Notch detection device, resin molding device, resin molding product manufacturing method, and notch detection method

Abstract

The notch detection device includes: a mounting surface for a plate-shaped object with a notch, a sensor, and a processing unit. The sensor is configured to rotate relative to the outer periphery of the object mounted on the mounting surface about a predetermined rotation axis. During this rotation, it repeatedly measures the distance from the rotation axis to the outer periphery, acquiring a series of distance data along the circumferential direction. The outer periphery of the object, excluding the notch portion, extends in a manner forming a predetermined repeating pattern along the circumferential direction. The processing unit divides the series of distance data acquired by the sensor into multiple groups corresponding to the repeating pattern along the circumferential direction, and detects the position of the notch by comparing the divided distance data between groups.

Description

Technical Field

[0001] This invention relates to a notch detection device, a resin molding device, a method for manufacturing resin molded articles, and a notch detection method. Background Technology

[0002] Patent Document 1 discloses a resin molding apparatus for processing wafers. In Patent Document 1, the outer periphery of the wafer is provided with a notch, which is used to position the wafer placed in the lower mold during resin molding.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2020-107700 As illustrated in Patent Document 1, notches are sometimes provided for plate-shaped objects such as wafers. These notches can be used not only for positioning the wafers, but also for various other applications, such as identifying the individual chips mounted on the wafer based on the notch's location, thereby managing information related to each chip. To effectively utilize the notches in various applications, the notch's location needs to be accurately detected during the processing of wafers and other objects. Summary of the Invention

[0004] The purpose of this invention is to provide a notch detection device, a resin molding apparatus, a method for manufacturing resin molded articles, and a notch detection method that can accurately detect the location of notches in plate-shaped objects.

[0005] A notch detection apparatus according to one aspect of the present invention includes: a mounting surface of a plate-shaped object having a notch, a sensor, and a processing unit. The sensor is configured to rotate relative to the outer periphery of the object disposed on the mounting surface about a predetermined rotation axis. During this relative rotation along the outer periphery, the sensor acquires a series of distance data along the circumferential direction by repeatedly measuring the distance from the rotation axis to the outer periphery. The processing unit detects the position of the notch on the outer periphery of the object based on the series of distance data acquired by the sensor. The outer periphery of the object, excluding the notch portion, extends in a manner forming a predetermined repeating pattern along the circumferential direction. The processing unit divides the series of distance data along the circumferential direction into multiple groups corresponding to the repeating pattern, and detects the position of the notch by comparing the divided distance data between groups.

[0006] According to another aspect of the present invention, a resin molding apparatus includes the aforementioned notch detection device and a molding die. An object is positioned within the molding die such that a notch detected by the notch detection device is positioned at a predetermined location, and is then molded with resin within the molding die.

[0007] According to another aspect of the present invention, a method for manufacturing a resin molded article is a method for manufacturing a resin molded article using the above-described resin molding apparatus. The method includes: detecting the position of a notch using the notch detection device; placing an object in a molding die such that the notch detected by the notch detection device is positioned at a predetermined location; and molding the object with resin in the molding die to manufacture a resin molded article.

[0008] According to another aspect of the invention, a notch detection method includes: rotating a sensor relative to the outer periphery of a plate-shaped object having a notch about a predetermined rotation axis; during the relative rotation of the sensor along the outer periphery, acquiring a series of distance data along the circumferential direction by repeatedly measuring the distance from the rotation axis to the outer periphery by the sensor; and detecting the position of the notch on the outer periphery based on the series of distance data acquired by the sensor. The outer periphery of the object, excluding the notch portion, extends in a manner forming a predetermined repeating pattern along the circumferential direction. Detecting the position of the notch includes dividing the series of distance data along the circumferential direction into multiple groups corresponding to the repeating pattern, and detecting the position of the notch by comparing the divided distance data with each other between the groups.

[0009] Invention Effects According to the present invention, the location of a notch in a plate-shaped object can be accurately detected. Attached Figure Description

[0010] Figure 1 This is a schematic plan view of a resin molding apparatus according to one embodiment.

[0011] Figure 2 This is a top view of a substrate before resin molding, as described in one embodiment.

[0012] Figure 3 This is a schematic diagram showing the side view of a positioning mechanism according to one embodiment.

[0013] Figure 4 It is a schematic side cross-sectional view of a portion of a stamping module prior to mold closing according to one embodiment.

[0014] Figure 5 It is a schematic side cross-sectional view of a portion of a die-closed stamping module according to one embodiment.

[0015] Figure 6 yes Figure 4 VI-VI line cross-section.

[0016] Figure 7 This is a flowchart illustrating the process of a notch detection method according to one implementation.

[0017] Figure 8A It is an example of a graph showing a series of distance data along the circumference.

[0018] Figure 8B This is an example of a curve graph created by overlapping multiple groups of curve graphs.

[0019] Figure 8C This is an example of a graph that represents the average of multiple groups.

[0020] Figure 8D This is an example of a graph showing the absolute value of the deviation.

[0021] Figure 9 This is a top view of the substrate involved in the modified example.

[0022] Explanation of reference numerals in the attached figures 10: Resin molding apparatus; 147: Positioning mechanism; 150: Control unit (processing unit); 305: Molding mold; 320: Upper mold; 321: Pin; 340: Lower mold; 40: Rotary table; 41: Shaft; 42: Motor; 43: Sensor; 431: Light source; 432: Light receiver; 433: Frame; 60, 60A, 60B: Substrate (object); 61: Electronic component; 62: Substrate body; 63: Notch; P1: Outer perimeter; PT1~PT4: Repeating pattern; A1: Rotation shaft; C1: Substrate center; C2: Rotary table center; B1~B4: Arc portion; L1~L4: Straight portion; G1~G4: Group; R1: Resin material. Detailed Implementation

[0023] Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail using the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same symbols, and their descriptions will not be repeated. Additionally, for ease of understanding, objects are appropriately omitted or exaggerated in the drawings, and the depictions are schematic.

