A method for mounting a lens on a circuit board and an imaging device.

Abstract

This invention relates to a method for mounting a lens on a circuit board and an imaging device. The mounting method includes: obtaining a calibration plate; placing the lens above a second imaging sensor, with the end face of the lens barrel facing the mounting platform; adjusting the lens attitude and / or position until the second imaging sensor achieves a target imaging quality, and then obtaining the distance between the end face of the lens barrel and the mounting platform; obtaining a target cutting amount based at least on the distance between the end face of the lens barrel and the mounting platform and the depth of the mounting platform; cutting the end face of the lens barrel based on the target cutting amount, and then transferring the lens above the first imaging sensor; controlling the distance between the end face of the lens barrel and the upper surface of the first substrate to be no greater than 0.2 mm, and then fixing the end face of the lens barrel to the upper surface of the first substrate.

Description

Technical Field

[0001] This invention relates to the field of automotive lenses, and in particular to a method for mounting a lens on a circuit board and an imaging device. Background Technology

[0002] For automotive lenses, they mainly consist of a lens barrel and an optical module installed inside the lens barrel. The end face of the lens barrel needs to be fixed to the circuit board carrying the image sensor so that the optical module can transmit image light to the image sensor.

[0003] In existing technologies, the lens barrel end face is primarily fixed to the circuit board using adhesive. Due to the low thermal conductivity of the adhesive, the heat generated by the components on the circuit board is hindered from being conducted outwards, leading to heat buildup in the image sensor and a decrease in image quality. Furthermore, the adhesive's coefficient of thermal expansion is much greater than that of the circuit board and the metal lens barrel. In extreme automotive temperature environments (such as -40℃ and 105℃), the adhesive at the lens barrel end face can also generate internal stress due to mismatch, causing positional deviations in the lens barrel and its internal optical modules. This results in the optical module's focus deviating from the image sensor, further degrading image quality due to defocusing. Summary of the Invention

[0004] Therefore, it is necessary to provide a method for mounting a lens on a circuit board and an imaging device to address the problem of insufficient image quality stability of the image sensor on the circuit board after the lens is mounted on it.

[0005] A method for mounting a lens on a circuit board, wherein the lens includes a lens barrel and an optical module disposed within the lens barrel, and the circuit board includes a first substrate and a first imaging sensor disposed on the upper surface of the first substrate.

[0006] The installation method includes:

[0007] A calibration board is obtained, the calibration board including a second substrate and a second imaging sensor disposed on the upper surface of the second substrate, and a recessed platform disposed around the periphery of the second imaging sensor is also disposed on the upper surface of the second substrate;

[0008] The lens is positioned above the second imaging sensor, with the end face of the lens barrel facing the platform;

[0009] Adjust the lens attitude and / or position until the second imaging sensor achieves the target imaging quality, and then obtain the distance between the end face of the lens barrel and the stage.

[0010] The target cutting amount is obtained based at least on the distance between the end face of the lens barrel and the countersink, as well as the depth of the countersink.

[0011] The end of the lens barrel is cut based on the target cutting amount, and then the lens is moved above the first imaging sensor;

[0012] The distance between the end face of the lens barrel and the upper surface of the first substrate is controlled to be no greater than 0.2 mm, and then the end face of the lens barrel is fixed on the upper surface of the first substrate.

[0013] In some embodiments of this application, the total optical length of the optical module is designed to be TTL, the distance between the imaging surface of the first imaging sensor and the upper surface of the first substrate is d, and the distance between the imaging surface of the second imaging sensor and the upper surface of the second substrate is also d.

[0014] Before cutting the end of the lens barrel, the actual length of the lens barrel is greater than the theoretical required length L0, where L0 = TTL + d.

[0015] In some embodiments of this application, the thickness of the second substrate at the second imaging sensor is C, the thickness of the second substrate at the stage is A, and when the second imaging sensor achieves the target imaging quality, the distance between the end face of the lens barrel and the stage is B, wherein the target cutting amount ΔH = CAB.

[0016] After the lens is moved above the first imaging sensor, the end face of the lens barrel is controlled to fit against the upper surface of the first substrate, and then the end face of the lens barrel is fixed on the upper surface of the first substrate.

