Capacitive touch panel

Abstract

A capacitive touch panel includes a substrate module, a plurality of sensing electrodes, a plurality of driving electrodes, and a plurality of light emitting diode chips mounted on the substrate module. The plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing area of the capacitive touch panel, wherein the touch sensing area is divided into a plurality of sensing units with the same area. Each of the light emitting diode chips is disposed in one of the sensing units, and the position of each of the light emitting diode chips corresponds to the intersection of the sensing electrode and the driving electrode. Accordingly, the touch effect of the capacitive touch panel can be avoided from being affected by the position of any one of the light emitting diode chips.

Description

[0001] This application is a divisional application of Chinese Invention Patent Application No. 2021115881948, filed on December 23, 2021, entitled "Capacitive Touch Panel". Technical Field

[0002] This invention relates to a touch panel, and more particularly to a capacitive touch panel. Background Technology

[0003] Existing capacitive touch panels typically have multiple LED chips placed on the side, with a light guide plate used to guide the light emitted by the LED chips. However, the touch performance of the side portion of existing capacitive touch panels is affected by the presence of multiple LED chips.

[0004] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0005] The present invention provides a capacitive touch panel that can effectively improve the defects that may occur in existing capacitive touch panels.

[0006] This invention discloses a capacitive touch panel, comprising: a substrate module; a sensing electrode layer including a plurality of sensing electrodes formed on the substrate module; a driving electrode layer including a plurality of driving electrodes formed on the substrate module, wherein the plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing area of ​​the capacitive touch panel, wherein the touch sensing area is divided into a plurality of sensing units having the same area; and a plurality of light-emitting diode chips mounted on the substrate module, each light-emitting diode chip being placed in one of the sensing units, and the position of each light-emitting diode chip corresponding to the boundary between the sensing electrode and the driving electrode, but without affecting the capacitance change between the sensing electrode and the driving electrode.

[0007] Preferably, the substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein the plurality of light-emitting diode chips are placed on one of the substrates and defined as a first substrate, and the plurality of sensing electrodes and the plurality of driving electrodes are disposed on at least one other substrate other than the first substrate.

[0008] Preferably, the capacitive touch panel further includes a controller electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light-emitting diode chips via the substrate module; wherein, when a conductor forms a coupling capacitor with at least one of the sensing electrodes, the controller can drive at least one of the light-emitting diode chips adjacent to at least one of the sensing electrodes forming the coupling capacitor to emit light.

[0009] Preferably, the substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein a plurality of sensing electrodes and a plurality of driving electrodes are disposed on one of the substrates and defined as a first substrate, and a plurality of light-emitting diode chips are disposed on another substrate other than the first substrate.

[0010] Preferably, the substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein the plurality of sensing electrodes are placed on one of the substrates and defined as a first substrate, and the plurality of driving electrodes and the plurality of light-emitting diode chips are disposed on another substrate other than the first substrate.

[0011] This invention also discloses a capacitive touch panel, comprising: a substrate module; a sensing electrode layer including a plurality of sensing electrodes formed on the substrate module; a driving electrode layer including a plurality of driving electrodes formed on the substrate module, wherein the plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing area of ​​the capacitive touch panel, wherein the touch sensing area is divided into a plurality of sensing units having the same area; and a plurality of light-emitting diode chips mounted on the substrate module, wherein each light-emitting diode chip is placed in two adjacent sensing units, and the position of each light-emitting diode chip corresponds to the boundary between the sensing electrode and the driving electrode, but does not affect the capacitance change between the sensing electrode and the driving electrode.

[0012] Preferably, the substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein the plurality of light-emitting diode chips are placed on one of the substrates and defined as a first substrate, and the plurality of sensing electrodes and the plurality of driving electrodes are disposed on at least one other substrate other than the first substrate.

[0013] Preferably, the capacitive touch panel further includes a controller electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light-emitting diode chips via the substrate module; wherein, when a conductor forms a coupling capacitor with at least one of the sensing electrodes, the controller can drive at least one of the light-emitting diode chips adjacent to at least one of the sensing electrodes forming the coupling capacitor to emit light.

[0014] Preferably, the substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein a plurality of sensing electrodes and a plurality of driving electrodes are disposed on one of the substrates and defined as a first substrate, and a plurality of light-emitting diode chips are disposed on another substrate other than the first substrate.