[0024] [1. Structure of the resin molding device] Figure 1 This is a schematic plan view of the resin molding apparatus 10 according to this embodiment. The resin molding apparatus 10 is configured to resin mold an object using resin material R1. As an example of the object, a substrate 60 on which multiple electronic components 61, such as semiconductor chips, are mounted can be cited. For example, in the resin molding apparatus 10, the surface of the substrate 60 on which the electronic components 61 are mounted is sealed with resin (resin molding) before resin molding, and a substrate 60 after resin molding is manufactured. In the following description, the substrate 60 before resin molding (the object to be molded) is sometimes marked with reference numeral 60A, and the substrate 60 after resin molding (the molded product) is marked with reference numeral 60B to distinguish between the two.

[0025] The substrate 60 is not limited to this; in this embodiment, it is a thin, plate-like component referred to as a wafer. The substrate 60 may be made of, for example, a semiconductor substrate such as a silicon wafer, a metal substrate, a resin substrate, a glass substrate, or a ceramic substrate. The substrate 60 may also be made of a carrier for FOWLP (Fan-Out Wafer Level Packaging). Wiring may or may not be implemented in the substrate 60.

[0026] Figure 2 This is a top view of substrate 60A before resin molding. (Example) Figure 2 As shown, substrate 60A includes a thin-plate substrate body 62 and multiple electronic components 61, such as semiconductor chips, integrated on the substrate body 62. A notch 63 is provided in substrate 60A. Figure 2 In this example, the notch 63 is formed in a V-shape. The notch 63 is a cut on the outer periphery P1 of the substrate 60A (i.e., the substrate body 62) to indicate the position and orientation of each electronic component 61 on the substrate body 62. Each electronic component 61 can be identified based on the position of the notch 63. In this embodiment, the notch 63 is used to position the substrate 60A, which is disposed within the molding die 305, during resin molding.

[0027] like Figure 1 As shown, the resin molding apparatus 10 includes a release film module 110, a resin module 120, a stamping module 130, a conveying module 140, and a control unit 150. Each module is configured to be detachable from adjacent modules. Furthermore, the resin molding apparatus 10... Figure 1 The example includes one stamping module 130, but it may also include two or more stamping modules 130.

[0028] The control unit 150 is configured to control the entire resin molding apparatus 10. For example, the control unit 150 controls the release film module 110, resin module 120, stamping module 130, and conveying module 140 respectively. The control unit 150 includes a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory) as hardware processors, and is configured to perform information processing based on programs and various data. The control unit 150 can also be implemented by multiple computers. The control unit 150 is typically arranged adjacent to modules 110, 120, 130, and 140, or arranged in the same housing as modules 110, 120, 130, and 140, but at least a portion of the control unit 150 can be arranged remotely. The control unit 150 is an example of a processing unit. The control unit 150 is connected to input devices (not shown), such as buttons and touch panels, and a display (not shown).

[0029] In the release film module 110, a release film 11 of the desired shape is formed. In the resin module 120, resin material R1 is supplied onto the release film 11. In this embodiment, the resin material R1 is a liquid resin, but it is not limited to this; for example, it may also be a powdered resin (granular resin). In addition, it is not limited to this, but the resin material R1 is typically a thermosetting resin.

[0030] In the stamping module 130, compression molding is performed with the substrate 60A, conveyed by the conveying module 140, and the release film 11, to which resin material R1 has been supplied, positioned in a predetermined location on the molding die 305. This produces a substrate 60B as a resin molded article. The substrate 60B is conveyed by the conveying module 140 and stored in a predetermined position (second storage section 146). Each module will be described in detail below.

[0031] The release film module 110 is configured to cut and separate a circular release film 11 from a long strip of release film. The release film 11 is used to prevent resin from adhering to the molding die 305 after compression molding in the stamping module 130, facilitating the removal of the substrate 60B from the molding die 305. As the material for the release film, resin materials with properties such as heat resistance, release properties, flexibility, and ductility can be used, such as PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, or polyvinylidene chloride.

[0032] The release film module 110 includes a moving mechanism 111, a film roll 112, and a film holder 113. The moving mechanism 111 is located between the film roll 112 and the film holder 113 in the Y-direction. The moving mechanism 111 is configured to move between the release film module 110 and the resin module 120. The moving mechanism 111 is capable of moving, for example, in the X-direction and the Y-direction, respectively.

[0033] A worktable 114 is disposed on top of the moving mechanism 111. The worktable 114 is a fixed platform for fixing the release film 11. The release film pulled out from the film roll 112 is fixed on the worktable 114. The film holder 113 is configured to pull out the release film from the film roll 112 and fix the front end of the pulled-out release film. The release film is cut with a cutter (not shown) on the moving mechanism 111 to form a circular release film 11. For example, the release film 11 can also be fixed on the worktable 114 by using a suction mechanism (not shown) such as a pressure reducing pump to suction through a suction hole (not shown) formed on the worktable 114.

[0034] The resin module 120 is configured to supply resin material R1 onto the release film 11 and to convey the release film 11, on which resin material R1 has been supplied, to a predetermined position on the molding die 305. The resin module 120 includes a supply mechanism 123, a resin loader 121, and a post-processing mechanism 122.

[0035] The supply mechanism 123 is configured to supply resin material R1 to the release film 11 disposed on the worktable 114 when the worktable 114 of the moving mechanism 111 is positioned below it. The supply mechanism 123 is capable of moving, for example, in both the X and Y directions. For example, the supply position of the resin material R1 on the release film 11 can be adjusted by moving the supply mechanism 123 during the supply of the resin material R1. Alternatively, the supply position of the resin material R1 on the release film 11 can also be adjusted by moving the worktable 114 of the moving mechanism 111 during the supply of the resin material R1. Preferably, the supply mechanism 123 is configured to move relative to the worktable 114 during the supply of the resin material R1.

