Zero-gravity body positioner and control circuit therefor

Abstract

The application discloses a zero-gravity body positioner and a control circuit thereof, which comprises a comfort layer for contacting a human body, a pressure sensing layer connected below the comfort layer and internally connected with a plurality of pressure sensor arrays, a buffer conducting layer connected below the pressure sensing layer for uniformly dispersing pressure, an adjustment execution layer connected below the buffer conducting layer and internally provided with a plurality of groups of driving devices, wherein the driving device comprises a first adjustment device; the first adjustment device comprises a motor, an extension rod and a motor base, the motor base is fixedly arranged on a bearing surface of the adjustment execution layer, the motor is mounted on the motor base, an output end of the motor is connected with a driving end of the extension rod, the motor and the extension rod are coaxially arranged in a straight line, and the motor is used for driving the extension rod to perform up-down extension movement along an axial direction; a base support layer is connected below the adjustment execution layer and used for providing overall support; a pressure processing module is electrically connected with the pressure sensing layer, used for receiving pressure data collected by the pressure sensor arrays, and the pressure processing module is electrically connected with the motor of the adjustment execution layer, used for controlling the motor to drive the extension rod to extend and retract; and the pressure sensing layer, the buffer conducting layer, the adjustment execution layer and the base support layer are detachably connected.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and in particular to zero-gravity positioning pads and their control circuits. Background Technology

[0002] In the use of traditional positioning pads, ordinary positioning pads are difficult to dynamically adjust according to the pressure on different parts of the body, and cannot evenly distribute the pressure on the body. Prolonged use can easily lead to excessive pressure on certain parts of the body, causing discomfort or even health problems. Summary of the Invention

[0003] To solve or partially solve the above problems, this application provides a zero-gravity positioning pad and its control circuit, including: A comfortable surface layer designed for contact with the human body; A pressure-sensing layer is connected to the comfort surface layer below, and a plurality of pressure sensor arrays are disposed inside it; A buffer conductive layer, connected below the pressure sensing layer, is used to evenly distribute pressure; An adjustment execution layer is connected below the buffer conduction layer, and a plurality of driving devices are provided inside it, the driving devices including a first adjustment device; The first adjustment device includes a motor, a telescopic rod, and a motor base. The motor base is fixedly mounted on the bearing surface of the adjustment execution layer. The motor is mounted on the motor base, and the output end of the motor is connected to the driving end of the telescopic rod. The motor and the telescopic rod are arranged coaxially in a straight line. The motor is used to drive the telescopic rod to move up and down along the axial direction. A base support layer is connected below the adjustment execution layer to provide overall support. The pressure processing module is electrically connected to the pressure sensing layer and is used to receive pressure data collected by the pressure sensor array. The pressure processing module is also electrically connected to the motor of the adjustment execution layer and is used to control the motor to drive the telescopic rod to extend and retract. The pressure sensing layer, buffer conduction layer, adjustment execution layer and base support layer are detachably connected.

[0004] The motor and the telescopic pole are arranged coaxially in a straight line, which ensures that the force is evenly distributed, without eccentricity or swaying, and that the operation is stable and reliable.

[0005] The zero-gravity positioning pad provided in this application further includes an integrated control box, which is connected to the adjustment execution layer for outputting drive signals and is connected to the pressure sensing layer for receiving pressure sensing signals.

[0006] The zero-gravity positioning pad provided in this application has several sets of drive devices in the adjustment execution layer arranged in zones, including head execution unit, shoulder execution unit, waist execution unit, hip execution unit, knee execution unit and ankle execution unit, and each set of drive devices is independently controlled by the pressure processing module.

[0007] The zero-gravity positioning pad provided in this application has a plurality of pressure sensor arrays in the pressure sensing layer arranged in a partitioned manner corresponding to the driving device, including a head pressure sensing unit, a shoulder pressure sensing unit, a waist pressure sensing unit, a hip pressure sensing unit, a knee pressure sensing unit, and an ankle pressure sensing unit.

[0008] The zero-gravity positioning pad provided in this application also includes a support elastic pad, which is connected to the base support layer.

[0009] This application also proposes a zero-gravity positioning pad control circuit, applied to any of the zero-gravity positioning pads described above: comprising: The built-in main control module includes a main control chip U30, a crystal oscillator circuit, and a debugging serial port CN3. The crystal oscillator circuit includes a crystal X2, resistors R33 and R32, and capacitors C82, C83, and C84. Capacitor C82 and resistor R32 are connected to pin 14 of the main control chip U30. Pin 12 of the main control chip U30 is connected in parallel to pin 13 of the main control chip U30 via crystal X2 and resistor R33. Capacitor C83 and capacitor C84 are both connected to pin 13 of the main control chip U30. Pin 2 of the debugging serial port CN3 is connected to pin 76 of the main control chip U30, pin 3 of the debugging serial port CN3 is connected to pin 72 of the main control chip U30, and pin 4 of the debugging serial port CN3 is grounded. A pressure sensing signal acquisition module, which is connected to the main control module, is used to connect to a flexible pressure sensor array and acquire pressure distribution simulation signals. The drive module is connected to the output terminal of the main control module. The drive module includes several drive execution circuits for connecting to several drive devices and driving the telescopic rod to move up and down to adjust the air pressure according to the control command. The plurality of drive execution circuits include a drive execution chip U35, capacitors C105, C106, C107, and C108. A 12V DC power supply port is connected to pin 1 of the drive execution chip U35. Capacitor C105 is connected between pins 1 and 2 of the drive execution chip U35. Pin 3 of the drive execution chip U35 is connected to pin 4 through capacitor C106. Pin 5 of the drive execution chip U35 is grounded and connected to pin 6 through capacitor C107. Pin 5 of the drive execution chip U35 is also connected to pin 8 through capacitor C108. Pins 6, 7, and 12 of the drive execution chip U35 are interconnected. Pin 13 of the drive execution chip U35 is connected to pin 89 of the main control chip U30. Pin 14 of the drive execution chip U35 is connected to pin 90 of the main control chip U30. Pin 15 of the drive execution chip U35 is connected to pin 91 of the main control chip U30. The power module is connected to the main control module, the pressure sensing signal acquisition module, and the drive module.

[0010] The zero-gravity body positioning pad control circuit provided in this application includes a main control module that further includes a storage module for storing the signal inputs and outputs of the main control chip. The storage module includes a storage chip U31, diodes D9, D10, D11, and D12, and resistors R35, R36, R37, R38, R39, R40, and R41. Pin 1 of storage chip U31 is connected to diode D12 and then to pin 54 of the main control chip U30 via resistor R41. Pin 3 of storage chip U31 is connected to pin 52 of the main control chip U30 via resistor R40. Pin 7 of storage chip U31 is connected to pin 54 of the main control chip U30 via resistor R39. Pin 29 is connected. Pin 8 of storage chip U31 is connected to diode D11 and then to pin 31 of main control chip U30 through resistor R38. Pin 9 of storage chip U31 is connected to diode D9 and then to pin 53 of main control chip U30 through resistor R37. Pin 10 of storage chip U31 is connected to pin 15 of storage chip U31 through diode D10. Pin 15 of storage chip U31 is connected to pin 32 of main control chip U30 through resistor R36. Pin 16 of storage chip U31 is connected to pin 30 of main control chip U30 through resistor R35.