[0015] Preferably, the substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein the plurality of sensing electrodes are placed on one of the substrates and defined as a first substrate, and the plurality of driving electrodes and the plurality of light-emitting diode chips are disposed on another substrate other than the first substrate.

[0016] In summary, the capacitive touch panel disclosed in the embodiments of the present invention, through the combination of multiple light-emitting diode chips and other components (e.g., each light-emitting diode chip is placed in a sensing unit, and the position of each light-emitting diode chip corresponds to the junction of the sensing electrode and the driving electrode), enables the touch effect of the capacitive touch panel to avoid being affected by the position of any one of the light-emitting diode chips, and the capacitive touch panel can also have delicate local optical changes.

[0017] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0018] Figure 1 This is a plan view of the capacitive touch panel according to Embodiment 1 of the present invention.

[0019] Figure 2 for Figure 1 A schematic cross-sectional view along section line II-II.

[0020] Figure 3 This is a partial circuit diagram (I) of the capacitive touch panel according to Embodiment 1 of the present invention.

[0021] Figure 4This is a partial circuit diagram (II) of the capacitive touch panel according to Embodiment 1 of the present invention.

[0022] Figure 5 This is a plan view of the capacitive touch panel according to Embodiment 2 of the present invention.

[0023] Figure 6 for Figure 5 A cross-sectional view along section line VI-VI.

[0024] Figure 7 This is a partial cross-sectional schematic diagram of the capacitive touch panel according to Embodiment 3 of the present invention.

[0025] Figure 8 This is a plan view of the capacitive touch panel according to Embodiment 4 of the present invention.

[0026] Figure 9 for Figure 8 A cross-sectional view along section line IX-IX.

[0027] Figure 10 This is a plan view of the capacitive touch panel according to Embodiment 5 of the present invention.

[0028] Figure 11 This is a plan view of the capacitive touch panel according to Embodiment Six of the present invention.

[0029] Figure 12 This is a plan view of the capacitive touch panel according to Embodiment 7 of the present invention.

[0030] Figure 13 This is a plan view of the capacitive touch panel according to Embodiment 8 of the present invention. Detailed Implementation

[0031] The following specific embodiments illustrate the implementation of the "capacitive touch panel" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0032] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0033] [Example 1]

[0034] Please see Figures 1 to 4 As shown, this is an embodiment of the present invention. Figure 1 and Figure 2 As shown, this embodiment discloses a capacitive touch panel 100, which includes a substrate module 1, a sensing electrode layer 2, a driving electrode layer 3, a plurality of light-emitting diode chips 4, a protective layer 5, and a controller 6. The sensing electrode layer 2, the driving electrode layer 3, the plurality of light-emitting diode chips 4, and the controller 6 are all mounted on the substrate module 1, and the protective layer 5 covers the sensing electrode layer 2 and the plurality of light-emitting diode chips 4.

[0035] It should be noted that the capacitive touch panel 100 described in this embodiment is based on the inclusion of the aforementioned components, but the present invention is not limited thereto. For example, in other embodiments not illustrated in this invention, the protective layer 5 may be omitted from the capacitive touch panel 100, or other components may be used to replace the protective layer. The structure of each component of the capacitive touch panel 100 will be described first, and then the connection relationships between the various components of the capacitive touch panel 100 will be explained as appropriate.

[0036] The substrate module 1 defines a normal direction D, and the substrate module 1 includes a plurality of substrates 10 arranged along the normal direction D; that is, in this embodiment, the surface of any one of the substrates 10 is perpendicular to the normal direction D. For ease of explanation of this embodiment, the plurality of substrates 10 are sequentially defined with a first substrate 11, a second substrate 12, and a third substrate 13 spaced apart from each other along a direction away from the protective layer 5, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the substrate module 1 may omit the third substrate 13 or add other substrates.

[0037] The sensing electrode layer 2 includes a plurality of sensing electrodes 21 formed on the substrate module 1. In this embodiment, the plurality of sensing electrodes 21 are spaced apart from each other and formed on the surface of the first substrate 11 adjacent to the protective layer 5 (e.g., ...). Figure 2The first substrate 11 in the diagram is the top surface of the substrate 11, but the invention is not limited thereto. For example, in other embodiments not illustrated in the invention, at least one of the sensing electrodes 21 may be formed on the surface of the first substrate 11 away from the protective layer 5 (e.g., the top surface of the first substrate 11). Figure 2 (The bottom surface of the first substrate 11 in the middle).

