Chip production sealing and pressing device

Abstract

The application discloses a chip production sealing and pressing device and relates to the technical field of chip production. The device comprises a base, a top base, a hydraulic cylinder, an upper mold assembly and the like. The chip sealing and pressing device uses a single hydraulic cylinder as a power source, utilizes a limiting arm-T-shaped rack-gear-tooth rack series connection mechanism to divide vertical return stroke into three controllable outputs, converts vertical displacement into horizontal feeding of a cutting block through a slant-straight composite guide groove, instantaneously cuts and connects a solidified epoxy resin in a groove, ensures the flatness of a chip edge without burrs, and is beneficial to eliminating problems of low efficiency of manual cutting, high positioning error of secondary punching and high waste rate caused by carrying.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, specifically to a sealing device for chip manufacturing. Background Technology

[0002] In existing dual-station epoxy resin encapsulation equipment for chips, after injection molding, a continuous waste material is formed in the connecting groove between the two chips, which is integrated with the chip edge. During mold opening, because the epoxy resin has already solidified, this waste material tightly holds the two chips together, preventing them from easily detaching from the mold cavity. Currently, common practices include: manually cutting the waste material with diagonal pliers and then prying the chip to demold it; or moving the entire mold to the next punching station and using an additional punching die to cut the waste material. Both methods have significant drawbacks: manual cutting is tedious; adding a punching station requires secondary positioning, and the chips are prone to displacement during mold handling, resulting in a high scrap rate. To address this, the present invention proposes a sealing device for chip production: the three actions of "cutting the connecting material, removing the chip, and removing the waste material" are combined into the mold opening stroke and completed in one go by the return force of the upper mold, without the need for external power or manual labor, thus realizing continuous packaging at two stations. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a sealing device for chip manufacturing, which solves the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a sealing apparatus for chip manufacturing, comprising: The base is used to fix the overall components of the device in place. Top mount; located above the base, supported and connected to the base via a rod; The hydraulic cylinder, embedded inside the top seat, is used to provide power to the entire device. Also includes: The upper mold assembly is installed at the bottom of the hydraulic cylinder, and its interior is provided with an injection channel that connects to an external injection pipe. There are two lower mold components, located below the upper mold component and connected to the base, used for chip sealing. A cutting mechanism, located between the two lower die assemblies, is used to cut off the waste material. The transmission mechanism is connected to the base and is used to cooperate with the upper mold assembly to drive the cutting mechanism.

[0005] Preferably, the upper mold assembly includes an upper template with two cavities at its bottom, corresponding to two chip sealing stations. A limiting arm is installed at the top of the upper template, and the limiting arm is connected to the upper template by bolts. Both ends of the limiting arm are provided with U-shaped grooves. A cavity is provided in the middle of the upper template, and an injection hole groove is provided at the top of the middle cavity. By setting a double-cavity structure at the bottom of the upper template, the upper mold assembly realizes synchronous sealing at two stations, significantly improving production efficiency. The design of the limiting arm and U-shaped grooves effectively enhances the mold closing positioning accuracy, prevents offset, and ensures the consistency of chip sealing.

[0006] Preferably, the upper mold plate is provided with an upper ejector pin, and there are two upper ejector pins. One end of the bottom of the two upper ejector pins is provided with a protruding structure. The top of the upper ejector pin protrudes from the top of the limiting arm, and a first spring is fitted on the outside of the upper ejector pin. The upper ejector pins are symmetrically arranged with the bottom protruding structure, and when the upper mold plate is opened to the top of the stroke, a balanced downward thrust is applied synchronously to push the sticky waste material downward.

