A high-efficiency heat dissipation device applied to a server chip

Abstract

The application discloses a kind of high-efficiency heat dissipation device applied to server chip, belong to computer equipment heat dissipation technical field, to solve the problems such as insufficient heat dissipation efficiency, temperature distribution is uneven and cooling resource waste of prior art.The device includes: with the composite heat-conducting base that server chip is conformed to, it includes high heat-conducting metal substrate and high heat-conducting interface material layer;Ejector plate assembly is set on the top of base, its bottom is equipped with microporous injection array, for cooling liquid with high-speed turbulent injection to base;Flow guide heat dissipation component, including heat dissipation fin group, the heat-conducting pipe array of connecting base and fin group, and for guiding external airflow flow guide;And intelligent temperature control component, including temperature sensor, controller and actuating mechanism, for adjusting heat dissipation intensity according to chip temperature.The application is combined by liquid cooling and air cooling, and is supplemented with intelligent energy-saving control, realizes the heat dissipation effect of high efficiency, energy saving, low noise, and improves the utilization of cooling resource.

Description

Technical Field

[0001] This invention relates to the field of computer equipment heat dissipation technology, and in particular to a high-efficiency heat dissipation device for server chips. Background Technology

[0002] As the integration and computing performance of server chips continue to improve, their power consumption has increased dramatically, making heat dissipation a key bottleneck restricting chip performance and stability. Existing heat dissipation technologies are mainly divided into air cooling and liquid cooling. Air cooling is mature and low-cost, but its heat dissipation efficiency is insufficient for high-power chips. Liquid cooling, especially cold-plate liquid cooling, has higher heat dissipation efficiency, but traditional cold-plate designs have inherent defects: First, the coolant easily forms a stable laminar boundary layer within the microchannels, hindering efficient heat transfer and leading to uneven temperature distribution on the chip surface, easily generating local hot spots; second, the microscopic unevenness between the cold plate and the chip surface creates significant contact thermal resistance, limiting the efficiency of heat conduction from the chip to the cold plate. Furthermore, in the compact space of a server, cooling airflow passing through secondary heat sources such as memory and storage is usually directly exhausted, leaving its remaining cooling capacity unutilized, resulting in a waste of cooling resources.

[0003] Therefore, existing technologies generally suffer from technical problems such as insufficient heat dissipation efficiency, uneven temperature distribution, waste of cooling resources, and high energy consumption and noise. Summary of the Invention

[0004] The main objective of this invention is to provide a high-efficiency heat dissipation device for server chips, aiming to solve the problems of insufficient heat dissipation efficiency, uneven temperature distribution, waste of cooling resources, and high energy consumption and noise in the prior art.

[0005] To achieve the above objectives, the present invention provides a high-efficiency heat dissipation device for server chips, comprising: a composite thermally conductive base for bonding with a server chip, the composite thermally conductive base including a high thermal conductivity metal substrate and a high thermal conductivity interface material layer coated between the high thermal conductivity metal substrate and the bonding surface of the server chip; a jet cooling plate assembly disposed above the composite thermally conductive base, the bottom of the jet cooling plate assembly having a micro-hole spray array facing the composite thermally conductive base for spraying coolant onto the composite thermally conductive base in the form of high-speed turbulent flow; and a heat dissipation guiding assembly including a heat dissipation fin assembly and a connection between the composite thermally conductive base and the server chip. The heat pipe array of the heat sink fin assembly, and the air guide; the air guide has an air inlet for receiving external airflow and an air outlet for guiding the airflow to the heat sink fin assembly; and an intelligent temperature control component, including a temperature sensor, controller, and actuator disposed on the composite thermally conductive base for collecting the server chip temperature; the actuator includes a flow regulating valve for adjusting the coolant flow rate and a speed-regulating fan disposed at the heat sink fin assembly; the controller is used to adjust the operating state of the flow regulating valve and the speed-regulating fan according to the server chip temperature collected by the temperature sensor to control the heat dissipation intensity.

[0006] Optionally, the high thermal conductivity interface material layer is a graphene composite nano-ceramic coating. This coating has extremely high thermal conductivity, and its nano-components can effectively fill the microscopic gaps between the chip and the base, thereby significantly reducing contact thermal resistance and improving the heat conduction efficiency from the chip to the composite thermally conductive base.