[0011] The zero-gravity body positioning pad control circuit provided in this application includes a pressure sensing signal acquisition circuit comprising a signal acquisition communication interface U32, a multi-channel signal converter U33, a multi-channel signal converter U34, and signal acquisition access interfaces FPC3 and FPC4. Among them, pin 3 of the acquisition signal communication interface U32 is connected to pin 45 of the main control chip U30, pin 4 of the acquisition signal communication interface U32 is connected to pin 48 of the main control chip U30, pin 5 of the acquisition signal communication interface U32 is connected to pin 47 of the main control chip U30, pin 6 of the acquisition signal communication interface U32 is connected to pin 46 of the main control chip U30, pin 15 of the acquisition signal communication interface U32 is connected in parallel to pin 16 of the acquisition signal communication interface U32 through capacitor C93 and inductor L3, pin 16 of the acquisition signal communication interface U32 is connected to pin 1 of the multi-channel signal converter U33, and pin 15 of the acquisition signal communication interface U32 is connected to pin 1 of the multi-channel signal converter U34. Pin 10 of the multi-channel signal converter U33 is connected to pin 41 of the main control chip U30; pin 11 of the multi-channel signal converter U33 is connected to pin 42 of the main control chip U30; pin 13 of the multi-channel signal converter U33 is connected to pin 44 of the main control chip U30; pin 14 of the multi-channel signal converter U33 is connected to pin 43 of the main control chip U30; pins 9 to 2 of the multi-channel signal converter U33 are connected sequentially to pins 3 to 10 of the acquisition signal access interface FPC3; and pins 23 to 16 of the multi-channel signal converter U33 are connected sequentially to pins 11 to 18 of the acquisition signal access interface FPC3. Pin 10 of the multi-channel signal converter U34 is connected to pin 36 of the main control chip U30, pin 11 of the multi-channel signal converter U34 is connected to pin 37 of the main control chip U30, pin 33 of the multi-channel signal converter U34 is connected to pin 39 of the main control chip U30, pin 14 of the multi-channel signal converter U34 is connected to pin 38 of the main control chip U30, and pins 9 to 2 of the multi-channel signal converter U34 are connected sequentially to pins 3 to 10 of the acquisition signal access interface FPC4.

[0012] The zero-gravity body positioning pad control circuit provided in this application includes a power module comprising a DC power port, a filter protection circuit, a step-down circuit, and a voltage regulator circuit. The filter protection circuit and the step-down circuit are connected to the 12V DC power port, and the 12V DC power port is connected to the drive module. The filtering and protection circuit includes a fuse F2, a rectifier diode D15, a double-pole switch U44, a voltage suppressor diode D14, a polarized capacitor U45, a capacitor C156, and a 12V DC power supply port connected to the positive terminals of the fuse F2, the voltage suppressor diode D14, the polarized capacitor U45, and the capacitor C156. The fuse F2 is connected to pin 2 of the double-pole switch U44 through the diode D15. Pin 1 of the double-pole switch U44 is grounded and connected to the negative terminal of the voltage suppressor diode D14, the polarized capacitor U45, and the capacitor C156. The buck converter circuit includes a buck controller U46, capacitors C157, C158, and C159, resistors R43, R44, and R45, inductor L4, and rectifier diode D16. Pin 7 of buck controller U46 is connected to a 12V DC power supply port. Pin 1 of buck controller U46 is connected to pin 8 via capacitor C157. Pin 4 of buck controller U46 is connected to pin 8 via resistor R43 and capacitor C158. Pin 4 of buck controller U46 is also connected to a power supply port. Resistor R44 is connected to resistor R45, which is grounded and connected to pin 8 of buck controller U46 through capacitor C159. Pin 6 of buck controller U46 is grounded and connected to pin 8 of buck controller U46 through rectifier diode D16. Pin 8 of buck controller U46 is connected to one end of inductor L4, and the other end of inductor L4 outputs to the 5V power supply port. The 5V power supply port serves as the current interface for the bucked circuit and is connected to the voltage regulator circuit and the pressure sensing signal acquisition module. The voltage regulator circuit includes a voltage regulator U43, capacitors C154, C153, and C155, and a resistor R42. The 5V power supply port is connected to capacitor C154 and pin 1 of the voltage regulator U43. The 5V power supply port is also connected to pin 3 of the voltage regulator U43 through resistor R42, serving as the current input terminal to the voltage regulator U43. The output pin 5 of the voltage regulator U43 is connected to capacitors C153 and C155. Capacitors C153 and C155 are connected and grounded. The output pin 5 of the voltage regulator U43 is connected to the power supply port VCC. The power supply port VCC is connected to the main control chip U30 and the storage chip U31.

[0013] The zero-gravity body positioning pad control circuit provided in this application includes a number of switching circuits connected to the drive execution unit for driving the DC motor to rotate forward and backward or an AC load. The switching circuit includes field-effect transistors Q33, Q35, Q34, and Q36. A 12V DC power supply port is connected to the drains of field-effect transistors Q33 and Q35. Pin 17 of the driver execution chip U35 is connected to the gate of field-effect transistor Q33, pin 24 of the driver execution chip U35 is connected to the gate of field-effect transistor Q35, pin 18 of the driver execution chip U35 is connected to both the source of field-effect transistor Q33 and the drain of field-effect transistor Q34, pin 23 of the driver execution chip U35 is connected to both the source of field-effect transistor Q35 and the drain of field-effect transistor Q36, pin 19 of the driver execution chip U35 is connected to the gate of field-effect transistor Q34, pin 22 of the driver execution chip U35 is connected to the gate of field-effect transistor Q36, and the sources of field-effect transistors Q34 and Q36 are interconnected and grounded.

[0014] Beneficial effects: The comfort surface layer directly contacts the human body, providing initial comfort; the pressure sensing layer, with a pressure sensor array located beneath the comfort surface, monitors pressure distribution data across different parts of the body in real time; the buffer conduction layer, connected below the pressure sensing layer, utilizes its ability to evenly distribute pressure, preventing localized pressure concentration; the adjustment execution layer, connected below the buffer conduction layer, has an internal drive mechanism that uses a motor to drive a telescopic rod for extension and retraction, dynamically adjusting its height based on control signals from the pressure processing module; the base support layer provides overall structural stability; the pressure processing module generates control commands based on data collected from the pressure sensing layer, driving the motor in the adjustment execution layer to achieve precise pressure regulation; and the detachable connection design facilitates maintenance and replacement of each layer.

[0015] 2. By integrating the main control module, pressure sensor signal acquisition module, drive module, and power supply module, accurate acquisition of pressure signals and efficient driving of the drive device are achieved, thus solving the problem of uneven pressure regulation. The built-in main control module includes a main control chip U30, a crystal oscillator circuit, and a debugging serial port CN3. The crystal oscillator circuit provides a stable clock signal through a combination of crystal X2, resistors, and capacitors, ensuring the timing accuracy of the main control chip. The debugging serial port CN3 facilitates system debugging and monitoring, improving overall reliability. The pressure sensor signal acquisition module is connected to the main control module and is used to acquire simulated pressure distribution signals, realizing real-time acquisition of pressure data and providing accurate input for control decisions. The drive module includes several drive execution circuits. The drive execution circuits, such as the drive execution chip U35 combined with capacitors, drive the telescopic rod to move after receiving control commands from the main control module. The capacitors are used to filter and stabilize the signal, ensuring interference-free command transmission. The power supply module connects all modules, providing a stable power supply to ensure the coordinated operation of the entire circuit. Attached Figure Description