[0007] Preferably, the lower mold assembly includes two lower mold plates, each corresponding to one chip. A support plate is provided at the bottom of the lower mold plates. One top end of a support rod is connected to the bottom of the lower mold plates, and one bottom end of the support rod is connected to a lifting plate. The support rod is slidably connected to the inside of the base, and one bottom end of the support rod is fixedly connected to the lifting plate. The lifting plate is located inside the base, and its two sides are in slidable contact with the inside of the base. A support spring is provided at the bottom of the lifting plate. This lower mold assembly forms a floating linkage structure with the double lower mold plates, support rod, lifting plate, and support spring. When the mold is opened, the spring compression stores energy and pushes upward in the opposite direction, causing the lower mold plates to descend synchronously and triggering the lower ejector pins to rise relative to each other, thus achieving smooth chip demolding and automatic ejection, avoiding jamming and stress concentration.

[0008] Preferably, the bottom of the lower template is provided with a groove, and a lower ejector pin is provided inside the groove. The top end face of the lower ejector pin is flush with the surface of the groove in the lower template. The bottom of the lower ejector pin is fixedly connected to the base. The two lower templates are provided with grooves for placing chips, and chip pin grooves are provided around the grooves. Connecting side plates are provided on both sides of the two lower templates, and the two lower templates are connected to each other through the connecting side plates. This structure fixes the lower ejector pin to the base and makes a precise sliding fit with the groove at the bottom of the lower template. The top surface is flush with the groove, ensuring stable chip support, accurate pin positioning, and no indentation during injection molding. When the mold is opened, the lower template moves down as a whole with the connecting side plates, and the lower ejector pin rises relative to it, realizing chip ejection without damage and avoiding the risk of manual prying.

[0009] Preferably, the cutting mechanism includes connecting blocks, two of which are provided. Guide blocks are fixedly mounted to both ends of each connecting block by screws. A guide groove is formed inside each guide block, with one bottom end inclined and one top end vertical. A guide shaft is provided inside the guide groove, slidingly contacting the inside of the guide groove. One end of the guide shaft is rotatably connected to one side of the cutting block. The cutting blocks are located on both sides of the injection molding block. One side of each cutting block has a T-shaped groove and is slidably connected to the injection molding block. A cutting blade is provided at one end of each cutting block. A groove is provided inside the injection molding block. The groove in the lower mold and the upper mold plate cooperate to form an injection cavity. The injection cavity formed between the injection block and the upper mold plate is connected to the groove inside the lower mold plate through a connecting groove, which is distributed on both sides of the injection block. The cutting mechanism uses the connecting block to drive the guide block downward. The oblique-straight composite trajectory of the guide groove converts the vertical movement of the guide shaft into the horizontal shearing of the cutting block. The T-shaped slide ensures a high-rigidity fit between the cutting block and the injection block. The cutter head instantly cuts the solidified resin at the outlet of the connecting groove, with a smooth and burr-free cut surface. The double cutters are symmetrically distributed and cut synchronously, avoiding tensile stress on the chip edge and reducing the risk of microcracks. The entire action is driven by the return stroke of the upper mold, without the need for additional cylinders or motors.

[0010] Preferably, a fixing block is provided at the bottom of the injection block, the fixing block is connected to the injection block by bolts, and one end of the bottom of the fixing block is connected to the base by screws. A lifting block is provided inside the fixing block, and a waste ejector pin is fixedly installed on the top of the lifting block. One end of the waste ejector pin penetrates the bottom of the injection block. A third spring is provided at the top of both ends of the lifting block, and protruding structures are provided on both sides of the lifting block. The protruding structures on both sides of the lifting block slide in contact with the grooves on the inner wall of the fixing block. A lever is provided at the bottom of the lifting block, and the middle part of the lever is rotatably connected to the inside of the fixing block through a shaft. The bottom of one end of the lever is provided with a limiting shaft, which is fixedly connected to the inside of the fixed block. The bottom of the other end of the lever is provided with a second spring. One end of the lever is located below the connecting block. This structure rigidly connects the injection block and the base through the fixed block to ensure that the cutting and scrap ejection action references are consistent. The lifting block is driven by the lever inside the fixed block. When the connecting block presses down on one end of the lever, the other end instantly lifts up and compresses the second spring. A reliable fulcrum is formed through the limiting shaft, which synchronously lifts the lifting block together with the scrap ejector pin. The third spring automatically resets, realizing the scrap ejection at one time after cutting.