[0017] In some embodiments of this application, after the lens is moved above the first imaging sensor, it is first aligned with the center of the first imaging sensor by translation, and then moved down until the end face of the lens barrel is in contact with the upper surface of the first substrate.

[0018] In some embodiments of this application, the flatness of the first substrate and the second substrate is not greater than 0.05.

[0019] In some embodiments of this application, after the end face of the lens barrel is attached to the upper surface of the first substrate, the edge of the end face of the lens barrel is laser welded, reflow soldered and / or filled with metal particle adhesive and cured, so that the end face of the lens barrel is fixedly disposed on the upper surface of the first substrate.

[0020] In some embodiments of this application, the thickness of the second substrate at the second imaging sensor is C, the thickness of the second substrate at the stage is A, and when the second imaging sensor achieves the target imaging quality, the distance between the end face of the lens barrel and the stage is B.

[0021] After the lens is moved above the first imaging sensor, the distance between the end face of the lens barrel and the upper surface of the first substrate is controlled to be δ, and then the end face of the lens barrel is fixed on the upper surface of the first substrate.

[0022] Where 0.05mm≤δ≤0.2mm, the target cutting amount ΔH = CA-B+δ.

[0023] In some embodiments of this application, the flatness of the first substrate is greater than 0.05, and the flatness of the second substrate is not greater than 0.05.

[0024] In some embodiments of this application, after controlling the distance between the end face of the lens barrel and the upper surface of the first substrate to be δ, the lens barrel is first translated and / or rotated until the first imaging sensor reaches the target imaging quality, and then the end face of the lens barrel is fixed on the upper surface of the first substrate.

[0025] In some embodiments of this application, the end face of the lens barrel and the upper surface of the first substrate are fixed together by adhesive.

[0026] An imaging device includes a circuit board and a lens, the lens being mounted on the circuit board by the aforementioned mounting method.

[0027] The beneficial effects of this invention are as follows:

[0028] This invention, through the cooperation of the lens and calibration plate, determines the distance between the end face of the lens barrel and the stage when the distance between the light-incoming surface of the optical module and the imaging surface of the second imaging sensor is exactly equal to the actual value of the total optical length of the optical module, and then obtains the target cutting amount by combining the depth of the stage.

[0029] Then, only the end of the lens barrel needs to be cut based on the target cutting amount. When the distance between the light-gathering surface of the optical module and the imaging surface of the first imaging sensor is exactly the actual value of the total optical length of the optical module, the distance between the end face of the lens barrel and the upper surface of the first substrate is 0 or very small, much smaller than in the prior art. Accordingly, the end face of the lens barrel and the upper surface of the first substrate can ultimately achieve no glue or only a small amount of glue between them. Consequently, the adverse effects of glue on the imaging quality and imaging stability of the first imaging sensor during subsequent operation will be reduced or eliminated.

[0030] In summary, the imaging quality and imaging stability of the first imaging sensor of this invention can be improved in subsequent working processes compared with the prior art. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of a photographing device in the prior art;

[0032] Figure 2 These are schematic diagrams of the calibration plates in Embodiments 1 and 2 of the present invention;

[0033] Figure 3 The fitting relationship between the lens barrel and the calibration plate in Embodiments 1 and 2 of the present invention. Figure 1 ;

[0034] Figure 4 The fitting relationship between the lens barrel and the calibration plate in Embodiment 1 of the present invention. Figure 2 ;

[0035] Figure 5 This is a schematic diagram of the imaging device in Embodiment 1 of the present invention;

[0036] Figure 6 The fitting relationship between the lens barrel and the calibration plate in Embodiment 2 of the present invention. Figure 3 ;

[0037] Figure 7 This is a schematic diagram of the imaging device in Embodiment 2 of the present invention.

[0038] Figure label:

[0039] 1. Lens tube; 2. Circuit board; 21. First substrate; 22. Imaging sensor; 3. Calibration board; 31. Second substrate; 311. Stage; 32. Second imaging sensor; 4. Adhesive; 5. Solder. Detailed Implementation

[0040] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0041] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0044] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0045] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0046] Existing technology:

[0047] like Figure 1 As shown, in the prior art, the imaging device includes a circuit board 2 and a lens, with the lens mounted on the circuit board 2.