[0016] Figure 1 A three-dimensional structural diagram of the zero-gravity positioning pad provided in this application; Figure 2 A schematic diagram of the pressure sensing layer of the zero-gravity positioning pad provided in this application; Figure 3 A schematic diagram of the adjustment execution layer of the zero-gravity positioning pad provided in this application; Figure 4 A schematic diagram of the structure of the first adjusting device provided in this application; Figure 5 A schematic diagram of the structure of the second regulating device provided in this application; Figure 6 The connection flow relationship of the circuit modules provided in this application; Figure 7 Circuit diagram of the main control module of the zero-gravity body positioning pad control circuit provided in this application; Figure 8Circuit diagram of the pressure signal sensing and acquisition module of the zero-gravity body positioning pad control circuit provided in this application; Figure 9 Circuit diagram of the drive module for the zero-gravity body positioning pad control circuit provided in this application; Figure 10 A circuit diagram of the motor interface for the zero-gravity body positioning pad control circuit provided in this application; Figure 11 Circuit diagram of the power module for the zero-gravity body positioning pad control circuit provided in this application; 1. Comfortable surface; 2. Pressure sensing layer; 21. Head pressure sensing unit; 22. Shoulder pressure sensing unit; 23. Waist pressure sensing unit; 24. Hip pressure sensing unit; 25. Knee pressure sensing unit; 26. Ankle pressure sensing unit; 3. Buffer conductive layer; 4. Adjustment execution layer; 41. Drive device; 411. First adjustment device; 4111. Motor; 4112. Motor base; 4113. Telescopic rod; 4114. First elastic telescopic sleeve; 412. Second adjusting device; 4121. Electric air pump; 4122. Air pump base; 4123. Air column; 4124. Second elastic telescopic sleeve; 42. Head actuator; 43. Shoulder actuator; 44. Waist actuator; 45. Hip actuator; 46. Knee actuator; 47. Ankle actuator; 5. Base support layer; 6. Pressure processing module; Detailed Implementation

[0017] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described to avoid confusion with this application.

[0018] Example 1 To address the aforementioned issues, a zero-gravity positioning pad was proposed. (See [link to relevant documentation]). Figure 1 - Figure 5 This application includes: a comfort surface layer 1, a pressure sensing layer 2, a buffer conduction layer 3, a regulation and actuation layer 4, and a base support layer 5.

[0019] Comfort surface 1 is used to contact the human body; pressure sensing layer 2 is connected below comfort surface 1 and has an array of pressure sensors inside; buffer conduction layer 3 is connected below pressure sensing layer 2 and is used to evenly distribute pressure; adjustment execution layer 4 is connected below buffer conduction layer 3 and has a number of drive devices 41 inside, including a first adjustment device. The first adjustment device includes a motor 4111, a telescopic rod 4113, and a motor base 4112. The motor base 4112 is fixedly mounted on the bearing surface of the adjustment execution layer 4. The motor 4111 is mounted on the motor base 4112. The output end of the motor 4111 is connected to the drive end of the telescopic rod 4113. The motor 4111 and the telescopic rod 4113 are arranged coaxially in a straight line. The motor 4111 is used to drive the telescopic rod 4113 to move up and down along the axial direction. The base support layer 5 is connected below the adjustment execution layer 4 and is used to provide overall support. The pressure processing module 6 is electrically connected to the pressure sensing layer 2 and is used to receive pressure data collected by the pressure sensor array. The pressure processing module 6 is also electrically connected to the motor 4111 of the adjustment execution layer 4 and is used to control the motor 4111 to drive the telescopic rod 4113 to extend and retract. The pressure sensing layer 2, the buffer conduction layer 3, the adjustment execution layer 4, and the base support layer 5 are detachably connected.

[0020] The telescopic rod 4113 is driven up and down by the motor 4111, so that the drive device 41 can be adjusted in real time according to the pressure felt by the human body.

[0021] The comfort surface layer 1 is in direct contact with the human body, providing basic comfort. The pressure sensing layer 2 is connected below the comfort surface layer 1 and integrates several pressure sensor arrays to monitor the pressure distribution between the human body and the pad in real time. For example, the pressure sensing layer 2 can use flexible sensors arranged in a matrix to cover the entire surface of the pad, thereby obtaining detailed pressure distribution data.

[0022] The buffer conduction layer 3 is connected below the pressure sensing layer 2, and its main function is to evenly distribute the pressure. For example, the buffer conduction layer 3 can be made of a material with a certain degree of elasticity and deformation capability, such as high-density memory foam or latex. These materials can absorb and redistribute the local high pressure from the upper comfort surface layer 1 and the pressure sensing layer 2, so that it is transmitted more evenly to the lower regulating actuation layer 4.

[0023] refer to Figure 3 The regulating execution layer 4 is connected below the buffer conduction layer 3, and it contains several sets of drive devices 41. The number of drive devices 41 can be selected according to actual needs. Figure 3 The quantity shown is merely a schematic diagram.

[0024] refer to Figure 4The drive device 41 may include a first adjustment device, wherein the first adjustment device may include a motor 4111, a telescopic rod 4113 and a motor base 4112. The motor base 4112 is fixedly mounted on the bearing surface of the adjustment execution layer 4. The motor 4111 is mounted on the motor base 4112. The output end of the motor 4111 is connected to the drive end of the telescopic rod 4113. The motor 4111 and the telescopic rod 4113 are arranged in a straight line and coaxially. The motor 4111 is used to drive the telescopic rod 4113 to move up and down along the axial direction. The motor 4111 is used to drive the telescopic rod 4113 to move up and down, thereby changing the local height of the positioning pad. The telescopic rod 4113 moves up or down under the control of the motor 4111.

[0025] The first adjustment device may further include a first elastic telescopic sleeve 4114, which is sleeved on the outside of the telescopic rod 4113. The lower end of the first elastic telescopic sleeve 4114 is sealed to the upper end of the motor base 4112. The first elastic telescopic sleeve 4114 can extend and deform synchronously with the extension and retraction of the telescopic rod 4113. An annular gap can be formed between the inner wall of the first elastic telescopic sleeve 4114 and the outer wall of the telescopic rod 4113. The width of the annular gap is 0.5-2mm. The annular gap is used to accommodate the radial deformation generated when the telescopic rod 4113 extends and retracts, and at the same time provides room for the extension and retraction of the first elastic telescopic sleeve 4114.

[0026] refer to Figure 5 The drive device 41 may also include a second adjustment device, which may include an electric air pump 4121, an air column 4123 and an air pump base 4122. The air pump base 4122 is fixedly mounted on the bearing surface of the adjustment execution layer 4. The electric air pump 4121 is embedded inside the air pump base 4122. The air outlet of the electric air pump 4121 is connected to the air chamber of the air column 4123 through an air pipe. The electric air pump 4121 is used to deliver air pressure to the air chamber to drive the air column 4123 to move upward along the axial direction.

[0027] In addition, an exhaust valve is provided at the bottom of the air column 4123. The exhaust valve is connected to the inner cavity of the air column 4123 and is used to release the air pressure in the inner cavity to drive the air column 4123 to retract.

[0028] The second adjustment device may further include a second elastic telescopic sleeve 4124, which is sleeved on the outside of the air column 4123, and the lower end of the second elastic telescopic sleeve 4124 is connected to the upper end of the air pump base 4122. The second elastic telescopic sleeve 4124 moves with the up and down movement of the air column 4123.

[0029] When the electric air pump 4121 operates, it inflates the air column 4123, increasing the internal air pressure. Under the pressure of the gas, the air column 4123 extends axially and upwards, achieving an upward movement. When the exhaust valve is opened, the gas inside the air column 4123 is discharged, and the internal air pressure decreases. Under the action of an external load, the air column 4123 is compressed, shortens axially, and falls downwards, achieving a downward movement.

[0030] The base support layer 5 is connected below the adjustment and actuation layer 4 to provide overall support. For example, the base support layer 5 can be made of robust foam material or composite board to ensure that the pad maintains a stable structure under various operating conditions.