[0011] Preferably, the transmission mechanism includes a fixed housing, which is fixedly connected to one side of the base. A gear is installed inside the fixed housing, and the gear is rotatably connected to the fixed housing via a shaft. A first rack is provided on one side of the gear, and a second rack is provided on the other side. Sliders are installed on both sides of the first rack by screws. The sliders are slidably connected to the slots on the surface of the fixed housing. The top end of the first rack has a T-shaped structure, and the bottom end of the second rack is fixedly connected to a connecting block. The bottom of the connecting block is slidably connected to a sliding rod, and the bottom end of the sliding rod is fixedly connected to the base. This transmission mechanism, through the simultaneous meshing of the first rack and the second rack by the gear inside the fixed housing, transforms the vertical return stroke of the upper mold opening into the reverse linear drive required for cutting and scrap removal. The T-shaped end ensures reliable docking between the limiting arm and the first rack. The dual guide of the slider and the sliding rod suppresses off-center load, ensuring smooth force transmission without jamming. The overall structure is compact and has high rigidity. It does not require an additional cylinder or motor and completes the three-in-one action of shearing, demolding, and scrap removal in one go, significantly improving the cycle time, energy efficiency, and reliability of the dual-station sealing press.

[0012] This invention provides a sealing apparatus for chip manufacturing. It has the following advantages: This chip sealing device uses a single hydraulic cylinder as its power source. During the process of dual-station injection molding and pressure holding on the upper mold plate and upward reset, the vertical return stroke is synchronously decomposed into three controllable outputs using a limit arm-T-shaped rack-gear-rack series mechanism: First, the vertical displacement is converted into horizontal feed of the cutting block through the inclined-straight composite guide groove, instantly shearing the solidified epoxy resin in the connecting groove to ensure that the chip edge is flat and burr-free; then, the same rack continues to drive the connecting side plate-support rod-lifting plate system downward, so that the lower mold plate is relatively fixed and the lower ejector pin produces a controllable descent, and the chip is ejected from the mold cavity in the opposite direction to achieve non-destructive demolding; finally, the connecting side plate triggers the lever, converting the remaining stroke into the upward ejection of the lifting block-waste ejector pin, pushing out the residual waste in the injection block out of the mold in one go; the entire three-linkage mechanism fully reuses the mold opening stroke, without the need for external cylinders, motors or manual intervention, which helps to eliminate the problems of low efficiency of manual cutting, high positioning error of secondary punching and the increase in scrap rate caused by handling. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a front view structural diagram of the present invention; Figure 3 This is a side view of the structure of the present invention; Figure 4 This is an exploded view of the structure of the present invention; Figure 5 This is a schematic diagram of the gear and first rack structure of the present invention; Figure 6 This is a schematic diagram of the transmission mechanism structure of the present invention; Figure 7 This is a schematic diagram of the upper mold component structure of the present invention; Figure 8 This is a schematic diagram of the cutting mechanism structure of the present invention; Figure 9 This is a schematic diagram of the toggle block structure of the present invention; Figure 10 This is a schematic diagram of the injection molding block structure of the present invention; Figure 11 This is a schematic diagram of the upper ejector pin structure of the present invention; Figure 12 This is a schematic diagram of the truncated block structure of the present invention.