[0048] Specifically, the circuit board 2 includes a first substrate 21 and a first imaging sensor 22 disposed on the upper surface of the first substrate 21. The thickness of the first substrate 21 is C, and the distance between the imaging surface of the first imaging sensor 22 and the upper surface of the first substrate 21 is d.

[0049] The lens includes a lens barrel 1 and an optical module disposed inside the lens barrel 1. The optical module is positioned facing the first imaging sensor 22. The end face of the lens barrel 1 is fixed to the upper surface of the first substrate 21 by adhesive 4.

[0050] Due to manufacturing errors, there is a certain deviation between the designed total optical length and the actual total optical length of the optical module. Specifically, the designed total optical length is TTL, while the actual total optical length is TTL'. To ensure that the actual imaging quality of the first imaging sensor 22 meets the requirements, the distance between the light-receiving surface of the optical module and the imaging surface of the first imaging sensor 22 needs to be controlled to TTL'.

[0051] The lens barrel 1 has a theoretical required length L0, where L0 = TTL + d. In the prior art, the actual length of the lens barrel 1 is L1, where L1 < L0.

[0052] In the prior art, the method for mounting the lens on the circuit board 2 includes the following steps:

[0053] Step 101: Move the lens barrel 1 above the first imaging sensor 22 and position the optical module toward the first imaging sensor 22.

[0054] Step 101: Since the specific value of TTL' has not yet been obtained, it is necessary to control the lens barrel 1 to move down until the distance between the light-incoming surface of the optical module and the imaging surface of the first imaging sensor 22 is exactly equal to TTL. Since L1 < L0, the end face of the lens barrel 1 and the upper surface of the first substrate 21 are spaced apart at this time.

[0055] Step 102: After the distance between the light-inlet surface of the optical module and the imaging surface of the first imaging sensor 22 is exactly equal to TTL, the lens barrel 1 is adjusted (by means of translation, lifting and / or rotation) to change the position and / or attitude of the lens barrel 1 until the imaging quality on the first imaging sensor 22 reaches the target imaging quality. At this time, the distance between the light-inlet surface of the optical module and the imaging surface of the first imaging sensor 22 is equal to TTL'.

[0056] During the adjustment of the lens barrel 1, the first substrate 21 needs to avoid the lens barrel 1 through the gap between its upper surface and the end face of the lens barrel 1. Since the specific value of TTL' is not known before the adjustment of the lens barrel 1, it is impossible to determine in advance the actual distance and / or rotation angle that the lens barrel 1 needs to move during the adjustment process. In order to avoid the first substrate 21 interfering with the adjustment process of the lens barrel 1, the value of L1 is usually designed to be small, for example, it can be controlled to be 0.3mm≤L0-L1≤0.5mm, so that there is a large gap between the end face of the lens barrel 1 and the upper surface of the first substrate 21 before the adjustment. Therefore, even after the adjustment of the lens barrel 1 is completed, the gap between the end face of the lens barrel 1 and the upper surface of the first substrate 21 is often still large.

[0057] Step 103: Fix the end face of the lens barrel 1 and the upper surface of the first substrate 21 with glue 4.

[0058] Because the gap between the end face of the lens barrel 1 and the upper surface of the first substrate 21 is relatively large after the lens barrel 1 is adjusted, a large amount of adhesive 4 is used. Considering that adhesive 4 has low thermal conductivity and high coefficient of thermal expansion, adhesive 4 will cause a significant decrease in the imaging quality and imaging stability of the first imaging sensor 22 during subsequent actual operation.

[0059] Example 1:

[0060] To address the problems existing in the prior art, this embodiment increases the actual length of the lens barrel 1 before assembling it onto the circuit board 2, increasing the actual length of the lens barrel 1 to L2, where L2 > L0. Based on this, this embodiment provides a method for mounting a lens on the circuit board 2, including the following steps:

[0061] Step 201: Obtain calibration plate 3.