[0036] The resin loader 121 and the post-processing mechanism 122 are, for example, integrally formed. The resin loader 121 and the post-processing mechanism 122 are configured to move between the resin module 120, the stamping module 130 and the conveying module 140 via the track 142.

[0037] The resin loader 121 is configured to hold the release film 11 by drawing the periphery of the release film 11, to which resin material R1 has been supplied, from above, and to move the release film 11 from the moving mechanism 111 to a predetermined position on the molding die 305. The post-processing mechanism 122 is configured to clean the molding die 305 and remove the release film 11 from the molding die 305 after compression molding using the molding die 305.

[0038] The transport module 140 transports the substrate 60A housed in the first receiving section 145 to a predetermined position in the molding die 305, and transports the substrate 60B (resin molded article) manufactured in the stamping module 130 to the second receiving section 146. The transport module 140 includes a substrate loader 141, a track 142, a robotic arm 143, the first receiving section 145, the second receiving section 146, and a positioning mechanism 147. In the transport module 140, the substrate 60 is transported, for example, by moving the substrate loader 141, which holds the substrate 60, along the track 142. The track 142 extends across various regions of the transport module 140, the stamping module 130, and the resin module 120.

[0039] The first storage section 145 is configured to store the substrate 60A before resin molding, and the second storage section 146 is configured to store the substrate 60B after resin molding. The robotic arm 143 removes the substrate 60A from the first storage section 145 and hands it over to the positioning mechanism 147.

[0040] Figure 3 This is a schematic diagram showing the side view of the positioning mechanism 147. (As shown) Figure 3 As shown, the positioning mechanism 147 includes a rotary table 40, a shaft 41, a motor 42, and a sensor 43. The positioning mechanism 147 is a mechanism that detects the position of the notch 63 in the outer periphery P1 of the substrate 60A and positions the substrate 60A in the rotational direction (circumferential direction). That is, in the positioning mechanism 147, the orientation of the substrate 60A in the rotational direction is adjusted based on the position of the notch 63. Then, the substrate 60A is transported to the molding die 305 by the robot arm 143 and the substrate loader 141 and placed inside the molding die 305. At this time, the robot arm 143 and the substrate loader 141 transport the substrate 60A while fixing the notch 63 in a predetermined position relative to themselves. Then, the substrate 60A is placed inside the molding die 305 with the notch 63 fixed in a predetermined position within the molding die 305. Thus, the rotational direction of the substrate 60A is positioned within the molding die 305.

[0041] The robotic arm 143 places the substrate 60A, which has been removed from the first storage section 145, onto the top surface (an example of the placement surface) of the rotary table 40. At this time, the substrate 60A is positioned on the rotary table 40 with the mounting surface of the electronic component 61 facing upwards. Furthermore, the robotic arm 143 places the substrate 60A on the rotary table 40 such that, in plan view, the center C1 of the substrate 60A and the center C2 of the rotary table 40 are approximately aligned. In this embodiment, the rotary table 40 is disk-shaped. The substrate 60A is larger than the rotary table 40 in plan view, and its outer periphery is exposed to the outside of the rotary table 40 throughout its entire circumference.

[0042] Below the rotary table 40, a shaft 41 is fixed coaxially with the rotary table 40. The shaft 41 is connected to a motor 42, and the rotary table 40 rotates around a predetermined rotation axis A1 by the motor 42 driving the shaft 41 to rotate. The rotation of the shaft 41 and the rotary table 40 is controlled by a control unit 150 connected to the motor 42. The rotation axis A1 passes through the center C2 of the rotary table 40 when viewed from above and extends in the vertical direction.

[0043] Sensor 43 includes a light source 431, a light receiver 432, and a frame 433. The frame 433 supports the light source 431 and the light receiver 432 in a spaced-apart and facing manner. The light receiver 432 detects the light emitted by the light source 431, provided there are no obstructions between them. The frame 433 is positioned to the side of the rotary table 40 such that the outer periphery of the substrate 60A mounted on the rotary table 40 is inserted between the light source 431 and the light receiver 432. For example, the light receiver 432 includes a plurality of light-receiving elements arranged in an array, with the plurality of light-receiving elements radially arranged with respect to the rotation axis A1. Alternatively, a plurality of light sources 431 may be provided, arranged in an array facing the arrangement of the light-receiving elements.

[0044] The sensor 43 is configured to rotate relative to the substrate 60A disposed on the rotary table 40 around the rotation axis A1. In this embodiment, the sensor 43 is fixed and the rotary table 40 rotates around the rotation axis A1. However, such relative rotation can also be achieved by rotating only the sensor 43 or by rotating both the sensor 43 and the rotary table 40.