[0007] Optionally, the high thermal conductivity interface material layer is a liquid metal thermal paste. Liquid metal thermal paste also has excellent thermal conductivity and fluidity, and can perfectly fill the contact interface to form a low thermal resistance thermal conduction path.

[0008] Optionally, the jet cooling plate assembly has a pump-free jet structure, which includes a pressurization chamber at the coolant inlet for pressurizing the coolant. This structure allows for coolant pressurization using fluid dynamics principles without the need for an external water pump, ensuring a sufficiently velocity jet as it passes through the micro-orifice jet array, simplifying the system structure and reducing energy consumption.

[0009] Optionally, the diameter of the micropores in the micro-orifice jet array is 0.5-1 mm, and the spacing between adjacent micropores is 2-3 mm. This size range of micropores and spacing design helps to optimize the jet morphology, forming a stable and uniformly covered high-speed turbulent flow, thereby efficiently impacting and breaking the thermal boundary layer on the surface of the composite heat-conducting base, achieving a highly efficient and uniform heat exchange effect.

[0010] Optionally, the air guide is an arc-shaped air guide plate. The arc-shaped structure allows the airflow to change direction smoothly, efficiently guiding the external airflow to the heat dissipation fin assembly with minimal pressure loss, thereby improving the airflow utilization efficiency.

[0011] Furthermore, the arc-shaped airflow guide plate forms an angle of 30-45° with the upper surface of the composite heat-conducting base. This angle range is optimized to effectively capture and guide the warm airflow from the secondary heat source inside the server, allowing it to act more fully on the heat dissipation fin assembly and achieving effective secondary utilization of cooling resources.

[0012] Optionally, the controller adjusts the speed of the variable-speed fan and the opening of the flow regulating valve in stages based on at least two preset temperature thresholds. This staged control strategy allows the output power of the cooling system to match the actual heat load of the chip, avoiding energy waste during low-load periods and achieving intelligent energy-saving operation.

[0013] Furthermore, the graded regulation includes: when the server chip temperature is not higher than 60°C, the controller controls the speed of the variable-speed fan to be 1500 r / min to 2000 r / min, and controls the coolant flow rate to be 0.5 L / min to 0.6 L / min; when the server chip temperature is higher than 60°C but not higher than 80°C, the controller controls the speed of the variable-speed fan to be greater than 2000 r / min and less than or equal to 3000 r / min, and controls the coolant flow rate to be greater than 0.6 L / min and less than or equal to 0.8 L / min; and when the server chip temperature is higher than 80°C, the controller controls the speed of the variable-speed fan to be greater than 3000 r / min and less than or equal to 4000 r / min, and controls the coolant flow rate to be greater than 0.8 L / min and less than or equal to 1.0 L / min. This specific three-level regulation scheme provides clear operating parameters for different operating conditions, ensuring that while meeting heat dissipation requirements, energy saving and noise reduction effects are also taken into account.

[0014] Optionally, the heat pipe array includes 4-8 heat pipes. This number of heat pipes provides sufficient heat transport capacity within a limited space, quickly transferring the heat absorbed by the composite heat-conducting base to the distant heat dissipation fin assembly, ensuring a smooth and efficient air-cooled auxiliary heat dissipation path.

[0015] Compared with existing technologies, this invention has the following beneficial effects: 1. High heat dissipation efficiency and good temperature uniformity: By using a high thermal conductivity interface material layer to fill the contact micro-gap, the interface thermal resistance is significantly reduced; at the same time, the high-speed turbulence generated by the jet cold plate assembly directly impacts the heat source, greatly enhancing the convective heat transfer efficiency. The combination of these two factors allows heat to be quickly and uniformly dissipated from the chip, effectively meeting the heat dissipation needs of high-power chips and avoiding the generation of local hot spots. 2. Significant energy saving and noise reduction: The intelligent temperature control component adjusts the fan speed and coolant flow rate in stages according to the real-time temperature of the chip, avoiding continuous high-power operation under low load and significantly reducing the average energy consumption of the system; at the same time, the fan operates at medium to low speeds in most operating conditions, greatly reducing operating noise and improving the working environment of the server. 3. High cooling resource utilization: The airflow guide in the heat dissipation component recovers the warm airflow after it flows through other components (secondary heat sources) in the server and guides it to the heat dissipation fins for auxiliary heat dissipation. It makes full use of every cooling airflow entering the server, further improving the overall heat dissipation efficiency of the system and achieving system-level energy saving. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation device according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of the composite thermal conductive base. Figure 3 yes Figure 1 A schematic diagram of the internal flow path of the mid-jet cold plate assembly. Figure 4 yes Figure 1 A schematic diagram illustrating the working principle of the central flow heat dissipation component. Figure 5 This is a control logic block diagram of the intelligent temperature control component in an embodiment of the present invention. Figure 6 This is an exploded structural diagram of a heat dissipation device according to an embodiment of the present invention.

