Support assembly and foldable electronic device

Abstract

This application discloses a support component and a foldable electronic device, belonging to the technical field of foldable electronic devices. The support component includes: a main board segment, which is mounted on a base component and extends along the length of the base component; and a reinforcing segment, which is mounted on the base component and its position corresponds to a specific area of ​​the base component. A process connection structure is provided between the reinforcing segment and the main board segment, and the reinforcing segment and the main board segment are connected by the process connection structure. The structural stiffness of the reinforcing segment is greater than that of the main board segment. The main board segment is manufactured by a first processing technology, and the reinforcing segment is manufactured by a second processing technology. The shrinkage rate of the first processing technology is less than that of the second processing technology. This effectively solves the technical problem of avoiding insufficient stiffness while ensuring accuracy, and improves the stability and reliability of the folding hinge mechanism of the foldable electronic device.

Description

Technical Field

[0001] This application relates to the field of foldable electronic device technology, and particularly to a support component and a foldable electronic device. Background Technology

[0002] With the development of technology, foldable electronic devices are becoming increasingly widely used and have become important tools in people's daily lives and work. Foldable electronic devices are favored by people because they take up little space and are easy to carry.

[0003] Foldable electronic devices typically include two housings, a folding hinge mechanism, and a display screen. The two housings are connected to opposite sides of the folding hinge mechanism, allowing them to open and close relative to each other. The display screen is located on the same side as both housings and the folding hinge mechanism, and is connected to the housings, thus folding or unfolding during the relative opening and closing of the two housings. When the folding hinge mechanism is flattened, the display screen unfolds onto the surfaces of the two housings and the folding hinge mechanism. The folding hinge mechanism includes a base assembly and a swing arm assembly. The swing arm assembly is rotatably mounted on the base assembly, and the swing arm assembly and the base assembly are connected via a shaft structure, allowing the swing arm to rotate and slide relative to the base.

[0004] To improve the rigidity of the base assembly and support the display screen, a support plate is usually installed on the side of the base assembly closest to the screen. However, the support plate is quite long, usually over 150mm. Using a one-piece MIM stainless steel with a shrinkage rate of 15%-20% makes it impossible to control the precision and requires additional CNC processes. Using a split MIM stainless steel also requires additional CNC processes, as well as welding, fastening, and other processes, making the manufacturing process complex and unable to guarantee precision. If a one-piece amorphous molding is used (shrinkage rate of 0.2%), the thinner areas or areas with high stress of the support plate are not rigid enough and are prone to deformation, causing work jams. Summary of the Invention

[0005] This application provides a support component and a foldable electronic device. This support component can ensure accuracy while avoiding insufficient rigidity.

[0006] The technical solution is as follows:

[0007] The first aspect of this application provides a support component for a foldable electronic device. The foldable electronic device includes a folding hinge mechanism, which includes a base assembly and a swing arm assembly mounted on the base assembly. The support component is mounted on the base assembly and includes: a main board segment, which is mounted on the base assembly and extends along the length of the base assembly; and a reinforcing segment, which is mounted on the base assembly and whose position corresponds to a specific area of ​​the base assembly. A process connection structure is provided between the reinforcing segment and the main board segment, and the reinforcing segment and the main board segment are connected by the process connection structure. The structural stiffness of the reinforcing segment is greater than that of the main board segment. The main board segment is manufactured by a first processing technology, and the reinforcing segment is manufactured by a second processing technology. The shrinkage rate of the first processing technology is less than that of the second processing technology.

[0008] Through the above technical solution, the main board segment extends along the length of the base assembly and is installed on the base assembly. The reinforcing segment is installed in a specific area of ​​the base assembly and connected to the main board segment through a process connection structure. Since the main board segment is manufactured using a first processing technology with a smaller shrinkage rate, and the reinforcing segment is manufactured using a second processing technology with a larger shrinkage rate, this approach leverages the high processing precision of the main board segment to ensure the overall precision of the support assembly, while the reinforcing segment provides sufficient structural rigidity in a specific area. This effectively solves the technical problem of ensuring precision while avoiding insufficient rigidity, improving the stability and reliability of the folding hinge mechanism of the foldable electronic device. This ensures the device operates normally during daily use and work, avoiding malfunctions such as display deformation and operational stuttering caused by precision or rigidity issues in the support assembly, thus improving user experience and extending the device's lifespan.

[0009] In one possible design, the first processing technology is amorphous injection molding. The process connection structure is located at the end of the reinforcing section. This connection structure includes an injection molding connection structure, which is situated within the mold during the amorphous injection molding process. Amorphous injection molding inherently offers the advantage of low shrinkage (e.g., 0.2%), ensuring high precision control of the support components during processing. This effectively avoids dimensional deviations caused by processing shrinkage, thereby guaranteeing precise alignment between the support components and the folding hinge mechanism, as well as other components, laying the foundation for the stable operation of the foldable electronic device.

[0010] In one possible design, the reinforcing section includes a reinforcing body and a boss located at the end of the reinforcing body. The boss has a first and / or second side with a molding space for amorphous material injection molding. The injection molding connection structure includes a protrusion on the boss, located in the molding space and spaced apart from the reinforcing body. Due to the inherent shrinkage of amorphous material, the protrusion effectively matches the shrinkage characteristics of the amorphous material during this process. When the amorphous material cools and shrinks, the protrusion effectively limits deformation caused by excessive shrinkage, while the amorphous material tightly wraps around the protrusion, making the connection between the two more stable and reliable, ensuring high strength and durability of the connection between the main body section and the reinforcing section.

[0011] In one possible design, there are multiple protrusions spaced apart. This spacing allows stress to be evenly distributed across the protrusions and the amorphous injection-molded parts they connect to, preventing stress concentration in any one area. This reduces the risk of damage to connections or structural failure due to excessive localized stress, significantly improving the overall structural reliability and durability of the support assembly.