[0045] The control unit 150 rotates the rotary table 40 on which the substrate 60A is placed. During this period (i.e., during the period when the sensor 43 rotates relative to the outer periphery P1 of the substrate 60A), the sensor 43 repeatedly measures the distance from the rotation axis A1 to the outer periphery P1 of the substrate 60A. More specifically, the control unit 150 emits light from the light source 431 while the light receiver 432 detects the intensity of the light. The amount of light received by the light receiver 432 will decrease if there is an object blocking the light between the light source 431 and the light receiver 432, relative to the amount of light from the light source 431. The more light is blocked, the less light is received by the light receiver 432. Here, as described above, the outer periphery of the substrate 60A is inserted between the light source 431 and the light receiver 432, which blocks the light from the light source 431 toward the light receiver 432. Therefore, the longer the distance from the rotation axis A1 to the outer periphery P1 of the substrate 60A, the more light is blocked, and the weaker the intensity of the light received by the light receiver 432. Conversely, the shorter the distance from the rotation axis A1 to the outer periphery P1 of the substrate 60A, the less light is blocked, and the stronger the light intensity received by the light receiver 432. Therefore, the light intensity data received by the light receiver 432 becomes distance data representing the distance from the rotation axis A1 to the outer periphery P1 of the substrate 60A. During the rotation of the substrate 60A around the rotation axis A1, the sensor 43 repeatedly acquires distance data by repeatedly measuring the light intensity received by the light receiver 432. Thus, the sensor 43 acquires a series of distance data along the circumferential direction with the rotation axis A1 as a reference. Based on the series of distance data acquired by the sensor 43, the control unit 150 detects the position of the notch 63 on the outer periphery P1 of the substrate 60A. Then, the control unit 150 positions the substrate 60A in the rotation direction (circumferential direction) by rotating the rotary table 40 to rotate the substrate 60A so that the detected notch 63 reaches a predetermined position.

[0046] Then, the robotic arm 143 retrieves the substrate 60A, which has been positioned in the rotational direction (circumferential direction) in the positioning mechanism 147, from the rotary table 40 and hands it over to the substrate loader 141. More specifically, the robotic arm 143 flips the substrate 60A, positioning it on top of the substrate loader 141. Thus, the substrate 60A is held by the substrate loader 141 with the mounting surface of the electronic component 61 facing downwards. The substrate loader 141 transports the substrate 60A from a predetermined position near the robotic arm 143 to a predetermined position in the molding die 305, keeping the mounting surface of the electronic component 61 facing downwards, and hands the substrate 60A over to the molding die 305.

[0047] Additionally, the substrate loader 141 keeps the mounting surface of the electronic component 61 facing downwards, and retrieves the resin-molded substrate 60B from the molding die 305, then transfers it to the robotic arm 143 indirectly or directly via other devices. Upon receiving the substrate 60B, the robotic arm 143 flips the substrate 60B over, storing it in the second storage section 146. Thus, the substrate 60B is stored in the second storage section 146 with the resin-molded surface facing upwards.

[0048] Figure 4 and Figure 5 This is a schematic side cross-sectional view of a portion of the stamping module 130. Figure 4 This indicates the state before mold closing. Figure 5 This indicates the state after mold closing. For example... Figure 4 and Figure 5 As shown, the stamping module 130 includes an outer frame component 301, a fixed pressure plate 310, a movable pressure plate 330, and a forming die 305. As an example of the forming die 305, a metal die can be cited. In this embodiment, the stamping module 130 manufactures a resin molded article (substrate 60B) using a so-called compression molding method. However, the resin molding method is not limited to this; the substrate 60B can also be manufactured using other methods, such as transfer molding, by replacing the stamping module 130 with other forming modules.

[0049] The outer frame component 301 is composed of connecting rods (columns) or fixing frames (plate components). When the outer frame component 301 is composed of connecting rods, for example, it consists of four connecting rods positioned at the four corners. The four connecting rods extend vertically. When the outer frame component 301 is composed of fixing frames, for example, it consists of two fixing frames positioned horizontally. The wide faces of each of the two fixing frames face each other in the horizontal direction.

[0050] The fixed pressure plate 310 is a rectangular plate-shaped component when viewed from above. The fixed pressure plate 310 is fixed to the upper part of the outer frame component 301. The movable pressure plate 330 is disposed inside the outer frame component 301, further below the fixed pressure plate 310. The movable pressure plate 330 is configured to move in the vertical direction. The movement of the movable pressure plate 330 is achieved, for example, by a mold-closing mechanism (not shown). The mold-closing mechanism is achieved, for example, by a combination of a servo motor and a ball screw, or a combination of a hydraulic cylinder and a linkage mechanism.

[0051] The molding die 305 includes an upper die 320 and a lower die 340. The molding die 305 is disposed inside the outer frame member 301 between a fixed pressure plate 310 and a movable pressure plate 330. More specifically, the upper die 320 is fixed to the lower surface of the fixed pressure plate 310, and the lower die 340 is fixed to the upper surface of the movable pressure plate 330. As the movable pressure plate 330 moves vertically, the lower die 340 also moves vertically together with the movable pressure plate 330. The molding die 305 closes when the movable pressure plate 330 rises.

[0052] The lower mold 340 includes a base plate 344, a bottom surface component 341, springs 343, and side surface components 342. The base plate 344 is a rectangular plate-shaped component when viewed from above. The base plate 344 is fixed to the upper surface of the movable pressure plate 330. The bottom surface component 341 is a rectangular block-shaped component when viewed from above. The bottom surface component 341 is fixed to the upper surface of the base plate 344 and is located approximately in the center of the base plate 344. The side surface component 342 is a frame-shaped component surrounding the bottom surface component 341. The side surface component 342 is fixed to the bottom surface component 341 by a plurality of springs 343.

[0053] The upper surface of the side member 342 is located above the upper surface of the bottom member 341, and a recess (cavity) is formed on the upper surface of the lower mold 340. A release film 11, containing resin material R1, is conveyed and disposed in this recess by the resin loader 121. A substrate 60A, transferred from the substrate loader 141, is disposed on the lower surface of the upper mold 320. At this time, the substrate 60A is held on the lower surface of the upper mold 320 by means of adsorption or the like, with the mounting surface of the electronic component 61 facing downwards. Furthermore, the control unit 150 controls the notch 63 on the lower surface of the upper mold 320 to be positioned at a predetermined location. In other words, the control unit 150 controls the orientation of the rotation direction (circumferential direction) of the substrate 60A held on the lower surface of the upper mold 320 based on the position of the notch 63 detected by the positioning mechanism 147, so that the orientation of the substrate 60A held on the lower surface of the upper mold 320 is a predetermined direction. Thus, the rotation direction of the substrate 60A is positioned within the molding die 305. Then, with the substrate 60A placed on the lower surface of the upper mold 320 and the release film 11 and resin material R1 placed in the recess of the lower mold 340, the molding die 305 is closed. Thus, the mounting surface of the electronic component 61 on the substrate 60A is sealed with resin. During resin sealing, the resin material R1 is appropriately heated using a heating mechanism (not shown).