[0018] Explanation of reference numerals in the attached diagram: 1. Composite thermally conductive base; 2. Jet cooling plate assembly; 3. Flow guiding heat dissipation assembly; 4. Intelligent temperature control assembly; 5. Sealing and protection assembly; 6. Server chip; 7. Server motherboard; 8. Secondary heat source; 11. High thermal conductivity metal substrate; 12. High thermal conductivity interface material layer; 13. Thermally conductive silicone layer; 22. Pressurization chamber; 23. Micro-hole jet array; 24. Diverting chamber; 25. Merging chamber; 26. Liquid inlet; 27. Liquid outlet; 31. Heat dissipation fin assembly; 32. Heat pipe array; 33. Flow guide; 34. Speed-regulating fan; 41. Temperature sensor; 42. Controller; 43. Flow regulating valve. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] Unless otherwise defined, all technical and scientific terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the embodiments of this application is for the purpose of describing the embodiments of this application only and is not intended to limit this application.

[0021] For ease of understanding, some of the nouns and terms used in the embodiments of this application will be explained below.

[0022] (1) Composite thermally conductive base: refers to a component for bonding with server chips, which includes at least a high thermal conductivity metal substrate and a high thermal conductivity interface material layer coated between the substrate and the bonding surface of the server chip, aiming to reduce contact thermal resistance and efficiently conduct heat generated by the chip away.

[0023] (2) Jet cooling plate assembly: refers to a liquid cooling component set above a composite heat-conducting base. Its bottom has a jet array composed of one or more micro-holes, which can directly impact the upper surface of the composite heat-conducting base in the form of high-speed turbulent flow to destroy the heat-conducting boundary layer and achieve efficient heat exchange.

[0024] (3) Airflow heat dissipation component: refers to a heat dissipation component that combines heat conduction and airflow guidance functions. It includes a heat pipe array and heat dissipation fin group for conducting heat from the far end of the composite heat conduction base, and a flow guide for capturing and guiding external airflow (especially warm airflow generated by other components in the server) to blow on the heat dissipation fin group, so as to realize the secondary utilization of cooling resources.

[0025] (4) Intelligent temperature control component: refers to a closed-loop control system for adaptive adjustment of heat dissipation intensity, which includes at least a temperature sensor for collecting chip temperature, a controller for decision-making, and an actuator (such as a speed-regulating fan, flow regulating valve, etc.) for performing heat dissipation adjustment actions.

[0026] (5) Secondary heat sources: Inside the server, in addition to the server chips (such as CPU and GPU) that are mainly cooled, there are other heat-generating components, such as memory modules, storage devices, and power modules. The heat generated by these components will heat the cooling airflow flowing over their surfaces.

[0027] The following will describe in detail, with reference to the accompanying drawings, an embodiment of a high-efficiency heat dissipation device applied to a server chip. Please refer to... Figure 1 , Figure 5 and Figure 6 This application provides a high-efficiency heat dissipation device for a server chip 6, which is mounted on a server motherboard 7 and used to dissipate heat from the high-power server chip 6. The device generally includes a composite thermally conductive base 1, a jet cooling plate assembly 2 disposed above the composite thermally conductive base 1, a heat dissipation and flow guiding assembly 3 thermally connected to the composite thermally conductive base 1, and an intelligent temperature control assembly 4 for adaptive adjustment. In some embodiments, a sealing and protection assembly 5 may also be included to ensure the system's sealing and reliability.

