A power module and a power device

Abstract

This application discloses a power module and power device, relating to the field of electronic power technology. The power module includes a power section and a drive section. The power section includes a power chip, a package, and signal pins, with the package encapsulating the power chip. The signal pins are electrically connected to the power chip. The drive section includes a flexible circuit board and a drive circuit, with the drive circuit disposed on the flexible circuit board. The signal pins are detachably connected to the flexible circuit board and electrically connected to the drive circuit, which provides a drive level to the power chip through the signal pins. The design scheme of the power module provided in this application improves the maintainability of the power section and the drive section, and reduces parasitic inductance in the drive, thereby improving the switching characteristics of the power chip. Furthermore, it helps reduce thermal coupling between the power section and the drive section, improving the operational reliability of the drive circuit.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to a power module and power device. Background Technology

[0002] A power module is a functional module that combines power devices according to certain functions and then packages them into a whole. It is widely used in power equipment such as servo motors, frequency converters, or inverters. With the rapid development of electrification and digitalization in the energy industry, the application market for power modules has increased significantly.

[0003] Switching of power devices requires a driver circuit. Currently, the driver circuit is typically located on an external circuit board, with pins leading the power device to the outside of the power module to achieve interconnection between the power device and the driver circuit. However, with this interconnection method, the gate drive circuit is particularly susceptible to parasitic impedance and signal interference, thus affecting the switching characteristics of the power device. Furthermore, as the number of power devices in a power module increases, the number of pins used for connection to the driver circuit also increases, leading to increased assembly difficulty between the power module and the external circuit board. Summary of the Invention

[0004] This application provides a power module and power device to improve the assembly efficiency of power devices and drive circuits while ensuring the switching characteristics of power devices, thereby improving the power density of power devices.

[0005] Firstly, this application provides a power module comprising a power section and a drive section. The power section includes a power chip, a package, and signal pins, with the package encapsulating the power chip. The signal pins are electrically connected to the power chip. The drive section includes a flexible circuit board and a drive circuit, with the drive circuit disposed on the flexible circuit board. The signal pins are detachably connected to the flexible circuit board and electrically connected to the drive circuit, which provides a drive level to the power chip via the signal pins. By employing the power module design provided in this application, the power section and drive section are interconnected in a detachable manner. This not only enables rapid assembly of the power section and drive section, allowing them to be used as a single unit, but also allows for individual use of the power section and drive section to meet various application requirements in different scenarios. Furthermore, it facilitates the shortening of the drive path from the drive circuit to the power chip, reducing parasitic inductance and thus minimizing oscillations to ensure the switching characteristics of the power chip. Furthermore, it facilitates the modification of parameters in the drive circuit within the drive section, as well as the repair and replacement of components in both the power and drive sections. This improves the maintainability of the power module, increases yield, and reduces maintenance costs. Moreover, the separate structure of the power and drive sections effectively reduces thermal coupling between them, thereby mitigating the impact of temperature rise in the power section on the drive section and enhancing the operational reliability of the drive circuit.

[0006] Because flexible circuit boards are bendable, in one possible implementation of this application, the package includes a receiving groove, in which at least a portion of the flexible circuit board is received, and the flexible circuit board is detachably connected to the receiving groove. This allows the power section and drive section of the power module to be laid out as a whole, improving its installation convenience.

[0007] In one possible implementation of this application, the signal pin portion is located outside the package, and the signal pin is electrically connected to the drive circuit via internal traces on the flexible circuit board. This improves the ease of connection between the signal pin and the drive circuit.

[0008] In one possible implementation of this application, the driving circuit includes gate signal traces and source signal traces, which are stacked. This helps reduce signal interference between the gate and source signal traces, thereby improving the operational stability of the driving circuit. Additionally, in this application, the signal pins may include a first pin and a second pin, with the first pin electrically connected to the gate signal trace and the second pin electrically connected to the source signal trace. This allows the power chip to be connected to the driving loop, which helps reduce the trace length of the driving loop and thus reduce the parasitic inductance of the driving loop.

[0009] This application does not limit the manner in which the first and second pins are led out of the package. For example, the first and second pins can be led out from the same side of the package to the outside of the package, which helps reduce the space occupied by the power section. Furthermore, since flexible circuit boards are bendable, in one possible implementation, the first and second pins can also be led out from different sides of the package to the outside of the package. Therefore, the solution provided in this application can effectively improve the flexibility of signal pin configuration.