[0054] Figure 6 yes Figure 4 A cross-sectional view along line VI-VI. (See attached image.) Figures 4-6As shown, a positioning pin 321 is provided on the lower surface of the upper mold 320. The substrate 60A is held on the lower surface of the upper mold 320 with the pin 321 aligned with the notch 63. More specifically, the substrate loader 141 delivers the substrate 60A to the upper mold 320 by means of the pin 321 entering the notch 63. As a result, during resin molding, movement, including rotation of the substrate 60A, is more reliably prevented within the molding die 305, resulting in more stable resin molding.

[0055] Furthermore, to more reliably prevent movement, including rotation of the substrate 60A, it is unnecessary to insert the pin 321 into the notch 63. For example, one or more holes can be formed near a preferred outer periphery of the substrate 60A, and one or more pilot pins provided on the upper mold 320 can be inserted into these holes. In this case, the control unit 150 can position the substrate 60A in the rotational direction on the lower surface of the upper mold 320 with the position of the notch 63 as a reference, and can position the pilot pins relative to the holes. Alternatively, as long as the substrate 60A is held firmly to a certain extent on the lower surface of the upper mold 320 by means of adsorption or the like, the positioning pins (including the aforementioned pin 321 and pilot pins) can be omitted.

[0056] Furthermore, with the mounting surface of the electronic component 61 facing upwards, the substrate 60A is placed in the recess of the lower mold 340. When resin material R1 is supplied to the substrate 60A, the molding die 305 can be closed. In this case, a positioning pin, similar to the aforementioned pin 321 or guide pin, can be provided in the lower mold 340.

[0057] [2. Shape details of the substrate] Below, refer to Figure 2 The shape of the substrate 60A in this embodiment will be described in detail. However, the shape of the object to which the present invention is applied is not limited to the shape of the substrate 60A described herein.

[0058] The substrate body 62 included in the substrate 60A has a notch 63. The outer periphery P1 of the substrate 60A (i.e., the substrate body 62), except for the portion with notch 63, extends in a manner that forms a predetermined repeating pattern circumferentially with reference to the center C1 when viewed from above. Figure 2 In the example, four identical patterns PT1 to PT4 are repeated in this order along the circumference. However, since pattern PT1 contains a notch 63, pattern PT1 has a different shape from the other patterns PT2 to PT4 only in the part with the notch 63.

[0059] Except for the notch 63, substrate 60A has a rotationally symmetrical shape when viewed from above. Figure 2In the example, the outer periphery P1 contains four patterns PT1 to PT4, which coincide with itself every 90 degrees of rotation, thus forming a four-fold symmetrical shape. That is, the rotational symmetry number is 4.

[0060] Patterns PT1 to PT4 each include arc portions B1 to B4 and straight portions L1 to L4. Arc portions B1 to B4 are all arcs with center C1 as the reference. Straight portions L1 to L4 extend in a straight line connecting the endpoints of two adjacent arc portions B1 to B4. However, a notch is cut into straight portion L1 at notch 63. The substrate 60A is also non-circular except for the portion with notch 63.

[0061] The shortest distance from the center C1 of the substrate 60A to the outer periphery P1 is the distance between the center C1 and the straight portions L1 to L4. Therefore, in this embodiment, the shortest distance from the center C1 to the outer periphery P1 is different from the distance from the center C1 to the notch 63 (the innermost end of the outline of the notch 63 in the radial direction).

[0062] If the sensor 43 described above is used, a series of distance data representing the distance from the rotation axis A1 to the outer periphery P1 of the substrate 60A can be acquired along the circumferential direction with the rotation axis A1 as a reference. Therefore, assuming that the substrate 60A is circular except for the portion with notch 63, by aligning the rotation axis A1 with the center C1 of the substrate 60A, the circumferential position corresponding to the data representing the shortest distance in the series of distance data can be determined as the position of notch 63. However, since the substrate 60A here is not circular, the position of notch 63 cannot be detected using the above algorithm. According to the method described below, the position of notch 63 can also be correctly detected for a non-circular substrate 60A.

[0063] [3. Manufacturing method of resin molded articles] Next, the manufacturing method of the resin molded article (substrate 60B) using the resin molding apparatus 10 will be described. During the manufacturing process of substrate 60B, the position of the notch 63 in substrate 60A is detected by the positioning mechanism 147 and the control unit 150 (an example of a notch detection device), and the rotation direction of substrate 60A is positioned. Figure 7 This is a flowchart illustrating the detection method for notch 63. The following will use... Figure 7 The manufacturing method of substrate 60B will be described, focusing on the processing shown.

[0064] First, when the resin molding apparatus 10 is commanded to begin manufacturing a resin molded article via the input device, the control unit 150 drives the robotic arm 143. The robotic arm 143 removes the substrate 60A from the first storage unit 145 and places the removed substrate 60A on the top surface of the rotary table 40 of the positioning mechanism 147. At this time, the robotic arm 143 aligns the substrate 60A so that its center C1 is approximately coincident with the center C2 of the rotary table 40. In this state, the process begins... Figure 7 The processing is shown.

