A strip chip hot-pressing curing production device and method

Abstract

This invention relates to a strip chip thermosetting curing production equipment and method. The invention includes a feeding module; a rotary vacuum roller module, including a cylindrical roller body; a strip tension and drive module; a thermosetting curing module, including two sets of high-temperature thermosetting heads; and a multi-stage vision inspection module, including a first vision inspection component upstream of the thermosetting curing module, a second vision inspection component after each of the high-temperature thermosetting heads, and a third vision inspection component downstream of the thermosetting curing module, arranged sequentially along the strip's transport direction. These components are used to perform online appearance and position inspections of the strip before curing, during the thermosetting curing process, and after curing. This invention offers high space utilization, enables continuous and automated production, and simultaneously ensures the stability of the inlay curing quality.

Description

Technical Field

[0001] This invention relates to the field of chip curing production technology, and in particular to a strip chip hot pressing curing production equipment and method. Background Technology

[0002] In the field of chip packaging and inlay production, inlay curing is a critical core process, and its process stability directly affects product yield, production efficiency, and overall cost control. Currently, the mainstream inlay curing processes in the industry mainly adopt batch step-by-step conveyor systems or long-line hot-pressing production lines, in conjunction with corresponding transmission devices, heating devices, and testing devices to complete the production process.

[0003] In existing technologies, inlay curing equipment typically employs stepping conveyors or stop mechanisms for material handling, and the heating system often features a large number of conventional heating heads. The adhesive-coated substrate is cured by hot pressing in batches. To maintain process continuity, a complex intermediate buffer structure is required, along with multiple tension rollers and electrical control components, resulting in a cumbersome overall structure and low system integration. Specifically, existing technologies suffer from the following main shortcomings: a) Limited production efficiency: Batch step conveyor systems require frequent start-stop operations, and long-line hot pressing processes involve multiple material handling steps and long cycle times, with significant time consumption in intermediate buffering processes, resulting in a long overall production cycle. This makes it difficult to improve equipment throughput capacity and meet the demands of high-efficiency continuous production. b) High energy consumption: The conventional heating heads are numerous and have low heat utilization efficiency. The overall heat preservation performance of the equipment is limited, and the energy consumption per unit material processing is large, resulting in a long-term high level of comprehensive energy consumption of the system. c) Unreasonable equipment layout: The reliance on stepping conveyor mechanisms, batch processing stations and complex buffer structures results in a large overall length of equipment, a large footprint, low space utilization, and relatively demanding requirements for production site conditions. d) Complex structure and high cost: It requires a large number of high-temperature heating heads, tension rollers and supporting electrical control components, which not only significantly increases the equipment manufacturing cost, but also makes the installation and commissioning process complicated and time-consuming, and also increases the difficulty and cost of later maintenance. e) Insufficient process adaptability: Traditional equipment has limited flexibility in adjusting heating parameters, pressing time, etc., making it difficult to adapt to the production needs of different material types, material thicknesses, and product pitches. During batch processing, uneven pressure and heat distribution are likely to occur, which in turn affects product consistency. f) Each process is relatively independent, the system has poor linkage, the degree of automation is limited, the changeover and adjustment process is cumbersome, the production flexibility is insufficient, and it is difficult to meet the needs of parallel production of multiple varieties and specifications. g) High defect rate: During material transfer, the strip is prone to bending or shifting, and the positioning accuracy at the process connection is insufficient, which can easily lead to defects such as incomplete adhesive layer coverage, air bubbles, and misalignment, affecting the stability of product quality. At the same time, there is a risk of missed detection in the inspection process, insufficient data traceability, and the accuracy of defective product identification and marking needs to be improved.

[0004] To address the aforementioned issues, existing technologies have attempted improvements through localized optimizations, such as simplifying the conveyor path, replacing some conveyor belts with transfer rollers, or adding independent offline inspection equipment for defect screening. However, these improvements are mostly localized adjustments and fail to solve fundamental problems at the system level, such as complex equipment structure, high energy consumption, and discontinuous production processes. They still suffer from shortcomings such as a disconnect between inspection and production processes, the inability to adjust process parameters in real time, and limited improvement in space utilization. Summary of the Invention

[0005] Therefore, the present invention provides a strip chip hot pressing curing production equipment and method, which has a simpler structure, lower energy consumption, and higher space utilization, and can realize continuous and automated production while ensuring the stability of inlay curing quality.

[0006] To solve the above technical problems, the present invention provides a strip chip hot-pressing curing production equipment, comprising: The feeding module is used to convey the strip carrying adhesive dots and chips along a preset transport path; A rotary vacuum roller module, which is connected to the feeding module, includes an elongated roller body, a vacuum adsorption port arranged on the outer peripheral surface of the roller body, and a vacuum system connected to the vacuum adsorption port. The vacuum adsorption port is used to flatly adsorb the strip onto the outer peripheral surface of the roller body. The strip tension and drive module, in conjunction with the rotary vacuum roller module, is used to control the transmission speed and tension of the strip when the strip is adsorbed onto the outer peripheral surface of the roller body; A hot-press curing module is disposed on one side of the outer circumference of the rotary vacuum roller module. The hot-press curing module includes two sets of high-temperature hot-pressing heads arranged at intervals along the circumference of the roller body and a lifting drive mechanism that drives the high-temperature hot-pressing heads to reciprocate radially toward or away from the roller body. The high-temperature hot-pressing heads are independently temperature-regulated by a temperature control component and are suitable for continuously hot-press curing the strips adsorbed on the outer circumferential surface of the roller body. The multi-level visual inspection module includes a first visual inspection component arranged sequentially upstream of the hot-press curing module, a second visual inspection component after each of the high-temperature hot press heads, and a third visual inspection component located downstream of the hot-press curing module, along the transmission direction of the strip. It is used to perform online appearance and position inspection on the strip before curing, the strip during the hot-press curing process, and the strip after curing.