[0031] The pressure processing module 6 can be located on the side of the positioning pad. The pressure processing module 6 is electrically connected to the pressure sensing layer 2 and is responsible for receiving and processing the raw pressure data collected by the pressure sensor array. At the same time, the pressure processing module 6 is also electrically connected to the motor 4111 in the adjustment execution layer 4. Based on the processed pressure data, it generates corresponding control commands to drive the motor 4111 to precisely control the extension and retraction of the telescopic rod 4113, so as to realize the dynamic adjustment of the local pressure of the positioning pad.

[0032] Furthermore, the pressure sensing layer 2, the buffer conduction layer 3, the regulation actuation layer 4, and the base support layer 5 are detachably connected. For example, these layers can be connected by zippers, Velcro, or other means, allowing for easy disassembly, cleaning, maintenance, or replacement of each layer.

[0033] The working principle is as follows: When a user lies on the comfort surface 1, their body weight will be evenly or unevenly distributed on the surface of the positioning pad. At this time, the pressure sensing layer 2 located below the comfort surface 1 will immediately start working. Several pressure sensor arrays inside the pressure sensing layer 2 will collect the pressure data exerted on the positioning pad by various parts of the user's body in real time and continuously. For example, if the user's shoulder and hip areas exert relatively high local pressure on the positioning pad due to body shape or sleeping posture, the pressure sensors in these areas will output large electrical signals.

[0034] The raw pressure data collected by the pressure sensor array is then transmitted to the pressure processing module 6. After receiving these electrical signals, the pressure processing module 6 performs digital conversion and analysis to identify areas on the surface of the positioning pad where the pressure is too high or uneven. For example, based on preset pressure thresholds and distribution models, the pressure processing module 6 determines that the pressure values ​​in the user's shoulder and hip areas exceed the comfort range.

[0035] After identifying the areas requiring adjustment, the pressure processing module 6 generates corresponding control commands and sends these commands via electrical connection to the motors 4111 of the drive devices 41 corresponding to the high-pressure areas in the adjustment execution layer 4. For example, the pressure processing module 6 sends drive signals to the motors 4111 in the drive devices 41 responsible for the shoulder and hip areas, instructing these motors 4111 to perform telescopic movements. Upon receiving the commands, the motors 4111 drive the telescopic rods 4113 connected to them to extend or retract. If the pressure in a certain area is too high, the telescopic rods 4113 may be instructed to extend upwards to raise the height of the pad in that area, thereby increasing the support area and dispersing local pressure; conversely, if the pressure in a certain area is too low, the telescopic rods 4113 may be instructed to retract downwards to lower the height of the pad in that area, allowing the body to fit more closely to the pad and providing tighter support.

[0036] In addition, since the pressure sensing layer 2, buffer conduction layer 3, adjustment execution layer 4 and base support layer 5 are detachably connected, users can easily separate the layers when the positioning pad needs to be cleaned or maintained, which improves the convenience and service life of the product.

[0037] In addition, the positioning pad may also include an integrated control box, which is connected to the adjustment execution layer 4 for outputting drive signals; the integrated control box is also connected to the pressure sensing layer 2 for receiving pressure sensing signals.

[0038] In addition, refer to Figure 3 The system can partition several groups of drive units 41 in the adjustment execution layer 4, including head actuators 42, shoulder actuators 43, waist actuators 44, hip actuators 45, knee actuators 46, and ankle actuators 47. Each group of drive units 41 is independently controlled by the pressure processing module 6. The adjustment execution layer 4 can be adjusted.

[0039] Specifically, the zoning settings can divide the body into specific areas based on the main stress points and the need for postural adjustments, ensuring that the positioning pad can cover the key stress areas of the body from head to toe.

[0040] As one specific implementation, each execution unit may consist of one or more sets of drive devices 41, and the drive devices 41 work together in their respective areas. Alternatively, each actuator can be pre-set with different sizes and shapes based on ergonomic data to better adapt to the contours of the corresponding body parts.

[0041] Furthermore, each drive unit 41 is independently controlled by the pressure processing module 6. Each drive unit 41 within each partition (e.g., head actuator 42, shoulder actuator 43, etc.) can receive independent control commands from the pressure processing module 6 and perform its own extension and retraction movements according to the commands. This enables differentiated and precise pressure adjustment for different body parts, effectively avoiding the limitations of overall adjustment. For example, the pressure processing module 6 can contain multiple independent control channels, each corresponding to an actuator, sending commands to each actuator via independent signal lines or wireless communication. Alternatively, the pressure processing module 6 can employ time-division multiplexing or address addressing to send control commands with specific address codes to different actuators via a single communication bus, thereby achieving independent control.

[0042] Meanwhile, the pressure sensor arrays in the pressure sensing layer 2 are arranged in a partitioned manner corresponding to the drive device 41, and may include a head pressure sensing unit 21, a shoulder pressure sensing unit 22, a waist pressure sensing unit 23, a hip pressure sensing unit 24, a knee pressure sensing unit 25, and an ankle pressure sensing unit 26.

[0043] The arrangement of several pressure sensor arrays in the pressure sensing layer 2 corresponding to the partitions of the drive device 41 means that the sensor set inside the pressure sensing layer 2 forms a one-to-one correspondence with each partition of the drive device 41 in the adjustment execution layer 4 (such as the head execution part 42, the shoulder execution part 43, etc.) in terms of spatial layout or data processing logic. For example, flexible sensors can be distributed in the corresponding positions of each drive device 41 partition. This ensures that the pressure data of each adjustment area can be collected independently and accurately, providing a data basis for subsequent precise adjustment.

[0044] Specifically, by partitioning the pressure sensor array in the pressure sensing layer 2 and corresponding it to the partitioning of the drive device 41 in the adjustment execution layer 4, the pressure processing module 6 can receive pressure data that precisely matches the adjustment area. When the pressure sensor of a certain body part (such as the head) detects an abnormal pressure, the pressure processing module 6 can accurately identify which part has a pressure problem and control the corresponding head execution part 42 in the adjustment execution layer 4 to adjust the extension and retraction of the telescopic rod 4113 driven by the motor 4111. This precise correspondence between pressure monitoring and adjustment can ensure that the positioning pad can manage the pressure of various parts of the human body in a refined and personalized way, avoiding the problem of mismatch between pressure data collection and adjustment control.

[0045] In addition, this application also includes a support elastic pad connected to the base support layer 5. As one specific implementation, the support elastic pad can be made of high-density memory foam, latex, gel materials, or combinations thereof, deforming according to the curves of the human body and pressure distribution to provide personalized support. Alternatively, the support elastic pad can also be made of an elastomer material with a special structure (such as honeycomb or mesh), such as thermoplastic polyurethane (TPU) elastomer, whose structural design optimizes pressure dispersion.

[0046] Example 2 Based on the above embodiments, the control circuit in this application is used to process pressure signals and control the drive device to achieve dynamic pressure adjustment. However, in this process, the design of the control circuit may not be efficient enough, resulting in response delay or insufficient control accuracy.

[0047] Therefore, see Figure 6 - Figure 11 This application proposes a zero-gravity positioning pad control circuit, which includes a built-in main control module, a pressure sensing signal acquisition module, a drive module, and a power supply module.