[0028] like Figure 1 As shown, the bottom surface of the composite thermally conductive base 1 is tightly fitted to the top cover of the server chip 6 for efficient heat dissipation from the heat source. The jet cooling plate assembly 2 covers the composite thermally conductive base 1, actively cooling the base through liquid jetting. A portion of the flow-guiding heat dissipation assembly 3 (heat pipe array 32) is connected to the composite thermally conductive base 1, conducting heat to another portion at the far end (heat dissipation fin assembly 31), and providing auxiliary heat dissipation through air cooling. Specifically, the flow-guiding heat dissipation assembly 3 also utilizes the warm airflow generated by other heat-generating components inside the server, namely secondary heat sources 8 (such as memory modules, hard drives, etc.), achieving secondary utilization of cooling resources. The intelligent temperature control assembly 4 serves as the core control unit of the entire heat dissipation system, dynamically adjusting the intensity of liquid cooling and air cooling based on the real-time temperature of the server chip 6 to achieve a good balance between heat dissipation performance and energy consumption / noise.

[0029] Specifically, please refer to Figure 2The composite thermally conductive base 1 includes a high thermal conductivity metal substrate 11 and a high thermal conductivity interface material layer 12 coated between the high thermal conductivity metal substrate 11 and the bonding surface of the server chip 6. The high thermal conductivity metal substrate 11 is preferably a metal material with high thermal conductivity, such as copper or its alloy, with a thermal conductivity of not less than 401 W / (m·K) to ensure rapid heat dissipation within it. In one specific embodiment, the thickness of the high thermal conductivity metal substrate 11 can be designed to be 5-8 mm, for example, 6 mm, ensuring sufficient heat capacity and diffusion capability while avoiding excessive volume and weight. The function of the high thermal conductivity interface material layer 12 is to fill the microscopic uneven gaps between the high thermal conductivity metal substrate 11 and the surface of the server chip 6, eliminating the significant contact thermal resistance caused by the presence of air gaps. In a preferred embodiment, to further enhance the tightness and sealing of the bonding, a thermally conductive silicone layer 13 can also be provided between the high thermal conductivity interface material layer 12 and the server chip 6. The thermally conductive silicone layer 13 has good elasticity and filling properties, and its thickness can be 0.2-0.5mm, for example 0.3mm, which can ensure a tight fit at the macro level.

[0030] Furthermore, the high thermal conductivity interface material layer 12 can be made of various materials with high thermal conductivity. In a preferred embodiment, such as... Figure 2 As shown, the high thermal conductivity interface material layer 12 is a graphene composite nano-ceramic coating. Graphene has extremely high in-plane thermal conductivity, while nano-ceramic particles can effectively fill even the smallest gaps. The coating formed by the combination of the two can have a thickness of 0.1-0.3 mm, for example 0.2 mm, and its horizontal thermal conductivity can reach over 800 W / (m·K). This design enables comprehensive and efficient heat conduction from the first interface where heat is generated, laying the foundation for subsequent heat dissipation processes. Compared with traditional silicone grease, using a graphene composite nano-ceramic coating as the high thermal conductivity interface material layer 12 results in superior thermal conductivity, less susceptibility to drying and failure over long-term use, and higher reliability.

[0031] Please see Figure 3The jet cooling plate assembly 2 is positioned above the composite thermally conductive base 1 for active liquid cooling of the composite thermally conductive base 1. After the coolant enters the jet cooling plate assembly 2 through the inlet 26, it first flows through a pressurization chamber 22. This pressurization chamber 22, through a specific flow channel structure design (e.g., a conical contraction structure), utilizes the Bernoulli effect to locally pressurize the coolant without the need for an additional power pump, forming a pump-free jet structure. This design simplifies the system structure and reduces potential failure points and energy consumption. The pressurized coolant enters the distribution chamber 24 and is evenly distributed to the micro-orifice jet array 23 at the bottom. The micro-orifice jet array 23, facing the upper surface of the composite thermally conductive base 1, is composed of numerous micro-orifices. These micro-orifices spray the coolant onto the upper surface of the composite thermally conductive base 1 in the form of high-speed turbulent flow. The high-speed fluid directly impacts the heat exchange surface, effectively disrupting the stable laminar boundary layer that easily forms within the microchannels of traditional cold plates, greatly enhancing the convective heat transfer coefficient, thereby achieving efficient and uniform heat removal and effectively avoiding the generation of local hot spots on the chip surface. After the impact heat exchange, the coolant spreads on the surface of the composite heat-conducting base 1, absorbs heat and gathers in the manifold 25, and finally flows out from the outlet 27 into the external circulating heat dissipation system (the heat sink and water pump are not shown in the figure).

