A temperature field uniformity intelligent regulation and control system for a packaging bag forming die
By introducing a matrix-type micro heating element array, an embedded heat pipe array, and a cooling air duct into the packaging bag forming mold, and combining them with an intelligent control unit, the problem of dynamic temperature field mismatch caused by zoned thermal coupling and time delay effect is solved, achieving uniform temperature field control and improving the sealing quality of the packaging bag.
CN122143315APending Publication Date: 2026-06-05DONGGUANG COUNTY JING PLASTIC PACKAGING CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUANG COUNTY JING PLASTIC PACKAGING CO LTD
- Filing Date
- 2026-04-24
- Publication Date
- 2026-06-05
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Figure CN122143315A_ABST
Abstract
The application discloses a kind of packaging bag forming die temperature field uniformity intelligent control system, and the present application relates to the temperature control technical field of packaging bag hot-press forming die, comprising: mould base, its inside is provided with matrix type micro heating element array and embedded heat pipe array, the matrix type micro heating element array is arranged along the below of mould forming surface in row and column.This packaging bag forming die temperature field uniformity intelligent control system, by the cooperation of heat directional drainage and instruction safety screening, so that mould forming surface each area temperature can be smoothly approached target value without overshoot and reciprocating oscillation in continuous hot-press forming process, effectively eliminates the temperature field dynamic mismatch phenomenon caused by partition thermal coupling and time lag effect, and then makes packaging bag sealing width keep uniform in full width, composite layer peeling force fluctuation range narrows, local heat shrinkage deformation incidence reduces.
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