Energy recycling method and device based on laser heating

Abstract

The application relates to the technical field of laser heating, and discloses an energy recycling mode and equipment based on laser heating, which comprises a laser module, a TEC refrigerating sheet arranged on the surface of the laser module, a heat dissipation fin connected to the surface of the TEC refrigerating sheet, a heated object additionally arranged on the surface of the heat dissipation fin, and a cold surface and a hot surface formed on the surface of the TEC refrigerating sheet, wherein the cold surface and the hot surface of the TEC refrigerating sheet are tightly combined with the laser module and the heat dissipation fin respectively; in the equipment, the cold surface of the TEC refrigerating sheet is tightly combined with the heat generation area of the laser module, efficient heat conduction between the two can be realized, after the TEC refrigerating sheet is synchronously started, the cold surface can quickly absorb a large amount of heat generated when the laser module works, the laser module is quickly cooled, the laser module can be ensured to be maintained at a preset working temperature, and the laser module can stably output laser according to the preset optical power.

Description

Technical Field

[0001] This invention relates to the field of laser heating technology, specifically to an energy recovery and utilization method and device based on laser heating. Background Technology

[0002] As the core component of laser heating equipment, the temperature stability of the laser module during operation is directly related to the laser output effect, and it usually requires a heat dissipation system to ensure its normal operation.

[0003] In existing technologies, although the heat dissipation system of laser modules is equipped with cooling components and heat-conducting structures, the fit design between the cooling components and the heat-generating areas of the laser module is not reasonable enough, and there are obstacles in the heat conduction path. This makes it difficult to quickly dissipate the large amount of heat generated during laser module operation, resulting in temperature fluctuations in the laser module and an inability to maintain a stable preset operating temperature, affecting the stable output of the laser. At the same time, most of the heat dissipated by the heat dissipation system is directly dissipated into the environment through the heat-conducting structure. There is no effective heat conduction design between the heat-conducting structure and the heated object, so this part of the heat is not utilized in a targeted manner, resulting in unnecessary energy loss. To address this, an energy recovery and utilization method and device based on laser heating is proposed. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an energy recovery and utilization method and device based on laser heating, in order to solve the aforementioned technical problem that makes it difficult to quickly dissipate the large amount of heat generated when the laser module is working.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an energy recovery and utilization method based on laser heating, comprising the following steps: S1. Overall Composition: The cold side of the TEC cooling chip is in close contact with the heating area of ​​the laser module, thereby achieving efficient heat conduction between the two; the hot side of the TEC cooling chip is connected to the heat sink, and the end of the heat sink is provided with the object to be heated, thus forming a heat transfer path from the TEC cooling chip to the object to be heated. S2, Collaborative Working Mechanism: After the laser module is started, it outputs laser light at a preset optical power to heat the object. At the same time, the laser module generates a large amount of heat due to its rapid operation. The TEC cooling chip starts simultaneously, and the cold surface absorbs the heat generated by the laser module by closely adhering to the laser module, thus rapidly cooling the laser module to ensure that the laser module maintains a stable output at the preset operating temperature and preset optical power. S3, Recycling Path: When the TEC cooling chip is working, it transfers the heat absorbed by the cold side to the hot side, and the heat from the hot side is discharged through the connected heat sink. During the heat dissipation process, some of the heat is transferred to the heated object through the end, thus realizing the recovery and utilization of some of the heat during the operation of the TEC cooling chip.

[0006] It realizes the recovery and utilization of heat generated during the operation of the laser module, avoids energy waste caused by direct heat loss, and effectively improves the overall energy utilization rate; By using TEC cooling pads to specifically cool the laser module, the laser module can be maintained at the preset operating temperature, ensuring stable laser output and improving the reliability and stability of the heating process. The recovered heat can be directly applied to the heated object, helping it to maintain a high temperature, making it perfectly suited for applications requiring long-term heating. It eliminates the need for a large amount of additional energy to dissipate the heat generated by the laser module, significantly reducing overall energy consumption and meeting the application requirements for energy conservation and consumption reduction. The heat dissipation method is not limited to TEC cooling chips, and the laser type is not limited to a single type, adapting to the personalized needs of different application scenarios and greatly improving the applicability of the equipment and methods.

