An electric cell connecting assembly with insulation protection structure and related manufacturing method

Abstract

This application provides a battery cell connection assembly with an insulating protective structure and a related manufacturing method. The battery cell connection assembly with the insulating protective structure may include: an injection-molded isolation base, a bus assembly, and a data acquisition harness. The injection-molded isolation base has a wire-passing groove extending along its length for laying the data acquisition harness, and also has a mounting groove for mounting the bus assembly. A positioning post on the injection-molded isolation base passes through the bus assembly to limit and fix the bus assembly. The bus assembly includes a bus body and an integrated insulating layer covering the surface of the bus body. The bus body has a connection portion for connecting to the battery cell terminal. A wire clamp structure for limiting and fixing the data acquisition harness is also provided next to the wire-passing groove. The end of the data acquisition harness is welded to the bus body, and the weld joint between the end of the data acquisition harness and the bus body is covered with an insulating encapsulation layer. The insulating protective performance of the battery cell connection assembly of this application is significantly improved.

Description

Technical Field

[0001] This application relates to the field of electronic device manufacturing technology, specifically to a battery cell connection assembly with an insulating protective structure and related preparation methods. Background Technology

[0002] Lithium-ion batteries and energy storage cells are increasingly being used in new energy passenger vehicles and large-scale energy storage stations. As the core component of battery module assembly, the cell connection assembly plays a crucial role in power conduction, signal collection, and energy aggregation between cells. Its connection stability and insulation protection safety directly affect the overall performance of the battery module and its safety factor during use. Existing cell connection assemblies have several deficiencies in insulation protection. For example, while existing injection-molded isolation bases can achieve basic isolation, conductive components such as busbar assemblies and data acquisition harnesses are mostly exposed. The assembly gap between the busbar and the injection-molded isolation base can easily create creepage paths, indicating that the insulation protection performance of existing cell connection assemblies is poor. For instance, when the cell explosion-proof valve depressurizes and generates a large amount of high-temperature gas, there may be a significant safety risk. Summary of the Invention

[0003] This application provides a cell connection assembly with an insulating protective structure and a related preparation method, which is beneficial to improving the insulating protective performance of the cell connection assembly.

[0004] A first aspect of this application provides a battery cell connection assembly with an insulating protective structure, which may include: Injection-molded isolation base, bus assembly, and data acquisition harness.

[0005] The injection-molded isolation base is provided with a wire passage groove extending along the length direction for laying the acquisition wire harness. The injection-molded isolation base is also provided with a mounting groove for installing the bus assembly. A wire passage opening is provided between the mounting groove and the wire passage groove. The injection-molded isolation base is also provided with a positioning post and a first pressure relief hole corresponding to the cell explosion-proof valve.

[0006] The bus assembly is embedded in the mounting groove, and the positioning post on the injection-molded isolation base passes through the bus assembly to achieve the limiting and fixing of the bus assembly; wherein, the bus assembly includes a bus body and an integrated insulating layer covering the surface of the bus body, the bus body is provided with a connection part for connecting with the battery cell terminal post, and the surface of the connection part is provided with a conductive exposed area.

[0007] The data acquisition harness is laid in the cable tray, and a cable clip structure for limiting and fixing the data acquisition harness is provided next to the cable tray; the end of the data acquisition harness is welded to the busbar body, and the welded joint between the end of the data acquisition harness and the busbar body is covered with an insulating encapsulation layer.

[0008] In some possible implementations, the thickness of the integrated insulation layer on the surface of the bus body is 0.1-0.5 mm, and the material of the integrated insulation layer is one or more of polyimide, polyvinyl chloride, or fluoroplastics.

[0009] In some possible implementations, the integrated insulating layer on the surface of the bus body is a heat-shrinkable insulating layer. The heat-shrinkable insulating layer is tightly wrapped around the surface of the bus body through a heat-shrinking process, and the heat-shrinkable insulating layer forms a stepped transition at the edge of the bus body connection to avoid the exposed conductive area.

[0010] In some possible implementations, the surface of the conductive exposed area of ​​the bus body is provided with a tin plating layer, the thickness of the tin plating layer is 0.02-0.05mm, and the ratio of the area of ​​the conductive exposed area to the total area of ​​the connection portion is 1 / 3-1 / 2.

[0011] In some possible implementations, the insulating encapsulation layer is an epoxy resin encapsulation layer, which is applied to the weld joint by a potting process, and the coverage of the insulating encapsulation layer extends 1-3 mm beyond the edge of the weld joint to form a sealed and insulating protection.

[0012] In some possible implementations, the injection-molded isolation base is a flame-retardant insulating base, the material of the injection-molded isolation base is reinforced nylon or PC / ABS alloy, and the thickness of the injection-molded isolation base is 1.5-3mm. The inner walls of the wire passage and the mounting groove are provided with anti-slip protrusions.

[0013] In some possible implementations, the wire clip structure is an elastic insulated wire clip, which is integrally injection molded with the injection-molded isolation base. The inner wall of the elastic insulated wire clip is provided with an arc-shaped groove adapted to the data collection harness, and the inner wall of the arc-shaped groove is provided with insulating and anti-slip texture.

[0014] In some possible implementations, the injection-molded isolation base is further provided with a second pressure relief hole, which is offset from the first pressure relief hole and penetrates through the injection-molded isolation base. The inner wall of the second pressure relief hole is provided with an insulating and high-temperature resistant coating.

[0015] The second aspect of this application provides a method for preparing a battery cell connection assembly with an insulating protective structure, which can be used to prepare the battery cell connection assembly with an insulating protective structure provided in the first aspect. The method may include: The process of processing an injection-molded isolation base may include: preparing an injection-molded isolation base through an injection molding process, and integrally forming a wire passage groove, an installation groove, a wire passage opening, a positioning post, and a first pressure relief hole during the injection molding process, wherein the wire passage groove extends along the length direction of the injection-molded isolation base, the wire passage opening connects the installation groove and the wire passage groove, and the first pressure relief hole corresponds to the position of the cell explosion-proof valve; Processing a busbar assembly may include: preparing a busbar body, covering the surface of the busbar body with an integrated insulating layer, and forming conductive exposed areas at the connection portions at both ends of the busbar body to obtain a busbar assembly; Assembling a busbar assembly may include: embedding the busbar assembly into the mounting groove of the injection-molded isolation base, so that the positioning post on the injection-molded isolation base passes through the busbar assembly to achieve the limiting and fixing of the busbar assembly; The installation of the data acquisition harness may include: placing the data acquisition harness in the cable tray of the injection-molded isolation base, and fixing the data acquisition harness by the cable clip structure next to the cable tray; The welding and insulation encapsulation may include: welding the end of the acquisition harness to the bus body, and covering the weld with an insulation encapsulation layer.

[0016] In some possible implementations, the thickness of the integrated insulation layer on the surface of the bus body is 0.1-0.5 mm, and the material of the integrated insulation layer is one or more of polyimide, polyvinyl chloride, or fluoroplastics.

[0017] In some possible implementations, the integrated insulating layer is a heat-shrinkable insulating layer. The integrated insulating layer is wrapped around the surface of the bus body, and the connection at both ends of the bus body forms a conductive exposed area. This includes: applying the heat-shrinkable insulating layer to the surface of the bus body, using a heat-shrinking process to heat-treat the heat-shrinkable insulating layer so that the heat-shrinkable insulating layer is tightly attached to the surface of the bus body, and forming a stepped transition at the edge of the connection of the bus body to avoid the conductive exposed area.

[0018] In some possible implementations, the heating temperature of the heat shrinking process can be controlled at 120-180°C, and the heating time can be controlled at 30-60 seconds, so that the heat-shrinkable insulation layer adheres to the surface of the bus body without bubbles or gaps.

[0019] In some possible implementations, the processing of the bus assembly may further include: electroplating a tin plating layer on the surface of the conductive exposed area of ​​the bus body, wherein the thickness of the tin plating layer is controlled to be 0.02-0.05 mm, and the ratio of the area of ​​the conductive exposed area to the total area of ​​the connection portion is controlled to be 1 / 3-1 / 2.

[0020] In some possible implementations, the insulating encapsulation layer is made of epoxy resin material, and the insulating encapsulation layer is applied to the weld joint by a potting process. During the potting process, the coverage area of ​​the insulating encapsulation layer is controlled to extend 1-3 mm beyond the edge of the weld joint to form a sealed insulating protection.

[0021] In some possible implementations, after epoxy resin potting, a curing process is used, with the curing temperature controlled at 80-120℃ and the curing time controlled at 1-2 hours.

[0022] In some possible implementations, the injection-molded isolation base is made of reinforced nylon or PC / ABS alloy material. The thickness of the injection-molded isolation base can be controlled to be 1.5-3mm during the injection molding process, and anti-slip protrusions are integrally formed on the inner wall of the wire groove and the mounting groove.

[0023] In some possible implementations, the wire clip structure is an elastic insulated wire clip. During the injection molding process of the injection molding isolation base, the elastic insulated wire clip and the injection molding isolation base are integrally injection molded together. Furthermore, an arc-shaped groove and insulating anti-slip texture that are adapted to the data acquisition harness are integrally formed on the inner wall of the elastic insulated wire clip.

[0024] In some possible implementations, a second pressure relief hole is integrally formed on the injection-molded isolation base, such that the second pressure relief hole is staggered from the first pressure relief hole and penetrates the injection-molded isolation base, and an insulating and high-temperature resistant coating is applied and cured on the inner wall of the second pressure relief hole after injection molding.

[0025] In some possible implementations, during the processing of the bus assembly, before the heat-shrinkable insulation layer is applied, the surface of the bus body is subjected to plasma cleaning to remove the oxide layer and oil impurities from the surface of the bus body. The cleaning power is controlled at 800-1200W, and the cleaning time is 10-20s. The bus body that has undergone plasma cleaning is then fitted with and heat-shrinkable insulation. The surface of the bus body is then purged with inert gas, wherein the purging flow rate can be controlled at 5-8L / min, and the purging time is 3-5s.

[0026] When heat-shrinking the heat-shrinkable insulation layer using the heat-shrinking process, a segmented heating mode is adopted. First, it is preheated at 120-140℃ for 15-20 seconds, then heated at a constant temperature of 160-180℃ for 15-40 seconds, and then naturally cooled to room temperature.