[0048] The built-in main control module includes a main control chip U30, a crystal oscillator circuit, and a debugging serial port CN3. The crystal oscillator circuit includes a crystal X2, resistors R33 and R32, and capacitors C82, C83, and C84. Capacitor C82 and resistor R32 are connected to pin 14 of the main control chip U30. Pin 12 of the main control chip U30 is connected in parallel to pin 13 of the main control chip U30 through crystal X2 and resistor R33. Capacitor C83 and capacitor C84 are connected to pin 13 of the main control chip U30. Pin 2 of the debugging serial port CN3 is connected to pin 76 of the main control chip U30, pin 3 of the debugging serial port CN3 is connected to pin 72 of the main control chip U30, and pin 4 of the debugging serial port CN3 is grounded. The pressure sensing signal acquisition module is connected to the main control module and is used to connect with the flexible pressure sensor array to acquire pressure distribution simulation signals. The drive module is connected to the output of the main control module. The drive module includes several drive execution circuits for connecting to several drive devices and driving the telescopic rod to move up and down to regulate air pressure according to control commands. The drive execution circuit includes a drive execution chip U35, capacitors C105, C106, C107, and C108. A 12V DC power supply port is connected to pin 1 of the drive execution chip U35. Capacitor C105 is connected between pins 1 and 2 of the drive execution chip U35. Pin 3 of the drive execution chip U35 is connected to pin 4 through capacitor C106. Pin 5 of the drive execution chip U35 is grounded and connected to pin 6 through capacitor C107. Pin 5 of the drive execution chip U35 is also connected to pin 8 through capacitor C108. Pins 6, 7, and 12 of the drive execution chip U35 are interconnected. Pin 13 of the drive execution chip U35 is connected to pin 89 of the main control chip U30. Pin 14 of the drive execution chip U35 is connected to pin 90 of the main control chip U30. Pin 15 of the drive execution chip U35 is connected to pin 91 of the main control chip U30. The power supply module is connected to the main control module, the pressure sensor signal acquisition module, and the drive module.

[0049] Specifically, when a user lies on the positioning pad, the flexible pressure sensor array in the pressure sensing layer inside the pad collects pressure distribution data of various parts of the body in real time. The analog pressure signal is transmitted to the pressure sensing signal acquisition module. The pressure sensing signal acquisition module performs necessary signal conditioning (such as amplification and filtering) and analog-to-digital conversion on the received analog signal, converting it into a digital signal, and sends it to the main control module through the communication interface. The main control chip U30 on the main control module accurately receives and processes the digital pressure data from the pressure sensing signal acquisition module under the stable clock signal provided by the crystal oscillator circuit.

[0050] The main control chip U30 analyzes the current pressure distribution based on the preset algorithm or the user-defined mode, and calculates the degree of extension and retraction adjustment required for each group of drive devices in the adjustment execution layer of the body positioning pad, so as to achieve uniform pressure distribution or specific body positioning support. The calculated control commands are sent to the drive module through the output of the main control module. After receiving the control commands from the main control module, the drive module uses several internal drive execution circuits (including the drive execution chip U35 and related capacitors) to convert these commands into specific electrical signals required to drive the motor in the drive device. The drive execution chip U35 precisely controls the forward and reverse rotation and speed of the DC motor by controlling its connected switching circuit (composed of MOSFETs Q33, Q35, Q34, and Q36), thereby driving the telescopic rod to extend and retract. For example, when the pressure in a certain area is too high, the main control module instructs the drive module to extend the telescopic rod in the corresponding area to raise that area and disperse the pressure; conversely, it shortens the telescopic rod when the pressure is low. Throughout the process, the power module provides a stable and reliable power supply to the built-in main control module, pressure sensor signal acquisition module, and drive module, ensuring that each module can operate normally under different working conditions and avoiding control instability or data acquisition errors caused by power fluctuations. The debugging serial port CN3 provides convenience during system development and maintenance. Through the above synergistic effect, the zero-gravity positioning pad control circuit can achieve rapid, accurate, and dynamic pressure adjustment of the positioning pad.

[0051] The real-time data acquisition capability of the pressure sensor signal acquisition module, combined with the intelligent decision-making of the main control module and the efficient execution capability of the drive module, enables the positioning pad to respond instantly according to changes in human posture and pressure, effectively avoiding the problems of response delay and insufficient control accuracy that may exist in traditional control circuits.

[0052] refer to Figure 7 The main control module also includes a storage module for storing the signal inputs and outputs of the main control chip; The storage module may include a storage chip U31, diodes D9, D10, D11, and D12, and resistors R35, R36, R37, R38, R39, R40, and R41. Pin 1 of storage chip U31 is connected to diode D12 and then to pin 54 of main control chip U30 via resistor R41. Pin 3 of storage chip U31 is connected to pin 52 of main control chip U30 via resistor R40, and pin 7 of storage chip U31 is connected to pin 54 of main control chip U30 via resistor R39. Pin 29 is connected. Pin 8 of storage chip U31 is connected to diode D11 and then to pin 31 of main control chip U30 through resistor R38. Pin 9 of storage chip U31 is connected to diode D9 and then to pin 53 of main control chip U30 through resistor R37. Pin 10 of storage chip U31 is connected to pin 15 of storage chip U31 through diode D10. Pin 15 of storage chip U31 is connected to pin 32 of main control chip U30 through resistor R36. Pin 16 of storage chip U31 is connected to pin 30 of main control chip U30 through resistor R35.

[0053] Specifically, when the zero-gravity positioning pad control circuit is running, the main control chip U30 acts as a processor, responsible for receiving pressure data from the pressure sensor signal acquisition module and generating drive signals according to preset algorithms or user instructions. The drive module controls the extension and retraction movement of the drive device. The input signals (such as pressure data and user settings) and output signals (such as motor control instructions and system status) of the main control chip U30 are transmitted to the storage module through its specific pins. The storage chip U31 in the storage module acts as a storage unit, and under the control of the main control chip U30, it writes and saves these key data.

[0054] For example, the main control chip U30 can exchange data and control signals with the corresponding pins of the storage chip U31 through its pins 54, 52, 29, 31, 53, 32, and 30. In this data transmission path, diodes D9, D10, D11, and D12 are strategically arranged to provide necessary circuit protection, such as preventing damage to the sensitive storage chip U31 from transient voltage surges or reverse currents, thereby enhancing the reliability of the entire storage system. Meanwhile, resistors R35, R36, R37, R38, R39, R40, and R41 are used to condition the signals, such as for current limiting, level matching, or impedance matching, to ensure stable and accurate data signal transmission between the main control chip U30 and the storage chip U31, avoiding signal distortion or interference.

[0055] refer to Figure 8The pressure sensing signal acquisition circuit may include a signal acquisition communication interface U32, a multi-channel signal converter U33, a multi-channel signal converter U34, and signal acquisition access interfaces FPC3 and FPC4. Specifically, pin 3 of the signal acquisition communication interface U32 is connected to pin 45 of the main control chip U30; pin 4 of the signal acquisition communication interface U32 is connected to pin 48 of the main control chip U30; pin 5 of the signal acquisition communication interface U32 is connected to pin 47 of the main control chip U30; pin 6 of the signal acquisition communication interface U32 is connected to pin 46 of the main control chip U30; pin 15 of the signal acquisition communication interface U32 is connected in parallel to pin 16 of the signal acquisition communication interface U32 through capacitor C93 and inductor L3; pin 16 of the signal acquisition communication interface U32 is connected to pin 1 of the multi-channel signal converter U33; and pin 15 of the signal acquisition communication interface U32 is connected to pin 1 of the multi-channel signal converter U34. Pin 10 of the multi-channel signal converter U33 is connected to pin 41 of the main control chip U30; pin 11 of the multi-channel signal converter U33 is connected to pin 42 of the main control chip U30; pin 13 of the multi-channel signal converter U33 is connected to pin 44 of the main control chip U30; pin 14 of the multi-channel signal converter U33 is connected to pin 43 of the main control chip U30; pins 9 to 2 of the multi-channel signal converter U33 are sequentially connected to pins 3 to 10 of the acquisition signal access interface FPC3; and pins 23 to 16 of the multi-channel signal converter U33 are sequentially connected to pins 11 to 18 of the acquisition signal access interface FPC3. Pin 10 of the multi-channel signal converter U34 is connected to pin 36 of the main control chip U30, pin 11 of the multi-channel signal converter U34 is connected to pin 37 of the main control chip U30, pin 33 of the multi-channel signal converter U34 is connected to pin 39 of the main control chip U30, pin 14 of the multi-channel signal converter U34 is connected to pin 38 of the main control chip U30, and pins 9 to 2 of the multi-channel signal converter U34 are connected sequentially to pins 3 to 10 of the acquisition signal access interface FPC4.