[0012] In one possible design, the first and second sides of the boss are positioned opposite each other, and the boss also includes a third and fourth side positioned opposite each other. The third and / or fourth sides of the boss are provided with cavities. After the amorphous material is formed in the cavity, the amorphous material forms a tight fit with the third and / or fourth sides of the boss in the width direction of the support assembly.

[0013] In one possible design, the third and / or fourth sides of the boss are provided with stepped cavities, the width of which gradually increases in a stepped manner from the reinforcing section to the main board section. Because the cavity width gradually increases from the reinforcing section to the main board section, the amorphous material can flow more smoothly along the cavity wall and fill all corners during injection, avoiding problems such as difficulty in material filling or trapped air bubbles caused by narrow cavity channels. The stepped amorphous structure formed by the stepped cavities, in conjunction with the reinforcing section, maintains good structural integrity and stability under multi-directional stress conditions.

[0014] In one possible design, a recess is provided at the mating point between the upper end of the motherboard segment and the upper end of the reinforcing segment. When the two move relative to each other during operations such as folding or unfolding the device, even if there is a slight misalignment due to various factors, the collision between the protrusion and the display screen that might have occurred will be avoided due to the buffering effect of the recess.

[0015] In one possible design, a first chamfer is provided on the upper end of the main board segment near the reinforcing segment, and a second chamfer is provided on the upper end of the reinforcing segment near the main board segment. The upper surfaces of the first and second chamfers form the bottom wall of the recess. During long-term use of the device, especially after multiple folding and unfolding cycles, the smooth chamfered connection can better adapt to the slight deformation and relative displacement between components, effectively avoiding structural damage or loosening of connections caused by local stress concentration, and ensuring the stable operation of the folding hinge mechanism.

[0016] In one possible design, there are two reinforcing sections, each connected to one end of the main board section. These reinforcing sections at both ends can initially withstand and disperse these forces, preventing stress concentration at the ends of the base assembly from causing structural damage.

[0017] In one possible design, there are multiple reinforcement segments and multiple motherboard segments, with a motherboard segment placed between two adjacent reinforcement segments.

[0018] In one possible design, the structural wear resistance of the reinforcing sections is greater than that of the main board sections. Multiple reinforcing sections are evenly distributed within the support assembly, each bearing and distributing external forces from different locations.

[0019] In one possible design, the structural density of the reinforcing section is less than that of the mainboard section.

[0020] In one possible design, the second processing technology is the MIM stainless steel process.

[0021] The second aspect of this application provides a foldable electronic device. The foldable electronic device includes a folding hinge mechanism, which includes a base assembly and a swing arm assembly mounted on the base assembly, and also includes the aforementioned support assembly mounted on the base assembly.

[0022] With the above technical solution, since the foldable electronic device includes the above-mentioned support components, it has at least all the beneficial effects of the support components, which will not be elaborated here. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiment of this application in a folded state;

[0024] Figure 2 This is a schematic diagram of the electronic device provided in the embodiments of this application in a semi-deployed state;

[0025] Figure 3 This is a schematic diagram of the electronic device provided in the embodiments of this application in its unfolded state;

[0026] Figure 4 yes Figure 3A schematic diagram of the decomposed structure;

[0027] Figure 5 This is a schematic diagram of the structure of the folding hinge mechanism and support assembly of the electronic device provided in this application, installed together;

[0028] Figure 6 yes Figure 5 Exploded view;

[0029] Figure 7 This is a schematic diagram of the structure of the support component provided in the embodiments of this application;

[0030] Figure 8 This is an exploded view of the support components provided in the embodiments of this application;

[0031] Figure 9 This is a cross-sectional view of the mating point between the reinforcing segment and the main board segment provided in an embodiment of this application;

[0032] Figure 10 This is a schematic diagram of the reinforcing segment provided in an embodiment of this application;

[0033] Figure 11 This is a structural perspective diagram of the support component provided in the embodiments of this application;

[0034] Figure 12 yes Figure 11 Enlarged view of region B in the middle;

[0035] Figure 13 This is a structural schematic diagram of the support component provided in an embodiment of this application from another angle;

[0036] Figure 14 yes Figure 13 Enlarged view of region A in the middle;

[0037] The meanings of the various symbols in the attached icons are as follows:

[0038] 1. Foldable electronic devices; 2. Protective cases;

[0039] 10. Folding hinge mechanism; 11. Base assembly; 20. First housing; 30. Second housing; 40. Display screen; 41. First part; 42. Second part; 43. Foldable part;

[0040] 50. Support components;

[0041] 51. Mainboard segment; 511. First chamfer section;

[0042] 52. Reinforcing section; 521. Reinforcing body; 522. Boss; 523. Second chamfer;

[0043] 53. Process connection structure; 531. Injection molding connection structure; 5311. Protruding column;

[0044] 54. Molding space; 55. Cavity;

[0045] 56. Concave. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0047] It should be understood that "multiple" as mentioned in this application refers to two or more. In the description of this application, unless otherwise stated, " / " indicates "or," for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist, for example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, to facilitate a clear description of the technical solutions of this application, the terms "first," "second," etc., are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first," "second," etc., do not limit the quantity or execution order, and that "first," "second," etc., do not necessarily imply differences.

[0048] In related technologies, foldable electronic devices typically include two housings, a folding hinge mechanism, and a display screen. The two housings are connected to opposite sides of the folding hinge mechanism, and can open and close relative to each other under the action of the mechanism. The display screen is located on the same side of both housings and the folding hinge mechanism, and is connected to the housings, thus folding or unfolding during the relative opening and closing of the two housings. When the folding hinge mechanism is flattened, the display screen unfolds onto the surfaces of the two housings and the mechanism. The folding hinge mechanism includes a base assembly and a swing arm assembly. The swing arm assembly is rotatably mounted on the base assembly, and the swing arm assembly and base assembly are connected via a shaft structure, allowing the swing arm to rotate and slide relative to the base.