[0007] In one embodiment of the present invention, the feeding module includes a pre-bonding module and an intermediate buffer module. The pre-bonding module is used to bond the chip to the adhesive-coated strip. The intermediate buffer module includes a strip driving component and a guide adjustment component. The strip driving component is used to pull the strip for transmission, and the guide adjustment component is used to adjust the lateral position of the strip.

[0008] In one embodiment of the present invention, two sets of high-temperature hot press heads work together in an odd-even glue dot division mode. One set of high-temperature hot press heads is used to hot press and cure the odd-numbered glue dots and their corresponding chips on the strip, while the other set of high-temperature hot press heads is used to hot press and cure the even-numbered glue dots and their corresponding chips on the strip, so as to achieve time-division parallel curing when the strip passes through continuously.

[0009] In one embodiment of the present invention, the drum body is driven to rotate by a rotary motor, and the vacuum adsorption port adopts a plurality of vacuum holes distributed along the axial and circumferential directions of the drum body and is connected to a vacuum extraction system.

[0010] In one embodiment of the present invention, the first visual inspection component, the second visual inspection component, and the third visual inspection component are high-speed visual inspection components capable of adjusting their positions along the length and width of the strip; the visual inspection components analyze the acquired strip images based on pattern matching algorithms or chip contour recognition algorithms to obtain glue dot positions, chip positions, cutting track information, and alignment deviation information, and accordingly compensate and adjust the lateral position of the strip and the pressing position of the hot press head.

[0011] In one embodiment of the present invention, the production equipment further includes a code-reading and electrical performance testing module and a defective product marking module. The code-reading and electrical performance testing module is located downstream of the multi-level visual inspection module and is used to perform functional testing on the cured strips and output defective product information when the test result is unqualified. The defective product marking module includes an inkjet printer, an ink volume detection unit, and a code generation unit for generating traceable marks. The inkjet printer is used to print at the strip position corresponding to the defective product. The ink volume detection unit includes a liquid level sensor and a flow sensor, which are used to detect the ink tank remaining amount and the actual ink volume ejected by the printhead, respectively. When insufficient ink volume or inkjet abnormality is detected, an audible and visual alarm is triggered and the abnormal position is recorded.

[0012] In one embodiment of the present invention, the lifting drive mechanism adopts a linear motor module, a cylinder or an electric cylinder; the high-temperature hot press head is equipped with a heater and a temperature sensor.

[0013] In one embodiment of the present invention, the strip tension and drive module includes a plurality of first conveying rollers, a first tension roller, and a drive motor; The output and rewinding module includes multiple second conveyor rollers, a web guide, a second tension roller, a splicing table, and an output winding machine, all arranged on the winding path.

[0014] In one embodiment of the present invention, an electrostatic protection module is provided around the hot-press curing module, the electrostatic protection module including an ion generator and an anti-static brush.

[0015] This invention also provides a method for producing strip-chip thermosetting curing equipment, comprising: S1, the strip carrying adhesive dots and chips is conveyed to the rotary vacuum drum module through the feeding module, so that the strip is flat and adsorbed on the outer peripheral surface of the rotary vacuum drum under the action of the vacuum adsorption port; S2, the strip image is acquired through the first vision detection component, the lateral position of the strip is corrected according to the adhesive dot pattern and chip outline information, the pre-bonding position deviation between the adhesive dots and the chip is determined, and the position deviation information is sent to the central control system. S3 controls the drive module for the rotary vacuum roller and strip tension, causing the strip to rotate synchronously with the rotary vacuum roller. Each adhesive dot and chip on the strip passes through the high-temperature hot press heads of the hot press curing module in sequence, and continuous hot press curing is completed in the pressing zone formed between the high-temperature hot press head and the rotary vacuum roller. Among them, an odd-even adhesive dot division mode is adopted to control the two sets of high-temperature hot press heads to work together. One set of high-temperature hot press heads performs hot press curing on the odd-numbered adhesive dots and their corresponding chips on the strip, while the other set of high-temperature hot press heads performs hot press curing on the even-numbered adhesive dots and their corresponding chips on the strip. S4 uses a second vision detection component to perform online detection of the strip during the hot pressing curing process, monitors the chip pressing position, glue dot appearance and strip status in real time, and combines the temperature signal output by the temperature control component to perform closed-loop regulation of the temperature and pressure of the hot pressing head. S5. After the strip completes hot-press curing and leaves the hot-press curing module, the third vision inspection component and the code reading and electrical performance testing module are used to perform appearance re-inspection and electrical performance testing on each chip on the strip to obtain information on qualified and unqualified products. S6, Based on the information of the non-conforming products, print defect marks at the corresponding strip positions, and guide and rewind the strip through the output and rewinding module to form a finished rewinding product.

