed pipes until the epoxy resin is discharged from the middle feed pipe. At this point, stop the epoxy resin injection and remove any excess epoxy resin to improve the sealing effect.

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