[0062] like Figure 2 As shown, the calibration plate 3 includes a second substrate 31 and a second imaging sensor 32 disposed on the upper surface of the second substrate 31. The upper surface of the second substrate 31 is also provided with a recessed platform 311 surrounding the second imaging sensor 32.

[0063] The specifications of the second imaging sensor 32 are consistent with those of the first imaging sensor 22, including its model, size, and imaging surface position. Therefore, the distance between the imaging surface of the second imaging sensor 32 and the upper surface of the second substrate 31 is also d. For example, the thickness of the second substrate 31 at the second imaging sensor 32 is C, and the thickness of the second substrate 31 at the recessed stage 311 is A, where C > A. Correspondingly, the depth of the recessed stage 311 is CA. The depth of the recessed stage 311 needs to match the difference between L2 and L0; the larger L2 - L0 is, the greater the depth of the recessed stage 311.

[0064] Preferably, the flatness of the second substrate 31 is not greater than 0.05.

[0065] Step 202: As Figure 3 As shown, the lens is placed above the second imaging sensor 32, and the end face of the lens barrel 1 is facing the stage 311. Then, the lens barrel 1 is controlled to move down until the distance between the light-inlet surface of the optical module and the imaging surface of the second imaging sensor 32 is exactly TTL.

[0066] As mentioned above, since the distance between the portion of the upper surface of the second substrate 31 at the second imaging sensor 32 and the imaging surface of the second imaging sensor 32 is d, the distance between the portion of the upper surface of the second substrate 31 at the second imaging sensor 32 and the light-gathering surface of the optical module is TTL+d, which is exactly equal to L0. Since L2>L0, the portion of the end of the lens barrel 1 corresponding to the axial length L2-L0 is located below the second imaging sensor 32, and the second substrate 31 avoids the end of the lens barrel 1 through the countersunk stage 311. As mentioned above, since the depth CA of the countersunk stage 311 matches L2-L0, it can be ensured that the end face of the lens barrel 1 and the countersunk stage 311 are spaced apart and the distance is large.

[0067] Step 203: As Figure 4 As shown, after the distance between the light-inlet surface of the optical module and the imaging surface of the second imaging sensor 32 is exactly equal to TTL, the lens barrel 1 is adjusted (by means of translation, lifting and / or rotation) to change the position and / or attitude of the lens barrel 1 until the imaging quality on the second imaging sensor 32 reaches the target imaging quality. At this time, the distance between the light-inlet surface of the optical module and the imaging surface of the second imaging sensor 32 is equal to TTL'.

[0068] During the adjustment of the lens tube 1, since there is a large gap between the end face of the lens tube 1 and the sinking stage 311, the sinking stage 311 will not interfere with the lens tube 1.

[0069] When the distance between the light-incoming surface of the optical module and the imaging surface of the second imaging sensor 32 is TTL', the distance between the end face of the lens barrel 1 and the stage 311 is B.

[0070] Step 204: Obtain the target cutting amount ΔH based at least on the distance B between the end face of the lens barrel 1 and the countersink 311 and the depth CA of the countersink 311.

[0071] In this embodiment, the target cutting amount ΔH = CAB. Since the lens barrel 1 may rotate during the adjustment process in step 203, the distance B corresponding to different positions at the end of the lens barrel 1 may differ after the adjustment is completed. Consequently, the target cutting amount ΔH corresponding to different positions at the end of the lens barrel 1 will also differ.

[0072] Step 205: Cut the end of the lens barrel 1 based on the target cutting amount ΔH, and then move the lens above the first imaging sensor 22.

[0073] The length cut at the end of the lens barrel 1 is ΔH. Therefore, after cutting, the actual length of the lens barrel 1 is reduced to L2-ΔH. In this embodiment, L2-ΔH=TTL'+d.

[0074] Step 206: As Figure 5 As shown, in this embodiment, the flatness of the first substrate 21 is also no greater than 0.05. Therefore, it is possible to control the end face of the cut lens barrel 1 to be in contact with the upper surface of the first substrate 21, that is, the distance between the end face of the lens barrel 1 and the upper surface of the first substrate 21 is 0 or nearly 0. Then, the end face of the lens barrel 1 can be fixed on the upper surface of the first substrate 21.