[0049] To improve the rigidity of the base assembly and support the display screen, a support plate is usually installed on the side of the base assembly closest to the screen. However, the support plate is quite long, usually over 150mm. Using a one-piece MIM stainless steel with a shrinkage rate of 15%-20% makes it impossible to control the precision and requires additional CNC processes. Using a split MIM stainless steel also requires additional CNC processes, as well as welding, fastening, and other processes, making the manufacturing process complex and unable to guarantee precision. If a one-piece amorphous molding is used (shrinkage rate of 0.2%), the thinner areas or areas with high stress of the support plate are not rigid enough and are prone to deformation, causing work jams.

[0050] To address the technical problem in the aforementioned related technologies that cannot guarantee accuracy while avoiding insufficient rigidity, this embodiment provides a support component applicable to foldable electronic devices. This application also provides a foldable electronic device using the aforementioned support component. The foldable electronic device includes a folding hinge mechanism, which includes a base assembly and a swing arm assembly mounted on the base assembly. The support component is mounted on the base assembly. The support component and foldable electronic device provided in this application will be explained in detail below.

[0051] Figure 1 This application provides a foldable electronic device 1, which includes, but is not limited to, cellphones, notebook computers, tablet computers, and laptop computers. In this embodiment, a cellphone is used as an example for illustration.

[0052] Figure 1 The foldable electronic device 1 shown is in a folded state. Figure 2 The foldable electronic device 1 shown is in a semi-flattened state. Figure 3 The foldable electronic device 1 shown is in a flattened state. Among them, Figure 2 The unfolding angle α of the foldable electronic device 1 shown is 90 degrees. Figure 3 The unfolding angle β of the foldable electronic device 1 shown is 180 degrees.

[0053] It should be noted that the angles illustrated in the embodiments of this application are allowed to have slight deviations. For example, Figure 2 The unfolding angle α of the foldable electronic device 1 shown is 90 degrees, which means that α can be 90 degrees, or approximately 90 degrees, such as 80 degrees, 85 degrees, 95 degrees, or 100 degrees. Figure 3 The unfolding angle β of the foldable electronic device 1 shown is 180 degrees, meaning that β can be 180 degrees, or approximately 180 degrees, such as 170 degrees, 175 degrees, 185 degrees, and 190 degrees. The angles illustrated in the following text can be understood in the same way.

[0054] The foldable electronic device 1 shown in this embodiment is an electronic device that can be folded once. In some other embodiments, the foldable electronic device 1 can also be an electronic device that can be folded multiple times (more than twice). In this case, the foldable electronic device 1 may include multiple parts, and two adjacent parts can be folded relatively close to each other until the foldable electronic device 1 is in a folded state, and two adjacent parts can be unfolded relatively far apart until the foldable electronic device 1 is in a flattened state.

[0055] For ease of description, in this embodiment, the width direction of the foldable electronic device 1 is defined as the X-axis direction, the length direction as the Y-axis direction, and the thickness direction as the Z-axis direction. The X-axis, Y-axis, and Z-axis directions are mutually perpendicular. It should be noted that the dimension in the width direction is not necessarily larger than the dimension in the length direction. It is worth noting that the limiting terms for parallel and perpendicular positional relationships mentioned in this embodiment are relative to the current technological level, not absolute and strict mathematical definitions, and slight deviations are allowed; approximation of parallelism and approximation of perpendicularity are acceptable. For example, A and B being parallel means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees. For example, A and B being perpendicular means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 degrees and 100 degrees. In this embodiment, the foldable electronic device 1 is described using directional terms such as "top," "bottom," "left," "right," "front," and "rear," and the orientation is mainly based on the foldable terminal's position on the attached... Figure 3 The orientation of the display is described as follows: the positive direction of the Y-axis is "top", the negative direction of the Y-axis is "bottom", the positive direction of the X-axis is "left", the negative direction of the X-axis is "right", the positive direction of the Z-axis is "front", and the negative direction of the Z-axis is "back".

[0056] Please see Figure 4 , Figure 4 yes Figure 3The exploded structural diagram is shown below. The foldable electronic device 1 includes a first housing 20, a second housing 30, a folding hinge mechanism 10, and a display screen 40. The folding hinge mechanism 10 connects the first housing 20 and the second housing 30. Specifically, the first housing 20 and the second housing 30 are respectively mounted on opposite sides of the folding hinge mechanism 10 in the width direction; that is, the first housing 20 and the second housing 30 are respectively mounted on the left and right sides of the folding hinge mechanism 10. The first housing 20 and the second housing 30 rotate relative to each other via the folding hinge mechanism 10. The rotation directions of the first housing 20 and the second housing 30 are opposite. The display screen 40 is disposed on one side of the first housing 20, the second housing 30, and the folding hinge mechanism 10; specifically, the display screen 40 is disposed on the front side of the first housing 20, the second housing 30, and the folding hinge mechanism 10. The display screen 40 includes a first part 41, a second part 42, and a foldable part 43. The foldable part 43 is located between the first part 41 and the second part 42, and the foldable part 43 can be bent along the Y-axis direction. The first part 41, the second part 42, and the foldable part 43 together constitute the display screen 40. In this embodiment, the display screen 40 is a flexible display screen, such as an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen.

[0057] The foldable electronic device 1 folds by bringing the first housing 20 and the second housing 30 closer together, causing the display screen 40 to fold. When the foldable electronic device 1 is in the folded state, the foldable portion 43 of the display screen 40 bends, and the first portion 41 and the second portion 42 are positioned opposite each other. At this time, the display screen 40 is located between the first housing 20 and the second housing 30, which greatly reduces the probability of the display screen 40 being damaged and achieves effective protection for the display screen 40.

