Punching method for occlusive membrane, occlusive membrane hole sewing forming apparatus, and computer readable storage medium

By using a laser to gradually enlarge the pores and ablate the through-holes on the sealing membrane to form an ablation structure, the problem of unstable suture connection is solved, and the stability and precise connection of the sealing membrane on the support mesh are achieved.

CN122140300APending Publication Date: 2026-06-05SHENZHEN KYD BIOMEDICAL TECH CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN KYD BIOMEDICAL TECH CO LTD
Filing Date
2026-01-30
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In existing technologies, the sutures of the sealing membrane are prone to problems such as fraying and loosening during the sewing process, and the connection is unstable, which leads to instability when the sealing disc is closed and released.

Method used

A laser is used to gradually enlarge the hole to create a through-hole on the sealing membrane. The edges and inner walls of the through-hole are ablated to ensure that the suture can pass through and connect stably, avoiding suture breakage and misalignment.

Benefits of technology

It improves the stability of the sealing membrane on the support mesh, ensures the accuracy and stability of the connection between the suture and the sealing membrane, avoids filament breakage and misalignment, and guarantees the stable closure and release of the sealing disc.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to the technical field of medical devices, and particularly relates to a method for punching a closure membrane, a closure membrane sewing hole forming device and a computer readable storage medium. The method for punching a closure membrane comprises the following steps: obtaining a preset punching position on a base body of the closure membrane; controlling a laser to emit a laser beam towards the preset punching position in a step-by-step hole expanding manner, so as to ablate a through hole at each preset punching position by means of the laser beam, and the edge and inner wall of the through hole are both ablation structures. In the present application, the ablation structure is gradually ablated and formed in the process of gradually processing the through hole on the closure membrane, so that the quality of the ablation structure is ensured, and the situation that the through hole has a local edge without an ablation structure when the through hole is formed by means of the laser once is avoided.
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