[0016] The technical solution of the present invention has the following advantages compared with the prior art: The present invention discloses a strip chip thermosetting curing production equipment and method that integrates feeding, pre-lamination, intermediate buffering, transmission and vacuum adsorption components, continuous thermosetting curing, multi-level visual online inspection, code encoding and full electrical performance inspection, online marking of defective products, and unloading and rewinding into a single continuous production chain. This enables the strip to run continuously on a preset transmission path, reducing the frequent start-stop and multiple handling steps in traditional step-by-step and batch processes, reducing cycle time loss and waiting time, thereby meeting the requirements of high-efficiency continuous production.

[0017] This invention employs a rotary vacuum roller module, which uses the vacuum adsorption port on the outer periphery of the roller to flatly adsorb the strip onto the outer peripheral surface of the roller body. This allows the strip to maintain a stable geometric reference and bonding posture during the curing section, effectively suppressing phenomena such as strip bending, warping, wrinkling, and local suspension. It also reduces defects such as incomplete adhesive layer coverage, air bubble inclusions, and chip misalignment caused by strip deformation, thereby improving curing consistency and appearance stability.

[0018] The strip tension and drive module of this invention controls the transmission speed and tension when the strip is adsorbed onto the outer circumferential surface of the roller, and works in a closed loop with the upstream and downstream conveying rollers, tension rollers, and winding tension to stabilize the stress state of the strip, reduce instantaneous displacement, slippage and tensile deformation caused by tension fluctuations, improve the synchronization of the strip in the curing, inspection, testing and winding processes, and reduce the risk of deviation, wrinkles and pitch drift.

[0019] This invention employs two sets of high-temperature hot-pressing heads arranged at intervals along the circumference of the roller, working collaboratively in an odd-even adhesive dot division mode. One set corresponds to odd-numbered adhesive dots and their chips, while the other set corresponds to even-numbered adhesive dots and their chips, enabling time-division parallel curing during continuous strip passage. This structure increases the effective curing frequency without increasing the strip dwell time, reduces the cycle pressure of single-head hot pressing, and is beneficial for maintaining sufficient curing and bonding stability at higher linear speeds.

[0020] In this invention, each high-temperature hot pressing head is independently temperature-regulated by a temperature control component, and the forming and releasing of the pressing zone is achieved through radial reciprocating motion of a lifting drive mechanism. Temperature, pressure, pressing time, and compensation parameters can be set according to the product material system, adhesive curing window, chip size, and pitch differences. Compared to traditional multi-heating head batch curing methods, this invention facilitates more refined management and rapid switching of process parameters, enhancing adaptability to various product types and specifications, and improving production flexibility.

[0021] This invention employs multi-level visual inspection throughout the pre-curing, curing, and post-curing stages, enabling online closed-loop correction and process quality control. A first visual inspection component is used for pre-curing inspection, a second visual inspection component for hot-press curing process inspection, and a third visual inspection component for post-curing re-inspection, forming a multi-stage online inspection path covering key quality nodes.

[0022] This invention incorporates a code-encoding and electrical performance testing module after multi-level visual inspection. This module performs functional testing on the cured strip and outputs information on defective products, achieving dual-channel identification of both appearance and electrical performance defects. Compared to solutions relying solely on visual sampling or offline testing, this invention improves defect detection coverage, reduces the risk of missed detections, and ensures functional consistency of the finished product after winding and unwinding.

[0023] The defective product marking module of this invention prints defective marks at corresponding positions on the strip based on the information of non-conforming products. It can also generate a combination of QR codes and character tags containing timestamps and test parameter codes, enabling real-time visualization and traceability of defective locations. This solution makes downstream sorting, rework, or scrapping more efficient, while providing a data foundation for process analysis, equipment diagnosis, and quality closed-loop improvement.

[0024] The defective product marking module of this invention integrates an ink level detection unit. It monitors the ink tank level and actual ink volume using a level sensor and a flow sensor, respectively. When the ink level is insufficient or there is an inkjet malfunction, an audible and visual alarm is triggered, and the location of the abnormality is recorded. This design reduces the risk of missed marking due to printhead clogging or ink shortage, ensuring the reliability and consistency of the marking process and further enhancing the integrity of the quality traceability chain. Attached Figure Description

[0025] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0026] Figure 1 This is a schematic diagram of the overall structure of the strip chip hot-pressing curing production equipment of the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of the rotary vacuum drum module of the present invention.

[0028] Figure 3 This is a schematic diagram of the structure of the high-temperature hot press head of the present invention and its working structure.

[0029] Figure 4 This is a schematic diagram of the internal structure of the high-temperature hot press head of the present invention.

[0030] Figure 5 This is a schematic diagram of the internal structure of the device of the present invention.

[0031] Explanation of reference numerals on the accompanying drawings: 100. Feeding module; 11. Intermediate buffer module; 200. Rotary vacuum roller module; 21. Roller body; 22. Vacuum adsorption port; 300. Belt tension and drive module; 400. Hot-press curing module; 41. High-temperature hot press head; 42. Lifting drive mechanism; 44. Heater; 45. Temperature sensor; 46. Electrostatic protection module; 500. Multi-level visual inspection module; 51. First visual inspection component; 52. Second visual inspection component; 53. Third visual inspection component; 600. Encoding and reading code and electrical performance testing module; 700. Defective Product Marking Module; 800. Discharge and rewinding module; 900. Strips carrying adhesive dots and chips. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0033] In this invention, when directions (up, down, left, right, front, and back) are described, it is only for the convenience of describing the technical solution of this invention, and does not indicate or imply that the technical features referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention.

