Epoxy resin composition, cured product thereof, prepreg, fiber-reinforced composite material, and fiber-reinforced composite material

By combining triphenylmethane-type phenol-derived epoxy resin with other epoxy resins and resorcinol curing agents in a specific ratio, the problems of hydrogen barrier properties, heat resistance and elongation of high-pressure gas containers are solved, resulting in high-performance cured products suitable for high-pressure hydrogen storage tanks.

CN122138991APending Publication Date: 2026-06-02MITSUBISHI GAS CHEM CO INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
MITSUBISHI GAS CHEM CO INC
Filing Date
2024-11-12
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing technologies cannot simultaneously meet the requirements of high hydrogen barrier properties, heat resistance, and high elongation for thermosetting resin compositions used in high-pressure gas containers.

Method used

An epoxy resin composition is formed by using a specific ratio of triphenylmethane-type phenol-derived epoxy resin and other epoxy resins, such as bisphenol F, bisphenol A, and phenolic varnish-type phenol-derived epoxy resin, combined with resorcinol as an epoxy resin curing agent, and adding appropriate amounts of curing accelerators and non-reactive diluents.

Benefits of technology

It achieves a solidified material with high hydrogen barrier properties, heat resistance and high elongation, suitable for high-pressure hydrogen storage tanks, improving the impact resistance and service life of the container.

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Abstract

Epoxy resin compositions, cured products thereof, prepregs using the epoxy resin composition, fiber-reinforced composites, and high-pressure gas containers. The aforementioned epoxy resin composition comprises epoxy resin (A) and epoxy resin curing agent (B), wherein the aforementioned epoxy resin (A) comprises a specified proportion of a specified epoxy resin (A1) and an epoxy resin (A2), and the aforementioned epoxy resin curing agent (B) comprises resorcinol (B1).
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