[0027] In some possible implementations, after the acquisition harness end is welded to the bus body, the weld is first cleaned using an ultrasonic cleaning process at a frequency of 20-40kHz for 5-10 minutes to remove welding slag, flux residue and impurities. Then, epoxy resin potting is performed using a vacuum potting process with the vacuum degree controlled at -0.08 to -0.1MPa.

[0028] During ultrasonic cleaning, a cleaning solution is prepared by mixing deionized water and neutral cleaning agent at a volume ratio of 10:1. The cleaning temperature can be controlled at 40-50℃. The cleaning process is carried out by a combination of ultrasonic vibration and spray rinsing. The ultrasonic vibration amplitude can be controlled at 0.5-1mm, and the spray rinsing pressure can be controlled at 0.1-0.2MPa.

[0029] Before vacuum potting, the weld area is preheated to 60-80℃ for 10-15 minutes to remove moisture and humidity from the surface. During potting, a uniform dripping method is used, with the dripping speed controlled at 5-10 ml / min. After vacuum potting, the area is pre-cured at 80℃ for 30 minutes, and then heated to 100-120℃ for constant temperature curing for 1-2 hours. After curing, a cooling process is performed, with the cooling rate controlled at 5-10℃ / min.

[0030] In some possible implementations, the method may further include: Before assembling the busbar assembly, an insulating and lubricating coating is applied to the surface of the positioning post. The insulating and lubricating coating is made of polytetrafluoroethylene (PTFE) material, and the coating thickness can be controlled to be 0.01-0.03 mm. The insulating and lubricating coating can be applied by electrostatic spraying, with the spraying voltage controlled to be 20-30 kV and the spraying distance controlled to be 15-20 cm. After spraying, it can be cured at 80-85℃ for 30-40 minutes.

[0031] In some possible implementations, the busbar assembly can be assembled using a step-by-step press-fit process to press the busbar assembly against the bottom of the mounting groove. This step-by-step press-fit process may include: first, pressing at a constant pressure of 200-300N to bring the busbar assembly into contact with the positioning post, holding for 5-10 seconds; then pressing at a constant pressure of 500-800N to bring the busbar assembly against the inner wall of the mounting groove, holding for 10-15 seconds; finally, maintaining pressure at 300-400N for 5-8 seconds, and then gradually depressurizing to atmospheric pressure.

[0032] In some possible implementations, the method further includes: After the elastic insulated wire clip is integrally injection molded, a low-temperature aging process is used to eliminate the internal stress generated during the molding process. The processing temperature of the low-temperature aging process is controlled at 40-60℃, and the processing time is 8-12h. Before low-temperature aging treatment, the injection-molded isolation base with elastic insulated wire clamps is pretreated in a constant temperature and humidity environment for 2-3 hours. The ambient temperature is controlled at 25±2℃ and the relative humidity is controlled at 50±5%. During the low-temperature aging treatment, a segmented temperature control mode is adopted. First, the temperature is controlled at 40-45℃ for 4-6 hours, and then at 50-60℃ for 4-6 hours. After the treatment, the wire clamps are allowed to cool naturally to room temperature. During the cooling process, the wire clamps are protected from external impact or compression. After the low-temperature aging treatment, the elastic insulated wire clamps are tested for performance. The elastic recovery rate of the wire clamps is ≥95%, the elongation at break is ≥300%, and the clamping force fluctuation range is ≤±2N.

[0033] During the injection molding process, micro-insulating bumps are added to the inner wall of the arc-shaped groove of the online card (the diameter of the micro-insulating bumps can be 0.1-0.2mm and the height can be 0.05-0.1mm), and the bumps are evenly distributed.

[0034] In some possible implementations, the insulating high-temperature resistant coating is a ceramic insulating coating, and the coating is applied using an electrostatic spraying process. The spraying voltage of the electrostatic spraying process is controlled at 30-50kV, and the coating thickness is controlled at 0.05-0.1mm.

[0035] The process involves a segmented curing process after spraying, including pre-curing at 80℃ for 30-40 minutes and then final curing at 150-160℃ for 2-3 hours.

[0036] The ceramic insulating coating uses a mixture of Al2O3 and SiO2 at a mass ratio of 7:3, with the addition of 0.5-1% dispersant (e.g., polyethylene glycol) and 0.3-0.5% binder (e.g., silane coupling agent). The mixture is stirred at 2000-3000 r / min to form a uniform spraying slurry. The viscosity of the spraying slurry is controlled at 200-300 mPa·s. During electrostatic spraying, the spraying distance is controlled at 20-25 cm, and the spraying speed is controlled at 5-8 cm / s. Two to three coats are applied using a reciprocating spraying method, with each coat dried at 60-65℃ for 10-15 min. The insulation resistance of the ceramic insulating coating is ≥10 Ω·cm. 12 Ω.

[0037] Specifically, a rounded corner transition is adopted at the port of the second pressure relief hole, with the rounded corner radius controlled at 0.5-1mm. During spraying, the coating at the port is thickened (for example, 0.1-0.12mm thick).

[0038] In some possible implementations, the tin plating process on the conductive exposed areas of the bus body may include: First, the connection part of the bus body is shielded. A silicone shielding sleeve resistant to electroplating corrosion is used to precisely cover the non-conductive exposed area. The gap between the shielding sleeve and the connection part of the bus body is ≤0.01mm. After masking is completed, the bus body is immersed in an electroplating solution to form a tin plating layer. The electroplating solution is a stannous sulfate electroplating solution (SnSO4 concentration can be 20-30 g / L, H2SO4 concentration can be 80-100 g / L), with 0.5-1 g / L of brightener (e.g., polyethylene glycol octylphenyl ether) and 0.3-0.5 g / L of stabilizer (e.g., dibutyl phthalate). The electroplating temperature is controlled at 25-30℃, the current density can be 1-2 A / dm², the electroplating time is 10-20 min, and the thickness of the tin plating layer can be controlled at 0.02-0.05 mm.

[0039] After electroplating, remove the busbar body and rinse it 3-5 times with deionized water to remove any residual electroplating solution. Then, dry the busbar body with hot air (temperature 60-80℃, air velocity 2-3m / s, drying time 5-10min). The resistivity of the tin plating layer should be ≤1.2×10⁻⁶. -7 Ω·m.

[0040] Remove the shielding sleeve from the manifold body after it has been dried with hot air, and wipe the surface of the exposed conductive area with alcohol to remove any residual silicone debris.

[0041] In some possible implementations, the injection molding process for preparing the injection-molded isolation base may include: first drying the reinforced nylon or PC / ABS alloy raw material at a temperature controlled at 80-100°C for 2-3 hours to ensure that the moisture content of the raw material is ≤0.1%.

[0042] The dried raw material is added to the injection molding machine barrel. The injection molding machine barrel operates in a segmented temperature control mode. The temperature of the feeding section is controlled at 180-200℃, the temperature of the melting section is controlled at 220-240℃, the temperature of the discharge section is controlled at 200-220℃, the nozzle temperature is controlled at 210-230℃, the screw speed is controlled at 80-120r / min, the injection pressure is controlled at 80-100MPa, and the injection speed is controlled at 50-80mm / s. The holding pressure is controlled at 40-60MPa, the holding time is controlled at 10-15s, and the cooling time is controlled at 20-30s. The surface roughness of the injection mold cavity is ≤Ra0.8μm.

[0043] Among them, the mold cavities of the wire passage, mounting groove, positioning post and pressure relief hole structure are mirror polished, the structural dimension accuracy of the injection molding isolation base is ±0.01mm, the fitting clearance between the wire passage and the acquisition wire harness is controlled at 0.02-0.05mm, the fitting clearance between the mounting groove and the bus assembly is controlled at 0.03-0.06mm; the verticality of the positioning post is ≤0.01mm / m, and the position deviation of the pressure relief hole is ≤0.02mm.

[0044] Place the injection isolation base output from the injection molding machine on a constant temperature cooling table (temperature 25±2℃) for 10-15 minutes to eliminate the internal stress generated during the injection molding process.

[0045] As can be seen, in the battery cell connection assembly of this application embodiment, the three core components of injection-molded isolation base, bus assembly and acquisition harness work together to form a complete system of support-connection-acquisition-insulation. This helps to solve the problem of poor insulation protection performance of conductive components such as bus and acquisition harness in traditional battery cell connection assemblies, realizes the integrated design of battery cell connection, signal acquisition and insulation protection, and helps to improve the overall reliability and safety of the assembly.

[0046] The injection-molded isolation base, serving as the core support carrier of the component, features a partitioned design of cable trays and mounting slots. This achieves physical isolation between the data acquisition harness and the busbar component, preventing short circuits and leakage hazards caused by improper contact. The cable tray design ensures that the data acquisition harness can be precisely extended to the busbar component, balancing ease of installation with a compact structure. Positioning posts provide precise positioning and fixation for the busbar component, preventing displacement and loosening after assembly and ensuring the stability of the connection between the cell terminals and the busbar. The first pressure relief hole is designed to correspond with the cell explosion-proof valve, allowing for timely discharge of high-pressure gas in case of cell malfunction, mitigating the risk of cell explosion and component damage, and improving the safety of component use.

[0047] The busbar is responsible for the current conduction between the battery cell terminals. An integrated insulation layer covers the surface of the busbar, providing comprehensive insulation protection and helping to avoid potential conductive hazards caused by improper contact between the busbar and other components. The connection part is equipped with a conductive exposed area to precisely avoid the connection position of the battery cell terminals. This ensures a reliable conductive connection between the busbar and the battery cell terminals while avoiding insulation failure caused by exposed conductive areas, achieving a precise balance between conductivity and insulation performance.

[0048] The cable trays allow for the orderly arrangement of the acquisition cable bundles, preventing them from becoming messy or tangled and reducing wear. The cable clips limit and fix the acquisition cable bundles, preventing them from loosening or shifting and ensuring the stability of signal acquisition. The weld joints are covered with an insulating encapsulation layer, providing sealed insulation protection to prevent oxidation and moisture, eliminating short circuits and leakage caused by exposed weld joints, while also strengthening the welded connection and extending the component's lifespan. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1A This is a three-dimensional structural diagram of a cell connection assembly with an insulating protection structure provided in an embodiment of this application.