[0056] Specifically, the acquisition signal communication interface U32 in the pressure sensor signal acquisition circuit is directly connected to the pins of the main control chip U30 via pins 3, 4, 5, and 6, which reduces signal transmission delay and potential communication errors. Multi-channel signal converters U33 and U34 operate in parallel, connected to pins 16 and 15 of the acquisition signal communication interface U32 via pin 1, respectively, to achieve synchronous conversion of multiple analog signals. They are also connected to the corresponding pins of the main control chip U30 via their respective pins (e.g., pins 10, 11, 13, and 14), ensuring the synchronicity and accuracy of signal conversion and effectively avoiding potential conflicts during multi-channel data processing. Acquisition signal access interfaces FPC3 and FPC4 serve as direct input ports for the pressure sensor array, with their pins sequentially connected to the corresponding pins of multi-channel signal converters U33 and U34. This partitioned access method optimizes data routing, prevents signal loss during transmission, and supports independent processing of pressure data from different areas. In addition, capacitor C93 and inductor L3 are connected in parallel between pins 15 and 16 of the signal acquisition communication interface U32 to form an effective filtering network, which can significantly suppress noise and electromagnetic interference in the circuit and further improve the purity of the signal.

[0057] refer to Figure 11 The power module may include a DC power port, a filter protection circuit, a step-down circuit, and a voltage regulator circuit. The filter protection circuit and the step-down circuit are connected to the 12V DC power port, and the 12V DC power port is connected to the drive module. The filtering and protection circuit includes a fuse F2, a rectifier diode D15, a double-pole switch U44, a voltage suppressor diode D14, a polarized capacitor U45, a capacitor C156, and a 12V DC power supply port connected to the positive terminals of the fuse F2, the voltage suppressor diode D14, the polarized capacitor U45, and the capacitor C156. The fuse F2 is connected to pin 2 of the double-pole switch U44 through the diode D15. Pin 1 of the double-pole switch U44 is grounded and connected to the negative terminal of the voltage suppressor diode D14, the polarized capacitor U45, and the capacitor C156.

[0058] The buck converter circuit may include a buck controller U46, capacitors C157, C158, and C159, resistors R43, R44, and R45, inductor L4, and rectifier diode D16. Pin 7 of the buck controller U46 is connected to a 12V DC power supply port. Pin 1 of the buck controller U46 is connected to pin 8 via capacitor C157. Pin 4 of the buck controller U46 is connected to pin 8 via resistor R43 and capacitor C158. Pin 4 of the buck controller U46 is also connected to... Resistor R44 is connected to resistor R45, which is grounded and connected to pin 8 of buck controller U46 via capacitor C159. Pin 6 of buck controller U46 is grounded and connected to pin 8 of buck controller U46 via rectifier diode D16. Pin 8 of buck controller U46 is connected to one end of inductor L4, and the other end of inductor L4 outputs to the 5V power supply port. The 5V power supply port serves as the current interface for the bucked circuit and is connected to the voltage regulator circuit and the pressure sensing signal acquisition module.

[0059] The voltage regulator circuit may include a voltage regulator U43, capacitors C154, C153, and C155, and a resistor R42. The 5V power supply port is connected to capacitor C154 and pin 1 of the voltage regulator U43. The 5V power supply port is also connected to pin 3 of the voltage regulator U43 through resistor R42, serving as a current input to the voltage regulator U43. The output pin 5 of the voltage regulator U43 is connected to capacitors C153 and C155. Capacitors C153 and C155 are connected and grounded. The output pin 5 of the voltage regulator U43 is connected to the power supply port VCC. The power supply port VCC is connected to the main control chip U30 and the storage chip U31.

[0060] Specifically, the power supply module is divided into three stages: filtering protection, voltage reduction, and voltage regulation, to ensure a stable and reliable power supply. First, an external 12V DC power supply is connected through the DC power port. The core of the filtering protection circuit is to provide overcurrent protection through fuse F2, preventing damage to the circuit from abnormally large currents. Rectifier diode D15 and double-pole switch U44 work together to not only manage the current direction but also provide complete power isolation when necessary, effectively eliminating reverse interference. Voltage suppression diode D14, along with polarized capacitor U45 and capacitor C156, form a highly efficient filtering network that absorbs voltage spikes at the input and filters out high-frequency noise, thereby significantly reducing the impact of external power fluctuations and interference on subsequent circuits.

[0061] Secondly, the filtered 12V DC power supply enters the buck circuit. The buck controller U46, along with capacitors C157, C158, and C159, resistors R43, R44, and R45, inductor L4, and rectifier diode D16, works together to efficiently and accurately convert the 12V DC voltage to a 5V power port. The buck controller U46, through its internal switching mechanism, combined with the energy storage function of inductor L4 and the freewheeling function of rectifier diode D16, effectively reduces the voltage. Capacitors C157, C158, and C159, and resistors R43, R44, and R45, smooth voltage fluctuations, set feedback voltage divider points, and suppress ripple, ensuring a stable and low-ripple output voltage at the 5V power port. This 5V power port not only provides input to the voltage regulator circuit but also directly powers the pressure sensor signal acquisition module, ensuring the accuracy of pressure data acquisition.

[0062] Finally, the output of the 5V power port is further fed into the voltage regulator circuit. Regulator U43, along with capacitors C154, C153, and C155, and resistor R42, outputs the 5V voltage to the power port VCC. Resistor R42 regulates the input current, while capacitors C154, C153, and C155 filter out residual noise and provide instantaneous energy storage, ensuring a highly stable voltage output from the power port VCC. This power port VCC directly powers the main control chip U30 and the storage chip U31, providing a stable and clean power supply for the core operations and data storage of the main control module.

[0063] refer to Figure 9 The drive module can contain eight independent units, each corresponding to a different execution unit in the drive layer. Each drive module is responsible for controlling one execution unit to achieve real-time pressure adjustment of the partition.

[0064] The drive module receives control commands from the main control module and converts them into electrical signals required by the motor in the drive unit, thereby driving the telescopic rod to extend and retract. The drive module can be composed of multiple motor drive chips (such as H-bridge drivers) and a power amplifier circuit to provide sufficient drive current and voltage.

[0065] The drive execution circuit is the specific execution unit in the drive module, used to control the motor in one or a group of drive devices in a single execution unit. It can use an integrated H-bridge drive chip, which integrates power switching transistors and control logic, simplifying the external circuitry; or it can use N-channel MOSFETs to build an H-bridge circuit, thereby achieving more flexible power and current control.