[0010] In one possible implementation of this application, the projection of the signal pin is located within the outline of the package projection along the thickness direction of the power section. This facilitates a reduction in the volume of the power section, and since the projection of the drive section in the aforementioned thickness direction is also located within the outline of the package projection, the overall volume of the power module formed by the drive section and the power section can be reduced.

[0011] In one possible implementation of this application, the power unit further includes a power pin electrically connected to the power chip, and the power pin is configured to support a current value greater than that supported by the signal pin. This allows the power pin to be used for the flow of large currents, thereby achieving the power conversion function.

[0012] In this application, the signal pins and power pins are led out from different sides of the package to the outside of the package. This helps to reduce mutual interference between the signal pins and power pins, thereby improving the operational stability of the power module.

[0013] In one possible implementation of this application, the driving circuit includes a driving chip and passive components. The driving chip is disposed on the surface of the flexible circuit board, and the passive components are disposed on the surface or inside the flexible circuit board. The driving chip and passive components are electrically connected through internal traces of the flexible circuit board to form a driving loop.

[0014] Secondly, this application also provides a power device, which includes a housing, a circuit board, and a power module as described in the first aspect. The circuit board and the power module are housed within the housing, and the power module is electrically connected to the circuit board. In the power device provided by this application, the power module has a smaller size, better structural reliability, and better junction temperature reliability of the chip, which is beneficial to improving the power density and operational reliability of the power device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a photovoltaic power generation system provided in an embodiment of this application;

[0016] Figure 2 A simplified structural diagram of a power device provided in an embodiment of this application;

[0017] Figure 3 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0018] Figure 4 This is a schematic diagram illustrating the layout of signal traces in a flexible circuit board according to an embodiment of this application.

[0019] Figure 5 This is another schematic diagram of the power module provided in the embodiments of this application;

[0020] Figure 6 This is another structural schematic diagram of the power module provided in the embodiments of this application;

[0021] Figure 7 This is another structural schematic diagram of the power module provided in the embodiments of this application;

[0022] Figure 8 This is another structural schematic diagram of the power module provided in the embodiments of this application;

[0023] Figure 9 This is another structural schematic diagram of the power module provided in the embodiments of this application.

[0024] Figure label:

[0025] 1000 - Photovoltaic modules; 2000 - Inverters; 3000 - Transformers; 4000 - Power grid; 5000 - Loads;

[0026] 100 - Power device; 10 - Housing; 20 - Circuit board; 30 - Power module;

[0027] 1-Power section; 101-Power chip; 102-Package; 1021-Receiving slot; 103-Signal pin; 104-Power pin; 2-Drive section;

[0028] 201-Flexible circuit board; 2011-Insulating layer; 202-Driver circuit; 2021-Driver chip; 2022-Passive components;

[0029] 2023 - Gate signal trace; 2024 - Source signal trace. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are only for illustrating relative positional relationships and do not represent actual scale.

[0031] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, the embodiments of this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the embodiments of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] Power devices are widely used in photovoltaic power generation systems, energy storage systems, and powertrain systems of new energy vehicles to convert current or voltage in these systems. Power devices can include inverters, microinverters, or optimizers in photovoltaic power generation systems; converters in energy storage systems; motor controllers, on-board chargers (OBCs), or microcontroller units (MCUs) in the powertrains of new energy vehicles; or blade power supplies for power stations.

[0033] Taking photovoltaic power generation systems as an example, Figure 1 This is a schematic diagram illustrating an application scenario of the photovoltaic power generation system provided in this application embodiment. The photovoltaic power generation system includes a photovoltaic module 1000, an inverter 2000, and a transformer 3000. The photovoltaic module 1000 is a DC power supply composed of solar cells connected in series or parallel, used to convert solar energy into DC electrical energy. The inverter 2000 is a DC-to-AC power device that converts the DC power output from the photovoltaic module 1000 into AC power for output to the transformer 3000. The transformer 3000 then transforms the AC power output from the inverter 2000 and connects it to the AC power grid 4000, thereby achieving grid connection of the photovoltaic power generation system. Alternatively, the AC power output from the inverter 2000 can be supplied to a load 5000 to power the load 5000.

[0034] Figure 2 A simplified structural diagram of a power device provided in an embodiment of this application. (Reference) Figure 2As shown, the power device 100 may include a housing 10 and a circuit board 20 and a power module 30 housed within the housing 10. The power module 30 is electrically connected to the circuit board 20. The power module 30 is the core component of the power device 100 that realizes the power conversion function. It may contain various power devices, which are connected in a certain functional combination and then packaged into a whole through a packaging process.

