Split structure and glue injection packaging process for photoelectric switch sensor
By using a split structure and potting encapsulation process, combined with a silent fan, transmission components, and dust removal components, the problem of dust accumulation and heat dissipation in photoelectric switch sensors is solved, enabling automatic cleaning of the dustproof plate and efficient heat dissipation, thus ensuring the stable operation of the sensor.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG CHAU LIGHT SOURCE INFRARED SEMICON CO LTD
- Filing Date
- 2026-02-06
- Publication Date
- 2026-06-05
AI Technical Summary
Existing high-power photoelectric switch sensors have limitations in terms of heat dissipation and dust prevention. The electrostatic adsorption effect leads to dust accumulation, the dustproof mesh is prone to clogging, the local heat dissipation capacity is insufficient, and it is impossible to effectively clean the electrostatically adsorbed dust and concentrate heat dissipation.
It adopts a split structure design, combining a silent fan, transmission components and dust removal components. The dustproof plate is automatically cleaned through the cooperation of the transmission sleeve and the tilting block. The filter holes are cleaned by the magnetic brush plate, and the sliding of the built-in holes increases the heat dissipation area to achieve efficient heat dissipation.
It effectively prevents dust from re-adsorbing, cleans the dust filter holes, improves heat dissipation efficiency, avoids localized high temperatures, and ensures the stable operation of the photoelectric switch sensor.
Smart Images
Figure CN122149547A_ABST