[0038] The driving electrode layer 3 and the sensing electrode layer 2 are located at different heights in the normal direction D, and the driving electrode layer 3 includes a plurality of driving electrodes 31 formed on the substrate module 1. The plurality of driving electrodes 31 are disposed on another substrate 10 other than the first substrate 11, and in this embodiment, the plurality of driving electrodes 31 are spaced apart from each other and formed on the surface of the second substrate 12 adjacent to the first substrate 11 (e.g., ...). Figure 2 (the top surface of the second substrate 12 in the invention), but the present invention is not limited thereto.

[0039] For example, in other embodiments not illustrated in this invention, at least one of the driving electrodes 31 may be formed on the surface of the second substrate 12 away from the first substrate 11 (e.g.: Figure 2 The bottom surface of the second substrate 12 in the middle); or, at least one of the driving electrodes 31 may also be formed on the surface of the first substrate 11 away from the protective layer 5 (e.g., the ...). Figure 2 (The bottom surface of the first substrate 11 in the middle).

[0040] More specifically, the driving electrode layer 3 defines a plurality of layout spaces S extending from the plurality of driving electrodes 31 along the normal direction D, and in this embodiment, the plurality of sensing electrodes 21 are located outside the plurality of layout spaces S; that is, a projection area formed by the orthographic projection of the plurality of sensing electrodes 21 toward the second substrate 12 surrounds the outside of the plurality of driving electrodes 31, but the invention is not limited thereto. For example, in other embodiments not shown in the invention, the peripheral portion of at least one sensing electrode 21 may be located within the layout space S.

[0041] Multiple light-emitting diode (LED) chips 4 and multiple sensing electrodes 21 are disposed together on one of the substrates 10 (i.e., the first substrate 11), and each LED chip 4 is located within a layout space S, while the multiple LED chips 4 do not obscure any of the sensing electrodes 21 along the normal direction D. Alternatively, in this embodiment, the position of any LED chip 4 along the normal direction D corresponds to one of the driving electrodes 31.

[0042] Furthermore, the light-emitting end face 41 of any of the aforementioned light-emitting diode chips 4 (e.g.: Figure 2 The distance D41 between the top surface of the light-emitting diode chip 4 and the first substrate 11 is preferably greater than the thickness T21 of any of the sensing electrodes 21. The difference between the distance D41 and the thickness T21 can be greater than 0 and less than 1 mm, but the present invention is not limited thereto.

[0043] In this embodiment, the protective layer 5 is described as being detachably disposed on a plate of the substrate module 1, and the protective layer 5 covers the plurality of sensing electrodes 21 and the plurality of light-emitting diode chips 4. The surface of the protective layer 5 facing the substrate module 1 (e.g., the first substrate 11) (e.g., the bottom surface of the protective layer 5 in the figure) is recessed with a plurality of receiving grooves 51, and the light-emitting end faces 41 of the plurality of light-emitting diode chips 4 are respectively located within the plurality of receiving grooves 51.

[0044] Furthermore, the protective layer 5 includes an operating surface 52 (e.g., the top surface of the protective layer 5 in the figure) that is away from the substrate module 1, and the operating surface 52 is preferably separated from the light-emitting end face 41 of any of the light-emitting diode chips 4 by a distance D52 greater than 0 and less than 1 mm, but the present invention is not limited thereto.

[0045] In this embodiment, the controller 6 is mounted on the surface of the third substrate 13, which is away from the protective layer 5 (e.g., ...). Figure 2 The controller 6 may be mounted on any of the substrates 10 in the substrate module 1, or on other components outside the substrate module 1.

[0046] Furthermore, the controller 6 is electrically coupled to the sensing electrode layer 2, the driving electrode layer 3, and the plurality of light-emitting diode chips 4 via the substrate module 1. When a conductor (such as a stylus or finger) forms a coupling capacitance with at least one of the sensing electrodes 21, the controller 6 can drive at least one of the light-emitting diode chips 4 adjacent to the at least one sensing electrode 21 forming the coupling capacitance to emit light. Further, the number of at least one light-emitting diode chips 4 driven by the controller 6 to emit light can be adjusted according to design requirements.