[0051] Figure 1B This is an exploded structural diagram of a cell connection assembly with an insulating protective structure provided in an embodiment of this application.

[0052] Figure 1C This is a schematic diagram of the structure of an injection-molded isolation base provided in an embodiment of this application.

[0053] Figure 1D This is a top view of a battery cell module equipped with a battery cell connection assembly according to an embodiment of this application.

[0054] Figure 1E This is a top view of the battery cell module provided in this application embodiment, with two battery cell connection components assembled.

[0055] Figure 1F This is a three-dimensional schematic diagram of a battery cell module equipped with a battery cell connection assembly according to an embodiment of this application.

[0056] Figure 2 This is a schematic flowchart illustrating a method for manufacturing a battery cell connection assembly according to an embodiment of this application. Detailed Implementation

[0057] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or modules is not limited to the listed steps or modules, but in one possible example includes steps or modules not listed, or in one possible example includes other steps or modules inherent to these processes, methods, products, or devices.

[0058] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0059] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present application.

[0060] The technical features of the embodiments of this application will be clearly and completely described below with reference to the technical solutions of the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0061] This application provides an example of a cell connection assembly with an insulating protection structure. This assembly can be widely used in cell assembly scenarios such as power battery modules for new energy vehicles and battery packs for energy storage power stations. Through multi-level insulating protection structure design and precise coordination of various components, it aims to solve the problem of poor insulation protection performance of traditional cell connection assemblies. It also aims to further solve technical problems such as poor structural stability and difficulty in balancing pressure relief and protection in traditional cell connection assemblies. While ensuring electrical connection reliability and signal acquisition accuracy as much as possible, it is beneficial to significantly improve the insulation protection performance of the cell connection assembly, as well as improve the vibration resistance and service life of the cell connection assembly.

[0062] Meanwhile, the embodiments of this application also illustrate the relevant preparation methods of battery cell connection components with insulating protection structures. Through standardized and refined process design, it is expected to achieve precise molding and assembly of various structural features of the components, which is conducive to ensuring the consistency and stability of product performance, and thus adapting to the needs of large-scale industrial production.

[0063] The following section, with reference to the accompanying drawings, provides specific examples illustrating some possible forms and structures of battery cell connection assemblies with insulating protective structures.

[0064] See Figures 1A to 1F , Figure 1A This is a three-dimensional structural diagram of a cell connection assembly with an insulating protection structure provided in an embodiment of this application. Figure 1B This is an exploded structural diagram of a cell connection assembly with an insulating protective structure provided in an embodiment of this application; Figure 1C This is a schematic diagram of the structure of an injection-molded isolation base provided in an embodiment of this application; Figure 1D This is a top view of a battery cell module equipped with a battery cell connection assembly according to an embodiment of this application; Figure 1E This is a top view of the battery cell module equipped with two battery cell connection components provided in the embodiments of this application; Figure 1F This is a three-dimensional schematic diagram of a battery cell module equipped with a battery cell connection assembly according to an embodiment of this application.

[0065] like Figures 1A to 1F As shown in the example, a battery cell connection assembly 100 with an insulating protection structure may include: an injection-molded isolation base 110, a bus assembly 120, and a data acquisition harness 130.

[0066] The injection-molded isolation base 110 is provided with a wire-passing groove 111 extending along the length direction for laying the acquisition wire harness. The injection-molded isolation base is also provided with a mounting groove 112 for installing the bus assembly. A wire-passing opening is provided between the mounting groove 112 and the wire-passing groove 111. The injection-molded isolation base 110 is also provided with a positioning post 113 and a first pressure relief hole 114 corresponding to the cell explosion-proof valve.

[0067] Bus assembly 120 is embedded in the mounting groove 112, and positioning post 113 on injection-molded isolation base 110 passes through bus assembly 120 to achieve limiting and fixing of bus assembly; wherein, bus assembly includes bus body and integrated insulating layer 121 covering the surface of bus body, bus body is provided with connection part for connection with cell terminal post, and the surface of connection part is provided with conductive exposed area.

[0068] The acquisition harness 130 is arranged in the cable tray 111, and a cable clip structure 115 for limiting and fixing the acquisition harness is provided next to the cable tray 111; the end of the acquisition harness is welded to the bus body, and the welded joint between the end of the acquisition harness and the bus body is covered with an insulating encapsulation layer.

[0069] As can be seen, in the battery cell connection assembly of this application embodiment, the three core components of injection-molded isolation base, bus assembly and acquisition harness work together to form a complete system of support-connection-acquisition-insulation. This solves the problem of poor insulation protection performance of bus and acquisition harness in traditional battery cell connection assemblies, realizes the integrated design of battery cell connection, signal acquisition and insulation protection, and is conducive to improving the overall reliability and safety of the assembly.

[0070] The injection-molded isolation base, serving as the core support carrier of the component, features a partitioned design of cable trays and mounting slots. This achieves physical isolation between the data acquisition harness and the busbar component, preventing short circuits and leakage hazards caused by improper contact. The cable tray design ensures that the data acquisition harness can be precisely extended to the busbar component, balancing ease of installation with a compact structure. Positioning posts provide precise positioning and fixation for the busbar component, preventing displacement and loosening after assembly and ensuring the stability of the connection between the cell terminals and the busbar. The first pressure relief hole is designed to correspond with the cell explosion-proof valve, allowing for timely discharge of high-pressure gas in case of cell malfunction, mitigating the risk of cell explosion and component damage, and improving the safety of component use.

[0071] The busbar is responsible for the current conduction between the battery cell terminals. An integrated insulation layer covers the surface of the busbar, providing comprehensive insulation protection and helping to avoid potential conductive hazards caused by improper contact between the busbar and other components. The connection part is equipped with a conductive exposed area to precisely avoid the connection position of the battery cell terminals. This ensures a reliable conductive connection between the busbar and the battery cell terminals while avoiding insulation failure caused by exposed conductive areas, achieving a precise balance between conductivity and insulation performance.

[0072] The cable trays allow for the orderly arrangement of the acquisition cable bundles, preventing them from becoming messy or tangled and reducing wear. The cable clips limit and fix the acquisition cable bundles, preventing them from loosening or shifting and ensuring the stability of signal acquisition. The weld joints are covered with an insulating encapsulation layer, providing sealed insulation protection to prevent oxidation and moisture, eliminating short circuits and leakage caused by exposed weld joints, while also strengthening the welded connection and extending the component's lifespan.

[0073] In some possible implementations, the thickness of the integrated insulation layer 121 on the surface of the bus body can be set to, for example, 0.1-0.5 mm, and the material of the integrated insulation layer 121 can be, for example, one or more of polyimide, polyvinyl chloride or fluoroplastics.

[0074] Actual testing revealed that a design with an integrated insulation layer thickness of 0.1-0.5mm on the surface of the busbar body can effectively balance insulation performance and structural compactness. Specifically, if the thickness is too thin, it is difficult to achieve effective insulation protection and it is easily broken down; if the thickness is too thick, it will increase the volume of the busbar assembly and affect the overall assembly space of the assembly. It adapts to the design requirements of miniaturization and compactness of the cell connection assembly, while ensuring that the insulation layer has sufficient structural strength to avoid damage and detachment during long-term use.

[0075] Furthermore, the selected materials—polyimide, polyvinyl chloride, and fluoroplastics—all possess excellent insulation properties, resistance to high and low temperatures, and abrasion resistance, making them suitable for the working environment of the battery cell connection components (such as high and low temperatures, humidity, and current surges). Multiple materials can be flexibly combined, and the material ratio can be adjusted according to the specific application scenario of the components (such as new energy vehicles and energy storage equipment), balancing insulation performance and cost control, while improving the durability of the insulation layer, avoiding insulation failure caused by insulation aging and cracking, and further enhancing the insulation protection reliability of the busbar components.

[0076] In some possible implementations, the integrated insulating layer 121 on the surface of the bus body is, for example, a heat-shrinkable insulating layer. The heat-shrinkable insulating layer is tightly wrapped around the surface of the bus body by a heat-shrinking process, and the heat-shrinkable insulating layer forms a stepped transition at the edge of the bus body connection portion to avoid the conductive exposed area.

[0077] As can be seen, the heat-shrinkable insulation layer tightly wraps the busbar body through the heat-shrinking process, with high fit and no gaps. This helps to completely isolate the busbar body from improper contact with the outside world, thereby preventing insulation failure caused by gaps between the insulation layer and the body. At the same time, it improves the wear resistance and anti-detachment performance of the insulation layer, adapting to vibration, high and low temperature cycling and other operating conditions during long-term use of the module.

[0078] The stepped transition design at the edge of the connection precisely avoids exposed conductive areas, preventing the insulation layer from covering the exposed conductive areas and affecting the conductive connection between the busbar and the cell terminal. This ensures a tight connection between the insulation layer and the connection without any insulation dead corners. The stepped structure also reduces stress concentration at the edge of the insulation layer, preventing cracking and peeling of the insulation layer edge during long-term use, which helps to further improve the integrity and stability of insulation protection.

[0079] In some possible implementations, the integrated insulating layer comprises, from the outside to the inside, a surface layer, an intermediate functional layer, and an inner bonding layer: The thickness of the surface layer can be 0.02-0.05 mm, and it adopts a dense cross-linked structure with a micropore size ≤0.01 μm, a porosity ≤1%, and no interconnected pores. 0.3-0.5% of UV stabilizer is added to the surface layer. The surface layer is micro-abrasive treated, and the roughness Ra is controlled at 0.2-0.4 μm.

[0080] The thickness of the intermediate functional layer can be 0.06-0.4 mm, accounting for 60%-80% of the total thickness of the integrated insulation layer. It adopts a layered cross-linking structure, which is divided into 3-5 sublayers at the micro level. The cross-linking degree of each sublayer increases gradually from the inner layer to the outer layer, with the cross-linking degree of the inner layer being 60%-70% and the cross-linking degree of the outer layer being 80%-90%. The intermediate functional layer contains 0.5-1% uniformly dispersed nano-alumina particles with a particle size of 50-100 nm, which are uniformly distributed and do not agglomerate.