[0034] In this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," "exceeding," etc., are understood to exclude the stated number; "above," "below," "within," etc., are understood to include the stated number. In the description of this invention, the terms "first" and "second" are used only to distinguish technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0035] In this invention, unless otherwise explicitly defined, the terms "setting," "installing," and "connecting" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium; a fixed connection, a detachable connection, or an integrally formed connection; a mechanical connection, an electrical connection, or a connection capable of mutual communication; or the internal connection of two components or the interaction between two components. Those skilled in the art can reasonably determine the specific meaning of the above terms in this invention based on the specific content of the technical solution.

[0036] Reference Figures 1 to 5 As shown, a strip chip thermosetting curing production equipment of the present invention includes: The feeding module 100 is used to convey the strip 900 carrying adhesive dots and chips along a preset transport path; The rotary vacuum roller module 200, which is connected to the feeding module 100, includes an elongated roller body 21, a vacuum adsorption port 22 arranged on the outer peripheral surface of the roller body 21, and a vacuum system connected to the vacuum adsorption port 22. The vacuum adsorption port 22 is used to flatly adsorb the strip on the outer peripheral surface of the roller body 21. The strip tension and drive module 300, in conjunction with the rotary vacuum roller module 200, is used to control the transmission speed and tension of the strip when the strip is adsorbed onto the outer peripheral surface of the roller body 21. A hot-press curing module 400 is disposed on one side of the outer circumference of the rotary vacuum roller module 200. The hot-press curing module 400 includes at least one set of high-temperature hot-press heads 41 arranged at intervals along the circumference of the roller body 21 and a lifting drive mechanism 42 that drives the high-temperature hot-press heads 41 to reciprocate radially toward or away from the roller body 21. The high-temperature hot-press heads 41 are independently temperature-regulated by a temperature control component and are suitable for continuously hot-press curing the strips adsorbed on the outer circumferential surface of the roller body 21. The multi-level visual inspection module 500 includes a first visual inspection component 51 arranged sequentially upstream of the hot-press curing module 400, a second visual inspection component 52 after each of the high-temperature hot press heads 41, and a third visual inspection component 53 located downstream of the hot-press curing module 400, along the transmission direction of the strip, for performing online appearance and position inspection on the strip before curing, the strip during the hot-press curing process, and the strip after curing, respectively. The code reading and electrical performance testing module 600 is located downstream of the multi-level visual inspection module 500. It is used to perform functional testing on the cured strip and output unqualified product information when the test result is unqualified. The defective product marking module 700 is located downstream of the code encoding and electrical performance testing module 600, and is used to print defective marks at the corresponding strip positions according to the non-conforming product information. The discharge and winding module 800 is located downstream of the defective product marking module 700 and is used to wind the marked strip into a roll.

[0037] After feeding and pre-lamination, the strip enters the intermediate buffer. It is vacuum-flattened and adsorbed on the outer periphery of the roller body 21 and runs continuously synchronously with the roller. The hot press head continuously heat-presses and cures the adhesive dots and chips above the roller. Subsequently, multi-level visual inspections are performed before, during, and after curing. Finally, coding and electrical performance are fully inspected. Defective products are marked online by the printing module and then rewound. This equipment addresses the problems of existing inlay curing processes, such as "limited efficiency, high energy consumption due to numerous heating heads, lengthy equipment due to complex buffer and tension mechanisms, high defect rate due to transmission offset and bending, and inability to achieve real-time closed-loop detection." It improves stability and yield through continuous conveying and online closed-loop detection control.

[0038] In one embodiment, the feeding module 100 includes a pre-bonding module and an intermediate buffer module 11. The pre-bonding module is used to bond the chip to the adhesive strip. The intermediate buffer module 11 includes a strip driving component and a guide adjustment component. The strip driving component is used to pull the strip for transmission, and the guide adjustment component is used to adjust the lateral position of the strip.

[0039] The pre-bonding module can adopt patent CN202411870440 (title: Transferring electronic components from a first carrier to a second carrier). This patent discloses an electronic component transfer device and method: the first carrier carries scattered components, and the second carrier carries electronic assemblies. The device accommodates and transports the two carriers, separating the components on the first carrier in a contact or non-contact manner and transferring them to the mounting position on the second carrier. During the process, two image acquisition devices are used to detect the mounting position of the electronic components and the positioning / orientation of the adhesive, and the relevant signals are sent to the control unit for confirmation.

[0040] In addition, the upstream unwinding and conveying system, consisting of a feeding winding machine, a web guide, and multiple conveyor rollers, works in conjunction with a strip end sensor and guide adjustment to monitor strip position, speed, and status, and to stop the machine in case of abnormalities. It also supports roll changing and splicing to receive new rolls, ensuring continuous material supply. The intermediate buffer module 11 serves as a transition between the feeding and vacuum rollers. It uses a strip drive assembly in conjunction with a vacuum adsorption device to smoothly feed the strip into the vacuum roller adsorption area. The guide adjustment assembly performs strip chip line alignment correction, improving positioning accuracy before entering the curing section.