[0065] In step S1, the control unit 150 drives the positioning mechanism 147 to acquire a series of distance data. More specifically, while rotating the rotary table 40 around the rotation axis A1 (while rotating the sensor 43 relative to the rotary table 40), the sensor 43 repeatedly measures the distance from the rotation axis A1 to the outer periphery P1 of the substrate 60A. In this embodiment, the rotary table 40 rotates at least one revolution, during which time the light source 431 emits light, and the intensity of the light emitted from the light source 431 is measured at short time intervals by the light receiver 432. Thus, a series of light intensity data is acquired; in other words, a series of distance data representing the distance from the rotation axis A1 to the outer periphery P1 is acquired. The series of distance data includes multiple data sets corresponding to data representing the angle around the rotation axis A1 and data representing the distance from the rotation axis A1 to the outer periphery P1 at that angle. Information related to the angle around the rotation axis A1 is acquired based on the rotational speed of the motor 42. These multiple datasets are acquired at small angular intervals between 0° and 360°. Therefore, the series of distance data acquired here becomes a series of data sets along the circumferential direction with the rotation axis A1 as the reference. In addition, although the series of distance data acquired by sensor 43 may be data from more than one rotation of the rotary table 40, the distance data from one rotation is used in the following calculations.

[0066] In the next step S2, the control unit 150 corrects the series of distance data acquired in step S1. The series of distance data acquired in step S1 is a set of data arranged circumferentially with the rotation axis A1 as the reference, that is, with the center C2 of the rotary table 40 as the reference. In step S2, it is transformed into a set of data arranged circumferentially with the center C1 of the substrate 60A as the reference. In addition, when the substrate 60A is placed on the rotary table 40, step S2 can be omitted as long as the center C1 of the substrate 60A and the center C2 of the rotary table 40 are consistent in top view, or even if they are not consistent, the degree of difference can be ignored.

[0067] By plotting the points represented by each dataset (representing paired data of angles and distances relative to center C2) contained in the series of distance data before transformation onto a polar coordinate plane, the shape of the outer periphery P1 of substrate 60A can be depicted. If the center coordinates of the depicted outer periphery P1 are determined, the coordinates of the center C1 of substrate 60A are calculated. The calculation of the center coordinates of the outer periphery P1 can be performed, for example, by geometric calculations or by pattern matching of an image. Then, by redrawing the points represented by the series of distance data before transformation onto a polar coordinate plane with the calculated center C1 as the origin (i.e., for each point, calculating the angle around center C1 and the distance from center C1), the series of distance data before transformation can be transformed into a series of data sets along the circumferential direction with center C1 as the reference. Furthermore, the method of transforming the origin of the polar coordinate system from center C2 to center C1 is not limited to the order described here, and various methods readily apparent to those skilled in the art can be used.

[0068] In subsequent steps S3 to S5, the position of the notch 63 in the outer periphery P1 of the substrate 60A is detected based on a series of distance data corrected in step S2. Alternatively, in steps S3 to S5, if step S2 is omitted, the same processing is performed on the series of distance data obtained in step S1. Figure 8A This is an example of a graph showing a series of distance data corrected in step S2. The horizontal axis represents the data number along the time series, and the vertical axis represents the distance from the center C1 to the outer perimeter P1. In other words, the horizontal axis represents the angle around the center C1, i.e., the circumferential direction. The control unit 150 divides the series of distance data corrected in step S2 into multiple groups along the circumferential direction, and detects the position of the gap 63 by comparing the divided distance data between groups.

[0069] In step S3, the control unit 150 divides the series of distance data corrected in step S2 into N groups along the circumferential direction. N is an integer greater than or equal to 2. Figure 8A In the example, a series of distance data is divided into four groups G1 to G4. These groups G1 to G4 correspond to... Figure 2 The repeating patterns PT1 to PT4 are shown. In this example, since the shape of substrate 60A is symmetrical four times, N = 4. However, N does not need to be the same as the rotational symmetry number of the shape of substrate 60A. For example, N can be an integer greater than 2, which is a divisor of the rotational symmetry number.

[0070] Each group G1 to G4 has M elements from the first to the Mth. M is an integer greater than or equal to 2. M can be the value obtained by dividing the number of data points (number of points) in a series of distance data by the number of groups N. In this case, if the number of data points is not divisible by N, the remainder data can be appropriately discarded. The discarded data may be, for example, the end data of the entire series of distance data, data near the boundary between groups, etc. In addition, even if the measurement parameters such as the rotation speed of the rotary table 40 or the light receiving interval of the light receiver 432 are preset so that the number of data points (one revolution of the rotary table 40) in a series of distance data is an integer multiple of N, a remainder may still occur. This is because the various commands for measurement from the control unit 150 are not necessarily issued at strictly equal intervals.

[0071] In the next step S4, the control unit 150 calculates the average distance represented by the N elements belonging to the N groups for each sequence from the first to the Mth element. That is, it calculates the average of the N first elements (distances) contained in each of the N groups, the average of the N second elements (distances), ..., and the average of the N Mth elements (distances). In other words, in step S4, the curves of the N groups segmented in step S3 overlap (refer to...). Figure 8B ), calculate the average of N points in each group that are in the same order along the horizontal axis (refer to Figure 8C ).

[0072] In the next step S5, the control unit 150 determines the element with the largest deviation from the average value calculated in step S4 among the N×M elements (distances) belonging to N groups. Figure 8DThis is a graph of the absolute values ​​of the deviations of N×M elements (distances). Here, the average value compared with each of the N×M elements is the average value calculated in step S4 from the first to the Mth average values, calculated in the same order as the element. That is, the difference is calculated by subtracting the average value of the first element calculated in step S4 from the distances represented by the N first elements contained in each of the N groups. Similarly, the difference is calculated by subtracting the average value of the second element from the distances represented by the N second elements, ..., and so on, until the difference is calculated by subtracting the average value of the Mth element from the distances represented by the N Mth elements. That is, in step S5, the element with the largest deviation is determined by subtracting the average value calculated in step S4 from the graphs of the N groups divided in step S3. The element with the largest deviation may be the element with the largest absolute value of deviation. In this case, the element with the largest absolute value of deviation is determined among the N×M elements (distances). Then, the control unit 150 detects the circumferential position of the element with the largest deviation determined in this way as the position of the gap 63. For example, the position of gap 63 is determined from the angle and distance represented by the distance data corresponding to the feature with the largest offset in a series of distance data corrected in step S2. Therefore, Figure 7 The processing is now complete.