[0032] In a preferred embodiment, to achieve optimal impact heat transfer, the diameter of the micropores in the micro-orifice jet array 23 can be set to 0.5-1 mm, for example, 0.8 mm; and the spacing between adjacent micropores can be set to 2-3 mm, for example, 2.5 mm. This combination of parameters can ensure sufficient jetting speed and coverage while avoiding excessive flow resistance. In a specific example, the body of the jet cooling plate assembly 2 can be made of aluminum alloy, with a jet array consisting of 36 micropores at the bottom. The coolant can be a mixture of deionized water and ethylene glycol with a volume ratio of 7:3, to balance heat transfer performance and low-temperature antifreeze capability.

[0033] Please see Figure 4 This embodiment also includes a heat dissipation component 3, which works in conjunction with the jet cooling plate component 2 to form a dual heat dissipation path of "liquid cooling + air cooling". The heat dissipation component 3 includes a heat sink fin assembly 31, a heat pipe array 32, and a flow guide 33. One end (evaporation end) of the heat pipe array 32 is embedded or welded into the composite heat-conducting base 1, and the other end (condensation end) passes through the heat sink fin assembly 31. In this way, heat on the composite heat-conducting base 1 that is not directly carried away by the jet cooling, or residual heat after the jet cooling reaches equilibrium, can be rapidly transferred to the heat sink fin assembly 31, which is far from the chip, through the efficient heat transporter, the heat pipe array 32. This design provides heat dissipation redundancy; even in extreme cases where the liquid cooling system fails, the air cooling component can still provide basic heat dissipation capacity, ensuring chip safety.

[0034] In a preferred embodiment, the heat pipe array 32 may include 4-8 heat pipes, such as 6 copper heat pipes with a diameter of 6 mm, to ensure sufficient heat transfer flux. The heat dissipation fin assembly 31 is composed of a large number of aluminum alloy fins to provide a large heat exchange surface area.

[0035] The heat dissipation assembly 3 is equipped with a heat guide 33. For example... Figure 4 As shown, the airflow guide 33 is positioned downstream of the airflow from the secondary heat source 8 (such as a memory module) inside the server chassis. Its function is to capture and guide the warm cooling airflow after it passes through the secondary heat source 8, changing its direction and precisely directing it towards the heatsink fin assembly 31. Although this airflow is slightly warmer, it still possesses considerable cooling potential. Through the design of the airflow guide 33, this airflow, which might otherwise be directly exhausted, is reused to perform forced convection heat transfer on the heatsink fin assembly 31, thereby improving the overall system's heat dissipation capacity without increasing additional fan energy consumption. This demonstrates the efficient integration and utilization of system-level cooling resources.

[0036] In one specific embodiment, the air guide 33 can be a simple arc-shaped air guide plate. To achieve a good air guiding effect, the arc-shaped air guide plate can form an angle of 30-45° with the upper surface of the composite heat-conducting base 1, for example, 35°. This angle range helps to achieve a balance between effectively changing the airflow direction and avoiding excessive wind resistance. The speed-regulating fan 34 is disposed above or to the side of the heat dissipation fin assembly 31 to generate a strong airflow when needed, actively enhancing the heat dissipation effect of the fins.

[0037] Please see Figure 5 The intelligent temperature control component 4 is used to achieve efficient, energy-saving, and low-noise operation of this heat dissipation device. This component includes a temperature sensor 41 mounted on the composite thermally conductive base 1 for collecting the temperature of the server chip 6, a controller 42, and a speed-regulating fan 34 and a flow control valve 43 as actuators. The temperature sensor 41, such as a surface-mount PT100 resistance temperature detector (RTD), is directly mounted on the composite thermally conductive base 1 closest to the heat source, enabling it to accurately reflect the temperature changes of the server chip 6 in real time. The controller 42, such as an STM32 microcontroller, continuously receives temperature signals from the temperature sensor 41.

[0038] The controller 42 has at least two preset temperature thresholds for graded adjustment of heat dissipation intensity. When the controller 42 determines that the current temperature is in different ranges, it sends different control commands to the speed-regulating fan 34 and the flow regulating valve 43 to adjust the fan speed and the coolant flow rate. This on-demand adjustment strategy avoids the energy waste and noise pollution caused by the cooling system always running at full power regardless of the chip load.