[0035] Circuit board 20 can be a printed circuit board (PCB), a flexible printed circuit board (FPC), or a rigid-flex PCB, etc. The drive circuits for the power devices in the power module 30 are typically located on circuit board 20. Multiple ports of the power devices can be led out to the outside of the power module 30 via pins to achieve electrical connection with the drive circuit on circuit board 20. Due to the relatively long trace length from the power device to the drive circuit, when the power of the power device is high, the drive circuit is particularly susceptible to parasitic impedance and signal interference, thus affecting the switching characteristics of the power device. Furthermore, as the number of power devices in the power module 30 increases, the number of pins electrically connected to circuit board 20 also increases, significantly increasing the assembly difficulty of the power module 30 and circuit board 20, thereby affecting the assembly efficiency of the power module 30 and circuit board 20.

[0036] To address these issues, intelligent power modules (IPMs) have been proposed. These modules integrate power devices and drive circuits to reduce parasitic interference from external traces, thereby improving the switching characteristics of the power devices and increasing assembly efficiency. However, the integrated design of intelligent power modules results in higher costs. Furthermore, since both the power devices and drive circuits are packaged, the parameters of the drive circuit are difficult to adjust, and failure of either the drive circuit or the power device will render the entire power module unusable. In addition, high-power devices generate significant heat, which can cause the temperature of the driving components in the drive circuit to rise. If this temperature exceeds the maximum tolerance of the driving components, it can lead to malfunctions in the drive circuit.

[0037] In view of this, the power module provided in this application interconnects the power section and the drive section by splicing them together. This reduces the impact of parasitics on the drive circuit, improves the assembly efficiency and maintainability of the power section and the drive section, and mitigates thermal coupling in the power module, thereby ensuring reliable operation of the power module. To facilitate understanding of the solution provided in this application, a detailed description will be given below with reference to specific embodiments.

[0038] Figure 3This is a schematic diagram of a power module provided in an embodiment of this application. Figure 3 As shown in the figure, in this application, the power module includes two parts, namely a power section 1 and a drive section 2. The power section 1 includes a power chip 101 and a package 102. The package 102 encapsulates the power chip 101 to protect it.

[0039] In this application, the power chip 101 may include an integrated circuit (IC) chip, an insulated gate bipolar transistor (IGBT), a metal-oxide-semiconductor field-effect transistor (MOSFET), a diode, or a power transistor. Furthermore, the package form of the power chip 101 may be, but is not limited to, a small outline package (SOP), a dual in-line package (DIP), a quad flat no-leads package (QFN), a quad flat package (QFP), or a ball grid array package (BGA).

[0040] This application does not limit the packaging form of the power unit 1. Figure 3 In the illustrated embodiment, the power unit 1 employs a molding package. Molding packaging involves placing a substrate carrying power devices such as the power chip 101 into a dedicated injection mold, using softened epoxy resin or other molding compound as the encapsulation material, and encapsulating each power device under certain pressure and temperature conditions to protect the internal components. In other embodiments of this application, the power unit 1 may also employ a housing package or an embedded package. A housing package is a method that uses a housing and the substrate carrying the power devices such as the power chip 101 to form a cavity, and then fills the cavity with encapsulation materials such as silicone gel to form an encapsulation body to protect the power devices. An embedded package is a packaging process that embeds the power devices such as the power chip 101 into a substrate and uses vias, copper pillars, and traces for interconnection. Since the packaging processes for these various packaging methods are relatively mature, they will not be described in detail here.

[0041] You can continue to refer to Figure 3 The power unit 1 also includes a signal pin 103, which is electrically connected to the power chip 101, and a portion of the signal pin 103 is located outside the package 102 to bring the signal port of the power chip 101 to the outside of the package 102.

[0042] It is understood that the number of signal pins 103 can be the same as the number of signal ports of the power chip 101, so that the signal pins 103 and signal ports are connected in a one-to-one correspondence, thereby leading each signal port of the power chip 101 to the outside of the package 102, so as to realize the electrical connection between the power chip 101 and the external circuit.

[0043] In this embodiment, the driving unit 2 includes a flexible printed circuit (FPC) 201 and a driving circuit 202, wherein the driving circuit 202 is disposed on the flexible printed circuit 201. Since the flexible printed circuit 201 has bendable characteristics, it can meet the arrangement requirements under compact space conditions, thereby improving space utilization.