[0058] Please refer to the following: Figure 2 and Figure 4The first housing 20 and the second housing 30 rotate relative to each other via the folding hinge mechanism 10. The relative distance between the first housing 20 and the second housing 30 causes the display screen 40 to unfold, thus unfolding the foldable electronic device 1 to a semi-flattened state. When the foldable electronic device 1 is in the semi-flattened state, the first housing 20 and the second housing 30 unfold to an angle α, the first part 41 and the second part 42 unfold relative to each other, and the foldable part 43 unfolds. At this time, the angle between the first part 41 and the second part 42 is α.

[0059] Please refer to the following: Figure 3 and Figure 4 The first housing 20 and the second housing 30 rotate relative to each other via the folding hinge mechanism 10. The first housing 20 and the second housing 30 can have the same structure and can be mirror-symmetrically arranged relative to the folding hinge mechanism 10. The relative movement of the first housing 20 and the second housing 30 causes the display screen 40 to further unfold until the foldable electronic device 1 is flattened. When the foldable electronic device 1 is flattened, the angle between the first housing 20 and the second housing 30 is β. The foldable portion 43 unfolds, and the first portion 41 and the second portion 42 unfold relative to each other. At this time, the angles between the first portion 41, the second portion 42, and the foldable portion 43 are all β, and the display screen 40 has a large display area, realizing a large-screen display for the foldable electronic device 1 and improving the user experience. It should be noted that angles α and β are both angles between the first housing 20 and the second housing 30; they are only used here to distinguish the different angles between the first housing 20 and the second housing 30 in different states of the foldable electronic device 1. Wherein, included angle α refers to the angle between the first housing 20 and the second housing 30 when the foldable electronic device 1 is in a semi-flattened state; included angle β refers to the angle between the first housing 20 and the second housing 30 when the foldable electronic device 1 is in a flattened state.

[0060] It should be understood that the foldable electronic device 1 shown in this embodiment folds inward, with the display screen 40 of the foldable electronic device 1 located inside the folding hinge mechanism 10 when folded. In other embodiments, the foldable electronic device 1 can also fold outward, in which case the display screen 40 of the foldable electronic device 1 is located outside the folding hinge mechanism 10 when folded. The main function of the support component is to be mounted on the base assembly, providing support, such as supporting the display screen and enhancing the stability of the folding hinge mechanism. It is an important component for ensuring the normal operation of the foldable electronic device. The folding hinge mechanism mainly includes a base assembly and a swing arm assembly. The swing arm assembly is rotatably mounted on the base assembly, and the two are connected by a shaft structure. The swing arm can rotate and slide relative to the base, enabling the device to fold and unfold. The swing arm assembly cooperates with the first housing and the second housing, respectively.

[0061] like Figures 5 to 8 As shown, the support component 50 provided in this embodiment includes a main board segment 51 and a reinforcing segment 52. The main board segment 51 is mounted on the base component 11 and extends along the length of the base component 11. The reinforcing segment 52 is mounted on the base component 11, and its position corresponds to a specific area of ​​the base component 11. A process connection structure 53 is provided between the reinforcing segment 52 and the main board segment 51, and the reinforcing segment 52 and the main board segment 51 are connected through the process connection structure 53. The main board segment 51 is manufactured by a first processing technology, and the reinforcing segment 52 is manufactured by a second processing technology. The shrinkage rate of the first processing technology is less than the shrinkage rate of the second processing technology. It should be noted that the process connection structure 53 is a structure used for connection between components during industrial production molding, rather than a connection structure used during parts assembly.

[0062] Specific areas refer to specific locations on the base assembly 11 that require additional reinforcement to improve rigidity and support functions such as the display screen, for example, in areas subjected to significant pressure, stress concentration, or that have a significant impact on the overall structural stability. The main board section, as part of the support assembly 50, primarily provides basic support functions and, due to its manufacturing process characteristics (low shrinkage rate), plays a crucial role in ensuring precision. The reinforcing section 52, also a component of the support assembly 50, is installed in specific areas of the base assembly 11 and works in conjunction with the main board section 51 to provide support, utilizing its high rigidity to provide sufficient stiffness.

[0063] This embodiment of the application provides a support component 50 on the base assembly 11 of the folding hinge mechanism 10 of a foldable electronic device, which includes a main board segment 51 and a reinforcing segment 52. The main board segment 51 extends along the length of the base assembly 11 and is mounted on the base assembly 11. The reinforcing segment 52 is mounted in a specific area of ​​the base assembly 11 and connected to the main board segment 51 through a process connection structure 53. Since the main board segment 51 is manufactured by a first processing technology with a small shrinkage rate, and the reinforcing segment 52 is manufactured by a second processing technology with a large shrinkage rate, this approach can utilize the high processing precision of the main board segment 51 to ensure the overall precision of the support component 50, while also providing sufficient structural rigidity in a specific area with the help of the reinforcing segment 52. This effectively solves the technical problem of ensuring precision while avoiding insufficient rigidity, improves the stability and reliability of the folding hinge mechanism 10 of the foldable electronic device, ensures the normal operation of the device during daily use and work, and avoids adverse phenomena such as display screen deformation and work lag caused by precision or rigidity issues of the support component 50, thereby improving user experience and the service life of the device.