[0007] An energy recovery and utilization device based on laser heating, employing the aforementioned energy recovery and utilization method based on laser heating, includes: A laser module and a TEC cooling chip disposed on the surface of the laser module. A heat sink is connected to the surface of the TEC cooling chip, and a heated object is placed on the surface of the heat sink. The surface of the TEC cooling chip is divided into a cold side and a hot side. The cold side and the hot side of the TEC cooling chip are tightly attached to the laser module and the heat sink, respectively.

[0008] When the laser module is activated, it outputs laser light to heat the object, and at the same time, the laser module generates heat. The TEC cooling chip starts simultaneously, absorbing the heat generated by the laser module through its cold surface, thereby cooling the laser module. The TEC cooling chip transfers the heat absorbed by the cold side to the hot side, and then the heat is transferred to the heat sink through the hot side; The heat sink conducts heat, which in turn transfers some of the heat to the object being heated, thus achieving heat recovery and utilization.

[0009] Preferably, a rigid frame and a flexible thermally conductive layer are respectively added between the heat sink and the object being heated. The rigid frame can provide stable support for the structure at the joint, preventing gaps from appearing on the joint surface due to structural deformation. The flexible thermally conductive layer can improve the adaptability of the joint surface. The combination of the two makes the heat transfer path between the heat sink and the object being heated more stable, reduces heat loss at the joint, and improves the overall heat transfer efficiency.

[0010] Preferably, the rigid frame has a mesh-like design, and a flexible thermally conductive layer covers the outside of the rigid frame, with the flexible thermally conductive layer in contact with the object being heated. The mesh-like design reduces the weight of the rigid frame while ensuring its structural strength, and does not impede heat flow; the flexible thermally conductive layer, after covering the rigid frame, adheres to the object being heated, adapting to the fine contours of the object's surface, increasing the actual contact area, further reducing thermal resistance, and improving thermal conductivity.

[0011] Preferably, a guide rod is installed at a corresponding location on the surface of the heat sink, and the rigid frame is slidably connected to the surface of the guide rod. The guide rod limits the movement trajectory of the rigid frame, preventing it from shifting or wobbling during movement, ensuring that the flexible heat-conducting layer can accurately adhere to the object being heated, improving the stability and reliability of the structure's operation, and facilitating subsequent adjustment of the adhesion state.

[0012] Preferably, a compression spring is fitted onto the surface of the guide rod at a corresponding location, and both ends of the compression spring are respectively in contact with the inner wall of the heat sink and the surface of the rigid frame. The elastic force of the compression spring can provide continuous clamping force to the rigid frame, ensuring that the flexible heat-conducting layer and the heated object always remain in close contact. This can effectively compensate for the deformation of the flexible heat-conducting layer and the minor vibrations generated during equipment operation, avoiding gaps in the fit caused by vibration, thereby stabilizing the heat transfer effect.

[0013] Preferably, an adjusting nut is threaded onto the corresponding location on the surface of the guide rod, and the surface of the adjusting nut is tightly fitted with the rigid frame. The adjusting nut enables precise adjustment of the position of the rigid frame, and the contact pressure between the flexible heat-conducting layer and the heated object can be preset according to actual working conditions, improving the adaptability of the structure; at the same time, the threaded connection has self-locking properties, and the adjusting nut can maintain a stable position after adjustment, ensuring that the contact state of the rigid frame will not change on its own, thus improving structural stability.