[0047] Accordingly, in this embodiment, the capacitive touch panel 100 achieves its touch effect by avoiding the influence of the position of any one of the LED chips 4 through the combination of multiple LED chips 4 with other components (e.g., each LED chip 4 is located within a layout space S, and the multiple LED chips 4 do not block any of the sensing electrodes 21 along the normal direction D). Furthermore, the capacitive touch panel 100 can also have refined local optical variations.

[0048] It should be further noted that the electrical coupling lines between the substrate module 1, the plurality of light-emitting diode chips 4, and the controller 6 can be adjusted and varied according to design requirements. For ease of understanding of this embodiment, the following description only uses the example of... Figure 3 and Figure 4 The electrical coupling circuit shown is for illustrative purposes only, but the present invention is not limited thereto.

[0049] Specifically, such as Figures 1 to 3 As shown, the substrate module 1 may include multiple first transmission lines 14 and multiple second transmission lines 15 electrically coupled to the controller 6. Each of the multiple first transmission lines 14 is connected one-to-one to a plurality of the light-emitting diode (LED) chips 4, and each of the multiple second transmission lines 15 is connected one-to-one to a plurality of the LED chips 4. Accordingly, each LED chip 4 can be individually driven to emit light by the controller 6.

[0050] In addition, such as Figure 1 , Figure 2 ,and Figure 4 As shown, the substrate module 1 may also include multiple first transmission lines 14 electrically coupled to the controller 6 and multiple second transmission lines 15 corresponding to the multiple first transmission lines 14. The multiple light-emitting diode chips 4 are divided into multiple light-emitting groups 40, and each of the multiple light-emitting groups 40 includes at least two light-emitting diode chips 4. Furthermore, any one of the first transmission lines 14 is connected to the positive or negative terminal of each light-emitting diode chip 4 in one of the light-emitting groups 40, and any one of the second transmission lines 15 is connected to the negative or positive terminal of one light-emitting diode chip 4 in each of the at least two light-emitting groups 40. Accordingly, one first transmission line 14 and one second transmission line 15 can jointly control the light emission of a connected light-emitting diode chip 4, so each light-emitting diode chip 4 can be driven to emit light independently by the controller 6.

[0051] [Example 2]

[0052] Please see Figure 5 and Figure 6 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0053] In this embodiment, a plurality of sensing electrodes 21, a plurality of driving electrodes 31, and a plurality of light-emitting diode chips 4 are disposed together on one of the substrates 10 of the substrate module 1 (e.g., the first substrate 11), and the protective layer 5 covers the plurality of sensing electrodes 21, the plurality of driving electrodes 31, and the plurality of light-emitting diode chips 4; that is, the second substrate 12 in the first embodiment can be omitted from the substrate module 1 in this embodiment.

[0054] More specifically, each of the plurality of driving electrodes 31 surrounds a layout region S1; and in this embodiment, any one of the driving electrodes 31 may be annular or U-shaped, such that its inner edge surrounds the layout region S1. For example, any one of the driving electrodes 31 forms a through hole, which is defined as the layout region S1.

[0055] Furthermore, the driving electrode layer 3 defines multiple layout spaces S extending from the multiple layout regions S1 along the normal direction D, and each of the light-emitting diode chips 4 is located within one of the layout spaces S, while the multiple light-emitting diode chips 4 do not obscure any of the sensing electrodes 21 along the normal direction D. Each light-emitting diode chip 4 is surrounded by one of the driving electrodes 31 and located in the corresponding layout region S1.

[0056] Accordingly, in this embodiment, the capacitive touch panel 100, through the structural design of each of the driving electrodes 31, enables multiple sensing electrodes 21, multiple driving electrodes 31, and multiple light-emitting diode chips 4 to be jointly disposed on the same substrate 10, so that the thickness of the capacitive touch panel 100 can be effectively reduced.

[0057] [Example 3]

[0058] Please see Figure 7 As shown, this is Embodiment 3 of the present invention. Since this embodiment is similar to Embodiment 2 described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment 2 are roughly explained as follows:

[0059] In this embodiment, a plurality of driving electrodes 31 and a plurality of sensing electrodes 21 are disposed on one of the substrates 10 of the substrate module 1 (e.g., the first substrate 11), while a plurality of light-emitting diode chips 4 are disposed on another substrate 10 of the substrate module 1 (e.g., the second substrate 12); that is, the substrate module 1 in this embodiment may include the second substrate 12 in embodiment one.

