Housing for a sensor, method of manufacturing the same, sensor, and electronic device

Abstract

The application provides a housing for a sensor, a manufacturing method of the housing, the sensor and an electronic device, the housing comprising a metal base body having a connecting area and a protection area, the metal base body being used to be connected with a substrate of the sensor through the connecting area; and an insulating layer, the insulating layer being arranged on the protection area to protect the protection area through the insulating layer, ensure the structural integrity of the housing, and improve the precision and service life of the sensor.

Description

Technical Field

[0001] This application belongs to the field of sensing component technology. Specifically, this application relates to a housing for a sensor and a method for manufacturing the same, as well as a sensor and electronic device. Background Technology

[0002] As a crucial component for sensing environmental parameters, the stability and reliability of sensors are essential to the overall performance of equipment.

[0003] However, in practical applications, when sensors are installed in electronic devices, the sensor housing is in direct contact with the electronic device housing, which is prone to electrochemical corrosion under the influence of environmental factors such as humidity and temperature changes. This not only damages the structural integrity of the sensor housing, but also affects the accuracy and lifespan of the sensor. Summary of the Invention

[0004] One objective of this application is to provide a new technical solution for a sensor housing, a method for manufacturing the same, a sensor, and an electronic device.

[0005] According to a first aspect of the embodiments of this application, a housing for a sensor is provided, comprising:

[0006] A metal substrate having a connection area and a protective area, the metal substrate being used to connect to the substrate of a sensor via the connection area;

[0007] An insulating layer is disposed in the protected area.

[0008] Optionally, the insulating layer is an insulating coating obtained by electrophoresis.

[0009] Optionally, the thickness of the insulating layer is 3-20 μm.

[0010] Optionally, the metal matrix is ​​annular;

[0011] In the axial direction of the metal substrate, the connection area is formed on one end face of the metal substrate, and the opening is formed on the other end face of the metal substrate.

[0012] Optionally, the outer peripheral side of the housing has an annular groove for providing a seal.

[0013] According to a second aspect of the embodiments of this application, a method for manufacturing a housing is provided, applied to the housing described in the first aspect, the method comprising:

[0014] The cover is attached to the metal substrate and covers the connection area;

[0015] Clamp the cover, and move the cover to move the metal substrate to the processing space;

[0016] The metal substrate is subjected to a protective treatment to form an insulating layer in the protected area of ​​the metal substrate.

[0017] Optionally, the processing space is an electrophoresis pool, and the protective treatment is an electrophoresis treatment.

[0018] According to a third aspect of the embodiments of this application, a sensor is provided, the sensor including a substrate and the housing described in the first aspect;

[0019] The connection area of ​​the housing is connected to the substrate.

[0020] Optionally, the sensor may also include a sensing chip and a sensing element;

[0021] A receiving cavity is formed inside the housing, the sensing chip is disposed in the receiving cavity and electrically connected to the substrate, and the sensor fills the receiving cavity and is used to sense external air pressure.

[0022] According to a fourth aspect of the embodiments of this application, an electronic device is provided, the electronic device comprising the housing described in the first aspect; or...

[0023] Including the sensors described in the third aspect.

[0024] One technical advantage of this application is:

[0025] The housing provided in this application includes a metal substrate with a connection area and a protective area. The metal substrate is used to connect to the substrate of the sensor through the connection area. An insulating layer is disposed in the protective area to protect the protective area, ensuring the structural integrity of the housing and improving the accuracy and lifespan of the sensor.

[0026] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0028] Figure 1 A schematic diagram of a housing for a sensor provided in one embodiment of this application;

[0029] Figure 2 A cross-sectional view of a housing for a sensor provided in one embodiment of this application;

[0030] Figure 3 A schematic diagram of a sensor housing during electrophoresis, provided as an embodiment of this application;

[0031] Figure 4 A schematic diagram of a cover for covering a housing, provided for one embodiment of this application;

[0032] Figure 5 A schematic diagram illustrating the connection of a sensor housing during electrophoresis, provided as an embodiment of this application;

[0033] Figure 6 This is a schematic diagram of a sensor provided in one embodiment of this application.

[0034] in:

[0035] 1. Shell; 11. Metal substrate; 111. Connection area; 112. Protective area; 12. Insulation layer; 13. Opening; 14. Annular groove;

[0036] 100. Covering components;

[0037] 2. Substrate; 3. Sensor chip; 31. ASIC part; 32. MEMS part; 4. Sensor. Detailed Implementation

[0038] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0039] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0040] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0041] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0042] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0044] Reference Figure 1 and Figure 2 This application provides a housing 1 for a sensor, the housing 1 comprising:

[0045] A metal substrate 11 has a connection region 111 and a protective region 112. The metal substrate 11 is used to connect to the substrate 2 of the sensor through the connection region 111.