[0075] Since the actual length of the lens barrel 1 is L2-ΔH at this time, and the distance between the imaging surface of the first imaging sensor 22 and the upper surface of the first substrate 21 is d, the distance between the light-inlet surface of the optical module and the imaging surface of the first imaging sensor 22 is L2-ΔH-d. That is, the distance between the light-inlet surface of the optical module and the imaging surface of the first imaging sensor 22 is exactly equal to TTL'. In other words, after the cut end face of the lens barrel 1 is attached to the upper surface of the first substrate 21, the imaging quality of the first imaging sensor 22 can be guaranteed to meet the requirements, and there is no need to detect the imaging quality of the first imaging sensor 22 again.

[0076] Since the end face of the lens barrel 1 and the upper surface of the first substrate 21 are in direct contact without any adhesive 4 separating them, the heat generated by the components on the first substrate 21 during subsequent operation can be directly conducted to the outside through the metal lens barrel 1, reducing heat accumulation at the first imaging sensor 22. Simultaneously, since there is no adhesive 4 between the end face of the lens barrel 1 and the upper surface of the first substrate 21, the lens barrel 1 will not experience positional deviation due to the internal stress of the adhesive 4 during subsequent operation, thus maintaining the stability of the optical module's position. Based on these two factors, compared to the prior art, this embodiment can effectively maintain the imaging stability and imaging quality of the first imaging sensor 22 during operation.

[0077] For example, after the end face of the lens barrel 1 is bonded to the upper surface of the first substrate 21, the end face of the lens barrel 1 can be fixed to the upper surface of the first substrate 21 by laser welding, reflow soldering, and / or metal particle adhesive filling and curing on the edge of the end face of the lens barrel 1. Thus, in this embodiment, the end face of the lens barrel 1 has solder 5 around its periphery. Since the end face of the lens barrel 1 is bonded to the upper surface of the first substrate 21, the lens barrel 1 and the upper surface of the first substrate 21 can form a relatively sealed cavity, and the first imaging sensor 22 is located in this cavity. During welding and subsequent operations, the sidewall of the lens barrel 1 can effectively prevent the solder 5 from contacting the first imaging sensor 22 through means such as evaporation, thereby preventing the first imaging sensor 22 from being contaminated.

[0078] In this embodiment, since the flatness of both the first substrate 21 and the second substrate 31 is small (e.g., neither is greater than 0.05), and their flatness is matched, it is not necessary to rotate the lens barrel 1 before controlling the cut end face of the lens barrel 1 to be attached to the upper surface of the first substrate 21 in step 206. It is only necessary to align the optical axis of the lens barrel 1 with the center of the first imaging sensor 22 by translation. After the optical axis of the lens barrel 1 is aligned with the center of the first imaging sensor 22, the lens barrel 1 is controlled to move downward until the end face of the lens barrel 1 is attached to the upper surface of the first substrate 21.

[0079] This embodiment further provides a shooting device, including a circuit board 2 and a lens, wherein the lens is mounted on the circuit board 2 by the mounting method described above.

[0080] Example 2:

[0081] To address the problems existing in the prior art, this embodiment increases the actual length of the lens barrel 1 before assembling it onto the circuit board 2, increasing the actual length of the lens barrel 1 to L2, where L2 > L0. Based on this, this embodiment provides a method for mounting a lens on the circuit board 2, including the following steps:

[0082] Step 301: Obtain calibration plate 3.

[0083] like Figure 2 As shown, the specific structure and parameters of calibration plate 3 in this embodiment are the same as those in embodiment 1.

[0084] Step 302: As Figure 3 As shown, the lens is placed above the second imaging sensor 32, and the end face of the lens barrel 1 is facing the stage 311. Then, the lens barrel 1 is controlled to move down until the distance between the light-inlet surface of the optical module and the imaging surface of the second imaging sensor 32 is exactly TTL.

[0085] Step 303: As Figure 6As shown, after the distance between the light-inlet surface of the optical module and the imaging surface of the second imaging sensor 32 is exactly equal to TTL, the lens barrel 1 is adjusted (by means of translation, lifting and / or rotation) to change the position and / or attitude of the lens barrel 1 until the imaging quality on the second imaging sensor 32 reaches the target imaging quality. At this time, the distance between the light-inlet surface of the optical module and the imaging surface of the second imaging sensor 32 is equal to TTL'.