[0066] The drive module may also include several switching circuits connected to the drive execution unit for driving the DC motor in forward and reverse rotation or AC load. The switching circuit includes field-effect transistors Q33, Q35, Q34, and Q36. A 12V DC power supply port is connected to the drain of field-effect transistors Q33 and Q35. Pin 17 of the driver execution chip U35 is connected to the gate of field-effect transistor Q33, pin 24 of the driver execution chip U35 is connected to the gate of field-effect transistor Q35, pin 18 of the driver execution chip U35 is connected to both the source of field-effect transistor Q33 and the drain of field-effect transistor Q34, pin 23 of the driver execution chip U35 is connected to both the source of field-effect transistor Q35 and the drain of field-effect transistor Q36, pin 19 of the driver execution chip U35 is connected to the gate of field-effect transistor Q34, pin 22 of the driver execution chip U35 is connected to the gate of field-effect transistor Q36, and the sources of field-effect transistors Q34 and Q36 are interconnected and grounded.

[0067] Switching circuits are used to control the forward and reverse rotation of DC motors or to drive AC loads. They can be composed of four field-effect transistors (FETs such as Q33, Q35, Q34, and Q36) forming an H-bridge structure. By controlling the on / off state of different FETs, the voltage direction across the motor can be changed.

[0068] Field-effect transistors (FETs) Q33, Q35, Q34, and Q36 serve as power switching elements in switching circuits, responsible for controlling the on / off state and direction of current. They can be N-channel MOSFETs, coupled with bootstrap circuits or dedicated gate driver chips, to achieve superior switching performance and efficiency.

[0069] Specifically, the switching circuit may include a first half-bridge power unit and a second half-bridge power unit; the first half-bridge power unit includes N-channel MOSFETs Q33 and Q34, Q33 is a high-side MOSFET, the drain of Q33 is connected to the DC power supply port, the gate of Q33 is connected to pin 17 of the first driver chip U35, and the source of Q33 forms the midpoint SH1 of the first half-bridge; Q34 is a low-side MOSFET, the drain of Q34 is connected to the midpoint SH1 of the first half-bridge, the gate of Q34 is connected to pin 19 of the driver execution chip U35, and the source of Q34 is grounded; The second half-bridge power unit includes N-channel MOSFETs Q35 and Q36. Q35 is a high-side MOSFET. The drain of Q35 is connected to the DC power supply port, the gate of Q35 is connected to pin 24 of the driver execution chip U35, and the source of Q35 forms the midpoint SH2 of the second half-bridge. Q36 is a low-side MOSFET. The drain of Q36 is connected to the midpoint SH2 of the second half-bridge. The gate of Q36 is connected to pin 22 of the drive execution chip U35. The source of Q36 is grounded.

[0070] The first half-bridge power unit and the second half-bridge power unit operate independently. Through the timing control of the drive signals at pins 17 / 19 and 24 / 22 of the first driver chip U35, the independent current direction and on / off control of the two loads can be achieved, meeting the diverse working requirements of different loads.

[0071] See Figure 10 The motor interface CN2 is connected to several switching circuits and several drive execution circuits, and is used to connect the DC motor to the drive module.

[0072] The motor interface CN2 can have 8 sets of connectors, corresponding to 8 sets of drive modules. For example, pin 1 of the motor interface CN2 is connected to pin 18 of the drive execution chip U35 on the drive module and SH1 of the switching circuit, and pin 3 of the motor interface CN2 is connected to pin 23 of the drive execution chip U35 and SH2 of the switching circuit. (The other 7 sets are the same as the drive modules mentioned above, and will not be described in detail here).

[0073] Specifically, the power supply pins and control signal pins of the motor interface CN2 are connected to the corresponding output terminals of the switching circuit and drive execution circuit inside the drive module, respectively. The main control module U30 generates corresponding drive signals according to preset control logic or received user commands and sends these signals to the drive module. After receiving the control commands from the main control module U30, the drive execution chip U35 in the drive module controls the on / off states of MOSFETs Q33, Q35, Q34, and Q36 in the switching circuit. By precisely controlling the switching sequence of these MOSFETs, the switching circuit can output currents of different directions and amplitudes, thereby driving the DC motor connected to the motor interface to perform operations such as forward rotation, reverse rotation, stopping, or speed adjustment.

[0074] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of this application. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of this application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

Claims

1. A zero-gravity positioning pad, characterized in that, include: A comfortable surface layer designed for contact with the human body; A pressure-sensing layer is connected to the comfort surface layer below, and a plurality of pressure sensor arrays are disposed inside it; A buffer conductive layer, connected below the pressure sensing layer, is used to evenly distribute pressure; An adjustment execution layer is connected below the buffer conduction layer, and a plurality of driving devices are provided inside it, the driving devices including a first adjustment device; The first adjustment device includes a motor, a telescopic rod, and a motor base. The motor base is fixedly mounted on the bearing surface of the adjustment execution layer. The motor is mounted on the motor base. The output end of the motor is connected to the driving end of the telescopic rod. The motor and the telescopic rod are arranged coaxially in a straight line. The motor is used to drive the telescopic rod to move up and down along the axial direction. A base support layer, connected below the adjustment execution layer, is used to provide overall support; The pressure processing module is electrically connected to the pressure sensing layer and is used to receive pressure data collected by the pressure sensor array. The pressure processing module is also electrically connected to the motor of the adjustment execution layer and is used to control the motor to drive the telescopic rod to extend and retract. The pressure sensing layer, buffer conduction layer, adjustment execution layer and base support layer are detachably connected.

2. The zero-gravity positioning pad according to claim 1, characterized in that, It also includes an integrated control box, which is connected to the adjustment and execution layer for outputting drive signals, and is connected to the pressure sensing layer for receiving pressure sensing signals.

3. The zero-gravity positioning pad according to claim 1, characterized in that, The adjustment execution layer is divided into several groups of drive devices, including head execution unit, shoulder execution unit, waist execution unit, hip execution unit, knee execution unit and ankle execution unit. Each group of drive devices is independently controlled by the pressure processing module.

4. The zero-gravity positioning pad according to claim 3, characterized in that, The pressure sensor arrays in the pressure sensing layer are arranged in corresponding zones of the driving device, including head pressure sensing units, shoulder pressure sensing units, waist pressure sensing units, hip pressure sensing units, knee pressure sensing units, and ankle pressure sensing units.

5. The zero-gravity positioning pad according to claim 1, characterized in that, It also includes a support elastic pad, which is connected to the base support layer.

6. A zero-gravity positioning pad control circuit, applied to the zero-gravity positioning pad according to any one of claims 1-5, characterized in that, include: The built-in main control module includes a main control chip U30, a crystal oscillator circuit, and a debugging serial port CN3. The crystal oscillator circuit includes a crystal X2, resistors R33 and R32, and capacitors C82, C83, and C84. Capacitor C82 and resistor R32 are connected to pin 14 of the main control chip U30. Pin 12 of the main control chip U30 is connected in parallel to pin 13 of the main control chip U30 via crystal X2 and resistor R33. Capacitor C83 and capacitor C84 are both connected to pin 13 of the main control chip U30. Pin 2 of the debugging serial port CN3 is connected to pin 76 of the main control chip U30, pin 3 of the debugging serial port CN3 is connected to pin 72 of the main control chip U30, and pin 4 of the debugging serial port CN3 is grounded. A pressure sensing signal acquisition module, which is connected to the main control module, is used to connect to a flexible pressure sensor array and acquire pressure distribution simulation signals. The drive module is connected to the output terminal of the main control module. The drive module includes several drive execution circuits for connecting to several drive devices and driving the telescopic rod to move up and down to adjust the air pressure according to the control command. The plurality of drive execution circuits include a drive execution chip U35, capacitors C105, C106, C107, and C108. A 12V DC power supply port is connected to pin 1 of the drive execution chip U35. Capacitor C105 is connected between pins 1 and 2 of the drive execution chip U35. Pin 3 of the drive execution chip U35 is connected to pin 4 through capacitor C106. Pin 5 of the drive execution chip U35 is grounded and connected to pin 6 through capacitor C107. Pin 5 of the drive execution chip U35 is also connected to pin 8 through capacitor C108. Pins 6, 7, and 12 of the drive execution chip U35 are interconnected. Pin 13 of the drive execution chip U35 is connected to pin 89 of the main control chip U30. Pin 14 of the drive execution chip U35 is connected to pin 90 of the main control chip U30. Pin 15 of the drive execution chip U35 is connected to pin 91 of the main control chip U30. The power module is connected to the main control module, the pressure sensing signal acquisition module, and the drive module.