[0064] like Figure 9 As shown, the first processing technology in this embodiment is amorphous injection molding. The process connection structure 53 is located at the end of the reinforcing section 52. The process connection structure 53 includes an injection molding connection structure 531, also known as a pull-out structure. During the amorphous injection molding process, the injection molding connection structure 531 is located in the mold of the amorphous injection molding process. During the amorphous injection molding process, the injection molding connection structure 531 connects the reinforcing section 52 and the main board section 51 together through interaction with the injection molding material, such as fusion and interlocking with the amorphous injection molding material. The two can withstand a certain amount of tensile and shear forces, ensuring that during the daily use of the equipment, even if subjected to various external forces such as folding, opening and closing, and external impacts, the main board section 51 and the reinforcing section 52 will not easily separate, thereby maintaining the structural integrity and stability of the support component 50. Amorphous injection molding has the advantage of low shrinkage (e.g., 0.2%), which can ensure high precision control of the support component 50 during processing, effectively avoiding dimensional deviations caused by processing shrinkage, thereby ensuring the precise cooperation between the support component 50 and the folding hinge mechanism 10 and other components, laying the foundation for the stable operation of foldable electronic devices.

[0065] Secondly, the process connection structure 53 is set in the injection-molded connection structure 531 at the end of the reinforcing section 52. During amorphous injection molding, it is in the mold. On the one hand, this allows the reinforcing section 52 and the main board section 51 to establish a reliable connection during the molding process. Compared with traditional post-assembly connections, this better ensures the integrity and stability of the connection and reduces structural defects caused by loosening or instability of the connection. On the other hand, the injection-molded connection structure 531 ensures the connection strength without significantly negatively affecting the stiffness distribution of the overall structure. It achieves an effective connection between the reinforcing section 52 and the main board section 51 while maintaining the coordination of the various structural parts in terms of stress and function. This allows the support component 50 to effectively play its role in supporting and stabilizing the folding hinge mechanism 10 under different working conditions, thereby improving the overall performance and reliability of the folding electronic device, reducing equipment failures or performance degradation caused by connection problems, extending the service life of the device, and improving the user experience.

[0066] like Figure 9 , Figure 10 and Figure 11 , Figure 12 The reinforcing section 52 in this embodiment includes a reinforcing body 521 and a boss 522 located at the end of the reinforcing body 521. The first and / or second sides of the boss 522 are provided with a molding space 54 for amorphous injection molding. The injection molding connection structure 531 includes a protrusion 5311 disposed on the boss 522. The protrusion 5311 is located in the molding space 54 and spaced apart from the reinforcing body 521. During amorphous injection molding, the molding space 54 of the boss 522 provides a molding area for the amorphous material, making the injection molding process more controllable and precise, which is beneficial to ensuring the overall processing accuracy and quality stability of the support component 50. The injection molding connection structure 531 uses a protrusion 5311 located in the molding space 54 and spaced apart from the reinforcing body 521. Because amorphous materials have a shrinkage rate, the protrusion 5311 can effectively cooperate with the shrinkage characteristics of amorphous materials during this process. When the amorphous material cools and shrinks, the protrusion 5311 can effectively limit the deformation caused by excessive shrinkage of the amorphous material. At the same time, the amorphous material can also tightly wrap the protrusion 5311, making the connection between the two more stable and reliable, ensuring the high strength and durability of the connection between the main board segment 51 and the reinforcing segment 52.

[0067] In contrast, if the injection-molded connection structure 531 adopts a hole form, the shrinkage rate of the amorphous material will inevitably create a large gap between the hole and the amorphous material. This will not only severely weaken the connection strength between the main board segment 51 and the reinforcing segment 52, making the connection prone to loosening and displacement during equipment operation, but the large gap may also allow impurities and dust to enter the interior, affecting the normal operation of the equipment, reducing the overall reliability and service life of the foldable electronic device, and increasing the risk of equipment failure.

[0068] In some examples, a hook-shaped injection-molded connection structure 531 is provided at the end of the reinforcing section 52. During amorphous injection molding, the amorphous material flows and fills the area around the hook-shaped structure. After the material solidifies, the hook-shaped structure is encased within the amorphous material, forming a "hook-like" connection. The hook-shaped structure provides good tensile strength.

[0069] In some examples, a corrugated injection-molded connection structure 531 is provided at the end of the reinforcing section 52. During amorphous injection molding, the amorphous material fills the grooves and protrusions of the corrugations. The cured amorphous material and the corrugated structure are nested together to form a tight connection. The corrugated structure increases the contact area between the injection-molded connection structure 531 and the amorphous material, thereby improving the friction and adhesion of the connection. This maintains the stability of the connection even when the device is subjected to forces in different directions.

[0070] like Figure 10 and Figure 12 As shown, in this embodiment of the application, there are multiple protrusions 5311, which are spaced apart. The spaced arrangement of multiple protrusions 5311 effectively disperses stress. During the use of foldable electronic devices, whether it's the folding or unfolding of the device, or external impacts that may occur during daily use, the support assembly 50 will bear forces of different directions and magnitudes. The multiple spaced protrusions 5311 allow stress to be evenly distributed among each protrusion 5311 and the amorphous injection-molded parts they are connected to, avoiding stress concentration in one place. This reduces the risk of damage to the connection points or structural failure due to excessive local stress, greatly improving the overall structural reliability and durability of the support assembly 50. Because of the presence of multiple protrusions 5311, after amorphous injection molding, each protrusion 5311 is tightly bonded to the amorphous material, forming multiple connection points. Compared to a single protruding post 5311, multiple connection points can provide stronger connection force, effectively preventing relative displacement or loosening of the main board segment 51 and the reinforcing segment 52 during long-term use. This ensures that the support component 50 maintains a stable structural shape under frequent folding and opening operations, guaranteeing the normal operation of the folding hinge mechanism 10 and reliable support for components such as the display screen.

[0071] In some examples, the protrusions 5311 are arranged in a regular matrix, such as a multi-row, multi-column distribution on the first or second side of the boss 522. For example, a 3x4 matrix is ​​used, with equal spacing between protrusions 5311 in each row and equally spaced protrusions 5311 in each column. This arrangement allows stress to be distributed relatively evenly in both the horizontal and vertical directions, making it suitable for situations where relatively uniform tensile and shear forces are applied. For instance, during the normal opening and closing of a foldable electronic device, when the display screen exerts a relatively uniform pulling force on the support component 50, the matrix-arranged protrusions 5311 can stably transmit and disperse the force, effectively preventing localized stress concentration that could lead to connection failure.