[0081] The inner bonding layer has a thickness of 0.02-0.05 mm, adopts a modified adhesive structure, and contains hydroxyl functional groups at the microscopic level with a content of 1.2-1.5 mol / 100g. 0.2-0.3% lubricant is added to the inner bonding layer, and the lubricant is polytetrafluoroethylene micro powder with a particle size of 1-5 μm. The inner bonding layer is bonded to the oxide layer on the surface of the manifold body with a bonding gap ≤0.005 mm, free of bubbles and voids.

[0082] In particular, at the step transition at the edge of the busbar connection, the thickness of the integrated insulation layer can gradually change from 0.1-0.5mm to 0.05-0.1mm, the radius of the transition fillet is 0.1-0.2mm, and there are no sharp edges or burrs at the microscopic level; the cross-linking degree of the transition area can be 90%-95%, which is higher than other areas of the integrated insulation layer.

[0083] Practice has shown that if cell connection components are used in cell modules for new energy vehicles, given the typical characteristics of new energy vehicles, such as frequent vibrations, high and low temperature cycling (-40℃ to 85℃), outdoor exposure, and humid and dusty conditions, the dense surface structure of the integrated insulation layer (micropore size ≤0.01μm, porosity ≤1%) can prevent the penetration of dust, water vapor, and electrolyte vapor during vehicle operation. The addition of UV stabilizers can resist UV erosion during outdoor exposure, reducing the risk of aging and cracking of the integrated insulation layer. The layered cross-linking structure of the intermediate functional layer (low cross-linking degree in the inner layer, high cross-linking degree in the outer layer) can effectively adapt to the high and low temperature cycling conditions of automobiles, facilitating integration with the busbar. The synchronous thermal expansion and contraction of the body, along with the uniform dispersion of nano-alumina particles, improves thermal conductivity, effectively dissipating heat generated by the busbar during fast charging and high-load discharge of the power battery. The hydroxyl functional groups in the inner bonding layer enhance the bonding stability with the busbar body, adapting to long-term vibration scenarios in automobiles and preventing the insulation layer from peeling off. The addition of lubricant adapts to the heat shrinking process, ensuring uniform shrinkage of the insulation layer. The high cross-linking degree and rounded corner design of the stepped transition structure help resist repeated stretching and compression at the steps during vehicle vibration, preventing edge cracking while precisely avoiding exposed conductive areas, ensuring reliable connection between the busbar and the cell terminals, and meeting the high-voltage power requirements of new energy vehicles.

[0084] In some possible implementations, the surface of the conductive exposed area of ​​the bus body may be provided with a tin plating layer, the thickness of which may be, for example, 0.02-0.05 mm, and the ratio of the area of ​​the conductive exposed area to the total area of ​​the connection portion may be, for example, 1 / 3-1 / 2.

[0085] It can be seen that the tin plating layer has excellent conductivity and corrosion resistance, which can improve the conductivity efficiency of the exposed conductive area, reduce the loss in the current conduction process, and at the same time help prevent oxidation and corrosion of the exposed conductive area, avoid poor contact caused by the oxide layer, and ensure reliable connection between the bus and the cell terminal. The 0.02-0.05mm thickness design is conducive to balancing conductivity and cost. If the thickness is too thin, it cannot achieve effective anti-oxidation and anti-corrosion effect, while if the thickness is too thick, the tin plating layer is prone to peeling off, affecting the reliability of the connection.

[0086] A 1 / 3 to 1 / 2 area ratio helps achieve a precise balance between conductive connection and insulation protection. If the exposed conductive area is too small, the contact area between the busbar and the cell terminal will be insufficient, affecting current conduction; if the area is too large, it will increase the risk of exposed conductive areas, easily leading to short circuits and leakage hazards. This ratio design precisely matches the connection size of the cell terminal, ensuring reliable conductivity while minimizing insulation dead zones.

[0087] In some possible implementations, the insulating encapsulation layer may be an epoxy resin encapsulation layer, which may be applied to the weld joint by a potting process, and the coverage of the insulating encapsulation layer may extend 1-3 mm beyond the edge of the weld joint to form a sealed and insulating protection.

[0088] It can be seen that epoxy resin has excellent insulation, sealing and bonding properties, which can form a comprehensive sealed insulation protection for the weld joint, avoid oxidation, moisture and contamination of the weld joint, and eliminate the risk of short circuit and leakage caused by exposed weld joints. At the same time, epoxy resin has strong adhesion to the bus body and the data acquisition harness, which can strengthen the weld connection, prevent the weld joint from loosening and falling off, and improve the connection reliability and service life of the components.

[0089] The coverage extends 1-3mm beyond the edge of the weld, which helps to thoroughly cover the weld joint and surrounding tiny gaps, eliminate insulation dead angles, and prevent moisture and dust from entering due to incomplete sealing of the weld edge, thereby further improving the sealing and insulation effect. The application of potting process helps to ensure that the encapsulation layer is filled evenly and without air bubbles, and fits tightly with the weld, reducing the risk of loosening and falling off.

[0090] In some possible implementations, the insulating encapsulation layer may include a surface protective layer, an internal reinforcing layer, and an adhesive layer for the solder joint.

[0091] The overall structure of the insulating encapsulation layer is a dense, non-porous structure with a microscopic porosity of ≤0.5%, a maximum pore size of ≤0.005μm, and no interconnected pores; the degree of crosslinking is ≥90%, forming a three-dimensional network crosslinked structure at the microscopic level.

[0092] The thickness of the bonding layer can be 0.03-0.08 mm. The bonding layer is bonded to the bus body and the end of the acquisition cable at the welding point. The microscopic layer contains epoxy groups and amino groups. 0.3-0.5% of nano-silane coupling agent is uniformly dispersed inside the bonding layer. The nano-silane coupling agent has a particle size of 20-50 nm. The bonding strength between the bonding layer and the bus body and the end of the acquisition cable is ≥15 MPa, with no bonding gaps and no air bubbles.

[0093] The internal reinforcing layer contains 1-2% glass fiber microfilaments, which have a diameter of 10-20 μm and a length of 50-100 μm. Microscopically, they are randomly and uniformly distributed without agglomeration or directional arrangement.

[0094] The thickness of the surface protective layer can be 0.02-0.04mm, with 0.2-0.3% fluorocarbon modifier added, forming a hydrophobic and oleophobic surface structure at the microscopic level, with a contact angle ≥110°; the surface cross-linking degree is 95%-98%, which is higher than that inside the insulating encapsulation layer.

[0095] Practice has shown that if the cell connection assembly is used in the cell modules of new energy vehicles, given the frequent vibrations, humid and dusty conditions, high and low temperature cycles, and high-voltage power consumption of these vehicles, the overall dense, non-porous structure (microscopic porosity ≤0.5%) effectively prevents rainwater, dust, and electrolyte vapor from entering the welding joint. The high degree of cross-linking and the three-dimensional network cross-linking structure are adaptable to the high and low temperature cycling conditions of automobiles, ensuring stable insulation performance and preventing insulation failure caused by the shrinkage and expansion of the encapsulation layer. The addition of epoxy groups, amino groups, and nano-silane coupling agents to the bonding layer enhances the bonding strength with the bus body and the data acquisition harness, filling the welding gap. The micro-gaps prevent the bonding layer from peeling off due to vehicle vibration, eliminating the risk of leakage in high-voltage electrical scenarios. The uniform dispersion of internal glass fiber microfilaments enhances the mechanical strength of the encapsulation layer, resisting vibration and impact during vehicle operation, inhibiting curing shrinkage and deformation, and preventing cracking of the encapsulation layer. In addition, the addition of fluorocarbon modifier to the surface protective layer forms a hydrophobic and oleophobic structure, resisting rainwater and oil pollution. Furthermore, the high cross-linking design resists ultraviolet rays and high-temperature corrosion, improves wear resistance, adapts to scratches and damage during vehicle assembly and driving, strengthens the insulation protection of welded joints, and helps ensure the safe and stable operation of the power battery system of new energy vehicles.

[0096] In some possible implementations, the injection-molded isolation base is a flame-retardant insulating base, the material of the injection-molded isolation base can be reinforced nylon or PC / ABS alloy, and the thickness of the injection-molded isolation base is 1.5-3mm. The inner walls of the wire passage and the mounting groove can both be provided with anti-slip protrusions.

[0097] It can be seen that flame-retardant insulation properties can effectively improve the fire safety of the components, preventing fires caused by short circuits or overheating, and meeting the safety requirements of cell connection components; reinforced nylon or PC / ABS alloys have excellent insulation, mechanical strength and aging resistance, and can serve as the core support carrier of the components, bearing the weight and assembly pressure of busbar components and acquisition harnesses, thus preventing base deformation and damage; furthermore, this type of material has excellent injection molding performance, and can accurately mold complex structures such as wire grooves, mounting grooves, and positioning posts, ensuring the structural accuracy of the base.

[0098] The 1.5-3mm thickness design balances structural strength and lightweight requirements. If the thickness is too thin, the mechanical strength of the base will be insufficient, making it prone to deformation and damage; if the thickness is too thick, it will increase the overall weight of the module and affect the lightweight design of the cell connection components. At the same time, it ensures that the base has sufficient insulation thickness to prevent the base from being broken down and to enhance the overall insulation protection.

[0099] The anti-slip protrusions on the inner walls of the cable tray and mounting slot can increase the friction between the data acquisition harness, bus assembly and base, preventing the data acquisition harness from loosening or shifting in the cable tray and the bus assembly from sliding in the mounting slot, further improving the stability of the assembly and reducing component wear and poor contact caused by vibration.

[0100] In some possible implementations, the wire clip structure 115 may be an elastic insulated wire clip, which is integrally injection molded with the injection-molded isolation base. The inner wall of the elastic insulated wire clip may be provided with an arc-shaped groove adapted to the acquisition wire harness, and the inner wall of the arc-shaped groove may be provided with insulating anti-slip texture.

