Method and system for adjusting process parameters of multi-layer copper plating process of PCB board

Abstract

The application discloses a PCB multilayer copper plating process parameter adjustment method and system, and relates to the field of process control, wherein the method comprises the following steps: collecting a historical stage copper plating state feature set and a historical adjustment process parameter set of a PCB multilayer copper plating process in a historical window, and training an initial process parameter adjustment network; distinguishing between steady states and abnormal states, and constructing a steady state training sample set and an abnormal state training sample set; performing double-item suggestive training on the initial process parameter adjustment network, and constructing a process parameter adjustment network; obtaining a current copper plating state feature, performing steady state and abnormal state distinguishing identification, calling a steady state or abnormal state prompt vector, performing process parameter adjustment, and obtaining a current adjustment process parameter. The application solves the technical problem that existing PCB multilayer copper plating process parameter adjustment cannot be accurately adjusted and controlled according to working conditions, and achieves the technical effect of accurately adjusting and controlling process parameters according to different working conditions.

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