[0041] In one embodiment, the two sets of high-temperature hot press heads 41 work together in an odd-even glue dot division mode. One set of high-temperature hot press heads 41 is used to hot press and cure the odd-numbered glue dots and their corresponding chips on the strip, while the other set of high-temperature hot press heads 41 is used to hot press and cure the even-numbered glue dots and their corresponding chips on the strip. The specific configuration parameters can be optimized and adjusted in combination with the glue curing critical conditions, strip length and width parameters, finished product output and machine speed, and process preset heating time to achieve time-sharing parallel curing when the strip passes through continuously.

[0042] In one embodiment, the roller body 21 is driven to rotate by a rotary motor, and the vacuum adsorption port 22 adopts a structure in which multiple vacuum holes are distributed along the axial and circumferential directions of the roller body 21 (the spacing and diameter of the vacuum holes can be flexibly adjusted according to the strip size, weight and adsorption requirements. For example, dense small holes are set for thin materials to ensure adsorption uniformity, and large holes are used for heavy materials and the hole distribution is optimized to enhance adsorption stability).

[0043] It should be noted that the vacuum adsorption ports 22 have multiple vacuum holes distributed in an X shape along the axial and circumferential directions of the roller, which work in conjunction with the vacuum system to achieve stable adsorption; the roller is driven to rotate by a motor, and the roller speed can be set by a program or a central control system to match the curing and testing cycle. The roller structure can integrate material handling and processing station. The strip enters the adsorption zone under the traction of the conveyor roller and continuously passes through the curing zone and the detection zone, reducing the cycle time loss caused by downtime and step conveying. The rollers can be made of high-temperature and wear-resistant materials (such as titanium alloys or equivalent heat-resistant materials) to adapt to hot pressing curing and high-speed friction conditions between the rollers and the strip, and to improve durability.

[0044] In one embodiment, the first visual inspection component 51, the second visual inspection component 52, and the third visual inspection component 53 are high-speed visual inspection components capable of adjusting their positions along the length and width of the strip. These visual inspection components analyze the acquired strip images based on pattern matching algorithms or chip contour recognition algorithms to obtain information such as glue dot positions, chip positions, cutting paths, and alignment deviations. Based on this information, they compensate and adjust the lateral position of the strip and the pressing position of the hot press head. For example: Pre-curing inspection: Based on pattern matching or component contour recognition, obtain information on glue dot position, component position, cutting track information and alignment deviation information to complete the initial screening of missing cores and missing glue, and provide a benchmark for subsequent hot pressing and positioning. Inspection during curing: Arranged after or beside each hot press head, it collects images of the strip status in real time, monitors the pressing position of the components and the appearance of the glue dots, and captures subtle changes under the influence of temperature; in odd-even division mode, it can perform inspection on products in odd and even rows respectively. Post-curing inspection: Verify the size of the adhesive dots and the deviation of their relative mounting positions, and re-inspect the appearance after curing to improve the reliability of the final inspection.

[0045] The visual algorithm can employ pattern matching, contour recognition, pattern recognition, or machine vision algorithms to identify defects such as incomplete adhesive layers, bubbles, misalignment, and foreign particles. With the cooperation of positioning reference and stable tension, the accuracy of adhesive dots and component mounting and bonding before and after curing can be controlled within a range of less than ±50 μm.

[0046] The code reading and electrical performance testing module 600 is located downstream of the visual inspection module. It is used to perform functional tests on the cured strip and output qualified and unqualified information. The defective product marking module 700 forms a traceable mark at the corresponding strip position based on the unqualified information.

[0047] Specifically, the code-encoding component supports UHF, HF and other code-encoding technologies, and provides standard and customized modes; the test unit adopts a 100% full inspection strategy and outputs defect judgment results.

[0048] In one embodiment, the defective product marking module 700 includes an inkjet printer, a coding generation unit, and an ink volume detection unit. The printed content may include traceable information such as timestamps and test parameter codes, and adopts a combination of QR codes and characters to accommodate both machine recognition and manual verification.

[0049] When a printhead becomes clogged or ink volume is insufficient, causing marking to fail, an audible and visual alarm is triggered and the abnormal location is recorded in the production log. If necessary, the marking can be re-applied at a subsequent workstation.

[0050] The ink level detection unit can use a dual detection method of liquid level sensor and flow sensor to monitor the ink tank remaining amount and the actual ink volume ejected by the printhead, respectively, in order to reduce the risk of missing labels. Copper ink printing technology can be used to reduce chemical waste and lower consumable costs.

[0051] In one embodiment, the high-temperature hot-press curing module 400 includes a high-temperature hot press head 41, a lifting drive mechanism 42, and a temperature control component, which can be used to perform hot-press curing on adhesive dots and their corresponding components during continuous strip movement. In one embodiment, the high-temperature hot press head 41 is configured with two to four units, of which two are main hot press heads and the others can be used as backup hot press heads. The specific configuration parameters can be optimized and adjusted according to the critical conditions for adhesive curing, the yield of finished products, and the preset heating time of the process. The two main hot press heads can work together in an odd-even adhesive dot division mode, with one unit corresponding to odd-numbered adhesive dots and components and the other unit corresponding to even-numbered adhesive dots and components. At the same time, the simultaneous, alternating, or parallel working modes can be selected according to process requirements. The hot press head is set above the rotating vacuum roller, with the pressing direction along the radial direction of the roller. The pressing surface of the hot press head is adapted to the outer peripheral surface of the roller where the strip is located to form a stable pressing zone. The hot press head is equipped with a heater 44 and a temperature sensor 45. The temperature control component is used to achieve independent temperature control and provide stable and uniform heat and pressure output during continuous strip movement.