[0072] In some examples, the protrusions 5311 are arranged linearly at intervals along a certain direction (such as the length or width direction) of the boss 522. For example, five protrusions 5311 are arranged along the length of the boss 522, maintaining the same spacing between them. This arrangement is highly effective in dealing with forces mainly along a specific direction. For example, when a foldable electronic device is in its unfolded state, it mainly bears the tensile force generated by the weight of the display screen along the length of the boss 522. The linearly spaced protrusions 5311 can effectively disperse the tensile force along this direction, uniformly transferring the force to the amorphous injection molding material and the reinforcing body 521, ensuring the structural strength and connection stability of the support assembly 50 in this force direction.

[0073] In some examples, three protrusions 5311 are arranged on one side of the boss 522 of the reinforcing section 52, forming an approximately equilateral triangle layout. One protrusion 5311 is located at the center of the side of the boss 522, and the other two protrusions 5311 are located at a certain distance above and below the central protrusion 5311, respectively, with the angle between the lines connecting these two protrusions 5311 and the central protrusion 5311 being approximately 60 degrees. During the use of foldable electronic devices, when subjected to forces from different directions, such as lateral pressure generated when the device is folded or tensile force when unfolded, this triangular layout of protrusions 5311 can disperse stress from multiple angles. The central protrusion 5311 can bear a large portion of the vertical force transmission and dispersion, while the upper and lower protrusions 5311 can assist in bearing force in the tilt direction, effectively preventing local damage to the connection parts due to uneven force distribution, ensuring the stability and reliability of the overall structure of the support assembly 50, maintaining the normal operation of the folding hinge mechanism 10, and providing good support for the display screen.

[0074] like Figure 10As shown, in this embodiment of the application, the first side and the second side of the boss 522 are disposed opposite to each other. The boss 522 also includes a third side and a fourth side disposed opposite to each other. The third side and / or the fourth side of the boss 522 are provided with a cavity 55. With the cavity 55 provided on the third side and / or the fourth side, when the amorphous material is formed in the cavity 55, the amorphous material and the third side and / or the fourth side of the boss 522 form a tight fit in the width direction of the support component 50, which greatly enhances the stability of the support component 50 in the width direction. In the daily use of foldable electronic devices, whether in a folded or unfolded state, the device will be subjected to various forces from different directions, especially in the width direction, which may be subjected to forces generated by external collisions, internal component compression, etc. The amorphous material formed in the cavity 55 and the side of the boss 522 can effectively resist these forces and prevent the support component 50 from swaying, shifting or deforming in the width direction. This ensures that the folding hinge mechanism 10 can operate stably and avoids deviation of the installation position of the display screen due to the instability of the support component 50 in the width direction, thereby reducing the risk of equipment failure due to structural instability.

[0075] In some examples, the opposing third and fourth sides allow the amorphous material formed by the cavity 55 to create a more symmetrical and balanced fit structure in the width direction of the support assembly 50. This symmetry can evenly distribute external forces from both sides in the width direction, avoiding torque or lateral deformation caused by uneven force distribution.

[0076] In this embodiment, the third and / or fourth sides of the boss 522 are provided with stepped cavities 55. The width of the stepped cavity 55 gradually increases in a stepped manner from the reinforcing section 52 to the main board section 51. During amorphous injection molding, the stepped cavity 55 facilitates the filling and solidification of the amorphous material. Because the cavity width gradually increases from the reinforcing section 52 to the main board section 51, the amorphous material can flow more smoothly along the cavity wall and fill all corners during injection, avoiding problems such as difficulty in material filling or trapped air bubbles caused by narrow cavity channels. The stepped amorphous structure formed by the stepped cavity 55, in conjunction with the reinforcing section 52, maintains good structural integrity and stability under multi-directional stress.

[0077] like Figure 13 and Figure 14As shown, a recess 56 is provided at the mating point between the upper end of the main board segment 51 and the upper end of the reinforcing segment 52 in this embodiment of the application. During the operation of the foldable electronic device, especially during frequent folding and unfolding operations, relative movement and slight displacement changes will inevitably occur between the components. When the upper end of the main board segment 51 and the upper end of the reinforcing segment 52 are in a mating state and are close to the display screen, if there is a protrusion at this mating point, the protrusion can easily come into direct contact with the display screen during these relative movements. Since the display screen is usually a relatively fragile component, direct contact with the protrusion can cause various types of damage to the display screen. For example, the protrusion may scratch the surface of the display screen, causing scratches; in severe cases, the pressure applied by the protrusion may also deform or damage the internal liquid crystal layer, touch layer, and other structures of the display screen, thereby causing display abnormalities or even screen malfunctions, greatly shortening the service life of the display screen.

[0078] However, in this embodiment, a recess 56 is provided at the mating point between the upper end of the motherboard segment 51 and the upper end of the reinforcing segment 52, which effectively avoids the aforementioned problems. The presence of the recess 56 is equivalent to creating a buffer space in the mating area of ​​the motherboard segment 51 and the reinforcing segment 52 near the display screen. When the two move relative to each other during operations such as folding or unfolding the device, even if there is a slight uncoordinated displacement due to various factors, the collision between the protrusion and the display screen that might have occurred will be avoided due to the buffering effect of the recess 56.

[0079] Specifically, the recess 56 can accommodate minor displacement deviations caused by relative movement, preventing scratches, pressure, or other damage to the display screen at the mating point between the main board segment 51 and the reinforcing segment 52 near the display screen end. This ensures that the display screen can operate normally in a relatively safe environment, maintaining its integrity and good display performance, extending the display screen's lifespan, and also improving the overall reliability and stability of the foldable electronic device.