[0086] Step 304: Obtain the target cutting amount ΔH based at least on the distance B between the end face of the lens barrel 1 and the countersink 311 and the depth CA of the countersink 311.

[0087] Unlike Example 1, in this example, ΔH = CA-B+δ, where 0.05mm≤δ≤0.2mm.

[0088] Step 305: Cut the end of the lens barrel 1 based on the target cutting amount ΔH, and then move the lens above the first imaging sensor 22.

[0089] The length of the cut at the end of the lens barrel 1 is ΔH. After the cut, the actual length of the lens barrel 1 is reduced to L2-ΔH. Unlike Example 1, in this example, L2-ΔH=L2-(CAB)-δ=d+TTL'-δ.

[0090] Step 306: As Figure 7 As shown, after the lens is moved above the first imaging sensor 22, the distance between the end face of the lens barrel 1 and the upper surface of the first substrate 21 is controlled to be δ.

[0091] Correspondingly, at this time, the distance between the light-inlet surface of the optical module and the upper surface of the first substrate 21 is L2-ΔH+δ, that is, the distance between the light-inlet surface of the optical module and the upper surface of the first substrate 21 is d+TTL'. Since the distance between the imaging surface of the first imaging sensor 22 and the upper surface of the first substrate 21 is d, the distance between the light-inlet surface of the optical module and the imaging surface of the first imaging sensor 22 is exactly TTL'. Therefore, the imaging quality of the first imaging sensor 22 can be directly guaranteed.

[0092] In this embodiment, the flatness of the first substrate 21 and the second substrate 31 is relatively small (for example, neither is greater than 0.05).

[0093] Step 307: Fix the end face of the lens barrel 1 and the upper surface of the first substrate 21 with glue 4.

[0094] Since the distance between the end face of the lens barrel 1 and the upper surface of the first substrate 21 in this embodiment is δ, the thickness of the adhesive 4 is also δ, which is much smaller than the thickness of the adhesive 4 in the prior art. Accordingly, since the thickness of the adhesive 4 between the end face of the lens barrel 1 and the upper surface of the first substrate 21 in this embodiment is significantly reduced compared to the prior art, the adverse effects of the adhesive 4 on the imaging quality and imaging stability of the first imaging sensor 22 will also be reduced in subsequent operations.

[0095] This embodiment further provides a shooting device, including a circuit board 2 and a lens, wherein the lens is mounted on the circuit board 2 by the mounting method described above.

[0096] Example 3:

[0097] The difference between this embodiment and Embodiment 2 is that the flatness of the first substrate 21 is greater than 0.05. Since the flatness of the second substrate 31 is not greater than 0.05, the flatness of the first substrate 21 and the second substrate 31 does not match. Therefore, when the distance between the end face of the lens barrel 1 and the upper surface of the first substrate 21 is δ, the imaging quality of the first imaging sensor 22 cannot be directly ensured due to the influence of the flatness of the first substrate 21.

[0098] Therefore, after controlling the distance between the end face of the lens barrel 1 and the upper surface of the first substrate 21 to be δ, it is also necessary to translate and / or rotate the lens barrel 1 to fine-tune the imaging quality of the first imaging sensor 22, thereby eliminating the influence of the flatness of the first substrate 21 until the first imaging sensor 22 reaches the target imaging quality, and then fix the end face of the lens barrel 1 on the upper surface of the first substrate 21.