[0046] Insulation layer 12 is disposed in the protected area 112.

[0047] In this embodiment, the metal substrate 11 serves as the main frame structure of the housing 1. When the housing 1 is applied to the sensor, the metal substrate 11 provides stable support for the sensor, making the sensor structure more robust and durable. Simultaneously, the metal substrate 11 can shield against external electromagnetic interference, ensuring the accuracy and stability of the sensor measurements.

[0048] In this embodiment, the metal substrate 11 is connected to the sensor substrate 2 through the connection area 111, which facilitates the placement of other sensor components within the housing 1, enabling the sensor to maintain a stable working state and reducing performance fluctuations caused by vibration or external impact.

[0049] In some specific embodiments, the metal substrate 11 is connected to the sensor substrate 2 by solder or conductive silver paste, thereby connecting the housing 1 and the substrate 2. While ensuring the structural integrity of the sensor, the housing 1 can also be grounded through the substrate 2, which effectively reduces the interference of stray signals on the sensor measurement and ensures the accuracy and stability of the sensor measurement.

[0050] In this embodiment, the protective area 112 on the metal substrate 11 can be any area on the surface of the metal substrate 11 other than the connecting area 111. Without the insulating layer 12, the protective area 112 on the metal substrate 11 would be directly exposed, making it susceptible to contact with other corrosive liquids or metallic materials, thus causing structural damage to the metal substrate 11. However, this embodiment provides an insulating layer 12 in the protective area 112 to protect it. The insulating layer 12 improves the durability and corrosion resistance of the housing 1, ensuring the structural integrity of the housing; it also allows the sensor to maintain stable performance in harsh environments, improving the sensor's accuracy and lifespan.

[0051] The housing 1 provided in this application embodiment includes a metal substrate 11, on which there is a connection area 111 and a protective area 112. The metal substrate 11 is used to connect to the substrate 2 of the sensor through the connection area 111. An insulating layer 12 is disposed in the protective area 112 to protect the protective area 112, thereby ensuring the structural integrity of the housing and improving the accuracy and lifespan of the sensor.

[0052] In one embodiment, the insulating layer 12 is an insulating coating obtained by electrophoresis.

[0053] In this embodiment, the insulating coating obtained by electrophoresis can form a uniform and dense insulating coating in the protective area 112 of the metal substrate 11, so as to effectively isolate the electrical contact between the metal substrate 11 and the external environmental components and ensure the stable electrical performance of the sensor.

[0054] Specifically, when performing electrophoretic treatment on the metal substrate 11, the connection area 111 of the metal substrate 11 can be covered first to prevent the connection area 111 from forming an insulating coating that would affect the connection with the substrate 2; then the metal substrate 11 is placed in an electrophoretic pool for electrophoretic operation, which can form a uniform insulating coating in the protective area 112 of the metal substrate 11.

[0055] In one embodiment, the thickness of the insulating layer 12 is 3μm-20μm.

[0056] In this embodiment, when the thickness of the insulating layer 12 is controlled within the range of 3μm-20μm, it can effectively isolate the protective area 112 of the metal substrate 11 from external contact, ensuring the insulation of the metal substrate 11; it can also avoid the insulating layer 12 being too thick, which would cause large internal stress inside the insulating layer 12, preventing the insulating layer 12 from cracking, and thus helping to maintain the integrity and structural stability of the shell 1.

[0057] In some specific embodiments, the thickness of the insulating layer 12 is 5μm, 8μm, 10μm, 13μm or 16μm. The specific thickness of the insulating layer 12 can be selected according to the insulation requirements of the metal substrate 11, so as to simplify the forming process of the insulating layer 12 while ensuring the insulation effect of the shell 1.

[0058] In some embodiments, see Figure 2 The metal matrix 11 is ring-shaped;

[0059] In the axial direction of the metal substrate 11, a connecting region 111 is formed on one side end face of the metal substrate 11, and an opening 13 is formed on the other side end face of the metal substrate 11.

[0060] In the above embodiments, an accommodating space can be formed inside the annular metal substrate 11. This accommodating space can be used to house other devices of the sensor, enabling the sensor to maintain a stable working state.

[0061] In this embodiment, the axial direction of the metal substrate 11 can be... Figure 2 In the vertical direction, the bottom end face of the metal substrate 11 forms a connection area 111, so that the metal substrate 11 can be installed to the substrate 2 of the sensor through the connection area 111; the top end face of the metal substrate 11 forms an opening 13, through which the sensor can sense external temperature, humidity and pressure information, ensuring the timeliness and accuracy of the sensor.

[0062] In one embodiment, see Figure 2 The outer periphery of the housing 1 has an annular groove 14, which is used to set a seal.