[0060] Furthermore, the protective layer 5 covers the plurality of sensing electrodes 21 and the plurality of driving electrodes 31. The first substrate 11 has a plurality of through holes 16 with positions corresponding to the plurality of layout regions S1, and the light-emitting end face 41 of any one of the light-emitting diode chips 4 faces one of the through holes 16. Accordingly, the surface of the protective layer 5 facing the substrate module 1 (e.g., the first substrate 11) (e.g., the bottom surface of the protective layer 5 in the figure) can be planar, thereby effectively reducing the manufacturing difficulty of the protective layer 5.

[0061] [Example 4]

[0062] Please see Figure 8 and Figure 9 As shown, this is Embodiment 4 of the present invention. Since this embodiment is similar to Embodiment 3 described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment 3 are roughly explained as follows:

[0063] In this embodiment, a plurality of substrates 10 are sequentially defined with a second substrate 12, a first substrate 11, and a third substrate 13 spaced apart from each other along a direction away from the protective layer 5, but the present invention is not limited thereto. Furthermore, a plurality of driving electrodes 31 and a plurality of light-emitting diode chips 4 are disposed together on one of the substrates 10 (e.g., the second substrate 12), while a plurality of sensing electrodes 21 are disposed on another substrate 10 (e.g., the first substrate 11) outside the second substrate 12.

[0064] Furthermore, the protective layer 5 covers the plurality of sensing electrodes 21, and the first substrate 11 forms a plurality of through holes 16 in the areas through which the plurality of layout spaces S pass, and the light-emitting end face 41 of any one of the light-emitting diode chips 4 faces one of the through holes 16. Accordingly, the surface of the protective layer 5 facing the substrate module 1 (e.g., the first substrate 11) (e.g., the bottom surface of the protective layer 5 in the figure) can be planar, thereby effectively reducing the manufacturing difficulty of the protective layer 5.

[0065] [Example 5]

[0066] Please see Figure 10As shown, this is Embodiment 5 of the present invention. Figure 10 As shown, this embodiment discloses a capacitive touch panel 100, which includes a substrate module 1, a sensing electrode layer 2, a driving electrode layer 3, and a plurality of light-emitting diode chips 4. The sensing electrode layer 2 includes a plurality of sensing electrodes 21 formed on the substrate module 1, and the driving electrode layer 3 includes a plurality of driving electrodes 31 formed on the substrate module 1.

[0067] The plurality of sensing electrodes 21 and the plurality of driving electrodes 31 may be respectively disposed on two different substrates in the substrate module 1 as in Embodiment 1 or Embodiment 4 described above, or they may be simultaneously disposed on the same substrate in the substrate module 1 as in Embodiment 2 or Embodiment 3 described above. In summary, the plurality of sensing electrodes 21 and the plurality of driving electrodes 31 are arranged alternately, and it should be understood that the plurality of sensing electrodes 21 and the plurality of driving electrodes 31 form a touch sensing area of ​​the capacitive touch panel 100.

[0068] Chinese patent application CN110568942A discloses a touch-sensing area divided into multiple first sensing units and multiple second sensing units to enable the touchpad to emit light. Compared to the first sensing units, the second sensing units have less area for housing the light-emitting diode chip. Therefore, under the same touch conditions, the sensing amount generated by the second sensing units is less than that generated by the first sensing units, necessitating compensation for the sensing amount of the second sensing units in Chinese patent application CN110568942A.

[0069] Compared to Chinese patent application CN110568942A, the touch sensing area in this embodiment is divided into multiple sensing units 23 with the same area. That is, under the same touch condition, the multiple sensing units 23 have the same sensing amount, and the sensing amount of each sensing unit 23 is related to the capacitance change between the sensing electrode 21 and the driving electrode 31 it covers.

[0070] Furthermore, multiple LED chips 4 are mounted on the substrate module 1. Each LED chip 4 is positioned between two adjacent sensing units 23, or spans between these two sensing units 23, and the position of each LED chip 4 corresponds to one of the driving electrodes 31. Moreover, the position of each LED chip 4 does not change the length of the adjacent edge between the corresponding driving electrode 31 and the surrounding sensing electrode 21; therefore, under the same touch conditions, each LED chip 4 does not change the sensing quantity of the corresponding sensing unit 23.