[0014] In the diagram, 1. Base; 2. Top seat; 3. Hydraulic cylinder; 4. Upper mold assembly; 401. Upper template; 402. Limiting arm; 403. Upper ejector pin; 404. First spring; 5. Lower mold assembly; 501. Lower template; 502. Support rod; 503. Lifting plate; 504. Support spring; 505. Lower ejector pin; 506. Connecting side plate; 6. Cutting mechanism; 601. Connecting block; 602. Guide block; 603. Guide. 604. Groove; 605. Guide shaft; 606. Cut-off block; 607. Injection block; 608. Connecting groove; 609. Fixing block; 610. Push block; 611. Second spring; 612. Limiting shaft; 613. Third spring; 614. Scrap ejector pin; 615. Lifting block; 7. Transmission mechanism; 701. Fixing shell; 702. First rack; 703. Slider; 704. Gear; 705. Second rack; 706. Slide rod. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] Example 1: Please see Figures 1-12 The present invention provides a technical solution: a sealing device for chip production, comprising: a base 1, which is used to fix the overall components of the device; a top seat 2, located above the base 1 and supported and connected to the base 1 by a rod; and a hydraulic cylinder 3, embedded in the top seat 2, used to provide power to the entire device. It also includes: an upper mold assembly 4, installed at the bottom of the hydraulic cylinder 3, with an internal injection channel connected to an external injection pipe; two lower mold assemblies 5, located below the upper mold assembly 4 and connected to the base 1, used for chip sealing; a cutting mechanism 6, located between the two lower mold assemblies 5, used for cutting off waste material; and a transmission mechanism 7, connected to the base 1, used to cooperate with the upper mold assembly 4 to drive the cutting mechanism 6. This embodiment integrates the dual-station lower mold assembly 5, the cutting mechanism 6, and the transmission mechanism 7 onto the same base 1, and drives them uniformly by the hydraulic cylinder 3. After the mold closing and injection molding are completed, the lifting force of the upper mold assembly 4 during the return stroke is synchronously converted by the transmission mechanism 7 into the horizontal shearing of the cutting mechanism 6 and the downward ejection of the lower mold assembly 5. This completes the online cutting of the continuous material and waste, the chip demolding without damage, and the automatic ejection of the waste in one go. It completely eliminates the need for manual cutting or secondary punching stations, avoids chip displacement and increased scrap rate caused by secondary positioning during handling, and realizes the integration of the three actions of "cutting continuous material, removing chip, and ejecting waste" in dual-station continuous packaging with the mold opening stroke, significantly shortening the cycle time, reducing manual intervention, and reducing the subsequent scrap rate.