[0014] Preferably, the heat sink is divided into a main heat-conducting section, a buffer heat-conducting section, and a terminal adapter section. The main heat-conducting section is in contact with the hot surface of the TEC cooling chip, and the terminal adapter section is in contact with the object being heated. The buffer heat-conducting section is connected to the main heat-conducting section by brazing, and the buffer heat-conducting section is connected to the terminal adapter section by thread. The three-section structure clearly defines the function of each part of the heat sink. The main heat-conducting section can focus on efficiently receiving heat from the TEC cooling chip, the buffer heat-conducting section achieves a smooth heat transfer, and the terminal adapter section ensures effective contact with the object being heated. The brazing connection ensures the reliability of the connection between the main heat-conducting section and the buffer heat-conducting section and the heat conduction efficiency, while the threaded connection facilitates the disassembly and replacement of the terminal adapter section, improving the maintenance convenience and versatility of the structure.

[0015] Preferably, the surface of the main heat-conducting section is arrayed with heat dissipation fins, and a U-shaped oil guide groove is formed in the inner cavity of the buffer heat-conducting section, with the inner cavity of the U-shaped oil guide groove filled with thermally conductive silicone oil. The heat dissipation fins increase the contact area between the main heat-conducting section and the air, accelerating the dissipation of excess heat and preventing heat accumulation; the thermally conductive silicone oil in the U-shaped oil guide groove has good thermal conductivity and fluidity, which can quickly and evenly distribute the concentrated heat in the buffer heat-conducting section, avoiding local high temperature phenomena, and allowing heat to be stably transferred to the end adapter section, improving the uniformity of heating of the heated object.

[0016] Preferably, a heat conduction bypass is provided at the corresponding location within the inner cavity of the buffer heat conduction section. This bypass consists of a heat-conducting copper sheet, an electromagnetic lock pin, and a temperature sensing element. The two ends of the heat-conducting copper sheet contact the main heat conduction section and the end adapter section, respectively, and a positioning hole is provided in the middle of the copper sheet. The electromagnetic lock pin is installed on the inner wall of the buffer heat conduction section. The heat-conducting copper sheet has excellent thermal conductivity, providing an efficient path for heat transfer. The cooperation between the temperature sensing element and the electromagnetic lock pin allows adjustment of the fixing state of the heat-conducting copper sheet according to temperature changes in the buffer heat conduction section, achieving dynamic control of the heat conduction bypass efficiency. This ensures efficient heat transfer under low loads and assists in heat dissipation under high loads, improving the adaptability of the heat dissipation structure to different operating conditions.

[0017] Compared with existing technologies, the present invention provides an energy recovery and utilization method and device based on laser heating, which has the following beneficial effects: This laser-heated energy recovery and utilization method and equipment has a TEC cooling chip with its cold surface closely attached to the heating area of ​​the laser module, which enables efficient heat conduction between the two. After the TEC cooling chip is started synchronously, the cold surface can quickly absorb a large amount of heat generated by the laser module during operation, and quickly cool down the laser module, thereby ensuring that the laser module is maintained at the preset operating temperature and ensuring that the laser module outputs laser stably at the preset optical power. The hot side of the TEC cooling chip is connected to the heat sink, and the end of the heat sink is provided with the object to be heated, forming a heat transfer path from the TEC cooling chip to the object to be heated. This allows the heat transferred to the hot side of the TEC cooling chip during operation to be smoothly discharged through the heat sink. During the discharge process, some of the heat can be transferred to the object to be heated through the end of the heat sink, thus realizing the recovery and utilization of some of the heat during the operation of the TEC cooling chip. The laser module heats the object and the TEC cooling chip dissipates heat and recovers heat, forming a collaborative working mechanism. While the laser module is performing its task of heating the object normally, the heat generated by the laser module is effectively processed. This not only solves the heat generation problem of the laser module during operation, but also recovers some of the heat that might otherwise be wasted, reducing energy loss and improving overall energy utilization. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the heat sink and its connection structure of the present invention; Figure 3 Appendix to this invention Figure 2 Enlarged structural diagram at point A in the middle; Figure 4 This is a schematic diagram of the rigid frame structure of the present invention; Figure 5 This is a schematic diagram of the heat sink structure of the present invention; Figure 6 Appendix to this invention Figure 5 Schematic diagram of the enlarged structure of B.