[0071] To ensure that the LED chip 4 does not affect the capacitance change between the sensing electrode 21 and the driving electrode 31, the structural design of this embodiment can be similar to that of Embodiments 1, 2, 3, or 4 described above, so its details will not be elaborated here. Accordingly, the capacitive touch panel 100 does not need to compensate for the sensing amount of any of the sensing units 23, but can directly determine whether the touch sensing area is touched by a conductor (such as a stylus or finger) and the location of the touch based on the sensing amount of each sensing unit 23.

[0072] [Example 6]

[0073] Please see Figure 11 As shown, this is Embodiment Six of the present invention. Since this embodiment is similar to Embodiment Five above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment Five are roughly explained as follows:

[0074] In this embodiment, each of the light-emitting diode chips 4 is placed in two adjacent sensing units 23, or across the two sensing units 23, and the position of each of the light-emitting diode chips 4 corresponds to a sensing electrode 21.

[0075] Furthermore, since the position of each light-emitting diode chip 4 is changed from corresponding to one driving electrode 31 in Embodiment 5 to corresponding to one sensing electrode 21, the structural design of this embodiment can be similar to that of... Figure 2 , Figure 6 , Figure 7 or Figure 9 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, so that each of the light-emitting diode chips 4 in this embodiment can also maintain the capacitance change between the sensing electrode 21 and the driving electrode 31 without affecting the capacitance change.

[0076] For example, if the structural design of this embodiment is to... Figure 2 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, meaning that in this embodiment, the plurality of light-emitting diode chips 4 and the plurality of driving electrodes 31 are jointly disposed on the first substrate 11 of the substrate module 1, while the plurality of sensing electrodes 21 are disposed on the second substrate 12 of the substrate module 1. Furthermore, this embodiment defines a plurality of layout spaces S extending from the plurality of sensing electrodes 21 along the normal direction D, and the plurality of driving electrodes 31 are located outside the plurality of layout spaces S.

[0077] Each of the LED chips 4 is located within one of the layout spaces S, and none of the driving electrodes 31 is obscured along the normal direction D. This is because at this point, it is only in a non-contradictory manner... Figure 2 Under the concept of interchangeable sensing electrode layer 2 and driving electrode layer 3, those skilled in the art should be able to understand other details at this time from the content of the above embodiment 1, so they will not be elaborated here.

[0078] In contrast, if the structural design of this embodiment is to... Figure 6 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, meaning that in this embodiment, multiple sensing electrodes 21, multiple driving electrodes 31, and multiple light-emitting diode chips 4 are jointly disposed on the first substrate 11 of the substrate module 1, and each sensing unit 21 surrounds and forms a layout region S1. In addition, this embodiment defines multiple layout spaces S extending from the multiple layout regions S1 along the normal direction D.

[0079] Each of the LED chips 4 is located within one of the layout spaces S, and none of the driving electrodes 31 are obscured along the normal direction D. That is, each LED chip 4 is surrounded by one of the sensing units 21. Since this is only in the case of not deviating... Figure 6 Under the concept of interchangeable sensing electrode layer 2 and driving electrode layer 3, those skilled in the art should also be able to understand other details at this time from the content of the above embodiment 2, so they will not be elaborated here.

[0080] In contrast, if the structural design of this embodiment is to... Figure 7 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, meaning that in this embodiment, multiple driving electrodes 31 and multiple sensing electrodes 21 are disposed on the first substrate 11 of the substrate module 1, while multiple light-emitting diode chips 4 are disposed on the second substrate 12 of the substrate module 1. Furthermore, each sensing unit 21 surrounds a layout region S1, and in this embodiment, multiple layout spaces S extending from the multiple layout regions S1 along the normal direction D are defined.

[0081] The first substrate 11 has a plurality of through holes 16 formed in the regions through which the plurality of layout spaces S pass, and the light-emitting end face 41 of any one of the light-emitting diode chips 4 faces one of the through holes 16. Since this is only in the case of not deviating from... Figure 7 Under the concept of interchangeable sensing electrode layer 2 and driving electrode layer 3, those skilled in the art should also be able to understand other details at this time from the content of the above embodiment 3, so they will not be elaborated here.