[0017] Example 2: Please see Figures 1-12This invention provides a technical solution: the upper mold assembly 4 includes an upper mold plate 401. The bottom of the upper mold plate 401 has two cavities corresponding to two chip sealing stations. A limiting arm 402 is installed on the top of the upper mold plate, and the limiting arm 402 is connected to the upper mold plate by bolts. Both ends of the limiting arm 402 have U-shaped grooves. A cavity is provided in the middle of the upper mold plate 401, and an injection hole groove is provided at the top of the middle cavity. Two upper ejector pins 403 are provided inside the upper mold plate 401. One end of each upper ejector pin 403 has a protruding structure. The top of the protruding limiting arm 402 is provided, and the upper ejector pin 403 is externally fitted with a first spring 404; the lower mold assembly 5 includes two lower mold plates 501, each corresponding to a chip. A support plate is provided at the bottom of the lower mold plate 501. One top end of the support rod 502 is connected to the bottom of the lower mold plate 501, and one bottom end of the support rod 502 is connected to the lifting plate 503. The support rod 502 is slidably connected to the inside of the base 1, and one bottom end of the support rod 502 is fixedly connected to the lifting plate 503. The lifting plate 503 is located inside the base 1, and both sides of the lifting plate 503 are in slidable contact with the inside of the base 1. The base is equipped with a support spring 504; the bottom of the lower template 501 is provided with a groove, and a lower ejector pin 505 is provided inside the groove of the lower template 501. The top end face of the lower ejector pin 505 is flush with the surface of the groove of the lower template 501, and the bottom of the lower ejector pin 505 is fixedly connected to the base 1. The two lower templates 501 are provided with grooves for placing chips, and chip pin grooves are provided around the grooves. The two lower templates 501 are provided with connecting side plates 506 on both sides, and the two lower templates 501 are connected to each other through the connecting side plates 506; the transmission mechanism 7 includes a fixed shell 701, and the fixed shell 701 is connected to one side of the base 1. The fixed connection includes a gear 704 inside the fixed housing 701, which is rotatably connected to the fixed housing 701 via a shaft. A first rack 702 is provided on one side of the gear 704, and a second rack 705 is provided on the other side. Slider 703 is installed on both sides of the first rack 702 by screws. The slider 703 is slidably connected to the slots on the surface of the fixed housing 701. The top end of the first rack 702 has a T-shaped structure, and the bottom end of the second rack 705 is fixedly connected to the connecting block 601. The bottom of the connecting block 601 is slidably connected to the slide rod 706, and the bottom end of the slide rod 706 is fixedly connected to the base 1.The cutting mechanism 6 includes two connecting blocks 601. Guide blocks 602 are fixedly mounted to both ends of each connecting block 601 by screws. A guide groove 603 is formed inside each guide block 602. The bottom end of the guide groove 603 is inclined, and the top end is vertical. A guide shaft 604 is disposed inside the guide groove 603, and the guide shaft 604 slides in contact with the inside of the guide groove 603. One end of the guide shaft 604 is rotatably connected to one side of the cutting block 605. The cutting block 605 is located at... On both sides of the injection block 606, a T-shaped groove is provided on one side of the cut-off block 605, and one side of the cut-off block 605 is slidably connected to the injection block 606. A cut-off head is provided at one end of the cut-off block 605. A groove is provided inside the injection block 606. The groove inside the injection block 606 cooperates with the upper template 401 to form an injection cavity. The injection cavity formed between the injection block 606 and the upper template 401 is connected to the groove inside the lower template 501 through a connecting groove 607. The connecting groove is distributed on both sides of the injection block 606. In this embodiment, when the device is in use, two chips are placed into the grooves of the two lower mold plates 501. The hydraulic cylinder 3 then drives the upper mold plate 401 downwards to close with the lower mold plates 501. An external injection molding machine injects epoxy resin through the channels inside the upper mold plate 401 into the cavity inside the injection block 606. The epoxy resin then enters the cavities inside the two lower mold plates 501 through the connecting grooves 607 on both sides of the injection block 606, thus encapsulating the chips. After encapsulating the chips with epoxy resin, pressure is maintained for a period of time to allow the epoxy resin to solidify, completing the sealing of the chips. This allows the device to seal two chips at once. After sealing, the hydraulic cylinder 3 drives the upper mold plate 401 upwards to reset. After the upper mold plate 401 moves upwards a certain distance, it reaches a limit position. Both ends of arm 402 contact the T-shaped structure at the top end of the first rack 702, thereby driving the first rack 702 to move upward. While the first rack 702 moves upward, it can drive the second rack 705 to move downward synchronously through gear 704. The second rack 705 can drive the connecting block 601 and the guide block 602 to move downward. While the guide block 602 moves downward, it can force the guide shaft 604 to move horizontally through the inclined end at the bottom of the guide groove 603. In turn, the guide shaft 604 can drive the cutting block 605 to move horizontally, so that the cutting head at one end of the cutting block 605 can cut the solidified epoxy resin inside the connecting groove 607, thereby separating the sealed chip from the waste inside the injection molding block 606, while keeping the edge of the sealed chip flat. As the second rack 705 continues to move downward, the connecting block 601 will press down on the connecting side plate 506, which in turn will cause the two lower templates 501 to move downward. As the lower templates 501 move downward, they will also drive the lifting plate 503 to move downward through the support rod 502. As a result, the lifting plate 503 can press down on the support spring 504, and at the same time, one end of the lower ejector pin 505 will be pushed out from the surface of the lower template 501, so that the chip sealed inside the lower template 501 can be quickly demolded and easily removed.