[0019] In the diagram: 1. Laser module; 2. TEC cooling chip; 3. Heat sink; 4. Object to be heated; 5. Rigid frame; 6. Flexible heat-conducting layer; 7. Guide rod; 8. Compression spring; 9. Adjusting nut; 10. Main heat-conducting section; 11. Buffer heat-conducting section; 12. End adapter section; 13. Heat dissipation fins; 14. U-shaped oil guide groove; 15. Heat conduction bypass. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] This invention provides a technical solution, a method for energy recovery and utilization based on laser heating, comprising the following steps: Please refer to... Figures 1-6 S1, Overall Composition: The cold side of the TEC cooling chip 2 is in close contact with the heating area of ​​the laser module 1, thereby achieving efficient heat conduction between the two; the hot side of the TEC cooling chip 2 is connected to the heat sink 3, and the end of the heat sink 3 is provided with the object to be heated 4, thereby forming a heat transfer path from the TEC cooling chip 2 to the object to be heated 4. S2, Collaborative Working Mechanism: After the laser module 1 is started, it outputs laser light at a preset optical power to heat the object. At the same time, the laser module 1 generates a large amount of heat due to its rapid operation. The TEC cooling chip 2 starts simultaneously. The cold surface absorbs the heat generated by the laser module 1 through close contact with the laser module 1, and rapidly cools the laser module 1 to ensure that the laser module 1 maintains a stable output at the preset operating temperature and preset optical power. S3, Recycling Path: When the TEC cooling chip 2 is working, it transfers the heat absorbed by the cold side to the hot side, and the heat from the hot side is discharged through the connected heat sink 3. During the process of heat dissipation by the heat sink 3, a portion of the heat is transferred to the heated object 4 through the end, thereby realizing the recovery and utilization of part of the heat during the operation of the TEC cooling chip 2.

[0022] An energy recovery and utilization device based on laser heating, employing the aforementioned energy recovery and utilization method based on laser heating, includes: The laser module 1 and the TEC cooling chip 2 disposed on the surface of the laser module 1 are provided with a heat sink 3 connected to the surface of the TEC cooling chip 2, and a heated object 4 is provided on the surface of the heat sink 3. The surface of the TEC cooling chip 2 is divided into a cold side and a hot side, and the cold side and the hot side of the TEC cooling chip 2 are tightly attached to the laser module 1 and the heat sink 3 respectively.

[0023] The heat generated during the operation of laser module 1 is recovered and utilized, avoiding energy waste caused by direct heat loss and effectively improving the overall energy utilization rate. The laser module 1 is cooled in a targeted manner by using the TEC cooling chip 2, which ensures that the laser module 1 can be maintained at the preset operating temperature, ensuring stable laser output and improving the reliability and stability of the heating process. The recovered heat can be directly applied to the heated object 4, helping the heated object 4 to maintain a high temperature state, which is perfectly suited for use scenarios where heating is carried out for a long time. There is no need to consume a large amount of extra energy to dissipate the heat generated by laser module 1, which significantly reduces the overall energy consumption and meets the application requirements of energy saving and consumption reduction. The heat dissipation method is not limited to TEC cooling chip 2, and the laser type is not limited to a single type, adapting to the personalized needs of different application scenarios and greatly improving the applicability of the equipment and methods.

[0024] Please see Figure 2 A rigid frame 5 and a flexible heat-conducting layer 6 are respectively provided between the heat sink 3 and the object being heated 4. The heat from the heat sink 3 is transferred to the flexible heat-conducting layer 6 through the rigid frame 5, and the flexible heat-conducting layer 6 transfers the heat to the object being heated 4; the heat from the object being heated 4 is transferred to the rigid frame 5 through the flexible heat-conducting layer 6, and the rigid frame 5 drives the heat to be transferred to the heat sink 3.