7. The zero-gravity body positioning pad control circuit according to claim 6, characterized in that, The main control module also includes a storage module for storing the signal inputs and outputs of the main control chip; The storage module includes a storage chip U31, diodes D9, D10, D11, and D12, and resistors R35, R36, R37, R38, R39, R40, and R41. Pin 1 of storage chip U31 is connected to diode D12 and then to pin 54 of the main control chip U30 via resistor R41. Pin 3 of storage chip U31 is connected to pin 52 of the main control chip U30 via resistor R40. Pin 7 of storage chip U31 is connected to pin 54 of the main control chip U30 via resistor R39. Pin 29 is connected. Pin 8 of storage chip U31 is connected to diode D11 and then to pin 31 of main control chip U30 through resistor R38. Pin 9 of storage chip U31 is connected to diode D9 and then to pin 53 of main control chip U30 through resistor R37. Pin 10 of storage chip U31 is connected to pin 15 of storage chip U31 through diode D10. Pin 15 of storage chip U31 is connected to pin 32 of main control chip U30 through resistor R36. Pin 16 of storage chip U31 is connected to pin 30 of main control chip U30 through resistor R35.

8. The zero-gravity body positioning pad control circuit according to claim 6, characterized in that, The pressure sensing signal acquisition circuit includes a signal acquisition communication interface U32, a multi-channel signal converter U33, a multi-channel signal converter U34, and signal acquisition access interfaces FPC3 and FPC4. Among them, pin 3 of the acquisition signal communication interface U32 is connected to pin 45 of the main control chip U30, pin 4 of the acquisition signal communication interface U32 is connected to pin 48 of the main control chip U30, pin 5 of the acquisition signal communication interface U32 is connected to pin 47 of the main control chip U30, pin 6 of the acquisition signal communication interface U32 is connected to pin 46 of the main control chip U30, pin 15 of the acquisition signal communication interface U32 is connected in parallel to pin 16 of the acquisition signal communication interface U32 through capacitor C93 and inductor L3, pin 16 of the acquisition signal communication interface U32 is connected to pin 1 of the multi-channel signal converter U33, and pin 15 of the acquisition signal communication interface U32 is connected to pin 1 of the multi-channel signal converter U34. Pin 10 of the multi-channel signal converter U33 is connected to pin 41 of the main control chip U30; pin 11 of the multi-channel signal converter U33 is connected to pin 42 of the main control chip U30; pin 13 of the multi-channel signal converter U33 is connected to pin 44 of the main control chip U30; pin 14 of the multi-channel signal converter U33 is connected to pin 43 of the main control chip U30; pins 9 to 2 of the multi-channel signal converter U33 are sequentially connected to pins 3 to 10 of the acquisition signal access interface FPC3; and pins 23 to 16 of the multi-channel signal converter U33 are sequentially connected to pins 11 to 18 of the acquisition signal access interface FPC3. Pin 10 of the multi-channel signal converter U34 is connected to pin 36 of the main control chip U30, pin 11 of the multi-channel signal converter U34 is connected to pin 37 of the main control chip U30, pin 33 of the multi-channel signal converter U34 is connected to pin 39 of the main control chip U30, pin 14 of the multi-channel signal converter U34 is connected to pin 38 of the main control chip U30, and pins 9 to 2 of the multi-channel signal converter U34 are connected in sequence to pins 3 to 10 of the acquisition signal access interface FPC4.

9. The zero-gravity body positioning pad control circuit according to claim 6, characterized in that, The power module includes a DC power port, a filter protection circuit, a step-down circuit, and a voltage regulator circuit. The filter protection circuit and the step-down circuit are connected to the 12V DC power port, and the 12V DC power port is connected to the drive module. The filtering and protection circuit includes a fuse F2, a rectifier diode D15, a double-pole switch U44, a voltage suppressor diode D14, a polarized capacitor U45, and a capacitor C156. A 12V DC power supply port is connected to the positive terminals of the fuse F2, the voltage suppressor diode D14, the polarized capacitor U45, and the capacitor C156. The fuse F2 is connected to pin 2 of the double-pole switch U44 via the diode D15. Pin 1 of the double-pole switch U44 is grounded and connected to the negative terminals of the voltage suppressor diode D14, the polarized capacitor U45, and the capacitor C156. The buck converter circuit includes a buck controller U46, capacitors C157, C158, and C159, resistors R43, R44, and R45, inductor L4, and rectifier diode D16. Pin 7 of buck controller U46 is connected to a 12V DC power supply port. Pin 1 of buck controller U46 is connected to pin 8 via capacitor C157. Pin 4 of buck controller U46 is connected to pin 8 via resistor R43 and capacitor C158. Pin 4 of buck controller U46 is also connected to a power supply port. Resistor R44 is connected to resistor R45, which is grounded and connected to pin 8 of buck controller U46 through capacitor C159. Pin 6 of buck controller U46 is grounded and connected to pin 8 of buck controller U46 through rectifier diode D16. Pin 8 of buck controller U46 is connected to one end of inductor L4, and the other end of inductor L4 outputs to the 5V power supply port. The 5V power supply port serves as the current interface for the bucked circuit and is connected to the voltage regulator circuit and the pressure sensing signal acquisition module. The voltage regulator circuit includes a voltage regulator U43, capacitors C154, C153, and C155, and a resistor R42. The 5V power supply port is connected to capacitor C154 and pin 1 of the voltage regulator U43. The 5V power supply port is also connected to pin 3 of the voltage regulator U43 through resistor R42, serving as a current input terminal to supply current to the voltage regulator U43. The output pin 5 of the voltage regulator U43 is connected to capacitors C153 and C155. Capacitors C153 and C155 are connected and grounded. The output pin 5 of the voltage regulator U43 is connected to the power supply port VCC. The power supply port VCC is connected to the main control chip U30 and the storage chip U31.

10. The zero-gravity body positioning pad control circuit according to claim 6, characterized in that, The drive module also includes several switching circuits connected to the drive execution unit for driving the DC motor to rotate in both directions or an AC load. The switching circuit includes field-effect transistors Q33, Q35, Q34, and Q36. A 12V DC power supply port is connected to the drains of field-effect transistors Q33 and Q35. Pin 17 of the driver execution chip U35 is connected to the gate of field-effect transistor Q33, pin 24 of the driver execution chip U35 is connected to the gate of field-effect transistor Q35, pin 18 of the driver execution chip U35 is connected to both the source of field-effect transistor Q33 and the drain of field-effect transistor Q34, pin 23 of the driver execution chip U35 is connected to both the source of field-effect transistor Q35 and the drain of field-effect transistor Q36, pin 19 of the driver execution chip U35 is connected to the gate of field-effect transistor Q34, pin 22 of the driver execution chip U35 is connected to the gate of field-effect transistor Q36, and the sources of field-effect transistors Q34 and Q36 are interconnected and grounded.

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