[0018] Example 3: Please see Figures 1-12 This invention provides a technical solution: a fixing block 608 is provided at the bottom of the injection block 606, the fixing block 608 is connected to the injection block 606 by bolts, and one end of the bottom of the fixing block 608 is connected to the base 1 by screws. A lifting block 614 is provided inside the fixing block 608, and a waste ejector pin 613 is fixedly installed on the top of the lifting block 614. One end of the top of the waste ejector pin 613 penetrates the bottom of the injection block 606, and a third spring 612 is provided at the top of both ends of the lifting block 614. 14 has protruding structures on both sides. The protruding structures on both sides of the lifting block 614 slide in contact with the grooves on the inner wall of the fixed block 608. The bottom of the lifting block 614 is provided with a lever 609, and the middle part of the lever 609 is rotatably connected to the inside of the fixed block 608 through a shaft. One end of the lever 609 is provided with a limit shaft 611, which is fixedly connected to the inside of the fixed block 608. The other end of the lever 609 is provided with a second spring 610. One end of the lever 609 is located below the connecting block 601. In this embodiment, as the second rack 705 continues to move downward, the connecting side plate 506 can press down one end of the push block 609, thereby causing the other end of the push block 609 to lift up, thus lifting the lifting block 614 upward. As the lifting block 614 lifts up, it can drive the waste ejector pin 613 to move upward, thereby enabling the waste ejector pin 613 to eject the waste material from the internal cavity of the injection molded block 606, making it easy to remove and recycle. During the mold opening process of the upper template 401, the device can continuously perform waste material cutting and waste material ejection through the linkage structure without the need for an additional drive source, which improves functionality and processing efficiency.

[0019] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0020] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A sealing apparatus for chip manufacturing, comprising: The base (1) is used to fix the overall components of the device. Top seat (2); Located above the base (1), it is supported and connected to the base (1) by a rod; The hydraulic cylinder (3) is embedded inside the top seat (2) and is used to provide power to the whole device; Its characteristic is that it further includes: The upper mold assembly (4) is installed at the bottom of the hydraulic cylinder (3), and its interior is provided with an injection channel connected to an external injection pipe; The lower mold assembly (5) has two components, located below the upper mold assembly (4) and connected to the base (1), for chip sealing work; The cutting mechanism (6), located between the two lower die assemblies (5), is used to cut off the waste material. The transmission mechanism (7) is connected to the base (1) and is used to cooperate with the upper mold assembly (4) to drive the cutting mechanism (6) to work.

2. The sealing apparatus for chip manufacturing according to claim 1, characterized in that: The upper mold assembly (4) includes an upper template (401). The bottom of the upper template (401) is provided with two cavities corresponding to two chip sealing stations. A limiting arm (402) is installed on the top of the upper template. The limiting arm (402) is connected to the upper template by bolts, and U-shaped grooves are provided at both ends of the limiting arm (402). A cavity is provided in the middle of the upper template (401), and an injection hole groove is provided at the top of the cavity in the middle of the upper template (401).

3. The sealing apparatus for chip manufacturing according to claim 2, characterized in that: The upper template (401) is provided with an upper ejector pin (403), and there are two upper ejector pins (403). One end of the bottom of the two upper ejector pins (403) is provided with a protruding structure. The top of the upper ejector pin (403) protrudes from the top of the limiting arm (402), and a first spring (404) is fitted on the outside of the upper ejector pin (403).

4. The sealing apparatus for chip manufacturing according to claim 3, characterized in that: The lower mold assembly (5) includes two lower mold plates (501), each corresponding to a chip. A support plate is provided at the bottom of the lower mold plate (501). The top end of the support rod (502) is connected to the bottom of the lower mold plate (501), and the bottom end of the support rod (502) is connected to the lifting plate (503). The support rod (502) is slidably connected to the inside of the base (1). The bottom end of the support rod (502) is fixedly connected to the lifting plate (503). The lifting plate (503) is located inside the base (1). The two sides of the lifting plate (503) are in slidable contact with the inside of the base (1). A support spring (504) is provided at the bottom of the lifting plate (503).