[0101] As can be seen, the elastic insulated wire clip and the injection-molded isolation base are integrally injection molded, eliminating the need for additional assembly, simplifying the component processing and assembly process, and improving production efficiency. At the same time, the integral molding ensures the firm connection between the wire clip and the base, preventing the wire clip from falling off or loosening, improving the overall structural integrity. Furthermore, the insulation material of the wire clip is consistent with that of the base, which can better ensure the uniformity of overall insulation performance and avoid weak points in insulation at the connection between the wire clip and the base.

[0102] The arc-shaped groove is adapted to the acquisition cable harness, conforming to the shape of the acquisition cable harness, increasing the contact area between the cable clip and the cable harness, improving clamping stability, and preventing the cable harness from loosening or shifting. At the same time, the arc-shaped structure can also prevent the cable clip from applying excessive local pressure to the acquisition cable harness, preventing damage to the cable harness insulation layer, protecting the integrity of the acquisition cable harness, and ensuring the stability of signal acquisition.

[0103] The insulating anti-slip texture can further increase the friction between the wire clip and the data acquisition harness, enhancing the clamping effect. It is especially suitable for vibration scenarios (such as new energy vehicles) to prevent the harness from shifting or wearing due to vibration. At the same time, the insulating material of the anti-slip texture can further enhance the insulation performance of the wire clip and prevent potential electrical conductivity at the contact point between the wire clip and the harness.

[0104] In some possible implementations, the injection-molded isolation base may also be provided with a second pressure relief hole, which is offset from the first pressure relief hole and penetrates through the injection-molded isolation base. The inner wall of the second pressure relief hole may be provided with an insulating and high-temperature resistant coating.

[0105] It can be seen that the staggered distribution of the first and second pressure relief holes can expand the pressure relief range and improve the pressure relief efficiency. When the cell abnormally generates a large amount of high-pressure gas, the gas can be discharged quickly and evenly, avoiding the accumulation of gas inside the module and causing excessive pressure. This avoids the risk of module damage and cell explosion. Compared with a single pressure relief hole, the pressure relief safety and reliability are greatly improved, which meets the safety protection requirements of cell connection modules.

[0106] When a battery cell experiences abnormal pressure relief, the temperature of the discharged gas may be extremely high, which can easily lead to aging and damage to the inner wall of the pressure relief hole, and even cause insulation failure. The insulating high-temperature resistant coating can effectively isolate the high-temperature gas from corroding the inner wall of the pressure relief hole, improve the high-temperature resistance and insulation performance of the pressure relief hole, and avoid insulation damage and conductivity hazards caused by high temperature. At the same time, the coating can enhance the wear resistance of the inner wall of the pressure relief hole and extend the service life of the pressure relief hole.

[0107] In some possible implementations, the first pressure relief holes can be arranged as follows: They are positioned one-to-one with the cell explosion-proof valves along the length of the injection-molded isolation base. Specifically, one first pressure relief hole is located directly above each cell explosion-proof valve (at the corresponding position on the injection-molded isolation base). The coaxiality deviation between the hole center and the cell explosion-proof valve center is ≤0.1mm. This facilitates ensuring that high-pressure gas can be quickly discharged directly through the first pressure relief hole in case of cell malfunction, reducing gas accumulation between the base and the cell. The number of first pressure relief holes is the same as the number of cells, and the spacing is the same as the cell arrangement spacing (typically 15-25mm, adjustable according to cell specifications).

[0108] The second pressure relief hole can be arranged as follows: It is placed in the middle area of ​​two adjacent first pressure relief holes using a staggered arrangement, forming an isosceles triangle with the first pressure relief holes (e.g., a vertices of 60° and a leg length equal to half the distance between the two adjacent first pressure relief holes). That is, a second pressure relief hole is opened 5-8 mm from the midpoint on the perpendicular bisector of the line connecting the midpoints of two adjacent first pressure relief holes (hole A and hole B), ensuring that the distance between the second pressure relief hole and the two adjacent first pressure relief holes is equal, thus achieving uniform airflow diffusion.

[0109] The diameter of the first pressure relief hole can be slightly larger than the outlet diameter of the battery cell explosion-proof valve (usually 3-5mm, while the outlet diameter of the battery cell explosion-proof valve is generally 2-4mm) to ensure unobstructed gas discharge; the diameter of the second pressure relief hole can be, for example, 0.6-0.8 times the diameter of the first pressure relief hole (specifically 1.8-4mm), which avoids the reduction in the strength of the base structure due to excessively large hole diameter, and can also assist in diversion and improve the overall pressure relief efficiency.

[0110] Both the first and second pressure relief holes can adopt a "trumpet-shaped through-hole" structure. The diameter of the hole closer to the battery cell is slightly smaller (the diameter of the small end of the first pressure relief hole is the same as the outlet diameter of the explosion-proof valve, and the diameter of the small end of the second pressure relief hole is 1.5-3.5mm), while the diameter of the hole closer to the outside is slightly larger (0.5-1mm larger than the small end). This structure can reduce the resistance when the gas is discharged, prevent the backflow of airflow, and increase the coverage area of ​​the insulating high-temperature resistant coating, thereby improving the high-temperature protection effect.

[0111] For example, along the length of the injection-molded isolation base, one first pressure relief hole and one second pressure relief hole are arranged every 15-25mm (corresponding to the cell spacing), that is, there is one pressure relief hole (first pressure relief hole or second pressure relief hole) every 7.5-12.5mm to ensure that the pressure relief coverage is without dead corners, while avoiding excessive density that would reduce the mechanical strength of the base.

[0112] For example, the outermost first and second pressure relief holes should be at least 8mm away from the edge of the injection-molded isolation base to avoid stress concentration at the base edge and prevent gas impact from causing edge damage during pressure relief. At the same time, the distance between the pressure relief holes and the cable trays and mounting slots should be at least 5mm to avoid affecting the installation of the acquisition harness and busbar components, and to prevent the pressure relief holes from being connected to the cable trays / mounting slots, which could lead to insulation problems.

[0113] In combination with the above arrangement, the insulating high-temperature resistant coating on the inner wall of the second pressure relief hole and / or the first pressure relief hole adopts a method of uniform spraying on the entire hole wall + thickening at the hole opening. That is, the coating thickness on the hole wall is 0.05-0.1mm, and the coating thickness at the hole opening (both sides) is thickened to 0.1-0.12mm. The hole opening is rounded with a 0.5-1mm radius to fit the flared hole shape. This can further enhance the insulation protection and wear resistance under the impact of high-temperature airflow and prevent the coating at the hole opening from being damaged.

[0114] Actual testing revealed that the first pressure relief hole is precisely aligned with the cell explosion-proof valve, ensuring direct gas discharge and reducing conduction resistance. The second pressure relief hole is staggered with the first pressure relief hole and distributed in an isosceles triangle pattern, allowing high-pressure gas to diffuse radially and evenly, preventing airflow collisions that could create localized high pressure. Compared to a single pressure relief hole or a disordered staggered arrangement, the pressure relief efficiency is improved by more than 40%, and more than 80% of the high-pressure gas generated by abnormal cell operation can be discharged within 0.5 seconds, effectively mitigating the risks of component damage and cell explosion.

[0115] The isosceles triangular arrangement ensures that the stress on the pressure relief holes is evenly distributed on the injection-molded isolation base, avoiding stress concentration in the base caused by excessively dense local pressure relief holes. The precise matching of hole diameter and spacing balances pressure relief efficiency and base mechanical strength. Tests have shown that with this arrangement, the base shows no deformation or damage during pressure relief impact (simulating abnormal high-pressure gas impact of the battery cell, pressure ≥1.2MPa), and the structural stability is improved by more than 35% compared to disordered arrangement.

[0116] The spacing control between the pressure relief hole and structures such as the cable tray, mounting slot, and positioning post helps to avoid insulation hazards caused by improper connection between the pressure relief hole and other components; the compatibility of the horn-shaped hole with the insulating high-temperature resistant coating can effectively isolate the erosion of the hole wall by high-temperature gas, avoid insulation failure caused by high temperature, and at the same time adapt to the installation layout of the busbar assembly and the acquisition harness without affecting the overall compactness of the assembly structure.

[0117] This arrangement can be flexibly adjusted according to the specifications (quantity, spacing) of the battery cells and the size of the injection-molded isolation base (for example, when the spacing between the battery cells is adjusted to 20mm, the spacing of the first pressure relief hole is adjusted to 20mm simultaneously, and the placement of the second pressure relief hole is shifted simultaneously). It is suitable for battery cell connection components in different scenarios such as electric new energy vehicles and energy storage equipment, and is especially suitable for multi-cell series / parallel component structures, ensuring that the best pressure relief effect can be achieved under different working conditions.

[0118] The following examples illustrate relevant preparation methods for battery cell connection components with insulating protective structures that can be used to prepare the structures described above.

[0119] See Figure 2 , Figure 2 This application provides a schematic flowchart of a method for fabricating a battery cell connection assembly with an insulating protective structure. The fabrication method may include: 210. Processing an injection-molded isolation base, specifically including: preparing an injection-molded isolation base through an injection molding process, integrally forming a wire passage groove, an installation groove, a wire passage opening, a positioning post, and a first pressure relief hole during the injection molding process, wherein the wire passage groove extends along the length direction of the injection-molded isolation base, the wire passage opening connects the installation groove and the wire passage groove, and the first pressure relief hole corresponds to the position of the battery cell explosion-proof valve.

[0120] 220. Processing a busbar assembly may specifically include: preparing a busbar body, covering the surface of the busbar body with an integrated insulating layer, and forming conductive exposed areas at the connection portions at both ends of the busbar body to obtain a busbar assembly.

[0121] 230. Assembling a busbar assembly may include: embedding the busbar assembly into the mounting groove of the injection-molded isolation base, so that the positioning post on the injection-molded isolation base passes through the busbar assembly to achieve the limiting and fixing of the busbar assembly.

[0122] 240. Laying out the acquisition harness may include: laying the acquisition harness in the cable tray of the injection-molded isolation base, and limiting and fixing the acquisition harness by the cable clamp structure next to the cable tray.

[0123] 250. Welding and insulating encapsulation may include: welding the end of the acquisition harness to the bus body, and covering the weld with an insulating encapsulation layer.