[0052] The lifting drive mechanism 42 can be a linear motor module, a cylinder, an electric cylinder or an equivalent drive structure to achieve the reciprocating motion of the hot press head toward or away from the roller radially.

[0053] The heating area of ​​the hot press head is approximately 13 mm × 13 mm, the pressure range can be set to 0.1 N to 10 N, and the maximum temperature can be set to 200-600℃ ± 5 ℃; the coplanarity accuracy of the hot press head can be set to ± 5 μm / mm, and the terminal bonding accuracy can reach ± ​​50 μm / mm (the above parameters can be customized or modified or upgraded according to product specifications and production capacity, chip size and adhesive system).

[0054] In one embodiment, the strip tension and drive module 300 includes a plurality of first conveying rollers, a first tension roller, and a drive motor; The output and rewinding module 800 includes multiple second conveyor rollers, a guide roller, a second tension roller, a splicing table, and an output winding machine arranged on the winding path. Adjustable winding tension is achieved through force measuring rollers or tension feedback to ensure smooth winding and reduce deviation and wrinkles.

[0055] In one embodiment, an electrostatic protection module 46 is provided around the hot-press curing module 400, the electrostatic protection module 46 including an ion generator and an anti-static brush.

[0056] In one embodiment, the device may be configured with a main control computer and a graphical human-machine interface for realizing device start-up and shutdown, speed setting, vacuum setting, offset compensation, temperature and pressure parameter management, batch management, and recipe management. Preferably: 1) Supports one-click recall and storage of product formulas, and supports configuration of process flow and calibration steps; 2) Supports online real-time display of inspection images and results from each workstation, facilitating rapid defect location; 3) It has functions such as code error and fault prompts, parameter calibration prompts, preventive maintenance reminders, and fault diagnosis; 4) It has the functions of recording production history, process trajectory, batch information, and exporting statistical data; 5) Configure an emergency stop switch and multi-mode audible and visual alarms to distinguish between start-up, operation, fault, and maintenance states.

[0057] The supporting system may include a power supply system, a gas supply system, a vacuum extraction system, and a network storage system. Example parameters are as follows: 1) Power supply system: 400 V three-phase AC, rated current 16 A, residual current protection 30 mA, power consumption approximately 3.7 kVA; 2) Gas supply system: gas supply pressure is about 6 bar, equipped with air filter, and gas consumption is about 90 L / min; 3) Vacuum system: Vacuum level can be less than 0.2 bar; 4) Electrostatic protection: The electrostatic level in the chip placement area can be controlled to be less than 2.0 kV.

[0058] In one embodiment, the material requirements are as follows: The strip has a width of 35 mm to 180 mm, a thickness of 0.035 mm to 0.2 mm, a dimensional tolerance of ±0.2 mm, and thermal stability. Wafers or chips: dimensions 0.3 mm to 2 mm, thickness 0.075 mm to 0.150 mm; Adhesive: Thermosetting adhesive, compatible with thermosetting curing process windows.

[0059] This embodiment also provides a method for producing strip-chip thermosetting curing equipment, comprising: Step 1: Feeding and pre-lamination.

[0060] The feeding and pre-lamination module includes a feeding reel fixing assembly, a strip drive assembly, a sensing assembly, a guide adjustment assembly, and a pre-lamination assembly. The feeding reel is fixed to the unwinding shaft, and the strip is unwound by the conveyor rollers. The strip drive assembly pulls the strip for transmission and adjusts its position and speed. The sensing assembly monitors the strip status in real time, triggering automatic shutdown when a strip end or gap is detected for replacement with a new reel. For strips of different bandwidths, adjustable guide assemblies and vacuum buffer structures are used for adaptation and adjustment. The visual system is manually or semi-automatically adjusted to the center position of the component area, and the double-sided guide structure is fine-tuned to improve transmission accuracy. The entire machine is equipped with an ion generator and anti-static brushes covering each process area to control the surface charge of the strip to no more than 2.0 kV. Indicator lights and software cleaning warnings prompt ion generator maintenance. The pre-lamination assembly is used to bond components to the adhesive-coated substrate or strip.

[0061] Step 2: Intermediate buffer.

[0062] The intermediate buffer module 11 connects the feeding pre-bonding module and the vacuum roller module, including a strip drive assembly and a vacuum adsorption device; the strip is conveyed to the vacuum roller adsorption area by the strip drive assembly, and the positioning accuracy is improved by the strip chip line alignment method through the guide adjustment assembly, so as to provide a stable reference for subsequent hot pressing curing.

[0063] Step 3: Vacuum adsorption, tension control and visual inspection before curing.