[0073] After detecting the position of the notch 63, the control unit 150 again drives the positioning mechanism 147 to adjust the orientation of the rotation direction (circumferential direction) of the substrate 60A based on the detected position of the notch 63. More specifically, the rotary table 40 is rotated so that the notch 63 reaches the predetermined position along the circumference. Then, the robot arm 143 retrieves the substrate 60A with the notch 63 positioned adjusted from the rotary table 40 and transfers it to the molding die 305 via the substrate loader 141. The control unit 150 controls the robot arm 143 and the substrate loader 141 to place the substrate 60A in the molding die 305 in the predetermined position of the notch 63.

[0074] After the substrate 60A is placed inside the molding die 305, the control unit 150 closes the molding die 305. Then, the substrate 60A is molded with resin inside the molding die 305 to manufacture a resin molded article (substrate 60B). The control unit 150 controls the substrate loader 141 and the robotic arm 143 to retrieve the substrate 60B from the molding die 305 and store it in the second storage unit 146. Thus, the manufacturing of the resin molded article is completed.

[0075] [4. Characteristics] The resin molding apparatus 10 described above can accurately detect the position of the notch 63. As a result, the object (substrate 60A) with the notch 63 can be accurately positioned.

[0076] [5. Variations] The above embodiments are merely examples of the present invention in all respects, and the present invention is not limited to the above embodiments. Various modifications or alterations can be made to the above embodiments within the scope of the present invention. For example, the following variations can be made. The various technical features described herein can be appropriately combined within the spirit of the present invention.

[0077] <5-1> The shape of the object (substrate 60) other than the portion with notch 63 may not be rotationally symmetric. If a repeating pattern exists along the circumferential direction on the outer periphery P1 other than the portion with notch 63, the notch 63 can be correctly detected using the same method described above. For example, the shape of the object other than the portion with notch 63 may also be... Figure 9 The line shown is symmetrical. In this case, in step S3, the series of distance data is divided into two groups equally. In step S4, the curve of one group is inverted to overlap the curves of the two groups, and then the average value is calculated. Other than... Figure 7 The same process applies.

[0078] As another example, the shape of the object other than the portion with notch 63 can be circular. In this case, it can also be said that there is a repeating pattern along the circumferential direction on the outer perimeter P1 other than the portion with notch 63, and notch 63 can be correctly detected by the same method as described above.

[0079] <5-2> In the above embodiment, the position of the notch 63 in the substrate 60A before resin molding is detected, but the position of the notch 63 in the substrate 60B after resin molding can also be detected by the same method.

[0080] <5-3> In the above embodiment, the position information of the notch 63 detected is used to position the substrate 60A disposed within the molding die 305. However, the position information of the notch 63 can also be used for other purposes.

[0081] For example, the position of the notch 63 can be detected not only in scenarios where the substrate 60A is placed within the molding die 305, but also in any scenario where object positioning is required, and this information can be effectively used. For any scenario mentioned here, in addition to processes performed within the resin molding apparatus 10, it also includes processes before the substrate 60A is input into the resin molding apparatus 10 and processes after the substrate 60B is removed from the resin molding apparatus 10. For example, the position of the notch 30 can also be detected when the resin-molded substrate 60B is cut with a blade and then monolithically packaged into multiple packages. In this case, by fixing the position of the notch 30 in the resin-molded substrate 60B, erroneous cutting of the electronic component 61 is prevented.

[0082] Furthermore, each electronic component 61 mounted on the substrate 60 can be identified based on the position of the notch 63. Therefore, when managing information related to each electronic component 61 on the substrate 60, the position information of the notch 63 can also be effectively used. In this case, in any scenario where it is necessary to identify each electronic component 61, the position of the notch 63 can be detected by the above method, and the information can be effectively used.

[0083] [6. Postscript] <Technology 1> (constitute) A notch detection device, comprising: A mounting surface for placing plate-shaped objects with notches; A sensor is configured to rotate relative to the outer periphery of the object disposed on the mounting surface about a predetermined rotation axis, and during this relative rotation along the outer periphery, acquire a series of circumferential distance data by repeatedly measuring the distance from the rotation axis to the outer periphery; and The processing unit, based on the series of distance data acquired by the sensor, detects the position of the notch on the outer periphery. The outer perimeter, excluding the notched portion, extends in a manner that forms a prescribed repeating pattern along the circumference. The processing unit divides the series of distance data into multiple groups corresponding to the repeating pattern along the circumference, and detects the position of the gap by comparing the segmented distance data with each other in the groups.

[0084] (Effects, etc.) According to the gap detection device, the aforementioned series of distance data is divided into multiple groups along the circumference that correspond to the aforementioned repeating pattern. By comparing the divided distance data with each other between the groups, the position of the gap in the plate-shaped object can be accurately detected.

[0085] <Technology 2> (constitute) According to the notch detection device of technology 1, the object has a rotationally symmetrical shape except for the notch portion.

[0086] (Effects, etc.) According to this gap detection device, the position of the gap can be accurately detected for objects that are rotationally symmetrical except for the gap portion.

[0087] <Technology 3> (constitute) According to the notch detection device of technique 1 or 2, the object is non-circular except for the part with the notch.

[0088] (Effects, etc.) According to this gap detection device, the location of the gap can be accurately detected for objects that are not circular except for the gap portion.

[0089] <Technology 4> (constitute) According to any one of the techniques 1 to 3, in the notch detection apparatus, the shortest distance from the center of the object to the outer periphery is different from the distance from the center to the notch.