[0080] like Figure 14As shown, in this embodiment, a first chamfer 511 is provided on the side of the upper end of the main board segment 51 near the reinforcing segment 52, and a second chamfer 523 is provided on the side of the upper end of the reinforcing segment 52 near the main board segment 51. The upper surfaces of the first chamfer 511 and the second chamfer 523 form the bottom wall of the recess 56. The provision of the first chamfer 511 and the second chamfer 523 makes the connection transition between the main board segment 51 and the reinforcing segment 52 near the display screen more smooth and natural. This reduces assembly errors caused by sharp or uneven edges, thereby making the overall structure of the support assembly 50 more stable and reliable. During long-term use of the device, especially after multiple folding and unfolding cycles, the smooth chamfered connection can better adapt to the small deformations and relative displacements between components, effectively avoiding structural damage or loosening of connections caused by local stress concentration, and ensuring the stable operation of the folding hinge mechanism 10.

[0081] During device operation, without chamfering, the edges of the motherboard segment 51 and the reinforcing segment 52 might scratch or damage the display screen due to relative movement. The chamfer effectively eliminates these sharp edges, greatly reducing the impact and friction when in contact with the display screen. When this area comes into contact with the display screen due to accidental events or minor displacement during normal use, the first chamfer 511 and the second chamfer 523 can guide the dispersion of force, preventing stress concentration at a single point from damaging the display screen, thus effectively protecting the integrity and display performance of the display screen.

[0082] In some examples, tests showed that these two ends were susceptible to deformation or damage. Therefore, in this embodiment, there are two reinforcing sections 52, each connected to one end of the main board section 51. Since specific areas are located at both ends of the base assembly 11 and are prone to deformation or damage, providing reinforcing sections 52 at these critical locations effectively enhances the rigidity and strength of the local structure. When the foldable electronic device is subjected to various external forces during use, such as stress from frequent folding and unfolding, accidental collisions, or compression, the reinforcing sections 52 at both ends can bear and disperse these forces first, preventing stress concentration at the ends of the base assembly 11 and thus preventing structural damage. For example, when the device is folded, the reinforcing sections 52 at both ends can provide stable support for the folding hinge mechanism 10, reducing twisting or deformation caused by uneven force, and ensuring the smoothness and accuracy of the folding action. Meanwhile, the reinforcing section 52, which is connected to the main board section 51 through the process connection structure 53, can work together with the main board section 51 to make the entire support assembly 50 form an organic whole, and evenly transmit and distribute external forces to the entire support assembly 50 and base assembly 11, further improving the overall structural stability and reliability of the foldable electronic device and effectively extending the service life of the device.

[0083] In some examples, the distribution of specific areas may be complex. In this embodiment, there are multiple reinforcing segments 52 and main board segments 51, with a main board segment 51 positioned between two adjacent reinforcing segments 52. Multiple reinforcing segments 52 are evenly distributed within the support assembly 50, each bearing and distributing external forces from different parts. Because the structural stiffness of the reinforcing segments 52 is greater than that of the main board segments 51, when the device is subjected to various complex stresses, such as bending and torsional forces generated during the folding and unfolding of foldable electronic devices, as well as external impacts encountered during daily use, the reinforcing segments 52 can serve as key supports and force distribution points. The main board segments 51, on the other hand, act as connectors and auxiliary supports between the reinforcing segments 52, connecting them into an organic whole, allowing forces to be transmitted and distributed more evenly throughout the support assembly 50. The spaced reinforcing segments 52 can correspond to multiple specific areas, and their structure can be customized according to the actual stress characteristics of each specific area. For example, in specific areas susceptible to torsional forces, the corresponding reinforcing section 52 can increase torsional resistance, such as by using a special cross-sectional shape or material distribution; in areas mainly bearing vertical pressure, the reinforcing section 52 can enhance its compressive strength. The entire support assembly 50 can better adapt to the complex and diverse stress environments of foldable electronic devices, improving the overall reliability and durability of the equipment.

[0084] In some examples, specific areas refer to regions of stress concentration and high wear resistance. In this embodiment, the structural wear resistance of the reinforcing segment 52 is greater than that of the mainboard segment 51. In dealing with stress concentration and wear, the reinforcing segment 52, with its higher wear resistance, effectively resists wear in these high-risk areas. When foldable electronic devices frequently undergo folding and unfolding operations, stress concentration areas repeatedly bear significant friction and impact forces, such as near the folding hinge, where the relative movement between components is frequent and intense. At this time, the highly wear-resistant reinforcing segment 52 can maintain its structural integrity for a long time, avoiding a decrease in structural strength due to excessive wear. This effectively reduces defects such as debris and scratches caused by wear, thereby ensuring the structural reliability of the support assembly 50 in critical areas.

[0085] In some examples, the reinforcing section 52 can be made of hard alloy or ceramic material. For the reinforcing section 52 near the folding shaft, since it is subjected to a large friction and a certain impact during the operation of the equipment, the use of hard alloy material can ensure that there will be no obvious wear during long-term use, and provide stable and reliable support for the folding shaft mechanism 10.

[0086] In foldable electronic devices, weight is a key factor; lighter devices are easier for users to carry and operate. For example, in portable foldable tablets, a lighter support component 50 helps reduce the overall weight, improving user comfort when holding or placing the device, and reducing arm fatigue during prolonged use. The structural density of the reinforcing segment 52 in this embodiment is lower than that of the motherboard segment 51. When dealing with various stresses during the folding and unfolding process, such as bending and torsional forces, the low-density reinforcing segment 52 can still effectively disperse and withstand these forces, preventing stress concentration in specific areas that could lead to structural damage. This is analogous to using lightweight but high-strength materials as key support components in building structures, reducing overall weight while ensuring structural stability. In some examples, the reinforcing segment 52 can be made of titanium alloy, aluminum alloy, etc.