[0039] In a preferred embodiment, the graded adjustment may include the following three levels: When the temperature of the server chip 6 is not higher than 60°C, it indicates that the chip is under low load. At this time, the controller 42 controls the speed of the speed-regulating fan 34 to a low 1500 r / min to 2000 r / min, and controls the flow rate of the coolant to a low 0.5 L / min to 0.6 L / min, in order to maintain the lowest energy consumption and noise; When the temperature of the server chip 6 is higher than 60°C but not higher than 80°C, it indicates that the chip is under medium load. The controller 42 increases the speed of the speed-regulating fan 34 to greater than 2000 r / min. The speed of the variable-speed fan 34 is increased to a speed greater than 3000 r / min and less than or equal to 4000 r / min, and the opening of the flow regulating valve 43 is increased to increase the flow of the coolant to a speed greater than 0.6 L / min and less than or equal to 0.8 L / min to cope with the increased heat load. When the temperature of the server chip 6 is higher than 80°C, it indicates that the chip is under high load or full load. The controller 42 then instructs the variable-speed fan 34 to operate at a high speed greater than 3000 r / min and less than or equal to 4000 r / min, and increases the opening of the flow regulating valve 43 to increase the flow of the coolant to a speed greater than 0.8 L / min and less than or equal to 1.0 L / min, so as to ensure that the heat dissipation requirements under peak power consumption are met.

[0040] In summary, this embodiment reduces interfacial thermal resistance from the source by using the composite thermally conductive base 1, utilizes the jet cold plate assembly 2 for efficient and uniform active liquid cooling, uses the flow-guided heat dissipation assembly 3 to achieve air cooling assistance and secondary utilization of cooling resources, and uses the intelligent temperature control assembly 4 for refined and adaptive global control. The four components work together to achieve efficient, energy-saving, and low-noise heat dissipation for high-power server chips.

[0041] In another embodiment, the high thermal conductivity interface material layer 12 of the composite thermally conductive base 1 can be made of other high-performance materials. For example, it can be liquid metal thermal paste. The overall structure of this embodiment is basically the same as the previous embodiment, the main difference being that a layer of liquid metal thermal paste with a thickness of about 0.1 mm is filled between the high thermal conductivity metal substrate 11 and the server chip 6 to replace the graphene coating. Liquid metal (such as gallium-based alloy) is liquid at room temperature, has extremely high thermal conductivity and excellent fluidity, and can well fill the microscopic gaps between the chip top cover and the thermally conductive base, and can also achieve an extremely low thermal resistance path. Heat is conducted from the chip to the liquid metal thermal paste, and then efficiently transferred to the high thermal conductivity metal substrate 11. The subsequent jet cooling, air-assisted heat dissipation and intelligent temperature control process is completely consistent with the previous embodiment. The core effect of this invention does not depend on a specific interface material, but rather stems from the synergistic design of "low thermal resistance interface + jet impact + intelligent temperature control", and has good technical compatibility.

[0042] Furthermore, to adapt to different server internal layouts, the airflow guide 33 in the airflow cooling assembly 3 can also adopt other structural forms. In a variant embodiment, the airflow guide 33 is no longer a fixed arc-shaped airflow guide plate, but consists of a set of adjustable-angle louvered airflow guide plates. These airflow guide plates are installed behind the secondary heat source 8, and their angles can be manually adjusted or finely adjusted by a micro motor. During initial server assembly or later maintenance, technicians can adjust the angle of the louvered airflow guide plates according to the internal airflow test results, so that the airflow passing through the secondary heat source 8 can optimally cover the effective heat exchange area of ​​the heat dissipation fin assembly 31. This design provides greater flexibility and adaptability, and can cope with more diverse internal airflow environments of servers. This also proves that the concept of "airflow guide" in this invention encompasses a variety of specific structures that can achieve airflow guidance functions, and is not limited to arc-shaped plates.

[0043] The heat dissipation device provided in this embodiment also has good scalability, and can be adapted to the heat dissipation requirements of chips with different power consumption levels by adjusting parameters. For example, in scenarios applied to server graphics processors (GPUs) with power consumption up to 500W, the components of the device can be strengthened accordingly. In this embodiment, the size of the composite heat-conducting base 1 can be increased to 60mm×60mm×8mm to cover a larger GPU core area. The size of the jet cooling plate assembly 2 is correspondingly increased, and the number of its micro-hole jet array 23 can be increased to 64 to provide stronger impact cooling capability. At the same time, the number of heat pipe arrays 32 in the heat dissipation assembly 3 is increased to 8, the size of the heat dissipation fin group 31 is also correspondingly increased, and more speed-adjustable fans 34 can be equipped. The temperature threshold and control parameters of the controller 42 in the intelligent temperature control assembly 4 are also adjusted accordingly, for example, the trigger temperature for high-speed operation is increased to 85°C, and higher fan speed and coolant flow rate are matched. This embodiment demonstrates that the solution of the present invention has good engineering application flexibility, and can adapt to the heat dissipation requirements of chips with different power consumption levels through modular parameter adjustment, with a wide range of applications.