[0090] (Effects, etc.) According to this gap detection device, for objects where the shortest distance from the center to the outer perimeter is different from the distance from the center to the gap, the location of the gap can be detected correctly.

[0091] <Technology 5> According to any one of the techniques 1 to 4, in the notch detection apparatus, the processing unit corrects the series of distance data acquired by the sensor into a second series of distance data representing multiple distances from the center of the object to the outer periphery. For integers N and M greater than 2, the corrected second series of distance data is divided into N groups along the circumferential direction, each having the first to the Mth feature. For each sequence from the first to the Mth element, calculate the average value of the N elements belonging to the N groups respectively. Among the N×M elements belonging to the N groups, identify the element with the largest deviation from the average value corresponding to the same order in the sequence from the first to the Mth element. The circumferential position of the determined element is detected as the position of the gap.

[0092] <Technology 6> (constitute) A resin molding apparatus, comprising: The notch detection device according to any one of techniques 1 to 5; and Molding mold The object is positioned in the molding die such that the notch detected by the notch detection device is located at a predetermined position, and is then molded in the molding die with resin.

[0093] (Effects, etc.) According to this resin molding apparatus, the notch can be correctly positioned within the molding die during resin molding.

[0094] <Technology 7> (Configuration) A method for manufacturing a resin molded article, which is a method for manufacturing a resin molded article using the resin molding apparatus described in Technique 6, includes: The notch detection device detects the position of the notch; The object is positioned within the molding die such that the notch detected by the notch detection device is located at the predetermined position; and The object is molded with resin in the molding mold to manufacture the resin molded article.

[0095] (Effects, etc.) According to the manufacturing method of this resin molded article, the position of the notch in the plate-shaped object can be accurately detected, and the notch can be accurately positioned in the molding die based on the position of the notch.

[0096] <Technology 8> (constitute) A notch detection method, comprising: The sensor is rotated relative to the outer periphery of the plate-shaped object with a notch around a predetermined rotation axis; During the relative rotation of the sensor along the outer periphery, a series of distance data along the circumferential direction are acquired by repeatedly measuring the distance from the rotation axis to the outer periphery by the sensor; and Based on the series of distance data acquired by the sensor, the position of the notch on the outer periphery is detected. The outer perimeter, excluding the notched portion, extends in a manner that forms a prescribed repeating pattern along the circumference. Detecting the location of the gap includes: dividing the series of distance data into multiple groups corresponding to the repeating pattern along the circumference, and detecting the location of the gap by comparing the segmented distance data with each other between the groups.

[0097] (Effects, etc.) According to this gap detection method, the aforementioned series of distance data is divided into multiple groups along the circumferential direction corresponding to the aforementioned repeating pattern. By comparing the segmented distance data between groups, the position of the gap in the plate-shaped object can be accurately detected.

Claims

1. A notch detection device, comprising: A mounting surface for placing plate-shaped objects with notches; A sensor is configured to rotate relative to the outer periphery of the object disposed on the mounting surface about a predetermined rotation axis, and during this relative rotation along the outer periphery, acquire a series of circumferential distance data by repeatedly measuring the distance from the rotation axis to the outer periphery; and The processing unit, based on the series of distance data acquired by the sensor, detects the position of the notch on the outer periphery. The outer perimeter, excluding the notched portion, extends in a manner that forms a prescribed repeating pattern along the circumference. The processing unit divides the series of distance data into multiple groups corresponding to the repeating pattern along the circumference, and detects the position of the gap by comparing the segmented distance data with each other in the groups.

2. The notch detection device according to claim 1, wherein, The object, except for the notched portion, has a rotationally symmetrical shape.

3. The notch detection device according to claim 1 or 2, wherein, The object is non-circular except for the part with the notch.

4. The notch detection device according to any one of claims 1 to 3, wherein, The shortest distance from the center of the object to its outer perimeter is different from the distance from the center to the gap.

5. The notch detection device according to any one of claims 1 to 4, wherein, The processing unit corrects the series of distance data acquired by the sensor into a second series of distance data representing multiple distances from the center of the object to its outer perimeter. For integers N and M greater than 2, the corrected second series of distance data is divided into N groups along the circumferential direction, each having the first to the Mth feature. For each sequence from the first to the Mth element, calculate the average value of the N elements belonging to the N groups respectively. Among the N×M elements belonging to the N groups, identify the element with the largest deviation from the average value corresponding to the same order in the sequence from the first to the Mth element. The circumferential position of the determined element is detected as the position of the gap.

6. A resin molding apparatus, comprising: The notch detection device according to any one of claims 1 to 5; and Molding mold The object is positioned in the molding die such that the notch detected by the notch detection device is located at a predetermined position, and is then molded in the molding die with resin.

7. A method for manufacturing a resin molded article, comprising using the resin molding apparatus of claim 6, and comprising: The notch detection device detects the position of the notch; The object is placed in the molding die in such a way that the notch detected by the notch detection device is positioned at the specified location; and The object is molded with resin in the molding mold to manufacture the resin molded article.

8. A notch detection method, comprising: The sensor is rotated relative to the outer periphery of the plate-shaped object with a notch around a predetermined rotation axis; During the relative rotation of the sensor along the outer periphery, a series of distance data along the circumferential direction are obtained by repeatedly measuring the distance from the rotation axis to the outer periphery by the sensor; and Based on the series of distance data acquired by the sensor, the position of the notch on the outer periphery is detected. The outer perimeter, excluding the notched portion, extends in a manner that forms a prescribed repeating pattern along the circumference. Detecting the location of the gap includes: dividing the series of distance data into multiple groups corresponding to the repeating pattern along the circumference, and detecting the location of the gap by comparing the segmented distance data with each other between the groups.

Images