[0087] The second processing technology in this embodiment is the MIM (Metal Injection Molding) stainless steel process. The MIM stainless steel process enables high-precision molding of complex shapes. When manufacturing components such as the reinforcing section 52, it can accurately replicate the fine structures required by the design, such as bosses 522, cavities 55, and various connection structures. Dimensional accuracy can be controlled at the micrometer level, helping to ensure a tight fit between the reinforcing section 52 and the main board section 51, as well as other components. For example, in the support assembly 50 of a foldable electronic device, the reinforcing section 52 manufactured using the MIM stainless steel process can achieve a high-precision fit with the connection points of the base assembly 11 or the main board section 51, thereby ensuring accurate relative positioning of each component during folding and unfolding of the device, preventing additional stress or wear due to dimensional deviations. The MIM stainless steel material itself has high strength and rigidity. In the application of the reinforcing section 52, it can provide reliable support for the foldable electronic device. For example, during the folding process, the MIM stainless steel reinforcing section 52, located in a critical position, can effectively resist bending and torsional forces, preventing deformation of the support assembly 50 and ensuring the normal operation of the folding hinge mechanism 10. The yield strength and elastic modulus of stainless steel ensure that the reinforcing section 52 maintains its shape and performance under long-term stress, extending the service life of the support component 50. Furthermore, compared to amorphous materials, it has a lower density and lighter weight, meeting the requirements for lightweight construction.

[0088] According to another aspect of this application, a foldable electronic device is provided, comprising a folding hinge mechanism 10. The folding hinge mechanism 10 includes a base assembly 11 and a swing arm assembly mounted on the base assembly 11, and also includes the aforementioned support assembly 50, which is mounted on the base assembly 11. Specific portions of the swing arm are connected to a first housing and a second housing in a specific manner. The swing arm assembly and the base assembly 11 are fitted together using a shaft structure. The shaft structure ensures that the swing arm can rotate around a specific axis, much like a door rotating around a hinge, allowing the swing arm to change its position relative to the base within a certain angular range. Simultaneously, the shaft structure also allows the swing arm to slide during rotation. This sliding function increases the freedom of movement of the swing arm, enabling the device to more smoothly complete form changes during folding and unfolding. For example, in devices such as foldable mobile phones or tablets, when a user gradually folds the device from its unfolded state, the swing arm first rotates around the shaft structure. As the folding action continues, the swing arm slides along the shaft structure, precisely guiding the two housings of the device closer together and ultimately completing the folding action.

[0089] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A support assembly for a foldable electronic device, comprising: The foldable electronic device includes a folding hinge mechanism, the folding hinge mechanism including a base assembly and a swing arm assembly mounted on the base assembly, and a support assembly mounted on the base assembly, the support assembly including: A motherboard segment, which is mounted on the base assembly and extends along the length of the base assembly; A reinforcing section is installed on the base assembly. The position of the reinforcing section corresponds to a specific area of ​​the base assembly. A process connection structure is provided between the reinforcing section and the main board section. The reinforcing section and the main board section are connected through the process connection structure. The structural stiffness of the reinforcing section is greater than that of the main board section. The main board segment is manufactured using a first processing technology, and the reinforcing segment is manufactured using a second processing technology. The shrinkage rate of the first processing technology is less than that of the second processing technology.

2. The support assembly of claim 1, wherein, The first processing technology is amorphous injection molding. The process connection structure is disposed at the end of the reinforcing section. The process connection structure includes an injection molding connection structure. During the amorphous injection molding process, the injection molding connection structure is located in the mold of the amorphous injection molding process.

3. The support assembly of claim 2, wherein, The reinforcing section includes a reinforcing body and a boss located at the end of the reinforcing body. The first side and / or the second side of the boss are provided with a molding space for the amorphous material to be injection molded. The injection molding connection structure includes a protruding post provided on the boss. The protruding post is located in the molding space and is spaced apart from the reinforcing body.

4. The support assembly of claim 3, wherein, There are multiple protrusions, and the multiple protrusions are arranged at intervals.

5. The support assembly of claim 3, wherein, The first side and the second side of the boss are disposed opposite to each other. The boss also includes a third side and a fourth side disposed opposite to each other. The third side and / or the fourth side of the boss are provided with a cavity.

6. The support component as described in claim 5, characterized in that, The third side and / or the fourth side of the boss are provided with a stepped cavity, the width of which gradually increases in a stepped manner in the direction from the reinforcing section to the main board section.

7. The support component as claimed in claim 1, characterized in that, A recess is provided at the mating point between the upper end of the main board segment and the upper end of the reinforcing segment.

8. The support component as claimed in claim 7, characterized in that, A first chamfer is provided on the side of the upper end of the main board segment near the reinforcing segment, and a second chamfer is provided on the side of the upper end of the reinforcing segment near the main board segment. The upper surfaces of the first chamfer and the second chamfer form the bottom wall of the recess.

9. The support component as claimed in claim 1, characterized in that, There are two reinforcement sections, which are respectively connected to both ends of the main board section.

10. The support component as claimed in claim 1, characterized in that, Both the reinforcing segments and the main board segments are multiple, and a main board segment is set between two adjacent reinforcing segments.

11. The support component as claimed in claim 1, characterized in that, The wear resistance of the reinforced section is greater than that of the main board section.

12. The support component as claimed in claim 1, characterized in that, The structural density of the reinforcing segment is less than that of the main board segment.

13. The support component as claimed in claim 12, characterized in that, The second processing technology is the MIM stainless steel process.

14. A foldable electronic device, characterized in that, The foldable electronic device includes a folding hinge mechanism, the folding hinge mechanism including a base assembly and a swing arm assembly mounted on the base assembly, and further includes a support assembly as described in any one of claims 1-13, the support assembly being mounted on the base assembly.

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