[0099] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for mounting a lens on a circuit board, wherein, The lens includes a lens barrel (1) and an optical module disposed within the lens barrel (1). The circuit board (2) includes a first substrate (21) and a first imaging sensor (22) disposed on the upper surface of the first substrate (21). The installation method is characterized by comprising: A calibration plate (3) is obtained. The calibration plate (3) includes a second substrate (31) and a second imaging sensor (32) disposed on the upper surface of the second substrate (31). A recessed platform (311) is also disposed on the upper surface of the second substrate (31) surrounding the second imaging sensor (32). The lens is placed above the second imaging sensor (32), and the end face of the lens barrel (1) is facing the stage (311). Adjust the attitude and / or position of the lens until the second imaging sensor (32) achieves the target imaging quality, and then obtain the distance between the end face of the lens barrel (1) and the sinking stage (311); The target cutting amount is obtained at least based on the distance between the end face of the lens barrel (1) and the countersink (311) and the depth of the countersink (311); The end of the lens barrel (1) is cut based on the target cutting amount, and then the lens is moved above the first imaging sensor (22); Control the distance between the end face of the lens barrel (1) and the upper surface of the first substrate (21) to be no greater than 0.2 mm, and then fix the end face of the lens barrel (1) on the upper surface of the first substrate (21).

2. The method for mounting a lens on a circuit board according to claim 1, characterized in that, The optical total length design value of the optical module is TTL, the distance between the imaging surface of the first imaging sensor (22) and the upper surface of the first substrate (21) is d, and the distance between the imaging surface of the second imaging sensor (32) and the upper surface of the second substrate (31) is also d. Before cutting the end of the lens barrel (1), the actual length of the lens barrel (1) is greater than the theoretical required length L0, where L0 = TTL + d.

3. The method for mounting a lens on a circuit board according to claim 1, characterized in that, The thickness of the second substrate (31) at the second imaging sensor (32) is C, the thickness of the second substrate (31) at the stage (311) is A, and when the second imaging sensor (32) achieves the target imaging quality, the distance between the end face of the lens barrel (1) and the stage (311) is B, wherein the target cutting amount ΔH=CAB; After the lens is moved above the first imaging sensor (22), the end face of the lens barrel (1) is controlled to be attached to the upper surface of the first substrate (21), and then the end face of the lens barrel (1) is fixed on the upper surface of the first substrate (21).

4. The method for mounting a lens on a circuit board according to claim 3, characterized in that, After the lens is moved above the first imaging sensor (22), it first moves to align the optical axis with the center of the first imaging sensor (22), and then moves down until the end face of the lens barrel (1) is in contact with the upper surface of the first substrate (21).

5. The method for mounting a lens on a circuit board according to claim 3, characterized in that, The flatness of the first substrate (21) and the second substrate (31) is not greater than 0.

05.

6. The method for mounting a lens on a circuit board according to claim 3, characterized in that, After the end face of the lens barrel (1) is attached to the upper surface of the first substrate (21), the edge of the end face of the lens barrel (1) is laser welded, reflow soldered and / or filled with metal particle glue and cured so that the end face of the lens barrel (1) is fixedly set on the upper surface of the first substrate (21).

7. The method for mounting a lens on a circuit board according to claim 1, characterized in that, The thickness of the second substrate (31) at the second imaging sensor (32) is C, the thickness of the second substrate (31) at the stage (311) is A, and when the second imaging sensor (32) achieves the target imaging quality, the distance between the end face of the lens barrel (1) and the stage (311) is B. After the lens is moved above the first imaging sensor (22), the distance between the end face of the lens barrel (1) and the upper surface of the first substrate (21) is controlled to be δ, and then the end face of the lens barrel (1) is fixed on the upper surface of the first substrate (21). Where 0.05mm≤δ≤0.2mm, the target cutting amount ΔH = CA-B+δ.

8. The method for mounting a lens on a circuit board according to claim 7, characterized in that, The flatness of the first substrate (21) is greater than 0.05, and the flatness of the second substrate (31) is not greater than 0.

05.

9. The method for mounting a lens on a circuit board according to claim 8, characterized in that, After controlling the distance between the end face of the lens barrel (1) and the upper surface of the first substrate (21) to be δ, the lens barrel (1) is first translated and / or rotated until the first imaging sensor (22) reaches the target imaging quality, and then the end face of the lens barrel (1) is fixed on the upper surface of the first substrate (21).

10. The method for mounting a lens on a circuit board according to claim 7, characterized in that, The end face of the lens barrel (1) and the upper surface of the first substrate (21) are fixed together by glue (4).

11. A shooting device, characterized in that, It includes a circuit board (2) and a lens, the lens being mounted on the circuit board (2) by the mounting method as described in any one of claims 1-10.

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