5. The sealing apparatus for chip manufacturing according to claim 4, characterized in that: The bottom of the lower template (501) is provided with a hole groove, and a lower ejector pin (505) is provided inside the hole groove of the bottom of the lower template (501). The top end face of the lower ejector pin (505) is flush with the groove surface of the lower template (501). The bottom of the lower ejector pin (505) is fixedly connected to the base (1). The two lower templates (501) are provided with grooves for placing chips inside, and chip pin grooves are provided around the grooves. Connecting side plates (506) are provided on both sides of the two lower templates (501), and the two lower templates (501) are connected to each other through the connecting side plates (506).

6. The sealing apparatus for chip manufacturing according to claim 5, characterized in that: The cutting mechanism (6) includes a connecting block (601), two of which are provided. Guide blocks (602) are fixedly installed at both ends of the connecting block (601) by screws. A guide groove (603) is provided inside the guide block (602). One end of the guide groove (603) is inclined, and the top end is vertical. A guide shaft (604) is provided inside the guide groove (603). The guide shaft (604) slides in contact with the inside of the guide groove (603). One end of the guide shaft (604) is rotatably connected to one side of the cutting block (605). (605) is distributed on both sides of the injection block (606). A T-shaped groove is provided on one side of the cut-off block (605), and one side of the cut-off block (605) is slidably connected to the injection block (606). A cut-off head is provided at one end of the cut-off block (605). A groove is provided inside the injection block (606). The groove inside the injection block (606) cooperates with the upper template (401) to form an injection cavity. The injection cavity formed between the injection block (606) and the upper template (401) is connected to the groove inside the lower template (501) through a connecting groove (607). The connecting groove is distributed on both sides of the injection block (606).

7. The sealing apparatus for chip manufacturing according to claim 6, characterized in that: A fixing block (608) is provided at the bottom of the injection block (606). The fixing block (608) is connected to the injection block (606) by bolts, and one end of the bottom of the fixing block (608) is connected to the base (1) by screws. A lifting block (614) is provided inside the fixing block (608). A waste ejector pin (613) is fixedly installed on the top of the lifting block (614). One end of the top of the waste ejector pin (613) penetrates the bottom of the injection block (606). A third spring (612) is provided at the top of both ends of the lifting block (614), and a third spring (612) is provided on both sides of the lifting block (614). The lifting block (614) has a protruding structure on both sides that slides in contact with the groove on the inner wall of the fixed block (608). The bottom of the lifting block (614) is provided with a lever (609), and the middle part of the lever (609) is rotatably connected to the inside of the fixed block (608) through a shaft. One end of the lever (609) is provided with a limit shaft (611), which is fixedly connected to the inside of the fixed block (608). The other end of the lever (609) is provided with a second spring (610), and one end of the lever (609) is located below the connecting block (601).

8. The sealing apparatus for chip manufacturing according to claim 7, characterized in that: The transmission mechanism (7) includes a fixed shell (701), which is fixedly connected to one side of the base (1). A gear (704) is provided inside the fixed shell (701). The gear (704) is rotatably connected to the fixed shell (701) via a shaft. A first rack (702) is provided on one side of the gear (704), and a second rack (705) is provided on the other side of the gear (704). Slider (703) is installed on both sides of the first rack (702) by screws. The slider (703) is slidably connected to the slot on the surface of the fixed shell (701). The top end of the first rack (702) is T-shaped. The bottom end of the second rack (705) is fixedly connected to the connecting block (601). The bottom of the connecting block (601) is slidably connected to the slide rod (706). The bottom end of the slide rod (706) is fixedly connected to the base (1).

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