[0063] In this embodiment, when the sensor is installed in the electronic device, a sealing ring can be inserted into the annular groove 14 on the outer periphery of the housing 1. The sealing ring is sandwiched between the housing 1 and the internal structure of the electronic device, thereby ensuring the sealing effect of the sensor. For example, a waterproof sensor can be formed in the electronic device. Moreover, the setting of the annular groove 14 increases the contact area between the metal substrate 11 and the sealing element, thereby enhancing the connection strength of the sensor in the electronic device and facilitating the installation and removal of the sensor.

[0064] In one embodiment, the adhesion between the insulating layer 12 and the metal substrate 11 is greater than or equal to 80N, for example, the adhesion between the insulating layer 12 and the metal substrate 11 is 100N, 180N, 300N or 500N, so as to ensure the bonding strength and stability between the insulating layer 12 and the metal substrate 11.

[0065] See Figures 3 to 5 This application provides a method for manufacturing a housing, applied to the aforementioned housing 1. The method includes:

[0066] S101, the cover is attached to the metal substrate and covers the connection area;

[0067] S102, clamping the cover, moving the metal substrate to the processing space by moving the cover;

[0068] S103, a protective treatment is applied to the metal substrate to form an insulating layer in the protected area of ​​the metal substrate.

[0069] In this embodiment, see Figure 3 and Figure 4 In step S101, connecting the cover to the metal substrate and covering the connection area can specifically involve first die-cutting a cover 100 with a clamping end, then connecting the covering end of the cover 100 to the metal substrate 11, with the covering end covering the connection area 111 of the metal substrate 11 to form protection for the connection area 111 of the metal substrate 11.

[0070] The operation of clamping the cover and moving the metal substrate to the processing space in step S102 can be specifically as follows: a metal jig is used to clamp the clamping end of the cover 100, so that the cover 100 and the metal substrate 11 are moved together by moving the cover 100 through the metal jig, thereby moving the metal substrate 11 to the processing space, so that the protective area 112 of the metal substrate 11 can be protected.

[0071] The protective treatment of the metal substrate in step S103 may include electrophoresis, electrodeposition and sputtering, etc., to form a uniform and dense insulating layer 12 in the protective area of ​​the metal substrate, and the protective area 112 is protected by the insulating layer 12.

[0072] In one specific embodiment, for the annular metal substrate 11, the covering end of the cover 100 can be annular to fit the connection area 111 of the metal substrate 11, so as to ensure comprehensive protection of the connection area 111. The cover 100 can be a conductive tape with a certain hardness, so as to facilitate the metal jig to grasp the cover 100 while ensuring that the covering end of the cover 100 is connected to the metal substrate 11.

[0073] In one embodiment, see Figure 5 The treatment space is an electric swimming pool, and the protective treatment is electrophoresis.

[0074] In this embodiment, the protective treatment of the metal substrate can be electrophoresis. When performing electrophoresis on the metal substrate 11, the connection area 111 of the metal substrate 11 can be covered by the cover 100 to prevent the connection area 111 from forming an insulating coating that would affect the connection with the substrate 2. Then, the metal substrate 11 is placed in an electrophoresis pool for electrophoresis, which can form a uniform insulating coating in the protective area 112 of the metal substrate 11.

[0075] To ensure the stability and service life of the insulating coating, it can be cleaned and dried after a uniform insulating coating is formed, so that the insulating coating is denser and more stable.

[0076] See Figure 6 This application provides a sensor, which includes a substrate 2 and the aforementioned housing 1;

[0077] The connection area of ​​the housing 1 is connected to the substrate 2.

[0078] In this embodiment, the metal substrate 11 of the housing 1 is used to connect to the substrate 2 of the sensor through the connection area 111; the insulating layer 12 is disposed in the protective area 112 to protect the protective area 112, ensuring the structural integrity of the housing 1 and improving the accuracy and lifespan of the sensor.

[0079] In some embodiments, see Figure 6 The sensor also includes a sensing chip 3 and a sensor body 4;

[0080] A receiving cavity is formed inside the housing 1, the sensing chip 3 is disposed in the receiving cavity and electrically connected to the substrate 2, and the sensor 4 is filled in the receiving cavity and used to sense the external air pressure.

[0081] In this embodiment, the sensing chip 3 includes an ASIC (Application-specific integrated circuit) part 31 and a MEMS (Micro-Electro-Mechanical System) part 32. The MEMS part 32 can sense external physical signals, such as external acceleration, pressure and temperature, in a micro-nano volume, thus realizing the miniaturization of the sensor. The ASIC part 31 converts and amplifies the weak signals sensed by the MEMS part 32 so that they can be effectively processed by subsequent circuits.