[0082] In contrast, if the structural design of this embodiment is to... Figure 9 The sensing electrode layer 2 and the driving electrode layer 3 are interchanged, meaning that in this embodiment, multiple driving electrodes 31 are disposed on the first substrate 11 of the substrate module 1, while multiple sensing electrodes 21 and multiple light-emitting diode chips 4 are disposed on the second substrate 12 of the substrate module 1. Furthermore, each sensing unit 21 surrounds a layout region S1, and in this embodiment, multiple layout spaces S extending from the multiple layout regions S1 along the normal direction D are defined.

[0083] The first substrate 11 has a plurality of through holes 16 formed in the regions through which the plurality of layout spaces S pass, and the light-emitting end face 41 of any one of the light-emitting diode chips 4 faces one of the through holes 16. Since this is only in the case of not deviating from... Figure 9 Under the concept of interchangeable sensing electrode layer 2 and driving electrode layer 3, those skilled in the art should also be able to understand other details at this time from the content of the above embodiment 4, so they will not be elaborated here.

[0084] [Example 7]

[0085] Please see Figure 12 As shown, this is Embodiment Seven of the present invention. Since this embodiment is similar to Embodiment Five or Embodiment Six described above, the similarities will not be repeated. The differences between this embodiment and Embodiment Five or Embodiment Six are roughly explained as follows:

[0086] In this embodiment, each of the light-emitting diode chips 4 is placed in one of the sensing units 23, and the position of each of the light-emitting diode chips 4 corresponds to the junction of the sensing electrode 21 and the driving electrode 31.

[0087] Furthermore, in this embodiment, the plurality of light-emitting diode chips 4 are disposed on the first substrate 11 of the substrate module 1, while the plurality of sensing electrodes 21 and the plurality of driving electrodes 31 are jointly disposed on the second substrate 12 of the substrate module 1 or respectively disposed on the second substrate 12 and the third substrate 13. Accordingly, in this embodiment, the light-emitting diode chip 4 only slightly affects the capacitance change between the sensing electrode 21 and the driving electrode 31, so that the capacitive touch panel 100 still does not need to have a notch without a sensing unit to accommodate the light-emitting diode chip 4.

[0088] [Example 8]

[0089] Please see Figure 13As shown, this is Embodiment Eight of the present invention. Since this embodiment is similar to Embodiment Seven described above, the similarities will not be repeated. The differences between this embodiment and Embodiment Seven are roughly explained as follows:

[0090] In this embodiment, each of the light-emitting diode chips 4 is placed in two adjacent sensing units 23, or spans the two sensing units 23, and the position of each of the light-emitting diode chips 4 corresponds to the boundary between the sensing electrode 21 and the driving electrode 31.

[0091] [Technical Effects of the Embodiments of the Invention]

[0092] In summary, the capacitive touch panel disclosed in the embodiments of the present invention, through the combination of multiple light-emitting diode chips and other components (e.g., each light-emitting diode chip is located within a layout space, and the multiple light-emitting diode chips do not block any of the sensing electrodes along the normal direction), enables the touch effect of the capacitive touch panel to avoid being affected by the position of any one of the light-emitting diode chips, and the capacitive touch panel can also have delicate local optical variations.

[0093] Furthermore, the capacitive touch panel disclosed in the embodiments of the present invention, through the structural design of each of the driving electrodes (e.g., each of the multiple driving electrodes surrounds a layout area, and the driving electrode layer defines multiple layout spaces extending from the multiple layout areas along the normal direction), enables multiple sensing electrodes, multiple driving electrodes, and multiple light-emitting diode chips to be jointly disposed on the same substrate, so that the thickness of the capacitive touch panel can be effectively reduced.

[0094] Furthermore, the capacitive touch panel disclosed in the embodiments of the present invention reduces the manufacturing difficulty by placing multiple light-emitting diode chips on the substrate away from the protective layer, so that the protective layer does not need to cover any of the light-emitting diode chips.

[0095] On the other hand, the capacitive touch panel disclosed in the embodiments of the present invention divides the touch sensing area formed by the plurality of sensing electrodes and the plurality of driving electrodes into a plurality of sensing units with the same area. Through the various specific implementation methods described above, the light-emitting diode chip can be placed in the sensing unit (e.g., placed in two adjacent sensing units), and its position corresponds to one of the driving electrodes or one of the sensing electrodes, but it will not affect the capacitance change between the sensing electrode and the driving electrode, and there is no need to compensate for the sensing amount of any of the sensing units.