[0025] Please see Figure 4 The rigid frame 5 has a grid-like design, and the flexible heat-conducting layer 6 covers the outside of the rigid frame 5, and the flexible heat-conducting layer 6 is in close contact with the object being heated 4. The rigid frame 5 supports the flexible heat-conducting layer 6 through its own grid structure. The heat from the heat sink 3 is transferred to the flexible heat-conducting layer 6 through the grid gaps of the rigid frame 5 and the frame body. The flexible heat-conducting layer 6 directly transfers the heat to the object being heated 4.

[0026] Please see Figure 3 A guide rod 7 is installed on the surface of the heat sink 3, and the rigid frame 5 is slidably connected to the surface of the guide rod 7. The guide rod 7 provides a moving guide for the rigid frame 5, and the rigid frame 5 slides linearly relative to the heat sink 3 under the guidance of the guide rod 7, causing the flexible heat-conducting layer 6 to move closer to or away from the heated object 4.

[0027] A compression spring 8 is fitted onto the surface of the guide rod 7, with both ends of the compression spring 8 fitting against the inner wall of the heat sink 3 and the surface of the rigid frame 5, respectively. The compression spring 8 generates elastic force through its own elastic deformation, which pushes the rigid frame 5 along the guide rod 7 toward the object being heated 4, causing the flexible heat-conducting layer 6 to fit tightly against the object being heated 4; when subjected to a reverse force, the rigid frame 5 compresses the spring 8 and slides in the opposite direction along the guide rod 7.

[0028] An adjusting nut 9 is threaded onto the surface of the guide rod 7, and the surface of the adjusting nut 9 is in close contact with the rigid frame 5. By rotating the adjusting nut 9, the adjusting nut 9 moves along the threaded structure of the guide rod 7, pushing the rigid frame 5 to slide along the guide rod 7, thereby adjusting the degree of contact between the flexible heat-conducting layer 6 and the heated object 4; by rotating the adjusting nut 9 in the opposite direction, the pressure on the rigid frame 5 can be released, making it easier to adjust the position of the rigid frame 5.

[0029] Please see Figure 5 The heat sink 3 is divided into a main heat-conducting section 10, a buffer heat-conducting section 11, and a terminal adapter section 12. The main heat-conducting section 10 is in contact with the hot surface of the TEC cooling chip 2, and the terminal adapter section 12 is in contact with the object being heated 4. The buffer heat-conducting section 11 is connected to the main heat-conducting section 10 by brazing, and the buffer heat-conducting section 11 is connected to the terminal adapter section 12 by thread. The heat from the hot surface of the TEC cooling chip 2 is transferred to the main heat-conducting section 10. The main heat-conducting section 10 drives the buffer heat-conducting section 11 to receive heat through the brazing connection. The buffer heat-conducting section 11 then drives the terminal adapter section 12 through the threaded connection to transfer the heat to the object being heated 4. The heat from the object being heated 4 is transferred to the buffer heat-conducting section 11 through the terminal adapter section 12, and then from the buffer heat-conducting section 11 to the main heat-conducting section 10, and finally to the TEC cooling chip 2.

[0030] The surface of the main heat-conducting section 10 is arrayed with heat dissipation fins 13, and a U-shaped oil guide groove 14 is formed in the inner cavity of the buffer heat-conducting section 11, with the inner cavity of the U-shaped oil guide groove 14 filled with thermally conductive silicone oil. Part of the heat received by the main heat-conducting section 10 is dissipated into the air through the heat dissipation fins 13 on the surface, and the other part is transferred to the buffer heat-conducting section 11. The buffer heat-conducting section 11 drives the thermally conductive silicone oil in the U-shaped oil guide groove 14, and the heat is evenly distributed in the buffer heat-conducting section 11 through the thermal conduction effect of the thermally conductive silicone oil, and then transferred to the end adapter section 12.