[0124] As can be seen, the above-described manufacturing method clearly defines the complete manufacturing process of the cell connection assembly, from base processing to busbar processing, assembly, wire harness layout, and welding encapsulation. This achieves injection-molded isolation base support, busbar conductivity, signal acquisition via the acquisition wire harness, and end-to-end insulation protection. Standardized processes ensure precise adaptation of each component structure, improve production efficiency, and guarantee the overall structural stability and insulation reliability of the assembly, thus meeting the needs of large-scale production of cell connection assemblies.

[0125] In some possible implementations, the thickness of the integrated insulation layer on the surface of the bus body is 0.1-0.5 mm, and the material of the integrated insulation layer is one or more of polyimide, polyvinyl chloride, or fluoroplastics.

[0126] It can be seen that by controlling the thickness and material of the integrated insulation layer, it is beneficial to adapt to the dual functional requirements of conductivity and insulation of the busbar assembly. Combined with the structural dimensions of the busbar body, a balance is achieved between insulation performance and structural compactness. This ensures that the insulation layer has sufficient insulation protection capabilities to effectively prevent current leakage, while preventing excessive insulation layer thickness from affecting the fit and assembly of the busbar assembly and mounting slot. Furthermore, the selected materials all possess excellent high and low temperature resistance and wear resistance, and can stably adapt to high and low temperature and humid application scenarios such as new energy vehicles and energy storage equipment, effectively extending the service life of the insulation layer and enhancing the insulation stability of the busbar assembly.

[0127] In some possible implementations, the integrated insulating layer is a heat-shrinkable insulating layer. The integrated insulating layer is wrapped around the surface of the bus body, and the connection at both ends of the bus body forms a conductive exposed area. This includes: applying the heat-shrinkable insulating layer to the surface of the bus body, using a heat-shrinking process to heat-treat the heat-shrinkable insulating layer so that the heat-shrinkable insulating layer is tightly attached to the surface of the bus body, and forming a stepped transition at the edge of the connection of the bus body to avoid the conductive exposed area.

[0128] As can be seen, considering the structural characteristics of the busbar assembly, the heat-shrink process achieves a tight fit between the insulation layer and the busbar body. Simultaneously, a stepped transition is formed at the edge of the connection, precisely avoiding exposed conductive areas. This creates a dual guarantee of both tight fit and precise avoidance: it helps prevent insulation failure caused by gaps in the insulation layer and avoids the insulation layer covering exposed conductive areas, thus ensuring a reliable conductive connection between the busbar and the cell terminals, achieving a precise balance between insulation protection and conductivity. Furthermore, the heat-shrink process can flexibly adapt to the shape and structure of the busbar body, ensuring the insulation layer is wrinkle-free and undamaged, improving the structural integrity of the busbar assembly and providing stable insulation for subsequent assembly and long-term use. The process logic is highly compatible with the structural requirements of the busbar assembly.

[0129] In some possible implementations, the heating temperature of the heat shrinking process can be controlled at 120-180°C, and the heating time can be controlled at 30-60 seconds, so that the heat-shrinkable insulation layer adheres to the surface of the bus body without bubbles or gaps.

[0130] It can be seen that precise control of temperature and time can effectively avoid problems such as insulation layer damage and aging caused by excessively high heat shrinking temperature or time, or insufficient temperature or time leading to loose bonding and gaps in the insulation layer. This ensures that the heat shrinking insulation layer adheres to the bus body surface without air bubbles or gaps, enhancing the insulation protection effect. At the same time, reasonable process parameters adapted to the material characteristics of the heat shrinking insulation layer can improve the structural stability and durability of the insulation layer, preventing cracking and peeling during long-term use. This adapts to the high and low temperature cycling application scenarios of the cell connection components, ensuring long-term stable insulation performance. The process parameters are precisely matched with the insulation layer performance and the bus structure.

[0131] In some possible implementations, the processing of the bus assembly may further include: electroplating a tin plating layer on the surface of the conductive exposed area of ​​the bus body, wherein the thickness of the tin plating layer is controlled to be 0.02-0.05 mm, and the ratio of the area of ​​the conductive exposed area to the total area of ​​the connection portion is controlled to be 1 / 3-1 / 2.

[0132] It can be seen that by controlling the thickness of the tin plating layer and the area ratio of the exposed conductive area to the connection part, it is beneficial to fit the structural design of the bus connection part. The tin plating layer can significantly improve the conductivity of the exposed conductive area, reduce current conduction loss, and enhance the corrosion resistance of the exposed conductive area, avoiding poor contact caused by oxidation and rust, thereby ensuring a reliable connection between the bus and the cell terminal. The precise control of the area ratio further achieves a balance between conductive connection and insulation protection, ensuring sufficient conductive contact area while avoiding short circuit hazards caused by excessively large conductive areas. It is suitable for the high reliability conductivity requirements of components, especially for energy storage and new energy vehicle scenarios with multiple cells connected in series / parallel, ensuring stable and efficient current conduction.

[0133] In some possible implementations, the insulating encapsulation layer is made of epoxy resin material, and the insulating encapsulation layer is applied to the weld joint by a potting process. During the potting process, the coverage area of ​​the insulating encapsulation layer is controlled to extend 1-3 mm beyond the edge of the weld joint to form a sealed insulating protection.

[0134] In some possible implementations, after epoxy resin potting, a curing process is used, with the curing temperature controlled at 80-120℃ and the curing time controlled at 1-2 hours.

[0135] As can be seen, the use of epoxy resin material and potting process to encapsulate the weld joints of the acquisition harness and busbar, with the encapsulation layer covering an area 1-3mm beyond the edge of the weld joint, effectively addresses the structural requirements for sealing and insulation of the component's weld joints. This solves the potential for short circuits and leakage caused by exposed weld joints and their susceptibility to oxidation and moisture. Epoxy resin possesses excellent adhesion and insulation properties, strengthening the welded connection and preventing loosening and detachment, while also providing excellent sealing protection. It can stably withstand harsh environments such as humidity and vibration, extending the component's lifespan. The controlled encapsulation layer coverage further expands the insulation protection range, providing comprehensive insulation protection for the weld joints and ensuring the stability of component signal acquisition and current conduction. The process design is highly compatible with the structural weaknesses of the weld joints.

[0136] Furthermore, precise control of curing temperature and time ensures complete curing of the epoxy resin, significantly improving the bonding strength between the encapsulation layer and the weld joints, busbar body, and data acquisition harness. This prevents the encapsulation layer from cracking and detaching due to insufficient curing, and helps eliminate the risk of short circuits caused by moisture and dust entering the weld joints. Simultaneously, reasonable curing parameters balance curing efficiency and encapsulation quality, avoiding weld joint damage and insulation layer aging caused by high-temperature curing. This ensures the encapsulation layer possesses excellent insulation and sealing performance, making it suitable for harsh application scenarios such as humidity and extreme temperatures, effectively extending the component's lifespan. The process control and the functional requirements of the encapsulation layer are highly matched.

[0137] In some possible implementations, the injection-molded isolation base is made of reinforced nylon or PC / ABS alloy material. The thickness of the injection-molded isolation base can be controlled to be 1.5-3mm during the injection molding process, and anti-slip protrusions are integrally formed on the inner wall of the wire groove and the mounting groove.

[0138] It can be seen that controlling the thickness of the base and integrally molding anti-slip protrusions on the inner walls of the cable trays and mounting slots helps ensure the core structural functions of the injection-molded isolation base in terms of support, insulation, and positioning. The selected material has excellent insulation properties and mechanical strength, which can effectively withstand the assembly pressure of components and the impact of external forces during long-term use, preventing the base from deforming and breaking. The anti-slip protrusion design increases the friction between the acquisition harness, busbar components and the base, preventing loosening and displacement, and improving assembly stability. Thickness control takes into account both structural strength and lightweight requirements, which can better adapt to the needs of lightweight new energy vehicles and compact energy storage devices.

[0139] In some possible implementations, the wire clip structure is an elastic insulated wire clip. During the injection molding process of the injection molding isolation base, the elastic insulated wire clip and the injection molding isolation base are integrally injection molded together. Furthermore, an arc-shaped groove and insulating anti-slip texture that are adapted to the data acquisition harness are integrally formed on the inner wall of the elastic insulated wire clip.

[0140] As can be seen, the one-piece injection molding eliminates the need for additional wire clips, simplifying the production process, improving efficiency, and ensuring a secure connection between the wire clips and the base, preventing them from falling off. The arc-shaped groove adapts to the shape of the acquisition harness, increasing the contact area between the wire clips and the harness. Combined with the insulating anti-slip texture, this further increases friction, achieving stable positioning of the acquisition harness and preventing damage to the harness insulation layer by the wire clips, thus ensuring the stability of signal acquisition. The one-piece injection molding ensures uniform insulation performance between the wire clips and the base, eliminating weak points in insulation. It also adapts to the compact structural design of components, making it particularly suitable for the frequently vibrating new energy vehicle scenario, effectively preventing signal anomalies caused by harness displacement due to vibration.

[0141] In some possible implementations, a second pressure relief hole is integrally formed on the injection-molded isolation base, such that the second pressure relief hole is staggered from the first pressure relief hole and penetrates the injection-molded isolation base, and an insulating and high-temperature resistant coating is applied and cured on the inner wall of the second pressure relief hole after injection molding.

[0142] As can be seen, by integrally molding the second pressure relief hole on the injection-molded isolation base, ensuring that it is staggered from the first pressure relief hole and penetrates the base, and coating the hole wall with a cured insulating high-temperature resistant coating, the pressure relief efficiency is improved and high-temperature insulation protection is achieved: the staggered distribution of the two pressure relief holes achieves synergistic pressure relief, significantly improving pressure relief efficiency and effectively avoiding the risk of component damage and explosion caused by the accumulation of high-pressure gas when the battery cell is abnormal; the insulating high-temperature resistant coating can effectively isolate the corrosion of the hole wall by high-temperature gas, avoiding insulation failure caused by high temperature, while enhancing the wear resistance of the pressure relief hole, adapting to the high-temperature scenario when the battery cell is abnormally depressurized; the integral molding process ensures that the pressure relief hole is accurately positioned and structurally complete, highly compatible with the overall structure of the base, neither affecting the mechanical strength of the base nor interfering with the assembly of other components, comprehensively improving the safety protection performance of the component.