[0044] In this application, the signal pin 103 of the power unit 1 is detachably connected to the flexible circuit board 201. The detachable connection can be achieved through snap-fit, crimping, or threaded connection, among other methods. In some other embodiments, the signal pin 103 and the flexible circuit board 201 can also be fixedly connected by soldering.

[0045] In addition, the drive circuit 202 is electrically connected to the signal pin 103 to provide a drive level for the power chip 101, thereby driving and controlling the switching of the power chip 101 and performing related functional control.

[0046] In one possible embodiment of this application, the power chip 101 of the power unit 1 may be arranged in a half-bridge circuit configuration to achieve interconnection with the drive circuit 202 of the drive unit 2. In other possible embodiments of this application, the power chip 101 of the power unit 1 may also be arranged in other ways, such as a boost chopper circuit or a buck converter circuit, which can be designed according to actual needs.

[0047] You can continue to refer to Figure 3In this application, the driving circuit 202 may include a driving chip 2021 and a passive component 2022. The passive component 2022 may include, for example, a resistor, capacitor, inductor, or sensor. The driving chip 2021 is disposed on the surface of the flexible circuit board 201, and the passive component 2022 may be disposed on the surface or inside the flexible circuit board 201. Furthermore, the driving chip 2021 and the passive component 2022 may be routed through internal traces of the flexible circuit board 201. Figure 3 Electrical connections (not shown) are made to form a drive circuit 202.

[0048] It is understood that the driver chip 2021 can provide a drive level to the power chip 101 through the passive component 2022. This application does not limit the correspondence between the driver chip 2021 and the power chip 101. For example, one driver chip 2021 can provide a drive level to multiple power chips 101, or the driver chip 2021 and the power chip 101 can be electrically connected in a one-to-one correspondence, which can be specifically configured according to the actual function to be implemented.

[0049] In this application, in order to achieve the electrical connection between the drive circuit 202 and the signal pin 103, the drive unit 2 may further include a signal connection unit. Figure 3 (Not shown in the image), at least a portion of the signal connection is exposed on the outer surface of the flexible circuit board 201, and the signal connection is electrically connected to the drive circuit 202. Specifically, after the drive chip 2021 and the passive component 2022 are electrically connected to form the drive circuit 202, they can be electrically connected to the signal connection through the internal traces of the flexible circuit board 201.

[0050] This application does not limit the specific arrangement of the signal connection portion. Since the flexible circuit board 201 includes a conductive layer, in one possible embodiment, the signal connection portion can be a portion of the conductive layer visible from the outer surface of the flexible circuit board 201, wherein the conductive layer is electrically connected to the driving circuit 202. In other possible embodiments of this application, the signal connection portion can also be a pad disposed on the outer surface of the flexible circuit board 201 or a pin extending outside the flexible circuit board 201, etc. As long as it can serve the function of electrically connecting the driving circuit 202 and the signal pin 103, it is acceptable. These are not listed individually here, but they should all be understood to fall within the protection scope of this application.

[0051] The power module design provided in this application connects the power chip 101 to the drive circuit via the electrical connection between the signal pin 103 and the drive circuit 202. This reduces the trace length of the drive circuit, thereby reducing the parasitic impedance of the drive circuit and reducing oscillation, thus improving the operational stability of the power module.

[0052] Furthermore, since the power unit 1 and the drive unit 2 of this power module adopt a separate structure, it facilitates the modification of the parameters of the drive circuit 202 in the drive unit 2, as well as the repair and replacement of components in the power unit 1 and the drive unit 2. This improves the maintainability of the power module, increases the yield rate, and reduces maintenance costs. Moreover, the separate structure of the power unit 1 and the drive unit 2 effectively reduces thermal coupling between them, thereby reducing the impact of temperature rise in the power unit 1 on the drive unit 2 and improving the operational reliability of the drive circuit 202.

[0053] In addition, since the signal pin 103 is detachably connected to the flexible circuit board 201, it can not only enable the rapid assembly of the power unit 1 and the drive unit 2 so that the power unit 1 and the drive unit 2 can be used as a whole after assembly, but also enable the power unit 1 and the drive unit 2 to be used separately to meet various usage requirements in different scenarios.