[0031] Please see Figure 6 A heat conduction bypass 15 is provided at the corresponding location within the inner cavity of the buffer heat conduction section 11. The heat conduction bypass 15 consists of a heat conduction copper sheet, an electromagnetic lock stop pin, and a temperature sensing plate. The two ends of the heat conduction copper sheet are in contact with the main heat conduction section 10 and the end adapter section 12, respectively. A positioning hole is provided in the middle of the heat conduction copper sheet, and the electromagnetic lock stop pin is installed on the inner side wall of the buffer heat conduction section 11. The temperature sensing plate detects the temperature of the buffer heat conduction section 11. When the temperature reaches the set value, the electromagnetic lock stop pin disengages from the positioning hole of the heat conduction copper sheet, and the heat conduction copper sheet maintains contact with the main heat conduction section 10 and the end adapter section 12 to transfer heat. When the temperature is lower than the set value, the electromagnetic lock stop pin inserts into the positioning hole to further fix the contact relationship between the heat conduction copper sheet and the main heat conduction section 10 and the end adapter section 12. The heat from the main heat conduction section 10 is quickly transferred to the end adapter section 12 through the heat conduction copper sheet.

[0032] In this solution: Laser module 1 is activated, outputting laser light to heat the object, and at the same time, laser module 1 generates heat; TEC cooling chip 2 is activated simultaneously, absorbing the heat generated by laser module 1 through its cold surface, thereby cooling laser module 1. The TEC cooling chip 2 transfers the heat absorbed by the cold surface to the hot surface, and the hot surface drives the heat to the main heat section 10 of the heat sink 3; the main heat section 10 drives the buffer heat conduction section 11 to receive heat through the brazing connection, and the main heat section 10 at the same time drives the heat dissipation fins 13 on the surface to dissipate some of the heat into the air. The buffer heat-conducting section 11 drives the heat-conducting silicone oil in the U-shaped oil guide groove 14 in the inner cavity, and the heat is evenly distributed in the buffer heat-conducting section 11 through the heat conduction effect of the heat-conducting silicone oil. The temperature sensing plate detects the temperature of the buffer heat-conducting section 11. When the temperature reaches the set value, the electromagnetic lock stop pin moves away from the positioning hole of the heat-conducting copper sheet, and the heat-conducting copper sheet maintains contact with the main heat-conducting section 10 and the end adapter section 12 to transfer heat. When the temperature is lower than the set value, the electromagnetic lock stop pin inserts into the positioning hole to fix the heat-conducting copper sheet, and the heat of the main heat-conducting section 10 is quickly transferred to the end adapter section 12 through the heat-conducting copper sheet. The buffer heat-conducting section 11 drives the end adapter section 12 to receive heat through the threaded connection. The end adapter section 12 drives the heat to be transferred to the rigid frame 5. The rigid frame 5 drives the heat to be transferred to the flexible heat-conducting layer 6 covering its outer side through its own grid structure. The flexible heat-conducting layer 6 drives the heat to be transferred to the heated object 4. Rotate the adjusting nut 9, and the adjusting nut 9 moves along the thread structure of the guide rod 7, pushing the rigid frame 5 to slide along the guide rod 7 through the guide rod 7, thereby adjusting the degree of contact between the flexible heat-conducting layer 6 and the heated object 4; rotate the adjusting nut 9 in the opposite direction to release the pressure on the rigid frame 5, making it easier to adjust the position of the rigid frame 5; The compression spring 8 generates elastic force through its own elastic deformation. The elastic force pushes the rigid frame 5 to move along the guide rod 7 towards the heated object 4, which is guided by the guide rod 7, causing the flexible heat-conducting layer 6 to fit tightly against the heated object 4. When subjected to a reverse force, the rigid frame 5 compresses the spring 8 and slides in the opposite direction along the guide rod 7.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An energy recovery and utilization method based on laser heating, characterized in that, Includes the following steps: S1. Overall Composition: The cold side of the TEC cooling chip (2) is closely attached to the heating area of ​​the laser module (1), thereby achieving efficient heat conduction between the two; the hot side of the TEC cooling chip (2) is connected to the heat sink (3), and the end of the heat sink (3) is provided with the object to be heated (4), thereby forming a heat transfer path from the TEC cooling chip (2) to the object to be heated (4). S2, Collaborative Working Mechanism: After the laser module (1) is started, it outputs laser at the preset optical power to heat the object. At the same time, the laser module (1) generates a large amount of heat due to its operation. The TEC cooling chip (2) is started at the same time. The cold surface absorbs the heat generated by the laser module (1) through close contact with the laser module (1) and cools the laser module (1) quickly to ensure that the laser module (1) maintains a stable output at the preset working temperature and preset optical power. S3, Recycling Path: When the TEC cooling chip (2) is working, it transfers the heat absorbed by the cold side to the hot side, and the heat of the hot side is discharged through the connected heat sink (3). During the process of the heat sink (3) discharging heat, a portion of the heat is transferred to the heated object (4) through the end, thereby realizing the recovery and utilization of part of the heat during the operation of the TEC cooling chip (2).