[0064] After the strip enters the rotary vacuum drum, it is flattened and adsorbed by the X-shaped vacuum port and the vacuum system; the strip drive assembly, sensors, and tension control work together to ensure stable operation of the strip. The first-stage vision inspection assembly can be adjusted in the X and Y directions to adapt to the strip size specifications. It is used to verify the center position of the adhesive dots and the component, verify the accuracy of the adhesive dots and the component mounting position, and perform surface defects such as missing cores and missing adhesive, providing positioning basis for the hot pressing process.

[0065] Step 4: Hot pressing, heating and curing, and visual inspection during curing.

[0066] The final heating and curing module includes a hot pressing assembly, a lifting mechanism, a temperature control assembly, and a safety protection assembly. The hot pressing assembly is equipped with at least two main hot pressing heads and can be configured with a backup hot pressing head. The main hot pressing heads use an odd-even glue dot division mode to achieve continuous hot pressing and curing. The pressing surface of the hot pressing head is adapted to the outer circumference of the roller to cover the glue dots and component areas. The second-stage visual inspection assembly is used for online monitoring of the curing process, acquiring real-time images of the strip status and dynamically comparing the glue dot and component positions. The temperature control assembly monitors the temperature of the hot pressing heads in real time, prohibiting production from starting when the temperature has not reached the preset value. The lifting mechanism is driven by a direct-drive motor or a cylinder to achieve radial reciprocating pressure application of the hot pressing heads. Safety protection mechanisms include retracting the hot pressing heads to the parking position when the machine stops to prevent strip burnout; the heating system enters standby mode during long-term standby to reduce energy consumption; each hot pressing head has independent temperature control and can be set with temperature compensation values, which are stored in the sub-formula.

[0067] Step 5: Code encoding and reading test and visual re-inspection after solidification.

[0068] The third-stage visual inspection component is used for full-dimensional re-inspection after curing, verifying the size of the adhesive dots and the deviation of their relative mounting positions, and conducting secondary checks for missing cores and adhesive. The code-encoding test includes a code-encoding component and a test unit, supporting UHF, HF and other processes, and outputs pass / fail information in a 100% full inspection mode; when the test determines that it is unqualified, it triggers downstream marking actions to achieve closed-loop control of test triggering, position locking and instant printing.

[0069] Step 6: Mark defective products with inkjet printing.

[0070] The inkjet printing unit simultaneously prints the corresponding test results during strip transport; defective marks contain traceable information (such as timestamps and test parameter codes) in a combination of QR codes and characters. An emergency mechanism is in place: if printhead clogging or insufficient ink leads to marking failure, an audible and visual alarm is triggered, and the abnormal location is recorded. If necessary, the mark is reprinted at a subsequent workstation. Ink level and flow sensing are used to reduce the risk of missed markings. Copper ink printing technology can be used to reduce consumable costs and chemical waste.

[0071] Step 7: Unwind and rewind.

[0072] The unloading module includes a winding assembly, which is equipped with a tension roller, a web guide, and a conveyor roller. The winding tension is detected and controlled by a force measuring roller and can be adjusted according to production needs. Through the coordinated operation of the unloading roll, drive roller, lifting roller, tension roller, and the take-up roll and waste roll, the entire process of strip transmission and flat winding from unwinding to rewinding is achieved.

[0073] Optional configurations: Optional Configuration 1: UV Curing Lamp Module When it is necessary to accelerate ink drying or protect the chip from UV damage, a UV curing lamp module can be set up, and a suitable UV curing system can be selected according to the properties of the strip substrate and the ink coverage. The optimal combination can be determined through printing tests.

[0074] Optional Configuration 2: Electrostatic Protection Module 46 Multiple sets of ion generators and anti-static brushes are centrally installed in the final heating and curing module and the discharge module to control the surface charge of the strip to not exceed 2.0 kV, and maintenance management is achieved through indicator lights and software cleaning warnings.

[0075] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A strip chip hot-press curing production equipment, characterized in that, include: The feeding module (100) is used to convey the strip (900) carrying adhesive dots and chips along a preset transport path; A rotary vacuum roller module (200) is connected to the feeding module (100) and includes an elongated roller body (21), a vacuum adsorption port (22) arranged on the outer peripheral surface of the roller body (21), and a vacuum system connected to the vacuum adsorption port (22). The vacuum adsorption port (22) is used to flatly adsorb the strip on the outer peripheral surface of the roller body (21). The strip tension and drive module (300), in conjunction with the rotary vacuum roller module (200), is used to control the transmission speed and tension of the strip when the strip is adsorbed onto the outer peripheral surface of the roller body (21); A hot-press curing module (400) is disposed on one side of the outer circumference of the rotary vacuum roller module (200). The hot-press curing module (400) includes at least one set of high-temperature hot press heads (41) spaced apart along the circumferential direction of the roller body (21) and a lifting drive mechanism (42) for driving the high-temperature hot press heads (41) to reciprocate radially toward or away from the roller body (21). The high-temperature hot press heads (41) are independently temperature-regulated by a temperature control component and are suitable for continuously hot-press curing the strips adsorbed on the outer circumferential surface of the roller body (21). The multi-level visual inspection module (500) includes a first visual inspection component (51) arranged sequentially upstream of the hot-press curing module (400), a second visual inspection component (52) after each of the high-temperature hot press heads (41), and a third visual inspection component (53) downstream of the hot-press curing module (400) along the transmission direction of the strip. It is used to perform online appearance and position inspection of the strip before curing, the strip during the hot-press curing process, and the strip after curing.