[0054] As described above, in this application, the signal traces of the driving circuit 202 can be disposed on the flexible circuit board 201. Typically, the driving circuit 202 may include gate signal traces and source signal traces, which can both be disposed inside the flexible circuit board 201. For specific implementation details, please refer to... Figure 4 , Figure 4 This is a schematic diagram illustrating the layout of signal traces in a flexible circuit board according to an embodiment of this application. In this embodiment, the gate signal trace 2023 and the source signal trace 2024 are stacked, meaning that the gate signal trace 2023 and the source signal trace 2024 are respectively disposed in different layers of the flexible circuit board 201. Since adjacent trace layers in the flexible circuit board 201 are isolated by an insulating layer 2011, the gate signal trace 2023 and the source signal trace 2024 are also separated by the insulating layer 2011. This not only reduces the design difficulty of the signal traces in the driving circuit 202, but also effectively reduces the parasitic inductance of the driving loop, thereby reducing signal crosstalk between the gate signal trace 2023 and the source signal trace 2024, which is beneficial to improving the driving stability of the driving circuit 202.

[0055] Furthermore, it is understood that when the power unit 1 and the drive unit 2 are connected, the signal pin 103 of the power unit 1 may include a first pin and a second pin, wherein the first pin is electrically connected to the gate signal trace 2023 and the second pin is electrically connected to the source signal trace 2024. This allows the power chip 101 to be connected to the drive circuit, which helps to reduce the trace length of the drive circuit and thus reduce the parasitic inductance of the drive circuit.

[0056] This application does not limit the lead-out method of the first and second pins. For example, they can be led out from the same side of the package 102 to the outside of the package 102, which is beneficial to reducing the size of the power section 1 and even the entire power module. Considering that the flexible circuit board 201 has the characteristic of being bendable, in one possible embodiment, the first and second pins can also be led out from different sides of the package 102 to the outside of the package 102. Therefore, the power module design provided by this application is beneficial to improving the flexibility of the signal pins 103 of the power section 1.

[0057] It is understandable that the way signal pin 103 is led out from package 102 can be designed according to the package form adopted by power unit 1, the relative positional relationship between signal pin 103 and flexible circuit board 201, and the specific layout and usage requirements of the entire power module. For example, in... Figure 3 In the power module shown, signal pin 103 is led out from the side of package 102. Additionally, signal pin 103 can also extend along the stacking direction of power chip 101, that is... Figure 3 As shown, the pin is bent in the Y direction to facilitate the connection between the signal pin 103 and the flexible circuit board 201. Alternatively, the signal pin 103 may also employ, for example... Figure 5 , Figure 6 or Figure 7 The protrusions are led out to the outside of the package 102 as shown, and bent in different directions.

[0058] In the above Figures 3 to 7 In the illustrated embodiment, the signal pins 103 are all led out from the side of the package 102. In other embodiments of this application, the signal pins 103 may also be led out from the top surface of the package 102, or along the stacking direction of the power chip 101. For example, refer to... Figure 8 , Figure 8 This is another schematic diagram of the power module provided in an embodiment of this application. Figure 8 In the illustrated embodiment, along the stacking direction of the power chip 101, the projection of the signal pin 103 falls within the outline of the projection of the package 102. This allows the driver unit 2 and the power unit 1 to be stacked together when connected, which facilitates miniaturization of the overall power module design. Furthermore, it effectively shortens the path from the power chip 101 to the driver chip 2021, thereby reducing parasitic impedance and improving the switching characteristics of the power chip 101.

[0059] It is worth mentioning that, such as Figure 8As shown, the power unit 1 typically also includes a power pin 104, which is also electrically connected to the power chip 101. In this application, the power pin 104 is used to support a current value greater than that supported by the signal pin 103. Therefore, the power pin 104 can be used for the flow of large currents, such as currents above 100A, for power conversion. Conversely, the signal pin 103 can be used for the flow of small currents, such as currents below 10A, for receiving drive signals.

[0060] In this embodiment, the signal pin 103 and power pin 104 of the power unit 1 can be led out from different sides of the package 102, which helps to reduce signal interference between the signal pin 103 and the power pin 104 and facilitates the miniaturization design of the power module.

[0061] In the above embodiments, the detachable connection between the signal pin 103 and the flexible circuit board 201 is described using the example of the signal pin 103 extending outside the package 102. However, the detachable connection between the signal pin 103 and the flexible circuit board 201 is not limited to this. For example, in one possible embodiment, the signal pin 103 can be configured as a recess, while a protrusion electrically connected to the drive circuit 202 is provided on the surface of the flexible circuit board 201, so that the detachable connection between the signal pin 103 and the flexible circuit board 201 is achieved by the protrusion being inserted into the recess. In other possible embodiments, the signal pin 103 and the flexible circuit board 201 can also be detachably connected in any other possible way, which will not be listed here, but should all be understood to fall within the protection scope of this application.