[0044] The heat dissipation device provided by this invention can be widely used in various data center servers, high-performance computing (HPC) clusters, artificial intelligence training servers, and edge computing nodes with stringent heat dissipation requirements. Especially for devices equipped with high-power CPUs, GPUs, FPGAs, or application-specific integrated circuits (ASICs), this invention, through its combination of liquid and air cooling, supplemented by intelligent energy-saving control, can significantly reduce the total cost of ownership (TCO) of data centers while meeting extreme heat dissipation needs. Its modular design also facilitates installation, maintenance, and upgrades.

Claims

1. A high-efficiency heat dissipation device applied to a server chip, characterized in that, include: A composite thermally conductive base for bonding with a server chip, the composite thermally conductive base comprising a high thermal conductivity metal substrate and a high thermal conductivity interface material layer coated between the high thermal conductivity metal substrate and the bonding surface of the server chip; A jet cooling plate assembly is disposed above the composite heat-conducting base. The bottom of the jet cooling plate assembly is provided with a micro-hole spray array facing the composite heat-conducting base, which is used to spray coolant into the composite heat-conducting base in the form of high-speed turbulence. The heat dissipation assembly includes a heat dissipation fin assembly, a heat pipe array connecting the composite heat-conducting base and the heat dissipation fin assembly, and a flow guide; the flow guide has an air inlet for receiving external airflow and an air outlet for guiding the airflow to the heat dissipation fin assembly. The intelligent temperature control component includes a temperature sensor, a controller, and an actuator mounted on the composite thermally conductive base for collecting the temperature of the server chip; the actuator includes a flow regulating valve for adjusting the flow rate of the coolant and a speed-regulating fan mounted on the heat dissipation fin assembly; the controller is used to adjust the operating state of the flow regulating valve and the speed-regulating fan according to the temperature of the server chip collected by the temperature sensor to control the heat dissipation intensity.

2. The apparatus of claim 1, wherein, The high thermal conductivity interface material layer is a graphene composite nano-ceramic coating.

3. The apparatus according to claim 1, characterized in that, The high thermal conductivity interface material layer is a liquid metal thermal paste.

4. The apparatus according to claim 1, characterized in that, The jet cooling plate assembly has a pump-free jet structure, which includes a pressurization chamber at the coolant inlet for pressurizing the coolant.

5. The apparatus according to claim 1, characterized in that, The diameter of the micropores in the micropore jet array is 0.5-1 mm, and the spacing between adjacent micropores is 2-3 mm.

6. The apparatus according to claim 1, characterized in that, The flow guide is an arc-shaped flow guide plate.

7. The apparatus according to claim 6, characterized in that, The arc-shaped guide plate forms an angle of 30-45° with the upper surface of the composite heat-conducting base.

8. The apparatus according to claim 1, characterized in that, The controller adjusts the speed of the variable speed fan and the opening of the flow regulating valve in stages according to at least two preset temperature thresholds.

9. The apparatus according to claim 8, characterized in that, The graded adjustment includes: When the temperature of the server chip is not higher than 60°C, the controller controls the speed of the variable speed fan to be 1500 r / min to 2000 r / min, and controls the flow rate of the coolant to be 0.5 L / min to 0.6 L / min; When the temperature of the server chip is higher than 60°C but not higher than 80°C, the controller controls the speed of the variable-speed fan to be greater than 2000 r / min and less than or equal to 3000 r / min, and controls the flow rate of the coolant to be greater than 0.6 L / min and less than or equal to 0.8 L / min; and When the temperature of the server chip is higher than 80°C, the controller controls the speed of the speed-regulating fan to be greater than 3000 r / min and less than or equal to 4000 r / min, and controls the flow rate of the coolant to be greater than 0.8 L / min and less than or equal to 1.0 L / min.

10. The apparatus according to claim 1, characterized in that, The heat pipe array comprises 4-8 heat pipes.

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