A brazing assembly for a MOCVD showerhead and a method of brazing the same

By designing vias that gradually decrease in size from top to bottom on the stainless steel substrate of the MOCVD spray head and the material leakage holes of the uniform material tooling, the sealing failure problem between the capillary and the substrate was solved, and reliable sealing of the brazing assembly and efficient epitaxial process were achieved.

CN122142438APending Publication Date: 2026-06-05NANCHANG UNIV +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-02-03
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In the existing MOCVD spray head, the cavity seal fails due to the misalignment of the fit between the capillary and the stainless steel substrate and the uneven distribution of the solder during the brazing process, which affects the success or failure of the epitaxial process.

Method used

The via diameter on the stainless steel substrate is designed to gradually decrease from top to bottom. Combined with the material discharge hole design of the uniform material tooling, the capillary tube is accurately guided and the solder is evenly distributed. The sealing performance is ensured through interference fit and vacuum degassing process.

Benefits of technology

This improves the reliable sealing between the capillary and the stainless steel substrate, reduces the probability of porosity defects and sealing failure, and increases the success rate of epitaxial processes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a brazing assembly for a MOCVD shower head and a brazing method thereof, wherein the brazing assembly comprises a stainless steel substrate, a capillary tube and a solder uniformizing tooling plate for pre-paving solder; the stainless steel substrate is provided with axially-through via holes in array distribution, and the hole diameter of the via holes gradually decreases from top to bottom; the outer diameter of the capillary tube is greater than or equal to the minimum hole diameter of the via holes; the solder uniformizing tooling plate is provided with array-distributed solder leakage holes; when the stainless steel substrate is attached to the solder uniformizing tooling plate, the solder leakage holes are coaxially aligned with the via holes. By designing the hole diameter of the via holes on the stainless steel substrate to gradually decrease from top to bottom, the assembly gap between the capillary tube and the stainless steel substrate can be controlled within the brazing process standard range. Meanwhile, the solder uniformizing tooling plate is designed with corresponding solder leakage holes corresponding to the stainless steel substrate, so that the solder can be accurately pre-paved in the via holes, the quantitative and uniform distribution of the solder is realized, the problems of solder accumulation or insufficient filling are effectively avoided, and the air tightness of the weld joint after brazing is improved.
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