[0082] In one embodiment, the sensor fabrication process includes:

[0083] S201, the ASIC part 31 is attached to the substrate 2 and the ASIC part 31 and the substrate 2 are connected by wire bonding.

[0084] S202, the MEMS part 32 is bonded to the ASIC part 31, and the MEMS part 32 and the substrate 2 are connected by wire bonding.

[0085] S203, Connect housing 1 to substrate 2 and surround sensor chip 3;

[0086] S204, The sensor 4 is injected into the housing cavity.

[0087] In this embodiment, after the sensor is manufactured, calibration tests can be performed on the sensor to ensure its stability in use.

[0088] In one specific embodiment, the housing 1 has an opening 13 for sensing air pressure, and the sensor 4 can be a gel. The gel is poured into the cavity through the opening 13 of the housing 1. The gel not only protects the sensing chip 3, but also deforms when sensing external physical signals. The deformation of the gel is used to transmit signals to the sensing chip 3, so as to realize the sensor's perception of external signals.

[0089] In one embodiment, the sensor can be a barometric pressure sensor, which measures the ambient air pressure and then uses the air pressure value to calculate the altitude.

[0090] In related technologies, when barometric pressure sensors are applied to electronic devices, the sensor housing can be made of stainless steel and grounded. The electronic device housing is typically also made of metal, such as aluminum. When the barometric pressure sensor is mounted on the electronic device, the sensor housing and the electronic device housing make hard contact. To achieve anti-interference characteristics, the electronic device housing is also grounded. When the electronic device comes into contact with external liquids, such as sweat or seawater, the metals in contact with the pressure sensor housing and the electronic device housing have different reactivity—specifically, aluminum is more reactive than stainless steel. Aluminum will undergo a chemical reaction in the liquid, leading to galvanic corrosion.

[0091] This application embodiment achieves insulation of the housing by applying a coating to the surface of the housing, thereby preventing the housing of the barometric pressure sensor from contacting the outer casing of the electronic device. At the same time, it ensures that the metal housing of the sensor is grounded, maintaining the sensor's anti-interference capability.

[0092] This application also provides an electronic device, which includes the aforementioned housing 1; or,

[0093] This includes the sensors mentioned above.

[0094] In this embodiment, when the housing 1 is installed in the electronic device, the metal substrate 11 of the housing 1 is used to connect to the substrate 2 of the sensor through the connection area 111; the insulating layer 12 is disposed in the protective area 112 to protect the protective area 112, ensure the structural integrity of the housing 1, and improve the sensing stability of the electronic device.

[0095] In this embodiment, when a sensor is installed in an electronic device, the metal substrate 11 of the sensor is connected to the substrate 2 of the sensor through the connection area 111; the insulating layer 12 is disposed in the protective area 112 to protect the protective area 112, ensuring the structural integrity of the housing and improving the accuracy and lifespan of the sensor.

[0096] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A housing for a sensor, characterized in that, include: A metal substrate (11) having a connection area (111) and a protective area (112) thereon, the metal substrate (11) being used to connect to the substrate (2) of the sensor through the connection area (111); An insulating layer (12) is disposed in the protective area (112).

2. The housing according to claim 1, characterized in that, The insulating layer (12) is an insulating coating obtained by electrophoresis.

3. The housing according to claim 1, characterized in that, The thickness of the insulating layer (12) is 3-20 μm.

4. The housing according to claim 1, characterized in that, The metal matrix (11) is annular; In the axial direction of the metal substrate (11), the connecting region (111) is formed on one side end face of the metal substrate (11), and the opening (13) is formed on the other side end face of the metal substrate (11).

5. The housing according to claim 4, characterized in that, The outer periphery of the housing has an annular groove (14) for setting a seal.

6. A method for manufacturing a shell, applied to the shell according to any one of claims 1-5, characterized in that, include: The cover is attached to the metal substrate and covers the connection area; Clamp the cover, and move the cover to move the metal substrate to the processing space; The metal substrate is subjected to a protective treatment to form an insulating layer in the protected area of ​​the metal substrate.

7. The manufacturing method according to claim 6, characterized in that, The processing space is an electrophoresis pool, and the protective treatment is electrophoresis.

8. A sensor, characterized in that, It includes a substrate (2) and a housing (1) as described in any one of claims 1-5; The connection area of ​​the housing (1) is connected to the substrate (2).

9. The sensor according to claim 8, characterized in that, It also includes a sensing chip (3) and a sensor (4); The housing (1) forms a cavity, the sensing chip (3) is disposed in the cavity and electrically connected to the substrate (2), and the sensor (4) is filled in the cavity and used to sense external air pressure.

10. An electronic device, characterized in that, Includes the housing (1) as described in any one of claims 1-5; or, Includes the sensor described in claim 8 or 9.

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