2. An energy recovery and utilization device based on laser heating, employing the energy recovery and utilization method based on laser heating as described in any one of claims 1, characterized in that, include: A laser module (1) and a TEC cooling chip (2) disposed on the surface of the laser module (1), and a heat sink (3) is connected to the surface of the TEC cooling chip (2), and a heated object (4) is added to the surface of the heat sink (3). The surface of the TEC cooling chip (2) is divided into a cold surface and a hot surface, and the cold surface and the hot surface of the TEC cooling chip (2) are closely attached to the laser module (1) and the heat sink (3) respectively.

3. The energy recovery and utilization device based on laser heating according to claim 2, characterized in that: A rigid frame (5) and a flexible heat-conducting layer (6) are respectively provided between the heat sink (3) and the heated object (4).

4. The energy recovery and utilization device based on laser heating according to claim 3, characterized in that: The rigid frame (5) has a grid-like design, and the flexible heat-conducting layer (6) covers the outside of the rigid frame (5). The flexible heat-conducting layer (6) is in contact with the heated object (4).

5. The energy recovery and utilization device based on laser heating according to claim 4, characterized in that: A guide rod (7) is installed at the corresponding position on the surface of the heat sink (3), and the rigid frame (5) is slidably connected to the surface of the guide rod (7).

6. The energy recovery and utilization device based on laser heating according to claim 5, characterized in that: A compression spring (8) is fitted on the corresponding part of the surface of the guide rod (7), and the two ends of the compression spring (8) are respectively attached to the inner wall of the heat sink (3) and the surface of the rigid frame (5).

7. The energy recovery and utilization device based on laser heating according to claim 6, characterized in that: The guide rod (7) is threaded with an adjusting nut (9) at the corresponding position on its surface, and the surface of the adjusting nut (9) is in close contact with the rigid frame (5).

8. The energy recovery and utilization device based on laser heating according to claim 2, characterized in that: The heat sink (3) is divided into a main heat section (10), a buffer heat conduction section (11) and an end adapter section (12). The main heat section (10) is in contact with the hot surface of the TEC cooling chip (2). The end adapter section (12) is in contact with the heated object (4). The buffer heat conduction section (11) is connected to the main heat section (10) by brazing, and the buffer heat conduction section (11) is connected to the end adapter section (12) by thread.

9. The energy recovery and utilization device based on laser heating according to claim 8, characterized in that: The surface of the main heat-conducting section (10) is arrayed with heat dissipation fins (13), and a U-shaped oil guide groove (14) is provided in the inner cavity of the buffer heat-conducting section (11), and the inner cavity of the U-shaped oil guide groove (14) is filled with thermally conductive silicone oil.

10. An energy recovery and utilization device based on laser heating according to claim 9, characterized in that: A heat conduction bypass (15) is provided at the corresponding location of the inner cavity of the buffer heat conduction section (11). The heat conduction bypass (15) is composed of a heat conduction copper sheet, an electromagnetic lock stop pin and a temperature sensing sheet. The two ends of the heat conduction copper sheet are in contact with the main heat conduction section (10) and the end adapter section (12) respectively. A positioning hole is provided in the middle of the heat conduction copper sheet. The electromagnetic lock stop pin is installed on the inner side wall of the buffer heat conduction section (11).

Images