[0143] In some possible implementations, during the processing of the bus assembly, before the heat-shrinkable insulation layer is applied, the surface of the bus body is subjected to plasma cleaning treatment to remove the oxide layer and oil stains from the surface of the bus body. The cleaning power is controlled at 800-1200W, and the cleaning time is 10-20s. The bus body that has undergone plasma cleaning treatment is then fitted with and heat-shrinkable insulation layer. The surface of the bus body is then purged with inert gas, wherein the purging flow rate is controlled at 5-8L / min, and the purging time is 3-5s.

[0144] When heat-shrinking the heat-shrinkable insulation layer using the heat-shrinking process, a segmented heating mode is adopted. First, it is preheated at 120-140℃ for 15-20 seconds, then heated at a constant temperature of 160-180℃ for 15-40 seconds, and then naturally cooled to room temperature.

[0145] As can be seen, by performing plasma cleaning and inert gas purging on the busbar body before heat-shrinking insulation layer coating, combined with segmented heating heat-shrinking technology, and tailored to the structural characteristics of the busbar assembly, a complete process logic of pretreatment + precise heat shrinking is formed. Plasma cleaning effectively removes the oxide layer and oil stains on the surface of the busbar body, while inert gas purging prevents secondary oxidation after cleaning, solving the problem of loose insulation layer adhesion in traditional heat shrinking processes from the source, and improving the bonding strength between the insulation layer and the busbar body. The segmented heating mode avoids wrinkles and damage caused by uneven heating of the insulation layer, while natural cooling reduces internal stress in the insulation layer, preventing cracking during long-term use, and further enhancing the stability and durability of insulation protection. The entire process is suitable for harsh scenarios such as new energy vehicles and energy storage equipment, which is conducive to ensuring the insulation reliability of the busbar assembly, and the process steps and technical effects are precisely correlated.

[0146] In some possible implementations, after the acquisition harness end is welded to the bus body, the weld is first cleaned using an ultrasonic cleaning process at a frequency of 20-40kHz for 5-10 minutes to remove welding slag, flux residue and impurities. Then, epoxy resin potting is performed using a vacuum potting process with the vacuum degree controlled at -0.08 to -0.1MPa.

[0147] During ultrasonic cleaning, a cleaning solution is prepared by mixing deionized water and neutral cleaning agent at a volume ratio of 10:1. The cleaning temperature is controlled at 40-50℃. The cleaning process is carried out by a combination of ultrasonic vibration and spray rinsing. The ultrasonic vibration amplitude is controlled at 0.5-1mm, and the spray rinsing pressure is controlled at 0.1-0.2MPa.

[0148] Before vacuum potting, the weld area is preheated to 60-80℃ for 10-15 minutes to remove moisture and humidity from the surface. During potting, a uniform dripping method is used, with the dripping speed controlled at 5-10 ml / min. After vacuum potting, the area is pre-cured at 80℃ for 30 minutes, and then heated to 100-120℃ for constant temperature curing for 1-2 hours. After curing, a cooling process is performed, with the cooling rate controlled at 5-10℃ / min.

[0149] As can be seen, for the welded structure between the acquisition harness and the bus body, ultrasonic cleaning is used to remove welding slag and impurities. Then, an insulating encapsulation layer is prepared through vacuum potting and segmented curing processes. Ultrasonic cleaning ensures the cleanliness of the welded area, preventing welding slag and impurities from affecting the encapsulation effect and avoiding potential insulation failure from the source. Vacuum potting effectively prevents air bubbles from forming within the encapsulation layer, ensuring a tight fit between the encapsulation layer and the welded area. Furthermore, segmented curing improves the bonding strength of the encapsulation layer, while controlled cooling reduces internal stress, ensuring the encapsulation layer is free of cracks and peeling, and meeting sealing and insulation performance standards. This process is adapted to the microstructure of the welded area, avoiding damage to the harness insulation layer during cleaning and potting, thus contributing to the reliability of component welding connections and insulation protection. It is well-suited for high-voltage and humid environments, and the process design is highly compatible with the structural weaknesses of the welded area.

[0150] In some possible implementations, the method may further include: Before assembling the busbar assembly, an insulating and lubricating coating is applied to the surface of the positioning post. The insulating and lubricating coating is made of polytetrafluoroethylene (PTFE) material, and the coating thickness is controlled to be 0.01-0.03 mm. The insulating and lubricating coating can be applied by electrostatic spraying, with the spraying voltage controlled to be 20-30 kV and the spraying distance controlled to be 15-20 cm. After spraying, it can be cured at 80-85℃ for 30-40 minutes.

[0151] In some possible implementations, the busbar assembly can be assembled using a step-by-step press-fit process to press the busbar assembly against the bottom of the mounting groove. This step-by-step press-fit process may include: first, pressing at a constant pressure of 200-300N to bring the busbar assembly into contact with the positioning post, holding for 5-10 seconds; then pressing at a constant pressure of 500-800N to bring the busbar assembly against the inner wall of the mounting groove, holding for 10-15 seconds; finally, maintaining pressure at 300-400N for 5-8 seconds, and then gradually depressurizing to atmospheric pressure.

[0152] As can be seen, coating the positioning post surface with a PTFE insulating and lubricating coating, combined with a step-by-step press-fit process for assembling the busbar assembly, conforms to the structural characteristics of the positioning post and mounting groove of the injection-molded isolation base. The insulating and lubricating coating not only strengthens the insulation protection between the positioning post and the busbar but also reduces friction during assembly, preventing damage to the busbar insulation layer. The step-by-step press-fit process avoids busbar deformation and insulation layer damage caused by one-time press-fitting, ensuring that the busbar is assembled in place and fits tightly, improving assembly accuracy and stability. The entire process adapts to the assembly structure of the component, requiring no additional complex equipment and can be smoothly integrated into the existing production process. It not only improves assembly quality and is suitable for large-scale production but also enhances the component's vibration resistance, adapting to new energy vehicle scenarios. The process steps precisely correspond to the assembly requirements and structural characteristics.

[0153] In some possible implementations, the method further includes: After the elastic insulated wire clip is integrally injection molded, a low-temperature aging process is used to eliminate the internal stress generated during the molding process. The processing temperature of the low-temperature aging process is controlled at 40-60℃, and the processing time is 8-12h.

[0154] Before low-temperature aging treatment, the injection-molded isolation base with elastic insulated wire clamps is pretreated in a constant temperature and humidity environment for 2-3 hours. The ambient temperature is controlled at 25±2℃ and the relative humidity is controlled at 50±5%. During the low-temperature aging treatment, a segmented temperature control mode is adopted. First, the temperature is controlled at 40-45℃ for 4-6 hours, and then at 50-60℃ for 4-6 hours. After the treatment, the wire clamps are allowed to cool naturally to room temperature. During the cooling process, the wire clamps are protected from external impact or compression. After the low-temperature aging treatment, the elastic insulated wire clamps are tested for performance. The elastic recovery rate of the wire clamps is ≥95%, the elongation at break is ≥300%, and the clamping force fluctuation range is ≤±2N.

[0155] During the injection molding process, micro-insulating bumps are added to the inner wall of the arc-shaped groove of the online card (the diameter of the micro-insulating bumps can be 0.1-0.2mm and the height can be 0.05-0.1mm), and the bumps are evenly distributed.

[0156] As can be seen, low-temperature aging treatment and performance testing of the elastic insulated wire clamp, along with the addition of micro-insulating protrusions to the arc-shaped groove of the wire clamp, perfectly match the structural characteristics and limiting function requirements of the elastic wire clamp. Low-temperature aging treatment effectively eliminates internal stress generated during the wire clamp's molding process, preventing cracking and deformation during long-term use and ensuring stable elasticity and clamping force. The micro-insulating protrusions further enhance the friction between the wire clamp and the acquisition harness, strengthening clamping stability, preventing damage to the harness's insulation layer, effectively ensuring stable acquisition harness layout, and avoiding abnormal signal acquisition.

[0157] In some possible implementations, the insulating high-temperature resistant coating is a ceramic insulating coating, and the coating is applied using an electrostatic spraying process. The spraying voltage of the electrostatic spraying process is controlled at 30-50kV, and the coating thickness is controlled at 0.05-0.1mm.

[0158] The process involves a segmented curing process after spraying, including pre-curing at 80℃ for 30-40 minutes and then final curing at 150-160℃ for 2-3 hours.

[0159] The ceramic insulating coating uses a mixture of Al2O3 and SiO2 at a mass ratio of 7:3, with the addition of 0.5-1% dispersant (e.g., polyethylene glycol) and 0.3-0.5% binder (e.g., silane coupling agent). The mixture is stirred at 2000-3000 r / min to form a uniform spraying slurry. The viscosity of the spraying slurry is controlled at 200-300 mPa·s. During electrostatic spraying, the spraying distance is controlled at 20-25 cm, and the spraying speed is controlled at 5-8 cm / s. Two to three coats are applied using a reciprocating spraying method, with each coat dried at 60-65℃ for 10-15 min. The insulation resistance of the ceramic insulating coating is ≥10 Ω·cm. 12 Ω.

[0160] Specifically, a rounded corner transition is adopted at the port of the second pressure relief hole, with the rounded corner radius controlled at 0.5-1mm. During spraying, the coating at the port is thickened (for example, 0.1-0.12mm thick).

[0161] As can be seen, a ceramic insulating coating with a specific ratio, applied to the inner wall of the second pressure relief hole through precise electrostatic spraying and segmented curing processes, perfectly matches the structural characteristics of the pressure relief hole and the requirements of high-temperature pressure relief scenarios. The ceramic coating possesses excellent high-temperature resistance and insulation properties, stably adapting to the high-temperature environment during abnormal pressure relief of the battery cell, preventing coating damage and insulation failure. Precise electrostatic spraying parameters ensure uniform coating and strong adhesion. Furthermore, the segmented curing process further enhances the bonding strength between the coating and the hole wall. Rounded corner treatment at the ports and thickened coating strengthen the protection of weak points, helping to prevent coating damage caused by high-temperature airflow impact. This process adapts to the structural design of the pressure relief hole, further improving the reliability of its insulation protection, eliminating potential conductive hazards during high-temperature pressure relief, and ensuring component safety.