[0062] In the power module provided in this application, to improve the structural reliability of the flexible circuit board 201, the flexible circuit board 201 can be connected to the power unit 1. For specific implementation, please refer to... Figure 9 , Figure 9 This is another structural schematic diagram of the power module provided in an embodiment of this application. In this embodiment, the package 102 includes a receiving groove 1021, and at least a portion of the flexible circuit board 201 can be accommodated in the receiving groove 1021, and the flexible circuit board 201 is detachably connected to the receiving groove 1021.

[0063] It is understandable that, since the flexible circuit board 201 has the characteristic of being bendable, it can be bent and accommodated in the receiving groove 1021, which is beneficial to improving the connection flexibility between the flexible circuit board 201 and the power unit 1.

[0064] In this application, the connection method between the flexible circuit board 201 and the power unit 1 is not limited to this. For example, in... Figure 9In the illustrated embodiment, at least a portion of the flexible material layer 201 is laid in the receiving groove 1021 along its width direction; while in other embodiments, the flexible material layer 201 may also be inserted into the receiving groove 1021 along its thickness direction.

[0065] In addition to the above-mentioned method of setting the receiving groove 1021, the flexible circuit board 201 and the package 102 can also be connected by setting a spring on the surface of the package 102 in some possible embodiments. The various possible settings will not be listed one by one here, but they should all be understood to fall within the protection scope of this application.

[0066] The power module described above, when applied to a power device, can be housed within the device's casing, and the power pins 104 of the power unit 1 can be directly connected to passive components such as capacitors to achieve power conversion. This reduces the space occupied by the power module within the casing, allowing for the installation of more power modules without altering the overall size of the power device, thereby improving the power density of the device.

[0067] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions between different embodiments are consistent and can be referenced in each other. Technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.

[0068] It is worth mentioning that the chip 102 packaging solution described above in this application can be used not only for power module packaging, but also for other module packaging involving chips or other devices, such as the packaging of RF chips and power amplifiers in the antenna field, or intelligent control devices in the field of artificial intelligence, or the packaging of central processing units (CPUs) and graphics processing units (GPUs) in servers, etc., which will not be listed one by one here.

[0069] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power module, characterized in that, It includes a power unit and a drive unit, wherein: The power unit includes a power chip, a package, and signal pins; the package encloses the substrate and the power chip; the signal pins are electrically connected to the power chip. The driving unit includes a flexible circuit board and a driving circuit, the driving circuit being disposed on the flexible circuit board; the signal pin is detachably connected to the flexible circuit board, and the signal pin is electrically connected to the driving circuit; the driving circuit is used to provide a driving level for the power chip.

2. The power module as described in claim 1, characterized in that, The package includes a receiving groove, in which at least a portion of the flexible circuit board is received, and the flexible circuit board is detachably connected to the receiving groove.

3. The power module as described in claim 1 or 2, characterized in that, The signal pin is located outside the package, and the signal pin is electrically connected to the drive circuit through the internal traces of the flexible circuit board.

4. The power module as described in any one of claims 1 to 3, characterized in that, The driving circuit includes gate signal traces and source signal traces, which are stacked together. The signal pins include a first pin and a second pin. The first pin is electrically connected to the gate signal trace, and the second pin is electrically connected to the source signal trace.

5. The power module as described in claim 4, characterized in that, The first pin and the second pin are led out from the same side of the package to the outside of the package; or the first pin and the second pin are led out from different sides of the package to the outside of the package.

6. The power module as described in any one of claims 1 to 5, characterized in that, Along the thickness direction of the power section, the projection of the signal pin lies within the outline of the projection of the package.

7. The power module according to any one of claims 1 to 6, characterized in that, The power unit further includes a power pin, which is electrically connected to the power chip. The power pin supports a current value that is greater than the current value supported by the signal pin.

8. The power module as described in claim 7, characterized in that, The signal pin and the power pin are led out from different sides of the package to the outside of the package.

9. The power module according to any one of claims 1 to 8, characterized in that, The driving circuit includes a driving chip and passive components. The driving chip is disposed on the surface of the flexible circuit board, and the passive components are disposed on the surface or inside the flexible circuit board. The driving chip and the passive components are electrically connected through the internal wiring of the flexible circuit board.

10. A power device, characterized in that, It includes a housing and a power module as described in any one of claims 1 to 9, wherein the power module is housed within the housing.

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