2. The strip chip hot-pressing curing production equipment according to claim 1, characterized in that, The feeding module (100) includes a pre-bonding module and an intermediate buffer module (11). The pre-bonding module is used to bond the chip to the adhesive strip. The intermediate buffer module (11) includes a strip driving component and a guide adjustment component. The strip driving component is used to pull the strip for transmission, and the guide adjustment component is used to adjust the lateral position of the strip.

3. The strip chip hot-pressing curing production equipment according to claim 1, characterized in that, Two sets of high-temperature hot press heads (41) work together in an odd-even glue dot division mode. One set of high-temperature hot press heads (41) is used to hot press and cure the odd-numbered glue dots and their corresponding chips on the strip, while the other set of high-temperature hot press heads (41) is used to hot press and cure the even-numbered glue dots and their corresponding chips on the strip, so as to achieve time-sharing parallel curing when the strip passes through continuously.

4. The strip chip hot-pressing curing production equipment according to claim 1, characterized in that, The drum body (21) is rotated by a motor, and the vacuum adsorption port (22) has multiple vacuum holes distributed along the axial and circumferential directions of the drum body (21) and is connected to the vacuum pumping system.

5. The strip chip hot-pressing curing production equipment according to claim 1, characterized in that, The first visual inspection component (51), the second visual inspection component (52) and the third visual inspection component (53) are high-speed visual inspection components that can adjust their positions along the length and width of the strip. The visual inspection components analyze the acquired strip images based on pattern matching algorithms or chip contour recognition algorithms to obtain glue dot positions, chip positions, cutting track information and alignment deviation information, and accordingly compensate and adjust the lateral position of the strip and the pressing position of the hot press head.

6. The strip chip hot-pressing curing production equipment according to claim 1, characterized in that, The production equipment also includes a code reading and electrical performance testing module (600) and a defective product marking module (700). The code reading and electrical performance testing module (600) is located downstream of the multi-level visual inspection module (500) and is used to perform functional tests on the cured strips and output defective product information when the test result is unqualified. The defective product marking module (700) includes an inkjet printer, an ink volume detection unit, and a code generation unit for generating traceable marks. The inkjet printer is used to print at the strip position corresponding to the defective product. The ink volume detection unit includes a liquid level sensor and a flow sensor, which are used to detect the ink tank remaining amount and the actual ink volume of the printhead, respectively. When insufficient ink volume or inkjet abnormality is detected, an audible and visual alarm is triggered and the abnormal position is recorded.

7. The strip chip hot-pressing curing production equipment according to claim 1, characterized in that, The lifting drive mechanism (42) adopts a linear motor module, cylinder or electric cylinder; the high temperature hot press head (41) is equipped with a heater (44) and a temperature sensor (45).

8. The strip chip hot-pressing curing production equipment according to claim 1, characterized in that, The strip tension and drive module (300) includes multiple first conveying rollers, a first tension roller, and a drive motor; The output and rewinding module includes multiple second conveyor rollers, a web guide, a second tension roller, a splicing table, and an output winding machine, all arranged on the winding path.

9. The strip chip hot-pressing curing production equipment according to claim 1, characterized in that, An electrostatic protection module (46) is provided around the hot-press curing module (400), the electrostatic protection module (46) including an ion generator and an anti-static brush.

10. A method for producing strip chips by hot pressing and curing, characterized in that, The strip chip thermosetting curing production equipment according to any one of claims 1-9 includes: S1, the strip (900) carrying adhesive dots and chips is conveyed to the rotary vacuum roller module (200) through the feeding module (100), so that the strip is flattened and adsorbed on the outer peripheral surface of the rotary vacuum roller under the action of the vacuum adsorption port (22); S2, the strip image is acquired by the first vision detection component (51), the lateral position of the strip is corrected according to the glue dot pattern and chip outline information, the pre-bonding position deviation between the glue dot and the chip is determined, and the position deviation information is sent to the central control system. S3, control the drive of the rotary vacuum roller and the strip tension and drive module (300) to make the strip rotate synchronously with the rotary vacuum roller. Each glue dot and chip on the strip passes through the high temperature hot press head (41) of the hot press curing module (400) in sequence, and completes continuous hot press curing in the pressing zone formed between the high temperature hot press head (41) and the rotary vacuum roller. Among them, the odd and even glue dot division mode is adopted to control the two sets of high temperature hot press heads (41) to work together. One set of high temperature hot press heads (41) performs hot press curing on the odd numbered glue dots and their corresponding chips on the strip, and the other set of high temperature hot press heads (41) performs hot press curing on the even numbered glue dots and their corresponding chips on the strip. S4, the strips in the hot pressing curing process are detected online by the second vision detection component (52), the chip pressing position, glue dot appearance and strip status are monitored in real time, and the temperature and pressure of the hot pressing head are adjusted in a closed loop by combining the temperature signal output by the temperature control component. S5. After the strip completes hot-press curing and leaves the hot-press curing module (400), the third vision inspection component (53) and the code reading and electrical performance test module (600) are used to perform appearance re-inspection and electrical performance test on each chip on the strip to obtain information on qualified and unqualified products. S6, Based on the information of the non-conforming products, print defect marks at the corresponding strip positions, and guide and rewind the strip through the output and rewinding module to form a finished rewinding product.

Images