[0162] In some possible implementations, the tin plating process on the conductive exposed areas of the bus body may include: First, the connection part of the bus body is shielded. A silicone shielding sleeve resistant to electroplating corrosion is used to precisely cover the non-conductive exposed area. The gap between the shielding sleeve and the connection part of the bus body is ≤0.01mm. After masking, the bus body is immersed in an electroplating solution to form a tin plating layer. The electroplating solution is a stannous sulfate electroplating solution (SnSO4 concentration of 20-30 g / L, H2SO4 concentration of 80-100 g / L), with 0.5-1 g / L of brightener (e.g., polyethylene glycol octylphenyl ether) and 0.3-0.5 g / L of stabilizer (e.g., dibutyl phthalate). The electroplating temperature is controlled at 25-30℃, the current density at 1-2 A / dm², and the electroplating time at 10-20 min. The thickness of the tin plating layer is controlled at 0.02-0.05 mm.

[0163] After electroplating, remove the busbar body and rinse it 3-5 times with deionized water to remove any residual electroplating solution. Then, dry the busbar body with hot air (temperature 60-80℃, air velocity 2-3m / s, drying time 5-10min). The resistivity of the tin plating layer should be ≤1.2×10⁻⁶. -7 Ω·m.

[0164] Remove the shielding sleeve from the manifold body after it has been dried with hot air, and wipe the surface of the exposed conductive area with alcohol to remove any residual silicone debris.

[0165] As can be seen, through precise masking and high-precision electroplating, a tin-plated layer is prepared in the conductive exposed area of ​​the busbar, conforming to the structural characteristics of the conductive exposed area, forming a complete process of masking + electroplating + post-treatment. Specifically, the silicone masking sleeve precisely covers the non-conductive exposed area, effectively preventing the electroplating solution from corroding the busbar insulation layer and solving the problem of easy damage to the insulation layer; reasonable electroplating parameters ensure that the tin-plated layer has uniform thickness, and that its conductivity and corrosion resistance meet the standards; the post-treatment stage can remove residual electroplating solution and impurities. The process is adapted to the structural design of the busbar connection, which can significantly improve the conductivity reliability and corrosion resistance of the conductive exposed area, ensuring a long-term stable connection between the busbar and the cell terminal.

[0166] In some possible implementations, the injection molding process for preparing the injection-molded isolation base may include: first drying the reinforced nylon or PC / ABS alloy raw material at a temperature controlled at 80-100°C for 2-3 hours to ensure that the moisture content of the raw material is ≤0.1%.

[0167] The dried raw material is added to the injection molding machine barrel. The injection molding machine barrel operates in a segmented temperature control mode: the temperature of the feeding section is controlled at 180-200℃, the temperature of the melting section is controlled at 220-240℃, the temperature of the discharge section is controlled at 200-220℃, the nozzle temperature is controlled at 210-230℃, the screw speed is controlled at 80-120 r / min, the injection pressure is controlled at 80-100MPa, and the injection speed is controlled at 50-80 mm / s. The holding pressure is controlled at 40-60MPa, the holding time is controlled at 10-15s, and the cooling time is controlled at 20-30s. The surface roughness of the injection mold cavity is ≤Ra0.8μm. Among them, the mold cavities of the wire passage, mounting groove, positioning post and pressure relief hole structure are mirror polished, the structural dimension accuracy of the injection molding isolation base is ±0.01mm, the fitting clearance between the wire passage and the acquisition wire harness is controlled at 0.02-0.05mm, the fitting clearance between the mounting groove and the bus assembly is controlled at 0.03-0.06mm; the verticality of the positioning post is ≤0.01mm / m, and the position deviation of the pressure relief hole is ≤0.02mm.

[0168] Place the injection isolation base output from the injection molding machine on a constant temperature cooling table (temperature 25±2℃) for 10-15 minutes to eliminate the internal stress generated during the injection molding process.

[0169] It can be seen that by drying raw materials, segmented temperature-controlled injection molding, and precise cooling, it is beneficial to produce high-precision injection-molded isolation bases that fit the structural characteristics and dimensional requirements of each part of the base. Drying raw materials can avoid defects such as bubbles and shrinkage cavities in the base. Segmented temperature-controlled injection molding ensures that the raw materials are fully melted, improving the molding quality of the base. Precise injection and cooling parameters can effectively eliminate internal stress in the base, prevent base deformation, and ensure that the base dimensions and fitting clearances meet the standards, adapting to the assembly requirements of busbar components and data acquisition harnesses. Mirror polishing of the mold ensures a smooth base surface and improves the quality stability of the base.

[0170] It is understandable that, in practical applications, other alternative methods can be selected to process battery cell connection components with insulating protective structures, in addition to the details of the above preparation method.

[0171] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0172] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of this application. For those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A battery cell connection assembly with an insulating protective structure, characterized in that, include: Injection-molded isolation base, bus assembly, and data acquisition harness; The injection-molded isolation base is provided with a wire passage groove extending along the length direction for laying the acquisition wire harness. The injection-molded isolation base is also provided with a mounting groove for installing the bus assembly. A wire passage opening is provided between the mounting groove and the wire passage groove. The injection-molded isolation base is also provided with a positioning post and a first pressure relief hole corresponding to the cell explosion-proof valve. The bus assembly is embedded in the mounting groove, and the positioning post on the injection-molded isolation base passes through the bus assembly to achieve the limiting and fixing of the bus assembly; wherein, the bus assembly includes a bus body and an integrated insulating layer covering the surface of the bus body, the bus body is provided with a connection part for connecting with the battery cell terminal, and the surface of the connection part is provided with a conductive exposed area. The data acquisition harness is laid in the cable tray, and a cable clip structure for limiting and fixing the data acquisition harness is provided next to the cable tray; the end of the data acquisition harness is welded to the busbar body, and the welded joint between the end of the data acquisition harness and the busbar body is covered with an insulating encapsulation layer.

2. The cell connection assembly according to claim 1, characterized in that, The integrated insulating layer on the surface of the bus body is a heat-shrinkable insulating layer. The heat-shrinkable insulating layer is tightly wrapped on the surface of the bus body through a heat-shrinking process, and the heat-shrinkable insulating layer forms a stepped transition at the edge of the bus body connection to avoid the exposed conductive area.

3. The cell connection assembly according to claim 2, characterized in that, The surface of the conductive exposed area of ​​the bus body is provided with a tin plating layer, the thickness of the tin plating layer is 0.02-0.05mm, and the ratio of the area of ​​the conductive exposed area to the total area of ​​the connection part is 1 / 3-1 / 2.

4. The cell connection assembly according to any one of claims 1 to 3, characterized in that, The insulating encapsulation layer is an epoxy resin encapsulation layer, which is applied to the weld joint through a potting process. The coverage area of ​​the insulating encapsulation layer extends 1-3 mm beyond the edge of the weld joint to form a sealed and insulating protection.

5. The cell connection assembly according to any one of claims 1 to 3, characterized in that, The injection-molded isolation base is a flame-retardant and insulating base. The material of the injection-molded isolation base is reinforced nylon or PC / ABS alloy, and the thickness of the injection-molded isolation base is 1.5-3mm. The inner walls of the wire passage and the mounting groove are provided with anti-slip protrusions.

6. The cell connection assembly according to any one of claims 1 to 3, characterized in that, The wire clip structure is an elastic insulated wire clip, which is integrally injection molded with the injection-molded isolation base. The inner wall of the elastic insulated wire clip is provided with an arc-shaped groove adapted to the data acquisition wire harness, and the inner wall of the arc-shaped groove is provided with insulating and anti-slip texture.

7. A method for preparing a battery cell connection assembly with an insulating protective structure, characterized in that, include: Processing an injection-molded isolation base includes: preparing an injection-molded isolation base through an injection molding process, and integrally forming a wire passage groove, an installation groove, a wire passage opening, a positioning post, and a first pressure relief hole during the injection molding process, wherein the wire passage groove extends along the length direction of the injection-molded isolation base, the wire passage opening connects the installation groove and the wire passage groove, and the first pressure relief hole corresponds to the position of the cell explosion-proof valve; Processing a busbar assembly includes: preparing a busbar body, covering the surface of the busbar body with an integrated insulating layer, and forming conductive exposed areas at the connection portions at both ends of the busbar body to obtain a busbar assembly; Assemble a busbar assembly, including: embedding the busbar assembly into the mounting groove of the injection-molded isolation base, so that the positioning post on the injection-molded isolation base passes through the busbar assembly to achieve the limiting and fixing of the busbar assembly; The process of laying out the data acquisition harness includes: laying the data acquisition harness in the wire passage groove of the injection-molded isolation base, and limiting and fixing the data acquisition harness by the wire clamp structure next to the wire passage groove; The welding and insulation encapsulation includes: welding the end of the acquisition harness to the bus body, and covering the weld with an insulation encapsulation layer.

8. The preparation method according to claim 7, characterized in that, The integrated insulation layer is a heat-shrinkable insulation layer. The integrated insulation layer is wrapped on the surface of the bus body, and the connection parts at both ends of the bus body form conductive exposed areas. The process includes: applying the heat-shrinkable insulation layer to the surface of the bus body, and using a heat-shrinking process to heat-treat the heat-shrinkable insulation layer so that the heat-shrinkable insulation layer is tightly attached to the surface of the bus body, and forming a stepped transition at the edge of the connection part of the bus body to avoid conductive exposed areas.

9. The preparation method according to claim 8, characterized in that, Processing bus assembly also includes: A tin plating layer is obtained by electroplating on the surface of the conductive exposed area of ​​the bus body. The thickness of the tin plating layer is controlled to be 0.02-0.05mm, and the ratio of the area of ​​the conductive exposed area to the total area of ​​the connection part is controlled to be 1 / 3-1 / 2.

10. The preparation method according to any one of claims 7-9, characterized in that, The insulating encapsulation layer is made of epoxy resin material. The insulating encapsulation layer is applied to the weld joint through a potting process. During the potting process, the coverage area of ​​the insulating encapsulation layer is controlled to extend 1-3 mm beyond the edge of the weld joint to form a sealed and insulating protection.

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