[0096] Furthermore, the capacitive touch panel disclosed in this embodiment of the invention is particularly suitable for touch keyboards, that is, the capacitive touch panel can have multiple keycaps, and one or more of the sensing units of the capacitive touch panel can correspond to one keycap. When a keycap is touched, the light-emitting diode chip in the corresponding one or more sensing units can emit light.

[0097] The above-disclosed content is only a preferred and feasible embodiment of the present invention and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A capacitive touch panel, characterized in that, The capacitive touch panel includes: One baseboard module; A sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; A driving electrode layer includes a plurality of driving electrodes formed on the substrate module, and the plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing area of ​​the capacitive touch panel, wherein the touch sensing area is divided into a plurality of sensing units having the same area; and Multiple light-emitting diode (LED) chips are mounted on the substrate module. Each LED chip is placed in a sensing unit, and the position of each LED chip corresponds to the junction of the sensing electrode and the driving electrode, but does not affect the capacitance change between the sensing electrode and the driving electrode.

2. The capacitive touch panel according to claim 1, characterized in that, The substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein a plurality of light-emitting diode chips are placed on one of the substrates and defined as a first substrate, and a plurality of sensing electrodes and a plurality of driving electrodes are disposed on at least one other substrate other than the first substrate.

3. The capacitive touch panel according to claim 1, characterized in that, The capacitive touch panel further includes a controller electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light-emitting diode chips via the substrate module; wherein, when a conductor forms a coupling capacitor with at least one of the sensing electrodes, the controller can drive at least one of the light-emitting diode chips adjacent to at least one of the sensing electrodes forming the coupling capacitor to emit light.

4. The capacitive touch panel according to claim 1, characterized in that, The substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein a plurality of sensing electrodes and a plurality of driving electrodes are disposed on one of the substrates and defined as a first substrate, and a plurality of light-emitting diode chips are disposed on another substrate other than the first substrate.

5. The capacitive touch panel according to claim 1, characterized in that, The substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein a plurality of sensing electrodes are placed on one of the substrates and defined as a first substrate, and a plurality of driving electrodes and a plurality of light-emitting diode chips are disposed on another substrate other than the first substrate.

6. A capacitive touch panel, characterized in that, The capacitive touch panel includes: One baseboard module; A sensing electrode layer comprising a plurality of sensing electrodes formed on the substrate module; A driving electrode layer includes a plurality of driving electrodes formed on the substrate module, and the plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing area of ​​the capacitive touch panel, wherein the touch sensing area is divided into a plurality of sensing units having the same area; and Multiple light-emitting diode (LED) chips are mounted on the substrate module. Each LED chip is placed in two adjacent sensing units, and the position of each LED chip corresponds to the boundary between the sensing electrode and the driving electrode, but does not affect the capacitance change between the sensing electrode and the driving electrode.

7. The capacitive touch panel according to claim 6, characterized in that, The substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein a plurality of light-emitting diode chips are placed on one of the substrates and defined as a first substrate, and a plurality of sensing electrodes and a plurality of driving electrodes are disposed on at least one other substrate other than the first substrate.

8. The capacitive touch panel according to claim 6, characterized in that, The capacitive touch panel further includes a controller electrically coupled to the sensing electrode layer, the driving electrode layer, and the plurality of light-emitting diode chips via the substrate module; wherein, when a conductor forms a coupling capacitor with at least one of the sensing electrodes, the controller can drive at least one of the light-emitting diode chips adjacent to at least one of the sensing electrodes forming the coupling capacitor to emit light.

9. The capacitive touch panel according to claim 6, characterized in that, The substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein a plurality of sensing electrodes and a plurality of driving electrodes are disposed on one of the substrates and defined as a first substrate, and a plurality of light-emitting diode chips are disposed on another substrate other than the first substrate.

10. The capacitive touch panel according to claim 6, characterized in that, The substrate module defines a normal direction and includes a plurality of substrates arranged along the normal direction, wherein a plurality of sensing electrodes are placed on one of the substrates and defined as a first substrate, and a plurality of driving electrodes and a plurality of light-emitting diode chips are disposed on another substrate other than the first substrate.

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